Quantum chip packaging clamp

Abstract

The invention relates to the technical field of quantum chip installation, in particular to a quantum chip packaging clamp which comprises a length adjusting structure, width adjusting structures are arranged at the two ends of the length adjusting structure, a movable supporting structure is installed between the length adjusting structures, a fixing structure is designed on the upper side of each width adjusting structure, and a clamping positioning structure is arranged on the inner side of each fixing structure. The overall usable area of the device is flexibly adjusted through the length adjusting structure and the width adjusting structure, so that the device adapts to packaging of quantum chips of different specifications and is matched with the internal environment of a mounting device corresponding to chips of specific specifications, the overall mounting convenience and efficiency of the device are improved, and the device is suitable for packaging of quantum chips of different specifications. The clamping and positioning structure is used for improving the fixing effect of the quantum chips in the device, the device can be flexibly combined and used under the cooperation of the combined bolts, a user can conveniently package, use or store a plurality of chips, the chip packaging convenience is improved, and the functional effect of the packaging clamp is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of quantum chip installation, and in particular to a quantum chip packaging fixture. Background Art

[0002] A quantum chip is a chip that integrates quantum circuits on a substrate and carries quantum information processing functions. As a new type of chip technology, quantum chips have broad application prospects and huge development potential in the fields of quantum computing and quantum communications. However, to achieve the widespread application and commercial production of quantum chips, many technical challenges and process difficulties need to be overcome. In the future, with the continuous advancement of technology and the continuous development of the industry, quantum chips are expected to bring more innovation and changes to human society.

[0003] The existing application number is CN202211004666.5, which is a quantum chip packaging fixture, comprising a horizontal plate, a straight plate is provided below the horizontal plate, and a fixed structure is provided above the horizontal plate, wherein the fixed structure comprises a clamping plate, an inclined rod, a square plate, a threaded rod 1, a round block, a vertical rod, a vertical tube, a vertical block and a rotating rod, wherein the bottom of the vertical rod is fixedly connected to one side of the top of the horizontal plate, and a vertical tube is provided in the gap above the outer wall of the vertical rod. The quantum chip packaging fixture, through the cooperation of the straight plate, the shell, the shell, the horizontal plate, the base, the baffle, the bolt and the fixed structure, enables the device to rotate the threaded rod 1, the threaded rod 1 drives the vertical block to move upward, the vertical block drives the round block to move upward, the round block drives the rotating rod to rotate, the rotating rod drives the inclined rod to move, the inclined rod drives the square plate to move downward, and the square plate drives the clamping plate above to move downward, so that the staff can fix the packaging substrate and avoid displacement when packaging the quantum chip, thereby affecting the packaging effect.

[0004] The above can adapt to chips of different sizes and improve the chip packaging effect. However, it occupies a large space when in use, has a poor adaptability to the internal environment of the external equipment, and causes inconvenience to the installation and fixation of the chip. In addition, its usage is single, and the installation effect of a single chip is better. It cannot be used in combination and cannot meet the needs of simultaneous positioning, packaging and storage of multiple chips. Summary of the invention

[0005] In order to overcome the technical defects of the prior art, the present invention provides a quantum chip packaging fixture to achieve the purpose of flexibly adjusting the overall usage volume of the device according to the chip specifications, improving the convenience of device installation and multi-chip packaging.

[0006] The technical solution adopted by the present invention is: a quantum chip packaging fixture, including a length adjustment structure, width adjustment structures are arranged at both ends of the length adjustment structure, a movable support structure is installed between the length adjustment structures, a fixed structure is designed on the upper side of the width adjustment structure, a clamping and positioning structure is arranged on the inner side of the fixed structure, and a combination bolt is clamped on the outer side of the fixed structure.

[0007] Preferably, in order to adjust the working length of the device, the length adjustment structure includes a long side baffle, a telescopic long plate, a limiting clamp and a length adjustment threaded rod. A positioning mounting ring is designed on the outer side of the long side baffle. The telescopic long plate is clamped on the upper side of the long side baffle. The length adjustment screw is rotatably installed on one end of the telescopic long plate. A length adjustment groove is opened on the inner side of the long side baffle. The limiting clamp is slidably clamped on both sides of the inner part of the length adjustment groove.

