Substrate heat treatment apparatus

Abstract

The invention provides a technology capable of easily maintaining a driving mechanism and the like for lifting a lifting pin in a substrate heat treatment device. A substrate heat treatment apparatus (1) is provided with: a heat plate (20) for heat-treating a substrate (9); a substrate raising and lowering mechanism (30) that raises and lowers the substrate (9) above the heat plate (20); a main body frame (11) for supporting the hot plate (20) and the substrate lifting mechanism (30); and a pair of sliding members (15) capable of integrally pulling out the heat plate (20) and the substrate lifting mechanism (30) from a processing position (P1) on the inner side of the main body frame (11) to a maintenance position (P2). The substrate lifting mechanism (30) is provided with: a plurality of lifting pins (31); a frame member (35) that supports the plurality of lifting pins (31); a motor (37) located outside the frame member (35) in plan view; and a power transmission mechanism (38) for transmitting the power of the motor (37) and raising and lowering the frame member (35).

Description

Technical Field

[0001] The subject matter disclosed in this specification relates to a substrate heat treatment apparatus. Background Art

[0002] For example, in the processing steps of various substrates such as glass substrates for display devices, a process is sometimes performed in which a coating liquid is applied to a substrate and then the substrate is heated by a substrate heat treatment apparatus to volatilize components contained in the coating liquid.

[0003] In addition, when heat treatment is performed in a substrate heat treatment device, when the substrate is transported, in order to transfer the substrate between the transport arm, a plurality of lift pins for supporting the substrate are sometimes used. For example, Patent Document 1 describes that a support frame is used to support a plurality of lift pins that penetrate a hot plate, and the support frame and the plurality of lift pins are lifted and lowered together by a lifting mechanism. In addition, the lifting mechanism includes a motor, a gear, a rack, and the like.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2008-311407 Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] Yet, in patent document 1, the lifting mechanism is arranged just below the frame member, so when carrying out the maintenance of the lifting mechanism, the operator needs to dive below the frame member to carry out the operation. In this case, because the action is restricted, it is possible to cause the operation to slow down, or lose the correctness and other maintenance work efficiency to reduce.

[0009] An object of the present invention is to provide a technology that can easily perform maintenance of a substrate lifting mechanism for lifting a substrate in a substrate heat treatment apparatus.

[0010] [Technical means to solve the problem]

[0011] In order to solve the above-mentioned problem, the first embodiment includes: a heat treatment plate for heat-treating a substrate; a substrate lifting mechanism for lifting and lowering the substrate above the heat treatment plate; a main frame for supporting the heat treatment plate and the substrate lifting mechanism; and a pulling-out mechanism for integrally pulling the heat treatment plate and the substrate lifting mechanism from a treatment position inside the main frame to a maintenance position, wherein the substrate lifting mechanism comprises: a plurality of lifting pins inserted into through holes of the heat treatment plate; a frame member arranged at a lower side than the heat treatment plate and supporting the plurality of lifting pins; a motor located outside the frame member when viewed from above; and a power transmission mechanism for transmitting power from the motor to lift and lower the frame member.

[0012] A second embodiment is the substrate heat treatment apparatus according to the first embodiment, wherein at least a portion of the power transmission mechanism is located outside the frame member in a plan view.

[0013] A third embodiment is the substrate heat treatment apparatus according to the second embodiment, wherein the power transmission mechanism raises and lowers the frame member while being in contact with a side surface of the frame member.

[0014] The fourth embodiment is a substrate heat treatment device according to the third embodiment, wherein the power transmission mechanism also has: a shaft, which is located outside the frame member when viewed from above and transmits the rotational motion of the motor; a pinion connected to the shaft; and a rack, which is located outside the frame member when viewed from above, connected to the frame member, and meshes with the pinion.

[0015] A fifth embodiment is a substrate heat treatment apparatus according to the fourth embodiment, wherein the substrate lifting mechanism further comprises an elastic connection member that connects the power transmission mechanism and the frame member and is elastically deformable.

