Wiring substrate, method for manufacturing structural member, and display device

Abstract

The invention provides a wiring substrate, a preparation method of a structural member and a display device, relates to the technical field of display, and is used for reducing the preparation cost of the display device. The wiring substrate includes a substrate including a first region and a second region. The first area comprises two first trunk areas, a first connecting area and a first opening, and the two first trunk areas extend in the first direction and are provided with a first interval in the second direction. And the first connecting region is connected with the end parts of the same sides of the two first trunk regions. The second area comprises two second trunk areas, a second connecting area and a second opening, the two second trunk areas extend in the first direction, and a second interval is formed in the second direction. And the second connecting region is connected with the end parts of the same sides of the two second trunk regions. And the orientation of the second opening is opposite to that of the first opening. A first trunk region of the first region is located within the second opening, and a second trunk region of the second region is located within the first opening. The wiring substrate is used for preparing a structural member.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a wiring substrate, a method for preparing a structural member, and a display device. Background Art

[0002] With the development of light-emitting diode technology, backlight sources using sub-millimeter light-emitting diodes (English: Mini Light Emitting Diode; abbreviated as: Mini-LED) and micro light-emitting diodes (English: Micro Light Emitting Diode; abbreviated as: Micro-LED) have been widely used. The size of Mini-LED is about 100μm to 300μm, and the size of Micro-LED is about less than 100μm. Mini-LED and Micro-LED have the advantages of small size, high brightness and high contrast. When applied to backlight modules, the backlight can be finely adjusted to achieve the display of high dynamic range images (English: High-Dynamic Range; abbreviated as: HDR), which has attracted more and more attention. Summary of the invention

[0003] The purpose of the embodiments of the present disclosure is to provide a wiring substrate, a method for preparing a structural member, and a display device, so as to reduce the preparation cost of a light-emitting substrate formed by light-emitting structural members, thereby reducing the preparation cost of the display device.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a wiring substrate is provided. The wiring substrate includes a substrate, and the substrate includes a first area and a second area. The first area includes two first trunk areas and a first connection area, and the two first trunk areas extend along the first direction and have a first interval along the second direction. The ends of the first connection area are respectively connected to the ends of the two first trunk areas on the same side, and the first area has a first opening. The second area includes two second trunk areas and a second connection area, and the two second trunk areas extend along the first direction and have a second interval along the second direction. The ends of the second connection area are respectively connected to the ends of the two second trunk areas on the same side, and the second area has a second opening. The direction of the second opening is opposite to that of the first opening; the first direction and the second direction intersect each other. A first trunk area of ​​the first area is located in the second opening, and a second trunk area of ​​the second area is located in the first opening.

[0006] The above wiring substrate can be used to prepare and form structural parts. Any of the above first regions and any of the second regions are used to form an independent structural part (such as a light-emitting structural part that can be used as a light source), and a wiring substrate can be prepared to form multiple structural parts. Moreover, each first region and each second region are U-shaped structures. When the size and arrangement density of the light-emitting substrate are the same, compared with the linear light-emitting structural parts, the U-shaped light-emitting structural parts can reduce the use of light-emitting structural parts and the use of connectors, which is conducive to reducing the preparation cost of the light-emitting substrate composed of multiple light-emitting structural parts and reducing the preparation cost of the display device.

[0007] In some embodiments, the size of the first trunk area along the first direction is equal to the size of the second trunk area along the first direction. And / or, the size of the first trunk area along the second direction is equal to the size of the second trunk area along the second direction.

[0008] In some embodiments, the first interval is equal to a dimension of the second interval along the second direction.

[0009] In some embodiments, the first interval is larger than the size of the second trunk area along the second direction, and is less than or equal to 1.5 times the size of the second trunk area along the second direction. The second interval is larger than the size of the first trunk area along the second direction, and is less than or equal to 1.5 times the size of the first trunk area in the second direction.

[0010] In some embodiments, a plurality of through holes are included between the adjacent first regions and the second regions, and a connecting structure is included between two adjacent through holes, wherein the connecting structure is used to connect and fix the adjacent first regions and the second regions.

[0011] In some embodiments, the first interval is greater than 2 times the size of the second trunk area along the second direction, and less than or equal to 2.5 times the size of the second trunk area along the second direction. The second interval is greater than 2 times the size of the first trunk area along the second direction, and less than or equal to 2.5 times the size of the first trunk area in the second direction.

[0012] In some embodiments, the substrate includes a plurality of first regions sequentially arranged along the second direction, and a plurality of second regions sequentially arranged along the second direction. Two first trunk regions respectively belonging to two adjacent first regions and having the smallest distance along the second direction are located in the second opening of the same second region; two second trunk regions respectively belonging to two adjacent second regions and having the smallest distance along the second direction are located in the first opening of the same first region.

[0013] In some embodiments, the substrate further includes a third region extending along the first direction and located between the outermost first trunk region and the second trunk region along the second direction.

[0014] In some embodiments, a plurality of through holes are included between adjacent first and second regions, between adjacent first and third regions, between adjacent first and first regions, between adjacent second and second regions, and between adjacent second and third regions, and a connecting structure is included between two adjacent through holes, wherein the connecting structure is used to connect and fix the adjacent first and second regions, the adjacent first and third regions, the adjacent first and first regions, the adjacent second and second regions, and the adjacent second and third regions.

[0015] In some embodiments, each first trunk area of ​​the first area and each second trunk area of ​​the second area are provided with a plurality of electronic components spaced apart along the first direction, the spacing between two adjacent electronic components along the first direction is D1, the size of the first trunk area along the second direction and the size of the second trunk area along the second direction are both D2, and the width of the connecting structure along a direction perpendicular to the boundary of the first area or the second area connected to the connecting structure is M; wherein D1, D2 and M satisfy D2=(D1-3M) / 3.

