Glue pouring forming method and glue pouring forming device based on thermosetting glue

Abstract

The invention relates to the technical field of glue filling, in particular to a glue filling forming method and device based on thermosetting glue, and aims at reducing the bad defects of glue shortage, bubbles and the like of injection molding products. The glue filling forming method comprises the steps that a workpiece is assembled into a forming cavity of a glue filling mechanism, a glue inlet and a glue outlet which are communicated with the forming cavity are formed in the top of the glue filling mechanism, a glue supplementing container is arranged on the glue filling mechanism, and a glue supplementing opening of the glue supplementing container is communicated with the glue outlet; the forming cavity is vacuumized, and thermosetting glue is poured into the forming cavity through a glue inlet; the forming cavity is subjected to pressurization and curing operation, so that glue pouring forming of the workpiece is completed, and the step of pressurization and curing operation comprises the step of heating the bottom of the forming cavity.

Description

Technical Field

[0001] The present application relates to the technical field of glue potting, and in particular to a glue potting molding method and a glue potting molding device based on thermosetting glue. Background Art

[0002] At present, when a workpiece is injected with glue, for an injection cavity with a complex structure on the workpiece, it is difficult to fill the entire injection cavity with thermosetting glue due to the relatively large viscosity of the thermosetting glue, resulting in defects such as glue deficiency and bubbles in the injection molded product formed in the injection cavity. Summary of the invention

[0003] In view of the above, it is necessary to provide a glue pouring molding method and a glue pouring molding device based on thermosetting glue to reduce the occurrence of defects such as glue shortage and bubbles in injection molded products.

[0004] In a first aspect, an embodiment of the present application provides a glue pouring molding method based on thermosetting glue, comprising: Assemble the workpiece into the molding cavity of the glue pouring mechanism, wherein the top of the glue pouring mechanism is provided with a glue inlet and a glue outlet respectively connected to the molding cavity, and the glue pouring mechanism is provided with a glue replenishing container, and the glue replenishing port of the glue replenishing container is connected to the glue outlet; The molding cavity is vacuumed and thermosetting glue is poured into the molding cavity through the glue inlet; The molding cavity is subjected to a pressurized curing operation to complete the glue injection molding of the workpiece, wherein the step of performing the pressurized curing operation includes heating the bottom of the molding cavity.

[0005] In other possible embodiments, the step of evacuating the molding cavity and injecting thermosetting glue into the molding cavity through the glue inlet includes: The molding cavity is evacuated to a preset vacuum pressure, and glue is simultaneously poured into the molding cavity through the glue inlet; When the thermosetting glue in the glue filling container reaches a preset height, the vacuuming and glue filling operations are stopped.

[0006] In other possible embodiments, the preset vacuum pressure ranges from -100 kPa to -90 kPa.

[0007] In other possible embodiments, the step of pressurizing and curing the molding cavity includes: If the thermal expansion coefficient of the thermosetting glue is less than the set expansion threshold, the molding cavity is vacuumed and heated, and after the bubbles in the molding cavity are removed, the molding cavity is pressurized.

[0008] In other possible embodiments, the step of pressurizing and curing the molding cavity includes: If the thermal expansion coefficient of the thermosetting glue is greater than or equal to the set expansion threshold, the molding cavity is first pressurized and then heated.

[0009] In other possible embodiments, the heating operation step includes: The molding cavity is heated to a set temperature; wherein the set temperature ranges from 90°C to 160°C.

[0010] In other possible embodiments, the step of pressurizing operation includes: The molding cavity is pressurized to a set pressure, wherein the set pressure ranges from 100 kPa to 1.6 MPa.

