Diamond trephine welded by laser and preparation method of diamond trephine
By adding specific powder to the ring saw blade head, setting up U-shaped grooves and V-shaped grooves, and using laser welding technology, the problem of insufficient sharpness and attenuation of cutting speed is solved, and more efficient cutting performance is achieved.
Patent Information
- Application Number
- CN202411611725.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-02-25
AI Technical Summary
The existing ring saw is not sharp enough, the substrate is prone to breaking, and the speed gradually slows down during the cutting process, affecting the cutting efficiency.
Diamond ring saws are prepared by laser welding technology. By adding ultrafine iron-nickel prealloy powder, ultrafine copper powder, tin powder, ultrafine tungsten carbide powder and yttrium oxide powder to the cutting head, and U-shaped grooves and V-shaped grooves are provided on the surface of the cutting head.
It improves the sharpness and cutting speed of the cutter head, extends the cutting life, prevents the cutting speed from decaying, and significantly improves the chip removal ability and sharpness of the ring saw.
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Figure CN119501061A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of powder metallurgy, and in particular to a diamond ring saw utilizing laser welding and a preparation method thereof. Background Art
[0002] With the development of science and technology, people have higher and higher requirements on the performance of tools. In the field of construction and cutting, traditional wall saw cutting can no longer fully meet the needs of cutting. Wall saws are troublesome to install and waste a lot of manpower and material resources. Ring saws are becoming more and more popular due to their lightness, deep cutting depth and easy operation. In the prior art, there are problems such as the poor sharpness of the ring saw and the easy breakage of the cutting base. Another problem is that the cutting speed of the saw blade gradually slows down during the cutting process until it is difficult to cut, which greatly affects the processing efficiency. Summary of the invention
[0003] The purpose of the present invention is to provide a diamond ring saw using laser welding and a preparation method thereof, so as to solve the problems existing in the prior art that the ring saw is not sharp enough, the base is easy to break, the speed gradually slows down during the cutting process, and the cutting efficiency is affected.
[0004] In order to solve the above technical problems, the present invention is implemented by the following technical solutions:
[0005] A method for preparing a diamond ring saw using laser welding, specifically comprising the following preparation steps:
[0006] (1) Ingredients: Weigh the following raw materials in weight proportion: 50-60 parts of ultrafine iron-nickel pre-alloy powder, 15-30 parts of ultrafine copper powder, 2-5 parts of tin powder, 15-30 parts of ultrafine tungsten carbide powder, and 3-6 parts of yttrium oxide powder, wherein the volume fraction of diamond accounts for 15%-50% (based on 400%), and the particle size is 400-700 μm, and mix the above raw materials to obtain alloy matrix powder;
[0007] (2) Mixing: Put the alloy matrix powder obtained in step (1) into a three-dimensional mixer, and then add glycerin to the mixer for mixing. The mixing time is 5-8 hours;
[0008] (3) Coating: Weigh diamond particles of a certain proportion, wet the surface of the diamond particles with methyl acetate, and then coat the surface of the diamond particles with a layer of cobalt powder. Specifically, 100 g of diamond is coated with 30 g of cobalt powder. After the cobalt coating, the diamond particles are put into the three-dimensional mixer of step (2) and mixed with the metal powder for 2 h.
[0009] (4) Cold pressing: cold pressing the powder mixed evenly in step (3) into a cold pressed blank according to the weight of the cutter head to obtain a cutter head blank, wherein the pressing pressure of the cold pressing is 150-300 MPa;
[0010] (5) Hot pressing sintering: the cutter head blank after cold pressing in (4) is placed into a graphite mold for hot pressing sintering, the sintering temperature is 820-950°C, the sintering pressure is 25-40MPa, and the holding time is 200-300 seconds;
[0011] (6) Laser welding: The cutter head blank sintered in step (5) is deburred, and the welding surface is polished with an abrasive belt to obtain the required curvature, and then the cutter head is welded to the steel substrate using a laser welding machine, wherein the laser welding power is 2500 W and the welding speed is 20 mm / s;
[0012] (7) After the welding is completed according to step (6), the tooth strength is tested, and finally the diamond ring saw is sharpened, polished, and engraved to obtain the finished product.
