Thermal field assembly, cavity assembly and reaction furnace

Abstract

The invention relates to the technical field of photovoltaics and semiconductors, in particular to a thermal field assembly, a cavity assembly and a reaction furnace, and solves the problem that a cavity in the related technology cannot be rapidly cooled. The thermal field assembly is configured to heat or cool the chamber. The thermal field assembly comprises at least one heating piece and at least one lead, the heating piece is provided with a first through hole, and the first through hole is configured to allow a cooling medium to pass through so as to cool the heating piece through the cooling medium. The lead penetrates into the first through hole, the first end of the lead is connected with the heating piece, and the second end of the lead is connected with the power supply, so that the heating piece can be electrified to generate heat. As the heating element of the thermal field assembly is provided with the first through hole, the cooling medium can cool the heating element through the first through hole and take away heat in the cavity, so that rapid cooling of the cavity is realized.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic and semiconductor technology, and in particular to a thermal field component, a cavity component and a reaction furnace. Background Art

[0002] The manufacturing processes of semiconductor and photovoltaic products include texturing, diffusion, oxidation, etching, coating, screen printing and sintering. Specific manufacturing processes usually need to be carried out in a specific reactor under specific temperature conditions. In particular, a certain manufacturing process of a product needs to be carried out under several different temperature conditions, so the chamber of the reactor needs to heat up and cool down quickly. However, the chamber in the related art cannot achieve rapid cooling. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a thermal field assembly, a cavity assembly and a reaction furnace, which solve the problem that the chamber of the related art cannot be cooled down quickly.

[0004] In a first aspect, an embodiment of the present application provides a thermal field assembly configured to heat or cool a chamber; wherein the thermal field assembly includes: at least one heating element having a first through hole, wherein the first through hole is configured to allow a cooling medium to pass through so as to utilize the cooling medium to cool the heating element; at least one lead wire is inserted into the first through hole, wherein a first end of the lead wire is connected to the heating element, and a second end of the lead wire is connected to a power source so that the heating element can be energized to generate heat.

[0005] In combination with the first aspect, in certain implementations of the first aspect, the heating element includes: a casting portion having the first through hole, the casting portion being made of an insulating material; at least one heating portion being wrapped by the casting portion to prevent the heating portion from being exposed; wherein the lead wire penetrates into the first through hole, passes through the casting portion, and is electrically connected to the heating portion.

[0006] In combination with the first aspect, in certain implementations of the first aspect, there are multiple heating parts, and the multiple heating parts are arranged at intervals along the extension direction of the first through hole; there are multiple lead wires, and the second ends of the multiple lead wires are all connected to a power source, and the first ends of the multiple lead wires penetrate into the first through hole, pass through the casting part, and are electrically connected to the multiple heating parts respectively, so that the multiple heating parts are energized through the multiple lead wires, so that the multiple heating parts generate heat respectively.

[0007] In combination with the first aspect, in some implementations of the first aspect, the heating portion includes: a heating wire, the heating wire is spiral, and an axis of the spiral heating wire is colinear with an axis of the first through hole.

[0008] In combination with the first aspect, in some implementations of the first aspect, the thermal field assembly further includes: an insulating tube, wrapping the lead; wherein the material of the insulating tube includes any at least one of the following materials: ceramic, glass, quartz.

[0009] In a second aspect, an embodiment of the present application provides a cavity assembly, comprising: a cavity having a chamber; and at least one thermal field assembly as described in the first aspect, disposed in the chamber and configured to heat or cool the chamber.

[0010] In combination with the second aspect, in certain implementations of the second aspect, the cavity includes: a main body having the cavity; at least one protective member connected to the main body and disposed in the cavity, the protective member having a second through hole; wherein the thermal field component is disposed in the second through hole to prevent the thermal field component from being exposed to the cavity.

[0011] In combination with the second aspect, in certain implementations of the second aspect, the material of the protective member includes at least one of the following materials: metal, silicon carbide, quartz, and ceramic; wherein, when the material of the protective member includes metal, the surface of the protective member has an insulating layer.

