Wafer manufacturing network system and private network system of semiconductor manufacturing factory

Abstract

The invention provides a wafer manufacturing network system. A production access network is provided through a core switch; the network optical line terminal equipment comprises at least one optical line terminal, isolates a production access network into a plurality of local area networks corresponding to different services and distributes bandwidths of the local area networks; the key service local area network has a preset guarantee bandwidth and is divided into a plurality of slice domains, and each slice domain corresponds to one type of manufacturing service; the optical splitter is connected with the network optical line terminal equipment and the optical network unit and transmits the service local area network to the optical network unit; the at least four optical network units are connected with terminal devices of different services through different physical isolation ports of the optical network units, and only semiconductor devices of the same kind of manufacturing services can communicate with the slice domain through the same physical isolation port. According to the invention, the local area networks are mutually independent, so that the bandwidth of the key service local area network is ensured when the abnormal flow occurs in the link, and the influence degree of safety accidents is reduced.

Description

Technical Field

[0001] The present invention relates to the field of communications, and in particular to a wafer manufacturing network system and a dedicated network system applied to a semiconductor manufacturing plant. Background Art

[0002] In the production network system of the dust-free workshop for chip processing, different VLANs (local area networks) are generally divided according to different areas. Under the same VLAN, devices and application requirements of various services will be connected. Among them, the devices and application requirements are marked and traffic is supervised according to different QoS (Quality of Service) priorities, and traffic control is performed using a first-in-first-out method.

[0003] However, this type of network is only suitable for relatively simple application scenarios. During semiconductor manufacturing, wafers will pass through a series of semiconductor equipment using different manufacturing services to complete chip manufacturing. If the continuity of key business equipment and application requirements is affected by abnormal traffic in the link and other application requirements, it will cause major security incidents. At the same time, when there is abnormal traffic in the link, the existing access network still has the problem of difficulty in troubleshooting the fault points in the link. Summary of the invention

[0004] The present invention provides a wafer manufacturing network system applied to a semiconductor manufacturing factory, which solves the technical problem of how to ensure that the key application requirements of the semiconductor factory are not affected and avoid expanding the impact of safety accidents.

[0005] According to a first aspect of the present invention, an embodiment of the present invention provides a wafer manufacturing network system applied to a semiconductor manufacturing plant, including a core switch, a network optical line terminal device, an optical splitter, and an optical network unit;

[0006] The core switch provides a production access network;

[0007] The network optical line terminal device includes at least one optical line terminal, which isolates the production access network into a number of local area networks corresponding to different services and allocates their bandwidth; the business local area network includes a key business local area network and a non-key business local area network, and the key business local area network has a preset guaranteed bandwidth; the key business local area network is sliced ​​into a number of slice domains, each slice domain corresponds to a type of manufacturing business;

[0008] The optical splitter connects the network optical line terminal device and the optical network unit to transmit the service local area network to the optical network unit;

[0009] At least four of the optical network units are connected to terminal devices of different services through different physical isolation ports; wherein, the terminal devices of the optical network units corresponding to the key business local area network are semiconductor devices, and the semiconductor devices of different manufacturing services are isolated by the physical isolation ports and do not communicate with each other; the semiconductor devices of the same manufacturing service communicate with each other through the same physical isolation ports and the same slicing domain.

[0010] Optionally, the method for slicing the critical business local area network is through hard pipe slicing private network technology.

[0011] Optionally, the manufacturing business in the critical business local area network is different manufacturing processes in the semiconductor manufacturing, the semiconductor equipment is provided with a control system, and the optical network unit is connected to the control system through the physical isolation port; the business in the non-critical business local area network is the system management business in the semiconductor manufacturing.

[0012] Optionally, the semiconductor devices of the same manufacturing business communicate with each other through the same physical isolation port and the same slice domain, specifically including:

[0013] The MAC addresses corresponding to the physically isolated ports corresponding to the semiconductor devices of the same type of manufacturing business are set to be the same;

[0014] The semiconductor devices of the same manufacturing business communicate with each other through the same MAC address and the same slice domain, and the optical line terminal mobilizes commands.

