Rotary spraying type wafer wet processing all-in-one machine

Abstract

The invention discloses a rotary spraying type wafer wet processing all-in-one machine, which comprises a wafer processing cylinder, a spraying mechanism, a driving mechanism, a filtering mechanism and a liquid storage tank, and is characterized in that the wafer processing cylinder is provided with a processing cavity, and a rotary frame is arranged in the processing cavity; the driving mechanism is used for driving the rotating frame to rotate, the spraying mechanism is used for spraying liquid medicine to a wafer, the filtering mechanism comprises a filtering box and a filtering part, the liquid discharging pipe is used for discharging the treated mixed liquid into the filtering part, the liquid storage tank is used for storing the filtered liquid medicine, and after the treated mixed liquid is filtered by the filtering part, the liquid medicine enters the cavity. And the filtered liquid medicine in the cavity flows into the liquid storage tank through the pipeline. According to the rotary spraying type wafer wet processing all-in-one machine, through cooperation of the spraying mechanism, the driving mechanism, the filtering mechanism and the liquid storage tank, automatic filtering of mixed liquid is achieved, frequent operation of operators is not needed, time and labor are saved, meanwhile, liquid medicine or cleaning liquid flowing back to the liquid storage tank can be reused after being finely filtered, and the efficiency is improved. And the processing cost of the wafer is greatly reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer processing equipment, and in particular relates to a rotary spray type wafer wet processing integrated machine. Background Art

[0002] The rotary spray wafer wet processing machine is a wet drying machine used in semiconductor industry wafer manufacturing. It can be used for wet process of strong acid, strong alkali, organic and other types of solvents, and is suitable for most wet processes of 2-inch to 12-inch wafers.

[0003] At present, in the degumming process of the conventional rotary spray-type wafer wet processing all-in-one machine, it is necessary to use liquid medicine to remove the photoresist on the surface of the wafer in the wafer processing barrel. The removed colloid will fall into the liquid medicine and be discharged from the wafer processing barrel together with the liquid medicine. This method will cause waste of liquid medicine. The processing method of the existing rotary spray-type wafer wet processing all-in-one machine is to place a filter bag at the discharge port of the wafer processing barrel, separate the colloid and the liquid medicine through the filter bag and collect the colloid in the filter bag, and the filtered liquid medicine will flow back to the liquid medicine storage tank through the pipeline, thereby avoiding waste of liquid medicine. However, in the actual operation process, when the colloid in the filter bag reaches a certain amount, the filter bag needs to be replaced. Obviously, there are disadvantages such as inconvenient operation, frequent replacement by operators, and time-consuming and labor-intensive. Summary of the invention

[0004] The object of the present invention is to provide a rotary spray type wafer wet processing all-in-one machine to solve the problem in the prior art that conventional rotary spray type wafer wet processing all-in-one machines require operators to frequently replace filter bags, resulting in inconvenience in operation.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A rotary spray type wafer wet processing integrated machine comprises a frame and a wafer processing cylinder, a spray mechanism, a driving mechanism, a filtering mechanism and a liquid storage tank arranged on the frame, wherein:

[0007] The wafer processing barrel has a processing chamber for wafer processing, and a rotating frame for carrying the wafers to be processed is rotatably arranged in the processing chamber; the fixed end of the driving mechanism is installed on the wafer processing barrel, and the driving end of the driving mechanism extends into the processing chamber and is connected to the rotating frame, and the driving mechanism is configured to drive the rotating frame to rotate, so as to drive the wafers to be processed to rotate;

[0008] The spray mechanism is installed on the wafer processing barrel, and the spray mechanism is configured to spray liquid or cleaning water onto the wafer located in the processing chamber to process the surface of the wafer;

[0009] The filtering mechanism includes a filter box and a filter element, the filter box is connected with the processing chamber through a drain pipe, the drain pipe is configured to discharge the mixed liquid after treatment in the processing chamber into the filter element, the filter element is provided with a plurality of filter holes, a cavity for temporarily storing filtered medicine liquid or cleaning water is formed between the filter element and the filter box, the liquid storage tank is configured to store filtered medicine liquid or cleaning water, the cavity is connected with the liquid storage tank through a pipeline, after the treated mixed liquid is filtered by the filter element, the medicine liquid or cleaning water enters the cavity, and the filtered medicine liquid or cleaning water in the cavity flows into the liquid storage tank through the pipeline.

[0010] Furthermore, the spray mechanism includes a nozzle assembly and a fine filter assembly, the nozzle assembly is installed on the wafer processing barrel, the water spraying end of the nozzle assembly is facing the wafer to be processed, the nozzle assembly is connected to the first end of the fine filter assembly through a pipeline, the second end of the fine filter assembly is connected to the liquid storage tank through a pipeline, and the fine filter assembly is configured to perform secondary fine filtration on the filtered medicine liquid or cleaning water, and the filtered medicine liquid or cleaning water in the liquid storage tank is transported to the nozzle assembly after secondary fine filtration by the fine filter assembly.

