Preparation method of high-reliability red light LED nixie tube

Abstract

The invention relates to the technical field of LED nixie tube preparation, and discloses a high-reliability red light LED nixie tube preparation method, which comprises the following steps: selecting a flip blue light LED chip; the method comprises the following steps: designing a corresponding bonding pad position on a PCB (Printed Circuit Board), and preparing solder paste for fixing; placing the flip blue-light LED chip on the bonding pads of the PCB, and fixing the flip blue-light LED chip by using solder paste, so that good electrical connection is formed between the flip blue-light LED chip and the bonding pads on the two sides of the flip blue-light LED chip; packaging glue with red fluorescent powder is injected into a light-emitting cavity of the LED nixie tube shell; the PCB provided with the flip LED chip is put into the nixie tube shell filled with the packaging glue filled with the red fluorescent powder in advance, and then curing treatment is carried out, so that all the components are firmly combined together. The flip blue light LED chips are adopted, aluminum wire connection is eliminated, and the structural stability and reliability are remarkably improved; and by simplifying the production process and reducing material waste, the overall production cost is effectively reduced, and the economic benefit is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of LED digital tube preparation, and in particular to a method for preparing a high-reliability red LED digital tube. Background Art

[0002] Red LED digital tubes are widely used in various display and lighting applications. Traditional red LED digital tubes usually adopt the solid crystal wire bonding process, and their internal structure includes PCB pads, conductive silver glue, upright red LED chips and aluminum wires. However, this structure has multiple contact points (PCB pad 1-conductive silver glue-LED upright red light chip-aluminum wire; aluminum wire-PCB pad 2). Any unstable contact point may cause poor contact, resulting in reliability problems. In particular, the aluminum wire connecting the LED chip and the PCB pad is very thin and is prone to collapse under external force, which seriously affects the stability and life of the product. In addition, in the traditional production process, since some unit points are located at the edge of the LED digital tube, it is easy for fingers to touch the aluminum wire during operation, resulting in an increase in the defective rate. Therefore, we propose a method for preparing a high-reliability red LED digital tube. Summary of the invention

[0003] The main purpose of the present invention is to provide a method for preparing a red light LED digital tube with high reliability, which can effectively solve the problems in the background technology.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] A method for preparing a high-reliability red LED digital tube comprises the following steps:

[0006] S1: Select flip-chip blue LED chip;

[0007] S2: Design the corresponding pad positions on the PCB board and prepare solder paste for fixing;

[0008] S3: placing the flip-chip blue LED chip on the pads of the PCB board and fixing it with solder paste to form a good electrical connection between the flip-chip blue LED chip and the pads on both sides;

[0009] S4: injecting red phosphor packaging glue into the light-emitting cavity of the LED digital tube shell;

[0010] S5: Place the PCB board with the flip-chip LED chip installed into the digital tube housing pre-filled with red phosphor packaging glue, and then perform a curing process to firmly combine all components together.

[0011] Preferably, in S3, the flip-chip blue LED chip is placed on the pad of the PCB board and fixed with solder paste. In this step, both the workbench and the operator need to take anti-static measures to prevent static electricity from damaging the chip.

[0012] Preferably, in S3, a reflow soldering machine is used to fix the flip-chip blue LED chip on the soldering pad of the PCB board through reflow soldering.

[0013] Preferably, the red phosphor is a nitride system red phosphor, and the proportion of the red phosphor in the red phosphor packaging glue is 4-8%.

[0014] Preferably, in S4, injecting a red fluorescent powder packaging glue into the light-emitting cavity of the LED digital tube housing comprises the following steps:

[0015] S401: Clean the LED digital tube housing to ensure that the interior of the light-emitting cavity is clean and dust-free, and check whether the LED digital tube housing is damaged or cracked to ensure its integrity;

[0016] S402: Load the degassed colloid into a syringe or a dispensing machine, remove the air in the syringe or the dispensing machine, and ensure smooth flow of the colloid;

[0017] S403: Align the needle of the syringe or dispensing machine to the entrance of the light-emitting cavity of the LED digital tube housing, and slowly and evenly inject the colloid to avoid generating bubbles;

[0018] S404: After the injection is completed, check whether there is an unfilled part or bubbles in the luminescent cavity. If necessary, a small amount of colloid can be injected to ensure that the luminescent cavity is completely filled;

