Substrate manufacturing method and substrate manufacturing apparatus

Abstract

The invention relates to a substrate manufacturing method and a substrate manufacturing apparatus. This substrate manufacturing method is provided with: a step for applying a filler (F) to a gap between the inclined surface section of a first substrate (W1) and the inclined surface section of a second substrate (W2); and a step for removing air bubbles from the filler (F) applied to the gap.

Description

Technical Field

[0001] The present invention relates to a substrate manufacturing method and a substrate manufacturing device. Background Art

[0002] In the three-dimensional assembly technology of stacking and stacking multiple substrates, after the device surfaces of the multiple substrates are bonded to each other, the non-device surface of one of the substrates is ground. The substrate has a shape with rounded edges or a chamfered shape (beveled portion) in advance.

[0003] Therefore, if the bevel portion is thinned by grinding, a sharp end (blade portion) will be formed, resulting in the worry of defects such as breakage or chipping. Therefore, in the bevel filling technology, the gap between the bevel portions in the stacked substrate is filled with a filler to support the blade portion with the filler to prevent defects.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2022-38834

[0007] Problems to be solved by the invention

[0008] However, if bubbles are mixed into the filler applied to the gap between the beveled portions, there is a concern that defects may occur in the substrate due to bubbles (i.e., voids) inside the filler. More specifically, if a grinding load is applied to the blade portion, the blade portion in the void portion cannot be fully supported by the filler, resulting in a concern that defects such as breakage or notches may occur in the substrate. Summary of the invention

[0009] Therefore, an object of the present invention is to provide a substrate manufacturing method and a substrate manufacturing apparatus capable of preventing defects from being generated in a substrate due to bubbles mixed into a filler.

[0010] (Methods to solve the problem)

[0011] In one embodiment, a substrate manufacturing method is provided for manufacturing a stacked substrate formed by bonding a first substrate and a second substrate, characterized in that it includes the following steps: a step of applying a filler to a gap between a bevel portion of the first substrate and a bevel portion of the second substrate; and a step of removing bubbles from the filler applied to the gap.

[0012] In one embodiment, the step of removing the bubbles includes a step of vibrating the stacked substrate using a substrate holding device that holds the stacked substrate.

[0013] In one embodiment, the step of removing the bubbles includes a step of spraying a pressurized fluid onto the filler applied to the gap.

[0014] In one embodiment, the substrate manufacturing method includes a step of removing bubbles in a filler before applying the filler to the gap.

[0015] In one embodiment, the substrate manufacturing method includes, after the step of removing the bubbles, a step of curing the filler applied to the gap.

[0016] In one embodiment, the substrate manufacturing method includes a step of grinding the laminated substrate.

[0017] In one embodiment, a substrate manufacturing device is provided for manufacturing a stacked substrate formed by bonding a first substrate and a second substrate, and is characterized in that it comprises: a coating device that applies a filler to a gap between a sloped portion of the first substrate and a sloped portion of the second substrate; and a bubble removal device that removes bubbles from the filler applied to the gap.

[0018] In one embodiment, the bubble removing device includes a vibration device that vibrates the stacked substrate using a substrate holding device that holds the stacked substrate.

[0019] In one embodiment, the bubble removal device includes a fluid ejecting device that ejects a pressurized fluid onto the filler applied to the gap.

[0020] In one embodiment, the coating device includes a jet nozzle configured to jet a pressurized fluid toward a filler supplied to a supply nozzle configured to supply the filler to the gap.

[0021] In one embodiment, the substrate manufacturing apparatus includes a curing device that cures the filler applied to the gap.

[0022] In one embodiment, the curing device is disposed on a downstream side of a fluid ejecting device that ejects a pressurized fluid onto a filler applied to the gap in a rotation direction of the substrate.

[0023] Effects of the Invention

[0024] By removing air bubbles from the filler applied to the gap between the stacked wafers, it is possible to prevent defects such as breakage or chipping of the substrate caused by air bubbles mixed into the filler. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1A This is an enlarged cross-sectional view showing the peripheral edge of a wafer as an example of a substrate.

[0026] Figure 1B This is an enlarged cross-sectional view showing the peripheral edge of a wafer as an example of a substrate.

[0027] Figure 2A This is a schematic diagram showing an example of a stacked wafer in which two wafers are bonded together.

[0028] Figure 2B It means that Figure 2A A schematic diagram of a stacked wafer after the second wafer is ground (thinned) as shown.