[0016] The sixth embodiment is a substrate heat treatment device according to the fifth embodiment, wherein the elastic connecting member comprises: a first connecting portion extending in a horizontal direction; a second connecting portion connected to the first connecting portion and extending in a vertical direction; and a frame holding portion connected to the second connecting portion and holding the frame member.

[0017] A seventh embodiment is a substrate heat treatment apparatus according to the fifth embodiment, wherein the substrate lifting mechanism further includes a plurality of linear guides that restrict the moving direction of the frame member to one direction.

[0018] [Effects of the Invention]

[0019] According to the substrate heat treatment apparatus of the first to seventh embodiments, since the motor is arranged outside the frame member, maintenance work of the substrate lifting mechanism can be easily performed. In addition, the substrate lifting mechanism can be more easily maintained by being pulled out to the maintenance position.

[0020] According to the substrate heat treatment apparatus of the second embodiment, maintenance work of the substrate lifting mechanism can be performed more easily.

[0021] According to the substrate heat treatment apparatus of the third embodiment, the portion of the substrate lifting mechanism that contacts the frame member is disposed outside the frame member, so that maintenance work on the contact portion can be easily performed.

[0022] According to the substrate heat treatment apparatus of the fourth embodiment, since the power transmission mechanism is disposed outside the frame member, maintenance work of the power transmission mechanism can be performed more easily.

[0023] According to the substrate heat treatment apparatus of the fifth embodiment, even if the frame member is deformed due to thermal expansion or the like, the elastic connection member absorbs the deformation, thereby reducing the load applied to the power transmission mechanism. Therefore, the plurality of lift pins can be smoothly raised and lowered.

[0024] According to the substrate heat treatment apparatus of the sixth embodiment, the elastic connecting member can absorb the horizontal deformation of the frame member.

[0025] According to the substrate heat treatment device of the seventh embodiment, even if the frame member is deformed due to thermal expansion, the elastic member absorbs the deformation, thereby reducing the load applied to the plurality of linear guides. Therefore, the parallelism of the plurality of linear guides can be ensured, so that the plurality of lift pins can be smoothly lifted and lowered. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a perspective view of the substrate heat treatment apparatus according to the embodiment.

[0027] Figure 2 Yes means Figure 1 1 is a perspective view of a heat treatment unit 13 of a substrate heat treatment apparatus shown.

[0028] Figure 3 Observed from below Figure 2 A perspective view of the heat treatment unit shown.

[0029] Figure 4 Yes means Figure 2 A schematic cross-sectional view of the structure of the heat treatment unit shown.

[0030] Figure 5 Yes means Figure 4 A three-dimensional view of a substrate lifting mechanism of a heat treatment unit is shown.

[0031] Figure 6 Yes means Figure 5 A three-dimensional diagram of the structure of the linkage part shown.

[0032] Figure 7 Yes means Figure 5 A front view of the power conversion unit shown.

[0033] Figure 8 is a bottom view of the heat treatment unit showing the processing positions.

[0034] [Explanation of Symbols]

[0035] 1: Substrate heat treatment device

[0036] 8: Control Department

[0037] 9: Substrate

[0038] 11: Main frame

[0039] 13: Heat treatment unit

[0040] 15: Sliding member (extraction mechanism)

[0041] 17: Processing chamber

[0042] 18: Support frame

[0043] 20: Hot plate (heat treatment plate)

[0044] 20a: Upper surface

[0045] 30: Substrate lifting mechanism

[0046] 31: Lifting pin

[0047] 33: Lifting pin lifting part

[0048] 35: Frame component

[0049] 37: Motor

[0050] 38: Power transmission mechanism

[0051] 39: Elastic connecting member

[0052] 40: Frame

[0053] 41: Opening

[0054] 43: Sealing part

[0055] 50: cover

[0056] 61: Axis

[0057] 63: Linkage Department

[0058] 65: Power conversion department

[0059] 131: Electrical Equipment Department

[0060] 151: Guide plate

[0061] 153: First board

[0062] 155: Second board

[0063] 391: First connection

[0064] 392: Second connection

[0065] 393: Frame holding part

[0066] 631: Linkage fixture

[0067] 651: Small gear

[0068] 653: Rack

[0069] 655: Shaft support member

[0070] 657: Linear guides

[0071] 657a: Rails

[0072] 657b: Boot block

[0073] 659: Base plate

[0074] P1: Processing position

[0075] P2: Maintenance position

[0076] X, Y, Z: direction DETAILED DESCRIPTION

[0077] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the constituent elements described in the embodiments are merely examples and do not mean that the scope of the present invention is limited to these. In the drawings, for ease of understanding, the size or number of each part is sometimes exaggerated or simplified as required.

