Laser processing system and laser processing head thereof

Abstract

The invention relates to a laser processing system and a laser processing head thereof. The laser processing head comprises an optical box, a moving box, a moving assembly and a lens assembly. According to the laser machining head, it is guaranteed that the lens assembly can generate movable focusing relative to the to-be-machined part in a large range, meanwhile, the light path is prevented from deviating due to movement of the lens assembly, and machining light spots emitted to the to-be-machined part can be more stable.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing system and a laser processing head thereof. Background Art

[0002] Laser processing is a new processing technology. By using a laser to emit a certain power of laser and focusing the laser, the ablation processing of the workpiece surface can be achieved. The earliest lasers were continuous lasers, and the processing method of focusing on the workpiece surface was mainly high-power ablation. With the development of science and technology, short-pulse lasers have emerged, such as nanosecond lasers, picosecond lasers and even femtosecond lasers. The processing mechanism of continuous lasers on materials is mainly thermal ablation, so only a higher power is required to process the workpiece, and no other adjustments to the laser are required. However, due to the large heat-affected zone, this type of processing is generally based on rough processing. The most widely used method is to use continuous lasers for cutting. Usually, the power of this type of laser can reach kilowatts to replace traditional cutting to cut metal plates. Unlike continuous lasers, the mechanism of action of pulsed light and materials is usually nonlinear. Although the macroscopic performance is similar to ablation, the power required is greatly reduced compared to continuous light, and the effect on the material is also more delicate. The action accuracy can usually reach the micron level, so the use of pulsed lasers can achieve micro-processing of workpieces.

[0003] During the processing of the pulse laser processing device, the jitter of the pulse laser parameters will cause significant changes in the processing morphology, making the results deviate from expectations. Therefore, when performing pulse laser processing, it is necessary to strictly control the stability of these parameters. Therefore, in the prior art, the components of the laser processing head of the pulse laser processing device are usually designed as a whole, but this also leads to the need to move the laser processing head of the entire pulse laser processing device when focusing according to the concave and convex surface of the workpiece to be processed. The movement of large and complex components will make it impossible to achieve precise focusing, resulting in a decrease in processing quality. Summary of the invention

[0004] Based on this, it is necessary to provide a laser processing system and its laser processing head, which are usually designed as a whole in the prior art. However, this leads to the need to move the laser processing head of the entire pulse laser processing device when focusing according to the concave and convex surface of the workpiece to be processed. The movement of larger and more complex components will lead to the inability to achieve precise focusing, resulting in a decrease in processing quality.

[0005] A laser processing head, comprising:

[0006] An optical box, wherein a first reflector and a second reflector are disposed in the optical box and are spaced apart from each other along a first direction, and the second reflector can move relative to the first reflector along the first direction;

[0007] A moving box, wherein a third reflector and a fourth reflector arranged at intervals along a first direction are arranged in the moving box;

[0008] A moving component, the moving component is arranged on the optical box, and the moving component is used to drive the moving box to move synchronously with the second reflector along the first direction;

[0009] a lens assembly, which is arranged on a side of the moving box away from the optical box and moves along the first direction with the moving box; the first reflector, the second reflector, the third reflector, the fourth reflector and the lens assembly are arranged in sequence along a propagation path of the laser generated by the laser generating assembly;

[0010] The first direction is the direction in which the lens assembly and the workpiece to be processed are arranged.

[0011] In the actual use of the above-mentioned laser processing head, the laser generated by the laser generating component passes through the first reflector, the second reflector, the third reflector, the fourth reflector and the lens assembly in sequence to the workpiece to be processed, so that laser processing of the workpiece to be processed can be achieved. An optical box, a moving box and a moving assembly are provided, and the moving assembly drives the moving box and the lens assembly to move relative to the optical box along the first direction to achieve adjustments along the first direction, such as focusing or changing the laser spot. The first reflector is fixed, and the second reflector, the third reflector and the fourth reflector move synchronously, and all move relative to the first reflector along the first direction. In this process, the optical path between the first reflector and the second reflector is elongated or shortened along the first direction, but it will not cause the optical path to be offset or inaccurate. Therefore, through the above-mentioned structure, while ensuring that the lens assembly can produce a large range of movement and focus relative to the workpiece to be processed, the optical path is prevented from being offset due to the movement of the lens assembly, so that the processing spot directed to the workpiece to be processed can be more stable.