[0011] In a second aspect, an embodiment of the present application further provides a glue potting molding device, which is applied to any glue potting molding method in the first aspect, comprising: The glue pouring mechanism is provided with a molding cavity, and a glue inlet and a glue outlet respectively connected to the molding cavity are opened on the top of the glue pouring mechanism; The glue filling container is arranged on the glue filling mechanism, and the glue filling port of the glue filling container is connected to the glue outlet; A vacuum glue potting box, used to accommodate the glue potting mechanism equipped with workpieces; The curing and molding box is used to accommodate a glue-filling mechanism equipped with a workpiece and filled with thermosetting glue, wherein the curing and molding box is provided with a bottom heating module to heat the bottom of the glue-filling mechanism.

[0012] In other possible embodiments, the cross-sectional area of ​​the glue replenishing container gradually increases in a direction away from the glue outlet.

[0013] In other possible embodiments, the glue pouring and molding device also includes a vacuum generator and a gas pressurizer. The vacuum port of the vacuum generator and the pressurization port of the gas pressurizer are respectively connected to the curing and molding box. The curing and molding box is also provided with a circumferential heating module and / or a top heating module to perform heating operations on the circumference and / or top of the glue pouring mechanism.

[0014] Beneficial effects of the embodiments of the present application: During the pressurized curing operation of the thermosetting glue, the embodiments of the present application heat the bottom of the molding cavity, increase the fluidity of the glue at the bottom of the molding cavity at the initial stage of heating, and allow the glue to flow to and fill the vacant positions in the molding cavity, while gradually causing the bubbles in the molding cavity to be discharged from bottom to top through heat. In addition, the embodiments of the present application also provide a glue replenishing container on the top of the glue filling mechanism to replenish glue for the vacant positions and bubble positions in the molding cavity, and also provide glue storage space for the overflow glue at the glue outlet, ultimately reducing the occurrence of glue shortages, bubbles and other defects in injection molded products. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1The figure is a schematic flow chart of the glue pouring and molding method based on thermosetting glue according to an embodiment of the present application.

[0016] Figure 2 for Figure 1 The flowchart of step S200 in the glue potting molding method is shown.

[0017] Figure 3 This is a microscopic schematic diagram of the workpiece after glue 1 is poured at different pouring speeds and pressures.

[0018] Figure 4 This is a microscopic schematic diagram of the workpiece after glue 2 is poured at different glue pouring speeds and pressures.

[0019] Figure 5 This is a microscopic diagram of the workpiece after glue 1 is poured at different vacuum values ​​and curing pressures.

[0020] Figure 6 This is a microscopic diagram of the workpiece after glue 2 is poured at different vacuum values ​​and curing pressures.

[0021] Figure 7 This is a schematic diagram of the structure of the glue pouring and molding device according to an embodiment of the present application.

[0022] Description of the main component symbols: glue pouring and molding device 100, glue pouring mechanism 110, glue inlet 110a, glue outlet 110b, glue replenishing container 120, glue replenishing groove 120a, vacuum glue pouring box 130, vacuum generator 140, curing molding box 150, gas pressurizer 160. DETAILED DESCRIPTION

[0023] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] The following is a detailed description of various embodiments of the present invention in conjunction with the accompanying drawings.

[0026] See also Figure 1 The present application provides a method for glue pouring and molding based on thermosetting glue, comprising: S100, assembling the workpiece into the molding cavity of the glue pouring mechanism, wherein the top of the glue pouring mechanism is provided with a glue inlet and a glue outlet respectively connected to the molding cavity, and the glue pouring mechanism is provided with a glue replenishing container, and the glue replenishing port of the glue replenishing container is connected to the glue outlet.

[0027] Specifically, the glue filling container may be provided with a glue filling groove, which runs through the glue filling container in the vertical direction, and a glue filling port is formed at the bottom of the glue filling groove. In the vertical direction, the height of the glue filling groove is greater than the height of the molding cavity, so that the glue liquid in the glue filling container can automatically complete the glue filling operation. Of course, the glue filling container can also use a booster pump to pump the glue liquid into the molding cavity. At this time, it is not required that the height of the glue filling groove must be greater than the height of the molding cavity.