[0015] Optionally, the core switch is further configured to: monitor the traffic conditions of each business local area network in real time to obtain the real-time network load in the network optical line terminal equipment, and when the real-time network load in the network optical line terminal equipment exceeds the link bandwidth carrying threshold, adjust the network resources through dynamic bandwidth allocation technology to provide at least the preset guaranteed bandwidth for the key business local area network and its corresponding network optical line terminal.

[0016] Optionally, the method of adjusting network resources by dynamic bandwidth allocation technology to provide at least the preset guaranteed bandwidth for the key business local area network and its corresponding optical line terminal includes:

[0017] Reclaiming the bandwidth provided for the critical business local area network, and providing at least the preset guaranteed bandwidth for the critical business local area network;

[0018] Based on a preset priority strategy, the service demands in the key service local area network are queued, delayed or discarded.

[0019] Optionally, the link bandwidth includes a shared bandwidth and the preset guaranteed bandwidth;

[0020] When the real-time network load in the local area network is characterized as not exceeding the link bandwidth carrying threshold, the core switch is further configured to:

[0021] The production access network is controlled to transmit data via the shared bandwidth.

[0022] Optionally, controlling the production access network to transmit data through the shared bandwidth includes:

[0023] Obtain the bandwidth required by each local area network;

[0024] Based on the bandwidth required by each local area network, the shared bandwidth is allocated to the corresponding channel to provide the required bandwidth for the local area network of each service.

[0025] Optionally, the core switch is further configured to locate and isolate the physical isolation port with abnormal traffic based on the real-time network load when the real-time network load in the network optical line terminal device exceeds a link bandwidth carrying threshold.

[0026] According to the second aspect of the present invention, an embodiment of the present invention provides a dedicated network system for a semiconductor manufacturing plant, including an Internet exit network, a buffer zone, an office network, a security network, a research and development network, an automatic control system network, a production service network, and the wafer manufacturing network system described in any one of the first aspects of the present invention; the Internet exit network is connected to an external network, and the buffer zone acts as a firewall to limit the external network from accessing the internal network system.

[0027] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0028] In the wafer manufacturing network system of the technical solution of the present invention, the wafer manufacturing network system provides a production access network through a core switch; the network optical line terminal device includes at least one optical line terminal, which isolates the production access network into multiple local area networks corresponding to different services and allocates their bandwidth; the key business local area network has a preset guaranteed bandwidth and is divided into several slice domains, each slice domain corresponds to a type of manufacturing business; the optical splitter connects the network optical line terminal device and the optical network unit to transmit the business local area network to the optical network unit; at least four optical network units are connected to terminal devices of different services through different physical isolation ports, wherein the terminal device of the optical network unit corresponding to the key business local area network is a semiconductor device, and only semiconductor devices of the same manufacturing business can communicate with each other through the same physical isolation port and slice domain. The present invention sets the local area networks to be independent of each other, so that when abnormal traffic occurs in the link, the bandwidth of the key business local area network is guaranteed, the impact of safety accidents is reduced, and the continuity of the production network is guaranteed.

[0029] Furthermore, the core switch is also configured to locate and isolate the physical isolation port with abnormal traffic based on the real-time network load when the real-time network load in the network optical line terminal device exceeds the link bandwidth carrying threshold. Thus, the present invention can also improve the efficiency of fault handling, timely discover the fault point, and reduce the fault impact time.