[0012] In one embodiment, the laser processing head further includes a first containing box, an elastic tube and a second containing box;

[0013] The first containing box is arranged on the inner wall of the optical box close to the workpiece to be processed, the first reflecting mirror is located in the first containing box, and the second reflecting mirror is located in the second containing box;

[0014] The elastic tube can be extended and retracted along the first direction, one end of the elastic tube is connected to one end of the accommodating box, and the other end of the elastic tube is connected to the second accommodating box;

[0015] The first containing box is provided with a first hole and a second hole, the first hole is used for the laser to enter the first containing box and emit to the first reflecting mirror, and the second hole is connected to the elastic tube;

[0016] The second containing box is provided with a third hole and a fourth hole, wherein the third hole is used for allowing the laser to pass through the second hole, the elastic tube and the third hole and be emitted to the second reflecting mirror;

[0017] The moving box is in communication with the optical box so that the laser is emitted from the second reflector to the third reflector through the fourth hole.

[0018] In one embodiment, the laser processing head further includes a beam measurement module and a debugging camera module;

[0019] Two installation positions are arranged in the moving box, and the two installation positions are located between the third reflector and the fourth reflector and are arranged at intervals along the first direction;

[0020] The installation position is used to install the light beam measurement module or the debugging camera module.

[0021] In one embodiment, the beam measurement module and / or the debugging camera module is installed between the third reflector and the fourth reflector.

[0022] In one embodiment, the beam measurement module includes a first half-wave plate, a first sampling mirror, and a beam measurement device;

[0023] The first half-wave plate and the first sampling mirror are arranged at intervals along the first direction, and the first half-wave plate is located on a side of the first sampling mirror away from the fourth reflecting mirror;

[0024] The first sampling mirror is used to transmit part of the laser light along a first direction and reflect part of the laser light to the light beam measuring device, and the light beam measuring device is used to detect the light intensity of the laser light.

[0025] In one embodiment, the debugging camera module includes a second half-wave plate, a second sampling mirror and a camera assembly;

[0026] The second half-wave plate and the second sampling mirror are arranged at intervals along the first direction, and the second half-wave plate is located on a side of the second sampling mirror away from the fourth reflecting mirror;

[0027] The second sampling mirror is located between the third reflecting mirror and the fourth reflecting mirror. The second sampling mirror is used to transmit part of the laser along the first direction and reflect part of the laser to the camera assembly. The camera assembly is used to detect the position and shape of the laser.

[0028] In one embodiment, the lens assembly includes: a dimming assembly and a lens housing, the dimming assembly includes a first galvanometer and a second galvanometer, and the first galvanometer and the second galvanometer are both rotatably matched with the lens housing;

[0029] The first galvanometer is used to transmit the laser reflected by the fourth reflector to the second galvanometer, and the second galvanometer is used to transmit the laser from the first galvanometer to the workpiece to be processed; the first galvanometer is used to adjust the offset of the laser along the second direction, and the second galvanometer is used to adjust the offset of the laser along the third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0030] In one embodiment, the first reflector and the second reflector are both rotatably connected to the optical box to correct the optical path of the laser;

[0031] The third reflector and the fourth reflector are both rotatably connected to the movable box to correct the optical path of the laser.

[0032] In one embodiment, the lens assembly further includes: a field lens and an altimeter, the field lens is connected to the lens housing, the dimming assembly and the field lens are arranged at intervals along the first direction, the field lens is located on a side of the dimming assembly close to the workpiece to be processed, and the altimeter is arranged in the lens housing and is used to measure the distance between the lens assembly and the workpiece to be processed.

