Ceramic chopper and laser surface treatment method thereof

Abstract

The invention discloses a ceramic chopper and a laser surface treatment method thereof, and the method comprises the following steps: molding ceramic powder by using a press to prepare a blank piece; sintering and curing; obtaining a prototype of the ceramic chopper; the roughness is changed; performing ultrasonic cleaning; carrying out spin-drying treatment; carrying out drawing design through drawing software; importing a drawing into a laser machine; the ceramic chopper is machined through a laser machine according to the drawing, and a desired shape is manufactured; and heat treatment. The laser processing depth can be flexibly adjusted in a dotting mode; by means of drawing design and dotting, compared with a common form, transverse connection is added, a grid-like structure is formed, connectivity of all positions is enhanced, the structure is not prone to breakage when subjected to transverse force in the application process, and the service life can be prolonged by more than one time; different layers are divided from inside to outside, and the depths and roughness of different positions can be adjusted according to an application end, so that better wear resistance and service life results and better mechanical performance of a client are realized.

Description

Technical Field

[0001] The invention belongs to the technical field of ceramic splitting knives, and in particular relates to a ceramic splitting knives and a laser surface treatment method thereof. Background Art

[0002] In recent years, laser has been widely used in many industries as a surface treatment method. The current laser treatment methods for ceramic splitters are mainly: by drawing certain graphics combined with specific laser parameters, a certain surface morphology is finally presented, and a certain life and mechanical properties are achieved to meet the client's usage. However, it should be noted that the previous graphic designs are often relatively simple, and in actual use, the product often has problems such as low life and fast wear, which does not meet the increasingly high demands of customers.

[0003] Based on this, the present invention discloses a ceramic splitting tool and a laser surface treatment method thereof. Summary of the invention

[0004] In order to solve the technical problems existing in the prior art, the object of the present invention is to provide a ceramic splitting tool and a laser surface treatment method thereof.

[0005] In order to achieve the above purpose and the above technical effect, the technical solution adopted by the present invention is:

[0006] A laser surface treatment method for a ceramic wedge comprises the following steps:

[0007] S1. preparing ceramic powder;

[0008] S2, forming the ceramic powder by using a press to form a blank of a cylinder or other shape;

[0009] S3, sintering and curing the blank at 1000-1800°C for 5-24h;

[0010] S4, machining the blank after solidification in step S3 to obtain a prototype of a ceramic splitting knife;

[0011] S5, performing surface treatment on the product obtained in step S4 to change the roughness;

[0012] S6, subjecting the product after the surface treatment in step S5 to ultrasonic cleaning to clean the surface of the product;

[0013] S7, drying the cleaned product;

[0014] S8. Place the processed product on a special fixture, keep the product fixed and clamped, and then place the fixture together with the product on the laser machine base;

[0015] S9. Select a picosecond laser machine, nanosecond laser machine or femtosecond laser machine with a spot size of 2-10μm, and use drawing software to design the drawing:

[0016] S10, import the drawing into the laser machine and set the process parameters of the laser machine;

[0017] S11. The camera identifies the product to confirm its position and height to ensure the consistency and stability of the shape. The laser machine moves to the designated position according to the identification result to process the ceramic splitter according to the drawing to produce the desired shape.

[0018] S12, performing ultrasonic cleaning on the processed product;

[0019] S13, heat treating the cleaned product;

[0020] S14. Package the finished products for sale or other testing.

[0021] Furthermore, in step S2, the pressing pressure is set to 0.1-0.6 MPa, and the holding time is set to 5-30 s.

[0022] Furthermore, in step S5, the roughness is 0.01-1 μm.

[0023] Furthermore, in step S6, the product after the surface treatment in step S5 is ultrasonically cleaned in a hot water environment at 50-80°C.

[0024] Furthermore, in step S7, the cleaned product is spun dry at a frequency of 1000-10000 Hz for 1-5 minutes.

[0025] Furthermore, in step S9, the step of designing drawings using drawing software includes:

[0026] First draw a point, and then generate the innermost circle according to the circular array with a spacing of 2-10μm, that is, several points in the inner circle are combined into a circle; then based on the innermost circle, draw a complete pattern with each circle spaced 1-10μm outward, and determine how many circles need to be drawn based on the size of the conical part of the product.

[0027] Furthermore, in step S10, the process parameters of the laser machine are:

[0028] Layer 1 uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times;

[0029] Layer 2 uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times;

[0030] Layer N uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times;

[0031] Layers 1-N are flexibly adjusted according to the actual chip application scenario.

[0032] Furthermore, in step S13, the heat treatment temperature is set to 500-1800° C., and the heat treatment time is set to 1-48 hours.

