Display backboard and display device

By designing a display backplane including a driving substrate, a pixel unit group, a bottom bonding layer and an interlayer bonding layer, the problems of large size of the LED light emitting module and low quantum dot stability are solved, and miniaturization and efficient luminescence are achieved .

CN119486396APending Publication Date: 2025-02-18WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202310954481.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-07-31
Publication Date
2025-02-18

AI Technical Summary

Technical Problem

In the color micro display technology, existing light emitting diodes (LEDs) lead to a large volume of the final formed light emitting module, affecting the need for miniaturization of the screen of micro display; at the same time, the heat formed by the quantum dot light conversion layer during the luminescence process leads to Its stability and lifespan are reduced.

Method used

A display backplane is designed, including a driving substrate, a pixel unit group, a bottom bonding layer and an interlayer bonding layer. The pixel unit group is bonded to the driving substrate through the underlying bonding layer, and adjacent pixel units are bonded to each other through the inter-layer bonding layer, realizing the design of adjacent pixel units being connected to the same connecting electrode, reducing the design of the connecting electrode and avoiding occupation. Area of ​​the luminescent layer.

Benefits of technology

A color light source with a certain area and uniform brightness is achieved in a narrow volume, reducing the volume of the display back panel and improving the luminous efficiency.

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Abstract

The invention provides a display backboard and a display device.The display backboard comprises a driving substrate, a pixel unit set, a bottom bonding layer and at least one interlayer bonding layer, the pixel unit set is arranged on one side of the driving substrate and comprises a plurality of pixel units arranged in a stacked mode, and the bottom bonding layer is arranged between the bottom bonding layer and the interlayer bonding layer. Each pixel unit comprises a first functional layer, a light-emitting layer and a second functional layer which are arranged in a stacked mode, the pixel units, close to the driving substrate, in the pixel unit set are bonded with the driving substrate through a bottom bonding layer, and every two adjacent pixel units are bonded through an interlayer bonding layer; wherein the first functional layers of every two adjacent pixel units are adjacent, and each interlayer bonding layer is located between every two adjacent first functional layers, or the second functional layers of every two adjacent pixel units are adjacent, and each interlayer bonding layer is located between every two adjacent second functional layers, so that the design that the adjacent pixel units are jointly connected to the same connecting electrode can be realized; and the light blocking phenomenon caused by too many connecting electrodes in the related technology is reduced.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display backplane and a display device. Background Art

[0002] With the development of display technology, the requirements for color and lightness are getting higher and higher. Light-emitting diodes (Liquid Crystal Display, LED) made of semiconductor materials have excellent light efficiency and are gradually entering the consumer electronics market such as mobile devices and televisions.

[0003] Light-emitting diodes made of semiconductor materials can be applied to color micro-display technology, which usually uses at least three monochrome independent screens, namely red, green and blue micro-LED structures. The three micro-LED structures form a color image through an optical mechanism, but the above method makes the final light-emitting module larger in size, seriously affecting the demand for screen miniaturization pursued by the micro-display; in addition to the above method, quantum dots can also be used as light conversion materials to convert blue light into the required pure green and red light, but the heat generated during the LED light-emitting process and the quantum dots in the light conversion process will affect the stability of the quantum dots, especially the quantum dot light conversion layer, which has poor thermal conductivity in a thicker film layer and will form heat accumulation, thereby reducing the stability and life of the quantum dots. Summary of the invention

[0004] The embodiments of the present application provide a display backplane and a display device to alleviate the deficiencies in the related art.

[0005] To achieve the above functions, the technical solutions provided by the embodiments of the present application are as follows:

[0006] The embodiment of the present application provides a display backplane, comprising

[0007] Driver substrate;

[0008] A pixel unit group is arranged on one side of the driving substrate, the pixel unit group includes a plurality of stacked pixel units, each of the pixel units includes a first functional layer, a light emitting layer and a second functional layer which are stacked;

[0009] A bottom bonding layer, through which the pixel units in the pixel unit group close to the driving substrate are bonded to the driving substrate;

[0010] At least one interlayer bonding layer, two adjacent pixel units are bonded to each other through the interlayer bonding layer;

[0011] Among them, the first functional layers of two adjacent pixel units are adjacent, and each interlayer bonding layer is located between the two adjacent first functional layers, or, the second functional layers of two adjacent pixel units are adjacent, and each interlayer bonding layer is located between the two adjacent second functional layers.

[0012] In this embodiment, a connection electrode is disposed at the edge of each interlayer bonding layer, and two first functional layers or two second functional layers adjacent to each interlayer bonding layer are electrically connected to the driving substrate via the same connection electrode.

[0013] In this embodiment, the pixel unit group is formed with a boss, and in the direction from the driving substrate to the pixel unit group, among two adjacent pixel units, the width of the pixel unit arranged close to the driving substrate is greater than the width of the pixel unit arranged far from the driving substrate.

