Leveling device for PCB processing

Abstract

The invention belongs to the technical field of PCB processing, and discloses a leveling device for PCB processing, the leveling device comprises a mounting frame and a hot pressing box, the side surface of the mounting frame is provided with a feeding port, a waste port and a discharging port from top to bottom, and a hydraulic push rod is fixedly mounted in the mounting frame. The warping PCB without the adsorption effect is directly and automatically guided out in a sliding mode, the flat PCB which is adsorbed and fixed is aligned with the discharging port after crossing the waste port, the contact pressure sensor arranged at the position corresponding to the outlet is used for cooperatively controlling starting and stopping of the vacuum pump, and therefore the warping PCB can be automatically guided out. According to the device, the PCB which is deflected to a specified outlet after being adsorbed is directionally discharged, so that the leveled PCB is subjected to leveling quality screening, the leveled and still warped PCB is actively separated, the actual screening is simple and rapid, the screening difficulty is reduced, the product quality is improved, and the production efficiency is improved. And in addition, secondary leveling can be conveniently carried out on products which are not completely leveled after screening, and the comprehensive leveling efficiency is greatly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB processing, and in particular relates to a leveling device for PCB board processing. Background Art

[0002] PCB boards are made of a variety of materials such as copper foil, resin, and glass cloth. During the processing of PCB boards, due to the influence of various factors, the physical and chemical properties of these materials are different. There is a risk of deformation during the processing. For PCB boards that have been completely deformed, it is necessary to add a leveling device to perform leveling processing.

[0003] The leveling device used for PCB board processing in the prior art adopts the upper and lower extrusion forces when performing the leveling process, and uses the external heating equipment to realize the hot pressing and leveling of the warped PCB board under hot pressing, and transfers and cools after leveling to realize the leveling process and maintain the flatness of the PCB board. However, after the actual processing, some PCB boards still have partial warping problems after the hot pressing and leveling pressure is removed, and actually have a leveling defect rate, and the flat PCB boards that appear in the leveling process are difficult to distinguish, and are mixed with the completely leveled PCB boards after the leveling process, affecting the output quality. It is necessary to add a screening process to dry out the defective PCB boards that are not completely leveled from the collected leveled PCB boards. However, the actual screening is difficult and the operation is cumbersome, which greatly reduces the processing efficiency after leveling and the use effect is not good. Summary of the invention

[0004] The object of the present invention is to provide a leveling device for PCB board processing to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a flattening device for PCB board processing, comprising a mounting frame and a hot press box, the side of the mounting frame is respectively provided with a loading port, a waste port and a discharging port from top to bottom, a hydraulic push rod is fixedly installed inside the mounting frame, the movable end of the hydraulic push rod is fixedly connected to a control component, a composite carrier is arranged above the control component, a mounting component is fixedly arranged at the bottom of the composite carrier, the mounting component is rotatably installed in the control component, a loading part is arranged on the side of the mounting frame, a hot press insulation part is fixedly arranged inside the hot press box, a flattening part is movably installed inside the hot press insulation part,

[0006] The control component controls the tilt and swing of the composite platform through the mounting component.

[0007] The composite carrier includes a platform body, an internal cavity, an air hole and a vacuum pump. The platform body is fixed on the top of the mounting assembly, the internal cavity is opened inside the platform body, the air hole is opened on the top of the platform body and is connected to the internal cavity, and the suction end of the vacuum pump is connected to the internal cavity.

[0008] Preferably, the waste port and the discharge port are both inclined ports, the loading port is a horizontal opening, and a top port is provided at the top of the installation frame.

[0009] Preferably, the control component includes a support seat, a tooth plate and an electric push rod, the support seat is fixed on the movable end of the hydraulic push rod, the tooth plate is located on the outside of the support seat, the electric push rod is fixed to the side of the support seat through a bracket, the movable end of the electric push rod is fixedly connected to the tooth plate through a connecting block, and the electric push rod pushes the tooth plate to move laterally.

[0010] Preferably, the mounting assembly includes a mounting column, a rotating shaft and a gear, one end of the mounting column is sleeved on the top of the support seat, the rotating shaft is rotatably sleeved in the support seat and fixedly sleeved in the mounting column, the gear is fixedly sleeved on the outer surface of the rotating shaft and meshingly connected with the gear plate, and the top of the mounting column is fixedly connected to the platform.

