Semiconductor chemical cleaning tank

Abstract

The invention relates to a semiconductor chemical cleaning tank which is characterized in that a wafer supporting seat is arranged in the semiconductor chemical cleaning tank, a vertical plate is arranged on a rectifying plate, a fluid guiding effect is achieved by utilizing the vertical plate, and a rectifying hole is not formed in the middle of the rectifying plate, so that cleaning fluid can be guided to a certain extent when flowing to side supporting blocks and a middle supporting block; and fluid at the tops of the side supporting blocks and the middle supporting block flows more uniformly, and the cleaning effect is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor manufacturing equipment, and in particular, relates to a semiconductor chemical cleaning tank. Background Art

[0002] Semiconductor chemical cleaning tanks are usually used as liquid tanks, such as HF acid tanks and Poly tanks, to remove the oxide film on the surface of the wafer. The structure of the semiconductor chemical cleaning tank usually includes a double-layer tank body, in which the wafer is placed in the inner tank body, and the liquid in the inner tank body overflows from the inner tank body to the outer tank body through the top overflow, and then the liquid in the outer tank body is pumped into the circulating water inlet pipe at the bottom of the inner tank body by a pump, thereby realizing the circulation of the liquid. When the liquid is less, it is replenished by the liquid inlet pipe.

[0003] A wafer support seat is also provided in the inner tank body to support the wafer. When working, the wafer is placed on the wafer support seat by a robot. The circulating water inlet pipe is usually located below the wafer. Since the wafers are arranged vertically in rows and placed on the wafer support seat, for example, 50 12-inch wafers are placed. However, in the existing semiconductor chemical cleaning tank, due to the influence of the wafer support seat, a slow fluid flow area (dead zone) is usually prone to appear at the top of the corresponding structure of the wafer support seat, which leads to poor cleaning effect and uneven cleaning. Summary of the invention

[0004] The technical problem to be solved by the present invention is to solve the deficiencies in the prior art and thus provide a semiconductor chemical cleaning tank with a more uniform cleaning effect.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A semiconductor chemical cleaning tank, comprising:

[0007] A tank body, wherein the top of the tank body is open and has an inner overflow plate, wherein the inner overflow plate surrounds a main tank, and one side of the tank body is a collecting tank, wherein an overflow channel formed between the inner overflow plate and the outer wall is connected to the collecting tank, and the top of the tank body has a liquid inlet, through which the cleaning liquid is introduced into the main tank;

[0008] The wafer support seat is arranged in the tank body, including columns, a wafer support block fixed between the columns, the wafer support block is provided with a plurality of wafer positioning grooves, and the wafer support block includes side support blocks located on both sides and a middle support block located in the middle; the top of the column is fixed outside the tank body and extends into the tank body;

[0009] A rectifying plate is arranged at the bottom of the tank body, comprising a plate body provided with rectifying holes, and a vertical plate arranged on the plate body, wherein the upper surface of the vertical plate contacts the lower surface of the side support block, and the rectifying plate is divided into two parts with the vertical projection of the middle support block as the boundary, and the first rectifying holes are arranged on both parts;

[0010] The circulating water inlet pipe is arranged at the bottom of the rectifier plate, and the collecting tank is connected with the circulating water inlet pipe through a pump.

[0011] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0012] The depth of the collecting tank is greater than the depth of the overflow channels formed on the other three sides so that the cleaning liquid can be smoothly collected into the collecting tank.

[0013] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0014] The circulating water inlet pipe comprises an inner pipe and an outer pipe sleeved outside the inner pipe, and openings are provided on the inner pipe and the outer pipe.

[0015] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0016] The opening formed on the outer tube corresponds to the area between the two side support blocks.

[0017] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0018] The inner tube has a row of openings, and the outer tube has two rows of openings. The central axes of the three rows of openings form an angle of 60° with each other, and the openings on the inner tube face downward, while the openings on the outer tube face obliquely upward.

[0019] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0020] The sum of the areas of all the openings on the inner tube is 120% to 140% of the sum of the areas of all the openings on the outer tube.

[0021] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0022] There are two circulating water inlet pipes, each of which is connected to a pump. The pump can be independently controlled to start or shut down, so that each circulating water inlet pipe can be independently started or shut down. During each wafer cleaning, if the total cleaning time is T, one of the circulating water inlet pipes is independently started for T / 3 time, and the other circulating water inlet pipe is independently started for T / 3 time, and finally the two circulating water inlet pipes are started together for T / 3 time.