[0012] In combination with the second aspect, in certain implementations of the second aspect, the chamber has an axis, and the axis of the chamber is parallel to the axis of the second through hole; there are multiple protective members, and the multiple protective members are arranged circumferentially along the axis of the chamber; wherein there are multiple thermal field components, and at least one thermal field component is arranged in the second through hole of each protective member.

[0013] In combination with the second aspect, in certain implementations of the second aspect, two thermal field components are arranged in the second through hole of each of the protective members, and the two thermal field components are arranged along the extension direction of the second through hole; wherein, the lead of the thermal field component close to the first end of the second through hole is led out from the first end of the second through hole, and the lead of the thermal field component close to the second end of the second through hole is led out from the second end of the second through hole.

[0014] In combination with the second aspect, in certain implementations of the second aspect, the main body includes: at least one first cooling medium inlet and outlet, connecting the first end of the second through hole with the outside; at least one second cooling medium inlet and outlet, connecting the second end of the second through hole with a ventilation device, so that the ventilation device assists the cooling medium to enter from the first cooling medium inlet and outlet, flow through the second through hole, and flow out from the second cooling medium inlet and outlet, or so that the ventilation device assists the cooling medium to enter from the second cooling medium inlet and outlet, flow through the second through hole, and flow out from the first cooling medium inlet and outlet.

[0015] In combination with the second aspect, in certain implementations of the second aspect, the main body has a feed port at the first end in the extension direction of the chamber, and the main body has a cooling medium channel at the second end in the extension direction of the chamber: wherein the number of the protective members is multiple, the second cooling medium inlet and outlet connect the first end of the cooling medium channel with the ventilation device, and the second end of the cooling medium channel connects the second end of the second through holes of each of the multiple protective members; wherein the number of the first cooling medium inlet and outlet is multiple, and the multiple first cooling medium inlets and outlets respectively connect the first end of the second through holes of each of the multiple protective members with the outside world.

[0016] In combination with the second aspect, in certain implementations of the second aspect, the main body has a feed port at the first end in the extension direction of the chamber, the feed port connects the chamber with the outside world, and the first end of the main body is provided with at least one threaded portion; the cavity assembly also includes: an insulating blocking member, which is arranged at the first end of the main body and abuts against an end of the thermal field assembly located in the second through hole and close to the first end of the main body, wherein the insulating blocking member has a third through hole and a fourth through hole, and the third through hole is configured for the lead of the thermal field assembly to pass through; a locking member, which abuts against a side of the insulating blocking member away from the main body, passes through the fourth through hole, and is threadedly connected to the threaded portion.

[0017] In combination with the second aspect, in some implementations of the second aspect, the cavity assembly further includes: a heat preservation component, which is disposed between the body and the protection component and is configured to reduce the loss of heat generated by the thermal field assembly.

[0018] In the third aspect, an embodiment of the present application provides a reaction furnace, comprising: the cavity assembly described in the second aspect, the cavity assembly having a feed port connecting the chamber of the cavity assembly with the outside, the feed port being configured to allow products to enter and exit the chamber; and a furnace door configured to open or close the feed port.

[0019] The heating element of the thermal field assembly provided in the embodiment of the present application has a first through hole, and the cooling medium can cool the heating element through the first through hole and take away the heat in the chamber to achieve rapid cooling of the chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0021] Figure 1 The figure shows a schematic diagram of the structure of a thermal field assembly and a power supply provided in an embodiment of the present application.

[0022] Figure 2 Shown is a schematic structural diagram of a thermal field assembly provided in one embodiment of the present application.

[0023] Figure 3 Shown Figure 2 A cross-sectional view of the thermal field component in the AA direction is shown.

[0024] Figure 4 Shown Figure 3 A partial enlarged view of the thermal field component in area B is shown.

[0025] Figure 5 Shown is a schematic structural diagram of a cavity assembly provided in one embodiment of the present application.

[0026] Figure 6 Shown Figure 5 A cross-sectional view of the cavity assembly shown in the CC direction.

[0027] Figure 7 Shown Figure 6 A partial enlarged view of the cavity assembly in area D is shown.

