Visual inspection equipment used after semiconductor wafer cutting

Abstract

The invention discloses visual inspection equipment after semiconductor wafer cutting, relates to the technical field of wafer visual inspection, and provides the following scheme aiming at the problems that an existing fixed detection device cannot ensure that each type of cut wafer can be completely and comprehensively detected and needs to be disassembled and adjusted by personnel, the visual inspection equipment comprises a workbench, a control machine is connected to one side of the lower end of the workbench, circulation mechanisms are connected to the two sides of the upper end of the workbench, detection mechanisms are installed on one side of the workbench at intervals, each detection mechanism comprises a positioner and a visual inspection machine, one end of the workbench is connected with a containing frame, and the other end of the workbench is connected with a sorting mechanism. According to the visual detection equipment, left-right detection is carried out through cooperation of rotation of the rotating plate and movement of the second sliding block, multi-directional comprehensive detection of semiconductor wafers is achieved, it is guaranteed that each type of cut wafers can be completely and comprehensively detected, and personnel do not need to carry out disassembly and adjustment.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer visual inspection, and in particular to a visual inspection device for semiconductor wafers after cutting. Background Art

[0002] Semiconductor wafer, this term refers to a kind of carefully prepared round sheet of semiconductor material, which constitutes the indispensable cornerstone of the manufacture of integrated circuits (IC) and other types of microelectronic devices in the modern electronics industry. In most cases, these wafers are extracted and processed from silicon (Si), an extremely common element on the earth, through a highly complex and precise process. Semiconductor wafers are not only the basic materials in the semiconductor manufacturing process, but also a very critical link in the entire electronics industry chain. Semiconductor wafers are not only the basic materials in the semiconductor manufacturing process, but also a very critical link in the entire electronics industry chain.

[0003] Quality inspection after wafer cutting is undoubtedly one of the key steps to ensure the quality and performance of the final product. However, there are many types of wafer cutting, but the post-cutting inspection devices are mostly fixed. This results in the fixed inspection device being unable to guarantee that each type of cut wafer can be fully and comprehensively inspected, and personnel are required to disassemble and adjust it to ensure the accuracy of the inspection. Summary of the invention

[0004] The present invention provides a visual inspection device for semiconductor wafers after cutting, which solves the existing problems.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a visual inspection device for semiconductor wafers after cutting, comprising a workbench, a control machine is connected to one side of the lower end of the workbench, and circulation mechanisms are connected to both sides of the upper end of the workbench, the circulation mechanisms are used to clamp and move semiconductor wafers, detection mechanisms are installed at intervals on one side of the workbench, the detection mechanism includes a locator and a visual inspection machine, the locator is used to detect the position of the semiconductor wafer in real time, the visual inspection machine is used to automatically calibrate and inspect the semiconductor wafer, one end of the workbench is connected to a placement frame, the other end of the workbench is connected to a sorting mechanism, a telescopic pushing structure is provided on one side of the sorting mechanism, and the sorting mechanism is used to automatically sort good products and defective products.

[0006] Preferably, a square groove is opened on one side of the upper end of the workbench, and the upper part of the square groove contacts the semiconductor wafer, and a circular groove is opened on the other side of the upper end of the workbench, a rotating plate is connected inside the circular groove, a first motor is connected below the rotating plate, and the first motor is connected to a mounting frame outside.

[0007] Preferably, the circulation mechanism includes a first electric slide rail, and two first electric slide rails are provided in total. The outer ends of the two first electric slide rails are connected to a first slider, one side of the first slider is connected to an F frame, the upper end of the F frame is internally connected to a first push cylinder, and one side of the first push cylinder is connected to the semiconductor wafer.

[0008] Preferably, the detection mechanism also includes a stand, which is in an L-shaped structure connected to the middle of one side of the workbench, and a positioner is connected to one side of the upper end of the stand. Two positioners are provided, and the two positioners are symmetrically connected to the upper end of the stand.

[0009] Preferably, a second electric slide rail is provided on one side of the stand, two second electric slide rails are provided, and the outer ends of the two second electric slide rails are connected to second sliders, and one end of the two second sliders is connected to the first square plate.