[0029] Figure 3 It is a diagram showing one embodiment of a substrate manufacturing apparatus.

[0030] Figure 4A This is a schematic diagram showing how a filler is applied to a stacked wafer.

[0031] Figure 4B This is a diagram showing the size of the filler applied to the stacked wafer.

[0032] Figure 5 It is a diagram showing another embodiment of the bubble removing device.

[0033] Fig. 6A This is a diagram showing how a pressurized fluid is sprayed into a gap between stacked wafers.

[0034] Figure 6B This is a diagram showing how a pressurized fluid is sprayed into a gap between stacked wafers.

[0035] Figure 7 It is a schematic diagram showing another embodiment of the coating device.

[0036] Figure 8 This is a diagram showing a curing device for curing a filler applied to a gap between stacked wafers.

[0037] Fig. 9 This is a diagram showing a combination of a fluid ejecting device as a bubble removing device and a curing device. DETAILED DESCRIPTION

[0038] Figure 1A and Figure 1B 1 is an enlarged cross-sectional view showing the peripheral edge of a wafer as an example of a substrate. Figure 1A This is a cross-sectional view of a so-called straight wafer. Figure 1B This is a cross-sectional view of a so-called round wafer. Figure 1A In the chip W, the bevel portion is the outermost peripheral surface of the chip W (indicated by the symbol B) composed of the upper inclined portion (upper bevel portion) P, the lower inclined portion (lower bevel portion) Q, and the side portion (top end) R.

[0039] exist Figure 1BIn the wafer W, the chamfer portion is a portion having a curved cross section constituting the outermost peripheral surface of the wafer W (indicated by the symbol B). The top edge portion E1 is a flat portion located in an area closer to the inside in the radial direction than the chamfer portion B and located closer to the outside in the radial direction than the area D where the device is formed. The top edge portion E1 may also include an area where the device is formed. The bottom edge portion E2 is a flat portion located on the opposite side of the top edge portion E1 and located closer to the inside in the radial direction than the chamfer portion B. These top edge portions E1 and bottom edge portions E2 may also be collectively referred to as near edge portions.

[0040] Figure 2A is a schematic diagram showing an example of a stacked wafer in which two wafers are bonded together. Figure 2B It means that Figure 2A A schematic diagram of a stacked wafer after the second wafer is ground (thinned) as shown. Figure 2A The stacked wafer Ws shown is formed by Figure 1B The circular first wafer W1 shown is manufactured by bonding the second wafer W2.

[0041] like Figure 2B As shown in FIG. 1 , if the second wafer W2 is thinned, a blade portion NE is formed at the peripheral portion of the second wafer W2. The blade portion NE is easily notched due to physical contact, and as a result, there is a concern that defects such as breakage or notches may occur in the stacked wafer Ws. Therefore, a filler is applied between the first wafer W1 and the second wafer W2 of the stacked wafer Ws, and the filler is cured to effectively protect the blade portion NE.

[0042] However, if bubbles are mixed into the filler, there is a concern that defects such as breakage or chipping may occur in the blade portion NE. Therefore, a substrate manufacturing apparatus that can prevent defects in the stacked wafer Ws caused by bubbles mixed into the filler will be described below with reference to the drawings.

[0043] Figure 3 Schematic diagram showing one embodiment of a substrate manufacturing apparatus. The substrate manufacturing apparatus is an apparatus for manufacturing (ie, processing) a stacked wafer Ws formed by bonding a first wafer W1 and a second wafer W2. Therefore, the substrate manufacturing apparatus is also called a substrate processing apparatus.

[0044] The substrate manufacturing device comprises: a substrate holding device 1 for holding a stacked chip Ws; a coating device 2 for coating a filler F in a gap between a bevel portion B of a first chip W1 and a bevel portion B of a second chip W2 (i.e., a gap of the stacked chips Ws); and a bubble removal device 5 for removing bubbles from the filler F coated in the gap of the stacked chips Ws.

[0045] exist Figure 3In the illustrated embodiment, the substrate holding device 1 is a device that rotates the stacked wafer Ws while holding the stacked wafer Ws in the vertical direction by vacuum adsorption, but the substrate holding device 1 may be configured to rotate the stacked wafer Ws while holding the stacked wafer Ws in the horizontal direction.

[0046] In one embodiment, the substrate holding device 1 may be a combination of a plurality of holding rollers. By the combination as described above, the substrate holding device 1 may rotate the stacked wafer Ws while holding the stacked wafer Ws in the vertical direction.

