Analog simulation method based on heat transfer characteristic of heating smoking set

Abstract

The invention discloses an analog simulation method based on heat transfer characteristics of a heating smoking set, the heating smoking set comprises a first assembly and a second assembly, the second assembly surrounds the first assembly, the first assembly and the second assembly are relatively fixed through a connecting piece, and a gap is kept between the first assembly and the second assembly; the analog simulation method comprises the following steps of: 1, simulating a first component and a second component by utilizing a non-gridding simulation method; 2, simulating a first heat transfer behavior of the first component and the second component through the connecting piece by using the comprehensive heat transfer coefficient model; and 3, simulating a second heat transfer behavior of the first assembly and the second assembly through the gap by using the narrow space model. According to the method, different heat transfer behaviors of the heating smoking set assembly are calculated through the non-gridding simulation method in cooperation with the comprehensive heat transfer coefficient model and the narrow space model, the calculation complexity of heat transfer of internal elements of the heating smoking set is reduced, and the analog simulation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of design of heated smoking articles, and in particular to a simulation method based on the heat transfer characteristics of heated smoking articles. Background Art

[0002] With the development of the tobacco industry, heated tobacco products, as a new type of tobacco product, have received extensive attention and research. Heated tobacco products release smoke by heating rather than burning tobacco. Compared with traditional tobacco products, they have lower smoke volume and release of harmful substances, so they are favored by consumers.

[0003] In the development of heated tobacco products, simulation technology plays a vital role. Simulation technology can simulate various situations of heated tobacco products in actual use, including the heating process of cigarettes, the release and transfer of smoke, and the temperature distribution inside the product. Through simulation, R&D personnel can conduct more in-depth research on the design and optimization of heated tobacco products, thereby improving product performance and user experience.

[0004] However, there are still some problems with the current simulation technology of heated smoking devices. For example, due to the complexity and diversity of heated smoking devices, the simulation process needs to involve the interaction of multiple physical fields, such as heat conduction, fluid dynamics and other physical properties, which undoubtedly increases the difficulty and complexity of the simulation, resulting in a significant increase in the scale and amount of calculation of simulation modeling, thereby reducing the simulation speed.

[0005] It is understandable that simulation technology is an important means to predict and optimize product performance, and simulation speed is one of the key factors in the iterative design process of heated tobacco products. However, it faces the problem of slow simulation speed, which means that the number of product design iterations is reduced, resulting in insufficient design optimization, which seriously restricts the research and development progress and efficiency of heated tobacco products, and may ultimately lead to poor product performance or defects.

[0006] Therefore, how to improve the simulation efficiency of heated smoking devices to meet the rapid development of heated smoking device products in the industry has become a major concern. Summary of the invention

[0007] In order to solve the above technical problems existing in the prior art, the present invention provides a simulation method based on the heat transfer characteristics of the heating smoking device, which is used to improve the simulation efficiency of the heating smoking device.

[0008] The technical solution adopted by the present invention is:

[0009] A simulation method based on the heat transfer characteristics of a heating smoking device, wherein the heating smoking device comprises a first component and a second component, wherein the second component surrounds the first component, and the first component and the second component are relatively fixed by a connecting member and a gap is maintained between them, wherein the simulation method comprises:

[0010] Step 1: simulating the first component and the second component by using a gridless simulation method;

[0011] Step 2: using a comprehensive heat transfer coefficient model to simulate a first heat transfer behavior of the first component and the second component through the connecting member;

[0012] Step 3: Use a narrow space model to simulate a second heat transfer behavior of the first component and the second component through the gap.

[0013] Furthermore, the step 2 comprises:

[0014] Step A: According to the physical parameters of the connector, the first component and the second component, the radiation heat transfer formula and the convection heat transfer formula are simplified and coupled to obtain the comprehensive heat transfer coefficient model;

[0015] Step B: Based on the comprehensive heat transfer coefficient model, the first component and the second component are simulated using the ambient temperature and the total heat transfer amount of the heating device.