[0030] In the dedicated network system of the conductor manufacturing factory of the technical solution of the present invention, the dedicated network system includes an Internet exit network, a buffer zone, an office network, a security network, a research and development network, an automatic control system network, a production service network and a wafer manufacturing network system; the Internet exit network is connected to an external network, and the buffer zone acts as a firewall to limit the external network from accessing the internal network system. By adopting the wafer manufacturing network system provided by the embodiment of the present invention, when abnormal traffic occurs in the link of the dedicated network system, the bandwidth of the key business local area network in the wafer manufacturing network system can be guaranteed, thereby reducing the impact of safety accidents and ensuring the continuity of the production network. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 is a schematic diagram of the structure of a wafer manufacturing network system provided by an embodiment of the present invention;

[0033] Figure 2 is a schematic structural diagram of a wafer manufacturing network system provided by another embodiment of the present invention;

[0034] Figure 3 It is a schematic diagram of the connection between a physical optical network unit and terminal devices of different services provided by an embodiment of the present invention;

[0035] Figure 4 It is a flowchart of a method for service communication between terminal devices provided by an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of the process of production access network work provided by an embodiment of the present invention Figure 1 ;

[0037] Figure 6 This is a schematic diagram of the process of production access network work provided by an embodiment of the present invention Figure 2 ;

[0038] Figure 7 This is a schematic diagram of the location of the wafer manufacturing network system in the industrial network structure provided by an embodiment of the present invention.

[0039] Reference numerals:

[0040] 10-Core switch;

[0041] 20-optical line terminal;

[0042] 30-splitter;

[0043] 40-optical network unit;

[0044] 61-Internet egress network;

[0045] 62-buffer;

[0046] 63-Office network;

[0047] 631-office access network;

[0048] 632-Office Service Network;

[0049] 64-Security network;

[0050] 65- R&D network;

[0051] 66-Automatic control system network;

[0052] 67-Production service network;

[0053] 68-Wafer manufacturing network system;

[0054] 69-External network. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0057] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0058] Before filing this application, the applicant has conducted a thorough study on the access networks of existing semiconductor manufacturing plants (dust-free workshops for chip processing), and proposed that in the access networks of existing semiconductor manufacturing plants, different VLANs are generally divided according to different areas, and multiple devices and application requirements are connected to the same VLAN. Among them, the devices and application requirements are marked and traffic supervised according to different QoS priorities, and traffic control is performed using a first-in-first-out method.

[0059] This type of semiconductor factory access network has the following problems:

[0060] (1) Since all devices in a VLAN share the same logical network, if a port in the VLAN fails, such as due to a configuration error or physical damage, it may cause erroneous network packets to be sent to other devices in the VLAN. These erroneous packets may be continuously broadcast or form loops in the network, consuming bandwidth and interfering with normal communications, resulting in a large-scale security incident.

[0061] (2) There are critical application requirements in the clean room that cannot be affected. However, the method of using QoS priority marking and first-in-first-out to control traffic will result in low network bandwidth utilization when there is no large amount of traffic on the network. When there is an abnormally large amount of traffic on the network, traffic control and allocation cannot be performed, and the uplink traffic will be occupied. Since network traffic is queued according to first-in-first-out, important business traffic also needs to queue, resulting in network transmission delays and affecting business.

[0062] (3) Modern workshops often have a large number of non-IT devices, which makes it difficult to use traditional semiconductor factory access networks for security management;

[0063] (4) Traditional semiconductor factory access networks cannot locate which port has abnormal traffic. When abnormal traffic occurs, network devices need to be checked layer by layer, which is time-consuming.

[0064] In view of this, the present invention proposes a new wafer manufacturing network system, which provides a production access network through a core switch; the network optical line terminal device includes at least one optical line terminal, which isolates the production access network into multiple local area networks corresponding to different services and allocates their bandwidth; the key business local area network has a preset guaranteed bandwidth and is divided into several slice domains, each slice domain corresponds to a type of manufacturing business; the optical splitter connects the network optical line terminal device and the optical network unit to transmit the business local area network to the optical network unit; at least four optical network units are connected to terminal devices of different services through different physical isolation ports, wherein the terminal device of the optical network unit corresponding to the key business local area network is a semiconductor device, and only semiconductor devices of the same manufacturing business can communicate with each other through the same physical isolation port and slice domain. The present invention sets the local area networks to be independent of each other, so that when abnormal traffic occurs in the link, the bandwidth of the key business local area network is guaranteed, the impact of safety accidents is reduced, and the continuity of the production network is guaranteed.