[0033] An embodiment of the present application further provides a laser processing system, the laser processing system comprising: a laser generating component and a plurality of the laser processing heads;

[0034] The laser generated by the laser generating assembly passes through the first reflector, the second reflector, the third reflector, the fourth reflector and the lens assembly in sequence and is emitted toward the workpiece to be processed.

[0035] In the actual use of the above-mentioned laser processing system, the laser generated by the laser generating component passes through the first reflector, the second reflector, the third reflector, the fourth reflector and the lens assembly in sequence to shoot toward the workpiece to be processed, so that laser processing of the workpiece to be processed can be achieved. An optical box, a moving box and a moving assembly are provided, and the moving assembly drives the moving box and the lens assembly to move relative to the optical box along the first direction to achieve adjustments along the first direction, such as focusing or changing the laser spot. The first reflector is fixed, and the second reflector, the third reflector and the fourth reflector move synchronously, and all move relative to the first reflector along the first direction. In this process, the optical path between the first reflector and the second reflector is elongated or shortened along the first direction, but it will not cause the optical path to be offset or inaccurate. Therefore, through the above-mentioned structure, while ensuring that the lens assembly can produce a large range of movement and focusing relative to the workpiece to be processed, the optical path is prevented from being offset due to the movement of the lens assembly, so that the processing spot directed to the workpiece to be processed can be more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] FIG. 1 is a schematic diagram of a laser processing head according to an embodiment.

[0037] FIG. 2 is a cross-sectional view of a laser processing system.

[0038] FIG. 3 is an enlarged view of the moving box of the optical box in FIG. 2 .

[0039] FIG. 4 is a light path diagram of FIG. 2 .

[0040] FIG. 5 is a schematic diagram of a beam measurement module or a debugging camera module according to an embodiment.

[0041] Description of Figure Numbers:

[0042] 100-Laser processing head;

[0043] 110-optical box; 111-first reflector; 112-second reflector; 113-first accommodating box; 114-second accommodating box; 115-elastic tube; 116-first hole; 117-second hole; 118-third hole; 119-fourth hole;

[0044] 120-movable box; 121-third reflector; 122-fourth reflector; 123-installation position;

[0045] 130-mobile components;

[0046] 140-lens assembly; 141-lens housing; 142-galvanometer; 143-field lens; 144-altimeter;

[0047] 150-beam measurement module; 151-first half-wave plate; 152-first sampling mirror; 153-beam measurement device;

[0048] 160 - debugging camera module; 161 - second sampling mirror; 162 - camera assembly; 163 - second half-wave plate;

[0049] 210-laser processing system; 211-laser generating component; 212-workpiece to be processed;

[0050] OX-first direction; OY-second direction; OZ-third direction. DETAILED DESCRIPTION

[0051] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0052] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0053] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0054] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0055] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0056] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0057] Refer to Figure 1, which shows a structural schematic diagram of a laser processing head 100 in an embodiment of the present application. The laser processing head 100 provided in an embodiment of the present application includes: an optical box 110, a moving box 120, a moving assembly 130 and a lens assembly 140.

[0058] In the above-mentioned laser processing head 100, a first reflector 111 and a second reflector 112 arranged at intervals along a first direction OX are arranged in the optical box 110, and the second reflector 112 can move relative to the first reflector 111 along the first direction OX. A third reflector 121 and a fourth reflector 122 arranged at intervals along the first direction OX are arranged in the moving box 120. The moving assembly 130 is arranged in the optical box 110, and the moving assembly 130 is used to drive the moving box 120 to move synchronously with the second reflector 112 along the first direction OX. The lens assembly 140 is arranged on the side of the moving box 120 away from the optical box 110 and moves along the first direction OX with the moving box 120. The first reflector 111, the second reflector 112, the third reflector 121, the fourth reflector 122 and the lens assembly 140 are arranged in sequence along the propagation path of the laser generated by the laser generating assembly. 4 , the laser generated by the laser generating assembly 211 passes through the first reflector 111, the second reflector 112, the third reflector 121, the fourth reflector 122 and the lens assembly 140 in sequence and is emitted to the workpiece 212. The first direction OX is the direction in which the lens assembly 140 and the workpiece 212 are arranged.