[0016] Further, the physical parameter includes a first physical parameter and a second physical parameter, and the step A includes:

[0017] Step A1: simplifying the radiation heat transfer formula according to the first physical parameters of the connector, the first component and the second component to obtain a simplified radiation heat transfer rate;

[0018] Step A2: simplifying the convection heat transfer formula according to the second physical parameters of the connector, the first component and the second component to obtain a simplified convection heat transfer rate;

[0019] Step A3: The simplified radiation heat transfer rate and the simplified convection heat transfer rate are coupled to establish the comprehensive heat transfer coefficient model.

[0020] Furthermore, the step A1 comprises:

[0021] Step A11: taking two end values ​​and at least one intermediate value of the wall temperature of the connecting member, the first component and the second component within the range of 25 to 60° C., and substituting them into the radiation heat transfer formula to calculate the radiation heat transfer rate corresponding to each wall temperature;

[0022] Step A12: According to the radiation heat transfer rate corresponding to each wall surface temperature, a first-order fitting formula of the radiation heat transfer rate with respect to the wall surface temperature is obtained to obtain a simplified radiation heat transfer rate.

[0023] Furthermore, the step A2 comprises:

[0024] Step A21: according to different wall shapes, sizes and / or oriented wall types of the connecting parts, the first component and the second component, respectively substitute the convection heat transfer formula to calculate the radiation heat transfer rate corresponding to each wall type;

[0025] Step A22: Simplify the radiation heat transfer rate into a function of wall type parameters and wall temperature.

[0026] Furthermore, the step 3 comprises:

[0027] Step 3-1: determining an air gap heat transfer calculation formula corresponding to the air gap between the first component and the second component according to the spacing distance between the first component and the second component and the heat transfer characteristic information of the gas in the gap;

[0028] Step 3-2: Map the air gap heat transfer calculation formula with the first component and the second component to establish the narrow space model.

[0029] Furthermore, the step 3-1 includes:

[0030] Based on the gap gas heat transfer characteristic information, determining the relationship between the spacing distance between the first component and the second component and the first preset threshold and the second preset threshold:

[0031] If the interval distance is greater than the first preset threshold, execute step 3-1-1:

[0032] Determining that the heat transfer type of the first component and the second component is mainly convective heat transfer, and selecting the air gap heat transfer calculation formula as a gas comprehensive heat transfer formula;

[0033] If the interval distance is less than the first preset threshold and greater than the second preset threshold, execute step 3-1-2:

[0034] Determining that the heat transfer type of the first component and the second component is mainly solid heat transfer, and selecting the air gap heat transfer calculation formula as a solid heat transfer formula;

[0035] If the interval distance is less than the second preset threshold, execute step 3-1-3:

[0036] Determine that the heat transfer type of the first component and the second component is mainly contact thermal resistance, and select the air gap heat transfer calculation formula as the thermal contact heat transfer formula.

[0037] Furthermore, the gap gas heat transfer characteristic information includes the relationship between the spacing distance between the first component and the second component and the convective heat transfer rate.

[0038] Furthermore, the first component and the second component are a heating component and a heat insulation component, or the first component and the second component are a heat insulation component and a heat dissipation component.

[0039] Furthermore, the simulation method also includes: Step 4: presenting the simulation results of the first heat transfer behavior and the simulation results of the second heat transfer behavior through a visualization system.

[0040] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0041] 1. The simulation method provided in this application simulates the components through a gridless simulation method, thereby reducing the calculation time of the simulation.

[0042] 2. The simulation method provided by the present invention simulates different heat transfer behaviors of components through a comprehensive heat transfer coefficient model and a narrow space model, thereby reducing the computational complexity of heat transfer of components inside the heating device and improving the efficiency of simulation.

[0043] 3. The simulation results provided by the present invention can also provide real-time feedback and intuitive visualization results at the same time, which is convenient for staff to quickly get started and meet the needs of rapid research and development of heated smoking products. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The above content and the following specific embodiments of the present invention will be better understood when read in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are only examples of the technical solutions claimed for protection.