[0016] In some embodiments, a width M of the connection structure along a direction perpendicular to a boundary of the first region or the second region connected to the connection structure is 1 mm to 2 mm.

[0017] In some embodiments, the first connection area of ​​the first region and the second connection area of ​​the second region are both provided with a first connector, and the orthographic projection of the first connector on the substrate only partially overlaps with the first connection area or the second connection area.

[0018] In some embodiments, each first trunk area in the first region and each second trunk area in the second region is provided with a plurality of driving elements, and the driving elements are configured to control at least one of the electronic elements in the same region.

[0019] In another aspect, a method for preparing a structural component is provided. The method comprises: dividing a substrate into a first region, a second region, and a fourth region; removing a portion of the fourth region so that the fourth region forms a plurality of through holes arranged at intervals, and a connection structure is formed between two adjacent through holes; wiring is performed in the first region and the second region; electronic components are arranged in each first trunk region of the first region and each second trunk region of the second region; a first connector is mounted in the first connection region and the second connection region; and the connection structure is cut so that any first region and any second region independently constitute a structural component. Among them, the first area includes two first trunk areas and a first connection area, the two first trunk areas both extend along the first direction and have a first interval along the second direction; the ends of the first connection area are respectively connected to the ends of the two first trunk areas on the same side, and the first area has a first opening; the second area includes two second trunk areas and a second connection area, the two second trunk areas both extend along the first direction and have a second interval along the second direction; the ends of the second connection area are respectively connected to the ends of the two second trunk areas on the same side, and the second area has a second opening; the direction of the second opening is opposite to that of the first opening; the fourth area is located between adjacent first and second areas, between adjacent first areas and first areas, and between adjacent second areas and second areas; the first direction and the second direction intersect with each other.

[0020] In some embodiments, after any first region and any second region independently form a structural member, the method further includes: providing a transfer circuit board; assembling multiple structural members on the transfer circuit board, and connecting a first connector of each structural member to a second connector. The transfer circuit board extends along the second direction, and multiple second connectors are provided on the transfer circuit board.

[0021] In some embodiments, two of the structural members adjacent to each other along the first direction are arranged on both sides of the adapter circuit board in an axisymmetric manner.

[0022] In another aspect, a display device is provided, comprising a display panel and a structural member prepared by the method for preparing a structural member according to any one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0024] Figure 1 is a structural diagram of a display device according to some embodiments;

[0025] Figure 2 is a structural diagram of a display panel according to some embodiments;

[0026] Figure 3A is a structural diagram of a wiring substrate according to some embodiments;

[0027] Figure 3B is another structural diagram of a wiring substrate according to some embodiments;

[0028] Figure 4 for Figure 3A A partial enlarged view of the middle A area;

[0029] Figure 5 is another structural diagram of a wiring substrate according to some embodiments;

[0030] Figure 6A to Figure 6D is a process flow chart of manufacturing a structural member according to some embodiments;

[0031] Figure 7 is a structural diagram of a light-emitting substrate according to some embodiments;

[0032] Figure 8 for Figure 7 A partial enlarged view of the middle B area;

[0033] Fig. 9A for Figure 8 A partial enlarged view of the middle C area;

[0034] Fig. 9B for Figure 8 Another partial magnification of the middle C area. DETAILED DESCRIPTION

[0035] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0036] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0037] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0038] When describing some embodiments, the term "connected" and its derivative expressions may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0039] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0040] The use of "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0041] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0042] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0043] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0044] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0045] Some embodiments of the present disclosure provide a display device, which may be any device that displays anything, whether in motion (eg, video) or fixed (eg, still image), and whether text or images.

[0046] Exemplarily, the display device can be a mobile phone, a wireless device, a personal digital assistant (PDA), a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a watch, a clock, a calculator, a television monitor, a flat-panel display, a computer monitor, a car display (e.g., an odometer display, etc.), a cockpit controller and / or display, a display of a camera view (e.g., a display of a rearview camera in a vehicle), an electronic photograph, an electronic billboard or sign, a projector, packaging and aesthetic structures (e.g., a display of an image of a piece of jewelry), etc.

[0047] In some embodiments, the display device may be a liquid crystal display (LCD). Figure 1 In the case where the display device 1000 is a liquid crystal display device, the display device 1000 may include a backlight module 100 and a display panel 200. Of course, the embodiments of the present disclosure are not limited thereto, and the display device 1000 may also include other structures or devices, such as Figure 1 As shown, the display device 1000 may further include a middle frame 300, an outer frame 400, and a glass cover plate ( Figure 1 As long as the same technical ideas as those of the present application are applied, they will not be listed one by one here.

[0048] The display panel 200 includes a display side and a non-display side. The display side refers to the side of the display panel 200 used to display the image ( Figure 1 The non-display side refers to the other side opposite to the display side. The backlight module 100 is disposed on the non-display side ( Figure 2 The backlight module 100 is used to provide a backlight source for the display panel 200 .

[0049] See also Figure 2 When the display device 1000 is a liquid crystal display device, the display panel 200 may be a liquid crystal display panel. In this case, the display panel 200 may include an array substrate 210, a pairing substrate 220, and a liquid crystal layer 230 disposed between the array substrate 210 and the pairing substrate 220.

[0050] The array substrate 210 is provided with a thin film transistor 212 (TFT) located on a first substrate 211 and a pixel electrode 213. The thin film transistor 212 includes an active layer, a source electrode, a drain electrode, a gate electrode and a gate insulating layer, the source electrode and the drain electrode are respectively in contact with the active layer, and the pixel electrode 213 is electrically connected to the drain electrode of the thin film transistor 212.

[0051] In some embodiments, Figure 2 As shown, the array substrate 210 further includes a common electrode 214 disposed on the first substrate 211. The pixel electrode 213 and the common electrode 214 may be disposed on different layers. In this case, Figure 2 As shown, a first insulating layer 215 is disposed between the pixel electrode 213 and the common electrode 214. In the case where the common electrode 214 is disposed between the thin film transistor 212 and the pixel electrode 213, as shown in FIG. Figure 2 As shown, a second insulating layer 216 is further disposed between the common electrode 214 and the thin film transistor 212 .