[0028] Specifically, the viscosity of the thermosetting glue used in the glue casting method can range from 10000 cps to 100000 cps. In practical applications, a thermosetting glue with any viscosity of 10000 cps, 20000 cps, 40000 cps, 60000 cps, 80000 cps, or 100000 cps can be selected according to actual needs.

[0029] It should be noted that the glue pouring mechanism refers to a mold used to assemble workpieces and contain thermosetting glue. The glue pouring mechanism can be in an expanded state when assembling workpieces and in a closed state after assembling the workpieces. The vertical direction mentioned above is the direction of gravity. In the natural state, the top surface of the glue pouring mechanism along the direction of gravity is the top of the glue pouring mechanism, and the bottom surface of the glue pouring mechanism along the direction of gravity is the bottom of the glue pouring mechanism.

[0030] In practical applications, the glue filling mechanism can be provided with one or more glue inlets and glue outlets according to actual needs to improve the glue filling efficiency of the molding cavity. The number of the glue filling containers is the same as the number of the glue outlets and corresponds one to one.

[0031] S200, the molding cavity is vacuumed and thermosetting glue is poured into the molding cavity through a glue inlet.

[0032] Specifically, vacuuming the molding cavity can form a pressure difference between the inside and outside of the molding cavity, which is conducive to promoting the full filling of the thermosetting glue into the injection cavity of the workpiece. Among them, a glue injection machine can be used to inject the thermosetting glue into the molding cavity through the glue inlet.

[0033] Specifically, there are two types of vacuuming operations on the molding cavity. One is to place the entire glue pouring mechanism in a closed space and perform a vacuuming operation on the closed space to form a vacuum state in the molding cavity. The other is to perform a vacuuming operation on the molding cavity while ensuring that the surrounding sides of the glue pouring mechanism are in a completely sealed state to form a vacuum state in the molding cavity.

[0034] S300, performing a pressurized curing operation on the molding cavity to complete the glue injection molding of the workpiece, wherein the step of performing the pressurized curing operation includes heating the bottom of the molding cavity.

[0035] Specifically, thermosetting glue has high viscosity and poor fluidity, which makes it difficult for thermosetting glue to flow spontaneously to all injection positions in the molding cavity, resulting in glue shortage defects on the injection molded products. Normal pressure curing cannot effectively solve the glue shortage problem in the injection cavity. Pressurizing the molding cavity is conducive to improving the fluidity of thermosetting glue during the curing process and promoting the flow of thermosetting glue to the glue shortage position in the injection cavity.

[0036] In addition, the viscosity of thermosetting glue before curing generally decreases as the temperature rises, and generally speaking, the higher the temperature, the faster the thermosetting glue cures. Heating the bottom of the molding cavity can gradually reduce the temperature in the molding cavity from the bottom to the top of the molding cavity, so that the thermosetting glue in the molding cavity is cured layer by layer from the bottom of the molding cavity to the glue outlet. Since the temperature at the bottom of the molding cavity is higher, the bubbles closer to the bottom of the molding cavity are heated and expanded earlier, and float out of the glue surface from the bottom of the molding cavity earlier, which ultimately reduces the bubble defects inside the injection molded product.

[0037] In the above-mentioned glue pouring molding method, the glue inlet and the glue outlet are both arranged at the top of the glue pouring mechanism, and the bottom of the molding cavity is heated, so that before the thermosetting glue is solidified, the pressure applied to the molding cavity can act on the thermosetting glue in the molding cavity through the glue inlet and the glue outlet. The continuous pressure applied to the thermosetting glue in the molding cavity can inhibit the expansion of the thermosetting glue and compress the volume of the bubbles generated by the thermosetting glue, thereby facilitating the thermosetting glue to fill the glue-deficient parts of the workpiece.

[0038] In practical applications, there are two ways to heat the bottom of the molding cavity. One is to place the glue filling mechanism equipped with the workpiece and thermosetting glue as a whole in a closed space, and heat the bottom of the closed space to heat the bottom of the molding cavity. The other is to set a heating component at the bottom of the molding cavity to heat the bottom of the molding cavity.