[0047] The coating device 2 is arranged above the stacked wafer Ws held in the vertical direction. More specifically, the stacked wafer Ws is held in a state where its plane is perpendicular to the horizontal plane. In other words, the stacked wafer Ws is held in a longitudinal position. The coating device 2 includes: a supply nozzle 4 for supplying a filler F toward the gap between the stacked wafers Ws; and a support arm 3 for supporting the supply nozzle 4.

[0048] exist Figure 3 In the illustrated embodiment, the bubble removing device 5 includes a vibrating device 10 for vibrating the stacked wafer Ws through the substrate holding device 1. The vibrating device 10 is, for example, an ultrasonic vibrator. The vibrating device 10 can vibrate the filler F applied to the gap between the stacked wafers Ws through the stacked wafers Ws by vibrating the stacked wafers Ws.

[0049] The vibrating device 10 vibrates the bubbles mixed in the filler F so that the adjacent bubbles are joined. The joined bubbles become larger bubbles and are discharged (degassed) to the outside of the filler F. As described above, the bubble removal device 5 (more specifically, the vibrating device 10) can remove bubbles from the filler F applied to the gap between the stacked wafers Ws.

[0050] Figure 4A is a schematic diagram showing how a filler is applied to a stacked wafer. Figure 4B Schematic diagram showing the size of the filler applied to the stacked wafer. The substrate manufacturing apparatus includes a control device 40 for controlling the operation of each of the substrate holding device 1, the coating device 2, and the bubble removal device 5. The control device 40 operates the substrate holding device 1 and the coating device 2 to rotate the stacked wafer Ws, and supplies the filler F from above the stacked wafer Ws through the supply nozzle 4.

[0051] By supplying the filler F while rotating the stacked wafer Ws, the gaps between the stacked wafers Ws are filled with the filler F over the entire circumference of the stacked wafer Ws (see Figure 4A ). In this embodiment, if Figure 4BAs shown, the size D (ie, line width) of the filler F applied from the supply nozzle 4 is 0.2 to 0.3 mm, corresponding to the size of the gap between the stacked wafers Ws.

[0052] When the filler F is applied to the gap between the stacked wafers Ws, the control device 40 operates the bubble removal device 5 (more specifically, the vibration device 10) to vibrate the stacked wafers Ws, thereby removing bubbles from the filler F applied to the gap between the stacked wafers Ws. The control device 40 continues the vibration based on the vibration device 10 until the bubbles are removed from the filler F. After the filler F is applied to the gap between the stacked wafers Ws, a grinding process is performed to grind (thinnen) the first wafer W1 or the second wafer W2.

[0053] According to this embodiment, the bubble removing device 5 can remove bubbles from the filler F applied to the gap between the stacked wafers Ws. Therefore, the substrate manufacturing apparatus can prevent defects such as breakage or chipping from occurring in the blade portion NE due to bubbles mixed into the filler F.

[0054] Figure 5 Schematic diagram showing another embodiment of the bubble removal device. Figure 5 As shown, the bubble removal device 5 includes: fluid injection devices 15 and 16 for injecting pressurized fluid to the filler F applied to the gap between the stacked wafers Ws. The pressurized fluid is a fluid that is given kinetic energy. In this embodiment, the pressurized fluid refers to a gas (e.g., nitrogen) that is pressurized to a pressure required to remove bubbles from the filler F.

[0055] exist Figure 5 In the illustrated embodiment, the fluid ejection devices 15 and 16 are disposed adjacent to each other in the vertical direction and are configured to locally eject pressurized fluid onto the filler F in the gap between the stacked wafers Ws. In one embodiment, the bubble removal device 5 may include at least one of the fluid ejection devices 15 and 16 .

[0056] Fig. 6A and Figure 6B 1 is a schematic diagram showing the state of spraying pressurized fluid into the gap between stacked wafers. The control device 40 is electrically connected to each fluid spraying device 15, 16 and can independently control each fluid spraying device 15, 16. Fig. 6A As shown, the filler F is compressed by locally spraying a pressurized fluid onto the filler F in the gap between the stacked wafers Ws.

[0057] like Figure 6BAs shown, the bubbles mixed into the filler F are compressed together with the filler F and soon become smaller to a level that does not adversely affect the blade portion NE. The size of the bubbles reduced by the injection of the pressurized fluid does not return to its original size. As shown above, the bubble removal device 5 can remove bubbles from the filler F applied to the gap between the stacked wafers Ws.

