Plating apparatus and plating liquid discharge method

Abstract

The purpose of the present invention is to suppress the occurrence of plating defects due to bubbles generated from an anode and simplify a structure relating to the supply of a plating solution. The plating module (400) is provided with: a plating tank (410) for accommodating a plating solution; an anode (430) disposed in the plating tank (410); a substrate holder (440) configured so as to hold the substrate (Wf) in a state in which the surface (Wf-a) to be plated faces downward; a diaphragm (420) that separates an anode region (424) in which the anode (430) is disposed and a cathode region (422) in which the substrate (Wf) is disposed during the plating process, the diaphragm having an inclined surface (423a) facing the anode (430); a supply port (412) for supplying a plating solution to the anode region (424); and a gas-liquid pipe (470) having a first end portion (472) that opens in the vicinity of the upper end of the inclined surface (423a) of the diaphragm (420), and a second end portion (474) that opens above the surface to be plated of the substrate during the plating process, the gas-liquid pipe being configured so as to supply the plating liquid supplied from the supply port (412) to the anode region (424) to the cathode region (422) via the second end portion (474).

Description

Technical Field

[0001] The present application relates to a plating device and a plating liquid discharge method. Background Art

[0002] As an example of a plating device, a cup-type electrolytic plating device is known. In the cup-type electrolytic plating device, a substrate (e.g., a semiconductor wafer) with a surface to be plated facing downward and held by a substrate holder is immersed in a plating solution, and a voltage is applied between the substrate (cathode) and an anode, so that a conductive film is deposited on the surface of the substrate.

[0003] Patent Document 1 discloses a cup-type plating device. The plating device is configured by having a membrane having an inclination disposed between an anode and a cathode, and by capturing and discharging bubbles generated from the anode with the membrane, thereby suppressing plating defects caused by the bubbles.

[0004] Patent Document 1: U.S. Patent No. 6126798

[0005] The plating apparatus disclosed in Patent Document 1 considers suppressing the occurrence of plating defects caused by the adhesion of bubbles to the plated surface of the substrate, but does not consider simplifying the structure related to the supply of the plating solution to the plating tank.

[0006] That is, the plating apparatus disclosed in Patent Document 1 is provided with pipes for supplying the plating solution to the anode region and the cathode region respectively, so the number of pipes increases, resulting in a complicated structure of the plating apparatus. Summary of the invention

[0007] Therefore, one of the objects of the present application is to suppress the occurrence of poor plating due to bubbles generated from the anode and to simplify the structure related to the supply of the plating solution.

[0008] According to one embodiment, a plating device is disclosed, comprising: a plating tank for accommodating a plating liquid; an anode arranged in the above-mentioned plating tank; a substrate holder, which is configured to hold a substrate in a state where a plated surface is facing downward; a diaphragm, which separates an anode region where the above-mentioned anode is arranged and a cathode region where the substrate is arranged during a plating process, the diaphragm having an inclined surface opposite to the above-mentioned anode; a supply port, which is used to supply the plating liquid to the above-mentioned anode region; and a gas-liquid piping, which has a first end portion opening near the upper end of the above-mentioned inclined surface of the above-mentioned diaphragm, and a second end portion opening above the plated surface of the substrate during the plating process, the gas-liquid piping being configured to supply the plating liquid supplied from the above-mentioned supply port to the above-mentioned anode region to the above-mentioned cathode region via the above-mentioned second end portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1It is a perspective view showing the overall structure of a plating device according to one embodiment.

[0010] Figure 2 It is a plan view showing the overall structure of a plating device according to one embodiment.

[0011] Figure 3 This is a longitudinal sectional view schematically showing the structure of a plating module according to one embodiment.

[0012] Figure 4 This is a longitudinal section schematically showing the structure of a check valve according to one embodiment.

[0013] Figure 5 This is a longitudinal section schematically showing the structure of the gas-liquid piping according to one embodiment.

[0014] Figure 6 The present invention is a flowchart of a plating treatment method including a plating solution discharge method according to an embodiment. DETAILED DESCRIPTION

[0015] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and duplicate descriptions are omitted.