[0010] Preferably, a screw rod is connected between the two first square plates, and one end of the screw rod is connected to a second motor, the outer end of the screw rod is connected to a moving ring, the outer side of the moving ring is connected to a second square plate, and one end of the second square plate is connected to a visual inspection machine.

[0011] Preferably, two placement frames are provided, and the two placement frames are respectively installed on both sides of one end of the workbench, and three grooves are opened at equal intervals on the opposite sides of the two placement frames, and a plurality of round rods are horizontally connected inside the grooves, and a plurality of round rods are externally connected to balls, a semiconductor wafer is clamped and placed on one side of the ball, a second push cylinder is connected to one side of the semiconductor wafer, and a first lifting frame is connected to the lower end of the second push cylinder.

[0012] Preferably, the sorting mechanism comprises a transverse plate, a plurality of rotating rods are internally connected to the upper end of the transverse plate, a plurality of rotating rods are externally connected to a synchronous belt, and a third motor is connected to one end of one rotating rod.

[0013] Preferably, a first mounting frame is connected below both sides of the transverse plate, a third push cylinder is connected to one side of the first mounting frame, a rack is connected to one end of the third push cylinder, a stop bar is connected to one side of the rack, and the rack and the stop bar are meshed with each other.

[0014] Preferably, a storage box is connected to the outer side of one end of the transverse plate, and a buffer pad is installed inside the lower end of the storage box. A second mounting frame is installed on the side of the transverse plate opposite to the storage box, and a fourth push cylinder is connected above the second mounting frame.

[0015] The beneficial effects of the present invention are as follows: the device uses a machine vision inspection machine to accurately detect the appearance defects of semiconductor wafers, and performs left and right detection by rotating the turn plate in coordination with the movement of the second slider, thereby achieving multi-directional and comprehensive inspection of semiconductor wafers, ensuring that each type of cut wafer can be completely and comprehensively inspected without the need for personnel to disassemble and adjust, thereby improving production efficiency and ensuring the accuracy of inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention.

[0017] Figure 2 It is a schematic diagram of the circulation mechanism of the present invention.

[0018] Figure 3 It is a schematic diagram of the detection mechanism of the present invention.

[0019] Figure 4 It is a schematic diagram of a placement frame of the present invention.

[0020] Figure 5 It is a schematic diagram of the sorting mechanism of the present invention.

