Silicon wafer stage moving mechanism of photoetching machine

Abstract

The invention discloses a photoetching machine silicon wafer stage moving mechanism, and relates to the technical field of silicon wafer processing, the photoetching machine silicon wafer stage moving mechanism comprises two groups of silicon wafer stages capable of reciprocating along a rectangular path, each group is composed of two transversely distributed silicon wafer stages, and the four silicon wafer stages are arranged in a shape like a Chinese character'tian '. And the silicon wafer carrying platform positioned at the right upper corner of the four silicon wafer carrying platforms is opposite to a processing station of the photoetching machine. And in an initial state, one of the two groups of silicon wafer carrying tables is positioned on the processing path, and the other group of silicon wafer carrying tables is positioned on one of the material changing paths. In the operation process, the processing stations on the processing path can continuously carry out processing operation on the silicon wafers in the silicon wafer carrying tables, the material changing path can continuously receive the processed silicon wafer carrying tables, and the material changing unit can synchronously carry out material changing operation on the processed silicon wafer carrying tables. And the implementation of processing operation is not influenced, a plurality of silicon wafer raw materials can be rapidly processed, and the working efficiency of processing the silicon wafer by the photoetching machine is improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing, and in particular to a silicon wafer stage moving mechanism for a photolithography machine. Background Art

[0002] The photolithography machine, also known as the mask alignment exposure machine, is the core equipment of the photolithography process in the chip manufacturing process. The photolithography process accounts for about 35% of the overall manufacturing cost in the chip manufacturing process and determines the key dimensions of the chip. The structure of the photolithography machine is complex, including silicon wafer stage, light source, optical system, control system and other parts. Its working principle is mainly to use specific light (usually ultraviolet light, deep ultraviolet light, extreme ultraviolet light) to irradiate the surface of the substrate through the mask containing the target pattern information, so that the photoresist exposed to the light reacts, thereby forming a different effect from the unexposed area after development. In the entire chip manufacturing process, generally 20-30 times of photolithography are required, which takes up 50% of the time of IC production and 1 / 3 of the chip production cost.

[0003] The wafer stage is one of the core subsystems of the lithography machine, which directly determines the key dimensions, overlay accuracy and production efficiency that the lithography machine can achieve. Most of the existing wafer stages of lithography machines use a dual-stage exchange system, which includes a base, two wafer stages with the same structure that work in the pre-processing station and the exposure station respectively, and a wafer stage drive device. However, in the existing dual-stage exchange system, when the silicon wafers in the wafer stages located in the pre-processing station and the exposure station are processed, the wafer stage still needs to be moved to remove the processed silicon wafers and replace them with the silicon wafers to be processed to perform material replacement operations. During the entire material replacement process, the wafer stage cannot perform processing operations, resulting in reduced efficiency in wafer processing. Summary of the invention

[0004] In response to the above problems, the present application provides a silicon wafer stage moving mechanism for a lithography machine.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a silicon wafer stage moving mechanism for a lithography machine, comprising two groups of silicon wafer carriers that can move back and forth along a rectangular path, each group consisting of two laterally distributed silicon wafer carriers, and the four silicon wafer carriers are arranged in a field shape. In the initial state, the silicon wafer carrier located in the upper right corner of the four silicon wafer carriers is facing the processing station of the lithography machine.

[0006] It also includes two material changing units, which form two material changing paths distributed from front to back and a processing path located between the two material changing paths with the processing station. In the initial state, one of the two groups of silicon wafer carriers is located on the processing path, and the other group is located on one of the material changing paths.

[0007] When two groups of silicon wafer carriers move along the X-axis direction at the same time, the processing station can perform photolithography processing operations on one group of silicon wafer carriers in turn, and the material changing unit can perform material changing operations on the other group of silicon wafer carriers in turn. When the four silicon wafer carriers move toward the Y-axis, two silicon wafer carriers that have completed the material changing operation move to the processing path, and two silicon wafer carriers that have completed the processing move to another material changing path. When the four silicon wafer carriers move back and forth along the rectangular path, two of the four silicon wafer carriers are always on the processing path, and the other two silicon wafer carriers are on the material changing path.