[0014] In this embodiment, the pixel unit group includes a first pixel unit and a second pixel unit, the second pixel unit is located on a side of the first pixel unit away from the driving substrate, the first pixel unit includes a first light-emitting layer, the second pixel unit includes a second light-emitting layer, and the light-emitting color of the first light-emitting layer is different from the light-emitting color of the second light-emitting layer;

[0015] The interlayer bonding layer includes a first interlayer bonding layer, the first interlayer bonding layer is located between the first pixel unit and the second pixel unit, the first interlayer bonding layer includes a first bonding body portion and a first extension portion, and the first extension portion extends from one end of the first bonding body portion along a first direction;

[0016] Among them, the first pixel unit and the second pixel unit are bonded to each other through the first bonding body portion, the orthographic projection of the first extension portion on the driving substrate is located within the orthographic projection of the first pixel unit on the driving substrate, and the orthographic projection of the first extension portion on the driving substrate does not overlap with the orthographic projection of the second pixel unit on the driving substrate.

[0017] In this embodiment, the pixel unit group further includes a third pixel unit, the third pixel unit is located on a side of the second pixel unit away from the first pixel unit, the third pixel unit includes a third light-emitting layer, and the light-emitting colors of the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer are all different;

[0018] The interlayer bonding layer includes a second interlayer bonding layer, the second interlayer bonding layer includes a second bonding body portion and a second extension portion, the second extension portion extends from one end of the second bonding body portion along a second direction;

[0019] In which, the second pixel unit and the third pixel unit are bonded to each other through the second bonding body portion, the orthographic projection of the second extension portion on the driving substrate is located within the orthographic projection of the second pixel unit on the driving substrate, and the orthographic projection of the second extension portion on the driving substrate does not overlap with the orthographic projection of the third pixel unit on the driving substrate.

[0020] In this embodiment, the boss includes a first side wall and a second side wall that are arranged opposite to each other, the first side wall is located on a side of the first extension portion away from the first bonding body portion, and the second side wall is located on a side of the second extension portion away from the second bonding body portion;

[0021] The connecting electrode includes a first connecting electrode and a second connecting electrode, the first connecting electrode is located on the first side wall of the boss, and the first connecting electrode is insulated from the first side wall, the second connecting electrode is located on the second side wall of the boss, and the second connecting electrode is insulated from the second side wall,

[0022] Among them, the bottom bonding layer is electrically connected to the first contact point of the driving substrate; one end of the first connecting electrode is connected to the first extension part, and the other end of the first connecting electrode is electrically connected to the second contact point of the driving substrate; one end of the second connecting electrode is connected to the second extension part, and the other end of the second connecting electrode is electrically connected to the third contact point of the driving substrate.

[0023] In this embodiment, the third pixel unit includes a top electrode, and the top electrode is located at a side of the third pixel unit away from the driving substrate;

[0024] The boss includes a third side wall connecting the first side wall and the second side wall;

[0025] The connecting electrode comprises a third connecting electrode, the third connecting electrode is located on the third side wall of the boss, and the third connecting electrode is insulated from the third side wall;

[0026] One end of the third connection electrode is connected to the top electrode of the third pixel unit, and the other end of the third connection electrode is electrically connected to the fourth contact point of the driving substrate.

[0027] In this embodiment, the orthographic projections of the first contact point, the second contact point, the third contact point, and the fourth contact point on the driving substrate do not overlap.

[0028] In this embodiment, the display back panel also includes a first reflective layer, a second reflective layer and a third reflective layer, the first reflective layer is located between the first light-emitting layer and the bottom bonding layer, the second reflective layer is located between the second light-emitting layer and the first interlayer bonding layer, and the third reflective layer is located between the third light-emitting layer and the second interlayer bonding layer.

[0029] In this embodiment, the first reflective layer is used to reflect light having a first wavelength, the second reflective layer is used to reflect light having a second wavelength, and the third reflective layer is used to reflect light having a third wavelength;

[0030] The light of the first wavelength includes light emitted by the first light-emitting layer, the light of the second wavelength includes light emitted by the second light-emitting layer, and the light of the third wavelength includes light emitted by the third light-emitting layer.

[0031] In this embodiment, the material of the bottom bonding layer is a reflective conductive material; and / or the material of the interlayer bonding layer is a transparent conductive material.

[0032] In this embodiment, the first functional layer is one of a p-type doping layer and an n-type doping layer, and the second functional layer is the other of the p-type doping layer and the n-type doping layer.

[0033] An embodiment of the present application provides a display device, which includes a terminal body and any one of the above-mentioned display back panels, wherein the terminal body and the display back panel are combined into one body.