[0011] Preferably, the composite carrier also includes a baffle, a curved rod and a spring 1, the baffle is located on the right side of the platform body, one end of the curved rod is fixedly connected to the bottom of the baffle, and the other end is movably sleeved on the bottom of the platform body, the spring 1 is fixed in the bottom chamber of the platform body, and the other end is fixedly connected to the curved rod, and the vacuum pump is fixed to the bottom of the platform body.

[0012] Preferably, the loading part includes a loading frame, a loading push rod and a push plate. The loading frame is fixedly connected to the left side of the mounting frame and is connected to the loading port. The push plate is movably sleeved in the loading frame. The loading push rod is fixed to the mounting frame through a mounting frame. The loading push rod controls the lateral movement of the push plate.

[0013] Preferably, the hot pressing insulation part includes an insulation frame, an assembly groove, a heating tube and a limit column. The insulation frame is fixedly nested in the hot pressing box, the assembly groove is opened inside the insulation frame, the heating tube is fixedly installed in the assembly groove, and the limit column is fixedly connected to the top of the inner cavity of the insulation frame.

[0014] Preferably, the flattening part includes a movable rod, an insulation plate, a heat-conducting pressure plate and a spring, the movable rod is movably sleeved on the top of the hot press box, and the inner end extends to the interior of the insulation frame, the insulation plate is fixedly connected to the lower end of the movable rod, the heat-conducting pressure plate is fixedly connected to the bottom of the insulation plate, the spring is fixedly connected to the top of the inner cavity of the insulation frame, and its lower end is fixedly connected to the insulation plate.

[0015] Preferably, the spring sleeve is arranged outside the movable rod, and the heat insulation plate is located below the limiting column.

[0016] The beneficial effects of the present invention are as follows:

[0017] 1. The present invention utilizes the combination of a composite carrier, a control component, a mounting component, and a waste port and a discharge port. After hot pressing and leveling after loading and upward movement, the vacuum pump and the air holes distributed in a high-density array are used to perform negative pressure adsorption on the leveled PCB board. The PCB board that is still warped after leveling cannot be adsorbed on the top of the platform, while the PCB board that is completely leveled is adsorbed and fixed on the platform. The effects of different states of the PCB board are utilized, the tilting and swinging of the platform is coordinated with the waste port located at the top, and the warped PCB board without adsorption is directly adsorbed. The PCB board is automatically exported by sliding, and the flat PCB board fixed by adsorption is aligned with the discharge port after passing the waste port, and the contact pressure sensor set at the corresponding outlet position is used to control the start and stop of the vacuum pump to directional discharge the PCB board deflected to the designated outlet after adsorption, so that the leveling quality of the PCB board is screened after leveling, and the PCB board that is still warped after leveling is actively separated. The actual screening is simple and fast, which reduces the difficulty of screening and improves the product quality. It is also convenient for secondary leveling of incompletely leveled products after screening, which greatly improves the overall leveling efficiency.

[0018] 2. The present invention utilizes the arrangement of the waste port and the discharge, and coordinates the actions of the composite carrier, the control component and the installation component to achieve the above-mentioned automatic quality inspection and screening, and also realizes automatic separation and discharge of good and defective products, thereby avoiding the need for additional discharge equipment for the PCB boards after leveling. The overall discharge operation is simple and fast, the continuous processing and leveling efficiency is high, the intermediate discharge process is simple, the time consumption is short, and the use effect is good.

[0019] 3. The present invention utilizes the cooperation of the hot pressing insulation part and the flattening part, and utilizes the supporting effect of the hydraulic push rod and the composite carrier to achieve heating, pressing and flattening of the PCB board confined in the insulation zone, and automatically achieves thermal insulation and sealing of the insulation zone when pushing out of the insulation zone for screening and discharging, effectively limiting the loss of internal heat, ensuring that the heat will not decrease too much during the continuous hot pressing and flattening process, saving energy, and improving the efficiency of continuous hot pressing and flattening through constant insulation hot pressing treatment, avoiding the need to extend the hot pressing and flattening time due to insufficient heat in the middle, and further improving the flattening efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the present invention;

[0021] Figure 2 It is a cross-sectional schematic diagram of the present invention;

