Laser light irradiation device and alignment adjustment method

Abstract

The invention provides a laser light irradiation device and an alignment adjustment method, which further improve the accuracy of the irradiation position of laser light. A laser light irradiation device includes: a laser light source that emits laser light; a substrate stage on which the mounting substrate irradiated with the laser light is placed; a mask disposed between the laser light source and the substrate stage and separating the laser light through the plurality of openings; a microlens array which is provided at the rear stage of the mask and which condenses the laser light that has passed through each of the plurality of openings by means of a plurality of microlenses; a first camera that captures an image of the illumination light that has passed through a first mark opening provided in the mask and has been condensed by a microlens provided in the microlens array; and a second camera that photographs a second mark provided on the microlens array, and the laser light irradiation device adjusts the planar position of the mask on the basis of the photographing result of the illumination light, and adjusts the planar positions of the mask and the microlens array on the basis of the photographing result of the second mark.

Description

Technical Field

[0001] The invention relates to a laser light irradiation device and an alignment adjustment method. Background Art

[0002] In the manufacturing process of a light emitting diode (LED) element including a compound semiconductor, a laser lift-off process is known in which the LED element formed on one surface of a substrate is irradiated with laser light from the other surface of the substrate to thereby lift off the LED element from the substrate.

[0003] For example, the following patent document 1 discloses a laser lift-off device that can lift off chip components from a growth substrate by sequentially irradiating a growth substrate on one side of which chip components are formed in a matrix at a predetermined arrangement pitch with a laser beam. In the laser lift-off device disclosed in patent document 1, a laser beam passing through a photomask is focused to the same degree as the outer diameter of the chip components by using microlenses arranged in an array, thereby irradiating the growth substrate with the laser beam.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2022-147017 Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] Here, when laser light emitted from a laser light source is separated into a plurality of laser lights by a mask and each of the separated laser lights is condensed by an array of microlenses, alignment of the mask, the microlens array, and the irradiation position becomes important.

[0009] However, the method of adjusting the alignment between the mask and the microlens array and the irradiation position has not been sufficiently studied in Patent Document 1. If these alignments are not sufficiently adjusted, the accuracy of the irradiation position of the laser light decreases.

[0010] Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a novel and improved laser light irradiation device and alignment adjustment method capable of further improving the accuracy of the irradiation position of the laser light.

[0011] [Technical means to solve the problem]

[0012] In order to solve the above-mentioned problem, according to a certain aspect of the present invention, there is provided a laser light irradiation device, which includes: a light source unit, including a laser light source for emitting laser light and an illumination light source for emitting illumination light; a substrate carrier, on which a mounting substrate irradiated with the laser light is mounted; a mask, which is arranged between the light source unit and the substrate carrier, and separates the laser light according to the plurality of openings through a plurality of openings; a microlens array, which is arranged at the rear stage of the mask between the light source unit and the substrate carrier, and which uses a plurality of microlenses to focus the laser light respectively passing through the plurality of openings onto the mounting substrate; and a first camera, which is arranged At a position opposite to the illumination light source, photographing the illumination light emitted from the illumination light source and passing through a first mark opening provided in the mask and focused by a microlens provided in the microlens array; a second camera, provided at a position opposite to the second mark, photographing the second mark provided in the microlens array; and an alignment adjustment unit, adjusting the planar position of the mask based on the photographing result of the illumination light obtained by the first camera, and adjusting the planar positions of the mask and the microlens array by an equal amount based on the photographing result of the second mark obtained by the second camera.

[0013] In addition, in order to solve the above-mentioned problem, according to another aspect of the present invention, an alignment adjustment method can be provided, which is an alignment adjustment method for a substrate carrier, a mask and a microlens array, wherein the substrate carrier carries a mounting substrate irradiated with the laser light emitted from a laser light source contained in a light source unit, the mask is arranged between the light source unit and the substrate carrier in a plane position-adjustable manner, and the laser light is separated according to the multiple openings through a plurality of openings, the microlens array is arranged at a subsequent stage of the mask between the light source unit and the substrate carrier in a plane position-adjustable manner, and the laser light respectively passing through the multiple openings is focused onto the mounting substrate through a plurality of microlenses, and the alignment adjustment The method includes: a step of photographing, using a first camera disposed at a position corresponding to the illumination light source, the illumination light emitted from the illumination light source contained in the light source section and passing through a first mark opening disposed in the mask and focused by a microlens disposed in the microlens array; a step of adjusting the planar position of the mask based on the photographing result of the illumination light obtained by the first camera; a step of photographing, using a second camera disposed at a position corresponding to the second mark, a second mark disposed in the microlens array; and a step of adjusting the planar positions of the mask and the microlens array by equal amounts based on the photographing result of the second mark obtained by the second camera.

[0014] [Effects of the Invention]

[0015] As described above, according to the present invention, the accuracy of the irradiation position of the laser light can be further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a block diagram showing a schematic configuration of a laser light irradiation device according to one embodiment of the present invention.

[0017] Figure 2 It is a schematic stereoscopic diagram illustrating the detailed structure of a laser light source, a mask, a microlens array, and a substrate carrier.

[0018] Figure 3 It is a schematic perspective view for explaining the detailed structure of the mounting substrate.

[0019] Figure 4 This is a flowchart showing the flow of the alignment adjustment operation performed using the laser light irradiation device.

[0020] Figure 5 It is a schematic cross-sectional view showing the positional relationship between the first mark opening, the second mark, the third mark, and the fourth mark.