[0045] Figure 1 It is a schematic diagram of the flow chart of the simulation method of the present application;

[0046] Figure 2 is a graph of the relationship between temperature and radiation heat transfer coefficient of the present application;

[0047] FIG3 is a graph showing the relationship between the natural convection heat transfer coefficient and the temperature and size of the present application, wherein: Figure 3a is the relationship diagram for the wall with the hot side facing upward, Figure 3b is the relationship diagram for the wall with the hot side facing downward, Figure 3c is the relationship diagram corresponding to the vertical wall, Figure 3d is the relationship diagram corresponding to the horizontal cylindrical wall, Figure 3eIt is the relationship diagram corresponding to the spherical wall;

[0048] Figure 4 is a graph of the relationship between air pressure and thermal conductivity of the present application;

[0049] Figure 5 is a graph showing the relationship between the spacing size between the elements of the present application and the convective heat transfer rate;

[0050] Figure 6 is a cross-sectional view of the circumferentially heated smoking device of the present application;

[0051] Figure 7 is a temperature cloud diagram of a heating component in an embodiment;

[0052] Figure 8 is a temperature cloud diagram of the thermal insulation assembly in the embodiment;

[0053] Fig. 9 is a temperature cloud diagram of a heat dissipation component in an embodiment;

[0054] Fig.10 It is a temperature cloud diagram of the entire heating smoking device in the embodiment.

[0055] The reference numerals are described as follows:

[0056] Heating smoking device 10;

[0057] Heating component 11;

[0058] Thermal insulation assembly 12;

[0059] Heat dissipation component 13. DETAILED DESCRIPTION

[0060] The detailed features and advantages of the present invention are described in detail in the specific implementation modes below, and the contents are sufficient to enable any person skilled in the art to understand the technical contents of the present invention and implement them accordingly. Moreover, according to the description, claims and drawings disclosed in this specification, those skilled in the art can easily understand the relevant objects and advantages of the present invention.

[0061] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0062] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0063] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0064] Please refer to Figure 1 The present application provides a simulation method based on the heat transfer characteristics of a heating smoking device. The heating smoking device may include a first component and a second component. The second component surrounds the first component. The first component and the second component are relatively fixed by a connecting member and a gap is maintained between them. The simulation method may specifically include the following steps:

[0065] Step 1: Simulate the first component and the second component using a meshless simulation method.

[0066] Step 2: Use the comprehensive heat transfer coefficient model to simulate the first heat transfer behavior of the first component and the second component through the connecting piece.

[0067] Step 3: Use the narrow space model to simulate the second heat transfer behavior between the first component and the second component through the gap.

[0068] In one embodiment, the simulation model of the heated smoking device may be pre-established and may be directly obtained through a local database or from a server stored in the cloud, and then the relevant configuration may be changed as needed.

[0069] In another embodiment, the simulation model of the heating smoking device can be selected according to the actual structure and working principle of the heating smoking device, and appropriate simulation software, such as COMSOL, ANSYS, FLUENT and other software, can be used to establish the simulation model of the heating smoking device by using the simulation software.

[0070] It can be understood that the specific process of establishing the simulation model is well known to those skilled in the art and will not be described in detail here.

[0071] Specifically, step 2 includes:

[0072] Step A: According to the physical parameters of the connector, the first component and the second component, the radiation heat transfer formula and the convection heat transfer formula are simplified and coupled to obtain a comprehensive heat transfer coefficient model;

[0073] Step B: Based on the comprehensive heat transfer coefficient model, the first component and the second component are simulated using the ambient temperature and the total heat transfer of the heating device.

[0074] It can be understood that here, the circumferential heating smoking device is used as an example. The wall structure in the heating smoking device is relatively simple, so the comprehensive heat transfer coefficient is within a smaller range, but the specific calculation of the comprehensive heat transfer takes a lot of time to calculate. Therefore, the relevant physical parameters of the connector, the first component and the second component can be used to fit some data with less influence, and the originally more complex radiation heat transfer formula and convection heat transfer formula can be simplified and coupled to obtain a comprehensive heat transfer coefficient model, and then the subsequent calculation can be directly performed through the comprehensive heat transfer coefficient model, which can effectively improve the calculation efficiency.

[0075] Specifically, the physical parameter includes a first physical parameter and a second physical parameter, and step A includes:

[0076] Step A1: Simplifying the radiation heat transfer formula according to the first physical parameters of the connector, the first component and the second component to obtain a simplified radiation heat transfer rate;

[0077] Step A2: simplifying the convection heat transfer formula according to the second physical parameters of the connector, the first component and the second component to obtain a simplified convection heat transfer rate;

[0078] Step A3: Couple the simplified radiation heat transfer rate and the simplified convection heat transfer rate to establish a comprehensive heat transfer coefficient model.