[0008] Furthermore, a slide and a table surface arranged parallel to the slide are provided below the silicon wafer carrier, the bottom end of the slide is connected to an X-axis movable frame through a support frame, the X-axis movable frame is a U-shaped structure, and a first driving rack arranged along the X direction is provided on the inner side of the X-axis movable frame.

[0009] The table is provided with a first driving gear meshing with the first driving rack and a first driving motor capable of driving the first driving gear to rotate. When the X-axis moving frame, the supporting frame and the slide table move synchronously, the two groups of silicon wafer carriers are respectively located in the material changing path and the processing path and move.

[0010] Furthermore, the bottom end of the slide is provided with a walking roller group that can move synchronously with it, the table top is provided with a guide track compatible with the walking roller group, and the table top is provided with a first guide roller group, and the X-axis moving frame is provided with a channel that can accommodate the first guide roller group to pass through.

[0011] Furthermore, a connecting beam is provided below the silicon wafer carrier, a Y-axis moving frame is provided on the connecting beam, the Y-axis moving frame is in a U-shaped structure, and a second driving rack arranged along the Y-axis direction is provided inside the Y-axis moving frame.

[0012] The slide is provided with a second driving gear meshing with the second driving rack and a second driving motor capable of driving the second driving gear to rotate. When the Y-axis moving frame and the connecting beam move synchronously, the two groups of silicon wafer carriers switch positions on the material changing path and the processing path.

[0013] Furthermore, the slide is provided with a second guide roller group arranged along the Y-axis direction, and the connecting beam and the Y-axis movable frame are both provided with a channel that can accommodate the second guide roller group to pass through.

[0014] Furthermore, the material changing units include an L-shaped material changing arm, and suction cups are provided on the two vertically distributed arm bodies of the material changing arm, and storage racks and material changing racks are respectively provided on both sides of the material changing arm. One of the arm bodies of the material changing arm is located directly above the silicon wafer carrier, and the other arm body is located directly above the material changing rack. When the material changing arm rotates, the two suction cups can transfer the silicon wafers originally located inside the material changing rack to the inside of the silicon wafer carrier, and at the same time transfer the silicon wafers inside the silicon wafer carrier to the inside of the storage rack.

[0015] Furthermore, the material changing unit also includes an electric rotating seat arranged at the bending position of the material changing arm, the electric rotating seat is provided with a mounting plate located directly below the material changing arm, the mounting plate is provided with a cylinder, and the push rod at the output end of the cylinder is connected to the material changing arm. When the material changing arm rises and falls, the suction cup located directly above the silicon wafer carrier and the material changing rack moves synchronously until it contacts the silicon wafer.

[0016] Furthermore, the storage rack and the material changing rack are each provided with a bracket capable of carrying silicon wafers, the bracket is each provided with a pair of driving protrusions, the storage rack and the material changing rack are each provided with a channel capable of accommodating the movement of the driving protrusions, and the outer sides of the storage rack and the material changing rack are each provided with an electric screw and a limit rod vertically distributed with the bracket, a pair of driving protrusions are respectively installed on the electric screw and the limit rod, and when the driving protrusion moves, the distance between the bracket and the suction cup above it can be adjusted.

[0017] In summary, the technical effects and advantages of the present invention are as follows: 1. The present invention is provided with four silicon wafer carriers that can reciprocate along a rectangular path. During the operation of the entire moving mechanism, two of the four silicon wafer carriers are always located on the processing path, and the other two silicon wafer carriers are located on the material replacement path. The processing stations on the processing path can continuously perform processing operations on the silicon wafers in the silicon wafer carriers, the material replacement path can continuously receive the silicon wafer carriers after processing, and the material replacement unit can synchronously perform material replacement operations on the silicon wafer carriers after processing. At the same time, it does not affect the implementation of the processing operation, and can quickly perform processing operations on multiple silicon wafer raw materials, thereby improving the work efficiency of the photolithography machine in processing silicon wafers.

[0018] 2. During the operation of the material changing unit of the present invention, the two suction cups can transfer the silicon wafers originally located inside the material changing rack to the inside of the silicon wafer carrier, and at the same time transfer the silicon wafers inside the silicon wafer carrier to the inside of the storage rack. Therefore, when the material changing arm rotates, the unloading and loading operations can be carried out simultaneously, which reduces the time required for repeated operation of silicon wafers and improves the efficiency of silicon wafer material changing and processing operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0021] Figure 2 This is a schematic diagram of the second viewing angle of the present invention.