[0013] Preferably, the ultrafine iron-nickel pre-alloyed powder described in the above step (1) has a powder particle size of 3-6 μm, the ultrafine copper powder has a powder particle size of 8-10 μm, the tin powder has a powder particle size of 12-15 μm, the ultrafine tungsten carbide powder has a powder particle size of 5-7 μm, and the yttrium oxide powder has a powder particle size of 20-25 μm.
[0014] A diamond ring saw comprises a steel substrate and a cutter head, wherein the cutter head comprises ultrafine iron-nickel prealloy powder, ultrafine copper powder, tin powder, ultrafine tungsten carbide powder, yttrium oxide powder and diamond raw material, wherein the weight percentage of the raw materials is 50%-60% of ultrafine iron-nickel prealloy powder, 15%-30% of ultrafine copper powder, 2%-5% of tin powder, 15%-30% of ultrafine tungsten carbide powder, 3%-6% of yttrium oxide powder, the volume fraction of diamond accounts for 15%-50%, and the particle size is 400-700μm, one side of the cutter head is arranged on the steel substrate at intervals by laser welding, and the other side is provided with a U-shaped groove, and both side surfaces of the cutter head are also provided with a V-shaped groove.
[0015] Preferably, the Ni content in the ultrafine iron-nickel pre-alloyed powder is 35%, and the laser particle size D50 is 3-6 μm.
[0016] Preferably, the length of the blade head is 20mm≤L≤50mm, and the height is 8mm≤H≤25mm;
[0017] Preferably, the dimensions of the U-shaped groove are 1mm≤a≤10mm, 1mm≤h≤20mm.
[0018] Preferably, the dimensions of the V-shaped groove on the tool head are 0.5mm≤b≤6mm, 30≤c≤150, 0.2mm≤d≤1.5mm, and 30°≤e≤180°.
[0019] Preferably, 1 to 5 of the U-shaped grooves are provided, and 1 to 6 V-shaped grooves are symmetrically provided on both side surfaces of the cutter head.
[0020] Preferably, the outer diameter of the steel substrate is 200mm-800mm, and two grooves are provided on the side, and the dimensions of the grooves are 20mm≤L1≤50mm, 5mm≤m≤20mm, 2≤p≤20, 1.4mm≤k≤2.0mm, and 3mm≤T≤5mm.
[0021] The present invention has the following beneficial effects:
[0022] (1) The present invention improves the problems of the separation degree and cutting speed attenuation of the cutter head by designing the cutter head raw materials and the proportions. Specifically, ultrafine iron-cobalt-copper alloy powder and carbonyl iron powder are added to the cutter head formula. The addition of ultrafine iron-nickel alloy powder can improve the sharpness of the cutter head. The ultrafine powder can improve the sintering activity of the powder. At the same time, the addition of yttrium oxide powder can play a role in deoxidation and denitrification and purifying the matrix, which can effectively improve the cutting speed and life, prevent the cutting speed attenuation phenomenon, and can achieve stable and continuous cutting;
[0023] (2) The U-shaped groove and V-shaped groove are arranged on the cutter head, which reduces the contact area between the cutter head and the cutting material, reduces the friction cutting resistance, and can significantly improve the chip removal ability and sharpness of the ring saw. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a structural schematic diagram of the present invention;
[0025] Figure 2 It is a schematic diagram of the structure of the cutter head in the present invention;
[0026] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure of AA;
[0027] Figure 4 It is a structural schematic diagram of the steel substrate in the present invention;
[0028] Figure 5 for Figure 4 Schematic diagram of the cross-sectional structure of BB.