[0065] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0066] Please refer to Figure 1 , an embodiment of the present invention provides a wafer manufacturing network system applied to a semiconductor manufacturing factory, including a core switch 10, a network optical line terminal device, a splitter 30, and an optical network unit 40;

[0067] The core switch 10 provides a production access network;

[0068] The network optical line terminal device includes at least one optical line terminal 20, which isolates the production access network into a number of local area networks corresponding to different services and allocates their bandwidth; the business local area network includes a key business local area network and a non-key business local area network, and the key business local area network has a preset guaranteed bandwidth; the key business local area network is sliced ​​into a number of slice domains, each slice domain corresponds to a type of manufacturing business;

[0069] The optical splitter 30 connects the network optical line terminal device and the optical network unit 40 to transmit the service local area network to the optical network unit 40;

[0070] At least four of the optical network units 40 are connected to terminal devices 50 of different services through different physical isolation ports, wherein the terminal devices of the optical network units 40 corresponding to the key business local area network are semiconductor devices, and the semiconductor devices of different manufacturing services are isolated through the physical isolation ports and do not communicate with each other; the semiconductor devices of the same manufacturing service communicate with each other through the same physical isolation ports and the same slicing domain.

[0071] In one embodiment, the method for slicing the critical business local area network is through hard pipe slicing private network technology.

[0072] Among them, the hard pipe slicing private network technology allows the creation of multiple independent virtual networks in the business LAN (that is, slicing into several slice domains), and allocates specific resources and QoS to each slice domain to meet the needs of different application scenarios.

[0073] Specifically, the hard pipe slicing private network technology uses chip slicing technology and fiber slicing technology to slice the service LAN into slice domains. The chip slicing technology is used to slice the chips of the optical line terminal and the optical network unit, and the forwarding engine and forwarding table items (service flow / VLAN / MAC table items) of the optical line terminal chip are hard isolated, and the chip hardware resources between the slices do not affect each other; at the same time, the GPON port priority queue resources of the optical line terminal are independent to ensure the QoS bandwidth and scheduling of the slices. The fiber slicing technology is used to divide the slices based on the wavelength, and the services corresponding to different slice domains are physically isolated. The hardware resources used in the service message forwarding process are divided and isolated by the hard pipe slicing private network technology. After the hardware resources are divided into a certain slice, other slices can no longer use this resource, thereby realizing exclusive resource sharing and service security isolation. In actual applications, the hard pipe slicing private network technology can also realize slices of different granularities and levels by means of ports, TDM time slots (Time-Division Multiplexing, time division multiplexing time slots), etc., which are not limited here.

[0074] In one embodiment, the services in the critical business local area network include manufacturing services and equipment automation services. The manufacturing services in the critical business local area network can be understood as different manufacturing processes in the semiconductor manufacturing. The semiconductor equipment is provided with a control system, and the optical network unit is connected to the control system through the physical isolation port; the services in the non-critical business local area network are system management services in the semiconductor manufacturing.

[0075] Specifically, in semiconductor manufacturing, a semiconductor manufacturing plant includes necessary manufacturing machines for processing semiconductor wafers. During semiconductor manufacturing, semiconductor wafers go through a series of manufacturing steps using various machines, such as photolithography, etching, chemical mechanical polishing, thin film, ion implantation, diffusion, etc. Each manufacturing process has its corresponding semiconductor equipment, and these semiconductor equipment have their corresponding control systems.

[0076] As an example, the control system includes a manufacturing execution system (MES) and an equipment automation program (EAP), which are not limited here. Those skilled in the art can set the composition of the control system according to specific circumstances.

[0077] As an example, the system management service includes: material control system (MCS, Material Control System), remote control management (RCM, Remote Control Managemant), telephone, etc. It should be understood that the present invention does not limit the content of the system management service, and technicians in this field can set the composition of the system management service according to needs.