[0034] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display backplane and a display device, wherein the display backplane includes a driving substrate, a pixel unit group, a bottom bonding layer and at least one interlayer bonding layer, and the pixel units in the pixel unit group close to the driving substrate are bonded to the driving substrate through the bottom bonding layer, and two adjacent pixel units are bonded to each other through an interlayer bonding layer, and the first functional layers of the two adjacent pixel units are adjacent, and each of the interlayer bonding layers is located between the two adjacent first functional layers, or the second functional layers of the two adjacent pixel units are adjacent, and each of the interlayer bonding layers is located between the two adjacent second functional layers, so that the design in which the adjacent pixel units are connected to the same connecting electrode can be realized, the design of the connecting electrode in the related art can be reduced, and the design of too many connecting electrodes can be avoided to occupy the light-emitting area of ​​the light-emitting layer in the pixel unit, thereby increasing the light-emitting area of ​​the pixel unit group and improving the light-emitting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 A top view of a display backplane provided in an embodiment of the present application;

[0037] Figure 2 for Figure 1 The cross section along the middle line A-Aˋ;

[0038] Figure 3 for Figure 1 Cross-sectional view along the B-Bˋ line. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0040] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0043] The embodiments of the present application provide a display backplane and a display device. The following are detailed descriptions of each. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0044] See also Figure 1 to Figure 3 The present embodiment provides a display backplane and a display device, wherein the display backplane 10 includes a driving substrate 11, a pixel unit group 13, a bottom bonding layer 12 and at least one interlayer bonding layer 14, wherein the pixel unit group 13 is arranged on one side of the driving substrate 11, and the pixel unit group 13 includes a plurality of stacked pixel units 130, each of the pixel units 130 includes a stacked first functional layer 131, a light-emitting layer 132 and a second functional layer 133, and the pixel unit 130 in the pixel unit group 13 close to the driving substrate 11 is bonded to the driving substrate 11 through the bottom bonding layer 12, and two adjacent pixel units 130 are bonded to each other through an interlayer bonding layer 14.

[0045] Among them, the first functional layers 131 of two adjacent pixel units 130 are adjacent, and each interlayer bonding layer 14 is located between the two adjacent first functional layers 131, or, the second functional layers 133 of two adjacent pixel units 130 are adjacent, and each interlayer bonding layer 14 is located between the two adjacent second functional layers 133.

[0046] It should be noted that, at present, light-emitting diodes made of semiconductor materials can be applied to color micro-display technology, which usually uses at least three monochrome independent screens, namely three micro-LED structures of red, green and blue. The three micro-LED structures form a color image through an optical mechanism, but the above method makes the final light-emitting module larger in size, seriously affecting the demand for screen miniaturization pursued by the micro-display; in addition to the above method, quantum dots can also be used as light conversion materials to convert blue light into the required pure green and red light, but the heat generated during the LED light-emitting process and the quantum dots in the light conversion process will affect the stability of the quantum dots, especially the quantum dot light conversion layer, which has poor thermal conductivity in the thicker film layer and will form heat accumulation, thereby reducing the stability and life of the quantum dots.

[0047] In this embodiment, the pixel unit group includes a plurality of stacked pixel units, the pixel units in the pixel unit group close to the driving substrate are bonded to the driving substrate through a bottom bonding layer, and two adjacent pixel units are bonded to each other through an interlayer bonding layer, thereby forming a display backplane with a vertical pixel unit group, which can form a color light source with a certain area and uniform brightness in a narrow volume, and effectively reduce the volume of the display backplane; at the same time, the first functional layers of two adjacent pixel units are adjacent, and each of the interlayer bonding layers is located between the two adjacent first functional layers, or the second functional layers of two adjacent pixel units are adjacent, and each of the interlayer bonding layers is located between the two adjacent second functional layers, so that the design of the adjacent pixel units being connected to the same connecting electrode can be realized, the design of the connecting electrode in the related art can be reduced, and the design of too many connecting electrodes can be avoided to occupy the light-emitting area of ​​the light-emitting layer in the pixel unit, thereby increasing the light-emitting area of ​​the pixel unit group and improving the light-emitting efficiency.

[0048] In this example, see Figure 1 , Figure 2 and Figure 3 ,in, Figure 1 A top view of a display backplane provided in an embodiment of the present application; Figure 2 for Figure 1 The cross section along the middle line A-Aˋ; Figure 3 for Figure 1 Cross-sectional view along the B-Bˋ line.

[0049] In this embodiment, the driving substrate 11 includes a driving circuit (not shown in the figure), and the driving circuit includes a pixel driver. The pixel driver includes but is not limited to a thin film transistor pixel driver or a silicon CMOS pixel driver. The pixel driver can control the operation of the pixel unit 130.

[0050] In this embodiment, a connecting electrode 16 is arranged at the edge of each interlayer bonding layer 14, and the two first functional layers 131 or the two second functional layers 133 adjacent to each interlayer bonding layer 14 are electrically connected to the driving substrate 11 through the same connecting electrode 16; thereby, a design in which adjacent pixel units 130 are connected to the same connecting electrode 16 can be realized.