[0011] Furthermore, the nozzle assembly includes a plurality of liquid supply channels and a plurality of nozzle units, wherein:

[0012] The wafer processing cylinder wall is provided with a plurality of liquid supply channels at intervals along the circumferential direction, and each of the liquid supply channels corresponds to a group of the nozzle units;

[0013] Each group of the nozzle units includes a plurality of nozzles spaced apart along the length direction of the liquid supply channel, and a mounting hole penetrating the liquid supply channel is provided on the wafer processing cylinder corresponding to each of the nozzles, and each of the nozzles is rotatably mounted in the corresponding mounting hole;

[0014] Each of the nozzles includes a first nozzle and a second nozzle, the first end of the second nozzle extends into the cavity of the wafer processing barrel, the second end of the second nozzle is provided with a groove, a liquid spraying channel is provided in the second nozzle, a protrusion is provided at the first end of the first nozzle, and an adjustment portion is provided at the second end of the first nozzle. After the first nozzle and the second nozzle are sealed and installed in the corresponding mounting holes, the protrusion is located in the groove, and a liquid separation channel is formed between the protrusion and the groove. The first end of the liquid separation channel is connected to the liquid supply channel, and the second end of the liquid separation channel is connected to the liquid spraying channel. The first nozzle is rotated by adjusting the adjustment portion, thereby driving the second nozzle to rotate to adjust the liquid spraying angle of the nozzle.

[0015] Furthermore, each group of the nozzle units also includes a pressing plate, which is detachably fixed to the outer wall of the wafer processing barrel and pressed against the adjusting parts of all the first nozzles of each group of the nozzle units to fix all the nozzles of each group of the nozzle units in the corresponding mounting holes. A through hole is provided on the pressing plate corresponding to the adjusting part of each of the first nozzles, and a group of fixing holes is opened on the pressing plate corresponding to each of the nozzles. Threaded holes are opened on the wafer processing barrel corresponding to the fixing holes, and fixing screws pass through the fixing holes and are fixed in the corresponding threaded holes to detachably fix the pressing plate to the outer wall of the wafer processing barrel.

[0016] Furthermore, the filtering mechanism further includes a cleaning pipe, a first control valve and a blowing assembly, wherein the first end of the cleaning pipe is connected to the bottom end of the filter element, and the second end of the cleaning pipe is connected to the factory sewage pipe. After the treated mixed liquid is filtered by the filter element, the liquid medicine or cleaning water enters the cavity, and the colloid in the mixed liquid is separated into the filter element and discharged into the factory sewage pipe through the cleaning pipe. The first control valve is arranged on the cleaning pipe, and the first control valve is configured to control the on and off of the cleaning pipe. The blowing assembly is installed on the filter box, and the blowing end of the blowing assembly is arranged toward the filter element, and the blowing assembly is configured to blow toward the colloid deposited in the filter element when discharging sewage;

[0017] During normal operation, the first control valve is in a closed state, and the colloid filtered by the filter element is deposited at the bottom of the filter element; when the amount of colloid deposited in the filter element reaches a preset value, the first control valve is in an open state, and at the same time, the blowing assembly blows air toward the colloid deposited in the filter element, so that the colloid in the filter element is discharged into the factory sewage pipe through the sewage cleaning pipe.

[0018] Furthermore, the filtering mechanism also includes a flushing component, which is configured to flush the filter element after the colloid in the filter element is discharged into the cleaning pipe to clean the filter element. The flushing component includes a flushing pipe and a flushing joint, and the flushing joint is installed on the filter box. The first end of the flushing pipe is connected to the flushing pipeline of the processing chamber. The cleaning water after cleaning the wafer processing chamber flows into the flushing pipe through the flushing pipeline. The second end of the flushing pipe is installed on the flushing joint.

[0019] Furthermore, the driving mechanism includes a driving motor and a first protective cover, wherein:

[0020] The fixed end of the driving motor is installed on the wafer processing barrel, the driving end of the driving motor extends into the wafer processing barrel and is connected to the rotating frame, the first protective cover is sealingly installed on the periphery of the driving motor, and an air supply port is provided in the first protective cover, and gas is supplied into the first protective cover through the air supply port to form a positive pressure in the first protective cover to prevent external gas from entering the first protective cover.

[0021] Furthermore, the spin-spray type wafer wet processing integrated machine also includes a moving seat and a locking assembly, wherein:

[0022] The wafer processing barrel is mounted on the movable seat, and the movable seat is mounted on the frame to be reciprocatingly movable along a first direction to move the wafer processing barrel to a working position or an operating position, wherein the working position is located inside the frame, and the operating position is located outside the frame;

[0023] The locking assembly is configured to fix the moving seat in the working position on the frame.

[0024] Furthermore, the locking assembly includes two locking units spaced apart along the second direction, each of the locking units includes a locking piece, a first disassembly assembly component and a second disassembly assembly component, the locking piece is a "Z"-shaped plate, the upper end of the locking piece can be detachably mounted at a preset position of the movable seat through the first disassembly assembly component, and the lower end of the locking piece plate can be detachably mounted at a preset position of the frame through the second disassembly assembly component.