[0022] Figure 3 It is a schematic diagram of the table structure of the present invention.

[0023] Figure 4 It is a structural schematic diagram of the silicon wafer carrier and the slide table when connected in the present invention.

[0024] Figure 5 It is a schematic diagram of the second viewing angle when the silicon wafer carrier and the slide table are connected in the present invention.

[0025] Figure 6 It is a schematic diagram of the position structure of multiple silicon wafer carriers of the present invention.

[0026] Figure 7 It is a schematic diagram of the slide structure after the silicon wafer carrier is separated from the slide.

[0027] Figure 8 This is a schematic diagram of the structure of the slide from a second viewing angle after the silicon wafer carrier is separated from the slide.

[0028] Fig. 9 This is a schematic diagram of the position structure of the material changing unit, storage rack and material changing rack of the present invention.

[0029] Fig.10 It is a schematic diagram of the movement direction of multiple silicon wafer carriers of the present invention.

[0030] In the figure: 1. slide; 11. support frame; 12. X-axis movable frame; 13. first drive rack; 14. walking roller group; 15. second drive gear; 16. second drive motor; 17. second guide roller group; 2. silicon wafer carrier; 21. connecting beam; 22. Y-axis movable frame; 23. second drive rack; 3. first drive gear; 31. first drive motor; 4. table; 41. guide rail; 42. first guide roller group; 5. storage rack; 6. material changing rack; 7. material changing arm; 71. electric rotating seat; 72. cylinder; 8. suction cup; 9. bracket; 91. drive bump; 92. electric screw; 93. limit rod. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Example 1: Reference Figure 1 , Fig.10 A silicon wafer stage moving mechanism for a photolithography machine shown in the figure includes two groups of silicon wafer carriers 2 that can move back and forth along a rectangular path, each group is composed of two laterally distributed silicon wafer carriers 2, and four silicon wafer carriers 2 are arranged in a field shape. In the initial state, the silicon wafer carrier 2 located in the upper right corner of the four silicon wafer carriers 2 is opposite to the processing station of the photolithography machine, and the processing station of the photolithography machine is located in the center of the entire silicon wafer stage moving mechanism.

[0033] The invention also includes two material changing units, which form two material changing paths from front to back and a processing path between the two material changing paths with the processing station, and the three paths are all distributed horizontally. In the initial state, one of the two groups of silicon wafer carriers 2 is located on the processing path, and the other group is located on one of the material changing paths.

[0034] When the wafer stage moving mechanism is initially operated, the two wafer carriers 2 on the processing path are fully loaded, and the two wafer carriers 2 on the material changing path are unloaded. When the two groups of wafer carriers 2 move along the X-axis direction at the same time, the processing station can perform photolithography processing operations on one group of wafer carriers 2 in turn. At this time, the material changing unit can perform loading operations on the two unloaded wafer carriers 2, so that the four wafer carriers 2 are all fully loaded.

[0035] When the four silicon wafer carriers 2 move toward the Y axis, two silicon wafer carriers 2 that have completed the material exchange operation move to the processing path, and two silicon wafer carriers 2 that have completed the processing move to another material exchange path. The processing station can continue to perform processing operations on the silicon wafer carriers 2 on the processing path, and after the processed silicon wafer carriers 2 move to the material exchange path, the material exchange unit can take out the processed silicon wafers and replace them with raw silicon wafers to be processed.

[0036] When the four silicon wafer carriers 2 move back and forth along the rectangular path, two of the four silicon wafer carriers 2 are always located on the processing path, and the other two silicon wafer carriers 2 are located on the material replacement path. The processing stations on the processing path can continuously perform processing operations on the silicon wafers in the silicon wafer carriers 2, and the material replacement path can continuously receive the silicon wafer carriers after processing. As the silicon wafer carriers 2 reciprocate, the two material replacement units can take out the silicon wafers after processing in turn and replace them with raw silicon wafers to be processed.