[0079] When the heating device is in natural convection, the convection heat transfer formula is:

[0080] Q C =α c1 S(T w -T0) (1)

[0081] Among them, Q C is the convective heat flux, α c1 is the convection heat transfer coefficient, S is the wall area of ​​the equipment, T w is the wall temperature, and T0 is the ambient temperature.

[0082] The radiation heat transfer formula is:

[0083]

[0084] Among them, Q R is the radiation heat transfer heat flux, δ0 ​​is the Stefan Borchert constant [5.67*10 -8 w / (m 2 ·k 4 )], ε is the total emissivity of the material, S is the wall area of ​​the device, is the view factor, T w is the wall temperature, and T0 is the ambient temperature.

[0085] It can be understood that both the convective heat transfer formula and the radiation heat transfer formula are relatively complex and can be simplified to improve the efficiency of the simulation.

[0086] Specifically, step A1 includes:

[0087] Step A11: Take two end values ​​and at least one intermediate value of the wall temperature of the connecting piece, the first component and the second component within the range of 25 to 60° C., substitute them into the radiation heat transfer formula to calculate the radiation heat transfer rate corresponding to each wall temperature;

[0088] Step A12: According to the radiation heat transfer rates corresponding to the various wall temperatures, a first-order fitting formula of the radiation heat transfer rate with respect to the wall temperature is obtained to obtain a simplified radiation heat transfer rate.

[0089] Please refer to Figure 2 ,In the parameter study of radiation heat transfer, it can be determined that the emissivity of the wall material has the greatest influence on radiation heat transfer, while the temperature has a smaller influence.

[0090] Step A12 may specifically be:

[0091] Step A121: Simplify the radiation heat transfer formula to:

[0092] Q R =α R1 S(T w -T0) (3)

[0093] Among them, α R is the radiation heat transfer coefficient, S is the wall area of ​​the device, T w is the wall temperature, T0 is the ambient temperature;

[0094] Step A122: Determine the angle coefficient based on the ambient temperature T0 1, and substitute it into the radiation heat transfer formula to obtain the following formula:

[0095]

[0096] Among them, α R is the radiation heat transfer coefficient, δ0 is the Stephen Borhertz constant [5.67*10-8w / (m 2 ·k4)], ε is the total emissivity of the material, T w is the wall temperature, T0 is the ambient temperature;

[0097] Step A123: The main use environment temperature T0 is 15-30°C, the wall temperature is 25-60°C, the total wall emissivity is 0.2-0.8, and the wall temperature T is calculated. w and radiation heat transfer coefficient α R relation;

[0098] Step A124: According to the wall temperature T w and radiation heat transfer coefficient α R Relationship, it is determined that the radiation heat transfer coefficient can be expressed as the product of the basic radiation heat transfer coefficient and the emissivity, and the following radiation heat transfer rate α is obtained R2 :

[0099] α R2 =ε(5.0364+0.0325T w ) (5)

[0100] Where ε is the total emissivity of the material, T w is the wall temperature;

[0101] Step A125: According to the wall temperature T w and the radiation heat transfer rate α R2 The relationship between the total emissivity ε of the material and the radiation heat transfer rate α R2 The relationship between the radiation heat transfer rate α R2 The fitting is simplified to obtain the following simplified radiation heat transfer rate α R3 :α R3 =Aε, where A is the wall temperature T w The relative scaling factor within a preset temperature range.

[0102] Specifically, step A2 includes:

[0103] Step A21: according to different wall shapes, sizes and / or oriented wall types of the connecting parts, the first component and the second component, respectively substitute the convective heat transfer formula to calculate the radiation heat transfer rate corresponding to each wall type;

[0104] Step A22: Simplify the radiation heat transfer rate into a function of the wall type parameters and the wall temperature.

[0105] Please refer to Figure 3. In the process of convection heat transfer of wall heat transfer, the relationship between the natural convection heat transfer coefficient, temperature and size shows that the temperature difference between the wall and the ambient temperature has the greatest impact on the convection heat transfer coefficient, and has little impact on the size.