[0025] Furthermore, the rotary spray type wafer wet processing integrated machine also includes an automatic lifting door arranged on the frame, and the automatic lifting door includes a first driving component, a lifting component, a second driving component and a door panel component; wherein:

[0026] The frame is provided with a first avoidance hole, the first avoidance hole and the opening of the processing chamber of the wafer processing cylinder are at the same height, the lifting member is escalably mounted on the frame, the fixed end of the first driving component is mounted on the frame, the driving end of the first driving component is connected to the lifting member, and the first driving component is configured to drive the lifting member to move up and down;

[0027] The fixed end of the second driving member is mounted on the lifting member, the driving end of the second driving member is connected to the door panel assembly, and the second driving member is configured to drive the door panel assembly to move closer to or away from the frame;

[0028] The first driving component drives the lifting member to rise to a height corresponding to the first avoidance hole, and the second driving component drives the door panel assembly to move close to the frame, so that the door panel assembly passes through the first avoidance hole and closes the opening of the processing chamber.

[0029] Compared with the prior art, the beneficial effects of the rotary spray type wafer wet processing integrated machine are as follows:

[0030] 1) Through the cooperation of the spray mechanism, the driving mechanism, the filtering mechanism and the liquid storage tank, the spray mechanism sprays the liquid medicine or the cleaning water onto the wafer in the processing chamber to process the surface of the wafer, and the liquid discharge pipe discharges the mixed liquid after the processing in the processing chamber into the filter element, and the treated mixed liquid is filtered by the filter element and the liquid medicine or the cleaning water enters the chamber, and the filtered liquid medicine or the cleaning water in the chamber flows into the liquid storage tank through the pipeline, thereby realizing the automatic filtration of the mixed liquid, eliminating the need for frequent operation by the operator, saving time and labor, and at the same time, the liquid medicine or the cleaning liquid refluxed into the liquid storage tank can be reused after fine filtration, which greatly reduces the processing cost of the wafer;

[0031] 2) The first nozzle and the second nozzle cooperate to adjust the spray angle of the nozzle in the wafer processing barrel, and at the same time realize the diversion of the liquid in the liquid supply channel, so that the nozzle cleans the wafer more evenly, thereby improving the wafer processing effect;

[0032] 3) Through the cooperation of the first control valve, the air blowing assembly and the filter element, the filtered colloid is first deposited in the filter element, and then discharged through the cleaning pipe after a certain amount of colloid is deposited, thereby avoiding the colloid from clogging the filter holes of the filter element and improving the filtering efficiency and filtering effect of the filter element;

[0033] 4) A flushing component is provided to flush the filter element after sewage discharge to prevent residual colloid from clogging the filter holes of the filter element. The flushing component uses secondary water from wafer cleaning to clean the filter element. Under the premise of ensuring the flushing effect, water is saved, which is conducive to saving emissions and reducing production costs;

[0034] 5) Through the cooperation of the moving seat and the locking assembly, the moving seat can be reciprocated and installed on the frame along the first direction, and the wafer processing cylinder is moved to the working position or the operating position. The locking assembly fixes the moving seat in the working position on the frame. When it is necessary to take out or repair materials, the operator only needs to move the moving seat from the working position to the operating position to carry out subsequent operations, which is convenient to operate;

[0035] 6) The first driving component, the lifting component, the second driving component and the door panel component are used to set the opening and closing door of the rotary spray type wafer wet processing integrated machine to a lifting type, thereby saving space. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the following briefly introduces the background technology of the present invention and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0037] Figure 1 It is a schematic diagram of the three-dimensional structure of a rotary spray type wafer wet processing integrated machine provided in an embodiment of the present invention;

[0038] Figure 2 is a schematic diagram of the three-dimensional structure of the spray mechanism provided in an embodiment of the present invention;

[0039] Figure 3 is a schematic diagram of the three-dimensional structure of a nozzle assembly provided by an embodiment of the present invention;

[0040] Figure 4 is a schematic diagram of the three-dimensional structure of a driving mechanism provided by an embodiment of the present invention;

[0041] Figure 5 is another three-dimensional structural schematic diagram of the driving mechanism provided by an embodiment of the present invention;

[0042] Figure 6 is a schematic diagram of the three-dimensional structure of the filtering mechanism provided by an embodiment of the present invention;

[0043] Figure 7 is another three-dimensional structural schematic diagram of the filtering mechanism provided by an embodiment of the present invention;

[0044] Figure 8 is a schematic diagram of the three-dimensional structure of an automatic lifting door provided by an embodiment of the present invention;