[0008] Preferably, in order to control the extension length of the lengthening structure, a limited flat groove is provided on the inner side of the long side baffle, the telescopic long plate is slidably clamped in the inside of the limited flat groove, the inner surface of the long side baffle and the inner side of the long side baffle are in the same plane, an adapter block is provided at one end of the long side baffle, a rotatable mounting hole is provided on one side of the adapter block, the lengthening threaded rod is rotatably clamped in the inside of the rotatable mounting hole, and lengthening threaded grooves are provided at both ends of the long side baffle, and the lengthening threaded grooves and the lengthening threaded rod are rotatably engaged with each other.

[0009] Preferably, in order to support and position the quantum chip, the movable support structure includes an I-shaped roller, a damping connection block, a support sleeve and an extended support plate, the working roller is installed inside the length-adjusting slide groove, the damping connection block is arranged on one side of the I-shaped roller, the support sleeve is installed on the other side of the damping connection block at one end, and the extended support plate is arranged on one side of the damping connection block at the other end.

[0010] Preferably, in order to adjust the use position of the movable support structure, the two sides of the I-beam roller are slidably engaged with the length-adjusting slide groove, the center position of the I-beam roller is slidably engaged with the limit clamping plate, one end of the support sleeve and the damping connecting block are fixedly welded to each other, the extended support plate is slidably engaged with the inside of the support sleeve, the upper surface of the extended support plate and the upper surface of the support sleeve are in the same plane, and one end of the extended support plate is fixedly connected to the damping connecting block.

[0011] Preferably, in order to adjust the working width of the device, the width adjustment structure includes a wide side baffle, a two-way threaded rod, a width adjustment telescopic rod, a driven bevel gear and a width adjustment bevel gear. An installation positioning hole is designed on the outer side of the wide side baffle. The two-way threaded rod is rotatably clamped in the interior of the wide side baffle. The width adjustment telescopic rod is respectively installed at both ends of the wide side baffle. The driven bevel gear and the two-way threaded rod are fixedly connected to each other. The width adjustment bevel gear is arranged on one side of the driven bevel gear. A storage adjustment groove is opened on the upper surface of the wide side baffle.

[0012] Preferably, in order to control the use length of the width adjustment structure, a positioning slot is provided inside the wide side baffle, and the positioning slot and the supporting sleeve frame are slidably engaged with each other, a width adjustment hole is provided inside the wide side baffle, the two-way threaded rod is rotatably engaged with the inside of the width adjustment hole, and the width adjustment telescopic rod is respectively slidably engaged with the inside of the width adjustment hole, and a width adjustment threaded hole is provided inside the width adjustment telescopic rod, and the width adjustment threaded hole and the two-way threaded rod are rotatably engaged with each other, a drive mounting hole is provided on one side of the width adjustment hole, and the width adjustment bevel gear is rotatably engaged with the inside of the drive mounting hole, and a width adjustment motor is fixedly installed on the outside of the width adjustment baffle, and the output end of the width adjustment motor and the width adjustment bevel gear are fixedly connected to each other.

[0013] Preferably, in order to control the working height of the clamping and positioning structure, the fixed structure includes a lifting motor, a lifting mirror screw, a mirror slider, a mirror support rod and a height connecting frame, the lifting motor is embedded in one end of the storage adjustment slot, the lifting mirror screw is fixedly installed on the output end of the lifting motor, the mirror slider is respectively slidably engaged on both sides of the interior of the storage adjustment slot, a mirror threaded hole is provided inside the mirror slider, the mirror threaded hole and the lifting mirror screw are threadedly connected to each other, one end of the mirror support rod is rotatably connected to the mirror slider, the other end of the mirror support rod is respectively rotatably connected to the two ends of the height support frame, a combination connecting ring is designed on the outside of the height connection frame, the combination bolt is slidably engaged in the interior of the combination connecting ring, and one end of the combination bolt is threadedly connected to a fixing nut.

[0014] Preferably, in order to clamp and fix the chip from above, the clamping and positioning structure includes a positioning motor, a telescopic bidirectional screw, a positioning adjustment block, a positioning support rod and a clamping card plate, the positioning motor is fixedly installed at one end of the height connection frame, the telescopic bidirectional screw is fixedly installed at the output end of the positioning motor, the positioning adjustment block is respectively slidably clamped on both sides of the interior of the height connection frame, a telescopic threaded hole is opened inside the positioning adjustment block, the telescopic threaded holes are respectively rotatably engaged with the two ends of the telescopic bidirectional screw, one end of the positioning support rod is rotatably connected to the positioning adjustment block, and the other end of the positioning support rod is respectively rotatably connected to the two ends of the clamping card plate.