[0016] <Overall structure of plating equipment>

[0017] Figure 1 It is a perspective view showing the overall structure of the plating apparatus according to the present embodiment. Figure 2 2 is a top view showing the overall structure of the plating device of this embodiment. Figure 1 , 2 As shown, the plating device 1000 includes: a loading port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-preg module 300, a plating module 400, a cleaning module 500, a spin rinse and dry device 600, a transfer device 700, and a control module 800.

[0018] The loading port 100 is a module for carrying a substrate stored in a box such as a FOUP not shown in the figure into the plating device 1000, or carrying a substrate out of the box from the plating device 1000. In the present embodiment, four loading ports 100 are arranged side by side in the horizontal direction, but the number and configuration of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, the pre-wetting module 200, and the rotary rinsing and drying device 600. When the transport robot 110 and the transport device 700 transfer substrates between the transport robot 110 and the transport device 700, the substrate can be transferred via a temporary stage not shown in the figure.

[0019] The aligner 120 is a module for aligning the orientation plane, notch and other positions of the substrate in a specified direction. In the present embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wet module 200 wets the plated surface of the substrate before the plating process using a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The pre-wet module 200 is configured to implement a pre-wet process, which is a process of easily supplying the plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with the plating liquid during plating. In the present embodiment, two pre-wet modules 200 are arranged side by side in the up and down direction, but the number and configuration of the pre-wet modules 200 are arbitrary.

[0020] The prepreg module 300 is configured to implement a prepreg treatment, which is, for example, etching with a treatment solution such as sulfuric acid or hydrochloric acid to remove the oxide film with large resistance on the surface of the seed layer formed on the plated surface of the substrate before the plating treatment, and the surface of the plated substrate is cleaned or activated. In the present embodiment, two prepreg modules 300 are arranged side by side in the up and down direction, but the number and configuration of the prepreg modules 300 are arbitrary. The plating module 400 implements a plating treatment on the substrate. In the present embodiment, there are two groups of twelve plating modules 400, three of which are arranged side by side in the up and down direction and four of which are arranged side by side in the horizontal direction, and a total of twenty-four plating modules 400 are provided, but the number and configuration of the plating modules 400 are arbitrary.

[0021] The cleaning module 500 is configured to perform cleaning treatment on the substrate so as to remove the plating liquid etc. remaining on the substrate after the plating treatment. In the present embodiment, two cleaning modules 500 are arranged side by side in the up-down direction, but the number and configuration of the cleaning modules 500 are arbitrary. The rotating rinsing and drying device 600 is a module for rotating and drying the substrate after the cleaning treatment at high speed. In the present embodiment, two rotating rinsing and drying devices are arranged side by side in the up-down direction, but the number and configuration of the rotating rinsing and drying devices are arbitrary. The transport device 700 is a device for transporting substrates between multiple modules in the plating device 1000. The control module 800 is configured to control multiple modules of the plating device 1000, for example, it can be composed of a general computer or a special computer having an input and output interface with an operator.

[0022] An example of a series of plating processes based on the plating device 1000 is described. First, the substrate stored in the box is carried into the loading port 100. Then, the transport robot 110 takes out the substrate from the box of the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the orientation plane, notch, etc. of the substrate in a predetermined direction. The transport robot 110 delivers the substrate aligned by the aligner 120 to the pre-wet module 200.

[0023] The prewetting module 200 performs a prewetting process on the substrate. The transport device 700 transports the substrate subjected to the prewetting process to the prepreg module 300. The prepreg module 300 performs a prepreg process on the substrate. The transport device 700 transports the substrate subjected to the prepreg process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0024] The transport device 700 transports the substrate subjected to the plating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the substrate subjected to the cleaning process to the spin rinse and dry device 600. The spin rinse and dry device 600 performs a drying process on the substrate. The transport robot 110 receives the substrate from the spin rinse and dry device 600, and transports the substrate subjected to the drying process to the box of the loading port 100. Finally, the box containing the substrate is unloaded from the loading port 100.

[0025] <Structure of the plating module>

[0026] Next, the structure of the plating module 400 will be described. Since the twenty-four plating modules 400 in the present embodiment have the same structure, only one plating module 400 will be described. Figure 3 This is a longitudinal sectional view schematically showing the structure of a plating module according to one embodiment.