[0051] Furthermore, in the present embodiment, the orthographic projection of the pixel unit group 13 on the driving substrate 11 covers the orthographic projection of the underlying bonding layer 12 on the driving substrate 11, and the pixel unit group 13 is formed with a boss 13A, and in the direction from the driving substrate 11 to the pixel unit group 13, among two adjacent pixel units 130, the width of the pixel unit 130 arranged close to the driving substrate 11 is greater than the width of the pixel unit 130 arranged away from the driving substrate 11; wherein, the side wall of the boss 13A has a straight line in a cross section in a direction perpendicular to the driving substrate 11, the boss 13A is an inverted cone or the cross-sectional shape of the boss 13A is a trapezoid, and the inverted cone can be naturally formed from the bottom to the top when the various layers in the pixel unit group 13 are etched and patterned, and the inverted cone structure can improve the electrical connection between adjacent pixel units 130 and simplify the manufacturing process.

[0052] Specifically, the boss 13A includes an upper surface connecting the two side walls and away from the driving substrate 11, and a lower surface connecting the two side walls and close to the driving substrate 11, and a first preset angle α between the side wall and the lower surface of the boss 13A is greater than or equal to 45 degrees and less than 90 degrees, wherein the first preset angle α is preferably one of 45 degrees, 60 degrees or 75 degrees, so that the luminous efficiency of the pixel unit group 13 can be controlled by controlling the size of the first preset angle α.

[0053] Furthermore, the pixel unit group 13 includes a first pixel unit 130A and a second pixel unit 130B which are stacked, the second pixel unit 130B is located on a side of the first pixel unit 130A away from the underlying bonding layer 12, the first pixel unit 130A includes a first light-emitting layer 130A1, the second pixel unit 130B includes a second light-emitting layer 130B1, and the light-emitting color of the second light-emitting layer 130B1 is different from the light-emitting color of the first light-emitting layer 130A1.

[0054] The interlayer bonding layer 14 includes a first interlayer bonding layer 140A, which is located between the first pixel unit 130A and the second pixel unit 130B. The first functional layer 131 of the first pixel unit 130A is bonded to the driving substrate 11 through the underlying bonding layer 12, and the second functional layer 133 of the first pixel unit 130A is bonded to the second functional layer 133 of the second pixel unit 130B through the first interlayer bonding layer 140A.

[0055] Among them, the first functional layer 131 is one of a p-type semiconductor layer and an n-type semiconductor layer, and the second functional layer 133 is the other of a p-type semiconductor layer and an n-type semiconductor layer; preferably, this embodiment takes the first functional layer 131 as a p-type semiconductor layer and the second functional layer 133 as an n-type semiconductor layer as an example to illustrate the technical solution of the present application.

[0056] It should be noted that in the prior art, the LED pixel unit includes a stacked P-type semiconductor layer, a light-emitting layer and an N-type semiconductor layer. Each LED pixel unit requires at least two connecting electrodes connected to the P electrode and the N electrode of the pixel driver. The increase in the density of the connecting electrodes will cause the parasitic resistance and capacitance of the LED pixel unit to increase, and a large amount of power consumption will be lost in the leads, reducing the chip efficiency. In addition, a large number of connecting electrodes will occupy more light-emitting areas of the LED pixel unit, and the proportion of the light-emitting area will be limited, thereby restricting the improvement of the display resolution.

[0057] It can be understood that in this embodiment, the second functional layer 133 of the first pixel unit 130A and the second functional layer 133 of the second pixel unit 130B are bonded together through the first interlayer bonding layer 140A. The second functional layer 133 of the first pixel unit 130A, the first interlayer bonding layer 140A and the second functional layer 133 of the second pixel unit 130B are interconnected to form a first common electrode. The first common electrode is electrically connected to the driving substrate 11 through the connecting electrode 16, thereby reducing the design of the connecting electrode 16 in the related art, avoiding the design of too many connecting electrodes 16 occupying the light-emitting area of ​​the light-emitting layer in the pixel unit 130, and then increasing the light-emitting area of ​​the pixel unit group 13 and improving the light-emitting efficiency.

[0058] Further, in the present embodiment, the first interlayer bonding layer 140A includes a first bonding main body portion 140A1 and a first extension portion 140A2, the first extension portion 140A2 extends from one end of the first bonding main body portion 140A1 along the first direction X1; the first pixel unit 130A and the second pixel unit 130B are bonded to each other through the first bonding main body portion 140A1, the orthographic projection of the first extension portion 140A2 on the driving substrate 11 is located within the orthographic projection of the first pixel unit 130A on the driving substrate 11, and the orthographic projection of the first extension portion 140A2 on the driving substrate 11 does not overlap with the orthographic projection of the second pixel unit 130B on the driving substrate 11, thereby ensuring the effective light-emitting area of ​​the second pixel unit 130B.