[0078] Furthermore, in the case where the optical network unit is connected to terminal devices of different services through different physically isolated ports, the method for the semiconductor devices of the same manufacturing service to communicate with each other through the same physically isolated port and the same slice domain specifically includes:

[0079] The MAC addresses corresponding to the physically isolated ports corresponding to the semiconductor devices of the same type of manufacturing business are set to be the same;

[0080] The semiconductor devices of the same manufacturing business communicate with each other through the same MAC address and the same slice domain, and the optical line terminal mobilizes commands.

[0081] It can be seen that the present invention realizes the segmentation of key business local area networks according to semiconductor devices of different businesses through hard pipe slicing private network technology, and realizes the secure isolation between slice domains without affecting each other.

[0082] In actual implementation, the specific structure of the wafer manufacturing network system can also be as follows: Figure 2 As shown, it can be seen that since the traffic transmission within the semiconductor factory (FAB) is mainly connected from the client to the server, there is basically no need for communication between clients. The present invention uses hard pipe slicing private network technology, optical line terminals combined with the second-layer port isolation of the optical network unit to ensure that the ports under the same VLAN are not connected to each other, thereby reducing the impact of non-critical services on the stability of the critical business network.

[0083] Specifically, in Figure 2 In the example of , the core switch 10 of the wafer manufacturing network system provides a production access network; Figure 2 In the example of , the wafer manufacturing network system has two core switches 10 , one of which is a candidate core switch 10 .

[0084] The optical line terminal 20 (OLT) in the network optical line terminal equipment isolates the production access network into four local area networks (Vlan10, Vlan20, Vlan30, Vlan40) corresponding to different services and allocates their bandwidth; the business local area network includes a key business local area network (Vlan10) and a non-key business local area network (Vlan20, Vlan30, Vlan40), and the key business local area network has a preset guaranteed bandwidth ( Figure 3 In the example of 1G bandwidth); the critical business local area network (Vlan10) is sliced ​​into different MES slice domains and EAP slice domains. Two optical line terminals 20 can be set in the network optical line terminal device, one of which is used as a backup; in specific operations, the network optical line terminal device can include multiple optical line terminals to ensure that the network system is running, which is not limited here, and technicians in this field can set it according to actual conditions.

[0085] In practical applications, different slicing domains correspond to different types of semiconductor machines (i.e., terminal devices). For example, an etching machine corresponds to one slicing domain, a thin film machine corresponds to one slicing domain, and so on. Since the semiconductor device is provided with a control system, Figure 2 In the example, the control system of a type of semiconductor equipment corresponding to the two MES slice domains is a manufacturing execution system (MES), and the control system of a type of semiconductor equipment corresponding to the EAP slice domain is an equipment automation program (EAP).

[0086] In a preferred embodiment, the slice domain in the critical business local area network may also have a preset guaranteed bandwidth. Figure 2 In the example, the EAP slice channel has a guaranteed bandwidth of 100M.

[0087] The optical splitter 30 connects the network optical line terminal device and the optical network unit 40, and transmits the business local area network to the optical network unit 40; the optical splitter can be set to 1, 2 or more to ensure the normal operation of the wafer manufacturing network system, and the number of optical splitters is not limited here.

[0088] The four optical network units 40 (ONU) are connected to terminal devices of different services through different physical isolation ports, wherein the terminal devices of the optical network units corresponding to the key business local area network are semiconductor devices, and the semiconductor devices of different manufacturing services are isolated through the physical isolation ports and do not communicate with each other; the semiconductor devices of the same manufacturing services communicate with each other through the same physical isolation ports and the same slicing domain.

[0089] Furthermore, in the case where the critical business local area network is divided into a plurality of slice domains, in one implementation, the method for the semiconductor devices of the same manufacturing business to communicate with each other through the same physically isolated port and the same slice domain specifically includes:

[0090] The MAC addresses corresponding to the physically isolated ports corresponding to the semiconductor devices of the same type of manufacturing business are set to be the same;

[0091] The semiconductor devices of the same manufacturing business communicate with each other through the same MAC address and the same slice domain, and the optical line terminal mobilizes commands.