[0052] The pixel electrode 213 and the common electrode 214 may also be arranged on the same layer (not shown in the figure). In this case, both the pixel electrode 213 and the common electrode 214 are comb-tooth structures including a plurality of strip-shaped sub-electrodes. In other embodiments, the common electrode 214 may also be arranged in the cell substrate 220.

[0053] like Figure 2 As shown, the cell substrate 220 may include a color filter layer 222 disposed on a second substrate 221. In this case, the cell substrate 220 may also be referred to as a color filter substrate (English: Color filter; abbreviated as: CF). Wherein, in the case where the backlight module 100 is used to emit white light, the color filter layer 222 at least includes a red light blocking unit, a green light blocking unit, and a blue light blocking unit, and the red light blocking unit, the green light blocking unit, and the blue light blocking unit are respectively opposite to the sub-pixels of the display panel 200. The cell substrate 220 also includes a black matrix pattern 223 disposed on the second substrate 221, and the black matrix pattern 223 is used to separate the red light blocking unit, the green light blocking unit, and the blue light blocking unit.

[0054] like Figure 2 As shown, the display panel 200 may further include a first polarizer 240 disposed on a side of the cell substrate 220 away from the liquid crystal layer 230, and a second polarizer 250 disposed on a side of the array substrate 210 away from the liquid crystal layer 230. In addition, the display panel 200 may further include other film layers or structures, which are not listed one by one in the embodiments of the present disclosure.

[0055] like Figure 1 As shown, the backlight module 100 may include a light-emitting substrate 110 and an optical film 120 disposed on the side of the light-emitting substrate 110 close to the display panel 200. The light-emitting substrate 110 may directly emit white light, or the light-emitting substrate 110 may also emit light of other colors, and the light of other colors is converted to the display panel 200 through the optical film 120. The optical film 120 may include a diffuser plate and / or an optical brightening film, which is not specifically limited in the embodiments of the present disclosure. Among them, the diffuser plate has a scattering and diffusion effect, which can further mix the above-mentioned white light; the optical brightening film can improve the light output efficiency of the backlight module 100. In addition, the backlight module 100 may also include other film layers or structures, which are not listed one by one in the embodiments of the present disclosure.

[0056] like Figure 1As shown, the light-emitting substrate 110 includes a back plate 111 and a light source 112 disposed on the back plate 111. The light source 112 is composed of a plurality of light-emitting elements (such as Mini-LED chips or Micro-LED chips) arranged in an array. There is a light mixing interval H between the light-emitting substrate 110 and the optical film 120. The light-emitting elements can be equivalent to point light sources. The light emitted by adjacent light-emitting elements is initially mixed within the light mixing interval H and then emitted to the optical film 120. After further homogenization by the optical film 120, it is emitted to the display panel 200. It can be understood that the light finally incident on the display panel can be equivalent to the light emitted by the surface light source.

[0057] In some embodiments, in some display products with a larger light mixing interval H (for example, greater than 20 mm), the intervals between adjacent light emitting elements on the light emitting substrate 110 are larger.

[0058] In the related art, a plurality of light-emitting elements arranged along the row direction are provided on a strip circuit board, and a first connector joint is fixed at the end of each strip circuit board. When a plurality of strip circuit boards are arranged to assemble to form a light-emitting substrate, it is also necessary to provide an adapter circuit board, on which a second connector joint is fixed, and the first connector joint of each strip circuit board is connected to a second connector joint on the adapter circuit board. The adapter circuit board can be connected to an external circuit (such as a driving circuit board) through a flexible circuit board (Flexible Printed Circuit; FPC for short). This solution requires each strip circuit board to be assembled and fixed to the adapter circuit board one by one, which is difficult to assemble and consumes a large number of connectors, which is not conducive to reducing the preparation cost of the light-emitting substrate.

[0059] In order to solve the above technical problems, the embodiment of the present application provides a wiring substrate 2000, which can be used to prepare a structural component, such as a light-emitting structural component. Figure 3A and Figure 4 The wiring substrate 2000 includes a substrate 2100, and the substrate 2100 includes a first region 30 and a second region 40. Figure 3AIn order to clearly show the boundary and position of the first region 30 and the second region 40, different types of filling patterns are used for both. The material of the substrate 2100 may be any one of glass, quartz, sapphire, ceramic, etc.; or a semiconductor material, such as a single crystal semiconductor substrate or a polycrystalline semiconductor based on silicon or silicon carbide, a compound semiconductor such as silicon germanium, SOI (Silicon On Insulator; Silicon on Insulator), etc.; or an organic resin material including epoxy resin, triazine, silicone resin or polyimide. The substrate 2100 may also be an FR4 type printed circuit board (PCB), or may be a flexible PCB that is easily deformed; it may also be a ceramic material including silicon nitride, AlN or Al2O3, or a metal or metal compound, or a metal core printed circuit board (MCPCB) or a metal copper clad laminate (MCCL).

[0060] The first region 30 includes two first trunk regions 31 and a first connection region 32. The two first trunk regions 31 extend along the first direction X and have a first interval D5 along the second direction Y. That is, the first interval D5 refers to the distance between the two first trunk regions 31 in the second direction Y. The ends of the first connection region 32 are respectively connected to the ends of the two first trunk regions 31 on the same side (for example, Figure 3A The first region 30 is connected to the left end of the first connecting region 32, and the first region 30 has a first opening 34. The first opening 34 refers to the region between the two first trunk regions 31. The first opening 34 is oriented away from the first connecting region 32, that is, Figure 3A The first region 30 forms a U-shaped structure. The first direction X and the second direction Y intersect each other. For example, the first direction X and the second direction Y are perpendicular to each other.