[0059] In this example, see Figure 1 , Figure 2 and Figure 3 , the pixel unit group 13 further includes a third pixel unit 130C, the third pixel unit 130C is located on a side of the second pixel unit 130B away from the first pixel unit 130A, the third pixel unit 130C includes a third light-emitting layer 130C1, and the light-emitting colors of the first light-emitting layer 130A1, the second light-emitting layer 130B1, and the third light-emitting layer 130C1 are all different;

[0060] The interlayer bonding layer 14 includes a second interlayer bonding layer 140B, which is located between the second pixel unit 130B and the third pixel unit 130C; the first functional layer 131 of the second pixel unit 130B is bonded to the second functional layer 133 of the third pixel unit 130C through the second interlayer bonding layer 140B.

[0061] It can be understood that in this embodiment, the first functional layer 131 of the second pixel unit 130B is bonded together with the second functional layer 133 of the third pixel unit 130C through the second interlayer bonding layer 140B, and the first functional layer 131 of the second pixel unit 130B, the second interlayer bonding layer 140B and the first functional layer 131 of the third pixel unit 130C are interconnected to form a second common electrode, and the second common electrode is electrically connected to the driving substrate 11 through the connecting electrode 16, thereby reducing the design of the connecting electrode 16 in the related art, avoiding the design of too many connecting electrodes 16 occupying the light-emitting area of ​​the light-emitting layer in the pixel unit 130, and then increasing the light-emitting area of ​​the pixel unit group 13 and improving the light-emitting efficiency.

[0062] It should be noted that, in the present embodiment, in the direction in which the driving substrate 11 points to the pixel unit group 13, the width of the first pixel unit 130A, the width of the second pixel unit 130B and the width of the third pixel unit 130C decrease successively, so that the pixel unit group 13 is an inverted cone structure. The inverted cone can be naturally formed from the bottom to the top when the various layers in the pixel unit group 13 are etched and patterned. Specifically, in the present embodiment, the pixel unit group 13 can be formed by repeatedly depositing, bonding and substrate peeling the light-emitting layer on the driving substrate, without the need for high-precision alignment, thereby reducing the difficulty of the bonding process.

[0063] At the same time, the luminous color of the first light-emitting layer 130A1 includes but is not limited to one of red, green and blue, the luminous color of the second light-emitting layer 130B1 includes but is not limited to one of red, green and blue, and the luminous color of the third light-emitting layer 130C1 includes but is not limited to one of red, green and blue. In this embodiment, the luminous color of the first light-emitting layer 130A1 is red, the luminous color of the second light-emitting layer 130B1 is green, and the luminous color of the third light-emitting layer 130C1 is blue as an example to illustrate the technical solution of the present application.

[0064] In addition, in some embodiments, the shape of the first pixel unit 130A, the shape of the second pixel unit 130B, and the shape of the third pixel unit 130C include but are not limited to one of a rectangle, a square, a triangle, a trapezoid, or a polygon; this embodiment takes the shape of the first pixel unit 130A, the shape of the second pixel unit 130B, and the shape of the third pixel unit 130C, which are all rectangles, as an example to illustrate the technical solution of the present application.

[0065] Furthermore, in the present embodiment, the second interlayer bonding layer 140B includes a second bonding main body portion 140B1 and a second extension portion 140B2, the second extension portion 140B2 extends from one end of the second bonding main body portion 140B1 along the second direction X2; the second pixel unit 130B and the third pixel unit 130C are bonded to each other through the second bonding main body portion 140B1, the orthographic projection of the second extension portion 140B2 on the driving substrate 11 is located within the orthographic projection of the second pixel unit 130B on the driving substrate 11, and the orthographic projection of the second extension portion 140B2 on the driving substrate 11 does not overlap with the orthographic projection of the third pixel unit 130C on the driving substrate 11, thereby ensuring the effective light-emitting area of ​​the third pixel unit 130C; wherein the first direction X1 is parallel to and opposite to the second direction X2.

[0066] Specifically, the boss 13A includes a first side wall 13A1 and a second side wall 13A2 that are oppositely arranged, the first side wall 13A1 is located on a side of the first extension portion 140A2 away from the first bonding main body portion 140A1, and the second side wall 13A2 is located on a side of the second extension portion 140B2 away from the second bonding main body portion 140B1; the connecting electrode 16 includes a first connecting electrode 16A and a second connecting electrode 16B, the first connecting electrode 16A is located on the first side wall 13A1 of the boss 13A, and the first connecting electrode 16A is insulated from the first side wall 13A1, and the second connecting electrode 16B is located on the second side wall 13A2 of the boss 13A, and the second connecting electrode 16B is insulated from the second side wall 13A2.

[0067] Among them, the bottom bonding layer 12 is electrically connected to the first contact point 1 of the driving substrate 11; one end of the first connecting electrode 16A is connected to the first extension portion 140A2, and the other end of the first connecting electrode 16A is electrically connected to the second contact point 2 of the driving substrate 11; one end of the second connecting electrode 16B is connected to the second extension portion 140B2, and the other end of the second connecting electrode 16B is electrically connected to the third contact point 3 of the driving substrate 11.