[0106] For example, the wall temperature is 25-60°C, the ambient temperature is 15-30°C, and the comprehensive heat transfer coefficient is α T =9.6+0.06(t0-t ∞ ), where t0 is the wall temperature of 25 to 60°C, t∞ When the ambient temperature is 15-30℃, the comprehensive heat transfer coefficient can be directly calculated through the two parameters of wall temperature and ambient temperature to obtain the heat dissipation capacity of the heating device and simplify the calculation process.

[0107] Specifically, step A21 may include:

[0108] Step A211: Based on the Rayleigh number or Nusselt number formula, the relationship between the convective heat transfer coefficient and the wall temperature and size corresponding to the convective surface facing upward, the heat surface facing downward and the vertical wall is processed, and substituted into the convective heat transfer formula to obtain the convective heat transfer coefficient corresponding to different flat walls:

[0109]

[0110] Among them, α P,T is the convective heat transfer coefficient of the flat wall with the hot surface facing upward, α P,B is the convective heat transfer coefficient of the flat wall with the hot surface facing downward, α P,v is the convective heat transfer coefficient of the vertical wall, T w is the wall temperature, W is the wall width, and H is the wall height;

[0111] Step A212: Based on the Rayleigh number or Nusselt number formula, the relationship between the convective heat transfer coefficient and the wall temperature and size corresponding to the horizontal cylindrical wall and the spherical wall is processed, and substituted into the convective heat transfer formula to obtain the convective heat transfer coefficient corresponding to different curved walls:

[0112]

[0113] Among them, α Cy is the convection heat transfer coefficient of the horizontal cylindrical wall, α S is the convection heat transfer coefficient of the spherical wall, and R is the radius of the curved surface.

[0114] Specifically, step A22 may include:

[0115] Step A221: Simplify the convective heat transfer coefficient corresponding to the flat wall and the convective heat transfer coefficient corresponding to the curved wall to obtain:

[0116]

[0117] Among them, the coefficient B is the proportionality coefficient related to the wall type, T w is the wall temperature, and L is a size parameter related to the wall type.

[0118] Specifically, the comprehensive heat transfer coefficient model is:

[0119] α T =α R2 +α C (12)

[0120] Among them, α T is the comprehensive heat transfer coefficient, α R2 To simplify the radiation heat transfer rate, α C To simplify the convection heat transfer rate.

[0121] Specifically, step 3 may include:

[0122] Step 3-1: Determine an air gap heat transfer calculation formula corresponding to the air gap between the first component and the second component according to the spacing distance between the first component and the second component and the heat transfer characteristic information of the gap gas;

[0123] Step 3-2: Map the air gap heat transfer calculation formula with the first component and the second component to establish a narrow space model.

[0124] It can be understood that the present application determines the relationship between the spacing distance between components and the threshold value, selects the corresponding heat transfer calculation method for calculation, simplifies the complexity of the air gap heat transfer calculation and improves the efficiency of subsequent simulation calculations.

[0125] The information on the heat transfer characteristics of interstitial gas mainly refers to the relevant information generated when heat is transferred through the gas in the tiny gaps between the components inside the heating device during the heating process of the heating device.

[0126] Specifically, step 3-1 includes: judging the relationship between the spacing distance between the first component and the second component and the first preset threshold and the second preset threshold based on the gap gas heat transfer characteristic information:

[0127] If the interval distance is greater than the first preset threshold, step 3-1-1 is performed: determining that the heat transfer type of the first component and the second component is mainly convective heat transfer, and selecting the air gap heat transfer calculation formula as the gas comprehensive heat transfer formula;

[0128] If the interval distance is less than the first preset threshold and greater than the second preset threshold, execute step 3-1-2: determine that the heat transfer type of the first component and the second component is mainly solid heat transfer, and select the air gap heat transfer calculation formula as the solid heat transfer formula;

[0129] If the spacing distance is less than the second preset threshold, execute step 3-1-3: determine that the heat transfer type of the first component and the second component is mainly contact thermal resistance, and select the air gap heat transfer calculation formula as the thermal contact heat transfer formula.

[0130] Exemplarily, the setting range of the first preset threshold may be 1-2 mm, and the setting range of the second preset threshold may be 0.1-1 mm.