[0028] Figure 8 Shown Figure 6 A partial enlarged view of the cavity assembly in area E is shown.

[0029] Fig. 9 Shown Figure 6 A partial enlarged view of the cavity assembly in area F is shown.

[0030] Fig.10 Shown is a schematic structural diagram of a cavity provided in one embodiment of the present application.

[0031] Fig.11 Shown is a schematic structural diagram of a cavity assembly and a ventilation device provided in one embodiment of the present application.

[0032] Fig.12 Shown is a schematic structural diagram of an insulating barrier provided in one embodiment of the present application.

[0033] Fig.13 Shown is a schematic structural diagram of a reactor provided in one embodiment of the present application.

[0034] Reference numerals:

[0035] 12. Reactor; 1. Cavity assembly; 10. Thermal field assembly; 100. Heating element; 101. First through hole; 1011. Axis of first through hole; 110. Casting part; 120. Heating part; 1210. Heating wire; 1211. Axis of heating wire; 200. Lead wire; 201. First end of lead wire; 202. Second end of lead wire; 300. Insulating tube; 20. Cavity; 210. Body; 2100. First end of body; 2101. First cooling medium inlet and outlet; 2102. Second cooling medium inlet and outlet; 2110. Feeding port; 2 120, cooling medium channel; 2121, first end of cooling medium channel; 2122, second end of cooling medium channel; 2130, threaded portion; 220, protective member; 2201, second through hole; 2211, axis of second through hole; 2221, first end of second through hole; 2231, second end of second through hole; 2001, chamber; 2011, axis of chamber; 30, insulating barrier; 301, third through hole; 302, fourth through hole; 40, locking member; 50, thermal insulation member; 2, furnace door; 3, power supply; 4, ventilation equipment. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] The specific structures of the thermal field assembly, the cavity assembly and the reaction furnace are described below in conjunction with the embodiments.

[0038] Figure 1 Shown is a schematic diagram of the structure of a thermal field assembly and a power supply provided in one embodiment of the present application. Figure 2 Shown is a schematic structural diagram of a thermal field assembly provided in one embodiment of the present application. Figure 3 Shown Figure 2 A cross-sectional view of the thermal field component in the AA direction is shown. Figure 4 Shown Figure 3 A partial enlarged view of the thermal field component in area B is shown. Figure 5 Shown is a schematic structural diagram of a cavity assembly provided in one embodiment of the present application. Figure 6 Shown Figure 5 The cross-sectional view of the cavity assembly in the CC direction is shown. Figures 1 to 6As shown, the thermal field assembly 10 is configured to heat or cool the chamber 2001. The thermal field assembly 10 includes at least one heating element 100 and at least one lead wire 200. The heating element 100 has a first through hole 101. The first through hole 101 is configured to allow a cooling medium to pass through so as to use the cooling medium to cool the heating element 100. The lead wire 200 penetrates the first through hole 101, the first end 201 of the lead wire is connected to the heating element 100, and the second end 202 of the lead wire is connected to the power source 3, so that the heating element 100 can be powered on to generate heat.

[0039] The heating element 100 of the thermal field assembly 10 has a first through hole 101 , and the cooling medium can cool the heating element 100 through the first through hole 101 and take away the heat in the chamber 2001 , so as to achieve rapid cooling of the chamber 2001 .

[0040] Exemplarily, the cross-sectional shape of the chamber 2001 can be circular, rectangular, other polygonal or irregular shapes. Exemplarily, the chamber 2001 can be placed horizontally or vertically. Exemplarily, the cooling medium can be a gas or a liquid. Exemplarily, the gas can be air, ammonia, nitrogen or other types of gases. Exemplarily, the liquid can be water, salt water, alkaline water or other types of liquids.

[0041] In some embodiments, Figures 2 to 4 As shown, the heating element 100 includes a casting part 110 and at least one heating part 120, the casting part 110 has a first through hole 101, and the casting part 110 is made of an insulating material. The heating part 120 is wrapped by the casting part 110 to prevent the heating part 120 from being exposed. The lead 200 penetrates the first through hole 101, passes through the casting part 110, and is electrically connected to the heating part 120 to prevent the lead 200 from short-circuiting with the heating part 120 when passing through the first through hole 101.