[0015] The beneficial effects of the present invention are as follows: through the length adjustment structure and the width adjustment structure, the overall use area of ​​the device can be flexibly adjusted, so that the device can adapt to the packaging of quantum chips of different specifications, and adapt to the internal environment of the installation device corresponding to the chip of a specific specification, thereby improving the convenience and efficiency of the overall installation of the device, and using the clamping and positioning structure to improve the fixing effect of the quantum chip inside the device. With the cooperation of the combination bolts, the device can be flexibly combined and used, which is convenient for users to package, use or store multiple chips, thereby improving the convenience of chip packaging and increasing the functional effect of the packaging fixture. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the expanded structure of the present invention.

[0017] Figure 2 It is a schematic diagram of the contraction structure of the present invention.

[0018] Figure 3 The combined structure of the present invention is shown in FIG. Figure 1 .

[0019] Figure 4 The combined structure of the present invention is shown in FIG. Figure 2 .

[0020] Figure 5 It is a side sectional structural schematic diagram of the present invention.

[0021] Figure 6 It is a schematic structural diagram of the long side baffle portion of the present invention.

[0022] Figure 7 It is a schematic structural diagram of the telescopic long plate part in the present invention.

[0023] Figure 8 It is a schematic structural diagram of the wide side baffle part in the present invention.

[0024] Fig. 9 It is a schematic structural diagram of the movable support structure part in the present invention.

[0025] Fig.10 It is a schematic structural diagram of the fixed structural part in the present invention.

[0026] Description of the accompanying drawings: In the figure: 1, length adjustment structure; 101, long side baffle; 102, telescopic long board; 103, limit clamping plate; 104, length adjustment threaded rod; 2, width adjustment structure; 201, wide side baffle; 202, two-way threaded rod; 203, width adjustment telescopic rod; 204, driven bevel gear; 205, width adjustment bevel gear; 206, width adjustment motor; 3, mobile support structure; 301, I-shaped roller; 302, damping connection block; 30 3. Support sleeve frame; 304. Extended support plate; 4. Fixed structure; 401. Lifting motor; 402. Lifting mirror screw; 403. Mirror slider; 404. Mirror support rod; 405. Height connection frame; 5. Clamping and positioning structure; 501. Positioning motor; 502. Telescopic bidirectional screw; 503. Positioning adjustment block; 504. Positioning support rod; 505. Clamping card plate; 6. Combination bolt; 601. Fixing nut. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the accompanying drawings: like Figure 1-Figure 10As shown, this embodiment provides a quantum chip packaging fixture, including a length adjustment structure 1. By adjusting the length adjustment structure 1, quantum chips of different sizes can be adapted to ensure that the chip can be accurately clamped. The length adjustment structure 1 includes a long side baffle 101, a telescopic long plate 102, a limit clamping plate 103 and a length adjustment threaded rod 104. A positioning mounting ring is designed on the outer side of the long side baffle 101. The long side baffle 101 is the main supporting part of the length adjustment structure 1. A positioning mounting ring is designed on the outer side of the long side baffle 101 for mounting the entire fixture on a workbench or other fixed surface. On the fixed device, the telescopic long plate 102 is mounted on the upper side of the long side baffle 101, and the length adjustment screw is rotatably installed on one end of the telescopic long plate 102. The inner side of the long side baffle 101 is provided with a length adjustment slide groove, and the limit card plate 103 is slidably connected to the inner sides of the length adjustment slide groove to limit the movement range of the telescopic long plate 102 to prevent it from being excessively extended or retracted. The inner side of the long side baffle 101 is provided with a limited flat groove, and the telescopic long plate 102 is slidably connected to the inside of the limited flat groove, and can slide under the guidance of the long side baffle 101 , thereby adjusting the overall length of the clamp, the inner surface of the long side baffle 101 and the inner side of the long side baffle 101 are in the same plane, one end of the long side baffle 101 is provided with an adapter block, one side of the adapter block is provided with a rotation mounting hole, the length adjustment threaded rod 104 is rotatably clamped in the inside of the rotation mounting hole, and both ends of the long side baffle 101 are provided with length adjustment threaded grooves, the length adjustment threaded grooves and the length adjustment threaded rod 104 are rotatably engaged with each other, and the position of the telescopic long plate 102 can be adjusted by rotating the length adjustment threaded rod 104, thereby achieving length adjustment Function: when the length of the clamp needs to be adjusted, first loosen the limit card plate 103, and then rotate the lengthening threaded rod 104. The rotation of the lengthening threaded rod 104 will cause it to move in the lengthening threaded groove, thereby pushing or pulling the telescopic long plate 102 to slide in the limit flat groove of the long side baffle 101. The movement of the telescopic long plate 102 will change the overall length of the clamp to accommodate quantum chips of different sizes. After the adjustment is completed, re-fix the limit card plate 103 to lock the position of the telescopic long plate 102 to ensure the stability of the clamp during the packaging process.