[0039] See also Figure 2In order to shorten the glue pouring time and improve the glue pouring efficiency of the molding cavity, step S200 in the embodiment of the present application performs a vacuum operation on the molding cavity, and pours thermosetting glue into the molding cavity through the glue inlet, which specifically includes steps S210 to S220.

[0040] S210, evacuating the molding cavity to a preset vacuum pressure, and simultaneously pouring glue into the molding cavity through the glue inlet.

[0041] Specifically, the setting value of the preset vacuum pressure may be determined based on the volume of the molding cavity and the viscosity of the thermosetting glue.

[0042] S220, when the thermosetting glue in the glue filling container reaches a preset height, the vacuuming and glue filling operations are stopped.

[0043] Specifically, the setting value of the preset height can be determined based on the volume of the molding cavity and the viscosity of the thermosetting glue. There are two ways to determine whether the thermosetting glue in the glue filling container has reached the preset height: one is to set the glue filling container as a light-transmitting structure to determine whether the thermosetting glue in the glue filling container has reached the preset height; the other is to set a sensor in the glue filling groove of the glue filling container. The sensor can be set at a preset height of the glue filling container to issue a warning message when the thermosetting glue in the glue filling container reaches the preset height. Exemplarily, the warning message can be a voice reminder or an alarm sound.

[0044] In practical applications, the vacuuming and glue filling operations can be stopped simultaneously to prevent the thermosetting glue from overflowing from the glue filling container.

[0045] In this embodiment, the defects of the injection molded product are mainly distributed on the surface and cracks of the injection molding area. In order to verify the effect of vacuum glue pouring, this embodiment uses glue 1 and glue 2 with different viscosities to compare the glue pouring effects of using step S200 and not using step S200. For details, please refer to Figure 3 and Figure 4 , Figure 3 (a) and (b) are respectively the surface microscopic diagram and crack microscopic diagram of the workpiece after the glue 1 is poured at a pouring speed of 0.8 mL / min and under normal pressure. Figure 3 (c) and (d) are the surface microscopic diagrams and crack microscopic diagrams of the workpiece after glue 1 was poured at a pouring speed of 4 mL / min and a vacuum value of -90 kPa, respectively. Figure 4 (a) and (b) are respectively the surface microscopic diagram and crack microscopic diagram of the workpiece after glue 2 was poured at a pouring speed of 0.8 mL / min and under normal pressure. Figure 4 (c) and (d) are the surface microscopic diagrams and crack microscopic diagrams of the workpiece after glue 2 was poured at a pouring speed of 4 mL / min and a vacuum value of -90 kPa, respectively.

[0046] Depend on Figure 3 and Figure 4 It can be clearly seen that the method of vacuuming and pouring glue at the same time significantly improves the filling rate of the thermosetting glue on the surface and cracks of the injection cavity.

[0047] In practical applications, the preset vacuum pressure ranges from -100 kPa to -90 kPa. Specifically, the preset vacuum pressure may be any one of -100 kPa, -98 kPa, -96 kPa, -94 kPa, -92 kPa, and -90 kPa.

[0048] Therefore, by reasonably configuring the preset vacuum pressure value range, the flow rate of the thermosetting glue can be increased while avoiding damage to the glue filling mechanism and the workpiece.

[0049] For some thermosetting glues with a small thermal expansion coefficient, in order to improve the pressurized curing efficiency of the molding cavity, the step of pressurizing and curing the molding cavity in step S300 includes step S310.

[0050] S310, if the thermal expansion coefficient of the thermosetting glue is less than the set expansion threshold, the molding cavity is vacuumed and heated, and after removing the bubbles in the molding cavity, the molding cavity is pressurized.

[0051] Specifically, if the thermal expansion coefficient of the thermosetting glue is less than the set expansion threshold, it means that the thermosetting glue is not easy to expand when heated. The molding cavity can be vacuumed and heated first to ensure that the thermosetting glue in the molding cavity has a sufficient curing rate.