[0022] Figure 3 It is a schematic diagram of the installation of the installation components and the control components of the present invention;

[0023] Figure 4 It is an exploded schematic diagram of the control assembly of the present invention;

[0024] Figure 5 A schematic diagram of the installation assembly of the present invention;

[0025] Figure 6 is a cross-sectional schematic diagram of the composite carrier of the present invention;

[0026] Figure 7 It is a cross-sectional schematic diagram of the flattening part and the hot pressing and heat preservation part of the present invention;

[0027] Figure 8 It is a schematic diagram of the hot pressing and heat preservation part of the present invention;

[0028] Fig. 9 It is a schematic diagram of the feeding part of the present invention;

[0029] Fig.10 It is a schematic diagram of the installation frame of the present invention.

[0030] In the figure: 1. installation frame; 2. waste outlet; 3. discharge outlet; 4. hot press box; 5. hydraulic push rod; 6. composite carrier; 61. platform; 62. internal cavity; 63. air hole; 64. vacuum pump; 65. baffle; 66. bending rod; 67. spring 1; 7. control component; 71. support seat; 72. tooth plate; 73. electric push rod; 8. installation component; 81. installation column; 82. rotating shaft; 83. gear; 9. feeding part; 91. feeding frame; 92. feeding push rod; 93. push plate; 10. feeding port; 11. hot pressing insulation part; 111. insulation frame; 112. assembly groove; 113. heating tube; 114. limit column; 12. flattening part; 121. movable rod; 122. heat insulation board; 123. heat conductive pressure plate; 124. spring; 13. top opening. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] like Figures 1 to 10As shown, the embodiment of the present invention provides a leveling device for PCB board processing, including a mounting frame 1 and a hot press box 4, the side of the mounting frame 1 is respectively provided with a loading port 10, a waste port 2 and a discharging port 3 from top to bottom, a hydraulic push rod 5 is fixedly installed inside the mounting frame 1, and the movable end of the hydraulic push rod 5 is fixedly connected to a control component 7, a composite carrier 6 is provided above the control component 7, a mounting component 8 is fixedly provided at the bottom of the composite carrier 6, and the mounting component 8 is rotatably installed in the control component 7, and a loading port 10 is provided on the side of the mounting frame 1. Part 9, the internal fixed sleeve of the hot press box 4 is provided with a hot press insulation part 11, and the internal movably installed flattening part 12 of the hot press insulation part 11, the control component 7 controls the tilt and swing of the composite carrier 6 through the mounting component 8, the composite carrier 6 includes a table body 61, an internal cavity 62, an air hole 63 and a vacuum pump 64, the table body 61 is fixed on the top of the mounting component 8, the internal cavity 62 is opened in the inside of the table body 61, the air hole 63 is opened on the top of the table body 61, and is connected with the internal cavity 62, and the suction end of the vacuum pump 64 is connected with the internal cavity 62.

[0033] Embodiment 1: When in use, start the hydraulic push rod 5 to drive the top composite carrier 6 to move, and move it to one side of the loading port 10, place the PCB board to be flattened in the loading part 9, start the loading push rod 92, and the electrically controlled telescopic loading push rod 92 drives the push plate 93 to move horizontally, and the push plate 93 pushes the PCB board along the loading port 10 and the auxiliary frame on one side of the loading port 10 to the top of the table body 61 of the composite carrier 6 along the loading frame 91, and the PCB board pushes the baffle 65 to achieve limiting and positioning, start the hydraulic push rod 5, drive the PCB board to move upward, pass through the top port 13, and be squeezed with the flattening part 12 in the hot press box 4, maintain the pressure state, keep the internal heating, complete the flattening process, and after the flattening is completed, lower the composite carrier 6, and when the top of the PCB board is separated from the flattening part 12, start the vacuum pump 64, and the vacuum pump 64 sucks upward through the internal cavity 62 and the air hole 63. When plate B is still uneven, the vacuum pump 64 continues to draw air from the top gap through the air hole 63, and then the control component 7 is started. The electric push rod 73 drives the tooth plate 83 to move horizontally, and drives the meshing gear 83 to rotate, so that the mounting component 8 is deflected, and the table 61 is deflected toward the waste port 2. When the PCB board is still uneven, the PCB board on the top of the table 61 slides down when tilting without a positioning effect, and slides out along the waste port 2. When the PCB board is leveled and maintains flatness, when the vacuum pump 64 is started, the PCB board is adsorbed and fixed through the air hole 63, and the PCB board is stably fixed on the table 61. When the table 61 passes the waste port 2 and continues to tilt until it is aligned with the discharge port 3, the external pressure sensor senses the extreme position of the table 61 and controls the vacuum pump 64 to close, and the air pressure inside the internal cavity 62 is restored. The PCB board that loses adsorption and fixation slides out independently along the discharge port 3, completing the screening and discharge.