[0068] In this embodiment, the third pixel unit 130C includes a top electrode 15, which is located on a side of the third pixel unit 130C away from the driving substrate 11; the boss 13A includes a third side wall 13A3 connecting the first side wall 13A1 and the second side wall 13A2; the connecting electrode 16 includes a third connecting electrode 16C, which is located on the third side wall 13A3 of the boss 13A, and the third connecting electrode 16C is insulated from the third side wall 13A3; wherein one end of the third connecting electrode 16C is connected to the top electrode 15 of the third pixel unit 130C, and the other end of the third connecting electrode 16C is electrically connected to the fourth contact point 4 of the driving substrate 11.

[0069] Preferably, in this embodiment, the orthographic projections of the first contact point 1, the second contact point 2, the third contact point 3 and the fourth contact point 4 on the driving substrate 11 do not overlap; wherein, the first contact point 1 and the third contact point 3 of the driving substrate 11 are P-electrode contact points of the pixel driver, and the second contact point 2 and the fourth contact point 4 of the driving substrate 11 are N-electrode contact points of the pixel driver.

[0070] Specifically, the first connecting electrode 16A includes a first connecting sub-portion 16A1 located on the first extension portion 140A2, and the orthographic projection of the first connecting sub-portion 16A1 on the driving substrate 11 overlaps with at least a portion of the orthographic projection of the first extension portion 140A2 on the driving substrate 11, and the orthographic projection of the first connecting sub-portion 16A1 on the driving substrate 11 does not overlap with the orthographic projection of the first bonding main portion 140A1 on the driving substrate 11, thereby ensuring the effective light-emitting area of ​​the second pixel unit 130B.

[0071] The second connecting electrode 16B includes a second connecting sub-portion 16B1 located on the second extension portion 140B2, and the orthographic projection of the second connecting sub-portion 16B1 on the driving substrate 11 overlaps with at least a portion of the orthographic projection of the second extension portion 140B2 on the driving substrate 11, and the orthographic projection of the second connecting sub-portion 16B1 on the driving substrate 11 does not overlap with the orthographic projection of the second bonding main portion 140B1 on the driving substrate 11, thereby ensuring the effective light-emitting area of ​​the third pixel unit 130C.

[0072] The third connection electrode 16C includes a third connection sub-portion 16C1 located on the top electrode layer 15 , and an orthographic projection of the third connection sub-portion 16C1 on the drive substrate 11 at least overlaps with a portion of an orthographic projection of the top electrode layer 15 on the drive substrate 11 .

[0073] It can be understood that, in this embodiment, the first functional layer 131 of the first pixel unit 130A is electrically connected to the first contact point 1 of the driving substrate 11 through the bottom bonding layer 12, the second functional layer 133 of the first pixel unit 130A is electrically connected to the second contact point 2 of the driving substrate 11 through the first interlayer bonding layer 140A, the first common electrode is electrically connected to the second contact point 2 electrically connected to the driving substrate 11 through the first connecting electrode 16A, the second common electrode is electrically connected to the third contact point 3 electrically connected to the driving substrate 11 through the second connecting electrode 16B, and the first functional layer 131 of the third pixel unit 130C is electrically connected to the fourth contact point 4 of the driving substrate 11 through the top electrode 15, so as to realize that the pixel driver controls the first pixel unit 130A and the second pixel unit 130C respectively. The operation of the pixel unit 130A, the second pixel unit 130B and the third pixel unit 130C, that is, the first pixel unit 130A, the second pixel unit 130B and the third pixel unit 130C can emit light separately; for example: within one frame, when it is necessary to display the colors corresponding to two or more light-emitting layers 132, the time t of one frame can be divided into different time periods, and each time period can be driven separately to drive a pixel unit 130 of one color (one of the first pixel unit 130A, the second pixel unit 130B and the third pixel unit 130C) to emit the required brightness; specifically, red is displayed within 1 / 3t, blue is displayed within 1 / 3t, and green is displayed within 1 / 3t. Combined with the visual residual phenomenon of the human eye, the three colors can be synthesized into one color, thereby achieving the effect of time-sharing drive full-color display.

[0074] Further, in this embodiment, the material of the bottom bonding layer 12 includes but is not limited to reflective conductive material; and / or, the material of the interlayer bonding layer 14 includes but is not limited to transparent conductive material; and / or, the material of the top electrode 15 includes but is not limited to transparent conductive material.

[0075] Among them, when the material of the bottom bonding layer 12 is preferably a reflective conductive material, the material of the bottom bonding layer 12 includes but is not limited to metal materials such as silver (Ag), aluminum (Al), gold (Au), tin (Su) and copper (CU); when the material of the interlayer bonding layer 14 and the material of the top electrode 15 are both preferably transparent conductive materials, the transparent conductive material includes but is not limited to one of indium zinc oxide (IZO), indium tin oxide (ITO), 3,4-ethylenedioxythiophene monomer polymer (PEDOT) and graphene; it can be understood that by setting the material of the bottom bonding layer 12 to a reflective conductive material, the material of the interlayer bonding layer 14 and the material of the top electrode 15 to be transparent conductive materials, the luminous brightness of the first light-emitting layer 130A1, the second light-emitting layer 130B1 and the third light-emitting layer 130C1 can be improved.