[0023] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0024] The radius of the first rectifying hole is 1.5 mm to 2.5 mm.

[0025] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0026] A second rectifying hole is arranged on the rectifying plate next to the plate body, the second rectifying hole is an elongated hole, and the central axis of the elongated hole in the length direction is parallel to the plate body, the length of the second rectifying hole is 3-4 times the diameter of the first rectifying hole, and the width of the second rectifying hole is equal to the diameter of the first rectifying hole;

[0027] A third rectifying hole is arranged on the rectifying plate near the middle supporting block, the length of the third rectifying hole is 3-4 times the diameter of the first rectifying hole, and the width of the third rectifying hole is equal to the diameter of the first rectifying hole.

[0028] Preferably, the semiconductor chemical cleaning tank of the present invention,

[0029] The third rectifying hole is arranged at a position corresponding to 60% of the wafers near the middle position in the wafer queue.

[0030] The beneficial effects of the present invention are:

[0031] The semiconductor chemical cleaning tank of the present invention utilizes vertical plates to guide the fluid, and no rectifying holes are arranged in the middle of the rectifying plates, so that the cleaning liquid can be guided to a certain extent when flowing toward the side support blocks and the middle support blocks, making the flow of the fluid at the top of the side support blocks and the middle support blocks more uniform, thereby improving the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0033] Figure 1 is a schematic structural diagram of a semiconductor chemical cleaning tank according to an embodiment of the present application;

[0034] Figure 2 yes Figure 1 A cross-sectional view of a semiconductor chemical cleaning tank;

[0035] Figure 3 It is a schematic diagram of the structure of a wafer support seat;

[0036] Figure 4 It is a structural diagram of the rectifier plate;

[0037] Figure 5 1. It is a schematic diagram of the structure of the circulating water inlet pipe;

[0038] Figure 6 is a cross-sectional view of a circulating water inlet pipe;

[0039] Figure 7 This is the flow simulation effect diagram when no vertical plate is set and the rectifying holes have the same diameter;

[0040] Figure 8 This is the flow simulation effect diagram when the vertical plate and the rectifying hole are set to the same diameter;

[0041] The reference numerals in the figure are:

[0042] 1 tank body;

[0043] 2 Wafer support seat;

[0044] 3. Rectifier plate;

[0045] 11 Liquid inlet;

[0046] 12 water outlet interface;

[0047] 13 water inlet interface;

[0048] 14 Circulation water inlet pipe;

[0049] 15 Collection tank;

[0050] 16 inner overflow plate;

[0051] 21 columns;

[0052] 22 wafer support block;

[0053] 31 plate body;

[0054] 32 vertical boards;

[0055] 141 inner tube;

[0056] 142 outer tube

[0057] 221 side support block

[0058] 222 Intermediate support block

[0059] 311 first rectifying hole;

[0060] 312 second rectifying hole;

[0061] 313Third rectifier hole. DETAILED DESCRIPTION

[0062] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0063] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention, unless otherwise specified, "multiple" means two or more.

[0064] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0065] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0066] Example

[0067] This embodiment provides a semiconductor chemical cleaning tank, which can be an HF acid tank, a Poly tank, such as Figure 1 As shown, including:

[0068] A tank body 1, wherein the top of the tank body 1 is open and has an inner overflow plate 16, wherein the inner overflow plate 16 surrounds a main tank, and one side of the tank body 1 is a collecting tank 15, wherein an overflow channel formed between the inner overflow plate 16 and the outer wall is connected to the collecting tank 15, and the top of the tank body 1 has a liquid inlet 11, through which the cleaning liquid is introduced into the main tank;

[0069] The wafer support seat 2 is arranged in the tank body 1, including columns 21, and a wafer support block 22 fixed between the columns 21. The wafer support block 22 is provided with a plurality of wafer positioning grooves. The wafer support block 22 includes side support blocks 221 located on both sides and a middle support block 222 located in the middle; the top of the column 21 is fixed outside the tank body 1 and extends into the tank body 1;

[0070] The rectifying plate 3 is arranged at the bottom of the tank body 1, and includes a plate body 31 provided with rectifying holes, and a vertical plate 32 arranged on the plate body 31, wherein the upper surface of the vertical plate 32 contacts the lower surface of the side support block 221, and the rectifying plate 3 is divided into two parts with the vertical projection of the middle support block 222 as the boundary, and the first rectifying holes 311 are arranged on both parts;

[0071] The circulating water inlet pipe 14 is arranged at the bottom of the rectifying plate 3 , and the collecting tank 15 is connected with the water inlet interface 13 and the circulating water inlet pipe 14 through the water outlet interface 12 , the pump.