[0045] Fig. 9 It is a cross-sectional schematic diagram of an automatic lifting door provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0046] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0047] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on the other component or there can also be a central component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and are not intended to be the only implementation method. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0048] See also Figures 1 to 9 As shown, in this embodiment, a rotary spray type wafer wet processing integrated machine includes a frame 1 and a wafer processing barrel 2, a spray mechanism 3, a driving mechanism 4, a filtering mechanism 5 and a liquid storage tank 6 arranged on the frame 1, wherein: the wafer processing barrel 2 has a processing chamber 20 for wafer processing, and a rotating frame 21 for carrying wafers to be processed is rotatably arranged in the processing chamber 20; the fixed end of the driving mechanism 4 is installed on the wafer processing barrel 2, and the driving end of the driving mechanism 4 extends into the processing chamber 20 and is connected to the rotating frame 21, and the driving mechanism 4 is configured to drive the rotating frame 21 to rotate, so as to drive the wafers to be processed to rotate; the spray mechanism 3 is installed on the wafer processing barrel 2, and the spray mechanism 3 is configured to spray liquid or cleaning water onto the wafers located in the processing chamber 20. On, the wafer surface is processed; the filtering mechanism 5 includes a filter box 50 and a filter element 51, the filter box 50 is connected to the processing chamber 20 through a drain pipe 52, the drain pipe 52 is configured to discharge the mixed liquid after processing in the processing chamber 20 into the filter element 51, a plurality of filter holes 510 are provided on the filter element 51, and a cavity 500 for temporarily storing filtered medicine or cleaning water is formed between the filter element 51 and the filter box 50, the liquid storage tank 6 is configured to store filtered medicine or cleaning water, the cavity 500 is connected to the liquid storage tank 6 through a pipeline, after the treated mixed liquid is filtered by the filter element 51, the medicine or cleaning water enters the cavity 500, and the filtered medicine or cleaning water in the cavity 500 flows into the liquid storage tank 6 through the pipeline.

[0049] It can be seen that, through the cooperation of the spray mechanism 3, the driving mechanism 4, the filtering mechanism 5 and the liquid storage tank 6, the spray mechanism 3 sprays the medicine liquid or the cleaning water onto the wafer located in the processing chamber 20 to process the wafer surface, and the drain pipe 52 discharges the mixed liquid after the treatment in the processing chamber 20 into the filter element 51. After the treated mixed liquid is filtered by the filter element 51, the medicine liquid or the cleaning water enters the cavity 500, and the filtered medicine liquid or the cleaning water in the cavity 500 flows into the liquid storage tank 6 through the pipeline, thereby realizing automatic filtration of the mixed liquid, eliminating the need for frequent operations by operators, saving time and effort, and at the same time, the medicine liquid or the cleaning liquid refluxed to the liquid storage tank 6 can be reused after fine filtration, thereby greatly reducing the processing cost of the wafer.

[0050] As an embodiment, the spray mechanism 3 includes a nozzle assembly and a fine filter assembly. The nozzle assembly is installed on the wafer processing barrel 2. The water spraying end of the nozzle assembly is facing the wafer to be processed. The nozzle assembly is connected to the first end of the fine filter assembly through a pipeline. The second end of the fine filter assembly is connected to the liquid storage tank 6 through a pipeline. The fine filter assembly is configured to perform secondary fine filtration on the filtered medicine or cleaning water. The filtered medicine or cleaning water in the liquid storage tank 6 is transported to the nozzle assembly after secondary fine filtration by the fine filter assembly.

[0051] As an embodiment, the nozzle assembly includes a plurality of liquid supply channels 30 and a plurality of groups of nozzle units 31, wherein: a plurality of liquid supply channels 30 are arranged at intervals along the circumferential direction in the barrel wall of the wafer processing barrel 2, and each liquid supply channel 30 corresponds to a group of nozzle units 31; each group of nozzle units 31 includes a plurality of nozzles arranged at intervals along the length direction of the liquid supply channel 30, and a mounting hole penetrating the liquid supply channel 30 is arranged on the wafer processing barrel 2 corresponding to each nozzle, and each nozzle is rotatably mounted in the corresponding mounting hole; each nozzle includes a first nozzle 310 and a second nozzle 311, and the first end of the second nozzle 311 extends into the cavity 500 of the wafer processing barrel 2 ... A groove 34 is provided at the second end of the second nozzle 311, and a liquid spraying channel is provided in the second nozzle 311. A protrusion 33 is provided at the first end of the first nozzle 310, and an adjusting portion is provided at the second end of the first nozzle 310. After the first nozzle 310 and the second nozzle 311 are sealed and installed in corresponding mounting holes, the protrusion 33 is located in the groove 34, and a liquid separation channel 32 is formed between the protrusion 33 and the groove 34. The first end of the liquid separation channel 32 is connected to the liquid supply channel 30, and the second end of the liquid separation channel 32 is connected to the liquid spraying channel. The first nozzle 310 is rotated by adjusting the adjusting portion, thereby driving the second nozzle 311 to rotate to adjust the liquid spraying angle of the nozzle.

[0052] It can be seen that through the cooperation between the first nozzle 310 and the second nozzle 311, the nozzle can adjust the spray angle in the wafer processing barrel 2, and at the same time realize the diversion of the liquid in the liquid supply channel 30, so that the nozzle cleans the wafer more evenly, thereby improving the processing effect of the wafer.