[0021] Numbers in the figure: 1, workbench; 101, square groove; 102, round groove; 103, rotating plate; 104, first motor; 2, control machine; 3, circulation mechanism; 301, first electric slide rail; 302, first slider; 303, F frame; 304, first push cylinder; 4, detection mechanism; 401, positioner; 402, visual inspection machine; 403, stand; 404, second electric slide rail; 405, second slider; 406, first square plate; 407, screw rod; 408, screw rod; 409, screw rod; 410, screw rod; 411, screw rod; 412, screw rod; 413, screw rod; 414, screw rod; 415, screw rod; 416, screw rod; 417, screw rod; 418, screw rod; 419, screw rod; 420, screw rod; 421, screw rod; 422, screw rod; 423, screw rod; 424, screw rod; 425, screw rod; 426, screw rod; 427, screw rod; 428, screw rod; 429, screw rod; 430, screw rod; 431, screw rod; 432, screw rod; 433, screw rod; 434, screw rod; 435, screw rod; 436, screw rod; 437, screw rod; 438, screw rod; 439, screw rod; 440, screw rod; 441, screw rod; 442, screw rod; 443, screw rod; 444, screw rod; 445, screw rod; 446, screw rod; 447, screw rod; 448, screw rod; 449, screw rod; 450, screw rod; 451, screw rod; 4 8. Second motor; 409. Moving ring; 410. Second square plate; 5. Placement frame; 501. Ball bearing; 502. Second push cylinder; 503. First lifting frame; 6. Sorting mechanism; 601. Horizontal plate; 602. Rotating rod; 603. Synchronous belt; 604. Third motor; 605. First mounting frame; 606. Third push cylinder; 607. Rack; 608. Stop bar; 609. Storage box; 610. Second mounting frame; 611. Fourth push cylinder; 7. Semiconductor wafer. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0023] Reference Figure 1-Figure 5A visual inspection device for semiconductor wafers after cutting, comprising a workbench 1, a control machine 2 is connected to one side of the lower end of the workbench 1, and a circulation mechanism 3 is connected to both sides of the upper end of the workbench 1, the circulation mechanism 3 is used to clamp and move the semiconductor wafer 7, a detection mechanism 4 is installed at intervals on one side of the workbench 1, the detection mechanism 4 includes a locator 401 and a visual inspection machine 402, the locator 401 is used to detect the position of the semiconductor wafer 7 in real time, the visual inspection machine 402 is used to automatically calibrate and inspect the semiconductor wafer 7, a placement frame 5 is connected to one end of the workbench 1, and a sorting mechanism 6 is connected to the other end of the workbench 1, a telescopic pushing structure is provided on one side of the sorting mechanism 6, and the sorting mechanism 6 is used to automatically sort good products and defective products, a square groove 101 is opened on one side of the upper end of the workbench 1, and the upper side of the square groove 101 is in contact with the semiconductor wafer 7, and the other side of the upper end of the workbench 1 is opened A circular groove 102 is provided, and a rotating plate 103 is connected inside the circular groove 102. A first motor 104 is connected below the rotating plate 103, and a mounting frame is connected outside the first motor 104. The circulation mechanism 3 includes a first electric slide rail 301. There are two first electric slide rails 301 in total. The outer ends of the two first electric slide rails 301 are connected to first sliders 302, and one side of the first slider 302 is connected to an F frame 303. The upper end of the F frame 303 is internally connected to a first push cylinder 304, and one side of the first push cylinder 304 is connected to the semiconductor wafer 7. The semiconductor wafer 7 is clamped by the first push cylinder 304, and the first electric slide rail 301 moves the first slider 302 to drive the F frame 303 to move. The first push cylinder 304 is connected to one side of the F frame 303, and the movement of the F frame 303 drives the first push cylinder 304 and the semiconductor wafer 7 on one side to move.

[0024] Reference Figure 3 The detection mechanism 4 also includes a stand 403, which is connected to the middle of one side of the workbench 1 in an L-shaped structure, and a positioner 401 is connected to one side of the upper end of the stand 403. Two positioners 401 are provided, and the two positioners 401 are symmetrically connected to the upper end of the stand 403. A second electric slide rail 404 is provided on one side of the stand 403, and two second electric slide rails 404 are provided. The outer ends of the two second electric slide rails 404 are connected to second sliders 405, and one end of the two second sliders 405 is connected to a first square plate 406, and a screw rod 407 is connected between the two first square plates 406, and the screw rod 40 7 is connected to a second motor 408 at one end, a moving ring 409 is connected to the outer end of the lead screw 407, a second square plate 410 is connected to the outer side of the moving ring 409, and a visual inspection machine 402 is connected to one end of the second square plate 410. The moving ring 409 is driven to move up and down by the rotation of the lead screw 407. The movement of the moving ring 409 drives the second square plate 410 and the visual inspection machine 402 to move up and down to automatically calibrate and detect the semiconductor wafer 7. The second slider 405 is driven to move left and right by the second electric slide rail 404. The movement of the second slider 405 drives the first square plate 406 on one side to perform left and right detection and adjustment.

[0025] Reference Figure 4 There are two placement frames 5, which are respectively installed on both sides of one end of the workbench 1. Three grooves are opened at equal intervals on the opposite side of the two placement frames 5, and a plurality of round rods are horizontally connected inside the grooves, and a plurality of round rods are externally connected with balls 501. A semiconductor wafer 7 is placed on one side of the ball 501, and a second push cylinder 502 is connected to one side of the semiconductor wafer 7. The lower end of the second push cylinder 502 is connected to a first lifting frame 503. The plurality of semiconductor wafers 7 are placed at intervals by means of the plurality of balls 501, and are pushed by the second push cylinder 502 at one end of the workbench 1 through extension and retraction, and the semiconductor wafer 7 is moved to the detection mechanism 4 area in cooperation with the circulation mechanism 3.