[0078] In addition, in the drawings, in order to make the positional relationship of each element easy to understand, arrows representing XYZ orthogonal coordinate axes are sometimes marked. In the XYZ coordinate system, the Z axis corresponds to the vertical axis, and the XY plane intersecting the Z axis at right angles corresponds to the horizontal plane. In addition, the (-Z) direction corresponds to the vertical downward direction. In the following description, the vertical upward direction is sometimes referred to as "upward" or "above", and the vertical downward direction is sometimes referred to as "downward" or "below".

[0079] <1. Implementation Method>

[0080] Figure 11 is a perspective view of a substrate heat treatment apparatus 1 according to an embodiment. The substrate heat treatment apparatus 1 is a process chamber 17 (see Figure 2 ) contains a substrate 9 coated with a coating liquid such as a photoresist on its surface, and heats the substrate 9, thereby volatilizing the solvent component in the coating liquid. The substrate heat treatment device 1 can be used, for example, for the purpose of forming a photoresist film on the surface of the substrate 9. The substrate 9 is, for example, various processed substrates for electronic devices, specifically, semiconductor chips, glass substrates for liquid crystal displays or plasma displays, glass or ceramic substrates for magnetic disks or optical disks, glass substrates for organic electroluminescence (EL), glass or silicon substrates for solar cells, flexible substrates, printed substrates, etc.

[0081] The substrate heat treatment apparatus 1 includes a main frame 11, a plurality of (five in this embodiment) heat treatment units 13, and a control unit 8. Figure 1 As shown, a plurality of heat treatment units 13 are stacked in multiple stages along the Z direction. The main frame 11 supports the heat treatment units 13. The heat treatment units 13 are devices for performing heat treatment on the substrate 9.

[0082] The control unit 8 is, for example, a computer, and has a processor such as a central processing unit (CPU), and a memory electrically connected to the processor and storing a program. The processor executes the program stored in the memory, thereby controlling the operation of each unit in the substrate heat treatment device 1. Thus, various processes such as heat treatment are performed in the substrate heat treatment device 1.

[0083] Figure 2 Yes means Figure 1 1 is a perspective view of the heat treatment unit 13 of the substrate heat treatment apparatus 1 shown. Figure 3 Observed from below Figure 2 A perspective view of the heat treatment unit 13 is shown. Figure 4 Yes means Figure 2 A schematic cross-sectional view of the structure of the heat treatment unit 13 is shown.

[0084] like Figure 2 and Figure 3As shown, the substrate heat treatment device 1 includes a pair of sliding members 15 for each heat treatment unit 13. The heat treatment unit 13 is arranged between the pair of sliding members 15 in the Y direction. The pair of sliding members 15 is a mechanism for moving the heat treatment unit 13 along the X direction. More specifically, the pair of sliding members 15 is moved between a processing position P1 where the heat treatment unit 13 performs a heat treatment and a maintenance position P2 when the heat treatment unit 13 is maintained. The processing position P1 is the inner side of the main frame 11 when viewed from above, and the maintenance position P2 is the outer side (+X side) of the main frame 11 when viewed from above.

[0085] <Sliding member 15>

[0086] Next, the structure of the sliding member 15 is described. In addition, in the following description, the sliding member 15 located on the +Y side of the pair of sliding members 15 is described, and the sliding member 15 on the -Y side also has the same structure. Among them, the pair of sliding members 15 are symmetrically arranged about the symmetry axis parallel to the Z axis passing therebetween.