[0076] It should be noted that, in another embodiment, the material of the bottom bonding layer 12, the material of the interlayer bonding layer 14 and the material of the top electrode 15 are all reflective transparent materials; specifically, the bottom bonding layer 12 is used to reflect light with a first wavelength, the first interlayer bonding layer 140A is used to reflect light with a second wavelength, and the second interlayer bonding layer 140B is used to reflect light with a third wavelength; wherein, the light of the first wavelength includes the light emitted by the first light-emitting layer 130A1, the light of the second wavelength includes the light emitted by the second light-emitting layer 130B1, and the light of the third wavelength includes the light emitted by the third light-emitting layer 130C1, thereby suppressing the green light emitted by the second light-emitting layer 130B1 from causing optical crosstalk to the material of the first pixel unit 130A, and at the same time suppressing the blue light emitted by the third light-emitting layer 130C1 from causing optical crosstalk to the material of the second pixel unit 130B, thereby improving the overall contrast of the pixel unit group 13.

[0077] It can be understood that, in another embodiment, the display back panel 10 further includes a first reflective layer, a second reflective layer and a third reflective layer, the first reflective layer is located between the first light-emitting layer 130A1 and the bottom bonding layer 12, the second reflective layer is located between the second light-emitting layer 130B1 and the first interlayer bonding layer 140A, and the third reflective layer is located between the third light-emitting layer 130C1 and the second interlayer bonding layer 140B. At this time, the material of the interlayer bonding layer 14 and the material of the top electrode 15 are both transparent conductive materials.

[0078] Further, the first reflective layer is used to reflect light with a first wavelength, the second reflective layer is used to reflect light with a second wavelength, and the third reflective layer is used to reflect light with a third wavelength; wherein the light with the first wavelength corresponds to the light emitted by the first light-emitting layer 130A1, the light with the second wavelength corresponds to the light emitted by the second light-emitting layer 130B1, and the light with the third wavelength corresponds to the light emitted by the third light-emitting layer 130C1; wherein the first light-emitting layer emits red light with a wavelength of 580 nanometers to 680 nanometers, the second light-emitting layer emits green light with a wavelength of 480 nanometers to 580 nanometers, and the third light-emitting layer emits blue light with a wavelength of 4380 nanometers to 480 nanometers.

[0079] Specifically, the light of the first wavelength includes the light emitted by the first light-emitting layer, the light of the second wavelength includes the light emitted by the second light-emitting layer, and the light of the third wavelength includes the light emitted by the third light-emitting layer, thereby suppressing the green light emitted by the second light-emitting layer 130B1 from causing optical crosstalk to the material of the first pixel unit 130A, and suppressing the blue light emitted by the third light-emitting layer 130C1 from causing optical crosstalk to the material of the second pixel unit 130B, thereby improving the overall contrast of the pixel unit group 13.

[0080] The present embodiment provides a display device, which includes a terminal body and the display backplane described in any of the above embodiments, and the terminal body and the display backplane are combined into one body; wherein, when the display backplane is a backlight source, the terminal body can be a liquid crystal display panel (Liquid Crystal Display, LCD), and the display backplane and the liquid crystal display panel are combined into the display device; when the display backplane is a direct display device, the terminal body can be a device such as a circuit board bound to the display backplane and a cover plate covering the display backplane.

[0081] In specific applications, the display device can be a display screen of a smart phone, tablet computer, laptop computer, smart bracelet, smart watch, smart glasses, smart helmet, desktop computer, smart TV or digital camera, and can even be used on electronic devices with flexible display screens.

[0082] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0083] The above is a detailed introduction to a display backplane and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display backplane, characterized in that: include: Driver substrate; A pixel unit group, arranged on one side of the driving substrate, the pixel unit group includes a plurality of stacked pixel units, each of the pixel units includes a first functional layer, a light emitting layer and a second functional layer which are stacked; A bottom bonding layer, through which the pixel units in the pixel unit group close to the driving substrate are bonded to the driving substrate; At least one interlayer bonding layer, two adjacent pixel units are bonded to each other through the interlayer bonding layer; Among them, the first functional layers of two adjacent pixel units are adjacent, and each interlayer bonding layer is located between the two adjacent first functional layers, or, the second functional layers of two adjacent pixel units are adjacent, and each interlayer bonding layer is located between the two adjacent second functional layers.

2. The display backplane according to claim 1, characterized in that: A connection electrode is disposed at the edge of each interlayer bonding layer, and two first functional layers or two second functional layers adjacent to each interlayer bonding layer are electrically connected to the driving substrate via the same connection electrode.

3. The display backplane according to claim 2, characterized in that: The pixel unit group is formed with a boss, and in the direction from the drive substrate to the pixel unit group, among two adjacent pixel units, the width of the pixel unit arranged close to the drive substrate is greater than the width of the pixel unit arranged far from the drive substrate.