[0028] A mobile support structure 3 is installed between the length adjustment structures 1, and the mobile support structure 3 includes an I-shaped roller 301, a damping connection block 302, a support sleeve frame 303 and an extension support plate 304. The working roller is installed inside the length adjustment chute, and is installed inside the length adjustment chute. Its design allows smooth sliding in the length adjustment chute while providing stable support. The damping connection block 302 is arranged on one side of the I-shaped roller 301, and the damping connection block 302 includes a damping material or structure to reduce vibration and noise during movement, thereby providing a stable support. In order to improve the stability of the clamp, the support frame 303 is installed on the other side of the damping connection block 302 at one end, and the extended support plate 304 is arranged on one side of the damping connection block 302 at the other end. The two sides of the I-shaped roller 301 are slidably engaged with the length adjustment slide groove, and the center position of the I-shaped roller 301 is slidably engaged with the limit clamp 103, which further ensures the stability and accuracy of the mobile support structure 3 during the length adjustment process. One end of the support frame 303 is fixedly welded to the damping connection block 302, and the support The sleeve frame 303 is a rigid frame used to fix and support quantum chips or other components that need to be packaged. The extended support plate 304 is slidably connected to the inside of the support sleeve frame 303. The upper surface of the extended support plate 304 is in the same plane as the upper surface of the support sleeve frame 303. The extended support plate 304 can be adjusted in length as needed to provide additional support area or adapt to quantum chips of different sizes. The upper surface of the extended support plate 304 is in the same plane as the upper surface of the support sleeve frame 303, ensuring the flatness and consistency of the support surface. One end of the extended support plate 304 is fixedly connected to the damping connection block 302. When the support position or length needs to be adjusted, it can be achieved by sliding the extended support plate 304 in the support sleeve frame 303. The presence of the damping connection block 302 reduces vibration and noise during movement, improves the stability and reliability of the fixture, and the sliding of the I-shaped roller 301 in the length adjustment slot ensures that the mobile support structure 3 can move smoothly following the adjustment of the length adjustment structure 1.