[0019] S405: Place the LED digital tube housing with the packaging glue injected with red fluorescent powder on a clean workbench and let it stand for 8-12 minutes to allow the colloid to initially solidify;

[0020] S406: Put the LED digital tube housing into an oven for complete curing, and the curing time is 15-20 hours;

[0021] S407: After curing is completed, check the appearance and function of the LED digital tube housing, and then perform electrical testing to ensure that the LED digital tube emits light normally.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention uses a flip-chip blue LED chip to replace the traditional regular LED chip, eliminating the need for aluminum wire connection and reducing the number of contact points, thereby significantly improving the structural stability and reliability of the product. The wafer thrust of the flip-chip can reach more than 200g, which is much higher than the 10-20g breaking force of the traditional aluminum wire, and can effectively avoid the collapse problem under the action of external force. In addition, the flip-chip LED chip is fixed with a high-melting-point solder paste to ensure that good electrical connection and mechanical strength can be maintained in a high-temperature environment, further improving the temperature resistance and reliability of the product.

[0024] 2. The installation and fixing process of the flip-chip LED chip of the present invention is simpler, eliminating the traditional wire bonding step, reducing the time and complexity of manual operation, simplifying the production process, and improving production efficiency. Under the premise of the same chip cost, the overall production cost is effectively reduced by simplifying the production process and reducing material waste. At the same time, the high reliability and long life of the flip-chip LED chip also reduce the cost of subsequent maintenance and replacement, further improving the economic benefits.

[0025] 3. The entire preparation process of the present invention strictly controls environmental conditions, such as taking anti-static measures to ensure that the chips and materials are not affected by the external environment. The vacuum degassing treatment of the colloid effectively eliminates bubbles, improves the reliability and service life of the product, and enables it to maintain excellent performance in various environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The present invention is a flow chart of a method for preparing a high-reliability red LED digital tube. DETAILED DESCRIPTION

[0027] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0028] like Figure 1 As shown, a method for preparing a high-reliability red LED digital tube comprises the following steps:

[0029] S1: Select flip-chip blue LED chip;

[0030] S2: Design the corresponding pad positions on the PCB board and prepare solder paste for fixing;

[0031] S3: placing the flip-chip blue LED chip on the pads of the PCB board and fixing it with solder paste to form a good electrical connection between the flip-chip blue LED chip and the pads on both sides;

[0032] Among them, the flip-chip blue light LED chip is placed on the pad of the PCB board and fixed with solder paste. In this step, the workbench and the operator need to take anti-static measures to prevent static electricity from damaging the chip.

[0033] Among them, a reflow soldering machine is used to fix the flip-chip blue light LED chip on the soldering pad of the PCB board through reflow soldering.

[0034] S4: injecting red phosphor packaging glue into the light-emitting cavity of the LED digital tube shell.

[0035] The red phosphor is a nitride system red phosphor, and the proportion of the red phosphor in the red phosphor packaging glue is 4-8%.

[0036] The process of injecting red phosphor packaging glue into the light-emitting cavity of the LED digital tube housing comprises the following steps:

[0037] S401: Clean the LED digital tube housing to ensure that the interior of the light-emitting cavity is clean and dust-free, and check whether the LED digital tube housing is damaged or cracked to ensure its integrity;

[0038] S402: Load the degassed colloid into a syringe or a dispensing machine, remove the air in the syringe or the dispensing machine, and ensure smooth flow of the colloid;

[0039] S403: Align the needle of the syringe or dispensing machine to the entrance of the light-emitting cavity of the LED digital tube housing, and slowly and evenly inject the colloid to avoid generating bubbles;

[0040] S404: After the injection is completed, check whether there is an unfilled part or bubbles in the luminescent cavity. If necessary, a small amount of colloid can be injected to ensure that the luminescent cavity is completely filled;

[0041] S405: Place the LED digital tube housing with the packaging glue injected with red fluorescent powder on a clean workbench and let it stand for 8-12 minutes to allow the colloid to initially solidify;

[0042] S406: Put the LED digital tube housing into an oven for complete curing, and the curing time is 15-20 hours;

[0043] S407: After curing is completed, check the appearance and function of the LED digital tube housing, and then perform electrical testing to ensure that the LED digital tube emits light normally.