[0027] like Figure 3 As shown, the plating module 400 is provided with a plating tank 410 for accommodating a plating solution. The plating tank 410 is configured to have a bottom wall 411 in the shape of a circular plate, and a cylindrical side wall 413 surrounding the peripheral portion of the bottom wall 411, and the upper surface is open. The side wall 413 is configured to have: a cylindrical first side wall 413-1, which is connected to the peripheral portion of the bottom wall 411 and has a first thickness; and a cylindrical second side wall 413-2, which is arranged on the upper portion of the first side wall 413-1 and has a second thickness thinner than the first thickness.

[0028] The plating module 400 includes an anode 430 disposed at the bottom of the plating tank 410. The anode 430 may be a dissolving anode or an insoluble anode. The plating module 400 includes a diaphragm 420 that separates the interior of the plating tank 410 in the up-down direction. The diaphragm 420 is a film that separates an anode region 424 where the anode 430 is disposed and a cathode region 422 where the substrate Wf is disposed during the plating process. A resistor 450 is disposed in the cathode region 422 in a manner opposite to the diaphragm 420. The resistor 450 is a component for achieving uniform plating of the plated surface Wf-a of the substrate Wf, and is composed of a plate-like component having many holes.

[0029] The plating module 400 includes a substrate holder 440 for holding a substrate Wf (e.g., a disc-shaped substrate) in a state where the plated surface Wf-a faces downward. The substrate holder 440 includes a power supply contact for supplying power to the substrate Wf from a power source not shown. The substrate holder 440 includes a sealing ring holder 442 for supporting the outer edge of the plated surface Wf-a of the substrate Wf, and a frame 446 for holding the sealing ring holder 442 on a substrate holder body not shown. In addition, the substrate holder 440 includes a back plate 444 for pressing the back side of the plated surface Wf-a of the substrate Wf, and a shaft 448 mounted on the back side of the substrate pressing surface of the back plate 444.

[0030] The plating module 400 includes: a lifting mechanism 443 for lifting and lowering the substrate holder 440; and a rotating mechanism 447 for rotating the substrate holder 440 so that the substrate Wf rotates around the imaginary axis of the shaft 448 (an imaginary rotation axis extending perpendicular to the center of the plated surface Wf-a). The lifting mechanism 443 and the rotating mechanism 447 can be implemented by a well-known mechanism such as a motor. The plating module 400 is configured to immerse the substrate Wf in the plating solution of the cathode region 422 using the lifting mechanism 443, and apply a voltage between the anode 430 and the substrate Wf, thereby performing a plating process on the plated surface Wf-a of the substrate Wf.

[0031] In addition, the plating module 400 includes a paddle 460, which is arranged between the anode 430 and the substrate Wf, specifically, between the resistor 450 and the substrate Wf. The paddle 460 is arranged opposite to the plated surface Wf-a of the substrate Wf. The plating module 400 includes a driving mechanism 462 for reciprocating the paddle 460 along the plated surface Wf-a of the substrate Wf. The driving mechanism 462 can be realized by a known mechanism such as a motor. The plating module 400 can stir the plating solution by reciprocating the paddle 460, thereby improving the uniformity of the plating formed on the plated surface.

[0032] The plating module 400 includes a supply port 412 for supplying a plating solution to the anode region 424. The supply port 412 is formed at the center of the bottom wall 411 of the plating tank 410. The plating module 400 includes a common pipe 414 connected to the supply port 412, and a supply pipe 414-1 and a discharge pipe 414-2 branched from the common pipe 414. A liquid storage tank 416 for storing a plating solution, a pump 417 for pressurizing the plating solution stored in the liquid storage tank 416, and a supply valve 418 for opening and closing the supply pipe 414-1 are connected to the supply pipe 414-1. A discharge valve 419 for opening and closing the discharge pipe 414-2 is connected to the discharge pipe 414-2.

[0033] Plating module 400 can supply plating solution to plating tank 410 by opening supply valve 418, closing discharge valve 419, and starting pump 417. Plating module 400 can discharge plating solution from plating tank 410 by stopping pump 417, closing supply valve 418, and opening discharge valve 419.