[0052] There are two ways to confirm the removal of bubbles in the molding cavity: one is to set a preset operation time for vacuuming and heating the molding cavity based on the product formed by multiple injection molding, that is, after the vacuuming and heating operations on the molding cavity reach the preset operation time, the molding cavity is pressurized; the other is to set the structure of the molding cavity to a light-transmitting structure, and after observing that there are no bubbles in the molding cavity, the molding cavity is pressurized.

[0053] For some thermosetting glues with a large expansion coefficient, in order to improve the pressurized curing efficiency of the molding cavity, the step of pressurizing and curing the molding cavity in step S300 includes step S320.

[0054] S320, if the thermal expansion coefficient of the thermosetting glue is greater than or equal to the set expansion threshold, the molding cavity is first pressurized and then heated.

[0055] Specifically, if the thermal expansion coefficient of the thermosetting glue is greater than or equal to the set expansion threshold, it means that the thermosetting glue is easy to expand when heated. The molding cavity can be vacuumed first to ensure that the thermosetting glue in the molding cavity has a sufficient filling rate for the structural holes.

[0056] In this embodiment, glue 1 and glue 2 with different viscosities are used to compare the glue pouring effects of the pressurized curing operation in step S300 and the pressurized curing operation not in step S300. Figure 5 and Figure 6 , Figure 5 (a) and (b) are respectively the surface microscopic diagram and crack microscopic diagram of the workpiece after glue 1 is filled at a vacuum value of -90 kPa and no pressure is applied. Figure 5 (c) and (d) are the surface microscopic diagrams and crack microscopic diagrams of the workpiece after glue 1 was poured under a vacuum value of -90 kPa and a curing pressure of 0.7 MPa, respectively. Figure 6 (a) and (b) are respectively the surface microscopic diagram and crack microscopic diagram of the workpiece after glue 2 is poured under the vacuum value of -90kPa and no pressure is applied. Figure 6 (c) and (d) are the surface microscopic diagrams and crack microscopic diagrams of the workpiece after glue 2 was poured under a vacuum value of -90 kPa and a curing pressure of 0.7 MPa, respectively.

[0057] Depend on Figure 5 and Figure 6 It can be clearly seen that the use of pressurized curing significantly reduces the occurrence of glue deficiency on the surface and cracks of the workpiece.

[0058] In order to improve the curing rate of the thermosetting glue while avoiding damage to the glue injection mechanism and the workpiece, in some embodiments, the heating operation step includes: heating the molding cavity to a set temperature; wherein the set temperature ranges from 90°C to 160°C. Exemplarily, the set temperature can be any one of 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, 150°C, and 160°C.

[0059] Specifically, the value range of the set temperature can be determined based on the type of thermosetting glue and the material of the glue filling mechanism and the workpiece.

[0060] In order to improve the bonding strength between the thermosetting glue and the workpiece while avoiding damage to the glue injection mechanism and the workpiece, in some embodiments, the step of pressurizing includes: pressurizing the molding cavity to a set pressure; wherein the set pressure ranges from 100 kPa to 1.6 MPa. Exemplarily, the set pressure can be any one of 100 kPa, 500 kPa, 0.7 MPa, 1.0 MPa, 1.2 MPa, 1.4 MPa, and 1.6 MPa.

[0061] Specifically, the value range of the set pressure can be determined based on the type of thermosetting glue and the material of the glue injection mechanism and the workpiece.

[0062] In order to better compare the application scope and effect of the glue pouring molding method of the present application, the embodiment of the present application also adopts the above-mentioned glue pouring molding method to compare the glue pouring of workpieces made of different metal materials with two glues 1 and 2 with different viscosities. For details, please refer to Table 1.

[0063] As can be seen from Table 1, the glue filling rate of workpieces made of different glues and different metals is significantly improved by using the above glue filling molding method.

