Product cooling partition adsorption rotary carrying table of laser processing equipment

Abstract

The invention relates to a product cooling partition adsorption rotary carrying table of laser processing equipment, which comprises a carrying table lower plate, a rotary motor and a base, and the rotary motor mounted on the base drives the carrying table lower plate above to rotate through a rotary motor connecting plate; a cooling adsorption plate is mounted on the carrying platform lower plate, cooling water joints are mounted at two ends of the cooling adsorption plate, and criss-cross cooling water channels are arranged in the cooling adsorption plate between the two cooling water joints; a plurality of vacuum adsorption cavities are sequentially arranged in the carrying platform lower plate from inside to outside, and a quick connector is installed on the carrying platform lower plate at one end of each vacuum adsorption cavity. According to the invention, the adverse effect of heat generated by laser processing on the product is obviously reduced, and the yield of the product is improved.

Description

Technical Field

[0001] The present invention relates to the technical field related to laser processing equipment, and in particular to a product cooling partition adsorption rotating carrier of laser processing equipment. Background Art

[0002] With the development of laser micromachining technology, its application industries and processed products are becoming more and more extensive. The materials range from silicon, silicon carbide and other wafers in the semiconductor industry to prisms and lenses in the optical industry. Laser micromachining technology has spread to all walks of life with its incomparable advantages over common mechanical processing, such as processing efficiency, processing precision, and processing flexibility.

[0003] After massive searches, it was found that the existing Chinese patent announcement number is CN217444361U, which discloses a quartz rotary adsorption carrier, which includes, from top to bottom, a grooved quartz carrier, a quartz mounting plate, a carrier base, a rotating motor and a rotating shaft pad. The rotating motor is installed in the middle position of the rotating shaft pad, and the driving end of the top of the rotating motor is connected to the upper carrier base. A quartz mounting plate is installed on the carrier base, and a grooved quartz carrier is installed on the inner side of the top of the quartz mounting plate. A number of suction cup brackets are evenly installed on the carrier base along the circumferential direction, and a suction cup is installed on the suction cup bracket.

[0004] In pursuit of higher processing efficiency, the laser power used in laser micromachining technology has also been further improved. The heat generated by high-frequency lasers cannot be dissipated in time, and thermal effects have become a bottleneck in improving processing efficiency in the laser micromachining industry.

[0005] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a product cooling partition adsorption rotating stage for laser processing equipment to make it more valuable for industrial use. Summary of the invention

[0006] In order to solve any of the above technical problems, the purpose of the present invention is to provide a product cooling partition adsorption rotating stage of laser processing equipment.

[0007] To achieve the above object, the present invention adopts the following technical solution:

[0008] The product cooling partition adsorption rotating stage of the laser processing equipment includes a lower plate of the stage, a rotating motor and a base. The rotating motor installed on the base drives the upper lower plate of the stage to rotate through the rotating motor connecting plate;

[0009] A cooling adsorption plate is installed on the lower plate of the carrier, cooling water joints are installed at both ends of the cooling adsorption plate, and crisscross cooling water channels are arranged in the cooling adsorption plate between the two cooling water joints;

[0010] A plurality of vacuum adsorption cavities are arranged in sequence from the inside to the outside in the lower plate of the carrier, and a quick connector is installed on the lower plate of the carrier at one end of the vacuum adsorption cavity.

[0011] As a further improvement of the present invention, a water tray is installed on the outer side of the bottom of the lower plate of the carrier.

[0012] As a further improvement of the present invention, a water leakage detection line is installed at the edge of the water tray.

[0013] As a further improvement of the present invention, the water leakage detection line is fastened by a plurality of detection line fixing blocks.

[0014] As a further improvement of the present invention, four vacuum adsorption cavities are sequentially arranged from the inside to the outside in the lower plate of the carrier.

[0015] As a further improvement of the present invention, the flatness and upper surface parallelism of the cooling adsorption plate and the lower plate of the carrier are both 0.02 mm.

[0016] By means of the above scheme, the present invention has at least the following advantages:

[0017] The present invention significantly reduces the adverse effect of heat generated by laser processing on products and improves the yield rate of products.