[0034] <Diaphragm>

[0035] The diaphragm 420 plays the role of capturing the bubbles generated from the anode 430. The diaphragm 420 is formed into an inclined shape in order to discharge the captured bubbles to the outside of the plating module 400. Specifically, the diaphragm 420 is formed into an inverted cone shape, and the inverted cone shape has a central part 421 configured in the radial center of the plating tank 410 and an inclined film 423 extending radially from the central part 421 to the upper side. Thus, the diaphragm 420 has an inclined surface 423a opposite to the anode 430 on the bottom surface of the inclined film 423. In addition, in this specification, the inclined surface refers to a surface inclined relative to the horizontal plane. In addition, the diaphragm 420 is not limited to the inverted cone shape, as long as it has an inclined surface 423a opposite to the anode 430. The inclined film 423 can be a film of a material that can capture the bubbles generated from the anode 430.

[0036] According to the plating module 400 of this embodiment, since the diaphragm 420 has the inclined surface 423a, the bubbles captured by the diaphragm 420 can be moved obliquely upward along the inclined surface 423a. As a result, the bubbles captured by the diaphragm 420 can be moved to the upper end of the inclined surface 423a.

[0037] <Check valve>

[0038] The plating module 400 includes a check valve 425 disposed on the central member 421 of the diaphragm 420 . Figure 4 This is a longitudinal section schematically showing the structure of a check valve. Figure 4 Will Figure 3 The area α in FIG. 1 is shown in an enlarged manner, showing the check valve 425 in a “closed” state (left side) and an “opened” state (right side).

[0039] like Figure 4 As shown, the check valve 425 includes: a valve box 426, which forms a flow path 426a that connects the anode region 424 and the cathode region 422; a valve seat 426b, which is provided in the flow path 426a; and a floating valve core 427, which is arranged below the valve seat 426b of the flow path 426a and is formed to be able to abut against the valve seat 426b. The valve core 427 is formed of a material with a specific gravity less than 1.

[0040] When the plating treatment starts, the plating solution is supplied from the supply port 412 to the anode region 424. If the liquid level is raised to the valve core 427, the valve core 427 rises and contacts the valve seat 426b. Thus, the check valve 425 becomes "closed", so the plating solution and bubbles are not supplied from the anode region 424 to the cathode region 422 through the flow path 426a. On the other hand, if the plating solution is discharged after the plating treatment, the liquid level of the plating solution in the anode region 424 drops to the valve core 427, and the valve core 427 drops and leaves the valve seat 426b. Thus, the check valve 425 becomes "open", so the plating solution flows from the cathode region 422 to the anode region 424 through the flow path 426a.

[0041] <Gas and liquid piping>

[0042] like Figure 3 As shown, the plating module 400 is provided with a gas-liquid piping 470, which is used to discharge the bubbles captured by the diaphragm 420 and supply the plating solution to the cathode region 422. In addition, in the present embodiment, although an example is shown in which the plating module 400 is provided with two gas-liquid pipings 470 opposite to each other across the center of the plating tank 410, it is not limited thereto. The plating module 400 may be provided with one gas-liquid piping 470, or may be provided with three or more gas-liquid pipings 470 arranged at equal intervals or unequal intervals along the circumference of the plating tank 410.

[0043] Figure 5 This is a longitudinal section schematically showing the structure of the gas-liquid piping according to one embodiment. Figure 5 Will Figure 3 The area β in FIG. 4 is shown in an enlarged manner, and parts are omitted appropriately for illustration. The two gas-liquid pipes 470 have the same structure except for their different configuration positions. Figure 5 In the description, only one side of the gas-liquid piping 470 is described. Figure 5 As shown, the gas-liquid pipe 470 has a first end portion 472 that opens near the upper end of the inclined surface 423 a of the diaphragm 420 in the anode region 424 .

[0044] In this embodiment, a bubble accumulation area BA is formed near the upper end of the inclined surface 423a, where bubbles captured by the diaphragm 420 gather. That is, the end 423b of the inclined film 423 on the side opposite to the central part 421 is connected to the peripheral portion of the bottom surface of the resistor 450 at a predetermined distance from the inner surface of the first side wall 413-1. Thus, an annular flow path surrounded by the end 423b of the inclined film 423, the peripheral portion of the bottom surface of the resistor 450, and the inner surface of the first side wall 413-1 is formed. The annular flow path is formed by these three surfaces, so a certain amount of bubbles can be gathered in the bubble accumulation area BA. The first end 472 opens at the bottom surface of the resistor 450 toward the bubble accumulation area BA.

