Photovoltaic module and preparation method thereof

Abstract

The invention relates to a photovoltaic module and a preparation method thereof. The photovoltaic module comprises a frame, a liquid resin pouring layer, a battery piece layer, a liquid resin brushing layer and a PCB backboard layer from outside to inside. According to the invention, the liquid resin has fluidity and can be cured at normal temperature, so that the assembly structure and the manufacturing process are simplified, and the cost is reduced; by simplifying the structure, the material and the manufacturing process of the photovoltaic module, compared with the traditional photovoltaic module manufacturing, the complex process is greatly reduced in the aspects of material, equipment and manufacturing process, the costs of water, electricity, labor and the like can be reduced, and the photovoltaic module has a good application prospect.

Description

Technical Field

[0001] The present invention belongs to the technical field of solar energy components, and in particular relates to a photovoltaic component and a preparation method thereof. Background Art

[0002] like Figure 1 and Figure 2 As shown, there are two types of conventional photovoltaic modules, double-glass modules and single-glass modules. The double-glass module structure consists of a frame, front glass, EVA / POE, battery cells, EVA / POE, and back glass. The single-glass module structure consists of a frame, front glass, EVA / POE, battery cells, and EVA / POE back panel. According to the investigation, the glass density is 2500kg / m 3 , the current conventional 72-panel modules use 2.0mm thick glass or thicker glass, and the glass size is 2278*1128mm. According to the formula m=ρV and V=abc, it can be calculated that the weight of a single piece of glass is 12.8kg. The remaining materials are about 11kg, so the weight of a double-glass module is about 36.6kg, and the weight of a single-glass module is about 25.8kg. The modules are heavy, and the weight of the glass accounts for the main weight. There are great difficulties in construction and transportation, and it is easy to cause secondary module damage. And at present, the EVA / POE film of the modules is mainly imported, and the domestic EVA technology is not mature enough and needs to be improved. There are many problems, which make it expensive and difficult to reduce the cost.

[0003] like Figure 4 As shown, the conventional preparation process of single-glass and double-glass photovoltaic modules is relatively complicated, with 32 steps, each of which requires equipment and personnel. Therefore, the equipment procurement cost, equipment maintenance cost, water and electricity cost, and labor cost are relatively high. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a photovoltaic module and a preparation method thereof, which simplifies the module structure and manufacturing process by utilizing the fluidity of liquid resin and the ability to solidify at room temperature, thereby reducing costs.

[0005] The invention provides a photovoltaic component, which comprises, from outside to inside, a frame, a liquid resin infusion layer, a battery sheet layer, a liquid resin coating layer and a PCB backboard layer.

[0006] Preferably, the liquid resin used in the present invention includes liquid resins such as acrylic, epoxy, ABS / PC, and acrylic acid.

[0007] The present invention also provides a method for preparing a photovoltaic module, comprising the following steps:

[0008] (1) providing a PCB backplane and applying liquid resin onto the PCB backplane;

[0009] (2) connecting the battery cells in series and parallel according to the requirements of the assembly. After the connection is completed, the battery cells are arranged on the PCB backplane obtained in step (1), and the leads are passed through the reserved holes of the PCB backplane or welded;

[0010] (3) Using a frame to seal the PCB backplane obtained in step (2) on all sides, evenly injecting liquid resin, and finally curing to obtain a photovoltaic module.

[0011] Preferably, the speed of applying the liquid resin in step (1) is 0.01-0.1 m / s.

[0012] Preferably, after the lead wire is passed through in step (2), the lead wire is bent, the hole is sealed with high-temperature tape, and then liquid resin is applied.

[0013] Preferably, after welding is completed in step (2), liquid resin is brushed on the welding points.

[0014] Preferably, the speed of injecting the liquid resin in step (3) is 10-20 ml / s.

[0015] Preferably, the specific process parameters for curing in step (3) are: humidity ≤ 75%, temperature 23-28° C., environment reaching 6S level, and keeping the curing zone still.

[0016] Preferably, the photovoltaic module obtained in step (3) is finally polished.

[0017] Beneficial Effects

[0018] The present invention utilizes the fluidity of liquid resin and the ability to solidify at room temperature to simplify the component structure and manufacturing process, thereby helping to reduce costs; by simplifying the photovoltaic component structure, simplifying the materials and simplifying the manufacturing process, the cumbersome processes in materials, equipment and manufacturing process are greatly reduced compared with traditional photovoltaic component manufacturing, and the costs of water, electricity, labor, etc. can also be reduced, and it has good application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is the structural diagram of a traditional double-glass photovoltaic module;

[0020] Figure 2 This is the structure diagram of a traditional single-glass photovoltaic module;

[0021] Figure 3 It is a structural diagram of a photovoltaic module of the present invention;

[0022] Figure 4 Create process flow diagrams for traditional components;

[0023] Figure 5A process flow chart for making a photovoltaic module of the present invention;

[0024] Figure 6 This is a frame diagram of the photovoltaic module of the present invention. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the appended claims of the application equally.

[0026] Example 1

[0027] like Figure 3 As shown, this embodiment provides a photovoltaic module, which includes a frame, a liquid resin injection layer, a battery layer, a liquid resin coating layer and a PCB backplane layer from the outside to the inside. Preferably, the liquid resin used includes acrylic, epoxy, ABS / PC, acrylic acid and other liquid resins.

[0028] like Figure 5 As shown, this embodiment also provides a method for preparing a photovoltaic module, comprising the following steps:

[0029] (1) First, prepare a PCB backplane according to the design size and place it flat on a horizontal device, making sure the inside of the component faces upward to ensure the accuracy of subsequent operations.