[0087] The slide member 15 has a guide plate 151, a first plate 153, and a second plate 155. The first plate 153 is located between the guide plate 151 and the second plate 155 in the Y direction.

[0088] <Guide plate 151>

[0089] The guide plate 151 is fixed to the main frame 11. The guide plate 151 is a plate-shaped member extending in the X direction. The guide plate 151 has substantially the same size as the processing chamber 17 in the X direction. A guide rail extending in the X direction is provided on the surface of the guide plate 151 facing the first plate 153 (the side surface on the -Y side).

[0090] <First Plate 153>

[0091] The first plate 153 is a plate-shaped member extending in the X direction. In the X direction, the size of the first plate 153 is substantially the same as that of the second plate 155. The first plate 153 is provided so as to be able to slide and move relative to the guide plate 151 in the X direction. In detail, a guide block is provided on the surface of the first plate 153 facing the guide plate 151 (the surface on the +Y side). The guide block can move along a guide rail provided on the guide plate 151. In addition, a guide rail extending in the X direction is provided on the surface of the first plate 153 facing the second plate 155 (the surface on the -Y side).

[0092] The second plate 155 is a plate-shaped member extending in the X direction. In the X direction, the size of the second plate 155 is substantially the same as that of the guide plate 151 and the first plate 153. The second plate 155 is provided to be able to slide relative to the first plate 153 in the X direction. In detail, a guide block is provided on the surface of the second plate 155 facing the first plate 153 (the surface on the +Y side). The guide block can move along the guide rail provided on the first plate 153.

[0093] The guide plate 151 is provided with a first stopper (not shown) for limiting the movement of the first plate 153 in the X direction. The first stopper is a protrusion provided on the guide plate 151. When the first plate 153 reaches a predetermined position by moving toward the +X side relative to the guide plate 151, the protrusion collides with a part of the first plate 153. Thus, the movement of the first plate 153 toward the +X side is limited.

[0094] The first plate 153 is provided with a second stopper (not shown) for limiting the movement of the second plate 155 in the X direction. The second stopper is, for example, a protrusion that protrudes toward the second plate 155. When the second plate 155 reaches a predetermined position by moving toward the +X side relative to the first plate 153, the protrusion contacts the second plate 155. Thus, the movement of the second plate 155 toward the +X side is limited.

[0095] like Figure 4 As shown, the thermal processing unit 13 includes a processing chamber 17 , a thermal plate 20 and a substrate lifting mechanism 30 .

[0096] The processing chamber 17 has a substantially rectangular parallelepiped shape. The processing chamber 17 has a frame 40 and a cover 50. The frame 40 has an opening 41 at the top. The frame 40 accommodates the hot plate 20 inside.

[0097] The cover 50 is a generally plate-shaped member that can close the opening 41 at the upper portion of the frame 40. The cover 50 is detachable from the upper portion of the frame 40. The cover 50 is mounted on the upper portion of the frame 40 via the sealing portion 43. The sealing portion 43 is a member that seals the gap between the frame 40 and the cover 50.

[0098] When the cover 50 is removed from the frame 40, the inner surface of the frame 40 is exposed to the outside through the opening 41 of the frame 40. In this state, maintenance work such as replacement of parts or cleaning inside the frame 40 is performed through the opening 41 of the frame 40.

[0099] The hot plate 20 is accommodated inside the processing chamber 17. The hot plate 20 has a flat upper surface 20a. A heater such as a heating wire is built into the hot plate 20. By driving the heater, the upper surface 20a of the hot plate 20 is heated to a predetermined temperature. As a result, the substrate 9 disposed above and near the upper surface 20a is heated. The heater is controlled by the control unit 8.

[0100] The substrate lifting mechanism 30 lifts the substrate 9 up and down above the hot plate 20. The substrate lifting mechanism 30 includes a plurality of lifting pins 31 and a lifting pin lifting unit 33. The substrate lifting mechanism 30 is supported by the support frame 18 (see Figure 3 ). The support frame 18 is a member connected to the processing chamber 17. That is, the substrate lifting mechanism 30 is connected to the processing chamber 17 via the support frame 18. In addition, the so-called "connection" includes not only a case where the members are directly connected by contact with each other, but also a case where the members are indirectly connected via other members.