[0029] Width-adjusting structures 2 are provided at both ends of the length-adjusting structure 1, so that the fixture can adapt to quantum chips or packaging requirements of different widths, further enhancing the versatility and flexibility of the fixture. The width-adjusting structure 2 includes a wide side baffle 201, a bidirectional threaded rod 202, a width-adjusting telescopic rod 203, a driven bevel gear 204 and a width-adjusting bevel gear 205. The outer side of the wide side baffle 201 is designed with mounting positioning holes. The wide side baffle 201 is the main supporting part of the width-adjusting structure 2. The outer side of the wide side baffle 201 is designed with mounting positioning holes for mounting the entire width-adjusting structure 2 on a workbench or other fixing device. The bidirectional threaded rod 202 is rotatably connected to the width baffle 201. The inside of the side baffle 201 simultaneously drives the two width-adjusting telescopic rods 203 to move in opposite directions. The width-adjusting telescopic rods 203 are respectively installed at both ends of the wide side baffle 201. The driven bevel gear 204 and the bidirectional threaded rod 202 are fixedly connected to each other for transmitting power or torque. The width-adjusting bevel gear 205 is arranged on one side of the driven bevel gear 204 for transmitting the power of the width-adjusting motor 206 to the bidirectional threaded rod 202. The upper surface of the wide side baffle 201 is provided with a storage adjustment groove. The inside of the wide side baffle 201 is provided with a positioning slot for accommodating and hiding the mobile support structure 3 during the width adjustment process. The positioning slot and the support sleeve frame 303 are slidably engaged with each other, a width adjustment hole is provided inside the wide side baffle 201, the bidirectional threaded rod 202 is rotatably engaged inside the width adjustment hole, and the width adjustment telescopic rod 203 is slidably engaged inside the width adjustment hole. A width adjustment threaded hole is provided inside the width adjustment telescopic rod 203, and the width adjustment threaded hole and the bidirectional threaded rod 202 are rotatably engaged with each other, and telescopic movement is performed under the drive of the bidirectional threaded rod 202. A drive mounting hole is provided on one side of the width adjustment hole, and the width adjustment bevel gear 205 is rotatably engaged inside the drive mounting hole. A width adjustment motor 205 is fixedly installed on the outer side of the width adjustment baffle. 06. The output end of the width-adjusting motor 206 is fixedly connected to the width-adjusting bevel gear 205. When the width of the clamp needs to be adjusted, the width-adjusting motor 206 is started. The output end of the width-adjusting motor 206 drives the width-adjusting bevel gear 205 to rotate, which is used to provide power in the width-adjusting process, and then drives the driven bevel gear 204 and the bidirectional threaded rod 202 to rotate through engagement. The rotation of the bidirectional threaded rod 202 will simultaneously drive the two width-adjusting telescopic rods 203 to move in opposite directions, thereby changing the overall width of the clamp. The sliding of the width-adjusting telescopic rod 203 in the width-adjusting card hole ensures the smoothness and accuracy of the movement.

[0030] The inner side of the fixed structure 4 is provided with a clamping and positioning structure 5 for fixing the clamping and positioning structure 5 and the combination bolt 6. The outer side of the fixed structure 4 is clamped with the combination bolt 6. The fixed structure 4 includes a lifting motor 401, a lifting mirror screw 402, a mirror slider 403, a mirror support rod 404 and a height connection frame 405. The lifting motor 401 is embedded and installed at one end of the storage adjustment slot as the main power source in the fixed structure 4. The lifting mirror screw 402 is fixedly installed at the output end of the lifting motor 401 for driving the lifting mirror screw 402 to rotate. The mirror image slider 403 is driven to move up and down by its rotation. The mirror image slider 403 is slidably connected to the two sides of the interior of the storage adjustment slot. The mirror image slider 403 is provided with a mirror image threaded hole. The mirror image threaded hole and the lifting mirror image screw 402 are threadedly connected to each other. The design of the lifting mirror image screw 402 matches the mirror image threaded hole to achieve smooth thread connection and movement. One end of the mirror image support rod 404 is rotatably connected to the mirror image slider 403, and the other end of the mirror image support rod 404 is rotatably connected to the two ends of the height support frame. The mirror image slider 403 is connected to the mirror image support frame 404 by the lifting and lowering of the mirror image slider 403, so as to change the height of the height support frame. The outer side of the height connection frame 405 is designed with a combined connection ring to achieve a stable connection between the two devices. The combined bolt 6 is slidably connected to the inside of the combined connection ring. One end of the combined bolt 6 is threadedly connected with a fixing nut 601, so that the two devices can be stably connected through the combined bolt 6 to ensure stability and accuracy during the packaging process. When the height of the device needs to be adjusted, the lifting motor 401 is started, and the output end of the lifting motor 401 drives the lifting mirror image screw 402 to rotate, and then drives the mirror image slider 403 to move up and down in the storage adjustment groove through the threaded connection. The lifting and lowering movement of the mirror image slider 403 will drive the mirror image support rod 404 to swing accordingly, so as to change the height of the height support frame. By adjusting the height of the height support frame, it can adapt to quantum chips of different sizes or other packaging requirements. When the two devices need to be connected, the combined bolt 6 is slidably connected to the inside of the combined connection ring, and the fixing nut 601 is rotated to tighten it to achieve a stable connection.