[0061] The second region 40 includes two second trunk regions 41 and a second connection region 42. The two second trunk regions 41 extend along the first direction X and have a second interval D6 along the second direction Y. That is, the second interval D6 refers to the distance between the two first trunk regions 31 in the second direction Y. The ends of the second connection region 42 are respectively connected to the ends of the two second trunk regions 41 on the same side (for example, Figure 3A That is, the second region 40 forms a U-shaped structure.

[0062] The second region 40 has a second opening 44, which is an area located between the two second trunk regions 41. The direction of the second opening 44 ( Figure 3A along the first direction X from right to left), and the direction of the first opening 34 ( Figure 3AThe first trunk area 31 is opposite to the second opening 44 (from left to right along the first direction X); so that the first trunk area 31 can extend into the second opening 44, and the second trunk area 42 can extend into the first opening 34. For example, a first trunk area 31 of the first area 30 is located in the second opening 44, and a second trunk area 41 of the second area 40 is located in the first opening 34. Based on this, it is beneficial to increase the space utilization rate of the substrate 2100. Any of the above-mentioned first areas 30 and any of the second areas 40 are used to form an independent structural member (such as a light-emitting structural member that can be used as a light source), and a wiring substrate 2000 can be prepared to form multiple structural members. Moreover, the first area 30 and each of the second areas 40 are U-shaped structures. When the size and arrangement density of the light-emitting substrate are the same, compared with the linear light-emitting structural member, the U-shape can reduce the use of the light-emitting structural member and the use of the connector, which is beneficial to reduce the preparation cost of the light-emitting substrate composed of multiple light-emitting structural members and reduce the preparation cost of the display device 1000.

[0063] Moreover, compared with setting the first area 30 and the second area 40 in a comb shape, setting the first area 30 and the second area 40 in a U shape makes the prepared light-emitting structure more versatile and can be applied to backlight products of various sizes. When setting the light-emitting substrate, the number and arrangement density of the U-shaped light-emitting structures can be flexibly set according to the size of the light-emitting substrate.

[0064] In some embodiments, see Figure 3A , the dimension D3 of the first trunk area 31 along the first direction X is equal to the dimension D4 of the second trunk area 41 along the first direction X. And / or, refer to Figure 4 , the size of the first trunk area 31 along the second direction Y is equal to the size of the second trunk area 41 along the second direction Y, and the sizes of the first trunk area 31 and the second trunk area 41 along the second direction Y are both D2. In this way, the first trunk area 31 and the second trunk area 41 of the same size and shape can be formed, and the first trunk area 31 and the second trunk area 41 are used to set the electronic components 50, which can be, for example, light-emitting components, sensors or other components arranged in an array. The first trunk area 31 and the second trunk area 41 have the same size and shape, which is conducive to improving the uniformity of the arrangement of the electronic components 50 on the first trunk area 31 and the second trunk area 41.

[0065] It is understandable that, in the case where the electronic component 50 is a light-emitting component, the structural member formed by the wiring substrate 2000 and the electronic component 50 is a light-emitting structural member. Among them, from the type of light-emitting element, the light-emitting element can be an LED with a quantum well junction, an LED with a columnar structure, an LED with a double heterojunction, etc., and the light-emitting element can also include a packaging structure on the light-emitting side of the LED, and the packaging structure can be made of a transparent material, and the surface can be a curved surface or a hemispherical surface. From the size of the light-emitting element, the light-emitting element can be a structure whose size is miniaturized to the order of hundreds of microns. For example, the light-emitting area of ​​the LED in the light-emitting element can be less than 1mm2, or the light-emitting area of ​​the LED can be less than 10000μm2, or the light-emitting area of ​​the LED can be less than 3000μm2, and the light-emitting area of ​​the LED can be less than 700μm2. Of course, the embodiments of the present disclosure are not limited to this, and the light-emitting element can also adopt light-emitting elements of other structures, as long as the same technical ideas as those of the present application are applied.

[0066] In some embodiments, Figure 3A As shown, the first interval D5 is equal to the second interval D6D6. In this way, the first area 30 and the second area 40 can be formed with the same size and shape, so that the first area 30 and the second area 40 can form the same shape of the structural member, thereby improving the consistency and versatility of the structural member.

[0067] Exemplarily, the size of the first connection area 32 of the first region 30 along the first direction X is equal to the size of the second connection area 42 of the second region 40 along the first direction X. And since the first interval D5 is equal to the second interval D6, it can be known that the size of the first connection area 32 of the first region 30 along the second direction Y is equal to the size of the second connection area 42 of the second region 40 along the second direction Y. In this way, the first trunk area 31 of the first region 30 can be completely located in the second interval D6 of the second region 40, and the second trunk area 42 of the second region 40 can be completely located in the first interval D5 of the first region 30, which is conducive to further improving the space utilization of the wiring substrate 2000 and reducing the preparation cost of the wiring substrate 2000.

[0068] In some embodiments, see Figure 5 , the first interval D5 is greater than the dimension D2 of the second trunk area 41 along the second direction Y, and is less than or equal to 1.5 times the dimension D2 of the second trunk area 41 along the second direction Y, that is, D2<D5≤1.5D2. At this time, one second trunk area 41 of the second area 40 is located in the first interval D5 of one first area 30, and another second trunk area 41 is located between two adjacent first areas 30, that is, only one second trunk area 41 is provided in each first interval D5.

[0069] The second interval D6 is greater than the dimension D2 of the first trunk area 31 along the second direction Y, and is less than or equal to 1.5 times the dimension D2 of the first trunk area 31 in the second direction, that is, D2<D6≤1.5D2. At this time, one first trunk area 31 of the first area 30 is located in the second opening 44 of one second area 40, and another first trunk area 31 is located between two adjacent first areas 30, that is, only one second trunk area 42 is provided in each second opening 44.