[0033] The invention also discloses a ceramic splitting knife made by adopting the laser surface treatment method of the ceramic splitting knife as described above.

[0034] Furthermore, the ceramic splitting knife has a working surface, which is a grid structure. Each circle in the grid structure is composed of a number of points. The diameter of each point is 1-5μm, the depth is 1-5μm, the point spacing is 2-10μm, and the spacing between two connected circles is 1-10μm.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] The advantages of the present invention over conventional splitting knives include:

[0037] 1) The depth of laser processing can be flexibly adjusted by dotting;

[0038] 2) Through the design of drawings and dotting, compared with the ordinary form, lateral connections are added to form a grid-like structure, which strengthens the connectivity of each position, making it less likely to break when subjected to lateral forces during application, and the service life can be increased by more than 1 times;

[0039] 3) By dividing the inside and outside into different layers, the depth and roughness of different positions can be adjusted according to the application end to achieve better wear resistance and life results for the client, as well as better mechanical performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is an electron microscope image of the surface morphology of existing ceramic splitting knife products;

[0041] Figure 2 It is a structural schematic diagram of step S9 of the present invention;

[0042] Figure 3 This is an electron microscope image of the surface morphology of the ceramic splitting knife product of the present invention;

[0043] Figure 4 It is a partial electron microscope magnified image of the ceramic splitting knife product of the present invention. DETAILED DESCRIPTION

[0044] The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0045] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or critical elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0046] like Figure 2-4 As shown, the present invention discloses a laser surface treatment method for a ceramic wedge, comprising the following steps:

[0047] S1. Ceramic powder is made from alumina raw powder; other functional materials can be doped into the alumina raw powder, and the materials can be flexibly selected according to actual needs;

[0048] S2, forming the ceramic powder using a press, setting the pressing pressure to 0.1-0.6 MPa, and setting the holding time to 5-30 seconds, thereby forming a cylindrical or other shaped blank;

[0049] S3, sintering and curing the blank at 1000-1800°C for 5-24h;

[0050] S4, using a grinding wheel, sandpaper or other mechanical processing tools to process the blank solidified in step S3, such as processing the head of the cylinder into a cone, etc., to obtain a prototype of the ceramic splitting knife;

[0051] S5, performing surface treatment on the product obtained in step S4, including but not limited to polishing, acid corrosion and the like to change the roughness, wherein the roughness is 0.01-1 μm;

[0052] S6, subjecting the product surface-treated in step S5 to ultrasonic cleaning in a hot water environment at 50-80° C. to clean the surface of the product;

[0053] S7, spin-drying the cleaned product at a frequency of 1000-10000 Hz for 1-5 minutes;

[0054] S8. Place the processed product on a special fixture, keep the product fixed and clamped, and then place the fixture together with the product on the laser machine base;

[0055] S9. Select a picosecond laser machine, nanosecond laser machine or femtosecond laser machine with a spot size of 2-10μm. Use the drawing software configured on the machine or computer, such as CAD or other 2D or 3D software, to design the drawing according to the following steps:

[0056] First draw a point, and then generate the innermost circle according to the circular array with a spacing of 2-10μm, that is, several points in the inner circle are combined into a circle; then, based on the innermost circle, draw a complete figure with each circle spaced 1-10μm outward, and get the following Figure 2 The structure shown, how many circles need to be drawn depends on the size of the conical part of the product;

[0057] S10. Import the drawing into the laser machine and set the process parameters of the laser machine as follows:

[0058] Layer 1 uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times;

[0059] Layer 2 uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times;

[0060] Layer N uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times;

[0061] Layers 1-N are flexibly adjusted according to the actual chip application scenario. For example, if there are only N=5 circles, the first circle inside is layer 1, and the rest are layer 2. For example, if there are N=10 circles, the first to second circles inside are layer 1, the third to seventh circles are layer 2, and the rest are layer 3;

[0062] S11. The camera identifies the product to confirm its position and height to ensure the consistency and stability of the shape. The laser machine moves to the designated position according to the identification result to process the ceramic splitter according to the drawing. Through the characteristics of the interaction between the laser beam and the material, the workpiece is irradiated with a high-power density laser beam, so that the ceramic material is rapidly heated in a very short time, and then physical or chemical changes such as melting and gasification occur, so as to achieve the purpose of processing and produce the desired shape;

[0063] S12, performing ultrasonic cleaning on the processed product;

[0064] S13, heat-treating the cleaned product, with the heat-treatment temperature set to 500-1800℃ and the heat-treatment time set to 1-48h, to eliminate stress and change the microstructure of the ceramic, such as grain growth, phase transformation, etc. These changes help to enhance the strength and stability of the ceramic; the surface morphology of the ceramic splitting knife product obtained by electron microscopy is as follows: Figure 3-4 As shown;

[0065] S14. Package the finished products for sale or other testing.