[0031] The clamping and positioning structure 5 is responsible for clamping and positioning the chip. The clamping and positioning structure 5 includes a positioning motor 501, a telescopic bidirectional screw 502, a positioning adjustment block 503, a positioning support rod 504 and a clamping card 505. The positioning motor 501 is fixedly installed at one end of the height connection frame 405, which serves as the main power source in the clamping and positioning structure 5. The telescopic bidirectional screw 502 is fixedly installed at the output end of the positioning motor 501. The positioning adjustment block 503 is driven to move toward or away from each other through its rotation, matching the telescopic threaded hole inside the positioning adjustment block 503 to achieve a smooth thread connection. The positioning adjustment block 503 is slidably connected to the two sides of the interior of the height connection frame 405, and a telescopic threaded hole is provided inside the positioning adjustment block 503. The telescopic threaded holes are respectively rotatably engaged with the two ends of the telescopic bidirectional screw 502, and are used for moving toward or away from each other under the drive of the telescopic bidirectional screw 502. The positioning adjustment block 503 is provided with a telescopic threaded hole inside, which is rotatably engaged with the two ends of the telescopic bidirectional screw 502, thereby realizing the clamping and releasing functions. One end of the positioning support rod 504 is rotatably connected to the positioning adjustment block 503, and the positioning support rod 5 The other end of 04 is rotatably connected with the two ends of the clamping card plate 505, allowing it to swing accordingly when the positioning adjustment block 503 moves, thereby changing the distance between the clamping card plates 505 to achieve the clamping and positioning of the chip. The clamping card plate 505 is used to directly clamp and position the chip. The design of the clamping card plate 505 includes anti-slip and anti-scratch properties to ensure that the chip will not be damaged during the clamping process. When the chip needs to be clamped, the positioning motor 501 is started, and the output end of the positioning motor 501 drives the telescopic bidirectional screw 502 to rotate, and then drives it through the threaded connection The positioning adjustment blocks 503 move toward each other in the height connection frame 405. The movement of the positioning adjustment blocks 503 toward each other will drive the positioning support rods 504 to swing accordingly, thereby reducing the distance between the clamping plates 505 and achieving chip clamping. By adjusting the rotation direction and rotation time of the positioning motor 501, the distance between the clamping plates 505 can be accurately controlled to accommodate chips of different sizes. When the chip needs to be released, the positioning motor 501 is rotated in the opposite direction to make the positioning adjustment blocks 503 move away from each other, thereby increasing the distance between the clamping plates 505 and releasing the chip.

[0032] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrating the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which shall fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A quantum chip packaging fixture, comprising a length adjustment structure (1), characterized in that: Width adjustment structures (2) are provided at both ends of the length adjustment structure (1), a movable support structure (3) is installed between the length adjustment structures (1), a fixing structure (4) is designed on the upper side of the width adjustment structure (2), a clamping and positioning structure (5) is provided on the inner side of the fixing structure (4), and a combination bolt (6) is clamped on the outer side of the fixing structure (4).

2. The quantum chip packaging fixture according to claim 1, characterized in that: The length adjustment structure (1) comprises a long side baffle (101), a telescopic long plate (102), a limit clamping plate (103) and a length adjustment threaded rod (104); a positioning mounting ring is arranged on the outer side of the long side baffle (101); the telescopic long plate (102) is clamped on the upper side of the long side baffle (101); the length adjustment threaded rod is rotatably mounted on one end of the telescopic long plate (102); a length adjustment slide groove is provided on the inner side of the long side baffle (101); and the limit clamping plate (103) is slidably clamped on both sides of the inner side of the length adjustment slide groove.

3. The quantum chip packaging fixture according to claim 2, characterized in that: A limited flat groove is provided on the inner side of the long side baffle (101), the telescopic long plate (102) is slidably engaged in the interior of the limited flat groove, the inner surface of the long side baffle (101) and the inner side of the long side baffle (101) are in the same plane, an adapter block is provided at one end of the long side baffle (101), a rotatable mounting hole is provided on one side of the adapter block, the length adjustment threaded rod (104) is rotatably engaged in the interior of the rotatable mounting hole, and length adjustment threaded grooves are provided at both ends of the long side baffle (101), the length adjustment threaded grooves and the length adjustment threaded rod (104) are rotatably engaged with each other.

4. The quantum chip packaging fixture according to claim 2, characterized in that: The movable support structure (3) comprises an I-shaped roller (301), a damping connection block (302), a support sleeve (303) and an extension support plate (304); the working roller is mounted inside the length-adjusting slide groove; the damping connection block (302) is arranged on one side of the I-shaped roller (301); the support sleeve (303) is mounted on the other side of the damping connection block (302) at one end; and the extension support plate (304) is arranged on one side of the damping connection block (302) at the other end.