4. The display backplane according to claim 3, characterized in that: The pixel unit group includes a first pixel unit and a second pixel unit, the second pixel unit is located at a side of the first pixel unit away from the driving substrate, the first pixel unit includes a first light-emitting layer, the second pixel unit includes a second light-emitting layer, and the light-emitting color of the first light-emitting layer is different from the light-emitting color of the second light-emitting layer; The interlayer bonding layer includes a first interlayer bonding layer, the first interlayer bonding layer is located between the first pixel unit and the second pixel unit, the first interlayer bonding layer includes a first bonding body portion and a first extension portion, and the first extension portion extends from one end of the first bonding body portion along a first direction; Among them, the first pixel unit and the second pixel unit are bonded to each other through the first bonding body portion, the orthographic projection of the first extension portion on the driving substrate is located within the orthographic projection of the first pixel unit on the driving substrate, and the orthographic projection of the first extension portion on the driving substrate does not overlap with the orthographic projection of the second pixel unit on the driving substrate.

5. The display backplane according to claim 4, characterized in that: The pixel unit group further includes a third pixel unit, the third pixel unit is located on a side of the second pixel unit away from the first pixel unit, the third pixel unit includes a third light-emitting layer, and the light-emitting colors of the first light-emitting layer, the second light-emitting layer and the third light-emitting layer are all different; The interlayer bonding layer includes a second interlayer bonding layer, the second interlayer bonding layer includes a second bonding body portion and a second extension portion, the second extension portion extends from one end of the second bonding body portion along a second direction; In which, the second pixel unit and the third pixel unit are bonded to each other through the second bonding body portion, the orthographic projection of the second extension portion on the driving substrate is located within the orthographic projection of the second pixel unit on the driving substrate, and the orthographic projection of the second extension portion on the driving substrate does not overlap with the orthographic projection of the third pixel unit on the driving substrate.

6. The display backplane according to claim 5, characterized in that: The boss comprises a first side wall and a second side wall which are arranged opposite to each other, wherein the first side wall is located at a side of the first extension portion away from the first bonding body portion, and the second side wall is located at a side of the second extension portion away from the second bonding body portion; The connecting electrode includes a first connecting electrode and a second connecting electrode, the first connecting electrode is located on the first side wall of the boss, and the first connecting electrode is insulated from the first side wall, the second connecting electrode is located on the second side wall of the boss, and the second connecting electrode is insulated from the second side wall, Among them, the bottom bonding layer is electrically connected to the first contact point of the driving substrate; one end of the first connecting electrode is connected to the first extension part, and the other end of the first connecting electrode is electrically connected to the second contact point of the driving substrate; one end of the second connecting electrode is connected to the second extension part, and the other end of the second connecting electrode is electrically connected to the third contact point of the driving substrate.

7. The display backplane according to claim 6, characterized in that: The third pixel unit comprises a top electrode, and the top electrode is located at a side of the third pixel unit away from the driving substrate; The boss includes a third side wall connecting the first side wall and the second side wall; The connecting electrode comprises a third connecting electrode, the third connecting electrode is located on the third side wall of the boss, and the third connecting electrode is insulated from the third side wall; One end of the third connection electrode is connected to the top electrode of the third pixel unit, and the other end of the third connection electrode is electrically connected to the fourth contact point of the driving substrate.

8. The display backplane according to claim 7, characterized in that: The orthographic projections of the first contact point, the second contact point, the third contact point, and the fourth contact point on the driving substrate do not overlap.

9. The display backplane according to claim 5, characterized in that: The display back panel also includes a first reflective layer, a second reflective layer and a third reflective layer. The first reflective layer is located between the first light-emitting layer and the bottom bonding layer, the second reflective layer is located between the second light-emitting layer and the first interlayer bonding layer, and the third reflective layer is located between the third light-emitting layer and the second interlayer bonding layer.

10. The display backplane according to claim 9, characterized in that: The first reflective layer is used to reflect light with a first wavelength, the second reflective layer is used to reflect light with a second wavelength, and the third reflective layer is used to reflect light with a third wavelength; The light of the first wavelength includes light emitted by the first light-emitting layer, the light of the second wavelength includes light emitted by the second light-emitting layer, and the light of the third wavelength includes light emitted by the third light-emitting layer.

11. The display backplane according to claim 1, characterized in that: The material of the bottom bonding layer is a reflective conductive material; and / or the material of the interlayer bonding layer is a transparent conductive material.

12. The display backplane according to any one of claims 1 to 11, characterized in that: The first functional layer is one of a p-type doping layer and an n-type doping layer, and the second functional layer is the other of the p-type doping layer and the n-type doping layer.

13. A display device, characterized in that: The display device comprises a terminal body and a display back panel according to any one of claims 1 to 12, wherein the terminal body and the display back panel are integrated into one body.