[0034] First, by utilizing the composite carrier 6, the control component 7, the mounting component 8, the waste port 2, and the discharge port 3, after hot pressing and leveling after loading and upward movement, the vacuum pump 64 and the air holes 63 with high-density array distribution are used to negatively adsorb the leveled PCB upwards. For PCB boards that are still warped after leveling, they cannot be adsorbed on the top of the platform 61, while the PCB boards that are completely leveled are adsorbed and fixed on the platform 61. In addition, by utilizing the effects of different states of the PCB boards, in conjunction with the tilting and swinging of the platform 61 and the waste port 2 located above, the warped PCB boards that are not adsorbed can be directly adsorbed. The PCB board is automatically slid out, and the flat PCB board fixed by adsorption is aligned with the discharge port 3 after passing the waste port 2, and the contact pressure sensor arranged at the corresponding outlet position is used to control the start and stop of the vacuum pump 64, so that the PCB board deflected to the designated outlet after adsorption is directed out, so that the leveling quality of the PCB board is screened after leveling, and the PCB board that is still warped after the leveling treatment is actively separated. The actual screening is simple and fast, which reduces the difficulty of screening and improves the product quality. It is also convenient for secondary leveling of incompletely leveled products after screening, which greatly improves the overall leveling efficiency.

[0035] In addition, by utilizing the arrangement of the waste port 2 and the discharge port 3, and coordinating the actions of the composite carrier 6, the control component 7 and the installation component 8, the above-mentioned automatic quality inspection and screening is realized, and automatic separation and discharge of good and defective products is also realized, avoiding the need for additional discharge equipment for the PCB boards after leveling processing. The overall discharge operation is simple and fast, the continuous processing and leveling efficiency is high, the intermediate discharge process is simple, the time consumption is short, and the use effect is good.

[0036] The waste port 2 and the discharge port 3 are both inclined ports, the loading port 10 is a horizontal opening, and a top port 13 is provided at the top of the installation frame 1 .

[0037] By utilizing the inclined waste port 2 and the discharge port 3 , the PCB boards can be automatically discharged conveniently, and the horizontally opened loading port 10 guides and pushes the PCB boards to be processed to the top of the platform 61 .

[0038] Among them, the control component 7 includes a support seat 71, a tooth plate 72 and an electric push rod 73. The support seat 71 is fixed on the movable end of the hydraulic push rod 5, the tooth plate 72 is located on the outer side of the support seat 71, and the electric push rod 73 is fixed on the side of the support seat 71 through a bracket. The movable end of the electric push rod 73 is fixedly connected to the tooth plate 72 through a connecting block. The electric push rod 73 pushes the tooth plate 72 to move laterally. The mounting component 8 includes a mounting column 81, a rotating shaft 82 and a gear 83. One end of the mounting column 81 is sleeved on the top of the support seat 71, the rotating shaft 82 is rotatably sleeved in the support seat 71, and is fixedly sleeved in the mounting column 81. The gear 83 is fixedly sleeved on the outer surface of the rotating shaft 82 and is meshed with the tooth plate 72. The top of the mounting column 81 is fixedly connected to the platform 61.

[0039] The lateral pushing is achieved through the control component 7, and the swing control of the installation component 8 is realized in cooperation with the installation component 8, which is specifically achieved through the meshing of the tooth plate 72 and the gear 83, thereby controlling the swing and tilt control of the composite carrier 6, switching different angles, and realizing screening and automatic discharging.

[0040] Among them, the composite carrier 6 also includes a baffle 65, a bent rod 66 and a spring 67. The baffle 65 is located on the right side of the platform 61. One end of the bent rod 66 is fixedly connected to the bottom of the baffle 65, and the other end is movably sleeved on the bottom of the platform 61. The spring 67 is fixed in the bottom chamber of the platform 61, and the other end is fixedly connected to the bent rod 66. The vacuum pump 64 is fixed at the bottom of the platform 61.

