Method for improving forming quality of hard anodic oxide film

Abstract

The invention relates to the technical field of surface treatment, in particular to a method for improving the forming quality of a hard anodic oxide film. The method for improving the forming quality of the hard anodic oxide film comprises the steps that S100, a base material is machined; s200, the roughness of the surface of the machined base material is measured; s300, whether the measured roughness is smaller than a preset roughness value or not is judged, if not, the step S400 is executed, and then the step S300 is executed; if yes, executing the step S500; s400, the base material is subjected to grinding treatment; and S500, the base material is subjected to hard anodic oxidation treatment, it can be guaranteed that the roughness of the base material subjected to hard anodic oxidation treatment is smaller than a preset roughness value, and it is avoided that when the surface roughness of the base material is large, the porosity of an anodic oxide film obtained by conducting hard anodic oxidation treatment on the base material is increased, and the service life of the anodic oxide film is prolonged. Therefore, the anode oxide film with uniform thickness, high hardness and good corrosion resistance is obtained, the quality and performance of the anode oxide film are improved, and the performance of a metal material is improved.

Description

Technical Field

[0001] The invention relates to the technical field of surface treatment, in particular to a method for improving the quality of forming a hard anodized film. Background Art

[0002] Hard anodizing is the process of forming an oxide film on the metal surface through electrolytic oxidation. The specific process is to place the metal material or other substrate as the anode in the electrolytic cell, pass a direct current, and make the electrolyte in the electrolyte react with the metal anode to form an oxide layer. This oxide film has high hardness and density, which can effectively prevent the metal material from being corroded and worn.

[0003] The substrate usually needs to be machined before hard anodizing. After machining, tiny grooves and microscopic protrusions will be left on the surface of the substrate, which have a great influence on the formation of the anodized film. When the surface roughness of the substrate is large, the porosity of the anodized film will also increase, resulting in greater non-uniformity of the film layer, thus affecting the quality and performance of the anodized film.

[0004] Therefore, there is an urgent need for a method for improving the quality of hard anodized film formation to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a method for improving the quality of hard anodized film formation, by reducing the roughness of the substrate in the machining process before hard anodizing to obtain an anodized film with uniform thickness, high hardness and good corrosion resistance, thereby improving the quality of the hard anodized film and further improving the performance of the metal material.

[0006] In order to achieve the above objectives, the following technical solutions are provided:

[0007] Methods for improving the quality of hard anodized film formation include:

[0008] S100, machining the substrate;

[0009] S200, measuring the roughness of the surface of the machined substrate;

[0010] S300, determining whether the measured roughness is less than a preset roughness value, if not, executing step S400 and then going to step S300; if yes, executing step S500;

[0011] S400, grinding the substrate;

[0012] S500, performing hard anodizing treatment on the substrate.

[0013] As an optional solution, in step S100 , a tool is selected according to the material of the substrate and the machining method.

[0014] As an optional solution, the tool is a ball-end PCD diamond milling cutter.

[0015] As an optional solution, in step S100, during the machining of the substrate, a cooling liquid is sprayed on the machining part.

[0016] As an optional solution, the preset roughness value is 0.4 μm.

[0017] As an optional solution, after step S500, the method further includes:

[0018] The thickness of the anodized film obtained by hard anodizing the substrate is detected.

[0019] As an alternative, the thickness of the anodized film is greater than or equal to 40 μm and less than or equal to 60 μm.

[0020] As an optional solution, in step S400, the step of grinding the substrate includes dry grinding and wet grinding.

[0021] As an option, the dry grinding includes dry grinding the substrate using a pneumatic grinder.

[0022] As an optional solution, the wet grinding includes adding a polishing liquid and using a tool to wet grind the substrate.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The method for improving the quality of hard anodized film formation provided by the present invention can ensure that the roughness of the substrate subjected to hard anodizing treatment is less than a preset roughness value, thereby avoiding an increase in the porosity of the anodized film obtained by hard anodizing the substrate when the surface roughness of the substrate is large, thereby avoiding an increase in the non-uniformity of the anodized film, so as to obtain an anodized film with uniform thickness, high hardness and good corrosion resistance, thereby improving the quality and performance of the anodized film, and further improving the performance of the metal material. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0026] Figure 1 A schematic structural diagram of a method for improving the quality of hard anodized film formation provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0029] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0031] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0033] like Figure 1 As shown, this embodiment provides a method for improving the quality of hard anodized film formation, comprising the following steps:

[0034] S100, machining the substrate;

[0035] S200, measuring the roughness of the surface of the machined substrate;

[0036] S300, determining whether the measured roughness is less than a preset roughness value, if not, executing step S400 and then going to step S300; if yes, executing step S500;

[0037] S400, grinding the substrate;

[0038] S500, performing hard anodizing treatment on the substrate.

[0039] The above steps ensure that the roughness of the substrate subjected to hard anodizing treatment is less than the preset roughness value, so as to avoid the increase in the porosity of the anodized film obtained by hard anodizing the substrate when the surface roughness of the substrate is large, thereby avoiding the increase in the non-uniformity of the anodized film, so as to obtain an anodized film with uniform thickness, high hardness and good corrosion resistance, thereby improving the quality and performance of the anodized film, and then improving the performance of the metal material.

[0040] It should be noted that measuring the roughness of the surface of the substrate is a prior art. In step S200, any roughness measuring instrument that can achieve the above function can be selected.