[0053] Specifically, each group of nozzle units 31 also includes a pressing plate 35, which is detachably fixed to the outer wall of the wafer processing barrel 2 and pressed against the adjusting parts of all the first nozzles 310 of each group of nozzle units 31 to fix all the nozzles of each group of nozzle units 31 in the corresponding mounting holes. A through hole is provided on the pressing plate 35 corresponding to the adjusting part of each first nozzle 310. Obviously, the nozzle is fixed by the pressing plate 35, which has a simple structure and improves the installation stability of the nozzle. It is also convenient for disassembly and assembly, and facilitates the later maintenance of the nozzle.

[0054] Specifically, a group of fixing holes are opened on the pressure plate 35 corresponding to each nozzle 31, and threaded holes are opened on the wafer processing barrel 2 corresponding to the fixing holes. The fixing screws pass through the fixing holes and are fixed in the corresponding threaded holes to detachably fix the pressure plate 4 to the outer wall of the wafer processing barrel 2.

[0055] As an embodiment, the filter mechanism 5 further includes a cleaning pipe 53, a first control valve 54 and a blowing assembly 55. The first end of the cleaning pipe 53 is connected to the bottom end of the filter element 51, and the second end of the cleaning pipe 53 is connected to the factory sewage pipe. After the treated mixed liquid is filtered by the filter element 51, the liquid medicine or cleaning water enters the cavity 500, and the colloid in the mixed liquid is separated into the filter element 51 and discharged into the factory sewage pipe through the cleaning pipe 53. The first control valve 54 is arranged on the cleaning pipe 53, and the first control valve 54 is configured to control the on and off of the cleaning pipe 53. The blowing assembly 55 is installed on the filter box 50, and the blowing end of the blowing component 55 is set toward the filter element 51. The blowing component 55 is configured to blow air toward the colloid deposited in the filter element 51 when discharging sewage; during normal operation, the first control valve 54 is in a closed state, and the colloid filtered by the filter element 51 is deposited at the bottom of the filter element 51; when the deposition amount of the colloid in the filter element 51 reaches a preset value, the first control valve 54 is in an open state, and the blowing component 55 blows air toward the colloid deposited in the filter element 51, so that the colloid in the filter element 51 is discharged into the factory sewage pipe through the sewage cleaning pipe 53.

[0056] It can be seen that, through the cooperation of the first control valve 54, the blowing assembly 55 and the filter element 51, the filtered colloid is first deposited in the filter element 51, and then discharged through the cleaning pipe 53 after a certain amount of colloid is deposited, thereby avoiding the colloid from clogging the filter holes 510 of the filter element 51 and improving the filtering efficiency and filtering effect of the filter element 51.

[0057] As an embodiment, the filter mechanism 5 also includes a flushing component 56, which is configured to flush the filter element 51 after the colloid in the filter element 51 is discharged into the cleaning pipe 53, so as to clean the filter element 51. The flushing component 56 includes a flushing pipe and a flushing joint. The flushing joint is installed on the filter box 50. The first end of the flushing pipe is connected to the flushing pipeline of the processing chamber 20. The cleaning water after cleaning the wafer processing chamber 20 flows into the flushing pipe through the flushing pipeline. The second end of the flushing pipe is installed on the flushing joint.

[0058] It can be seen that a flushing component 56 is provided to flush the filter element 51 after sewage discharge to prevent residual colloid from clogging the filter holes 510 of the filter element 51, and the flushing component 56 uses secondary water for wafer cleaning to clean the filter element 51. Under the premise of ensuring the flushing effect, water is saved, which is conducive to saving emissions and reducing production costs.

[0059] Specifically, the filter element 51 as a whole is a conical structure that is larger at the top and smaller at the bottom. The density of the filter holes 510 on the filter element 51 increases from top to bottom, and the aperture of the filter holes 510 on the filter element 51 decreases from top to bottom.

[0060] Specifically, the liquid storage tank 6 is located below the box body, and the filtered liquid medicine in the cavity 500 flows into the liquid storage tank 6 by its own weight.

[0061] As an embodiment, the driving mechanism 4 includes a driving motor 40 and a first protective cover 41, wherein: the fixed end of the driving motor 40 is installed on the wafer processing barrel 2, and the driving end of the driving motor 40 extends into the wafer processing barrel 2 and is connected to the rotating frame 21; the first protective cover 41 is sealed and installed on the periphery of the driving motor 40, and an air supply port 410 is provided in the first protective cover 41, and gas is supplied into the first protective cover 41 through the air supply port 410, so that a positive pressure is formed in the first protective cover 41 to prevent external gas from entering the first protective cover 41.