[0041] The composite carrier 6 is used to support and place the PCB board, and the vacuum pump 64 and the air hole 63 are used to screen the PCB board after leveling. The baffle 65 is connected with the curved rod 66 and the spring 67 to achieve limit control during the loading process and basic positioning. The elastic connection adapts to the contact of the top flattening part 12, which is convenient for compression and hiding.

[0042] Among them, the loading part 9 includes a loading frame 91, a loading push rod 92 and a push plate 93. The loading frame 91 is fixedly connected to the left side of the installation frame 1 and is connected to the loading port 10. The push plate 93 is movably sleeved in the loading frame 91. The loading push rod 92 is fixed to the installation frame 1 through a mounting frame. The loading push rod 92 controls the lateral movement of the push plate 93.

[0043] The loading part 9 realizes active loading and replenishment, realizes continuous leveling processing, and can add a conveying mechanism, cooperate with electrical control, further automatically and continuously convey the PCB to be processed to the loading part 9, and realize the loading processing.

[0044] The hot pressing and heat preservation part 11 includes a heat preservation frame 111, an assembly groove 112, a heating tube 113 and a limiting column 114. The heat preservation frame 111 is fixedly nested in the hot pressing box 4. The assembly groove 112 is opened inside the heat preservation frame 111. The heating tube 113 is fixedly installed in the assembly groove 112. The limiting column 114 is fixedly connected to the top of the inner cavity of the heat preservation frame 111. The flattening part 12 includes a movable rod 121, a heat insulation plate 122, a heat conductive pressure plate 123 and a spring 124. The movable rod 121 is movably sleeved on the top of the hot press box 4, and the inner end extends to the inside of the insulation frame 111, the insulation board 122 is fixedly connected to the lower end of the movable rod 121, the heat-conducting pressure plate 123 is fixedly connected to the bottom of the insulation board 122, the spring 124 is fixedly connected to the top of the inner cavity of the insulation frame 111, and its lower end is fixedly connected to the insulation board 122, the spring 124 is sleeved on the outside of the movable rod 121, and the insulation board 122 is located below the limit column 114.

[0045] The hot pressing and heat preservation part 11 provides a hot pressing and leveling space, and realizes the heat preservation treatment of the hot air after heating to avoid heat loss. It maintains long-term energy-saving heat treatment for the intermittent processing and leveling of different PCB boards. In combination with the elastically arranged flattening part 12 and the arrangement of the heat-conducting pressure plate 123 and the heat insulation plate 122 in the flattening part 12, it actively insulates and seals when the PCB board is pushed out, thereby improving the heat preservation effect. The leveling operation is simple and quick, thereby improving the efficiency and quality of hot pressing and leveling.

[0046] Embodiment 2: When hot pressing is performed, as the PCB board is lifted up, the top surface of the PCB board contacts the heat-conducting pressure plate 123 of the flattening part 12, and as the hydraulic push rod 5 continues to push upward, the PCB board is pressed between the heat-conducting pressure plate 123 and the table 61, and at the same time the entire flattening part 12 is pushed upward, so that the heat-conducting pressure plate 123 moves upward to the inside of the hot pressing and heat-insulating part 11, and the table 61 moves to the inside of the top opening 13, and the bottom of the hot pressing and heat-insulating part 11 is sealed by the table 61, and the heat insulation is The top of the plate 122 is released from the limit column 114 to complete the positioning, the spring 124 is compressed, the heating tube 113 is kept started and maintained in a pressed state, the PCB board completes hot pressing at high temperature, and after the hot pressing is completed, the table 61 moves downward and resets, the flattening part 12 moves downward synchronously, the spring 124 resets, and the insulation plate 122 moves to be sleeved in the top opening 13, and cooperates with the insulation frame 111 to fully insulate the inside of the insulation frame 111, keep the heating tube 113 started, and wait for the next round of flattening operation.