[0026] Reference Figure 5 The sorting mechanism 6 includes a horizontal plate 601, a plurality of rotating rods 602 are internally connected to the upper end of the horizontal plate 601, a plurality of rotating rods 602 are externally connected to a synchronous belt 603, one end of a rotating rod 602 is connected to a third motor 604, first mounting frames 605 are connected to the lower sides of the horizontal plate 601, a third push cylinder 606 is connected to one side of the first mounting frame 605, and a rack 607 is connected to one end of the third push cylinder 606, a stop bar 608 is connected to one side of the rack 607, and the rack 607 and the stop bar 608 are meshed with each other, and a storage is connected to the outer side of one end of the horizontal plate 601 Box 609, and a buffer pad is installed inside the lower end of the storage box 609, a second mounting frame 610 is installed on the side opposite to the transverse plate 601 and the storage box 609, and a fourth push cylinder 611 is connected above the second mounting frame 610, and the rotating rod 602 drives the synchronous belt 603 to transmit, the rack 607 and the blocking bar 608 are engaged with each other, and the rack 607 is telescopically moved to drive the blocking bar 608 to rotate, so as to block or release defective or good products. After blocking the defective products, the fourth push cylinder 611 is telescopically pushed to push the defective semiconductor wafer 7 to push it into the storage box 609.

[0027] Working principle: First, the control machine 2 electrically controls the flow mechanism 3, the detection mechanism 4, the sorting mechanism 6 and the second push cylinder 502 to place multiple semiconductor wafers 7 on one side of the placement frame 5 in sequence. The control machine 2 controls the second push cylinder 502 to push a semiconductor wafer 7 forward, controls the first electric slide rail 301 to move the first slider 302, and the first slider 302 drives the F frame 303 on one side and the first push cylinder 304 to move toward the semiconductor wafer 7. The first push cylinder 304 is started to push the clamped semiconductor wafer 7, and the semiconductor wafer 7 is driven to move to the detection mechanism 4 area. The positioner 401 is controlled to detect the position of the semiconductor wafer 7 in real time. After the detection is completed, the first push cylinder 304 is used, and the first motor 104 is started to rotate the rotating plate 103 to drive the semiconductor wafer 7 to rotate ninety degrees. The second motor 408 is started to rotate the screw rod 407 to drive the moving ring 409 to move up and down. The moving ring 409 moves to drive the second square plate 410 to move up and down. The second square plate 410 moves to drive the visual inspection machine 402 at one end to move up and down for automatic calibration detection. The second electric The movable slide rail 404 drives the second slider 405 to move, and the second slider 405 drives the first square plate 406 and the internal screw rod 407 to move left and right for detection, and the first motor 104 is started again to rotate the rotating plate 103, and the rotating plate 103 drives the semiconductor wafer 7 to rotate 90 degrees again, and the second electric slide rail 404 is started for the second left and right movement detection. After the detection is completed, the first push cylinder 304 is started to clamp the semiconductor wafer 7, and the first electric slide rail 301 is moved to drive the first slider 302 and the first push cylinder 304 on one side. The cylinder 304 moves to move the semiconductor wafer 7 to the synchronous belt 603. If the semiconductor wafer 7 is a good product, the third push cylinder 606 is started to telescope the moving rack 607. The rack 607 rotates to drive the blocking bar 608 to be placed vertically. The third motor 604 is started to rotate the rotating rod 602 to move the semiconductor wafer 7 on the synchronous belt 603. If the semiconductor wafer 7 is a defective product, the rack 607 rotates to drive the blocking bar 608 to be placed horizontally to block the semiconductor wafer 7. At the same time, the fourth push cylinder 611 is telescoped to push it to the storage box 609.

[0028] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A visual inspection device for semiconductor wafers after dicing, comprising a workbench (1), characterized in that: A control machine (2) is connected to one side of the lower end of the workbench (1), and a circulation mechanism (3) is connected to both sides of the upper end of the workbench (1). The circulation mechanism (3) is used to clamp and move the semiconductor wafer (7). A detection mechanism (4) is installed at intervals on one side of the workbench (1). The detection mechanism (4) includes a locator (401) and a visual inspection machine (402). The locator (401) is used to detect the position of the semiconductor wafer (7) in real time. The visual inspection machine (402) is used to automatically calibrate and inspect the semiconductor wafer (7). A placement frame (5) is connected to one end of the workbench (1), and a sorting mechanism (6) is connected to the other end of the workbench (1). A telescopic material pushing structure is provided on one side of the sorting mechanism (6). The sorting mechanism (6) is used to automatically sort good products and defective products.