[0042] Exemplarily, the material of the casting part 110 may be a material having the properties of insulation, good thermal conductivity, light weight, and small specific heat capacity. Exemplarily, the material of the casting part 110 may be concrete, sintered silicate, and the like.

[0043] In some embodiments, there are multiple heating parts 120, and the multiple heating parts 120 are arranged at intervals along the extension direction of the first through hole 101. There are multiple leads 200, and the second ends 202 of the multiple leads are all connected to the power source 3. The first ends 201 of the multiple leads penetrate the first through hole 101, pass through the casting part 110, and are electrically connected to the multiple heating parts 120 respectively, so that the multiple heating parts 120 are energized through the multiple leads 200 respectively, so that the multiple heating parts 120 generate heat respectively, thereby realizing that the multiple heating parts 120 heat the multiple areas of the chamber 2001 respectively.

[0044] For example, Figure 3 and Figure 4 Three heating parts 120 are shown, the number of leads 200 is three, the three heating parts 120 are arranged at intervals along the extension direction of the first through hole 101, the second ends 202 of the three leads are all connected to the power supply 3, the first ends 201 of the three leads are inserted into the first through hole 101, pass through the casting part 110, and are electrically connected to the three heating parts 120 respectively, so that the three heating parts 120 are energized through the three leads 200, so that the three heating parts 120 generate heat respectively.

[0045] In some embodiments, Figure 4 As shown, the heating portion 120 includes a heating wire 1210 , which is spiral-shaped, and an axis 1211 of the spiral heating wire is colinear with an axis 1011 of the first through hole.

[0046] The spiral heating wire 1210 saves space. In a limited space, as many heating wires 1210 as possible can be arranged to improve the heating efficiency of the heating wire 1210 .

[0047] In some embodiments, Figures 2 to 4 As shown, the thermal field assembly 10 further includes an insulating tube 300, and the insulating tube 300 wraps the lead wire 200. The material of the insulating tube 300 includes any at least one of the following materials: ceramic, glass, and quartz.

[0048] The lead wire 200 is wrapped with the insulating tube 300 to prevent the lead wire 200 from being short-circuited with the heating element 100 when passing through the first through hole 101 .

[0049] like Figure 5 and Figure 6 As shown, the cavity assembly 1 includes at least one thermal field assembly 10 mentioned in the above embodiment and a cavity 20 . The cavity 20 has a chamber 2001 . The thermal field assembly 10 is disposed in the chamber 2001 and is configured to heat or cool the chamber 2001 .

[0050] The thermal field assembly 10 is disposed in the chamber 2001 and can directly heat the interior of the cavity 20 , thereby improving the heating efficiency of the cavity assembly 1 having the cavity 20 .

[0051] In some embodiments, Figure 6 As shown, the chamber 20 includes a body 210 and at least one protective member 220, and the body 210 has a chamber 2001. The protective member 220 is connected to the body 210 and is disposed in the chamber 2001, and the protective member 220 has a second through hole 2201. The thermal field assembly 10 is disposed in the second through hole 2201 to prevent the thermal field assembly 10 from being exposed to the chamber 2001.

[0052] For example, if the heating element 100 is placed directly in the chamber 2001, impurities generated by the heating element 100 at high temperature will contaminate the chamber 2001 and the product in the chamber 2001. The protective element 220 is used to accommodate the heating element 100 to prevent the heating element 100 from being exposed to the chamber 2001, thereby preventing the impurities generated by the heating element 100 at high temperature from contaminating the chamber 2001 and the product in the chamber 2001.

[0053] In some embodiments, the material of the protection member 220 includes at least one of the following materials: metal, silicon carbide, quartz, and ceramic. When the material of the protection member 220 includes metal, the surface of the protection member 220 has an insulating layer.