[0045] In addition, the gas-liquid piping 470 has a second end portion 474, which is located above the surface to be plated Wf-a of the substrate Wf during the plating process and opens inside the plating tank 410. The gas-liquid piping 470 extends upward from the first end portion 472 through the inside of the resistor 450, then extends radially outward through the inside of the resistor 450 and the first side wall 413-1, and further extends upward inside the second side wall 413-2 to reach the second end portion 474. The bubbles accumulated in the bubble accumulation area BA are discharged from the second end portion 474 through the gas-liquid piping 470. The second end portion 474 opens above the surface to be plated Wf-a, so that the bubbles discharged from the second end portion 474 can be suppressed from adhering to the surface to be plated Wf-a.

[0046] The gas-liquid piping 470 is not only configured to discharge bubbles, but also to supply the plating solution supplied from the supply port 412 to the anode region 424 to the cathode region 422 via the second end 474. That is, if the plating solution supplied from the supply port 412 fills the anode region 424, and the plating solution is further pressure-fed from the pump 417 to the anode region 424, the plating solution flows from the first end 472 to the gas-liquid piping 470. This is because the flow resistance of the plating solution of the diaphragm 420 is large, and the flow resistance of the plating solution of the first end 472 is small. If the plating solution is further pressure-fed from the pump 417 to the anode region 424, the plating solution flowing to the gas-liquid piping 470 is supplied to the cathode region 422 via the second end 474. Thus, the cathode region 422 is filled with the plating solution.

[0047] In the present embodiment, the second end 474 of the gas-liquid pipe 470 opens below the plating liquid level OF contained in the plating tank 410 during the plating process. That is, the plating module 400 is configured to perform the plating process while allowing the plating liquid supplied to the cathode region 422 to overflow from the second side wall 413-2. Therefore, the plating liquid level OF becomes a height position corresponding to the upper end of the second side wall 413-2. By making the second end 474 open below the plating liquid level OF, the additive contained in the plating liquid supplied from the second end 474 can contribute to the plating process.

[0048] However, it is not limited to this, and the second end 474 of the gas-liquid piping 470 may also be opened above the plating liquid level OF contained in the plating tank 410 during the plating process. That is to say, in this specification, "opening on the inner side of the plating tank 410" means that when the plating module 400 is viewed from above, the second end 474 is located on the inner side of the second side wall 413-2 of the plating tank 410. Therefore, the second end 474 may be opened in an area below the upper end (plating liquid level OF) of the second side wall 413-2, or may be opened in an area above the upper end (plating liquid level OF) of the second side wall 413-2. In short, as long as the second end 474 is opened on the inner side of the plating tank 410, the plating liquid flowing from the second end 474 is supplied to the cathode region 422.

[0049] According to the plating module 400 of the present embodiment, the generation of poor plating caused by bubbles generated from the anode can be suppressed, and the structure related to the supply of the plating solution can be simplified. That is, the bubbles generated from the anode 430 can be captured by the diaphragm 420 and discharged to the upper side of the plated surface of the substrate through the gas-liquid piping 470, so that the bubbles can be suppressed from adhering to the plated surface and generating poor plating. In addition, the plating solution can be supplied from the anode region 424 to the cathode region 422 via the gas-liquid piping 470, so there is no need to respectively set supply piping in the anode region 424 and the cathode region 422, and the structure related to the supply of the plating solution can be simplified.

[0050] In addition, according to the plating module 400 of the present embodiment, the plating solution can be transported from the cathode region 422 to the anode region 424 via the check valve 425 and discharged from the discharge pipe 414-2, so there is no need to respectively set the discharge pipes in the anode region 424 and the cathode region 422, which can simplify the structure related to the discharge of the plating solution. In addition, according to the plating module 400 of the present embodiment, the plating solution is made to fall from the cathode region 422 to the anode region 424 via the check valve 425 and discharged, so that more byproducts (sludge) attached to the surface of the anode 430 can be washed away.

[0051] <Plating method>

[0052] Figure 6 The following plating method starts with no plating solution stored in the plating tank 410 and the supply valve 418 and the discharge valve 419 being closed.

[0053] The plating method first performs a step of opening the supply valve 418 and starting the pump 417 ( S101 ). As a result, the supply pipe 414 - 1 is opened, and the plating solution stored in the tank 416 is supplied from the supply port 412 to the anode region 424 .