[0062] It can be seen that by opening an air supply port 410 on the first protective cover 41, the first protective cover 41 is sealed and installed on the periphery of the drive motor 40, and gas is supplied into the first protective cover 41 through the air supply port, so that a positive pressure is formed in the first protective cover 41 to prevent external gas from entering the first protective cover 41, which can effectively prevent the evaporated medicine or cleaning water from getting on the surface of the drive motor 40, thereby greatly improving the service life of the drive motor 40.

[0063] Specifically, the gas is nitrogen, and the nitrogen is configured to protect and cool the drive motor 40 when the drive motor 40 is working.

[0064] As an embodiment, a rotary spray type wafer wet processing integrated machine also includes a moving seat 7 and a locking assembly 8, wherein: the wafer processing cylinder 2 is installed on the moving seat 7, and the moving seat 7 can move along a first direction ( Figure 1 The movable seat 7 is reciprocatingly mounted on the frame 1 in the X direction in the middle to move the wafer processing barrel 2 to a working position or an operating position, wherein the working position is located inside the frame 1 and the operating position is located outside the frame 1; the locking assembly 8 is configured to fix the movable seat 7 in the working position on the frame 1.

[0065] It can be seen that through the cooperation of the movable seat 7 and the locking assembly 8, the movable seat 7 can be installed on the frame 1 to move back and forth along the first direction, and the wafer processing cylinder 2 is moved to the working position or the operating position. The locking assembly 8 fixes the movable seat 7 in the working position on the frame 1. When it is necessary to take out materials or perform maintenance, the operator only needs to move and drag the movable seat 7 from the working position to the operating position to perform subsequent operations, which is convenient to operate.

[0066] As an embodiment, the locking assembly 8 includes two Figure 1 The locking units are arranged at intervals (in the Y direction in the middle), each locking unit includes a locking piece 80, a first disassembly assembly component 81 and a second disassembly assembly component 82, the locking piece 80 is a "Z"-shaped plate, the upper end of the locking piece 80 can be detachably mounted at a preset position of the movable seat 7 through the first disassembly assembly component 81, and the lower end of the locking piece 80 plate can be detachably mounted at a preset position of the frame 1 through the second disassembly assembly component 82.

[0067] Specifically, a reinforcement structure is provided in the middle of the locking piece 80 , and the reinforcement structure is a reinforcement rib 83 . The first end of the reinforcement rib 83 is provided in the middle of the locking piece 80 along the height direction, and the second end of the reinforcement rib 83 extends to the lower end of the locking piece 80 .

[0068] Obviously, by providing the reinforcement structure, the use strength of the locking member 80 is greatly improved, and the service life is increased.

[0069] Specifically, the two ends of the bottom of the movable seat 7 are slidably arranged on the frame 1 through sliding units respectively. The sliding unit includes a first concave slide rail 84 arranged at the bottom of the movable seat 7 and a second concave slide rail 85 arranged on the frame 1. The concave surfaces of the first concave slide rail 84 and the second concave slide rail 85 are arranged relatively to each other. The first concave slide rail 84 can be slidably arranged in the concave surface of the second concave slide rail 85. Through the sliding cooperation of the first concave slide rail 84 and the second concave slide rail 85, the movable seat 7 can be slidably arranged on the frame 1.

[0070] Obviously, through the sliding cooperation between the first concave slide rail 84 and the second concave slide rail 85, the movable seat 7 can be slidably arranged on the frame 1, and the sliding manner is simple and easy to implement.

[0071] As an embodiment, a rotary spray type wafer wet processing integrated machine also includes an automatic lifting door 9 arranged on a frame 1, and the automatic lifting door 9 includes a first drive assembly 90, a lifting member 91, a second drive member 92 and a door panel assembly 93; wherein: a first avoidance hole 10 is opened on the frame 1, and the first avoidance hole 10 is at the same height as the opening of the processing chamber 20 of the wafer processing cylinder 2, the lifting member 91 can be installed on the frame 1 in a liftable manner, the fixed end of the first drive assembly 90 is installed on the frame 1, and the driving end of the first drive assembly 90 is connected to the lifting member 91, the first driving component 90 is configured to drive the lifting member 91 to rise and fall; the fixed end of the second driving member 92 is installed on the lifting member 91, and the driving end of the second driving member 92 is connected to the door panel component 93, and the second driving member 92 is configured to drive the door panel component 93 to move closer to or away from the frame 1; the first driving component 90 drives the lifting member 91 to rise to the height corresponding to the first avoidance hole 10, and the second driving member 92 drives the door panel component 93 to move closer to the frame 1, so that the door panel component 93 passes through the first avoidance hole 10 and closes the opening of the processing chamber 20.

[0072] It can be seen that the opening and closing door of the rotary spray type wafer wet processing integrated machine is set to a lifting type through the first driving component 90, the lifting component 91, the second driving component 92 and the door panel component 93, thereby saving space.