[0092] In a specific implementation, the optical network unit 40 (ONU) is provided with a MAC network access point, and the optical line terminal 20 (OLT) sends a command. Figure 2 In the example shown, the two MES terminals 1 are semiconductor devices of the same manufacturing business in the same key business local area network. They can communicate with each other through the MES slicing domain and setting the same MAC address. The slicing domains and MAC addresses of MES terminal 1 and MES terminal 2 are different, and they cannot communicate with each other.

[0093] It can be seen that the present invention uses hard pipe slicing private network technology to slice the key business local area network to obtain slice domains for similar services, as well as Layer 2 port isolation that combines OLT local area network isolation and ONU physical isolation, to isolate ports that do not need to communicate, thereby reducing the impact of non-critical services on the stability of the key business network, thereby reducing the impact of the FAB access network on the business and improving business continuity.

[0094] Specifically, please refer to Figure 3 , Figure 3 The figure shows the connection between a physical optical network unit 40 (ONU) and terminal devices of different services. It can be seen that the slice domain is divided based on the slice domain identifier and VLAN, and the device hardware resources are allocated to different slices. The data traffic and hardware resources between different slices are isolated from each other.

[0095] It should be understood that the above-mentioned intercommunication achieved through MES slicing domains and setting the same MAC address is direct intercommunication. In actual work, terminal devices corresponding to different slicing domains or different business LANs can also be interconnected through core switches or firewall forwarding.

[0096] For a specific implementation, please refer to Figure 4 In the wafer manufacturing network system provided by the present invention, the method for performing business communication between terminal devices includes:

[0097] S11: Obtain a mapping relationship between an identifier of a service local area network and identifiers of each slice domain;

[0098] S12: Obtain a service local area network identifier and a slice domain identifier of the optical network unit;

[0099] S13: Based on the address relationship between the source terminal device and the target terminal device, business communication is performed. If the source terminal device and the target terminal device are located in the same slice domain, the process proceeds to S14. If the source terminal device and the target terminal device are not located in the same slice domain or are not located in the same business local area network, the process proceeds to S15.

[0100] S14: performing data communication between the source terminal device and the target terminal device;

[0101] S15: forwarding the message sent by the source terminal device through the core switch or firewall, and entering S16;

[0102] S16: Determine whether the message sent by the source terminal device complies with the core policy or the firewall policy, wherein:

[0103] If yes, go to S17; otherwise, go to S18;

[0104] S17: Perform data communication between the source terminal device and the target terminal device through layer 3 forwarding;

[0105] The three-layer forwarding may be understood as completing message forwarding through the core switch, the network optical line terminal device and the optical network unit in sequence.

[0106] S18: The message is discarded.

[0107] In actual implementation, in order to realize that the critical business local area network has a preset guaranteed bandwidth, in one implementation mode, the core switch is further configured to:

[0108] The traffic conditions of each business local area network are monitored in real time to obtain the real-time network load in the network optical line terminal equipment, and when the real-time network load in the network optical line terminal equipment exceeds the link bandwidth carrying threshold, the network resources are adjusted through the dynamic bandwidth allocation technology to provide at least the preset guaranteed bandwidth for the key business local area network and its corresponding optical line terminal 20.

[0109] It can be seen that through the DBA (Dynamic Bandwidth Allocation) dynamic bandwidth allocation technology in this embodiment, bandwidth guarantee can be set for important business local area networks. When abnormal traffic occurs in the network, the local area network connected to the control system MES / EAP corresponding to the semiconductor equipment has guaranteed bandwidth and is not affected by other network segments.

[0110] In one implementation, please refer to Figure 5 The method of adjusting network resources by dynamic bandwidth allocation technology to provide at least the preset guaranteed bandwidth for the key business local area network and its corresponding optical line terminal 20 includes:

[0111] S21: Reclaiming the bandwidth provided for the critical business local area network, and providing at least the preset guaranteed bandwidth for the critical business local area network;

[0112] S22: Based on a preset priority strategy, the service demands in the critical service local area network are queued and delayed or discarded.