[0070] D2<D5≤1.5D2, and D2<D6≤1.5D2, not only can a second trunk area 41 be set in the first opening 34, and a first trunk area 31 be set in the second opening 44, but it is also beneficial to set a gap between the first trunk area 31 and the second trunk area 41, which is beneficial to subsequently separate the first area 30 and the second area 40 from the gap between the first trunk area 31 and the second trunk area 41.

[0071] For example, see Fig. 6A , a plurality of through holes 61 are included between the adjacent first regions 30 and the second regions 40, and a connection structure 62 is included between the adjacent two through holes 61, and the connection structure 62 is used to connect and fix the adjacent first regions 30 and the second regions 40. The connection structure 62 connects the first region 30 and the second region 40 as a whole, which is conducive to wiring on the first region 30 and the second region 40 of the substrate 2100 during the preparation of the wiring substrate. The connection structures 62 penetrate the substrate 2100 through the through holes 61, which is conducive to reducing the contact area between the first region 30 and the second region 40, and is convenient for separating the first region 30 and the second region 40 in the subsequent preparation process to form independent structural parts. Among them, the plurality of through holes 61 and the plurality of connection structures 62 together constitute the fourth region 60, and the fourth region 60 separates the two adjacent first regions 30 and / or the second region 40, so that any first region 30 and any second region 40 can be separated from the fourth region 60 to form independent structural parts.

[0072] Exemplarily, along the extension direction of the edge of the first region 30 or the second region 40, the length of the through hole 61 is greater than the length of the connection structure 62. Along the direction perpendicular to the edge of the first region 30 or the second region 40 where the connection structure 62 is located, the width of the connection structure 62 is M, and M can be 1mm to 2mm. For example, in the interval between the first trunk region 31 and the second trunk region 32 along the second direction Y, the width M of the connection structure 62 along the second direction Y is 1mm to 2mm, and in the interval between the first trunk region 31 and the second trunk region 32 along the first direction X, the width M of the connection structure 62 along the first direction X is 1mm to 2mm. Exemplarily, the width M of the connection structure 62 is 1mm, 1.5mm or 2mm, etc.

[0073] In other embodiments, Figure 3A and Figure 4 As shown, the first interval D5 is greater than 2 times the size D2 of the second trunk area 41 along the second direction, and less than or equal to 2.5 times the size D2 of the second trunk area 41 along the second direction Y. That is, 2D2<D5≤2.5D2. At this time, the two second trunk areas 41 of the second area 40 are respectively located in the first intervals D5 of the two adjacent first areas 30, and only two second trunk areas 41 are arranged in each first interval D5.

[0074] The second interval D6 is greater than 2 times the dimension D2 of the first trunk area 31 along the second direction Y, and is less than or equal to 2.5 times the dimension D2 of the first trunk area 31 in the second direction, that is, 2D2<D6≤2.5D2. At this time, the two first trunk areas 31 of the first area 30 are respectively located in the second openings 44 of the two adjacent second areas 40, and two first trunk areas 31 of the two adjacent first areas 30 are arranged in one second opening 44, that is, two first trunk areas 31 can be arranged in each second opening 44.

[0075] 2D2<D5≤2.5D2, and 2D2<D6≤2.5D2, not only can the two mutually adjacent second trunk areas 41 of the two adjacent second areas 40 be set in the first opening 34, and the two mutually adjacent first trunk areas 31 of the two adjacent first areas 30 be set in the second opening 44, but it is also beneficial to set a gap between the first trunk area 31 and the second trunk area 41, which is beneficial to subsequently separate the first area 30 and the second area 40 from the gap between the first trunk area 31 and the second trunk area 41.

[0076] See also Figure 3A , the substrate 2100 includes a plurality of first regions 30 sequentially arranged along the second direction Y, and a plurality of second regions 40 sequentially arranged along the second direction Y. Two first trunk regions 31 respectively belonging to two adjacent first regions 30 and having the smallest distance along the second direction Y are located in the second opening 44 of the same second region 40. Two second trunk regions 41 respectively belonging to two adjacent second regions 40 and having the smallest distance along the second direction Y are located in the first opening 34 of the same first region 30, based on which, it is beneficial to improve the space utilization of the wiring substrate 2000.

[0077] like Figure 3AAs shown, the substrate 2100 further includes two third regions 60, each of which extends along the first direction X, and the third region 70 is located between the outermost first trunk region 30 and the second trunk region 40 along the second direction Y. The third region 70 is used to fill the gap between the outermost first region 30 and the second region 40, so that the substrate 2100 forms a regular shape, which is conducive to the stable connection between the outermost first region 30 and the second region 40.

[0078] For example, the two outermost sides of the substrate 2100 along the second direction Y may be the first region 30 or the second region 40, respectively. Figure 3A As shown, the upper side and the lower side of the substrate 2100 along the second direction Y are both the first region 30, or, as shown in FIG. Figure 3B As shown, the upper side of the substrate 2100 along the second direction Y is the first region 30, and the lower side is the second region 40. Of course, both sides of the substrate 2100 along the second direction Y may also be the second region 40 (not shown in the figure); or the upper side may be the second region 40, and the lower side may be the first region 30 (not shown in the figure).

[0079] Continue reading Figure 3A , a plurality of through holes 61 are included between adjacent first regions 30 and second regions 40, between adjacent first regions 30 and third regions 70, between adjacent first regions 30 and first regions 30, between adjacent second regions 40 and second regions 40, and between adjacent second regions 40 and third regions 70, and a connection structure 62 is included between two adjacent through holes 61, and the connection structure 62 is used to connect and fix adjacent first regions 30 and second regions 40, adjacent first regions 30 and third regions 70, adjacent first regions 30 and first regions 30, adjacent second regions 40 and second regions 40, and adjacent second regions 40 and third regions 70. The connection structure 62 connects the first region 30, the second region 40, and the third region 70 to each other to form a whole, which is beneficial to wiring on the first region 30 and the second region 40 of the substrate 2100 during the preparation of the wiring substrate. The connection structure 62 passes through the substrate 2100 through the through hole 61, which is beneficial to reducing the contact area between the first region 30, the second region 40 and the third region 70, and is convenient for separating the first region 30 and the second region 40 in the subsequent preparation process to form independent structural parts.