[0072] The semiconductor chemical cleaning tank of this embodiment utilizes the vertical plate 32 to guide the fluid, and no rectifying hole is provided in the middle of the rectifying plate, so that the cleaning liquid can be guided to a certain extent when flowing toward the side support block 221 and the middle support block 222, so that the flow of the fluid at the top of the side support block 221 and the middle support block 222 is more uniform, thereby improving the cleaning effect.

[0073] Furthermore, the depth of the collecting tank 15 is greater than the depth of the overflow channels formed on the other three sides so that the cleaning liquid can be smoothly collected into the collecting tank 15 .

[0074] Furthermore, the circulating water inlet pipe 14 includes an inner pipe 141 and an outer pipe 142 sleeved outside the inner pipe 141 , and both the inner pipe 141 and the outer pipe 142 are provided with openings.

[0075] Furthermore, the opening formed on the outer tube 142 corresponds to the area between the two side support blocks 221. In other words, the cleaning liquid sprayed from the outer tube 142 can directly correspond to the wafer on the top.

[0076] Furthermore, the inner tube 141 has a row of openings, and the outer tube 142 has two rows of openings, the central axes of the three rows of openings form a 60° angle, and the openings on the inner tube 141 face downward, and the openings on the outer tube 142 face obliquely upward. The circulating water inlet pipe 14 of the two-layer tube structure can play the role of the first re-rectifier, and in contrast, the rectifying plate 3 is the second re-rectifier.

[0077] Furthermore, the sum of the areas of all the openings on the inner tube 141 is 120% to 140% of the sum of the areas of all the openings on the outer tube 142. The opening area on the inner tube 141 is large and the opening area on the outer tube 142 is small, so that the flow rate of the outer tube 142 will be greater than the flow rate of the inner tube 141, thereby improving the cleaning effect.

[0078] Furthermore, there are two circulating water inlet pipes 14, each of which is connected to a pump, and the pump can be independently controlled to start or shut down, so that each circulating water inlet pipe 14 can be independently started or shut down. During each wafer cleaning, if the total cleaning time is T, one of the circulating water inlet pipes 14 is independently started for T / 3 time, the other circulating water inlet pipe 14 is independently started for T / 3 time, and finally the two circulating water inlet pipes 14 are jointly started for T / 3 time. The above arrangement improves the flow of the cleaning liquid in the main tank and improves the cleaning effect.

[0079] Further, the radius of the first rectifying hole 311 is 1.5 mm to 2.5 mm, such as 1.5 mm, 1.7 mm, 2 mm, 2.3 mm or 2.5 mm.

[0080] Furthermore, a second rectifying hole 312 is provided on the rectifying plate 3 next to the plate body 31. The second rectifying hole 312 is an elongated hole, and the central axis of the elongated hole in the length direction is parallel to the plate body 31. The length of the second rectifying hole 312 is 3-4 times the diameter of the first rectifying hole 311, and the width of the second rectifying hole 312 is equal to the diameter of the first rectifying hole 311.

[0081] The strip-shaped second rectifying holes 312 disposed beside the plate body 31 can improve the flow of the fluid above the side support block 221 , making the flow of the fluid more uniform.

[0082] Furthermore, a third rectifying hole 313 is provided on the rectifying plate 3 near the middle support block 222 , and the length of the third rectifying hole 313 is 3-4 times the diameter of the first rectifying hole 311 , and the width of the third rectifying hole 313 is equal to the diameter of the first rectifying hole 311 .

[0083] The third rectifying hole 313 is provided on the rectifying plate 3 near the middle supporting block 222 to improve the flow of the fluid above the middle supporting block 222 and make the flow of the fluid more uniform.