[0047] Firstly, by utilizing the cooperation of the hot pressing insulation part 11 and the flattening part 12, and utilizing the supporting effect of the hydraulic push rod 5 and the composite carrier 6, the PCB board is confined in the insulation zone for heating, pressing and flattening, and the insulation zone is automatically insulated and sealed when it is pushed out of the insulation zone for screening and discharging, thereby effectively limiting the loss of internal heat and ensuring that the heat does not decrease too much during the continuous hot pressing and flattening process. While saving energy, the efficiency of continuous hot pressing and flattening is improved through constant insulation hot pressing treatment, avoiding the need to extend the hot pressing and flattening time due to insufficient heat in the middle, thereby further improving the flattening efficiency.

[0048] The working principle and use process of the present invention are as follows: when in use, the hydraulic push rod 5 is started to drive the top composite carrier 6 to move and move to one side of the loading port 10, the PCB board to be flattened is placed in the loading part 9, the loading push rod 92 is started, and the electrically controlled telescopic loading push rod 92 drives the push plate 93 to move horizontally, and the push plate 93 pushes the PCB board along the loading port 10 and the auxiliary frame on one side of the loading port 10 to the top of the table body 61 of the composite carrier 6 along the loading frame 91, and the PCB board pushes the baffle 65 to achieve limiting and positioning, and the hydraulic push rod 5 is started to drive the PCB board to move upward, pass through the top port 13, and squeeze with the flattening part 12 in the hot press box 4, maintain the pressure state, and keep the internal heating, After the leveling process is completed, the composite carrier 6 is lowered. When the top of the PCB board is separated from the flattening part 12, the vacuum pump 64 is started. The vacuum pump 64 sucks upward through the internal cavity 62 and the air hole 63. When the PCB board is still uneven, the vacuum pump 64 continues to suck air from the top gap through the air hole 63. Then the control component 7 is started, and the electric push rod 73 drives the gear plate 83 to move horizontally, and drives the meshing gear 83 to rotate, so that the mounting component 8 deflects, and the table body 61 deflects toward the waste port 2. When the PCB board is still uneven, the PCB board on the top of the table body 61 slides down when tilting without a positioning effect, and slides out along the waste port 2. When the PCB board is leveled and remains flat, the vacuum pump When 64 is started, the PCB board is fixed by adsorption through the air hole 63, and the PCB board is stably fixed on the table 61. When the table 61 passes the waste port 2 and continues to tilt until it is aligned with the discharge port 3, the external pressure sensor senses the limit position of the table 61 and controls the vacuum pump 64 to close, and the air pressure inside the internal cavity 62 is restored. The PCB board that loses adsorption and fixation slides out independently along the discharge port 3, completing the screening and discharge; when hot pressing is performed, as the PCB board is lifted up, the top surface of the PCB board contacts the heat-conducting pressure plate 123 of the flattening part 12, and in the process of the hydraulic push rod 5 continuously pushing upward, the PCB board is pressed between the heat-conducting pressure plate 123 and the table 61, and at the same time the entire flattening part 12 is pushed upward. The heat-conducting pressure plate 123 moves upward to the inside of the hot pressing and heat preservation part 11, and the table 61 moves to be located inside the top opening 13, and the bottom of the hot pressing and heat preservation part 11 is sealed by the table 61. At this time, the top of the insulation plate 122 is released from the limit column 114, and the positioning is completed. The spring 124 is compressed to keep the heating tube 113 started and maintained in a pressed state. The PCB board completes hot pressing at high temperature. After the hot pressing is completed, the table 61 moves downward and resets, and the flattening part 12 moves downward synchronously, the spring 124 resets, and the insulation plate 122 moves and is sleeved in the top opening 13, and cooperates with the insulation frame 111 to fully insulate the inside of the insulation frame 111, and keep the heating tube 113 started, waiting for the next round of flattening operation.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A leveling device for PCB board processing, comprising a mounting frame (1) and a hot press box (4), characterized in that: The side of the installation frame (1) is respectively provided with a loading port (10), a waste port (2) and a discharging port (3) from top to bottom; a hydraulic push rod (5) is fixedly installed inside the installation frame (1); a movable end of the hydraulic push rod (5) is fixedly connected to a control component (7); a composite carrier (6) is provided above the control component (7); a mounting component (8) is fixedly provided at the bottom of the composite carrier (6); the mounting component (8) is rotatably installed in the control component (7); a loading portion (9) is provided on the side of the installation frame (1); a hot pressing and heat preservation portion (11) is fixedly provided inside the hot pressing and heat preservation portion (11); a flattening portion (12) is movably installed inside the hot pressing and heat preservation portion (11); The control component (7) controls the composite platform (6) to tilt and swing via the mounting component (8). The composite carrier (6) comprises a platform (61), an internal cavity (62), an air hole (63) and a vacuum pump (64); the platform (61) is fixed on the top of the mounting assembly (8); the internal cavity (62) is opened inside the platform (61); the air hole (63) is opened on the top of the platform (61) and is connected to the internal cavity (62); and the suction end of the vacuum pump (64) is connected to the internal cavity (62).