[0054] Next, the plating treatment method performs a step (S102) of closing the check valve 425 by supplying the plating solution to the anode region 424, thereby raising the plating solution level in the anode region 424. Specifically, S102 is performed in the following manner: if the plating solution level in the anode region 424 rises to the valve core 427, the valve core 427 rises together with the rise of the plating solution level and abuts against the valve seat 426b, thereby closing the flow path 426a.

[0055] Next, the plating method performs a step of closing the check valve 425 to increase the flow resistance of the entire diaphragm 420 including the flow path 426 a , thereby supplying the plating solution from the gas-liquid pipe 470 to the cathode region 422 ( S103 ).

[0056] The plating method performs a step (S104) of capturing bubbles generated from the anode 430 by the diaphragm 420 and discharging the captured bubbles to a position above the plated surface Wf-a of the substrate Wf via the gas-liquid piping 470. Specifically, the bubbles captured by the diaphragm 420 move in an upward direction along the inclined surface 423a, and are gathered in the bubble accumulation area BA near the upper end of the inclined surface 423a, and are discharged to a position above the plated surface Wf-a of the substrate Wf via the gas-liquid piping 470.

[0057] If the plating solution fills the plating tank 410, the plating method performs plating by applying voltage between the substrate Wf (cathode) and the anode (step S105). If the plating is completed, the plating method stops the pump 417 and closes the supply valve 418 (S106).

[0058] Next, the plating treatment method performs a step of discharging the plating solution from the anode region 424 by opening the discharge valve 419 and opening the discharge pipe 414 - 2 ( S107 ).

[0059] Next, the plating treatment method performs a step (S108) of draining the plating solution from the anode region 424 to lower the plating solution level in the anode region 424, thereby opening the check valve 425 provided on the diaphragm 420 that separates the anode region 424 from the cathode region 422. Specifically, S108 is performed in the following manner: if the plating solution level in the anode region 424 drops to the valve core 427, the valve core 427 drops together with the drop in the plating solution level and leaves the valve seat 426b, thereby opening the flow path 426a.

[0060] Next, the plating method performs a step of opening the check valve 425 to transport the plating solution in the cathode region 422 to the anode region 424 through the flow path 426 a and discharge the plating solution from the discharge pipe 414 - 2 ( S109 ).

[0061] According to the plating treatment method of the present embodiment, it is possible to capture bubbles generated from the anode 430 and discharge them to the upper side of the plated surface of the substrate, so that bubbles can be prevented from adhering to the plated surface and causing poor plating. In addition, according to the plating treatment method of the present embodiment, the plating solution can be supplied from the anode region 424 to the cathode region 422 via the gas-liquid piping 470, so there is no need to respectively set supply piping in the anode region 424 and the cathode region 422, and the structure related to the supply of the plating solution can be simplified. In addition, according to the plating treatment method of the present embodiment, the plating solution can be transported from the cathode region 422 to the anode region 424 via the check valve 425, and discharged from the discharge piping 414-2, so there is no need to respectively set discharge piping in the anode region 424 and the cathode region 422, and the structure related to the discharge of the plating solution can be simplified. Furthermore, according to the plating method of this embodiment, the plating solution is discharged by dropping from the cathode region 422 to the anode region 424 via the check valve 425 , so that more byproducts (sludge) attached to the surface of the anode 430 can be washed away.

[0062] Although several embodiments of the present invention have been described above, the embodiments of the invention described above are for easy understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from its main purpose, and the present invention also includes its equivalents. In addition, within the scope of being able to solve at least part of the above-mentioned problems or having at least part of the effects, any combination or omission of the constituent elements described in the claims and the specification can be performed.

[0063] As one embodiment, the present application discloses a plating device, comprising: a plating tank for accommodating a plating liquid; an anode disposed in the above-mentioned plating tank; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a diaphragm that separates an anode region where the above-mentioned anode is disposed and a cathode region where the substrate is disposed during a plating process, the diaphragm having an inclined surface opposite to the above-mentioned anode; a supply port for supplying the plating liquid to the above-mentioned anode region; and a gas-liquid piping having a first end portion opening near an upper end of the above-mentioned inclined surface of the above-mentioned diaphragm, and a second end portion opening above the surface to be plated of the substrate during the plating process, the gas-liquid piping being configured to supply the plating liquid supplied from the above-mentioned supply port to the above-mentioned anode region to the above-mentioned cathode region via the above-mentioned second end portion.