[0029] In the figure: 1- steel substrate; 2- cutter head; 101- groove; 201- U-shaped groove; 202- V-shaped groove. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0031] Example 1
[0032] like Figure 1-5 As shown, a diamond ring saw and a preparation method thereof, the ring saw comprises a steel substrate 1 and a cutter head 2, the cutter head 2 comprises ultrafine iron-nickel pre-alloyed powder, ultrafine copper powder, tin powder, ultrafine tungsten carbide powder, yttrium oxide powder and diamond raw material, wherein the weight percentage of the raw materials is 50%-60% of ultrafine iron-nickel pre-alloyed powder, 15%-30% of ultrafine copper powder, 2%-5% of tin powder, 15%-30% of ultrafine tungsten carbide powder, 3%-6% of yttrium oxide powder, the volume fraction of diamond is 15%-50%, and the particle size is 400-700μm, one side of the cutter head 2 is arranged on the steel substrate 1 at intervals by laser welding, and a U-shaped groove 201 is arranged on the other side, and V-shaped grooves 202 are also arranged on both sides of the cutter head 2, and specifically comprises the following steps:
[0033] (1) Ingredients: Weigh the following raw materials in weight proportion: 54 parts of ultrafine iron-nickel pre-alloy powder, 25 parts of ultrafine copper powder, 3 parts of tin powder, 15 parts of ultrafine tungsten carbide powder and 3 parts of yttrium oxide powder, with a volume fraction of diamond of 25% (based on 400%) and a particle size of 400 μm, and mix the above raw materials to obtain alloy matrix powder;
[0034] (2) Mixing: Put the alloy matrix powder obtained in step (1) into a three-dimensional mixer, and then add glycerin to the mixer for mixing. The mixing time is 5-8 hours;
[0035] (3) Coating: Weigh diamond particles of a certain proportion, wet the surface of the diamond particles with methyl acetate, and then coat the surface of the diamond particles with a layer of cobalt powder. Specifically, 100 g of diamond is coated with 30 g of cobalt powder. After the cobalt coating, the diamond particles are put into the three-dimensional mixer of step (2) and mixed with the metal powder for 2 h.
[0036] (4) Cold pressing: cold pressing the powder mixed evenly in step (3) into a cold pressed blank according to the weight of the cutter head to obtain a cutter head blank, wherein the pressing pressure of the cold pressing is 150-300 MPa;
[0037] (5) Hot pressing sintering: the cutter head blank after cold pressing in (4) is placed into a graphite mold for hot pressing sintering, the sintering temperature is 820-950°C, the sintering pressure is 25-40MPa, and the holding time is 200-300 seconds;
[0038] (6) Laser welding: The cutter head blank sintered in step (5) is deburred, and the welding surface is polished with an abrasive belt to obtain the required curvature, and then the cutter head is welded to the steel substrate using a laser welding machine, wherein the laser welding power is 2500 W and the welding speed is 20 mm / s;
[0039] (7) After the welding is completed according to step (6), the tooth strength is tested, and finally the diamond ring saw is sharpened, polished, and engraved to obtain the finished product.
[0040] Example 2
[0041] The diamond ring saw and preparation method thereof of this embodiment are the same as those of Example 1, except that 50 parts of ultrafine iron-nickel pre-alloyed powder, 20 parts of ultrafine copper powder, 5 parts of tin powder, 20 parts of ultrafine tungsten carbide powder and 5 parts of yttrium oxide powder are weighed, the volume fraction of diamond is 20% (based on 400%), the particle size is 700 μm, and the above raw materials are mixed to obtain alloy matrix powder.
[0042] Example 3
[0043] The diamond ring saw and preparation method thereof of this embodiment are the same as those of Example 1, except that 50 parts of ultrafine iron-nickel pre-alloy powder, 30 parts of ultrafine copper powder, 2 parts of tin powder, 15 parts of ultrafine tungsten carbide powder and 3 parts of yttrium oxide powder are weighed, the volume fraction of diamond is 15% (based on 400%), the particle size is 500 μm, and the above raw materials are mixed to obtain alloy matrix powder.
[0044] Example 4
[0045] The diamond ring saw and preparation method thereof of this embodiment are the same as those of Example 1, except that 60 parts of ultrafine iron-nickel pre-alloyed powder, 15 parts of ultrafine copper powder, 2 parts of tin powder, 17 parts of ultrafine tungsten carbide powder and 6 parts of yttrium oxide powder are weighed, the volume fraction of diamond is 50% (based on 400%), the particle size is 450μm, and the above raw materials are mixed to obtain alloy matrix powder.
[0046] Example 5
[0047] The diamond ring saw and preparation method thereof of this embodiment are the same as those of Example 1, except that 50 parts of ultrafine iron-nickel pre-alloyed powder, 15 parts of ultrafine copper powder, 2 parts of tin powder, 30 parts of ultrafine tungsten carbide powder and 3 parts of yttrium oxide powder are weighed, the volume fraction of diamond is 30% (based on 400%), the particle size is 600 μm, and the above raw materials are mixed to obtain alloy matrix powder.