[0059] Since the laser generated by the laser generating component 211 is emitted toward the workpiece 212 to be processed only through four emitting mirrors, or the laser generated by the laser generating component 211 is directly emitted toward the workpiece 212 to be processed, however, only the above-mentioned laser transmission method, if the lens component 140 is focused along the first direction OX, the laser may not be accurately emitted toward the lens component 140 in a moving state.

[0060] Referring to FIG. 2 and FIG. 3 , therefore, in the actual use of the laser processing head 100, the laser generated by the laser generating component 211 passes through the first reflector 111, the second reflector 112, the third reflector 121, the fourth reflector 122 and the lens assembly 140 in sequence and is emitted to the workpiece 212 to be processed, so that the laser processing of the workpiece 212 can be achieved. The optical box 110, the moving box 120 and the moving assembly 130 are provided, and the moving assembly 130 drives the moving box 120 and the lens assembly 140 to move along the first direction OX relative to the optical box 110 to achieve the adjustment along the first direction OX, such as focusing or changing the laser spot. The first reflector 111 is fixed, and the second reflector 112, the third reflector 121 and the fourth reflector 122 move synchronously, and all move relative to the first reflector 111 along the first direction OX. In this process, the optical path between the first reflector 111 and the second reflector 112 is extended or shortened along the first direction OX, but it does not cause the optical path to be offset or inaccurate. Therefore, through the above structure, while ensuring that the lens assembly 140 can move and focus relative to the workpiece 212 over a large range, the optical path is prevented from being offset due to the movement of the lens assembly 140, so that the processing light spot directed to the workpiece 212 can be more stable.

[0061] Referring to FIG. 2 and FIG. 3 , in one embodiment, the laser processing head 100 further includes a first housing box 113, an elastic tube 115, and a second housing box 114. The first housing box 113 is disposed on the inner wall of the optical box 110 close to the workpiece 212 to be processed, the first reflector 111 is located in the first housing box 113, and the second reflector 112 is located in the second housing box 114. The elastic tube 115 can be extended and retracted along the first direction OX, one end of the elastic tube 115 is connected to one end of the housing box, and the other end is connected to the second housing box 114. The first housing box 113 is provided with a first hole 116 and a second hole 117, the first hole 116 is used for laser to enter the first housing box 113 and project to the first reflector 111, and the second hole 117 is connected to the elastic tube 115. The second housing box 114 is provided with a third hole 118 and a fourth hole 119, the third hole 118 is used for laser to pass through the second hole 117 through the elastic tube 115 and the third hole 118 and project to the second reflector 112. The moving box 120 is in communication with the optical box 110 , so that the laser is emitted from the second reflecting mirror 112 to the third reflecting mirror 121 through the fourth hole 119 .

[0062] In this embodiment, the first reflector 111 and the second reflector 112 are relatively moved along the first direction OX in the optical box 110 by the elastic tube 115, the first accommodating box 113 and the second accommodating box 114. The specific optical path is that the laser generated by the laser generating assembly 211 passes through the first hole 116, enters the first accommodating box 113 and is emitted to the first reflector 111, and then is reflected by the first reflector 111 and passes through the second hole 117, the elastic tube 115 and the third hole 118 to be emitted to the second reflector 112, and the second reflector 112 is reflected and passes through the connection between the movable box 120 and the optical box 110 to be emitted to the third reflector 121, and is reflected by the third reflector 121 and emitted to the fourth reflector 122, and the fourth reflector 122 is reflected and then emitted to the camera lens assembly 140, and finally is emitted to the workpiece 212 to be processed through the lens assembly 140.

[0063] 2 and 3, in one embodiment, the laser processing head 100 further includes a beam measuring module 150 and a debugging camera module 160. Two mounting positions 123 are provided in the moving box 120. The two mounting positions 123 are located between the third reflector 121 and the fourth reflector 122 and are arranged at intervals along the first direction OX. The mounting positions 123 are used to mount the beam measuring module 150 or the debugging camera module 160.