5. The quantum chip packaging fixture according to claim 4, characterized in that: The two sides of the I-shaped roller (301) are slidably engaged with the length-adjusting slide groove, the center of the I-shaped roller (301) is slidably engaged with the limit clamping plate (103), one end of the support sleeve (303) and the damping connection block (302) are fixedly welded to each other, the extended support plate (304) is slidably engaged with the interior of the support sleeve (303), the upper surface of the extended support plate (304) and the upper surface of the support sleeve (303) are in the same plane, and one end of the extended support plate (304) and the damping connection block (302) are fixedly connected to each other.

6. The quantum chip packaging fixture according to claim 4, characterized in that: The width adjustment structure (2) comprises a wide edge baffle plate (201), a bidirectional threaded rod (202), a width adjustment telescopic rod (203), a driven bevel gear (204) and a width adjustment bevel gear (205); an installation positioning hole is arranged on the outer side of the wide edge baffle plate (201); the bidirectional threaded rod (202) is rotatably clamped inside the wide edge baffle plate (201); the width adjustment telescopic rod (203) is respectively mounted on both ends of the wide edge baffle plate (201); the driven bevel gear (204) and the bidirectional threaded rod (202) are fixedly connected to each other; the width adjustment bevel gear (205) is arranged on one side of the driven bevel gear (204); and a storage adjustment groove is arranged on the upper surface of the wide edge baffle plate (201).

7. The quantum chip packaging fixture according to claim 6, characterized in that: The wide edge baffle (201) is provided with a position adjustment slot inside, the position adjustment slot and the support sleeve frame (303) are slidably engaged with each other, a width adjustment hole is provided inside the wide edge baffle (201), the bidirectional threaded rod (202) is rotatably engaged with the inside of the width adjustment hole, the width adjustment telescopic rod (203) is respectively slidably engaged with the inside of the width adjustment hole, a width adjustment threaded hole is provided inside the width adjustment telescopic rod (203), the width adjustment threaded hole and the bidirectional threaded rod (202) are rotatably engaged with each other, a drive mounting hole is provided on one side of the width adjustment hole, the width adjustment bevel gear (205) is rotatably engaged with the inside of the drive mounting hole, a width adjustment motor (206) is fixedly mounted on the outside of the width adjustment baffle, and an output end of the width adjustment motor (206) and the width adjustment bevel gear (205) are fixedly connected with each other.

8. The quantum chip packaging fixture according to claim 6, characterized in that: The fixed structure (4) comprises a lifting motor (401), a lifting mirror image screw rod (402), a mirror image slider (403), a mirror image support rod (404) and a height connection frame (405); the lifting motor (401) is embedded and installed at one end of the storage adjustment slot; the lifting mirror image screw rod (402) is fixedly installed at the output end of the lifting motor (401); the mirror image slider (403) is respectively slidably engaged with two sides of the interior of the storage adjustment slot; a mirror image threaded hole is provided inside the mirror image slider (403); the mirror image threaded hole and the lifting mirror image screw rod (402) are mutually threadedly connected; one end of the mirror image support rod (404) is rotatably connected to the mirror image slider (403); the other end of the mirror image support rod (404) is respectively rotatably connected to two ends of the height support frame; a combination connection ring is designed on the outer side of the height connection frame (405); the combination bolt (6) is slidably engaged with the interior of the combination connection ring; one end of the combination bolt (6) is threadedly connected to a fixing nut (601).

9. The quantum chip packaging fixture according to claim 8, characterized in that: The clamping and positioning structure (5) comprises a positioning motor (501), a telescopic bidirectional screw (502), a positioning adjustment block (503), a positioning support rod (504) and a clamping card plate (505); the positioning motor (501) is fixedly mounted on one end of the height connection frame (405); the telescopic bidirectional screw (502) is fixedly mounted on the output end of the positioning motor (501); the positioning adjustment block (503) is slidably clamped on two sides of the interior of the height connection frame (405); a telescopic threaded hole is provided inside the positioning adjustment block (503); the telescopic threaded hole is respectively rotatably engaged with two ends of the telescopic bidirectional screw (502); one end of the positioning support rod (504) is rotatably connected to the positioning adjustment block (503); and the other end of the positioning support rod (504) is rotatably connected to two ends of the clamping card plate (505).

Images