[0084] Furthermore, the third rectifying hole 313 is set at a position corresponding to 60% of the wafers near the middle position in the wafer queue. The third rectifying hole 313 is set in the middle, which can improve the uniformity of the wafer fluid flow in the entire queue. For example, if there are 50 wafers, it is set at the middle 30 wafers.

[0085] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A semiconductor chemical cleaning tank, characterized in that: include: A tank body (1), wherein the top of the tank body (1) is open and has an inner overflow plate (16), wherein the inner overflow plate (16) surrounds a main tank, one side of the tank body (1) is a collecting tank (15), an overflow channel formed between the inner overflow plate (16) and the outer wall is connected to the collecting tank (15), and the top of the tank body (1) has a liquid inlet (11), through which the cleaning liquid is introduced into the main tank; A wafer support seat (2) is arranged in the tank body (1), comprising columns (21), a wafer support block (22) fixed between the columns (21), the wafer support block (22) being provided with a plurality of wafer positioning grooves, and the wafer support block (22) comprising side support blocks (221) located on both sides and a middle support block (222) located in the middle; A rectifying plate (3) is arranged at the bottom of the tank body (1), comprising a plate body (31) provided with rectifying holes, and a vertical plate (32) arranged on the plate body (31), wherein the upper surface of the vertical plate (32) contacts the lower surface of the side support block (221), and the rectifying plate (3) is divided into two parts with the vertical projection of the middle support block (222) as the boundary, and both parts are provided with first rectifying holes (311); A circulating water inlet pipe (14) is arranged at the bottom of the rectifying plate (3), and the collecting tank (15) is connected to the circulating water inlet pipe (14) through a pump.

2. The semiconductor chemical cleaning tank according to claim 1, characterized in that: The depth of the collecting groove (15) is greater than the depth of the overflow channels formed on the other three sides so that the cleaning liquid can be smoothly collected into the collecting groove (15).

3. The semiconductor chemical cleaning tank according to claim 1, characterized in that: The circulating water inlet pipe (14) comprises an inner pipe (141) and an outer pipe (142) sleeved outside the inner pipe (141), and both the inner pipe (141) and the outer pipe (142) are provided with openings.

4. The semiconductor chemical cleaning tank according to claim 1, characterized in that: The opening formed on the outer tube (142) corresponds to the area between the two side support blocks (221).

5. The semiconductor chemical cleaning tank according to claim 4, characterized in that: The inner tube (141) has a row of openings, and the outer tube (142) has two rows of openings. The central axes of the three rows of openings form an angle of 60° with each other, and the openings on the inner tube (141) face downward, while the openings on the outer tube (142) face obliquely upward.

6. The semiconductor chemical cleaning tank according to claim 4, characterized in that: The sum of the areas of all the openings on the inner tube (141) is 120% to 140% of the sum of the areas of all the openings on the outer tube (142).

7. The semiconductor chemical cleaning tank according to claim 5, characterized in that: There are two circulating water inlet pipes (14), each of which is connected to a pump. The pump can be independently controlled to start or shut down, so that each circulating water inlet pipe (14) can be independently started or shut down. During each wafer cleaning, if the total cleaning time is T, one of the circulating water inlet pipes (14) is independently started for T / 3 time, and the other circulating water inlet pipe (14) is independently started for T / 3 time, and finally the two circulating water inlet pipes (14) are started together for T / 3 time.

8. The semiconductor chemical cleaning tank according to claim 1, characterized in that: The radius of the first rectifying hole (311) is 1.5 mm to 2.5 mm.

9. The semiconductor chemical cleaning tank according to claim 1, characterized in that: A second rectifying hole (312) is provided on the rectifying plate (3) next to the plate body (31), the second rectifying hole (312) is an elongated hole, and the central axis of the elongated hole in the length direction is parallel to the plate body (31), the length of the second rectifying hole (312) is 3-4 times the diameter of the first rectifying hole (311), and the width of the second rectifying hole (312) is equal to the diameter of the first rectifying hole (311); A third rectifying hole (313) is provided on the rectifying plate (3) at a portion close to the middle support block (222); the length of the third rectifying hole (313) is 3-4 times the diameter of the first rectifying hole (311); and the width of the third rectifying hole (313) is equal to the diameter of the first rectifying hole (311).

10. The semiconductor chemical cleaning tank according to claim 9, characterized in that: The third rectifying hole (313) is arranged at a position corresponding to 60% of the wafers close to the middle position in the wafer queue.

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