[0030] (2) Mix the liquid resin according to the required proportion of the materials used (for example; epoxy resin: curing agent is mixed in a ratio of 2:1), put it into the mixer, and stir at a speed of 100-300 revolutions per minute for 20-25 minutes. Ensure that the materials are fully mixed to achieve the best bonding effect. After mixing, start brushing at a speed of 0.4m / s. Apply the mixed resin evenly on the PCB backplane. Repeat this process 1-3 times to ensure that every inch of the backplane is fully coated.

[0031] (3) The battery cells are connected in series and parallel according to the requirements of the components, and arranged according to the requirements of the drawings. The battery strings are ensured to be flat without obvious protrusions, and the leads are passed through the reserved holes of the PCB or welded at the welding positions. After welding, the holes or welding points are sealed.

[0032] (A) Punching: After the lead wire is inserted, bend the lead wire, seal the hole with high temperature masking tape, and then apply liquid resin. (B) Welding: After the welding point is completed, apply liquid resin on the welding point.

[0033] (4) Use an aluminum frame to seal the PCB backplane, and then inject liquid resin evenly at a rate of 10ml / s. Stop injecting when the resin drops 1mm to 2mm from the frame, and let it stand for 30 seconds to observe. After it is confirmed to be correct, transfer it to the curing area and cure it for 24 hours before proceeding with subsequent operations (curing agent can be added to speed up the curing time). The curing environment is humidity ≤ 75%; temperature 23 to 28°C; the environment is required to reach the 6S level, and there should be no vibrating equipment nearby, and the curing area must be kept still.

[0034] (5) After the component is completely cured, use high-density sandpaper to sand the front of the component, and stop sanding after sanding 1mm-2mm to remove the sanding residue.

[0035] (6) Install the junction box and transfer to the curing area for curing for 4-6 hours. After complete curing, test the electrical performance parameters and conduct a full inspection.

[0036] Different from the prior art, the present invention does not require adhesive films such as EVA / POE for bonding, and also does not require lamination, thereby reducing both the adhesive film laying process and the lamination process.

[0037] On the other hand, according to the investigation, a laminating machine in a workshop of a listed company can consume 1680KW / H of electricity every day if it is fully operational 24 hours a day. Based on the industrial electricity consumption of 1 yuan, a laminating machine will cost 1680 yuan a day. Based on a 30-day month, it will cost 50,400 yuan a month, and 613,200 yuan for 365 days a year. Two film laying machines will cost about 200,000 yuan a year, and a front plate laying machine will cost about 96,360 yuan a year. One production line can save 909,560 yuan a year. At the same time, the equipment expenses for purchasing laminating machines, film laying machines and front plate laying machines are omitted, saving about 2.2 million yuan in equipment costs.

[0038] On the other hand, the present invention can improve the power of the components by 0.5% after grinding and polishing. Specifically, the production environment of this embodiment is made in the laboratory under the conditions of temperature 26.3°C, humidity 58% and light intensity >1000Lux, and transferred to: humidity ≤70%; temperature 25°C; clean light intensity dark environment for curing for 18 hours, and two batches of components are tested, and the following results are obtained:

[0039]

[0040] After analyzing the above data, there are two possible reasons why grinding increases power: 1. Grinding reduces the thickness of the resin to the cell, thereby reducing light loss; 2. Grinding increases the contact area of ​​light.

[0041] On the other hand, the frame of the present invention should also be synchronized with the process. The frame of the present invention is characterized by having no A side, with A side 0mm, B side 6mm, and C side 8mm. Figure 6 shown.

[0042] On the other hand, the installation method of the components and the frame of the present invention is also different from the prior art. The traditional components need the help of silicone to adhere to the frame. The frame of the present invention is directly glued with liquid resin to form an integral part with the components. Figure 3 shown.

Claims

1. A photovoltaic module, characterized in that: The photovoltaic component comprises a frame, a liquid resin infusion layer, a battery layer, a liquid resin coating layer and a PCB backboard layer from the outside to the inside.

2. A method for preparing a photovoltaic module, comprising the following steps: (1) providing a PCB backplane and applying liquid resin onto the PCB backplane; (2) connecting the battery cells in series and parallel according to the requirements of the assembly. After the connection is completed, the battery cells are arranged on the PCB backplane obtained in step (1), and the leads are passed through the reserved holes of the PCB backplane or welded; (3) Using a frame to seal the PCB backplane obtained in step (2) on all sides, evenly injecting liquid resin, and finally curing to obtain a photovoltaic module.

3. The preparation method according to claim 2, characterized in that: The speed of applying the liquid resin in step (1) is 0.01-0.1 m / s.

4. The preparation method according to claim 2, characterized in that: After the lead wire is passed through in step (2), the lead wire is bent, the hole is sealed with high temperature tape, and then liquid resin is applied.

5. The preparation method according to claim 2, characterized in that: After the welding in step (2) is completed, liquid resin is brushed on the welding points.

6. The preparation method according to claim 2, characterized in that: The speed of injecting the liquid resin in step (3) is 10-20 ml / s.

7. The preparation method according to claim 2, characterized in that: The specific process parameters for curing in step (3) are: humidity ≤ 75%, temperature 23-28° C., environment reaching 6S level, and keeping the curing zone still.

8. The preparation method according to claim 2, characterized in that: The photovoltaic module obtained in step (3) is finally polished.

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