[0054] For example, the metal material can be various types of stainless steel, such as 304 stainless steel, 316 stainless steel, etc. For example, the metal material can also be iron, etc. For example, the stainless steel protection member 220 is not easy to generate impurities at high temperatures, and can prevent the chamber 2001 and the product in the chamber 2001 from being contaminated.

[0055] For example, under different temperature conditions, the thermal conductivity of the protective member 220 made of different materials is different. For example, at about 700° C. to 800° C., the thermal conductivity of the protective member 220 made of metal material is better.

[0056] Exemplarily, the material of the insulating layer on the surface of the protection member 220 may be ceramic polymer, alumina ceramic coating, or the like.

[0057] In some embodiments, Figure 6 , Figure 7 and Fig.10 As shown, the chamber 2001 has an axis, and the axis 2011 of the chamber is parallel to the axis 2211 of the second through hole. There are multiple protective members 220, and the multiple protective members 220 are arranged along the circumferential direction of the axis 2011 of the chamber. There are multiple thermal field assemblies 10, and at least one thermal field assembly 10 is arranged in the second through hole 2201 of each protective member 220 to further improve the heating efficiency of the thermal field assembly 10.

[0058] In some embodiments, Figures 6 to 9 As shown, two thermal field components 10 are arranged in the second through hole 2201 of each protective member 220, and the two thermal field components 10 are arranged along the extension direction of the second through hole 2201. The lead 200 of the thermal field component 10 close to the first end 2221 of the second through hole is led out from the first end 2221 of the second through hole, and the lead 200 of the thermal field component 10 close to the second end 2231 of the second through hole is led out from the second end 2231 of the second through hole.

[0059] The above-mentioned method of leading out the lead wire 200 can make the size of the second through hole 2201 as small as possible, so as to reduce the space occupied by the second through hole 2201 in the chamber 2001 .

[0060] In some embodiments, Figures 6 to 11 As shown, the body 210 includes at least one first cooling medium inlet and outlet 2101 and at least one second cooling medium inlet and outlet 2102. The first cooling medium inlet and outlet 2101 connects the first end 2221 of the second through hole with the outside, and the second cooling medium inlet and outlet 2102 connects the second end 2231 of the second through hole with the ventilation device 4, so that the ventilation device 4 assists the cooling medium to enter from the first cooling medium inlet and outlet 2101, flow through the second through hole 2201, and flow out from the second cooling medium inlet and outlet 2102. Alternatively, the ventilation device 4 assists the cooling medium to enter from the second cooling medium inlet and outlet 2102, flow through the second through hole 2201, and flow out from the first cooling medium inlet and outlet 2101.

[0061] The flow path of the cooling medium can pass through the entire thermal field assembly 10 to improve the cooling effect of the cooling medium.

[0062] Exemplarily, the ventilation device 4 can be a blowing device or an exhaust device. Exemplarily, the blowing device can be a fan or a hair dryer. Exemplarily, the exhaust device can be a vacuum pump.

[0063] In some embodiments, Figure 6 , Figure 7 and Fig.10 As shown, the first end of the body 210 in the extension direction of the chamber 2001 has a feed port 2110, and the second end of the body 210 in the extension direction of the chamber 2001 has a cooling medium channel 2120. There are multiple protective members 220, the second cooling medium inlet and outlet 2102 connects the first end 2121 of the cooling medium channel with the ventilation device 4, and the second end 2122 of the cooling medium channel connects with the second end 2231 of the second through hole of each of the multiple protective members 220. There are multiple first cooling medium inlet and outlet 2101, and the multiple first cooling medium inlet and outlet 2101 respectively connect the first end 2221 of the second through hole of each of the multiple protective members 220 with the outside world.

[0064] The above arrangement can realize cooling of multiple thermal field components 10 by using one ventilation device 4 .