[0037] Therefore, when the entire silicon wafer stage moving mechanism is operating, the processing station can continuously perform processing operations on the silicon wafer carrier 2. At the same time, the material changing unit can synchronously perform material changing operations on the silicon wafer carrier 2 after the processing is completed, which will not affect the implementation of the processing operation. It can quickly perform processing operations on multiple silicon wafer raw materials, thereby improving the work efficiency of the lithography machine in processing silicon wafers.

[0038] Specifically, Figure 2-8 As shown, a slide 1 and a table 4 arranged parallel to the slide 1 are provided below the silicon wafer carrier 2, and the bottom end of the slide 1 is connected to an X-axis moving frame 12 through a support frame 11. The X-axis moving frame 12 is a U-shaped structure, and a first driving rack 13 arranged along the X direction is provided on the inner side of the X-axis moving frame 12.

[0039] The table 4 is provided with a first driving gear 3 meshed with the first driving rack 13 and a first driving motor 31 that can drive the first driving gear 3 to rotate. Therefore, when the first driving motor 31 is running, the first driving gear 3 can be rotated, and during the rotation process, the first driving rack 13 meshed with it and the X-axis moving frame 12 can be moved synchronously. When the X-axis moving frame 12, the support frame 11 and the slide 1 move synchronously, the two groups of silicon wafer carriers 2 are respectively located in the material replacement path and the processing path and move, so as to achieve the purpose of enabling the silicon wafer carrier 2 to move along the X-axis path.

[0040] The bottom end of the slide 1 is provided with a walking roller group 14 that can move synchronously with the slide 1, a guide rail 41 that matches the walking roller group 14 is provided on the table 4, and a first guide roller group 42 is provided on the table 4, and a channel that can accommodate the first guide roller group 42 is provided on the X-axis moving frame 12. The combination of the walking roller 14, the guide rail 41 and the first guide roller group 42 can improve the stability of the slide 1 during movement, effectively avoid the slide 1 and the silicon wafer carrier 2 from shaking and deflecting during movement, and further ensure the accuracy of the processing station and the material changing unit in the process of processing and material changing operations on the silicon wafer carrier 2.

[0041] Furthermore, a connecting beam 21 is provided below the silicon wafer stage 2, and a Y-axis moving frame 22 is provided on the connecting beam 21. The Y-axis moving frame 22 is a U-shaped structure, and a second driving rack 23 arranged along the Y-axis direction is provided inside the Y-axis moving frame 22.

[0042] The slide table 1 is provided with a second driving gear 15 meshing with the second driving rack 23 and a second driving motor 16 that can drive the second driving gear 15 to rotate. Therefore, when the second driving motor 16 is running, the second driving gear 15 can be meshed with the second driving rack 23 to move, and then the Y-axis moving frame 22 and the connecting beam 21 can be moved synchronously, so that the two sets of silicon wafer carriers 2 are located at the switching position on the material replacement path and the processing path.

[0043] In order to maintain the stability of the silicon wafer carrier 2 during movement, the slide 1 is provided with a second guide roller set 17 arranged along the Y-axis direction, and the connecting beam 21 and the Y-axis moving frame 22 are both provided with channels that can accommodate the second guide roller set 17 to pass through.

[0044] Example 2: Fig. 9 As shown, on the basis of Example 1, in order to facilitate the material change operation on the silicon wafer carrier 2, the material change unit includes an L-shaped material change arm 7, and the two vertically distributed arm bodies of the material change arm 7 are provided with suction cups 8, and the two sides of the material change arm 7 are provided with a storage rack 5 and a material change rack 6, respectively. In the initial state, one arm body of the material change arm 7 is located directly above the silicon wafer carrier 2, and the other arm body is located directly above the material change rack 6. When the material change arm 7 rotates, the two suction cups 8 can transfer the silicon wafer originally located in the material change rack 6 to the inside of the silicon wafer carrier 2, and at the same time transfer the silicon wafer inside the silicon wafer carrier 2 to the inside of the storage rack 5. Therefore, when the material change arm 7 rotates, the material unloading and loading operations can be carried out synchronously, which reduces the time required for repeated operation of silicon wafers and improves the efficiency of silicon wafer material change and processing operations.