[0064] In one embodiment, a beam measurement module 150 is installed between the third reflector 121 and the fourth reflector 122 .

[0065] In another embodiment, a debugging camera module 160 is installed between the third reflecting mirror 121 and the fourth reflecting mirror 122 .

[0066] In yet another embodiment, a debugging camera module 160 and a beam measuring module 150 are installed between the third reflecting mirror 121 and the fourth reflecting mirror 122 .

[0067] Referring to FIG. 5 , the beam measurement module 150 includes a first half-wave plate 151, a first sampling mirror 152, and a beam measurement device 153. The first half-wave plate 151 and the first sampling mirror 152 are arranged at intervals along the first direction OX, and the first half-wave plate 151 is located on the side of the first sampling mirror 152 away from the fourth reflector 122. The first sampling mirror 152 is used to transmit part of the laser along the first direction OX, and reflect part of the laser to the beam measurement device, and the beam measurement device is used to detect the light intensity of the laser. The laser used for processing passes through the first sampling mirror 152 and is emitted to the fourth reflector 122. The part of the laser reflected by the first sampling mirror 152 is transmitted to the beam measurement module to detect the laser intensity, and the intensity of the laser generated by the laser generating component 211 is adjusted according to the detection result.

[0068] Specifically, the beam measuring device 153 includes a first attenuation plate and a beam measuring part, which are arranged along the second direction OY. Part of the laser reflected by the first sampling mirror 152 passes through the first attenuation plate and is transmitted to the beam measuring part to detect the laser intensity. The intensity of the laser generated by the laser generating component 211 is adjusted according to the detection result.

[0069] Referring to FIG. 5 , the debugging camera module 160 includes a second half-wave plate 163, a second sampling mirror 161, and a camera assembly 162. The second half-wave plate 163 and the second sampling mirror 161 are arranged at intervals along the first direction OX, and the second half-wave plate 163 is located on the side of the second sampling mirror 161 away from the fourth reflector 122. The second sampling mirror 161 is located between the third reflector 121 and the fourth reflector 122, and the second sampling mirror 161 is used to transmit part of the laser along the first direction OX, and reflect part of the laser to the camera assembly 162, and the camera assembly 162 is used to detect the position and shape of the laser. The laser used for processing passes through the second sampling mirror 161 and is emitted to the fourth reflector 122, and part of the laser reflected by the second sampling mirror 161 is transmitted to the camera assembly 162 to detect the position and shape of the laser, and the position and shape of the laser generated by the laser generating assembly 211 are adjusted according to the detection result.

[0070] Specifically, the camera assembly 162 includes a second attenuation plate and a camera unit, which are arranged along the second direction OY. Part of the laser reflected by the second sampling mirror 161 passes through the second attenuation plate and is transmitted to the camera unit to detect the position and shape of the laser. The position and shape of the laser generated by the laser generating assembly 211 are adjusted based on the detection results.

[0071] Referring to FIG. 1 and FIG. 3 , in one embodiment, the lens assembly 140 includes: a dimming assembly and a lens housing 141, and the dimming assembly includes a first galvanometer and a second galvanometer, and the first galvanometer and the second galvanometer are both rotatably matched with the lens housing 141. The first galvanometer is used to transmit the laser reflected by the fourth reflector 122 to the second galvanometer, and the second galvanometer is used to transmit the laser from the first galvanometer to the workpiece 212 to be processed. The first galvanometer is used to adjust the offset of the laser along the second direction OY, and the second galvanometer is used to adjust the offset of the laser along the third direction OZ. The first direction OX, the second direction OY and the third direction OZ are perpendicular to each other. Thereby, the adjustment of the workpiece 212 to be processed with a large area is achieved. Specifically, the distance of the laser spot movement that can be adjusted by the first galvanometer and the second galvanometer is: 20-30mm relative to the axis along the second direction OY or the third direction OZ. Specifically, 22.5mm relative to the axis along the second direction OY or the third direction OZ.