[0064] See also Figure 7 The embodiment of the present application also provides a glue pouring molding device 100, which is applied to the glue pouring molding method implemented above, including a glue pouring mechanism 110, a glue replenishing container 120, a vacuum glue pouring box 130 and a curing molding box 150. The glue pouring molding device 100 and the above glue pouring molding method are applicable to the same thermosetting glue and workpiece.

[0065] Specifically, the glue filling mechanism 110 is provided with a molding cavity, and the top of the glue filling mechanism 110 is provided with a glue inlet 110a and a glue outlet 110b respectively connected to the molding cavity. The glue filling container 120 is provided at the glue filling mechanism 110, and the glue filling port of the glue filling container 120 is connected to the glue outlet 110b. Exemplarily, the glue filling container 120 is provided with a glue filling groove 120a, and the glue filling groove 120a penetrates the glue filling container 120 in the vertical direction, and the bottom of the glue filling groove 120a forms a glue filling port, and in the vertical direction, the height of the glue filling groove 120a is greater than the height of the molding cavity, and the vacuum glue filling box 130 is used to accommodate the glue filling mechanism 110 equipped with the workpiece. The vacuum glue filling box 130 is used to perform the above step S200, and the curing molding box 150 is used to accommodate the glue filling mechanism 110 equipped with the workpiece and filled with thermosetting glue, wherein the curing molding box 150 is provided with a bottom heating module to heat the bottom of the glue filling mechanism 110.

[0066] In practical applications, the glue inlet 110a and the glue outlet 110b in the glue pouring molding device 100 can be multiple to improve the glue pouring efficiency of the molding cavity. The number of the glue replenishing containers 120 in the glue pouring molding device 100 is the same as the number of the glue outlets 110b and corresponds one to one.

[0067] See also Figure 7 In some embodiments, the cross-sectional area of ​​the glue replenishing container 120 gradually increases in the direction away from the glue outlet 110b. Specifically, the radial cross-sectional area of ​​the glue replenishing groove 120a gradually increases in the direction away from the glue outlet 110b. Exemplarily, the glue replenishing container 120 is generally in a conical structure.

[0068] Therefore, through the above arrangement, it is not only convenient to connect the glue filling container 120 with the glue outlet 110b, but also the thermosetting glue in the glue filling groove 120a forms pressure on the connection between the glue filling container 120 and the glue outlet 110b according to its own gravity, which is conducive to the automatic return of the thermosetting glue in the glue filling groove 120a to the molding cavity.

[0069] To facilitate the execution of the above step S300, the glue potting device 100 further includes a vacuum generator 140 and a gas pressurizer 160. The vacuum port of the vacuum generator 140 and the pressurization port of the gas pressurizer 160 are respectively connected to the curing molding box 150 to perform vacuuming and pressurizing operations on the curing molding box 150, so that a vacuum and pressurized state are formed in the curing molding box 150.

[0070] In addition, in order to simplify the vacuum glue potting box 130 , a vacuum generator 140 may be provided to communicate with the vacuum glue potting box 130 so as to perform a vacuum operation on the vacuum glue potting box 130 .

[0071] Furthermore, in order to improve the efficiency of curing and molding, a circumferential heating module and / or a top heating module are also provided in the curing and molding box 150 to perform heating operations on the circumference and / or the top of the glue filling mechanism 110 .

[0072] To facilitate the execution of the above step S220 , in some embodiments, the vacuum glue filling box 130 is a light-transmitting structure to observe the height of the thermosetting glue in the glue filling container 120 .

[0073] Therefore, the vacuum glue potting box 130 with a light-transmitting structure can reduce the difficulty of performing the above step S220.