[0018] The present invention can achieve compatibility with products of different sizes (4 inches, 6 inches, 8 inches, and 12 inches) by connecting to vacuum through different quick connectors, and can ensure that the adsorption area is as large as possible to ensure that the entire product can fit on the table.

[0019] The present invention can also introduce 4 groups of vacuum generators to realize automatic switching of products of different sizes without manual blocking of pipelines and remaining vacuum adsorption holes.

[0020] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a structural schematic diagram of a product cooling partition adsorption rotating stage of a laser processing equipment of the present invention;

[0023] Figure 2 yes Figure 1 A top view of

[0024] Figure 3 yes Figure 1 Top view after removing the cooling adsorption plate.

[0025] The meanings of the various reference numerals in the figures are as follows.

[0026] Cooling adsorption plate 1, water leakage detection line 2, water tray 3, cooling water joint 4, quick joint 5, carrier lower plate 6, rotary motor connecting plate 7, rotary motor 8, base 9, vacuum adsorption chamber 10, detection line fixing block 11. DETAILED DESCRIPTION

[0027] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0028] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0029] like Figure 1 to Figure 3 As shown, a product cooling partition adsorption rotating stage of a laser processing equipment includes a stage lower plate 6, a rotating motor 8 and a base 9. The rotating motor 8 installed on the base 9 drives the upper stage lower plate 6 to rotate through the rotating motor connecting plate 7.

[0030] A cooling adsorption plate 1 is installed on the lower plate 6 of the carrier, cooling water joints 4 are installed at both ends of the cooling adsorption plate 1, and crisscross cooling water channels are arranged in the cooling adsorption plate 1 between the two cooling water joints 4.

[0031] Several vacuum adsorption chambers 10 are sequentially arranged in the lower plate 6 of the stage from the inside to the outside, and a quick connector 5 is installed on the lower plate 6 of the stage at one end of the vacuum adsorption chamber 10. Specifically, four vacuum adsorption chambers 10 are sequentially arranged in the lower plate 6 of the stage from the inside to the outside.

[0032] A water tray 3 is installed on the outer side of the bottom of the lower plate 6 of the stage. A water leakage detection line 2 is installed at the edge of the water tray 3, and the water leakage detection line 2 is fastened by a plurality of detection line fixing blocks 11.

[0033] To solve the problem of heat influence, there are power control systems to control power in real time, and there is also processing under the protection of inert gas to ensure that the material does not react with the air. However, the most direct way is still to use efficient heat dissipation methods to ensure that the product is processed under acceptable and small temperature fluctuations.

[0034] Among various heat dissipation methods, the high specific heat capacity of water makes water cooling have higher heat dissipation efficiency than air cooling. Compared with oil-based refrigerants (such as Freon), it has a safer use environment and simpler mechanical structure. Water cooling has become the first choice for heat dissipation in the laser micromachining industry.

[0035] There are three main types of adsorption carriers commonly used at present. One is to use holes or grooves in metal materials, and vacuum is used to adsorb and fix the product through the holes or grooves. One is to use porous ceramic plates for adsorption and fixation. After the ceramic is sintered, countless tiny pores are formed inside, and vacuum is used to adsorb and fix the product through the pores. The third is to use holes or grooves in quartz glass, and vacuum is used to adsorb and fix the product through the holes or grooves.

[0036] The flatness of the adsorption stage made of metal materials is unstable and is greatly affected by the ambient temperature and the heat generated during processing. When the temperature changes, the flatness of the stage also changes, affecting the cutting size accuracy. The flatness of the adsorption stage made of porous ceramics and quartz is stable and is less affected by the ambient temperature, but it cannot absorb the deformation caused by the heat generated during processing.

[0037] The present invention uses metal materials to make the adsorption carrier, which is provided with through holes, and forms a vacuum adsorption cavity 10 with the sinking space of the lower plate of the carrier for zoned adsorption. The carrier is provided with crisscross cooling water channels, and the temperature of the carrier is kept constant through the circulation of cooling water, so as to ensure that the carrier is not affected by changes in the external environment and the heat generated during processing, and to ensure the flatness of the carrier. Different sized cavities are used to achieve the adsorption of products of sizes such as 4 inches, 6 inches, 8 inches, and 12 inches, without the need to manually block the vacuum through holes, thereby increasing the convenience of product switching.