[0101] The plurality of lift pins 31 extend in the Z direction and are dispersedly arranged in the horizontal direction. The plurality of lift pins 31 are inserted into the bottom wall of the frame 40 in the processing chamber 17 and a plurality of through holes provided on the heat plate 20, and penetrate the bottom wall of the frame 40 and the heat plate 20. The plurality of lift pins 31 are held by the lift pin lifter 33 in a state of protruding upward from the upper surface 20a of the heat plate 20.

[0102] The lift pin lifting unit 33 lifts the plurality of lift pins 31 up and down in unison. The lift pin lifting unit 33 is disposed outside and below the processing chamber 17. The lift pin lifting unit 33 includes, for example, a rack and pinion mechanism including a motor 37 described later.

[0103] The substrate 9 is supported by the upper ends of the plurality of lift pins 31. The lift pin lifter 33 moves the plurality of lift pins 31 between a proximity position where the substrate 9 is close to the upper surface 20a of the hot plate 20 and an upper position above the proximity position. The operation of the lift pin lifter 33 is controlled by the control unit 8.

[0104] Figure 5 Yes means Figure 4 3D diagram of the substrate lifting mechanism 30 of the heat treatment unit 13 shown in FIG. Figure 4 As shown, the substrate lifting mechanism 30 further includes a frame member 35 , a motor 37 , and a power transmission mechanism 38 .

[0105] The frame member 35 is a member that supports the plurality of lift pins 31. The frame member 35 has a substantially rectangular shape when viewed from above. The frame member 35 is formed, for example, by connecting a plurality of pipes. The frame member 35 overlaps the heat plate 20 when viewed from above. However, a portion of the frame member 35 may extend from the heat plate 20 when viewed from above.

[0106] The frame member 35 is connected to the power transmission mechanism 38. In this example, the outer side surface of the frame member 35 is connected to the power conversion unit 65 of the power transmission mechanism 38.

[0107] The motor 37 converts electrical energy into rotational force to supply power for raising and lowering the frame member 35. The motor 37 is located outside the frame member 35 in a plan view. In this example, the motor 37 is located near the corner on the +Y side and the -X side of the frame member 35. The motor 37 is connected to a power transmission mechanism 38.

[0108] The power transmission mechanism 38 is a mechanism for transmitting the rotational driving force of the motor 37 to raise and lower the frame member 35. The power transmission mechanism 38 has a plurality of (three in this example) shafts 61, a plurality of (two in this example) linkage parts 63, and a plurality of (four in this example) power conversion parts 65.

[0109] The plurality of shafts 61 are connected to the motor 37 via the linkage portion 63, and rotate in conjunction with the drive of the motor 37. The plurality of shafts 61 are arranged outside the frame member 35 in a plan view. In this example, the plurality of shafts 61 are arranged to be parallel to three sides, namely, one side extending in the X direction and two sides extending in the Y direction, of the four sides of the frame member 35.

[0110] Figure 6 Yes means Figure 5 The three-dimensional diagram of the structure of the linkage part 63 shown in the figure. The linkage part 63 is arranged between the two shafts 61. The linkage part 63 is a mechanism that transmits the rotation of one shaft 61 to the other shaft 61. The linkage part 63, for example, has two linkage clamps 631 installed on each end of the two shafts 61. The linkage clamps 631 rotate together with the shaft 61. Each linkage clamp 631 has a conical surface at the front end. The conical surfaces of the two linkage clamps 631 are in contact with each other. Therefore, when one of the linkage clamps 631 rotates, the other linkage clamp 631 rotates due to friction. As a result, the two shafts 61 rotate in a linkage manner. In addition, the linkage clamp 631 can also be a gear (bevel gear, helical gear, etc.) with teeth formed on the conical surface. The linkage part 63 can be any structure as long as it can make the mutually intersecting shafts 61 rotate in a linkage manner.