[0080] In some embodiments, Figure 3A and Figure 4As shown, each first trunk area 31 of the first area 30 and each second trunk area 41 of the second area 40 are provided with a plurality of electronic components 50 at intervals along the first direction X. Exemplarily, the electronic components 50 are provided in the middle of the first trunk area 31 along the second direction Y and in the middle of the second trunk area 41 along the second direction Y. The spacing between two adjacent electronic components 50 along the first direction X is D1. The width of the connection structure 62 along the direction perpendicular to the boundary of the first area 30 or the second area 40 connected to the connection structure 62 is M.

[0081] The line connecting the geometric centers of the plurality of electronic components 50 located in any first trunk area 31 or second trunk area 41 coincides with the midline of the first trunk area 31 or second trunk area 41 along the first direction X, and D1, D2 and M satisfy D2 = (D1-3M) / 3, or D1 = 3D2 + 3M. Figure 4 As shown, the distance between two electronic components 50 adjacent to each other along the second direction Y on two first trunk regions 31 belonging to the same first region 30 is equal to the size of one first trunk region 31 along the second direction Y (2*(1 / 2·D2)), the size of two second trunk regions 41 along the second direction Y (2*D2)) and the size of three connecting structures 62 along the second direction Y (3M). Moreover, since the size of the first trunk region 31 along the second direction Y and the size of the second trunk region along the second direction Y are both D2, the interval between two electronic components 50 adjacent to each other along the second direction Y on two first trunk regions 31 belonging to the same first region 30 is also D1, or the interval between two electronic components 50 adjacent to each other along the second direction Y on two second trunk regions 41 belonging to the same second region 40 is also D1. This makes the distribution density of the electronic components 50 in the first direction X and the second direction Y the same.

[0082] In some embodiments, Figure 3A As shown, the first connection area 32 of the first area 30 and the second connection area 42 of the second area 40 are both provided with a first connector 2200, and the orthographic projection of the first connector 2200 on the substrate 2100 only partially overlaps with the first connection area 32 or the second connection area 42, so that the first connector 2200 is electrically connected to the second connector on the adapter circuit board. The structural member formed by cutting the wiring substrate is connected to the adapter circuit board through the first connector 2200, which is conducive to simplifying the assembly process between the structural member and the adapter circuit board and improving the assembly efficiency.

[0083] like Figure 3A and Figure 4As shown, each first trunk area 31 of the first area 30 and each second trunk area 41 of the second area 40 are provided with a plurality of driving elements 51, and the driving element 51 is configured to control at least one electronic element 50 in the same area (such as the same first trunk area 31 or the same second trunk area 42). For example, in the case where the electronic element 50 is a light-emitting element (such as a mini-LED chip), the driving element 51 can be a micro integrated circuit chip, and one driving element 51 can control a plurality of light-emitting elements, and the plurality of light-emitting elements can be connected in series, in parallel, or in a combination of series and parallel, or the plurality of light-emitting elements are independent of each other, which is not limited here.

[0084] In some embodiments, Figure 4 As shown, each first trunk area 31 of the first area 30 and each second trunk area 41 of the second area 40 are provided with a plurality of fixing holes 52, and the fixing holes 52 are used to fix the structural member formed by the wiring substrate 2000 to other components, such as fixing the structural member to the backplane. The wiring substrate also includes a packaging glue (not shown in the figure), each packaging glue covers an electronic component 50, and is used to protect the electronic component 50.

[0085] In some other embodiments, the embodiments of the present disclosure further provide a method for preparing a structural component, wherein the method comprises steps S100 to S600.

[0086] S100, see Fig. 6A , a first region 30 , a second region 40 and a fourth region 60 are divided on the substrate 2100 .

[0087] The first region 30 includes two first trunk regions 31 and a first connection region 32. The two first trunk regions 31 extend along the first direction X and have a first interval D5 along the second direction Y. The ends of the first connection region 32 are respectively connected to the ends of the two first trunk regions 31 on the same side (for example, Fig. 6A The first region 30 is connected to the left end portion in FIG. 1 , and has a first opening 34 .

[0088] The second region 40 includes two second trunk regions 41 and a second connection region 42. The two second trunk regions 41 extend along the first direction X and have a second interval D6 along the second direction Y. The ends of the second connection region 42 are respectively connected to the ends of the two second trunk regions 41 on the same side (such as the right end in the figure). The second region 40 has a second opening 44. The first direction X and the second direction Y intersect each other.

[0089] The second opening 44 is oriented in the opposite direction to the first opening 34. The first trunk region 31 can extend into the second opening 44, and the second trunk region 42 can extend into the first opening 34. A first trunk region 31 of the first region 30 is located in the second opening 44, and a second trunk region 41 of the second region 40 is located in the first opening 34, which is beneficial to increase the space utilization of the substrate 2100.

[0090] The fourth region 60 is located between the adjacent first region 30 and the second region 40, between the adjacent first region 30 and the first region 30, and between the adjacent second region 40 and the second region 40. The fourth region 60 is used to form a cuttable region. In the subsequent preparation process of the subsequent structural member, the first region 30 and the second region 40 are cut along the fourth region 60 to form independent structural members.

[0091] It can be understood that the first area 30 and the second area 40 can be the areas described in any of the above embodiments, which will not be described one by one here. Fig. 6A The first region 30 and the second region 40 are taken as examples for illustrative description.