[0072] In one embodiment, the first reflector 111 and the second reflector 112 are both rotatably connected to the optical box 110 to correct the optical path of the laser. The third reflector 121 and the fourth reflector 122 are both rotatably connected to the moving box 120 to correct the optical path of the laser. In this embodiment, the change of the optical path propagation is achieved by rotating the four reflectors passing through the laser propagation optical path.

[0073] Referring to FIG. 1 and FIG. 3 , in one embodiment, the lens assembly 140 further includes: a field lens 143 and an altimeter 144. The field lens 143 is connected to the lens housing 141. The dimming assembly and the field lens 143 are arranged at intervals along the first direction OX. The field lens 143 is located on the side of the dimming assembly close to the workpiece 212 to be processed. The altimeter 144 is disposed on the lens housing 141 and is used to measure the distance between the lens assembly 140 and the workpiece 212 to be processed. The laser is directed to the workpiece 212 to be processed for adjustment through the field lens 143, and the altimeter 144 measures the distance between the lens assembly 140 and the workpiece 212 to be processed, thereby assisting in focusing.

[0074] Preferably, the lens assembly 140 further includes a dust extraction device, which is connected to the lens housing 141 and is used for removing dust during the laser processing to prevent processing debris from affecting the processing process.

[0075] 2 , an embodiment of the present application further provides a laser processing system 210, which includes a laser generating assembly 211 and a plurality of laser processing heads 100. The laser generated by the laser generating assembly 211 sequentially passes through a first reflector 111, a second reflector 112, a third reflector 121, a fourth reflector 122 and a lens assembly 140 to be emitted toward a workpiece 212 to be processed.

[0076] In the actual use of the above-mentioned laser processing system 210, the laser generated by the laser generating component 211 passes through the first reflector 111, the second reflector 112, the third reflector 121, the fourth reflector 122 and the lens assembly 140 in sequence and is emitted to the workpiece 212 to be processed, so that the laser processing of the workpiece 212 to be processed can be achieved. The optical box 110, the moving box 120 and the moving assembly 130 are provided, and the moving assembly 130 drives the moving box 120 and the lens assembly 140 to move along the first direction OX relative to the optical box 110 to achieve the adjustment along the first direction OX, such as focusing or changing the laser spot. The first reflector 111 is fixed, and the second reflector 112, the third reflector 121 and the fourth reflector 122 move synchronously, and all move relative to the first reflector 111 along the first direction OX. In this process, the optical path between the first reflector 111 and the second reflector 112 is extended or shortened along the first direction OX, but it does not cause the optical path to be offset or inaccurate. Therefore, through the above structure, while ensuring that the lens assembly 140 can move and focus relative to the workpiece 212 over a large range, the optical path is prevented from being offset due to the movement of the lens assembly 140, so that the processing light spot directed to the workpiece 212 can be more stable.

[0077] Specifically, a half-wave plate and a shape changing member are provided between the third reflecting mirror 121 and the fourth reflecting mirror 122 to change the shape of the laser spot, which may be a shape or a shape changing member to change one spot into multiple spots.

[0078] The moving speed of the laser spot on the workpiece to be processed is 0-4m / s, the laser wavelength is 340-360nm, and the focal length of the lens assembly is 100mm.

[0079] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A laser processing head, characterized in that: The laser processing head comprises: An optical box, wherein a first reflector and a second reflector are disposed in the optical box and are spaced apart from each other along a first direction, and the second reflector can move relative to the first reflector along the first direction; A moving box, wherein a third reflector and a fourth reflector arranged at intervals along a first direction are arranged in the moving box; A moving component, the moving component is arranged on the optical box, and the moving component is used to drive the moving box to move synchronously with the second reflector along the first direction; A lens assembly, disposed on a side of the moving box away from the optical box and moving along the first direction with the moving box; The first reflector, the second reflector, the third reflector, the fourth reflector and the lens assembly are arranged in sequence along a propagation path of the laser generated by the laser generating assembly; The first direction is the direction in which the lens assembly and the workpiece to be processed are arranged.