[0074] In the above-mentioned glue pouring molding method and glue pouring molding device 100, during the pressurized curing operation of the thermosetting glue, the bottom of the molding cavity is heated to increase the fluidity of the glue at the bottom of the molding cavity in the initial stage of heating, so that the glue can flow to and fill the vacant positions in the molding cavity, and at the same time, the bubbles in the molding cavity are gradually discharged from the bottom to the top through the heat; in addition, the embodiment of the present application also provides a glue replenishing container 120 on the top of the glue pouring mechanism 110 to replenish glue for the vacant positions and bubble positions in the molding cavity, and at the same time, it can also provide a glue storage space for the overflow glue at the glue outlet 110b, thereby ultimately reducing the occurrence of defects such as glue shortage and bubbles in the injection molded products.

[0075] It is obvious to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A glue pouring molding method based on thermosetting glue, characterized in that: include: Assemble the workpiece into the molding cavity of the glue filling mechanism, wherein the top of the glue filling mechanism is provided with a glue inlet and a glue outlet respectively connected to the molding cavity, and the glue filling container is provided on the glue filling mechanism, and the glue filling port of the glue filling container is connected to the glue outlet; The molding cavity is vacuumed, and thermosetting glue is poured into the molding cavity through the glue inlet; The molding cavity is subjected to a pressurized curing operation to complete the glue-injection molding of the workpiece, wherein the step of performing the pressurized curing operation includes heating the bottom of the molding cavity.

2. The glue pouring molding method according to claim 1, characterized in that: The step of evacuating the molding cavity and injecting thermosetting glue into the molding cavity through the glue inlet comprises: The molding cavity is evacuated to a preset vacuum pressure, and glue is simultaneously poured into the molding cavity through the glue inlet; When the thermosetting glue in the glue filling container reaches a preset height, the vacuuming and glue filling operations are stopped.

3. The glue pouring molding method according to claim 2, characterized in that: The preset vacuum pressure ranges from -100 kPa to -90 kPa.

4. The glue pouring molding method according to claim 1, characterized in that: The step of pressurizing and curing the molding cavity comprises: If the thermal expansion coefficient of the thermosetting glue is less than the set expansion threshold, the molding cavity is vacuumed and heated, and after the bubbles in the molding cavity are removed, the molding cavity is pressurized.

5. The glue pouring molding method according to claim 1, characterized in that: The step of pressurizing and curing the molding cavity comprises: If the thermal expansion coefficient of the thermosetting glue is greater than or equal to the set expansion threshold, the molding cavity is first pressurized and then heated.

6. The glue pouring molding method according to claim 4 or 5, characterized in that: The steps of the heating operation include: The molding cavity is heated to a set temperature; wherein the set temperature ranges from 90°C to 160°C.

7. The glue pouring molding method according to claim 4 or 5, characterized in that: The steps of the pressurization operation include: The molding cavity is pressurized to a set pressure; wherein the set pressure ranges from 100 kPa to 1.6 MPa.

8. A glue pouring molding device, applied to the glue pouring molding method according to any one of claims 1 to 7, characterized in that: include: The glue pouring mechanism is provided with the molding cavity, and the top of the glue pouring mechanism is provided with the glue inlet and the glue outlet respectively connected to the molding cavity; The glue replenishing container is arranged on the glue filling mechanism, and the glue replenishing port of the glue replenishing container is connected to the glue outlet; A vacuum glue pouring box, used to accommodate the glue pouring mechanism equipped with the workpiece; The curing and molding box is used to accommodate the glue pouring mechanism equipped with the workpiece and filled with thermosetting glue, wherein the curing and molding box is provided with a bottom heating module to heat the bottom of the glue pouring mechanism.

9. The glue pouring molding device according to claim 8, characterized in that: The cross-sectional area of ​​the glue replenishing container gradually increases in a direction away from the glue outlet.

10. The glue pouring molding device according to claim 8, characterized in that: The glue pouring and molding device also includes a vacuum generator and a gas pressurizer. The vacuum port of the vacuum generator and the pressurization port of the gas pressurizer are respectively connected to the curing and molding box. The curing and molding box is also provided with a circumferential heating module and / or a top heating module to heat the circumference and / or the top of the glue pouring mechanism.

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