[0131] It should be noted that contact thermal resistance is a microscopic heat transfer characteristic of material mechanics, which varies with material properties, surface roughness, operating pressure and other conditions, and cannot be directly calculated in engineering simulation. This application facilitates simulation heat transfer calculation by performing an equivalent simplified calculation of contact thermal resistance.

[0132]

[0133] Where h = h c +h g +h r ,h c is the heat conduction at the contact point, h g is the heat conduction of the gas in the contact gap, h r It is the radiation heat conduction of the contact gap.

[0134] h c The heat conduction at the contact point can be calculated using the CMY theoretical model:

[0135]

[0136] The influencing factors are: 1. Material surface roughness, 2. Pressure, 3. Material hardness and 4. Material thermal conductivity.

[0137] h g The heat conduction of the contact gap gas can be calculated by the equivalent model of two plane gap heat conduction:

[0138]

[0139] in

[0140]

[0141] M=αβ∧ (19)

[0142] The influencing factors are 1. material surface roughness, 2. gas property parameters, 3. pressure and 4. material hardness.

[0143] h r The radiative heat transfer through the contact gap can be calculated using the gray-diffuse parallel plate model:

[0144]

[0145] The influencing factors are 1. material emissivity and 2. interface temperature.

[0146] By adding the above three models together, we can get the theoretical formula:

[0147]

[0148] in, M=αβ∧, surface roughness σ, average absolute slope m, loading pressure p, material hardness H c .

[0149] First, a model suitable for contact thermal resistance is constructed, and the contact thermal resistance model is simulated and the corresponding temperature cloud map is obtained. It can be found that the contact thermal resistance is mainly related to the temperature difference between the two walls.

[0150] Therefore, the calculation of the equivalent simplified contact thermal resistance is:

[0151]

[0152] Among them, ΔT is the temperature difference between the two walls, and q is the heat flux.

[0153] As the temperature inside the heating device gradually increases, the air pressure also increases, and the air temperature and thermal conductivity have a strong linear correlation. Figure 4 As shown in Figure 2, as the air pressure increases, the thermal conductivity gradually tends to a stable value.

[0154] That is, the internal pressure of the heating device has no effect on the heat conduction of the air, while the thermal conductivity of the air in the high-temperature section inside the heating device varies greatly.

[0155] In the embodiment of the present application, the first preset threshold value can be set to 1 mm, and the second preset threshold value can be set to 0.1 mm. Figure 5 , the spacing between the internal components of the heating device at different temperatures, the corresponding rising curve of the convective heat transfer rate relationship is also different. That is, it can be determined that 1. When the spacing between the components is above 1mm, the convective heat transfer between the components increases significantly; 2. When the spacing between the components is between 0.1 and 1mm, the convective heat transfer between the components is extremely low. 3. When the spacing between the components is below 0.1mm, the heat transfer between the components is a non-fluid heat transfer characteristic.

[0156] Specifically, the comprehensive heat transfer formula for gas is:

[0157]

[0158] Where q is the heat flux in W / m 2 ; k is the thermal conductivity of gas, unit is W / (m·K); is the temperature gradient, in K / m; h is the convective heat transfer coefficient, in W / (m 2 ·K); T s is the solid surface temperature, in K; T ∞ is the temperature of the fluid far away from the solid surface, in K; ∈ is the surface emissivity; σ is the Stefan-Boltzmann constant.

[0159] It should be noted that the comprehensive heat transfer formula for gases combines three basic heat transfer methods: heat conduction, convection and radiation.

[0160] Specifically, the solid heat transfer formula is:

[0161]

[0162] Where q is the heat flux in W / m 2 ;k eff It is the thermal conductivity of gas when it is equivalent to solid conduction, the unit is W / (m·K); is the temperature gradient in K / m.

[0163] Specifically, the thermal contact heat transfer formula is:

[0164]

[0165] Where q is the heat flux in W / m 2 ; T1, T2 are the temperatures of the two walls, in K; R c is the contact thermal resistance, unit is (K·m 2 ) / W.

[0166] Specifically, the first component and the second component are a heating component and a heat insulation component, or the first component and the second component are a heat insulation component and a heat dissipation component.