2. The visual inspection device for semiconductor wafer after dicing according to claim 1, characterized in that: A square groove (101) is provided on one side of the upper end of the workbench (1), and the upper part of the square groove (101) is in contact with the semiconductor wafer (7), and a circular groove (102) is provided on the other side of the upper end of the workbench (1), a rotating plate (103) is connected inside the circular groove (102), a first motor (104) is connected below the rotating plate (103), and a mounting frame is connected outside the first motor (104).

3. The visual inspection device for semiconductor wafer after dicing according to claim 1, characterized in that: The circulation mechanism (3) comprises a first electric slide rail (301), wherein two first electric slide rails (301) are provided, and the outer ends of the two first electric slide rails (301) are connected to a first slider (302), one side of the first slider (302) is connected to an F frame (303), the upper end of the F frame (303) is internally connected to a first push cylinder (304), and one side of the first push cylinder (304) is connected to a semiconductor wafer (7).

4. The visual inspection device for semiconductor wafer after dicing according to claim 1, characterized in that: The detection mechanism (4) further comprises a stand (403), wherein the stand (403) is in an L-shaped structure and connected to the middle of one side of the workbench (1), and a positioner (401) is connected to one side of the upper end of the stand (403), and two positioners (401) are provided, and the two positioners (401) are symmetrically connected to the upper end of the stand (403).

5. The visual inspection device for semiconductor wafer after dicing according to claim 4, characterized in that: A second electric slide rail (404) is provided on one side of the stand (403), two second electric slide rails (404) are provided, and the outer ends of the two second electric slide rails (404) are connected to second sliders (405), and one end of the two second sliders (405) is connected to a first square plate (406).

6. The visual inspection device for semiconductor wafer after dicing according to claim 5, characterized in that: A screw rod (407) is connected between the two first square plates (406), and one end of the screw rod (407) is connected to a second motor (408), the outer end of the screw rod (407) is connected to a moving ring (409), the outer side of the moving ring (409) is connected to a second square plate (410), and one end of the second square plate (410) is connected to a visual inspection machine (402).

7. The visual inspection device for semiconductor wafer after dicing according to claim 1, characterized in that There are two placement frames (5), and the two placement frames (5) are respectively installed on both sides of one end of the workbench (1). Three grooves are opened at equal intervals on the opposite side of the two placement frames (5), and a plurality of round rods are horizontally connected inside the grooves, and a plurality of round rods are externally connected to balls (501). A semiconductor wafer (7) is placed on one side of the balls (501), and a second push cylinder (502) is connected to one side of the semiconductor wafer (7), and a first lifting frame (503) is connected to the lower end of the second push cylinder (502).

8. The visual inspection device for semiconductor wafer after dicing according to claim 1, characterized in that: The sorting mechanism (6) comprises a transverse plate (601), a plurality of rotating rods (602) are internally connected to the upper end of the transverse plate (601), a plurality of rotating rods (602) are externally connected to a synchronous belt (603), and one end of one rotating rod (602) is connected to a third motor (604).

9. The visual inspection device for semiconductor wafer after dicing according to claim 8, characterized in that: A first mounting frame (605) is connected below both sides of the transverse plate (601), one side of the first mounting frame (605) is connected to a third push cylinder (606), one end of the third push cylinder (606) is connected to a rack (607), one side of the rack (607) is connected to a stop bar (608), and the rack (607) and the stop bar (608) are meshed with each other.

10. The visual inspection device for semiconductor wafer after dicing according to claim 8, characterized in that: A storage box (609) is connected to the outside of one end of the transverse plate (601), and a buffer pad is installed inside the lower end of the storage box (609). A second mounting frame (610) is installed on the side of the transverse plate (601) opposite to the storage box (609), and a fourth push cylinder (611) is connected above the second mounting frame (610).

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