[0048] The diamond ring saw prepared in the above-mentioned embodiments 1-5, wherein the powder particle size of the ultrafine iron-nickel pre-alloyed powder in step (1) is 3-6 μm, the powder particle size of the ultrafine copper powder is 8-10 μm, the powder particle size of the tin powder is 12-15 μm, the powder particle size of the ultrafine tungsten carbide powder is 5-7 μm, the powder particle size of the yttrium oxide powder is 20-25 μm, the Ni content in the ultrafine iron-nickel pre-alloyed powder is 35%, and the laser particle size D50 is 3-6 μm. Adding ultrafine iron-nickel alloy powder can improve the sharpness of the blade, and the ultrafine powder can improve the sintering activity of the powder. At the same time, adding yttrium oxide powder can play the role of deoxidation and denitrification, purifying the matrix, and can effectively improve the cutting speed and life, prevent the cutting speed from attenuating, and can stably and continuously cut.
[0049] Among them, the length of the cutter head 2 is 20mm≤L≤50mm, the height is 8mm≤H≤25mm, the notch length of the U-shaped groove 201 is 1mm≤a≤10mm, the depth of the U-shaped groove 201 is 1mm≤h≤20mm, the size of the V-shaped groove 202 on the cutter head 2 is 0.5mm≤b≤6mm, 30≤c≤150, 0.2mm≤d≤1.5mm, 30°≤e≤180°, 1-5 U-shaped grooves 201 are provided, and 1-6 V-shaped grooves 202 are symmetrically provided on both sides of the cutter head 2. The outer diameter of the steel substrate 1 is 200mm-800mm, and two grooves 101 are provided on the side. The size of the groove 101 is 20mm≤L1≤50mm, 5mm≤m≤20mm, 2≤p≤20, 1.4mm≤k≤2.0mm, and 3mm≤T≤5mm.
[0050] The size design of the above-mentioned cutter head 2, U-shaped groove 201, V-shaped groove 202 and steel base 1 can improve the overall use strength of the ring saw and improve the cutting efficiency. The design of the U-shaped groove 201 and the V-shaped groove 202 reduces the contact area between the cutter head 2 and the cutting material, reduces the frictional cutting resistance, and can significantly improve the chip removal ability and sharpness of the ring saw; the groove 101 designed on the side of the steel base 1 also has a chip removal function, while reducing the weight of the ring saw blade and improving its sharpness.
[0051] The saw blades prepared in Examples 1-5 have a specification of φ410 mm. The only difference in the weight percentage of the raw materials of the cutter head 2 is that the diamond ring saws formed therefrom are tested for various properties, and it is found that the differences in the properties are not large, as shown in Table 1 below:
[0052] Table 1
[0053] Cutting speed Service life Chip removal capacity Example 1 5m / min 3000 square meters good Example 2 6m / min 3500 square meters good Example 3 5.1m / min 3100 square meters good Example 4 5.4m / min 2900 square meters good Example 5 5.6m / min 3200 square meters good
[0054] It can be seen from the above table that the present invention improves the separation degree and cutting speed attenuation problems of the cutter head by designing the cutter head raw materials and proportions. Specifically, ultrafine iron-cobalt-copper alloy powder and carbonyl iron powder are added to the cutter head formula. The addition of ultrafine iron-nickel alloy powder can improve the sharpness of the cutter head. The ultrafine powder can improve the sintering activity of the powder. At the same time, the addition of yttrium oxide powder can play a role in deoxidation and denitrification, purifying the matrix, and can effectively improve the cutting speed and service life, prevent the cutting speed attenuation phenomenon, and can stably and continuously cut. Compared with similar products, the cutting speed of this ring saw blade is more than 50% higher than that of its peers, and the service life is more than 50% longer. At the same time, U-shaped grooves and V-shaped grooves are set on the cutter head to reduce the contact area between the cutter head and the cutting material, reduce the friction cutting resistance, and significantly improve the chip removal ability and sharpness of the ring saw.
[0055] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.