[0167] Preferably, the simulation method provided in the present application can be applied to circumferentially heated smoking articles, which are heat-not-burn smoking articles that adopt a circumferential heating method, and their characteristics are mainly reflected in the heating method and structural design.

[0168] It can be understood that, unlike the central heating method, circumferential heating means that the heating element heats the cigarette around the periphery, so that the cigarette is evenly heated from the outside to the inside. This heating method can ensure uniform carbonization of the cigarette and provide better taste and comfort.

[0169] For example, please refer to Figure 6 The heating smoking device 10 is a circumferential heating device, the heating component 11 is a tubular heating element; the heat insulation component 12 is a tubular heat insulation element sleeved on the outside of the tubular heating element; and the heat dissipation component 13 is a heat dissipation shell sleeved on the outside of the tubular heat insulation element.

[0170] In one embodiment, the simulation method further includes: Step 4: presenting the simulation results of the first heat transfer behavior and the simulation results of the second heat transfer behavior through a visualization system.

[0171] Please refer to Figure 7-Figure 10By using the meshless fast simulation method to perform heat transfer simulation calculations, the two original steps in the traditional simulation process (creating or modifying the geometric model, defining the structural load and boundary conditions) can be combined into one step, that is, simplifying or modifying the model while defining the model's operating environment; then the operation of meshing the model in the traditional simulation process is omitted. The quality of meshing directly affects the reliability of the simulation results, and professional simulation engineers are required to analyze the model and set the corresponding mesh type and mesh unit size. The meshless simulation technology does not require manual operation. The background automatically performs meshing according to the model. You only need to select the fidelity size (that is, the accuracy of meshing); then you can click the solve button to perform calculations, which simplifies a series of highly professional manual operations in the traditional simulation process, such as selecting the heat transfer solution model, setting the solver parameters, setting the flow field initialization, and setting the number of iterations; the temperature cloud map of the model is presented in less than 1 minute.

[0172] Based on the above inventive concept, the present application also provides an electronic device, comprising: a processor; a memory for storing processor executable instructions; wherein the processor implements the above simulation method based on the heat transfer characteristics of the heated smoking device by running the executable instructions.

[0173] Based on the above inventive concept, the present application also provides a computer-readable storage medium on which a computer program and / or computer instructions are stored. When the computer program / instructions are executed by a processor, the above simulation method based on the heat transfer characteristics of the heated smoking device is implemented.

[0174] Based on the above inventive concept, the present application also provides a computer program product, including a computer program and / or computer instructions, which, when executed by a processor, implement the steps of the above simulation method based on the heat transfer characteristics of the heated smoking device.

[0175] It should be noted that the systems, devices or modules described in the above embodiments can be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer, and the specific form of the computer can be a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email transceiver, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0176] In a typical configuration, a computer includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0177] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0178] Computer-readable media include permanent and non-permanent, removable and non-removable media that can be used to store information by any method or technology. Information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, disk storage, quantum memory, graphene-based storage media or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include temporary computer-readable media (transitory media), such as modulated data signals and carrier waves.

[0179] The terms and expressions used herein are for descriptive purposes only, and the present invention should not be limited to these terms and expressions. The use of these terms and expressions does not mean to exclude any equivalent features of the illustrations and descriptions (or parts thereof), and it should be recognized that various modifications that may exist should also be included in the scope of the claims. Other modifications, variations and substitutions may also exist. Accordingly, the claims should be deemed to cover all such equivalents.

[0180] Similarly, it should be pointed out that although the present invention has been described with reference to the current specific embodiments, ordinary technicians in this technical field should realize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions may be made without departing from the spirit of the present invention. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the essential spirit of the present invention, they will fall within the scope of the claims of the present invention.

Claims

1. A simulation method based on the heat transfer characteristics of a heating smoking device, wherein the heating smoking device comprises a first component and a second component, wherein the second component surrounds the first component, and the first component and the second component are relatively fixed by a connecting member and a gap is maintained between them, characterized in that: The simulation method comprises: Step 1: simulating the first component and the second component by using a gridless simulation method; Step 2: using a comprehensive heat transfer coefficient model to simulate a first heat transfer behavior of the first component and the second component through the connecting member; Step 3: Use a narrow space model to simulate a second heat transfer behavior of the first component and the second component through the gap.