[0058] Figure 7 2 is a diagram showing another embodiment of the coating device. Figure 7 As shown, the coating device 2 may also include: a syringe body 20 filled with a filler F; an introduction portion 21 that introduces the filler F in the syringe body 20 into the supply nozzle 4 via a support arm 3; a rod 22 that pushes the filler F in the introduction portion 21 to the supply nozzle 4; and an injection nozzle 23 that injects a pressurized fluid (e.g., nitrogen) into the filler in the syringe body 20.

[0059] The filler F in the syringe body 20 may contain air bubbles. Figure 7 In the illustrated embodiment, the injection nozzle 23 is configured to inject pressurized fluid to the filler F supplied to the supply nozzle 4 (i.e., the filler F in the syringe body 20) to remove bubbles in the filler F before the filler F is applied to the gaps between the stacked wafers Ws.

[0060] The control device 40 is configured to control the operation of the injection nozzle 23. More specifically, the control device 40 is electrically connected to a fluid supply source (not shown) that supplies pressurized fluid through the injection nozzle 23. By injecting the pressurized fluid from the injection nozzle 23, the bubbles of the filler F mixed into the syringe body 20 are compressed together with the filler F, and soon become small to a level that does not adversely affect the blade portion NE (see Fig. 6A and Figure 6B ).

[0061] The control device 40 is configured to control the movement of the rod 22. More specifically, the control device 40 is electrically connected to a vertical movement device (not shown) that vertically moves the rod 22. An example of the rod 22 is a piston rod.

[0062] By moving the rod 22 up and down while the bubbles in the filling agent F in the syringe body 20 are removed, the filling agent F in the introduction portion 21 is supplied to the gap between the stacked wafers Ws through the supply nozzle 4 .

[0063] According to this embodiment, bubbles in the filler F can be removed before the filler F is applied to the gaps between the stacked wafers Ws, thereby preventing defects such as breakage or chipping in the blade portion NE due to bubbles mixed in the filler F.

[0064] Figure 3 The embodiment shown, Figure 5 The embodiment shown, and Figure 7 The embodiments shown can be appropriately combined as needed. By combining the above, bubbles mixed into the filler F can be more effectively removed. Figure 7 The structure of the embodiment shown in the figure is used to replace the bubble removal device 5 (see Figure 3 and Figure 5 ).

[0065] Figure 8 Schematic diagram of a curing device for curing a filler applied to a gap between stacked wafers. Figure 8 As shown, the substrate manufacturing apparatus may include a curing device 30 for curing the filler F applied to the gap between the stacked wafers Ws. The control device 40 is electrically connected to the curing device 30 and can control the operation of the curing device 30 .

[0066] In one embodiment, if a filler F that cures by irradiating ultraviolet rays is used, the curing device 30 may be an ultraviolet irradiation device that irradiates ultraviolet rays to the filler F to cure the filler F. In one embodiment, if a filler F that cures by moisture is used, the curing device 30 may be a mist supply device that supplies mist to the filler F to cure the filler F. In one embodiment, the curing device 30 may be a heater that supplies high-temperature (i.e., a temperature required for curing the filler F) gas to the filler F to heat the filler F. The temperature required for curing the filler F is, in other words, the curing temperature.

[0067] like Figure 8 As shown in the figure, the substrate manufacturing apparatus may also include: a coating device 2, a bubble removal device 5 (more specifically, a vibration device 10), and a curing device 30. With the above-mentioned structure, the coating of the filler F, the removal of bubbles, and the curing of the filler F can be performed in a short time, and as a result, the process time of the stacked wafer Ws can be shortened. Although not shown in the figure, the substrate manufacturing apparatus may also include a spray nozzle 23 (see FIG. 2 ) for spraying a pressurized fluid on the filler F supplied to the supply nozzle 4. Figure 7 ).

[0068] Fig. 9 Schematic diagram showing a combination of a fluid ejection device as a bubble removal device and a curing device. Fig. 9 As shown in FIG. 1 , the substrate manufacturing apparatus may also include: fluid injection devices 15, 16, and a curing device 30. Although not shown in the figure, the substrate manufacturing apparatus may also include an injection nozzle 23 (see FIG. 2 ) for injecting a pressurized fluid to the filler F supplied to the supply nozzle 4. Figure 7 ).

