265results about How to "Discharge safety" patented technology

A passive element memory array preferably biases selected X-lines to an externally received VPP voltage and selected Y-lines to ground. Unselected Y-lines are preferably biased to VPP minus a first offset voltage, and unselected X-lines biased to a second offset voltage (relative to ground). The first and second offset voltages preferably are identical and have a value of about 0.5 to 2 volts. The VPP voltage depends upon the memory cell technology used, and preferably falls within the range of 5 to 20 volts. The area otherwise required for an on-chip VPP generator and saves the power that would be consumed by such a generator. In addition, the operating temperature of the integrated circuit during the programming operation decreases, which further decreases power dissipation. When discharging the memory array, the capacitance between layers is preferably discharged first, then the layers are discharged to ground.

An image forming apparatus including: a fixing unit; a main power supply that provides a portion of the heaters with voltage; and a secondary power supply that provides another portion of the heaters connected to the portion of the heaters in parallel with power provided by the main power supply. The secondary power supply is disposed below and in the neighborhood of the fixing unit. The secondary power supply may be disposed between a side face of a chassis of the image forming apparatus and the fixing unit, or at an exterior of the chassis of the image forming apparatus on the side face of the chassis. The secondary power supply can be prevented from being heated by the fixing unit.

The first and second check valve mechanisms, which are applicable to a small-size double-layered container, are created while maintaining high productivity. The discharge container provided with these check valve mechanisms comprises an outer container, which has the flexibility to make this outer container squeezable and recoverable to its original shape and which is provided with a cylindrical outer neck on top thereof. This discharge container also comprises an inner container, which is deformable with the decrease in the content and is disposed inside the outer container under the condition that cylindrical inner neck has been directly engaged with, and tightly fitted to, the outer neck. The first check valve mechanism is engaged with, and tightly fitted to, the inside of the inner neck and is used to open or close the opening of the inner neck while preventing outside air from creeping in the inner container. The second check valve mechanism is engaged with, and tightly fitted to, either one of the outer neck or the inner neck, with the lower end of this mechanism being in tight contact circumferentially with the other one of the outer neck or the inner neck, and is used to open or close airflow paths, which extends from the upper air intakes near the outer neck in a manner that allows outside air to enter the void between the outer and inner containers but does not allow air in the void to escape outside. There is thus provided a highly sanitary discharge container having high productivity and affording no entry of outside air into the inner container.

An ESD protection circuit with leakage current reduction function includes a silicon controlled rectifier, a first CMOS inverter, a first transistor, a current mirror, a PMOS capacitor and a resistor. The first CMOS inverter electrically connects with the silicon controlled rectifier. The first transistor comprises a first end, a second end and a third end, wherein the first end electrically connects with the silicon controlled rectifier and the first CMOS inverter, and the current mirror electrically connects with the third end of the first transistor. The PMOS capacitor electrically connects with the current mirror, and the resistor electrically connects with the first CMOS inverter, the second end of the first transistor and the PMOS capacitor.

This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.