2. A simulation method based on the heat transfer characteristics of a heating smoking device according to claim 1, characterized in that: The step 2 comprises: Step A: According to the physical parameters of the connector, the first component and the second component, the radiation heat transfer formula and the convection heat transfer formula are simplified and coupled to obtain the comprehensive heat transfer coefficient model; Step B: Based on the comprehensive heat transfer coefficient model, the first component and the second component are simulated using the ambient temperature and the total heat transfer amount of the heating device.

3. A simulation method based on the heat transfer characteristics of a heating smoking device according to claim 2, characterized in that: The physical parameters include a first physical parameter and a second physical parameter, and the step A includes: Step A1: simplifying the radiation heat transfer formula according to the first physical parameters of the connector, the first component and the second component to obtain a simplified radiation heat transfer rate; Step A2: simplifying the convection heat transfer formula according to the second physical parameters of the connector, the first component and the second component to obtain a simplified convection heat transfer rate; Step A3: The simplified radiation heat transfer rate and the simplified convection heat transfer rate are coupled to establish the comprehensive heat transfer coefficient model.

4. The simulation method based on the heat transfer characteristics of a heating smoking device according to claim 3, characterized in that: The step A1 comprises: Step A11: taking two end values ​​and at least one intermediate value of the wall temperature of the connecting member, the first component and the second component within the range of 25 to 60° C., and substituting them into the radiation heat transfer formula to calculate the radiation heat transfer rate corresponding to each wall temperature; Step A12: According to the radiation heat transfer rate corresponding to each wall surface temperature, a first-order fitting formula of the radiation heat transfer rate with respect to the wall surface temperature is obtained to obtain a simplified radiation heat transfer rate.

5. The simulation method based on the heat transfer characteristics of a heating smoking device according to claim 3, characterized in that: The step A2 comprises: Step A21: according to different wall shapes, sizes and / or oriented wall types of the connecting parts, the first component and the second component, respectively substitute the convection heat transfer formula to calculate the radiation heat transfer rate corresponding to each wall type; Step A22: Simplify the radiation heat transfer rate into a function of wall type parameters and wall temperature.

6. The simulation method based on the heat transfer characteristics of a heating smoking device according to claim 1, characterized in that: The step 3 comprises: Step 3-1: determining an air gap heat transfer calculation formula corresponding to the air gap between the first component and the second component according to the spacing distance between the first component and the second component and the heat transfer characteristic information of the gas in the gap; Step 3-2: Map the air gap heat transfer calculation formula with the first component and the second component to establish the narrow space model.

7. The simulation method based on the heat transfer characteristics of a heating smoking device according to claim 6, characterized in that: The step 3-1 comprises: Based on the gap gas heat transfer characteristic information, determining the relationship between the spacing distance between the first component and the second component and the first preset threshold and the second preset threshold: If the interval distance is greater than the first preset threshold, execute step 3-1-1: Determining that the heat transfer type of the first component and the second component is mainly convective heat transfer, and selecting the air gap heat transfer calculation formula as a gas comprehensive heat transfer formula; If the interval distance is less than the first preset threshold and greater than the second preset threshold, execute step 3-1-2: Determining that the heat transfer type of the first component and the second component is mainly solid heat transfer, and selecting the air gap heat transfer calculation formula as a solid heat transfer formula; If the interval distance is less than the second preset threshold, execute step 3-1-3: Determine that the heat transfer type of the first component and the second component is mainly contact thermal resistance, and select the air gap heat transfer calculation formula as the thermal contact heat transfer formula.

8. The simulation method based on the heat transfer characteristics of a heating smoking device according to claim 6, characterized in that: The gap gas heat transfer characteristic information includes the relationship between the spacing distance between the first component and the second component and the convective heat transfer rate.

9. The simulation method based on the heat transfer characteristics of a heating smoking device according to claim 1, characterized in that: The first component and the second component are a heating component and a heat insulating component, or the first component and the second component are a heat insulating component and a heat dissipating component.

10. The simulation method according to claim 1, characterized in that: The simulation method further includes: Step 4: presenting the simulation results of the first heat transfer behavior and the simulation results of the second heat transfer behavior through a visualization system.

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