[0065] In some embodiments, Figure 6 , Fig. 9 , Fig.10 and Fig.12As shown, the first end of the body 210 in the extension direction of the chamber 2001 has a feed port 2110, and the feed port 2110 connects the chamber 2001 with the outside, and the first end 2100 of the body is provided with at least one threaded portion 2130. The chamber assembly 1 further includes an insulating barrier 30 and a locking member 40, wherein the insulating barrier 30 is provided at the first end 2100 of the body and abuts against an end of the thermal field assembly 10 located in the second through hole 2201 and close to the first end 2100 of the body. The insulating barrier 30 has a third through hole 301 and a fourth through hole 302, and the third through hole 301 is configured to allow the lead 200 of the thermal field assembly 10 to pass through. The locking member 40 abuts against a side of the insulating barrier 30 away from the body 210, passes through the fourth through hole 302, and is screwed with the threaded portion 2130.

[0066] The insulating blocking member 30 and the locking member 40 are used to realize the detachable connection between the thermal field assembly 10 and the body 210 .

[0067] Exemplarily, the insulating barrier 30 may be made of ceramic, rubber, or the like.

[0068] Exemplarily, the locking member 40 may be a screw, a bolt or other structure with a thread locking function.

[0069] In some embodiments, Figure 6 and Figure 7 As shown, the cavity assembly 1 further includes a heat preservation member 50 , which is disposed between the body 210 and the protection member 220 and is configured to reduce the loss of heat generated by the thermal field assembly 10 .

[0070] Since the cavity assembly 1 includes the thermal field assembly 10 , the cavity assembly 1 includes all technical features and technical effects of the thermal field assembly 10 , which will not be described in detail herein.

[0071] Fig.13 The figure shows a schematic diagram of the structure of a reactor provided by an embodiment of the present application. Fig.10 and Fig.13 As shown, the reaction furnace 12 includes the chamber assembly 1 and the furnace door 2 mentioned in the above embodiment. The chamber assembly 1 has a feed port 2110 connecting the chamber 2001 of the chamber assembly 1 with the outside, and the feed port 2110 is configured to allow products to enter and exit the chamber 2001. The furnace door 2 is configured to open or close the feed port 2110.

[0072] Exemplarily, the reaction furnace 12 can perform processes such as plasma chemical vapor deposition (PECVD), low pressure chemical vapor deposition (LPCVD), atomic layer deposition (ALD), diffusion, dry cleaning, oxidation, etc. on the product.

[0073] For example, the product may be a silicon wafer, a solar panel, a glass substrate, etc. For example, the product may be a silicon wafer with a cross section, and the cross section of the silicon wafer with a cross section is a surface that needs to be passivated.

[0074] Since the reaction furnace 12 includes the cavity assembly 1 , the reaction furnace 12 includes all the technical features and technical effects of the cavity assembly 1 , which will not be described in detail herein.

[0075] In the embodiments of the present disclosure, if not clearly defined, the connection may be in the form of detachable connection by means of bolts and nuts, screws, buckles, magnets, etc. In some connections, if there is no special requirement for detachable matching, non-detachable connection may be achieved by means of welding, bonding, etc.

[0076] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0077] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0078] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0079] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0080] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A thermal field assembly, characterized in that: configured to heat or cool the chamber; Wherein, the thermal field component comprises: at least one heating element, having a first through hole, wherein the first through hole is configured to allow a cooling medium to pass through, so as to use the cooling medium to cool the heating element; At least one lead wire is inserted into the first through hole, a first end of the lead wire is connected to the heating element, and a second end of the lead wire is connected to a power source, so that the heating element can be energized to generate heat.

2. The thermal field assembly according to claim 1, characterized in that: The heating element comprises: A casting part, having the first through hole, and the casting part is made of insulating material; at least one heating portion, which is wrapped by the casting portion to prevent the heating portion from being exposed; Wherein, the lead wire passes through the first through hole, passes through the casting part, and is electrically connected to the heating part.

3. The thermal field assembly according to claim 2, characterized in that: There are multiple heating parts, and the multiple heating parts are arranged at intervals along the extending direction of the first through hole; There are multiple leads, the second ends of the multiple leads are all connected to a power source, the first ends of the multiple leads are inserted into the first through hole, pass through the casting part, and are electrically connected to the multiple heating parts respectively, so that the multiple heating parts are energized through the multiple leads respectively, so that the multiple heating parts generate heat respectively.