[0066] The present invention also discloses a ceramic splitting knife made by the laser surface treatment method of the ceramic splitting knife as described above, wherein the ceramic splitting knife has a working surface, the working surface is a grid structure, each circle in the grid structure is composed of a plurality of points, each point has a diameter of 1-5 μm, a depth of 1-5 μm, a point spacing of 2-10 μm, and a spacing between two connected circles of 1-10 μm.

[0067] Example 1

[0068] A laser surface treatment method for a ceramic wedge comprises the following steps:

[0069] S1. Alumina raw powder is used to make ceramic powder by conventional technology, which will not be described in detail here;

[0070] S2, forming the ceramic powder using a press, setting the pressing pressure to 0.6 MPa and the holding time to 20 seconds, thereby forming a cylindrical blank;

[0071] S3, sintering and curing the blank at 1800°C for 5h;

[0072] S4, using sandpaper to process the blank after being cured in step S3, processing the head of the cylinder into a cone, and obtaining the prototype of the ceramic splitting knife;

[0073] S5, polishing the product obtained in step S4 to change the roughness to 0.02 μm;

[0074] S6, subjecting the product surface-treated in step S5 to ultrasonic cleaning in a hot water environment at 80° C. to clean the surface of the product;

[0075] S7, drying the cleaned product at a frequency of 10000 Hz for 1 minute;

[0076] S8. Place the processed product on a special fixture, keep the product fixed and clamped, and then place the fixture together with the product on the laser machine base;

[0077] S9. Select a nanosecond laser machine with a spot size of 5μm. Use the CAD drawing software configured on the machine to design the drawing according to the following steps:

[0078] First draw a point, and then generate the innermost circle according to the circular array with a point spacing of 3μm, that is, several points in the inner circle are combined into a circle; then, based on the innermost circle, draw a complete figure with each circle spaced 3μm outwards in sequence, with the inner and outer layers having the same depth, and obtain the following Figure 2 For the structure shown, the number of circles to be drawn is determined according to the size of the conical part of the product. If N=5 circles, the first circle inside is layer 1, and the rest are layer 2.

[0079] S10. Import the drawing into the laser machine and set the process parameters of the laser machine as follows:

[0080] Layer 1 uses a laser frequency of 500Khz, a power ratio of 10%, a dotting time of 10μs, a scanning speed of 100bits / ms, a jump speed of 100bits / ms, a scanning delay of 100μs, a jump delay of 100μs, a light-on delay of 100μs, a light-off delay of 100μs, and processing times of 2 times;

[0081] Layer 2 uses a laser frequency of 1000Khz, a power ratio of 20%, a dotting time of 100μs, a scanning speed of 1000bits / ms, a jump speed of 1000bits / ms, a scanning delay of 1000μs, a jump delay of 1000μs, a light-on delay of 1000μs, a light-off delay of 1000μs, and a processing number of 2 times;

[0082] S11. The camera identifies the product to confirm its position and height to ensure the consistency and stability of the shape. The laser machine moves to the designated position according to the identification result to process the ceramic splitter according to the drawing. Through the characteristics of the interaction between the laser beam and the material, the workpiece is irradiated with a high-power density laser beam, so that the ceramic material is rapidly heated in a very short time, and then physical or chemical changes such as melting and gasification occur, so as to achieve the purpose of processing and produce the desired shape;

[0083] S12, performing ultrasonic cleaning on the processed product;

[0084] S13, heat treatment is performed on the cleaned product, the heat treatment temperature is set to 1800℃, and the heat treatment time is set to 2h to eliminate stress and change the microstructure of the ceramic, such as grain growth, phase transformation, etc. These changes help to enhance the strength and stability of the ceramic; the surface morphology of the ceramic splitting knife product obtained at this time is as follows: Figure 3-4 As shown;

[0085] S14. Package the finished products for sale or other testing.

[0086] A ceramic splitting knife has a working surface with a grid structure. Each circle in the grid structure is composed of a plurality of points. The diameter of each point is 2 μm, the depth is 2 μm, the point spacing is 2 μm, and the spacing between two connected circles is 2 μm.

[0087] Example 2

[0088] The difference between this embodiment and the first embodiment is that the dot pitch and the circle pitch in step S9 of this embodiment are both 4 μm, and the rest is the same as the first embodiment.

[0089] Example 3

[0090] The difference between this embodiment and the first embodiment is that the dot pitch and the circle pitch in step S9 of this embodiment are both 5 μm, and the rest is the same as the first embodiment.

[0091] Example 4

[0092] The difference between this embodiment and embodiment 1 is that the dot spacing and circle spacing in step S9 of this embodiment are both 4 μm, the inner layer depth is shallow, and the outer layer depth is deep, and the rest is the same as embodiment 1.