[0111] Back to Figure 5 The power conversion unit 65 is a mechanism that converts the rotational motion of the shaft 61 into linear motion in the Z direction. Figure 5 In the example, two power conversion parts 65 are respectively connected to two shafts 61 facing each other in the X direction. In addition, two power conversion parts 65 are respectively connected to each of the two sides extending in the Y direction at the +X side end and the -X side end of the frame member 35.

[0112] Figure 7 Yes means Figure 5 The side view of the power conversion unit 65 shown in FIG. Figure 7 As shown, the power conversion unit 65 has a pinion 651 and a rack 653. The pinion 651 is fixed to the shaft 61 and rotates together with the shaft 61. The rack 653 is fixed to the frame member 35 via the elastic connecting member 39 described later. The rack 653 has a plurality of teeth arranged at equal intervals in the Z direction and meshing with the pinion 651. The rack 653 is raised and lowered by the rotation of the pinion 651, and the frame member 35 is raised and lowered accordingly.

[0113] The power conversion unit 65 has a shaft support member 655. The shaft support member 655 has, for example, a plate shape, and supports the shaft 61 via a bearing so that it can rotate. The shaft support member 655 is connected to the support frame 18. In addition, the power conversion unit 65 has a linear guide 657. The linear guide 657 is a mechanism that limits the moving direction of the rack 653 and the frame member 35 to one direction (here, the Z direction) so that the rack 653 moves linearly along the Z direction. The linear guide 657 includes a guide rail 657a and a guide block 657b. The guide rail 657a extends along the Z direction, and both ends are fixed to the shaft support member 655. The guide block 657b is a member that slides and moves along the guide rail 657a, and is fixed to the base plate 659 to which the rack 653 is fixed.

[0114] like Figure 7 As shown in FIG. 1 , the substrate lifting mechanism 30 has an elastic connection member 39. The elastic connection member 39 connects the power transmission mechanism 38 and the frame member 35. The elastic connection member 39 can be elastically deformed. The elastic connection member 39 is formed of a metal material, for example. Figure 7 As shown, the elastic connection member 39 has a substantially S-shape in a side view along the Y direction.

[0115] In more detail, the elastic connection member 39 has a first connection portion 391, a second connection portion 392 and a frame holding portion 393. The first connection portion 391 has a plate shape extending in the horizontal direction. The first connection portion 391 is connected to the base plate 659 to which the rack 653 is fixed. The first connection portion 391 can bend and deform in the Z direction. The second connection portion 392 has a plate shape extending in the Z direction. The second connection portion 392 can bend and deform in the X direction. The frame holding portion 393 is connected to the second connection portion 392 and holds the frame member 35. The shape of the frame holding portion 393 has, for example, a roughly U-shaped shape that opens in the X direction when observed in cross section. The frame member 35 is fixed to the inside of the frame holding portion 393, for example, via bolts or the like.

[0116] Even if the frame member 35 is deformed due to thermal expansion or the like, the deformation can be absorbed by the elastic connecting member 39, so that the excessive load on the power transmission mechanism 38 can be reduced. In particular, the substrate lifting mechanism 30 uses a plurality of (four in this example) linear guides 657 to ensure the accuracy of the linear movement of the frame member 35 in the Z direction. Therefore, if an excessive load is applied to the plurality of linear guides 657 due to the deformation of the frame member 35, the parallelism of the plurality of guide rails 657a cannot be maintained, and the movement accuracy of the frame member 35 may be reduced. Therefore, in the case where the elastic connecting member 39 is provided, even if the frame member 35 is deformed due to thermal expansion or the like, the movement accuracy of the frame member 35 can be ensured by reducing the load applied to the linear guides 657. Therefore, the plurality of lifting pins 31 can be smoothly raised and lowered.

[0117] Furthermore, even when vibration occurs in the power transmission mechanism 38, the vibration is absorbed by the elastic connection member 39, thereby reducing the vibration from being transmitted to the frame member 35. Thus, the frame member 35 can be smoothly raised and lowered.