4. The thermal field assembly according to claim 2, characterized in that: The heating unit comprises: The heating wire is in a spiral shape, and the axis of the spiral heating wire is colinear with the axis of the first through hole.

5. The thermal field assembly according to any one of claims 1 to 4, characterized in that: Also includes: an insulating tube, wrapping the lead wire; Wherein, the material of the insulating tube includes any at least one of the following materials: ceramic, glass, and quartz.

6. A cavity assembly, characterized in that: include: a cavity, having a chamber; At least one thermal field assembly according to any one of claims 1 to 5 is disposed in the chamber and is configured to heat or cool the chamber.

7. The chamber assembly according to claim 6, characterized in that: The cavity comprises: a body having the chamber; at least one protective member connected to the body and disposed in the chamber, wherein the protective member has a second through hole; Wherein, the thermal field component is disposed in the second through hole to prevent the thermal field component from being exposed to the chamber.

8. The chamber assembly according to claim 7, characterized in that: The material of the protective member includes at least one of the following materials: metal, silicon carbide, quartz, and ceramic; Wherein, when the material of the protection member includes metal, the surface of the protection member has an insulating layer.

9. The chamber assembly according to claim 7, characterized in that: The chamber has an axis, and the axis of the chamber is parallel to the axis of the second through hole; The number of the protective members is multiple, and the multiple protective members are arranged along the circumferential direction of the axis of the chamber; There are multiple thermal field components, and at least one thermal field component is disposed in the second through hole of each protective member.

10. The chamber assembly according to claim 9, characterized in that: Two thermal field components are arranged in the second through hole of each of the protective members, and the two thermal field components are arranged along the extension direction of the second through hole; The lead of the thermal field component close to the first end of the second through hole is led out from the first end of the second through hole, and the lead of the thermal field component close to the second end of the second through hole is led out from the second end of the second through hole.

11. The chamber assembly according to claim 7, characterized in that: The body comprises: At least one first cooling medium inlet and outlet, connecting the first end of the second through hole with the outside; At least one second cooling medium inlet and outlet connects the second end of the second through hole with the ventilation device, so that the ventilation device assists the cooling medium to enter from the first cooling medium inlet and outlet, flows through the second through hole, and flows out from the second cooling medium inlet and outlet, or the ventilation device assists the cooling medium to enter from the second cooling medium inlet and outlet, flows through the second through hole, and flows out from the first cooling medium inlet and outlet.

12. The chamber assembly according to claim 11, characterized in that: The body has a feed port at a first end in the extending direction of the chamber, and a cooling medium channel at a second end in the extending direction of the chamber: Wherein, the number of the protective members is multiple, the second cooling medium inlet and outlet communicates with the first end of the cooling medium channel and the ventilation device, and the second end of the cooling medium channel communicates with the second ends of the second through holes of each of the multiple protective members; There are multiple first cooling medium inlets and outlets, and the multiple first cooling medium inlets and outlets are respectively connected to the first ends of the second through holes of the multiple protective members and the outside.

13. The chamber assembly according to any one of claims 7 to 12, characterized in that: The body has a feed port at a first end in the extension direction of the chamber, the feed port connects the chamber with the outside, and the first end of the body is provided with at least one threaded portion; The cavity assembly also includes: an insulating barrier, disposed at the first end of the body, abutting against an end of the thermal field component located in the second through hole and close to the first end of the body, wherein the insulating barrier has a third through hole and a fourth through hole, and the third through hole is configured to allow a lead of the thermal field component to pass through; The locking member abuts against a side of the insulating blocking member away from the main body, passes through the fourth through hole, and is threadedly connected with the threaded portion.

14. The chamber assembly according to any one of claims 7 to 12, characterized in that: Also includes: The heat-insulating component is disposed between the body and the protecting component and is configured to reduce the loss of heat generated by the thermal field component.

15. A reaction furnace, characterized in that: include: The cavity assembly according to any one of claims 6 to 14, wherein the cavity assembly has a feed port connecting the cavity of the cavity assembly with the outside, and the feed port is configured to allow products to enter and exit the cavity; The furnace door is configured to open or close the feed opening.

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