[0113] In actual implementation, the link bandwidth includes the shared bandwidth and the preset guaranteed bandwidth;

[0114] In this case, when the real-time network load in the local area network is characterized as not exceeding the link bandwidth carrying threshold, the core switch is further configured to:

[0115] The production access network is controlled to transmit data via the shared bandwidth.

[0116] Furthermore, please refer to Figure 6 , when there is no abnormal traffic in the network, the method for controlling the production access network to transmit data through the shared bandwidth comprises:

[0117] S31: Obtain the bandwidth required by each local area network;

[0118] S32: Based on the bandwidth required by each local area network, the shared bandwidth is allocated to a corresponding channel to provide the required bandwidth for the local area network of each service.

[0119] When abnormal traffic occurs in the network, the core switch 10 is further configured to locate and isolate the physical isolation port with abnormal traffic based on the real-time network load when the real-time network load in the network optical line terminal device exceeds the link bandwidth carrying threshold.

[0120] Since all traffic needs to be aggregated and forwarded through the core switch 10, the core switch can fully grasp the traffic status of all nodes. At the same time, the network optical line terminal equipment can detect the power attenuation of the optical signal in the link and identify whether there is an abnormality in the link. The optical network unit can manage the connected terminal equipment through the physical isolation port and monitor the traffic and status of each port. Therefore, the present invention can monitor each node of the wafer manufacturing network system that may have problems in real time. It can be seen that when a fault occurs, the present invention can locate the fault location in time, improve the fault handling efficiency, discover the fault point in time, and reduce the fault impact time.

[0121] In summary, the wafer manufacturing network system of the present invention provides a production access network through a core switch; the network optical line terminal device includes at least one optical line terminal, which isolates the production access network into multiple local area networks corresponding to different services and allocates their bandwidth; the key business local area network has a preset guaranteed bandwidth and is divided into several slice domains, each slice domain corresponds to a type of manufacturing business; the optical splitter connects the network optical line terminal device and the optical network unit to transmit the business local area network to the optical network unit; at least four optical network units are connected to terminal devices of different services through their different physical isolation ports, wherein the terminal device of the optical network unit corresponding to the key business local area network is a semiconductor device, and only semiconductor devices of the same manufacturing business can communicate with each other through the same physical isolation port and slice domain. The present invention sets the local area networks to be independent of each other, so that when abnormal traffic occurs in the link, the bandwidth of the key business local area network is guaranteed, which reduces the impact of safety accidents and ensures the continuity of the production network.

[0122] In addition, the present invention also provides a dedicated network system for a semiconductor manufacturing plant, please refer to Figure 7 , including an Internet exit network 61, a buffer zone 62 (DMZ network), an office network 63, a security network 64, a R&D network 65, an automatic control system network 66, a production service network 67 and any of the above-mentioned wafer manufacturing network systems 68; the Internet exit network is connected to an external network 69, and the buffer zone 62 acts as a firewall to limit the external network 69 from accessing the internal network system.

[0123] Among them, the office network 63 is used to support employees' daily office needs. Figure 7 In the example, the office network 63 also includes an office access network 631 and an office service network 632.

[0124] Of course, the present invention does not limit the specific internal structure of the dedicated network system, and those skilled in the art can select a suitable network as needed.

[0125] Please continue to refer to Figure 7 It can be seen that in the wafer manufacturing network system of the present invention, the network optical line terminal equipment completes the slicing application on the access and aggregation sides of the network optical line terminal equipment. The network optical line terminal equipment also utilizes the hard pipe slicing private network technology (hard pipe slicing) of the all-optical network to isolate the production access network according to business needs, so that the business local area network includes a critical business local area network and a non-critical business local area network. At the same time, the critical business local area network is divided into several slicing domains to achieve secure isolation of the sliced ​​private network without affecting each other.