[0092] S200, see Figure 6B , a part of the fourth region 60 is removed, so that the fourth region 60 forms a plurality of through holes 61 arranged at intervals, and a connection structure 62 is formed between two adjacent through holes 61 .

[0093] The through hole 61 penetrates the substrate 2100, which is beneficial to reduce the connection area between the first region 30 and / or the second region 40, and facilitates the subsequent separation of the first region 30 and the second region 40 to form independent structural members. The connection structure 62 is used to connect and fix the adjacent first region 30 and / or the second region 40, which is beneficial to wiring on the first region 30 and the second region 40 of the substrate 2100 during the preparation of the wiring substrate.

[0094] S300 , wiring 40 is performed in the first region 30 and the second region.

[0095] That is, a circuit structure for transmitting electrical signals to electronic components 50, driving components and other electronic devices (such as a first connector) is formed on the first area 30 and the second area 40, including but not limited to forming at least one conductive layer and forming at least one insulating layer.

[0096] S400, see Figure 6C , an electronic component 50 is disposed on each first trunk region 31 of the first region 30 and each second trunk region 41 of the second region 40 . That is, die bonding is performed on the first region 30 and the second region 40 .

[0097] The electronic component 50 may be, for example, a light emitting element, a sensor or other components arranged in an array. When the electronic component 50 is a light emitting element, the structural component is also a light emitting structural component, which can be used to form a backlight source in a display device. The light emitting element is as described above and will not be described in detail here.

[0098] In some embodiments, after the electronic component 50 is arranged in each first trunk area 31 of the first area 30 and each second trunk area 41 of the second area 40 in S400, the method for preparing the structural member may further include packaging the electronic component 50. For example, when the electronic component 50 is a light-emitting component, the electronic component 50 may be packaged with a protective glue (such as OC glue or UV glue, etc.).

[0099] S500, such as Figure 6C As shown, the first connector 2200 is mounted on the first connection area 32 and the second connection area 42. It can also be called mounting on the first connection area 32 and the second connection area 42, and the first connector 2200 is bound and connected to the first connection area 32 of the first area 30 or the second connection area 42 of the second area 40.

[0100] S600, cutting the connection structure 62. Fig.6D As shown, the connecting structure 62 is removed so that any first region 30 and any second region 40 independently form a structural member 500 .

[0101] like Fig.6D As shown, the structural member 500 includes two first sub-portions 510 extending along the first direction X, the two first sub-portions 510 are arranged opposite to each other along the second direction Y, and the two first sub-portions 510 have a third interval D7 along the second direction Y. The structural member 500 also includes a second sub-portion 520 located in the first interval D7, and the two ends of the second sub-portion 520 along the second direction Y are respectively connected to the two ends of the two first sub-portions 510 located on the same side. That is, the structural member 500 forms a U-shaped structure, and in the structural member 500, the third interval D7 is greater than the dimension D8 of the first sub-portion 510 along the second direction Y.

[0102] In some embodiments, after any first region 30 and any second region 40 independently form a structural member 500, the method for preparing the structural member 500 further includes:

[0103] S600, such as Figure 7 and Figure 8 As shown, a transfer circuit board 600 is provided, and a plurality of structural members 500 are assembled on the transfer circuit board 600 .

[0104] In the case where the structural member 500 is a light-emitting structural member, the above S600 assembling a plurality of structural members 500 on the adapter circuit board 600 can be used to form a light-emitting substrate. In the embodiment of the present disclosure, the structural member 500 is a U-shaped structure. Compared with a linear structural member, the U-shape can reduce the amount of structural members used, and reduce the amount of the first connector 2200 and the second connector 2300 used between the structural member 500 and the adapter circuit board 600, thereby helping to reduce the preparation cost of the light-emitting substrate composed of a plurality of structural members 500, and reducing the preparation cost of the display device 1000.

[0105] Moreover, compared with setting the structure 500 in a comb shape, setting the structure 500 in a U shape has better versatility and can be applied to backlight products of various sizes. When setting the light-emitting substrate, the number and arrangement density of the U-shaped light-emitting structures can be flexibly set according to the size of the light-emitting substrate.

[0106] See also Figure 8 , Fig. 9A and Fig. 9B The adapter circuit board 600 extends along the second direction Y, and a plurality of second connectors 2300 are disposed on the adapter circuit board 600. The first connector 2200 of each structural member 500 is connected to one second connector 2300.

[0107] In some embodiments, two adjacent structural members 500 along the first direction X are arranged in an axisymmetric manner on both sides of the adapter circuit board 600. This is conducive to improving the distribution uniformity of the structural members 500, and further improving the distribution uniformity of the electronic components 50 on the structural members 500.

[0108] For example, Fig. 9A As shown, the second connectors 2300 are arranged in two rows along the first direction X on the adapter circuit board 600, and the adapter circuit board 600 is located between two adjacent structural members 500 along the first direction X. The two first connectors 2200 of the two structural members 500 are respectively connected to the two adjacent second connectors 2300 along the first direction X on the adapter circuit board 600.

[0109] Or, if Fig. 9B As shown, the adapter circuit board 600 is provided with a plurality of second connectors 2300 along the second direction. The adapter circuit board 600 is located between two adjacent structural members 500 along the first direction X. The two first connectors 2200 of the two structural members 500 can be connected to one second connector 2300 at the same time.

[0110] In some embodiments, the first connector 2200 and the second connector 2300 can be board-to-board connectors (English: Board-To-Board; abbreviated as: BTB connector). The first connector 2200 and the second connector 2300 that are in a connection relationship have the same number of connection terminals, and the two are adapted to be connected and fixed by plugging.

[0111] For example, Fig. 9A and Fig. 9B As shown, the adapter circuit board 600 may further include a connection area 610 , and the connection area 610 is configured to be electrically connected to an external control circuit board through an FPC.