Claims
1. A method for preparing a diamond ring saw using laser welding, characterized in that: The specific preparation steps include: (1) Ingredients: Weigh the following raw materials in weight proportion: 50-60 parts of ultrafine iron-nickel pre-alloy powder, 15-30 parts of ultrafine copper powder, 2-5 parts of tin powder, 15-30 parts of ultrafine tungsten carbide powder, and 3-6 parts of yttrium oxide powder, wherein the volume fraction of diamond accounts for 15%-50% (based on 400%), and the particle size is 400-700 μm, and mix the above raw materials to obtain alloy matrix powder; (2) Mixing: Put the alloy matrix powder obtained in step (1) into a three-dimensional mixer, and then add glycerin into the mixer for mixing. The mixing time is 5-8 hours; (3) Coating: Weigh diamond particles of a certain proportion, wet the surface of the diamond particles with methyl acetate, and then coat the surface of the diamond particles with a layer of cobalt powder. Specifically, 100 g of diamond is coated with 30 g of cobalt powder. After the cobalt coating, the diamond particles are put into the three-dimensional mixer of step (2) and mixed with the metal powder for 2 h. (4) Cold pressing: cold pressing the powder mixed evenly in step (3) into a cold pressed blank according to the weight of the cutter head to obtain a cutter head blank, wherein the pressing pressure of the cold pressing is 150-300 MPa; (5) Hot pressing sintering: the cutter head blank after cold pressing in (4) is placed into a graphite mold for hot pressing sintering, the sintering temperature is 820-950°C, the sintering pressure is 25-40MPa, and the holding time is 200-300 seconds; (6) Laser welding: The cutter head blank sintered in step (5) is deburred, and the welding surface is polished with an abrasive belt to obtain the required curvature, and then the cutter head is welded to the steel substrate using a laser welding machine, wherein the laser welding power is 2500 W and the welding speed is 20 mm / s; (7) After the welding is completed according to step (6), the strength of the teeth is tested, and finally the diamond ring saw is obtained after sharpening, polishing and engraving.
2. A method for preparing a diamond ring saw using laser welding, characterized in that: The ultrafine iron-nickel pre-alloyed powder described in step (1) has a powder particle size of 3-6 μm, the ultrafine copper powder has a powder particle size of 8-10 μm, the tin powder has a powder particle size of 12-15 μm, the ultrafine tungsten carbide powder has a powder particle size of 5-7 μm, and the yttrium oxide powder has a powder particle size of 20-25 μm.
3. A diamond ring saw made according to claim 1, comprising a steel base and a cutter head, characterized in that: The cutter head comprises ultrafine iron-nickel pre-alloyed powder, ultrafine copper powder, tin powder, ultrafine tungsten carbide powder, yttrium oxide powder and diamond raw materials, wherein the weight percentage of the raw materials is 50%-60% of ultrafine iron-nickel pre-alloyed powder, 15%-30% of ultrafine copper powder, 2%-5% of tin powder, 15%-30% of ultrafine tungsten carbide powder, 3%-6% of yttrium oxide powder, the volume fraction of the diamond is 15%-50%, and the particle size is 400-700μm. One side of the cutter head is arranged on a steel substrate at intervals by laser welding, and a U-shaped groove is arranged on the other side, and V-shaped grooves are also arranged on both side surfaces of the cutter head.
4. The diamond ring saw according to claim 3, characterized in that: The Ni content in the ultrafine iron-nickel pre-alloyed powder is 35%, and the laser particle size D50 is 3-6 μm.
5. The diamond ring saw according to claim 1, characterized in that: The length of the blade head is 20mm≤L≤50mm, and the height is 8mm≤H≤25mm.
6. The diamond ring saw according to claim 1, characterized in that: The dimensions of the U-shaped groove are 1mm≤a≤10mm, 1mm≤h≤20mm.
7. The diamond ring saw according to claim 1, characterized in that: The dimensions of the V-shaped groove on the cutter head are 0.5mm≤b≤6mm, 30≤c≤150, 0.2mm≤d≤1.5mm, and 30°≤e≤180°.
8. The laser-welded diamond ring saw according to claim 1, characterized in that: The number of the U-shaped grooves is 1 to 5, and the number of the V-shaped grooves is symmetrically arranged on both side surfaces of the cutter head.
9. The diamond ring saw according to claim 1, characterized in that: The outer diameter of the steel substrate is 200mm-800mm, and two grooves are arranged on the side, and the dimensions of the grooves are 20mm≤L1≤50mm, 5mm≤m≤20mm, 2≤p≤20, 1.4mm≤k≤2.0mm, and 3mm≤T≤5mm.
Citation Information
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