[0044] S5: Place the PCB board with the flip-chip LED chip installed into the digital tube housing pre-filled with red phosphor packaging glue, and then perform a curing process to firmly combine all components together.

[0045] The present invention adopts a flip-chip blue light LED chip to replace the traditional upright LED chip, eliminating the need for aluminum wire connection and reducing the number of contact points, thereby significantly improving the structural stability and reliability of the product. The wafer thrust of the flip-chip can reach more than 200g, which is much higher than the 10-20g breaking force of the traditional aluminum wire, and can effectively avoid the collapse problem under the action of external force. In addition, the use of high-melting-point solder paste to fix the flip-chip LED chip ensures that good electrical connection and mechanical strength can be maintained in a high-temperature environment, further improving the temperature resistance and reliability of the product; the installation and fixing process of the flip-chip LED chip is simpler, eliminating the traditional wire bonding step, reducing the time and complexity of manual operation, simplifying the production process, and improving production efficiency. Under the premise of the same chip cost, the overall production cost is effectively reduced by simplifying the production process and reducing material waste. At the same time, the high reliability and long life of the flip-chip LED chip also reduce the cost of later maintenance and replacement, further improving the economic benefits; the entire preparation process of the present invention strictly controls environmental conditions, such as taking anti-static measures to ensure that the chip and materials are not affected by the external environment, and the vacuum degassing treatment of the colloid effectively eliminates bubbles, improves the reliability and service life of the product, and enables it to maintain excellent performance in various environments.

[0046] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for preparing a high-reliability red LED digital tube, characterized in that: The following steps are involved: S1: Select flip-chip blue LED chip; S2: Design the corresponding pad positions on the PCB board and prepare solder paste for fixing; S3: placing the flip-chip blue LED chip on the pads of the PCB board and fixing it with solder paste to form a good electrical connection between the flip-chip blue LED chip and the pads on both sides; S4: injecting packaging glue containing red fluorescent powder into the light-emitting cavity of the LED digital tube housing; S5: Place the PCB board with the flip-chip LED chip installed into the digital tube housing pre-filled with red phosphor packaging glue, and then perform a curing process to firmly combine all components together.

2. The method for preparing a high-reliability red LED digital tube according to claim 1, characterized in that: In S3, the flip-chip blue LED chip is placed on the pad of the PCB board and fixed with solder paste. In this step, the workbench and the operator need to take anti-static measures to prevent static electricity from damaging the chip.

3. The method for preparing a high-reliability red LED digital tube according to claim 1, characterized in that: In S3, a reflow soldering machine is used to fix the flip-chip blue LED chip on the soldering pad of the PCB board through reflow soldering.

4. The method for preparing a high-reliability red LED digital tube according to claim 1, characterized in that: The red phosphor is a nitride system red phosphor, and the proportion of the red phosphor in the red phosphor packaging glue is 4-8%.

5. The method for preparing a high-reliability red LED digital tube according to claim 1, characterized in that: In the above S4, injecting the packaging glue of red fluorescent powder into the light-emitting cavity of the LED digital tube housing comprises the following steps: S401: Clean the LED digital tube housing to ensure that the interior of the light-emitting cavity is clean and dust-free, and check whether the LED digital tube housing is damaged or cracked to ensure its integrity; S402: Load the degassed colloid into a syringe or a dispensing machine, remove the air in the syringe or the dispensing machine, and ensure smooth flow of the colloid; S403: Align the needle of the syringe or dispensing machine to the entrance of the light-emitting cavity of the LED digital tube housing, and slowly and evenly inject the colloid to avoid generating bubbles; S404: After the injection is completed, check whether there is an unfilled part or bubbles in the luminescent cavity. If necessary, a small amount of colloid can be injected to ensure that the luminescent cavity is completely filled; S405: Place the LED digital tube housing with the packaging glue injected with red fluorescent powder on a clean workbench and let it stand for 8-12 minutes to allow the colloid to initially solidify; S406: Put the LED digital tube housing into an oven for complete curing, and the curing time is 15-20 hours; S407: After curing is completed, check the appearance and function of the LED digital tube housing, and then perform electrical testing to ensure that the LED digital tube emits light normally.

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