[0045] Specifically, in order to enable the material changing arm 7 to rotate smoothly, the material changing unit further includes an electric rotating seat 71 disposed at the bending position of the material changing arm 7. The electric rotating seat 71 is provided with a mounting plate located directly below the material changing arm 7, and a cylinder 72 is provided on the mounting plate. The push rod at the output end of the cylinder 72 is connected to the material changing arm 7. With the operation of the cylinder 72, the material changing arm 7 can be promoted to rise and fall, and then the suction cup 8 located directly above the silicon wafer carrier 2 and the material changing rack 6 can be synchronously moved. After the suction cup 8 descends and absorbs the silicon wafer, it can carry the silicon wafer and rise, so that the silicon wafer is separated from the original position and moved to the specified position.

[0046] It is worth mentioning that, in the initial state, a plurality of stacked silicon wafer raw materials to be processed are pre-stored inside the material changing rack 6, while the storage rack 5 is in an empty state. As the entire silicon wafer stage moving mechanism continues to operate, the number of processed silicon wafers inside the storage rack 5 continues to increase, while the number of silicon wafers inside the material changing rack 6 continues to decrease. Since the rising and falling distance of the suction cup 8 is limited, in order to avoid the failure of the suction cup 8 to contact the silicon wafer inside the material changing rack 6 and the offset phenomenon when the suction cup 8 drops the silicon wafer 8 into the storage rack 5, a bracket 9 that can carry the silicon wafer is provided inside the storage rack 5 and the material changing rack 6, and a pair of driving protrusions 91 are provided on the bracket 9. The storage rack 5 and the material changing rack 6 are provided with a channel that can accommodate the movement of the driving protrusion 91, and the outer side of the storage rack 5 and the material changing rack 6 are provided with an electric screw 92 and a limit rod 93 vertically distributed with the bracket 9, a pair of driving protrusions 91 are respectively installed on the electric screw 92 and the limit rod 93, when the driving protrusion 91 moves, the distance between the bracket 9 and the suction cup 8 above it can be adjusted.

[0047] During the process that the two suction cups 8 respectively suck out the silicon wafers in the material changing rack 6 and drop the silicon wafers into the storage rack 5, the bracket 9 can rise, and then lift the silicon wafer above it to a specified height, so that the silicon wafer can be precisely contacted with the suction cups 8, and the falling silicon wafer can also be precisely received to avoid collision when the silicon wafer falls.

[0048] With the repeated operation of the entire wafer stage moving mechanism, the number of processed wafers inside the storage rack 5 continues to increase, while the number of wafers inside the material changing rack 6 continues to decrease. According to the thickness of the silicon wafers, the specifications of the suction cup 8 and the stroke of the lifting movement of the suction cup 8, pre-settings can be made in the PLC control system, so that the travel of the bracket 9 inside the storage rack 5 and the material changing rack 6 is different each time, thereby ensuring the smooth operation of the entire wafer stage moving mechanism.

[0049] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A photolithography machine silicon wafer stage moving mechanism, characterized in that: It comprises two groups of silicon wafer carriers (2) that can reciprocate along a rectangular path, each group is composed of two silicon wafer carriers (2) distributed laterally, and the four silicon wafer carriers (2) are arranged in a field shape. In an initial state, the silicon wafer carrier (2) located at the upper right corner of the four silicon wafer carriers (2) is directly opposite to the processing station of the photolithography machine; It also includes two material changing units, the two material changing units and the processing stations form two material changing paths distributed from front to back and a processing path located between the two material changing paths, and in an initial state, one of the two groups of silicon wafer carriers (2) is located on the processing path, and the other group is located on one of the material changing paths; When the two groups of silicon wafer carriers (2) move simultaneously along the X-axis direction, the processing station can sequentially perform photolithography processing operations on one group of silicon wafer carriers (2), and the material changing unit can sequentially perform material changing operations on the other group of silicon wafer carriers (2); when the four silicon wafer carriers (2) move toward the Y-axis, two silicon wafer carriers (2) that have completed the material changing operation move to the processing path, and two silicon wafer carriers (2) that have completed the processing move to another material changing path; when the four silicon wafer carriers (2) move back and forth along the rectangular path, two of the four silicon wafer carriers (2) are always located on the processing path, and the other two silicon wafer carriers (2) are located on the material changing path.