[0118] Figure 8 FIG. 1 is a bottom view showing the heat treatment unit 13 at the treatment position P1. Figure 8 As shown, the motor 37 is located closer to the -X side than the frame member 35. In this example, when the heat treatment unit 13 is located at the processing position P1, the motor 37 is arranged near the -X side end of the main frame 11. Therefore, even when the processing chamber 17 is located at the processing position P1 (that is, the state that it is not pulled out from the main frame 11), it can be easily accessed from the outside of the -X side of the main frame 11. In addition, when a cover is installed at the -X side end of the main frame 11, the operator can access the motor 37 by being able to remove the cover.

[0119] In addition, if Figure 8 As shown, the heat treatment unit 13 has an electrical device 131. The electrical device 131 has electronic equipment or a power supply device, electronic equipment and wiring such as a power line or a signal line. The electrical device 131 is located closer to the -X side than the processing chamber 17. The motor 37 and the electrical device 131 are arranged adjacent to each other on the +Y side. According to this arrangement, the electrical device 131 and the motor 37 can be accessed from the outside of the -X side of the main frame 11, so maintenance can be easily performed.

[0120] As described above, the substrate heat treatment device 1 includes a hot plate 20 as a heat treatment plate, a substrate lifting mechanism 30, a main frame 11, and a pair of sliding members 15 as a pulling mechanism. The hot plate 20 performs heat treatment on the substrate 9. The substrate lifting mechanism 30 lifts the substrate 9 above the hot plate 20. The main frame 11 supports the hot plate 20 and the substrate lifting mechanism 30. The pair of sliding members 15 can integrally pull out the hot plate 20 and the substrate lifting mechanism 30 from the processing position P1 inside the main frame 11 to the maintenance position P2. The substrate lifting mechanism 30 has a plurality of lifting pins 31, a frame member 35, a motor 37, and a power transmission mechanism 38. The plurality of lifting pins 31 are inserted into the through holes of the hot plate 20. The frame member 35 is arranged at a lower side than the hot plate 20 and supports the plurality of lifting pins 31. The motor 37 is located outside the frame member 35 when viewed from above. The power transmission mechanism 38 transmits the power of the motor 37 to lift the frame member 35. According to this structure, the motor 37 of the substrate lifting mechanism 30 is arranged outside the frame member 35, so that the maintenance work of the substrate lifting mechanism 30 can be easily performed. In addition, by pulling the substrate lifting mechanism 30 from the processing position P1 inside the main frame 11 to the maintenance position P2, the maintenance of the substrate lifting mechanism 30 can be more easily performed.

[0121] In addition, at least a part of the power transmission mechanism 38 is located outside the frame member 35 in a plan view. According to such a structure, the maintenance work of the substrate lifting mechanism 30 can be performed more easily.

[0122] The power transmission mechanism 38 raises and lowers the frame member 35 while contacting the side surface of the frame member 35. According to this structure, the portion of the substrate raising and lowering mechanism 30 contacting the frame member 35 is arranged outside the frame member 35, so that maintenance work on the contact portion can be easily performed.

[0123] In addition, the power transmission mechanism 38 also includes a shaft 61, a pinion 651, and a rack 653. The shaft 61 is located outside the frame member 35 in a plan view, and transmits the rotational motion of the motor 37. The pinion 651 is connected to the shaft 61. The rack 653 is located outside the frame member 35, connected to the frame member, and meshes with the pinion 651. According to this structure, since the power transmission mechanism 38 is arranged outside the frame member 35, maintenance work of the power transmission mechanism 38 can be performed more easily.

[0124] In addition, the substrate lifting mechanism 30 has an elastic connecting member 39 that connects the power transmission mechanism 38 and the frame member 35 and is elastically deformable. According to this structure, even if the frame member 35 is deformed due to thermal expansion or the like, the deformation can be absorbed by the elastic connecting member 39, so that the excessive load applied to the power transmission mechanism 38 can be reduced. In addition, even if the power transmission mechanism 38 vibrates, the vibration is absorbed by the elastic connecting member 39, so that the vibration is reduced. The frame member 35 can be smoothly raised and lowered.