[0041] Optionally, in step S100 , a tool is selected according to the material of the substrate and the machining method, and the tool is reasonably selected according to the hardness of the material of the substrate, thereby reducing the roughness of the substrate as much as possible during the machining process.

[0042] In this embodiment, the material of the substrate is aluminum, and the tool is a ball-end PCD diamond milling cutter. The ball-end PCD diamond milling cutter can reduce the cutting force and reduce the burrs of the surface milling, thereby achieving a lower roughness on the surface of the substrate.

[0043] Optionally, in step S100, during machining of the substrate, a coolant is sprayed on the processing part. The use of the coolant can help reduce the temperature of the surface when processing the substrate, reduce friction and wear, and thus obtain a lower roughness. At the same time, the selection of the coolant can also affect the surface quality of the substrate, and it is necessary to select a suitable coolant according to the material of the substrate and the processing environment. In addition, the roughness of the substrate can also be reduced to a certain extent by reasonably selecting the cutting speed and the chip depth. Among them, selecting a suitable coolant according to the material of the substrate and the processing environment, and reasonably selecting the cutting speed and the chip depth are prior art, and this embodiment will not be specifically repeated.

[0044] Optionally, the preset roughness value is 0.4 μm. When the surface roughness of the substrate is less than 0.4 μm, the anodized film obtained by hard anodizing the substrate has uniform thickness, high hardness and good corrosion resistance.

[0045] Optionally, after step S500, the process further includes detecting the thickness of the anodized film obtained by hard anodizing the substrate. By detecting the thickness of the anodized film, the actual thickness of the anodized film can be monitored and recorded to provide a reference for evaluating the formation quality of the anodized film.

[0046] Optionally, the Particle value on the surface of the anodized film obtained by hard anodizing the substrate is detected to monitor and record the actual Particle value of the anodized film, providing a reference for evaluating the formation quality of the anodized film.

[0047] Optionally, the thickness of the anodized film is greater than or equal to 40 μm and less than or equal to 60 μm. The anodized film within the above thickness range has uniform thickness, high hardness, and good corrosion resistance, and can meet use requirements.

[0048] Optionally, in step S400, the step of grinding the substrate includes dry grinding and wet grinding to reduce the roughness of the surface of the substrate.

[0049] Optionally, dry grinding includes dry grinding the substrate using a pneumatic grinder. Dry grinding using a pneumatic grinder can more effectively and intuitively observe whether the roughness of the substrate surface is reduced.

[0050] Optionally, wet grinding includes adding a polishing liquid and using a tool to wet grind the substrate. Specifically, the polishing liquid is selected from an existing neutral polishing liquid to avoid corrosion to the substrate. Wet grinding can reduce the high temperature generated during grinding and can also make the surface of the substrate more delicate, so as to reduce the roughness of the substrate before hard anodizing.

[0051] Optionally, before the substrate is subjected to hard anodizing treatment, the following steps are further included:

[0052] Soak the substrate in pure water;

[0053] Specifically, the substrate is immersed in pure water for 0.5h-1h, the substrate with a surface roughness less than a preset roughness value is immersed in pure water, and then the surface of the product is rinsed with a water gun to ensure the cleanliness of the substrate surface.

[0054] Optionally, after the substrate is immersed in pure water and before the hard anodizing treatment, the following steps are further included:

[0055] Blow dry the moisture on the surface of the substrate.

[0056] Use compressed dry air to dry the moisture on the surface of the substrate to ensure that the surface of the substrate is dry.

[0057] Note that in the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] The above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for improving the quality of hard anodized film formation, characterized in that: include: S100, machining the substrate; S200, measuring the roughness of the surface of the machined substrate; S300, determining whether the measured roughness is less than a preset roughness value, if not, executing step S400 and then going to step S300; If yes, execute step S500; S400, grinding the substrate; S500, performing hard anodizing treatment on the substrate.

2. The method for improving the quality of hard anodized film formation according to claim 1, characterized in that: In step S100 , a tool is selected according to the material of the substrate and the machining method.

3. The method for improving the quality of hard anodized film formation according to claim 2, characterized in that: The tool is a ball-end PCD diamond milling cutter.

4. The method for improving the quality of hard anodized film formation according to claim 1, characterized in that: In step S100, during machining of the substrate, a cooling liquid is sprayed on a machining location.

5. The method for improving the quality of hard anodized film formation according to claim 1, characterized in that: The preset roughness value is 0.4 μm.

6. The method for improving the quality of hard anodized film formation according to any one of claims 1 to 5, characterized in that: After step S500, the method further includes: The thickness of the anodized film obtained by hard anodizing the substrate is detected.

7. The method for improving the quality of hard anodized film formation according to claim 6, characterized in that: The thickness of the anodized film is greater than or equal to 40 μm and less than or equal to 60 μm.

8. The method for improving the quality of hard anodized film formation according to any one of claims 1 to 5, characterized in that: In step S400, the step of grinding the substrate includes dry grinding and wet grinding.

9. The method for improving the quality of hard anodized film formation according to claim 8, characterized in that: The dry grinding includes dry grinding the substrate using an air-powered grinder.

10. The method for improving the quality of hard anodized film formation according to claim 8, characterized in that: The wet grinding includes adding a polishing liquid and using a tool to wet grind the substrate.

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