[0038] The base 9 is installed on the moving platform of the laser processing equipment, the rotating motor 8 is installed on the base 9, the rotating motor connecting plate 7 is connected to the rotating body of the rotating motor 8 by screws, the cooling adsorption plate 1 is connected to the lower plate 6 of the carrier by screws, and the lower plate 6 of the carrier sinks to a certain depth to form a cavity corresponding to the position of products of different sizes. A sealing strip must be installed during connection to ensure that there is no possibility of air leakage between cavities of different sizes. The water tray 3 is connected to the back of the lower plate 6 of the carrier by screws, and the water leakage detection line 2 is fixed at the edge of the water tray 3. The cooling water connector 4 is connected to both sides of the cooling adsorption plate 1, and the remaining openings need to be sealed with plugs to ensure that the cooling water can pass through the inside and take away the heat. The quick connector 5 is connected to the lower plate 6 of the carrier.

[0039] The working principle and working process of the present invention: the flatness of the whole set of fixtures is based on the installation of the base 9, the rotary motor 8, and the rotary motor connecting plate 7, and the flatness is adjusted by the gap plate. The lower plate 6 of the carrier and the cooling adsorption plate 1 are locked and then processed as a whole, and then connected to the rotary motor connecting plate 7 after the flatness is adjusted, finally ensuring that the parallelism of the cooling adsorption plate 1 and the upper surface of the motion platform and the flatness of the cooling adsorption plate 1 are 0.02mm. During operation, the vacuum adsorption area is controlled by switching the 4 different positions of the quick connector 5. It can be compatible with up to 4 types of products of 4 inches, 6 inches, 8 inches, and 12 inches. There is no need to seal the remaining adsorption holes to maintain vacuum when processing small products. The cooling water of the external chiller is introduced into the cooling adsorption plate 1 through the cooling water connector 4. There are through holes that cross and penetrate vertically and horizontally in the cooling adsorption plate 1. The cooling water enters from one side and flows out from the other side, so as to take away the heat generated during processing and reduce the adverse effects on the product.

[0040] The present invention significantly reduces the adverse effects of heat generated by laser processing on products and improves the yield of products. By connecting to vacuum through different quick connectors, compatibility of products of different sizes (4 inches, 6 inches, 8 inches, 12 inches) can be achieved, and the adsorption area can be as large as possible to ensure that the entire product can fit on the table. Four sets of vacuum generators can also be introduced to achieve automatic switching of products of different sizes without manual sealing of pipelines and remaining vacuum adsorption holes.

[0041] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A product cooling partition adsorption rotating stage of laser processing equipment, comprising a stage lower plate (6), a rotating motor (8) and a base (9), wherein the rotating motor (8) mounted on the base (9) drives the upper stage lower plate (6) to rotate through a rotating motor connecting plate (7); characterized in that: A cooling adsorption plate (1) is installed on the lower plate (6) of the carrier, cooling water joints (4) are installed at both ends of the cooling adsorption plate (1), and crisscross cooling water channels are arranged in the cooling adsorption plate (1) between the two cooling water joints (4); A plurality of vacuum adsorption chambers (10) are arranged in sequence from the inside to the outside of the carrier lower plate (6), and a quick connector (5) is installed on the carrier lower plate (6) at one end of the vacuum adsorption chamber (10).

2. The product cooling partition adsorption rotating stage of the laser processing equipment according to claim 1, characterized in that: A water tray (3) is installed on the outer side of the bottom of the lower plate (6) of the carrier.

3. The product cooling partition adsorption rotating stage of the laser processing equipment according to claim 2, characterized in that: A water leakage detection line (2) is installed at the edge of the water receiving tray (3).

4. The product cooling partition adsorption rotating stage of the laser processing equipment according to claim 3, characterized in that: The water leakage detection line (2) is fastened by a plurality of detection line fixing blocks (11).

5. The product cooling partition adsorption rotating stage of the laser processing equipment according to claim 1, characterized in that: Four vacuum adsorption cavities (10) are arranged in sequence from the inside to the outside in the lower plate (6) of the carrier.

6. The product cooling partition adsorption rotating stage of the laser processing equipment according to claim 1, characterized in that: The flatness and upper surface parallelism of the cooling adsorption plate (1) and the lower plate (6) of the carrier are both 0.02 mm.

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