[0125] In addition, the elastic connection member 39 includes a first connection portion 391, a second connection portion 392, and a frame holding portion 393. The first connection portion 391 extends in the horizontal direction. The second connection portion 392 is connected to the first connection portion 391 and extends in the Z direction. The frame holding portion 393 is connected to the second connection portion 392 and holds the frame member 35. According to this structure, the elastic connection member 39 can absorb the deformation of the frame member 35 in the horizontal direction. As a result, the situation where an excessive load in the horizontal direction is applied to the power transmission mechanism 38 can be reduced.

[0126] In addition, the substrate lifting mechanism 30 further includes a plurality of linear guides 657 that restrict the moving direction of the frame member 35 to the Z direction. According to this structure, even if the frame member 35 is deformed due to thermal expansion or the like, the elastic connection member 39 absorbs the deformation, and the load applied to the plurality of linear guides 657 can be reduced. Therefore, the parallelism of the plurality of linear guides 657 can be ensured, and the plurality of lift pins 31 can be smoothly lifted and lowered.

[0127] <2. Modifications>

[0128] As mentioned above, although embodiment was described, this invention is not limited to the said embodiment, Various deformation|transformation is possible.

[0129] For example, the substrate heat treatment apparatus 1 is configured to perform a heating process on the substrate 9 by the hot plate 20. However, the substrate heat treatment apparatus 1 may also be configured to perform a cooling process on the substrate 9. In this case, the substrate heat treatment apparatus 1 may also include a heat treatment plate (cooling plate) without a heater, or a heat treatment plate (cooling plate) having a cooling water flow path or a cooling mechanism such as a Peltier element instead of the hot plate 20. In addition, the processing chamber 17 may not exist.

[0130] The elastic connection member 39 is formed in a leaf spring shape, but the shape of the elastic connection member 39 is not limited to this shape. For example, the elastic connection member 39 may also include a coil-shaped spring.

[0131] The present invention has been described in detail, but the description is illustrative in all aspects and the present invention is not limited thereto. It can be interpreted that numerous modifications not illustrated can be envisioned without departing from the scope of the present invention. The structures described in the embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

Claims

1. A substrate heat treatment device, comprising: Heat treatment plate, heat treatment of the substrate; A substrate lifting mechanism is used to lift the substrate above the heat treatment plate; A main frame, supporting the heat treatment plate and the substrate lifting mechanism; as well as The extraction mechanism can integrally extract the heat treatment plate and the substrate lifting mechanism from the processing position inside the main frame to the maintenance position. The substrate lifting mechanism comprises: a plurality of lifting pins inserted into the through holes of the heat treatment plate; a frame member disposed below the heat treatment plate and supporting the plurality of lift pins; a motor, located outside the frame member when viewed from above; as well as The power transmission mechanism transmits the power of the motor to raise and lower the frame member.

2. The substrate heat treatment device according to claim 1, wherein: At least a portion of the power transmission mechanism is located outside the frame member in a plan view.

3. The substrate heat treatment device according to claim 2, wherein: The power transmission mechanism moves the frame member up and down while being in contact with a side surface of the frame member.

4. The substrate heat treatment device according to claim 3, wherein: The power transmission mechanism also has: a shaft, located outside the frame member in a plan view and transmitting the rotational motion of the motor; A pinion gear connected to the shaft; and The rack is located outside the frame member in a plan view, is connected to the frame member, and meshes with the pinion gear.

5. The substrate heat treatment device according to claim 4, wherein: The substrate lifting mechanism further includes an elastic connection member that connects the power transmission mechanism and the frame member and is elastically deformable.

6. The substrate heat treatment apparatus according to claim 5, wherein: The elastic connecting member comprises: A first connecting portion extending in a horizontal direction; a second connecting portion connected to the first connecting portion and extending in a vertical direction; as well as The frame holding portion is connected to the second connecting portion and holds the frame member.

7. The substrate heat treatment apparatus according to claim 5, wherein: The substrate lifting mechanism further includes a plurality of linear guides that restrict the moving direction of the frame member to one direction.

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