2. The photolithography machine wafer stage moving mechanism according to claim 1, characterized in that: A slide table (1) and a table surface (4) arranged parallel to the slide table (1) are provided below the silicon wafer carrier (2); the bottom end of the slide table (1) is connected to an X-axis moving frame (12) via a support frame (11); the X-axis moving frame (12) is in a U-shaped structure, and a first driving rack (13) arranged along the X direction is provided on the inner side of the X-axis moving frame (12); The table top (4) is provided with a first driving gear (3) meshing with a first driving rack (13) and a first driving motor (31) capable of driving the first driving gear (3) to rotate. When the X-axis moving frame (12), the supporting frame (11) and the slide table (1) move synchronously, the two groups of silicon wafer carriers (2) are respectively located in the material replacement path and the processing path and move.

3. The photolithography machine wafer stage moving mechanism according to claim 2, characterized in that: The bottom end of the slide (1) is provided with a travel roller group (14) which can move synchronously therewith, the table top (4) is provided with a guide track (41) which is compatible with the travel roller group (14), and the table top (4) is provided with a first guide roller group (42), and the X-axis moving frame (12) is provided with a channel which can accommodate the first guide roller group (42) to pass through.

4. The photolithography machine wafer stage moving mechanism according to claim 2, characterized in that: A connecting beam (21) is provided below the silicon wafer carrier (2), a Y-axis moving frame (22) is provided on the connecting beam (21), the Y-axis moving frame (22) is in a U-shaped structure, and a second driving rack (23) arranged along the Y-axis direction is provided inside the Y-axis moving frame (22); The slide table (1) is provided with a second drive gear (15) meshing with a second drive rack (23) and a second drive motor (16) capable of driving the second drive gear (15) to rotate. When the Y-axis moving frame (22) and the connecting beam (21) move synchronously, the two sets of silicon wafer carriers (2) are located at switching positions on the material replacement path and the processing path.

5. The photolithography machine wafer stage moving mechanism according to claim 4, characterized in that: The slide table (1) is provided with a second guide roller group (17) arranged along the Y-axis direction, and the connecting beam (21) and the Y-axis moving frame (22) are both provided with a channel capable of accommodating the second guide roller group (17) to pass through.

6. The photolithography machine wafer stage moving mechanism according to claim 1, characterized in that: The material changing units all include an L-shaped material changing arm (7), and suction cups (8) are provided on two vertically distributed arm bodies of the material changing arm (7), and a storage rack (5) and a material changing rack (6) are provided on both sides of the material changing arm (7), one arm body of the material changing arm (7) is located directly above the silicon wafer carrier (2), and the other arm body is located directly above the material changing rack (6), and when the material changing arm (7) rotates, the two suction cups (8) can transfer the silicon wafers originally located inside the material changing rack (6) to the inside of the silicon wafer carrier (2), and at the same time transfer the silicon wafers inside the silicon wafer carrier (2) to the inside of the storage rack (5).

7. The photolithography machine wafer stage moving mechanism according to claim 6, characterized in that: The material changing unit further comprises an electric rotating seat (71) arranged at the bending position of the material changing arm (7); a mounting plate located directly below the material changing arm (7) is provided on the electric rotating seat (71); a cylinder (72) is provided on the mounting plate; a push rod at the output end of the cylinder (72) is connected to the material changing arm (7); when the material changing arm (7) moves up and down, the suction cup (8) located directly above the silicon wafer carrier (2) and the material changing rack (6) moves synchronously until it contacts the silicon wafer.

8. The photolithography machine wafer stage moving mechanism according to claim 7, characterized in that: The storage rack (5) and the material changing rack (6) are both provided with a bracket (9) capable of carrying silicon wafers, and the bracket (9) is provided with a pair of driving protrusions (91). The storage rack (5) and the material changing rack (6) are both provided with a channel capable of accommodating the movement of the driving protrusions (91), and the outer sides of the storage rack (5) and the material changing rack (6) are both provided with an electric screw rod (92) and a limit rod (93) vertically distributed with respect to the bracket (9), and the pair of driving protrusions (91) are respectively installed on the electric screw rod (92) and the limit rod (93), and when the driving protrusions (91) move, the distance between the bracket (9) and the suction cup (8) above it can be adjusted.

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