Backside illumination CCD (charge coupled device) structure with output short circuit prevention structure

CN119521814APending Publication Date: 2025-02-25THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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Patent Information

Application Number
CN202411659268.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2025-02-25

AI Technical Summary

Technical Problem

In the output amplifier area, existing back-illuminated CCD devices have a risk of shorting the lead between the output pressure point and the ceramic shell pad, and sensitive analog signals are susceptible to high-speed driving pulses, resulting in unreliability of the device.

Method used

By etching on the silicon-based substrate, the first and second etching grooves are formed, the metal leads are prevented from shorting from the silicon-based substrate, and the output pressure points are independently arranged, away from other driving pressure points, and only the DC drive leads are arranged near the output pressure points, and away from the AC drive leads, reducing interference from sensitive analog signals.

Benefits of technology

It effectively avoids the problem that the device cannot work properly due to shorting, and reduces the risk of interference from sensitive analog signals, improving the reliability of the device.

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Abstract

The invention discloses a back-illuminated CCD (charge coupled device) structure with an output short circuit prevention structure, which comprises a silicon-based substrate and a photosensitive area, a storage area and an output amplifier area which are formed on the silicon-based substrate, and is characterized in that the output amplifier area is provided with an output amplifier, an output pressure point, a direct-current driving lead, an alternating-current connecting lead, a driving pressure point and a tube shell bonding pad; the output pressure point and the driving pressure point are connected with the tube shell bonding pad through metal leads, a first etching groove is formed in the silicon-based substrate on the side, facing the tube shell bonding pad area, of the output pressure point in an etching mode, and a second etching groove is formed in the silicon-based substrate on the side, facing the tube shell bonding pad area, of the driving pressure point in an etching mode. In the invention, the silicon substrate in the direction from the output pressure point to the metal lead of the tube shell bonding pad is etched to form the groove morphology, so that the phenomenon that the device cannot work due to the fact that the metal lead from the output pressure point to the tube shell bonding pad is in electrical contact with the substrate when the CCD device is packaged is avoided, and the reliability of the device is ensured.
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