[0093] Comparative Example 1

[0094] Commercially available ceramic cleaver.

[0095] The performance test results of Examples 1-4 and Comparative Example 1 are shown in Table 1.

[0096] Table 1

[0097] Mechanics (gf) Lifespan (K) Example 1 26 800 Example 2 32 1300 Example 3 25 900 Example 4 38 2500 Comparative Example 1 22 600

[0098] As can be seen from Table 1, the ceramic splitter of the present invention has increased lateral connections compared to the ceramic splitter of the ordinary form, forming a grid-like structure, strengthening the connectivity of each position, improving the mechanical properties, not easy to break, higher stability, and life span can be increased by more than double. The present invention can adjust the depth and roughness of different positions according to the application end by dividing different layers inside and outside, thereby improving wear resistance, life span and mechanical properties.

[0099] Parts or structures not specifically described in the present invention may adopt existing technologies or existing products and will not be described in detail here.

[0100] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A laser surface treatment method for a ceramic splitter, characterized in that: The following steps are involved: S1. preparing ceramic powder; S2, forming the ceramic powder by using a press to form a blank of a cylinder or other shape; S3, sintering and curing the blank at 1000-1800°C for 5-24h; S4, machining the blank after solidification in step S3 to obtain a prototype of a ceramic splitting knife; S5, performing surface treatment on the product obtained in step S4 to change the roughness; S6, subjecting the product after the surface treatment in step S5 to ultrasonic cleaning to clean the surface of the product; S7, drying the cleaned product; S8. Place the processed product on a special fixture, keep the product fixed and clamped, and then place the fixture together with the product on the laser machine base; S9. Select a picosecond laser machine, nanosecond laser machine or femtosecond laser machine with a spot size of 2-10μm, and use drawing software to design the drawing: S10, import the drawing into the laser machine and set the process parameters of the laser machine; S11. The camera identifies the product to confirm its position and height to ensure the consistency and stability of the shape. The laser machine moves to the designated position according to the identification result to process the ceramic splitter according to the drawing to produce the desired shape. S12, performing ultrasonic cleaning on the processed product; S13, heat treating the cleaned product; S14. Package the finished products for sale or other testing.

2. The laser surface treatment method of a ceramic splitting tool according to claim 1, characterized in that: In step S2, the pressing pressure is set to 0.1-0.6 MPa, and the holding time is set to 5-30 s.

3. The laser surface treatment method of a ceramic splitting tool according to claim 1, characterized in that: In step S5, the roughness is 0.01-1 μm.

4. The laser surface treatment method of a ceramic wedge according to claim 1, characterized in that: In step S6, the product surface-treated in step S5 is ultrasonically cleaned in a hot water environment at 50-80°C.

5. The laser surface treatment method of a ceramic splitting tool according to claim 1, characterized in that: In step S7, the cleaned product is spun dry at a frequency of 1000-10000 Hz for 1-5 minutes.

6. The laser surface treatment method of a ceramic splitting tool according to claim 1, characterized in that: In step S9, the step of designing drawings using drawing software includes: First draw a point, and then generate the innermost circle according to the circular array with a spacing of 2-10μm, that is, several points in the inner circle are combined into a circle; then based on the innermost circle, draw a complete pattern with each circle spaced 1-10μm outward, and determine how many circles need to be drawn based on the size of the conical part of the product.

7. The laser surface treatment method of a ceramic splitting tool according to claim 1, characterized in that: In step S10, the process parameters of the laser machine are: Layer 1 uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times; Layer 2 uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times; Layer N uses a laser frequency of 500-2000Khz, a power ratio of 10-50%, a dotting time of 10-500μs, a scanning speed of 100-2000bits / ms, a jump speed of 100-2000bits / ms, a scanning delay of 100-2000μs, a jump delay of 100-2000μs, a light-on delay of 100-2000μs, a light-off delay of 100-2000μs, and a processing number of 1-10 times; Layers 1-N are flexibly adjusted according to the actual chip application scenario.

8. The laser surface treatment method of a ceramic splitting tool according to claim 1, characterized in that: In step S13, the heat treatment temperature is set to 500-1800° C., and the heat treatment time is set to 1-48 hours.

9. A ceramic wedge manufactured by the laser surface treatment method for a ceramic wedge according to any one of claims 1 to 8.

10. A ceramic splitting knife according to claim 9, characterized in that: The ceramic splitting knife has a working surface which is a grid structure. Each circle in the grid structure is composed of a number of points. The diameter of each point is 1-5 μm, the depth is 1-5 μm, the point spacing is 2-10 μm, and the spacing between two connected circles is 1-10 μm.

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