[0112] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A wiring substrate, characterized in that: comprising a substrate, the substrate comprising a first region and a second region; The first region includes two first trunk regions and a first connection region, the two first trunk regions both extend along the first direction and have a first interval along the second direction; ends of the first connection region are respectively connected to ends of the two first trunk regions located on the same side, and the first region has a first opening; the first direction and the second direction intersect each other; The second region includes two second trunk regions and a second connection region, the two second trunk regions both extend along the first direction and have a second interval along the second direction; ends of the second connection region are respectively connected to ends of the two second trunk regions located on the same side, and the second region has a second opening; the direction of the second opening is opposite to that of the first opening; A first trunk region of the first area is located in the second opening, and a second trunk region of the second area is located in the first opening.

2. The wiring substrate according to claim 1, wherein: The size of the first trunk area along the first direction is equal to the size of the second trunk area along the first direction; and / or the size of the first trunk area along the second direction is equal to the size of the second trunk area along the second direction.

3. The wiring substrate according to claim 1, wherein: The first interval is equal to the second interval.

4. The wiring substrate according to any one of claims 1 to 3, wherein: The first interval is larger than a size of the second trunk area along the second direction, and smaller than or equal to 1.5 times a size of the second trunk area along the second direction; The second interval is larger than a dimension of the first trunk region along the second direction, and smaller than or equal to 1.5 times a dimension of the first trunk region along the second direction.

5. The wiring substrate according to claim 4, characterized in that A plurality of through holes are provided between the adjacent first and second regions, and a connecting structure is provided between two adjacent through holes, wherein the connecting structure is used to connect and fix the adjacent first and second regions.

6. The wiring substrate according to any one of claims 1 to 3, characterized in that: The first interval is greater than 2 times the size of the second trunk area along the second direction, and less than or equal to 2.5 times the size of the second trunk area along the second direction; The second interval is greater than twice the size of the first trunk area along the second direction, and less than or equal to 2.5 times the size of the first trunk area along the second direction.

7. The wiring substrate according to claim 6, wherein: The substrate includes a plurality of first regions sequentially arranged along the second direction, and a plurality of second regions sequentially arranged along the second direction; Two first trunk areas that belong to two adjacent first areas and have the smallest distance along the second direction are located in the second opening of the same second area; Two second trunk areas respectively belonging to two adjacent second areas and having the smallest distance along the second direction are located in the first opening of the same first area.

8. The wiring substrate according to claim 7, wherein: The substrate further includes a third region extending along the first direction and located between the outermost first trunk region and the second trunk region along the second direction.

9. The wiring substrate according to claim 7, wherein: A plurality of through holes are included between adjacent first and second regions, between adjacent first and third regions, between adjacent first and first regions, between adjacent second and second regions, and between adjacent second and third regions, and a connecting structure is included between two adjacent through holes, and the connecting structure is used to connect and fix the adjacent first and second regions, the adjacent first and third regions, the adjacent first and first regions, the adjacent second and second regions, and the adjacent second and third regions.

10. The wiring substrate according to claim 9, wherein: Each first trunk area of ​​the first area and each second trunk area of ​​the second area are provided with a plurality of electronic components spaced apart along the first direction, the spacing between two adjacent electronic components along the first direction is D1, the size of the first trunk area along the second direction and the size of the second trunk area along the second direction are both D2, and the width of the connecting structure along the direction perpendicular to the boundary of the first area or the second area connected to the connecting structure is M; wherein D1, D2 and M satisfy D2=(D1-3M) / 3.

11. The wiring substrate according to claim 10, wherein: A width M of the connection structure along a direction perpendicular to a boundary of the first region or the second region connected to the connection structure is 1 mm to 2 mm.

12. The wiring substrate according to claim 1, wherein: The first connection area of ​​the first region and the second connection area of ​​the second region are both provided with a first connector, and the orthographic projection of the first connector on the substrate only partially overlaps with the first connection area or the second connection area.

13. The wiring substrate according to claim 1, wherein: Each first trunk area of ​​the first region and each second trunk area of ​​the second region is provided with a plurality of driving elements, and the driving elements are configured to control at least one of the electronic elements in the same area.

14. A method for preparing a structural part, characterized in that: The preparation method comprises: The substrate is divided into a first region, a second region and a fourth region; the first region includes two first trunk regions and a first connection region, the two first trunk regions extend along the first direction and have a first interval along the second direction; the ends of the first connection region are respectively connected to the ends of the two first trunk regions located on the same side, and the first region has a first opening; the second region includes two second trunk regions and a second connection region, the two second trunk regions extend along the first direction and have a second interval along the second direction; the ends of the second connection region are respectively connected to the ends of the two second trunk regions located on the same side, and the second region has a second opening; the direction of the second opening is opposite to that of the first opening; the fourth region is located between adjacent first and second regions, between adjacent first and first regions, and between adjacent second and second regions; the first direction and the second direction intersect each other; Removing a portion of the fourth region so that the fourth region forms a plurality of through holes arranged at intervals, and a connection structure is formed between two adjacent through holes; wiring in the first area and the second area; Disposing an electronic component in each first trunk region of the first region and each second trunk region of the second region; Mounting a first connector on the first connection area and the second connection area; The connection structure is cut so that any first region and any second region independently constitute a structural member.

15. The preparation method according to claim 14, characterized in that: After any first region and any second region independently form a structural member, the method further includes: A transfer circuit board is provided; the transfer circuit board extends along a second direction, and a plurality of second connectors are provided on the transfer circuit board; A plurality of structural components are mounted on the adapter circuit board, and a first connector of each structural component is connected to a second connector.

16. The preparation method according to claim 15, characterized in that: The two structural members adjacent to each other along the first direction are arranged on both sides of the adapter circuit board in an axisymmetric manner.

17. A display device, characterized in that: include: A plurality of structural members prepared by the preparation method according to any one of claims 14 to 16; the electronic components include light-emitting components; The display panel is provided with a plurality of structural members on a non-display side of the display panel.

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