[0126] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A wafer manufacturing network system applied to a semiconductor manufacturing plant, characterized in that: Including core switches, network optical line terminal equipment, splitters, and optical network units; The core switch provides a production access network; The network optical line terminal device includes at least one optical line terminal, which isolates the production access network into a number of local area networks corresponding to different services and allocates their bandwidth; the business local area network includes a key business local area network and a non-key business local area network, and the key business local area network has a preset guaranteed bandwidth; the key business local area network is sliced ​​into a number of slice domains, each slice domain corresponds to a type of manufacturing business; The optical splitter connects the network optical line terminal device and the optical network unit to transmit the service local area network to the optical network unit; At least four of the optical network units are connected to terminal devices of different services through different physically isolated ports; wherein the terminal devices of the optical network units corresponding to the key business local area network are semiconductor devices, and the semiconductor devices of different manufacturing services are isolated through the physically isolated ports and do not communicate with each other; The semiconductor devices of the same manufacturing business communicate with each other through the same physical isolation port and the same slicing domain.

2. The wafer manufacturing network system according to claim 1, characterized in that: The method for slicing the critical business local area network is through hard pipe slicing private network technology.

3. The wafer manufacturing network system according to claim 2, characterized in that: The manufacturing business in the critical business local area network is the different manufacturing processes in the semiconductor manufacturing. The semiconductor equipment is provided with a control system, and the optical network unit is connected to the control system through the physical isolation port; the business in the non-critical business local area network is the system management business in the semiconductor manufacturing.

4. The wafer manufacturing network system according to claim 3, characterized in that: The semiconductor devices of the same manufacturing business communicate with each other through the same physical isolation port and the same slice domain, specifically including: The MAC addresses corresponding to the physically isolated ports corresponding to the semiconductor devices of the same type of manufacturing business are set to be the same; The semiconductor devices of the same manufacturing business communicate with each other through the same MAC address and the same slice domain, and the optical line terminal mobilizes commands.

5. The wafer manufacturing network system according to claim 1, characterized in that: The core switch is also configured to: monitor the traffic conditions of each business local area network in real time to obtain the real-time network load in the network optical line terminal equipment, and when the real-time network load in the network optical line terminal equipment exceeds the link bandwidth carrying threshold, adjust the network resources through dynamic bandwidth allocation technology to provide at least the preset guaranteed bandwidth for the key business local area network and its corresponding network optical line terminal.

6. The wafer manufacturing network system according to claim 5, characterized in that: The method for adjusting network resources by dynamic bandwidth allocation technology to provide at least the preset guaranteed bandwidth for the key business local area network and its corresponding optical line terminal includes: Reclaiming the bandwidth provided for the critical business local area network, and providing at least the preset guaranteed bandwidth for the critical business local area network; Based on a preset priority strategy, the service demands in the key service local area network are queued, delayed or discarded.

7. The wafer manufacturing network system according to claim 6, characterized in that: The link bandwidth includes a shared bandwidth and the preset guaranteed bandwidth; When the real-time network load in the local area network is characterized as not exceeding the link bandwidth carrying threshold, the core switch is further configured to: The production access network is controlled to transmit data via the shared bandwidth.

8. The wafer manufacturing network system according to claim 7, characterized in that: Controlling the production access network to transmit data through the shared bandwidth includes: Obtain the bandwidth required by each local area network; Based on the bandwidth required by each local area network, the shared bandwidth is allocated to the corresponding channel to provide the required bandwidth for the local area network of each service.

9. The wafer manufacturing network system according to claim 5, characterized in that: The core switch is further configured to locate and isolate the physical isolation port with abnormal traffic based on the real-time network load when the real-time network load in the network optical line terminal device exceeds a link bandwidth carrying threshold.

10. A dedicated network system for a semiconductor manufacturing plant, characterized in that: It includes an Internet exit network, a buffer zone, an office network, a security network, a research and development network, an automatic control system network, a production service network and the wafer manufacturing network system as described in any one of claims 1 to 9; the Internet exit network is connected to an external network, and the buffer zone acts as a firewall to limit the external network from accessing the internal network system.

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