[0069] exist Fig. 9In the illustrated embodiment, the curing device 30 is arranged on the downstream side of the fluid ejection devices 15 and 16 in the rotation direction of the stacked wafer Ws. In other words, the fluid ejection devices 15 and 16 are arranged between the supply nozzle 4 and the curing device 30 in the rotation direction of the stacked wafer Ws. By the arrangement shown above, the filler F supplied from the supply nozzle 4 is quickly cured after the bubbles inside it are removed. As a result, the process time of the stacked wafer Ws can be shortened. The grinding process of grinding (thinning) the first wafer W1 or the second wafer W2 is performed after the filler F is cured.

[0070] In one embodiment, at least one of the fluid ejection devices 15 and 16 may also have the same function as the curing device 30. For example, the fluid ejection device 16 disposed on the downstream side of the fluid ejection device 15 in the rotation direction of the stacked wafer Ws may also be configured to eject the heated fluid. With the configuration shown above, the bubbles in the filler F supplied from the supply nozzle 4 are removed by the fluid ejection device 15, and then the filler F is rapidly cured. Although not shown in the figure, the bubble removal device 5 may include not only the fluid ejection devices 15 and 16 but also the vibration device 10.

[0071] The above embodiments are recorded for the purpose of enabling a person with ordinary knowledge in the technical field to which the present invention belongs to implement the present invention. Various modifications of the above embodiments should be accomplished by a person skilled in the art, and the technical idea of ​​the present invention may also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is interpreted as the maximum scope of the technical idea defined by the scope of the patent application.

[0072] Industrial Applicability

[0073] The present invention can be used in a substrate manufacturing method and a substrate manufacturing device.

[0074] Explanation of symbols

[0075] 1: Substrate holding device

[0076] 2: Coating device

[0077] 3: Support arm

[0078] 4: Supply nozzle

[0079] 5: Bubble removal device

[0080] 10: Vibration device

[0081] 15, 16: Fluid injection device

[0082] 20: Syringe body

[0083] 21: Import

[0084] 22: Rod

[0085] 23: Spray nozzle

[0086] 30: Curing device

[0087] 40: Control device.

Claims

1. A method for manufacturing a substrate, comprising manufacturing a laminated substrate formed by laminating a first substrate and a second substrate, wherein: The process includes the following steps: A step of applying a filler to a gap between the inclined surface of the first substrate and the inclined surface of the second substrate; and A step of removing bubbles from the filler applied to the gap.

2. The method for manufacturing a substrate according to claim 1, wherein: The step of removing the bubbles includes the step of vibrating the stacked substrate using a substrate holding device that holds the stacked substrate.

3. The method for manufacturing a substrate according to claim 1, wherein: The step of removing the bubbles includes the step of spraying a pressurized fluid onto the filler applied to the gap.

4. The method for manufacturing a substrate according to claim 1, wherein: The substrate manufacturing method includes a step of removing bubbles in a filler before applying the filler to the gap.

5. The method for manufacturing a substrate according to claim 1, wherein: The substrate manufacturing method includes, after the step of removing the bubbles, a step of curing the filler applied to the gap.

6. The method for manufacturing a substrate according to claim 1, wherein: The substrate manufacturing method includes a step of grinding the laminated substrate.

7. A substrate manufacturing device for manufacturing a laminated substrate formed by laminating a first substrate and a second substrate, characterized in that: have: a coating device for coating a filler in a gap between the inclined surface of the first substrate and the inclined surface of the second substrate; and A bubble removal device removes bubbles from the filler applied to the gap.

8. The substrate manufacturing device according to claim 7, characterized in that: The bubble removing device includes a vibrating device that vibrates the stacked substrate using a substrate holding device that holds the stacked substrate.

9. The substrate manufacturing device according to claim 7, wherein: The bubble removal device includes a fluid ejecting device that ejects a pressurized fluid onto the filler applied to the gap.

10. The substrate manufacturing device according to claim 7, wherein: The coating device includes a jet nozzle that jets a pressurized fluid toward a filler supplied to a supply nozzle that supplies the filler to the gap.

11. The substrate manufacturing apparatus according to claim 7, wherein: The substrate manufacturing apparatus includes a curing device that cures the filler applied to the gap.

12. The substrate manufacturing device according to claim 11, wherein: The curing device is disposed on the downstream side of a fluid ejecting device that ejects a pressurized fluid onto the filler applied to the gap in the rotation direction of the substrate.

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