[0073] The working principle of the above-mentioned rotary spray type wafer wet processing integrated machine for liquid filtration is:

[0074] S1, placing the wafer to be processed on the rotating frame 21, the driving mechanism 4 drives the rotating frame 21 to rotate, and the spraying mechanism 3 sprays the liquid onto the wafer in the processing chamber 20 to process the surface of the wafer;

[0075] S2, the liquid discharge pipe 52 discharges the mixed liquid after treatment in the treatment chamber 20 into the filter element 51, and the filter element 51 filters the mixed liquid after treatment through a plurality of filter holes 510. After the mixed liquid after treatment is filtered by the filter element 51, the liquid medicine enters the cavity 500, and the filtered liquid medicine in the cavity 500 flows into the liquid storage tank 6 through the pipeline;

[0076] S3, when the amount of colloid deposited in the filter element 51 reaches a preset value, the first control valve 54 is switched to an open state, and at the same time, the air blowing component 55 blows air downward into the filter element 51, so that the colloid in the filter element 51 is discharged into the cleaning pipe 53, and the flushing component 56 sprays cleaning water on the filter element 51 after the colloid in the filter element 51 is discharged into the cleaning pipe 53, so as to clean the colloid remaining on the surface of the filter element 51;

[0077] S4, the filtered liquid in the liquid storage tank 6 is transported to the nozzle assembly after secondary fine filtration by the fine filtration assembly;

[0078] S5, the nozzle assembly processes the wafers in the processing chamber 20 to achieve recycling of the chemical solution.

[0079] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above examples. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A rotary spray type wafer wet processing integrated machine, characterized in that: The rotary spray type wafer wet processing integrated machine comprises a frame and a wafer processing cylinder, a spray mechanism, a driving mechanism, a filtering mechanism and a liquid storage tank arranged on the frame, wherein: The wafer processing barrel has a processing chamber for wafer processing, and a rotating frame for carrying the wafers to be processed is rotatably arranged in the processing chamber; the fixed end of the driving mechanism is installed on the wafer processing barrel, and the driving end of the driving mechanism extends into the processing chamber and is connected to the rotating frame, and the driving mechanism is configured to drive the rotating frame to rotate, so as to drive the wafers to be processed to rotate; The spray mechanism is installed on the wafer processing barrel, and the spray mechanism is configured to spray liquid or cleaning water onto the wafer located in the processing chamber to process the surface of the wafer; The filtering mechanism includes a filter box and a filter element, the filter box is connected with the processing chamber through a drain pipe, the drain pipe is configured to discharge the mixed liquid after treatment in the processing chamber into the filter element, the filter element is provided with a plurality of filter holes, a cavity for temporarily storing filtered medicine liquid or cleaning water is formed between the filter element and the filter box, the liquid storage tank is configured to store filtered medicine liquid or cleaning water, the cavity is connected with the liquid storage tank through a pipeline, after the treated mixed liquid is filtered by the filter element, the medicine liquid or cleaning water enters the cavity, and the filtered medicine liquid or cleaning water in the cavity flows into the liquid storage tank through the pipeline.

2. The integrated rotary spray wafer wet processing machine according to claim 1, characterized in that: The spray mechanism includes a nozzle assembly and a fine filter assembly, wherein the nozzle assembly is mounted on the wafer processing barrel, the water spraying end of the nozzle assembly is facing the wafer to be processed, the nozzle assembly is connected to the first end of the fine filter assembly through a pipeline, the second end of the fine filter assembly is connected to the liquid storage tank through a pipeline, the fine filter assembly is configured to perform secondary fine filtration on the filtered medicine liquid or cleaning water, and the filtered medicine liquid or cleaning water in the liquid storage tank is transported to the nozzle assembly after secondary fine filtration by the fine filter assembly.

3. The integrated rotary spray wafer wet processing machine according to claim 2, characterized in that: The spray head assembly includes a plurality of liquid supply channels and a plurality of nozzle units, wherein: The wafer processing cylinder wall is provided with a plurality of liquid supply channels at intervals along the circumferential direction, and each of the liquid supply channels corresponds to a group of the nozzle units; Each group of the nozzle units includes a plurality of nozzles spaced apart along the length direction of the liquid supply channel, and a mounting hole penetrating the liquid supply channel is provided on the wafer processing cylinder corresponding to each of the nozzles, and each of the nozzles is rotatably mounted in the corresponding mounting hole; Each of the nozzles includes a first nozzle and a second nozzle, the first end of the second nozzle extends into the cavity of the wafer processing barrel, the second end of the second nozzle is provided with a groove, a liquid spraying channel is provided in the second nozzle, a protrusion is provided at the first end of the first nozzle, and an adjustment portion is provided at the second end of the first nozzle. After the first nozzle and the second nozzle are sealed and installed in the corresponding mounting holes, the protrusion is located in the groove, and a liquid separation channel is formed between the protrusion and the groove. The first end of the liquid separation channel is connected to the liquid supply channel, and the second end of the liquid separation channel is connected to the liquid spraying channel. The first nozzle is rotated by adjusting the adjustment portion, thereby driving the second nozzle to rotate to adjust the liquid spraying angle of the nozzle.