2. The laser processing head according to claim 1, characterized in that: The laser processing head further comprises a first accommodating box, an elastic tube and a second accommodating box; The first containing box is arranged on the inner wall of the optical box close to the workpiece to be processed, the first reflecting mirror is located in the first containing box, and the second reflecting mirror is located in the second containing box; The elastic tube can be extended and retracted along the first direction, one end of the elastic tube is connected to one end of the accommodating box, and the other end of the elastic tube is connected to the second accommodating box; The first containing box is provided with a first hole and a second hole, the first hole is used for the laser to enter the first containing box and emit to the first reflecting mirror, and the second hole is connected to the elastic tube; The second containing box is provided with a third hole and a fourth hole, wherein the third hole is used for allowing the laser to pass through the second hole, the elastic tube and the third hole and be emitted to the second reflecting mirror; The moving box is in communication with the optical box so that the laser is emitted from the second reflector to the third reflector through the fourth hole.

3. The laser processing head according to claim 1, characterized in that: The laser processing head also includes a beam measurement module and a debugging camera module; Two installation positions are arranged in the moving box, and the two installation positions are located between the third reflector and the fourth reflector and are arranged at intervals along the first direction; The installation position is used to install the light beam measurement module or the debugging camera module.

4. The laser processing head according to claim 3, characterized in that: The beam measurement module and / or the debugging camera module are installed between the third reflector and the fourth reflector.

5. The laser processing head according to claim 3, characterized in that: The beam measurement module includes a first half-wave plate, a first sampling mirror and a beam measurement device; The first half-wave plate and the first sampling mirror are arranged at intervals along the first direction, and the first half-wave plate is located on a side of the first sampling mirror away from the fourth reflecting mirror; The first sampling mirror is used to transmit part of the laser light along a first direction and reflect part of the laser light to the light beam measuring device, and the light beam measuring device is used to detect the light intensity of the laser light.

6. The laser processing head according to claim 3, characterized in that: The debugging camera module includes a second half-wave plate, a second sampling mirror and a camera assembly; The second half-wave plate and the second sampling mirror are arranged at intervals along the first direction, and the second half-wave plate is located on a side of the second sampling mirror away from the fourth reflecting mirror; The second sampling mirror is located between the third reflecting mirror and the fourth reflecting mirror. The second sampling mirror is used to transmit part of the laser along the first direction and reflect part of the laser to the camera assembly. The camera assembly is used to detect the position and shape of the laser.

7. The laser processing head according to claim 1, characterized in that: The lens assembly comprises: a dimming assembly and a lens housing, the dimming assembly comprises a first galvanometer and a second galvanometer, and the first galvanometer and the second galvanometer are both rotatably matched with the lens housing; The first galvanometer is used to transmit the laser reflected by the fourth reflector to the second galvanometer, and the second galvanometer is used to transmit the laser from the first galvanometer to the workpiece to be processed; the first galvanometer is used to adjust the offset of the laser along the second direction, and the second galvanometer is used to adjust the offset of the laser along the third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

8. The laser processing head according to claim 1, characterized in that: The first reflector and the second reflector are both rotatably connected to the optical box to correct the optical path of the laser; The third reflector and the fourth reflector are both rotatably connected to the movable box to correct the optical path of the laser.

9. The laser processing head according to claim 7, characterized in that: The lens assembly also includes: a field lens and a altimeter, the field lens is connected to the lens housing, the dimming assembly and the field lens are arranged at intervals along the first direction, the field lens is located on a side of the dimming assembly close to the workpiece to be processed, and the altimeter is arranged in the lens housing and is used to measure the distance between the lens assembly and the workpiece to be processed.

10. A laser processing system, characterized in that: The laser processing system comprises: a laser generating assembly and a plurality of laser processing heads according to any one of claims 1 to 9; The laser generated by the laser generating assembly passes through the first reflector, the second reflector, the third reflector, the fourth reflector and the lens assembly in sequence and is emitted toward the workpiece to be processed.

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