2. A leveling device for PCB board processing according to claim 1, characterized in that: The waste port (2) and the discharge port (3) are both inclined ports, the loading port (10) is a horizontal opening, and a top port (13) is provided at the top of the installation frame (1).

3. A leveling device for PCB board processing according to claim 2, characterized in that: The control assembly (7) comprises a support seat (71), a tooth plate (72) and an electric push rod (73); the support seat (71) is fixed on the movable end of the hydraulic push rod (5); the tooth plate (72) is located on the outer side of the support seat (71); the electric push rod (73) is fixed on the side of the support seat (71) through a bracket; the movable end of the electric push rod (73) is fixedly connected to the tooth plate (72) through a connecting block; and the electric push rod (73) pushes the tooth plate (72) to move laterally.

4. The leveling device for PCB board processing according to claim 3 is characterized in that: The mounting assembly (8) comprises a mounting column (81), a rotating shaft (82) and a gear (83); one end of the mounting column (81) is sleeved on the top of the support seat (71); the rotating shaft (82) is rotatably sleeved in the support seat (71) and fixedly sleeved in the mounting column (81); the gear (83) is fixedly sleeved on the outer surface of the rotating shaft (82) and meshedly connected with the toothed plate (72); and the top of the mounting column (81) is fixedly connected to the platform (61).

5. A leveling device for PCB board processing according to claim 4, characterized in that: The composite carrier (6) further comprises a baffle (65), a curved rod (66) and a spring (67); the baffle (65) is located on the right side of the platform (61); one end of the curved rod (66) is fixedly connected to the bottom of the baffle (65), and the other end is movably sleeved on the bottom of the platform (61); the spring (67) is fixed in the bottom chamber of the platform (61), and the other end is fixedly connected to the curved rod (66); the vacuum pump (64) is fixed to the bottom of the platform (61).

6. A leveling device for PCB board processing according to claim 5, characterized in that: The feeding part (9) comprises a feeding frame (91), a feeding push rod (92) and a push plate (93); the feeding frame (91) is fixedly connected to the left side of the mounting frame (1) and is communicated with the feeding port (10); the push plate (93) is movably sleeved in the feeding frame (91); the feeding push rod (92) is fixed to the mounting frame (1) through a mounting frame; and the feeding push rod (92) controls the lateral movement of the push plate (93).

7. A leveling device for PCB board processing according to claim 6, characterized in that: The hot pressing heat preservation part (11) comprises a heat preservation frame (111), an assembly groove (112), a heating tube (113) and a limiting column (114); the heat preservation frame (111) is fixedly nested in the hot pressing box (4); the assembly groove (112) is arranged inside the heat preservation frame (111); the heating tube (113) is fixedly installed in the assembly groove (112); and the limiting column (114) is fixedly connected to the top of the inner cavity of the heat preservation frame (111).

8. The leveling device for PCB board processing according to claim 7 is characterized in that: The flattening portion (12) comprises a movable rod (121), a heat insulating plate (122), a heat conductive pressure plate (123) and a spring (124); the movable rod (121) is movably sleeved on the top of the hot press box (4), and the inner end thereof extends to the interior of the heat preservation frame (111); the heat insulating plate (122) is fixedly connected to the lower end of the movable rod (121); the heat conductive pressure plate (123) is fixedly connected to the bottom of the heat insulating plate (122); the spring (124) is fixedly connected to the top of the inner cavity of the heat preservation frame (111), and the lower end thereof is fixedly connected to the heat insulating plate (122).

9. A leveling device for PCB board processing according to claim 8, characterized in that: The spring (124) is sleeved on the outside of the movable rod (121), and the heat insulation plate (122) is located below the limiting column (114).

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