4. The integrated rotary spray wafer wet processing machine according to claim 3, characterized in that: Each group of the nozzle units also includes a pressing plate, which is detachably fixed to the outer wall of the wafer processing barrel and pressed against the adjusting parts of all the first nozzles of each group of the nozzle units to fix all the nozzles of each group of the nozzle units in corresponding mounting holes. A through hole is provided on the pressing plate corresponding to the adjusting part of each of the first nozzles, and a group of fixing holes is opened on the pressing plate corresponding to each of the nozzles. Threaded holes are opened on the wafer processing barrel corresponding to the fixing holes, and fixing screws pass through the fixing holes and are fixed in the corresponding threaded holes to detachably fix the pressing plate to the outer wall of the wafer processing barrel.

5. The integrated rotary spray wafer wet processing machine according to claim 1, characterized in that: The filtering mechanism further includes a cleaning pipe, a first control valve and an air blowing assembly, wherein the first end of the cleaning pipe is connected to the bottom end of the filter element, and the second end of the cleaning pipe is connected to the factory sewage pipe. After the treated mixed liquid is filtered by the filter element, the liquid medicine or cleaning water enters the cavity, and the colloid in the mixed liquid is separated into the filter element and discharged into the factory sewage pipe through the cleaning pipe. The first control valve is arranged on the cleaning pipe, and the first control valve is configured to control the on and off of the cleaning pipe. The air blowing assembly is installed on the filter box, and the air blowing end of the air blowing assembly is arranged toward the filter element, and the air blowing assembly is configured to blow air toward the colloid deposited in the filter element when discharging sewage; During normal operation, the first control valve is in a closed state, and the colloid filtered by the filter element is deposited at the bottom of the filter element; when the amount of colloid deposited in the filter element reaches a preset value, the first control valve is in an open state, and at the same time, the blowing assembly blows air toward the colloid deposited in the filter element, so that the colloid in the filter element is discharged into the factory sewage pipe through the sewage cleaning pipe.

6. The integrated rotary spray wafer wet processing machine according to claim 5, characterized in that: The filter mechanism also includes a flushing component, which is configured to flush the filter element after the colloid in the filter element is discharged into the cleaning pipe to clean the filter element. The flushing component includes a flushing pipe and a flushing joint, and the flushing joint is installed on the filter box. The first end of the flushing pipe is connected to the flushing pipeline of the processing chamber. The cleaning water after cleaning the wafer processing chamber flows into the flushing pipe through the flushing pipeline. The second end of the flushing pipe is installed on the flushing joint.

7. The integrated spin-spray wafer wet processing machine according to claim 1, characterized in that: The driving mechanism comprises a driving motor and a first protective cover, wherein: The fixed end of the driving motor is installed on the wafer processing barrel, the driving end of the driving motor extends into the wafer processing barrel and is connected to the rotating frame, the first protective cover is sealingly installed on the periphery of the driving motor, and an air supply port is provided in the first protective cover, and gas is supplied into the first protective cover through the air supply port to form a positive pressure in the first protective cover to prevent external gas from entering the first protective cover.

8. The integrated spin-spray wafer wet processing machine according to claim 1, characterized in that: The spin-spray type wafer wet processing integrated machine also includes a moving seat and a locking assembly, wherein: The wafer processing barrel is mounted on the movable seat, and the movable seat is mounted on the frame to be reciprocatingly movable along a first direction to move the wafer processing barrel to a working position or an operating position, wherein the working position is located inside the frame, and the operating position is located outside the frame; The locking assembly is configured to fix the moving seat in the working position on the frame.

9. The integrated rotary spray wafer wet processing machine according to claim 8, characterized in that: The locking assembly includes two locking units spaced apart along the second direction, each of the locking units includes a locking piece, a first disassembly assembly component and a second disassembly assembly component, the locking piece is a "Z"-shaped plate, the upper end of the locking piece can be detachably mounted at a preset position of the movable seat through the first disassembly assembly component, and the lower end of the locking piece plate can be detachably mounted at a preset position of the frame through the second disassembly assembly component.

10. The integrated spin-spray wafer wet processing machine according to claim 1, characterized in that: The rotary spray type wafer wet processing integrated machine also includes an automatic lifting door arranged on the frame, and the automatic lifting door includes a first driving component, a lifting component, a second driving component and a door panel component; wherein: The frame is provided with a first avoidance hole, the first avoidance hole and the opening of the processing chamber of the wafer processing cylinder are at the same height, the lifting member is escalably mounted on the frame, the fixed end of the first driving component is mounted on the frame, the driving end of the first driving component is connected to the lifting member, and the first driving component is configured to drive the lifting member to move up and down; The fixed end of the second driving member is mounted on the lifting member, the driving end of the second driving member is connected to the door panel assembly, and the second driving member is configured to drive the door panel assembly to move closer to or away from the frame; The first driving component drives the lifting member to rise to a height corresponding to the first avoidance hole, and the second driving component drives the door panel assembly to move close to the frame, so that the door panel assembly passes through the first avoidance hole and closes the opening of the processing chamber.

Images