[0064] In addition, as one embodiment, the present application discloses a plating apparatus, wherein the second end portion of the gas-liquid pipe is configured to open below a surface of the plating liquid contained in the plating tank.

[0065] In addition, as one embodiment, the present application discloses a plating device, wherein the diaphragm includes a central member disposed at the center of the plating tank in a radial direction, and an inclined film extending radially and obliquely upward from the central member.

[0066] In addition, as one embodiment, the present application discloses a plating device, wherein a check valve is disposed on the central member of the diaphragm, and the check valve is configured to allow the plating solution to flow only in a direction from the cathode region to the anode region.

[0067] In addition, as an embodiment, the present application discloses a plating device, wherein the above-mentioned check valve has: a valve box, which forms a flow path that connects the above-mentioned anode area with the above-mentioned cathode area; a valve seat, which is arranged in the above-mentioned flow path; and a floating valve core, which is arranged below the above-mentioned valve seat in the above-mentioned flow path and is formed to be able to abut against the above-mentioned valve seat.

[0068] In addition, as an embodiment, the present application discloses a plating liquid discharge method, which is used to discharge the plating liquid contained in a plating tank of a cup-type plating device, and the above-mentioned plating liquid discharge method includes: the step of opening a discharge pipe connected to the anode area of ​​the above-mentioned plating tank to discharge the plating liquid from the above-mentioned anode area; the step of discharging the plating liquid from the above-mentioned anode area to lower the plating liquid level in the above-mentioned anode area, thereby opening a check valve arranged on a diaphragm separating the above-mentioned anode area and the cathode area; and the step of opening the above-mentioned check valve to transport the plating liquid in the above-mentioned cathode area to the above-mentioned anode area and discharge it from the above-mentioned discharge pipe.

[0069] Description of Reference Numerals

[0070] 400…plating module; 410…plating tank; 412…supply port; 420…diaphragm; 421…central component; 422…cathode region; 423…inclined membrane; 423a…inclined surface; 424…anode region; 425…check valve; 426…valve box; 426a…flow path; 426b…valve seat; 427…valve core; 430…anode; 440…substrate holder; 470…gas-liquid piping; 472…first end; 474…second end; Wf…substrate; Wf-a…plated surface.

Claims

1. A plating device, characterized in that: include: A plating tank, the plating tank is used to contain a plating solution; an anode, the anode being disposed in the plating tank; a substrate holder configured to hold the substrate with the plated surface facing downward; a diaphragm that separates an anode region where the anode is arranged and a cathode region where the substrate is arranged during plating, the diaphragm having an inclined surface facing the anode; a supply port, the supply port being used to supply a plating solution to the anode region; as well as A gas-liquid piping system having a first end portion opening near the upper end of the inclined surface of the diaphragm and a second end portion opening above a plated surface of the substrate during plating treatment, wherein the gas-liquid piping system is configured to supply the plating liquid supplied from the supply port to the anode region to the cathode region via the second end portion.

2. The plating device according to claim 1, characterized in that: The second end portion of the gas-liquid pipe is configured to open below a surface of the plating liquid contained in the plating tank.

3. The plating device according to claim 2, characterized in that: The diaphragm includes a central member disposed at the center of the plating tank in a radial direction, and an inclined film extending radially and obliquely upward from the central member.

4. The plating device according to claim 3, characterized in that: A check valve is disposed in the central member of the diaphragm, and the check valve is configured to allow the plating solution to flow only in a direction from the cathode region to the anode region.

5. The plating device according to claim 4, characterized in that: The check valve comprises: a valve box forming a flow path connecting the anode region and the cathode region; a valve seat provided in the flow path; and a floating valve core arranged below the valve seat in the flow path and formed to be capable of abutting against the valve seat.

6. A method for discharging a plating solution, for discharging a plating solution contained in a plating tank of a cup-type plating device, The plating solution discharge method is characterized by comprising: The step of opening a discharge pipe connected to the anode region of the plating tank to discharge the plating solution from the anode region; The step of draining the plating solution from the anode region to lower the plating solution level in the anode region, thereby opening a check valve provided on a diaphragm separating the anode region from the cathode region; and The step of opening the check valve to transport the plating solution in the cathode region to the anode region and discharge the plating solution from the discharge pipe.

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