[0021] [Explanation of Symbols]

[0022] 1: Laser light irradiation device

[0023] 110: Light source

[0024] 111: Laser light source

[0025] 112: Lighting source

[0026] 120: Mask

[0027] 121: Opening

[0028] 130: Microlens Array

[0029] 131, 131A: Microlens

[0030] 140: Substrate carrier

[0031] 150: Photography Department

[0032] 151: The First Camera

[0033] 152: Second Camera

[0034] 153: The Third Camera

[0035] 160: Alignment adjustment unit

[0036] 170: Control device

[0037] 200: Install the base plate

[0038] 210: Circuit board

[0039] 220: LED components

[0040] 230: Support substrate

[0041] L, L1: Laser light

[0042] S: Lighting

[0043] M1: First marking opening

[0044] M2: Second Mark

[0045] M3: The third mark

[0046] M4: The fourth mark DETAILED DESCRIPTION

[0047] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in this specification and the accompanying drawings, components having substantially the same functional structure are denoted by the same reference numerals, and repeated description is omitted.

[0048] <1.Outline>

[0049] First, refer to Figure 1 , a schematic structure of a laser light irradiation device according to an embodiment of the present invention is described. Figure 1 This is a block diagram showing a schematic configuration of the laser light irradiation device 1 according to the present embodiment.

[0050] like Figure 1 As shown, the laser light irradiation device 1 includes: a laser light source 111 , a mask 120 , a microlens array 130 , a substrate stage 140 , an imaging unit 150 , an alignment adjustment unit 160 , and a control device 170 .

[0051] The laser light irradiation device 1 is a device that irradiates the laser light L emitted from the laser light source 111, passed through the mask 120, and focused by the microlens array 130, onto the mounting substrate 200 mounted on the substrate stage 140. The mounting substrate 200 is a laminated body formed by bonding a supporting substrate having an LED element formed on one side and a circuit substrate in a manner that the LED element is transferred to the circuit substrate. That is, the laser light irradiation device 1 is a laser peeling device that peels the supporting substrate from the LED element by irradiating the laser light to the interface between the LED element and the supporting substrate from the other side of the supporting substrate.

[0052] The laser light source 111 is, for example, an excimer laser. The laser light L emitted from the laser light source 111 is emitted toward the mask 120. The laser light source 111 may emit the laser light L having a uniform light intensity distribution by using, for example, a homogenizer or the like.

[0053] The mask 120 is a light-shielding substrate having a plurality of openings through which the laser light L can pass. The mask 120 may also be formed by, for example, forming a light-shielding film such as chromium (Cr) on a transparent substrate such as quartz glass, and further patterning the formed light-shielding film. The mask 120 can separate the laser light L emitted from the laser light source 111 into a plurality of laser lights L1 by using a plurality of openings provided corresponding to each of the microlenses of the microlens array 130 described later.

[0054] The microlens array 130 is a transparent substrate having a plurality of microlenses arranged in a predetermined configuration on one side thereof. The microlens array 130 can use the microlenses to focus the plurality of laser lights L1 separated by the plurality of openings of the mask 120 respectively onto the mounting substrate 200. For example, the microlens array 130 can focus each of the plurality of laser lights L1 into a beam spot diameter that is approximately the same as the outer diameter of the LED element disposed on the mounting substrate 200.

[0055] The substrate stage 140 places the mounting substrate 200 on the surface facing the laser light source 111, and transports the mounted mounting substrate 200 in the direction opposite to the scanning direction of the laser light L1. The substrate stage 140 can irradiate the laser light L1 to each LED element on the mounting substrate 200 by transporting the mounted mounting substrate 200. For example, the substrate stage 140 can transport the mounting substrate 200 in the X direction and the Y direction.

[0056] The photographing unit 150 uses a camera to photograph the alignment marks provided on the mask 120 and the microlens array 130. For example, the photographing unit 150 may use a camera provided on the substrate stage 140 to photograph the alignment marks of the mask 120 and the microlens array 130 from the substrate stage 140 side.

[0057] The alignment adjustment unit 160 adjusts the plane positions of the mask 120 and the microlens array 130 based on the photographing results of the alignment marks provided on the mask 120 and the microlens array 130. For example, the alignment adjustment unit 160 may adjust the plane positions of the mask 120 and the microlens array 130 based on the deviation of the photographing positions of the alignment marks provided on the mask 120 and the microlens array 130.

[0058] In addition, the imaging unit 150 may use other cameras to image the alignment marks provided on the substrate stage 140 and the mounting substrate 200. For example, the imaging unit 150 may use a camera provided opposite to the substrate stage 140 to image the alignment marks provided on the substrate stage 140 and the mounting substrate 200.

[0059] In this case, the alignment adjustment unit 160 can adjust the planar positions of the substrate stage 140 and the mounting substrate 200 based on the photographing results of the alignment marks provided on the substrate stage 140 and the mounting substrate 200. For example, the alignment adjustment unit 160 can adjust the planar positions of the substrate stage 140 and the mounting substrate 200 based on the deviation of the photographing positions of the alignment marks provided on the substrate stage 140 and the mounting substrate 200.

[0060] The control device 170 controls the substrate stage 140 and the laser light source 111 in a linked manner. Specifically, the control device 170 controls the transport of the mounting substrate 200 by the substrate stage 140, and controls the emission timing of the laser light L of the laser light source 111. Thus, the control device 170 can control the transport of the mounting substrate 200 and the irradiation timing of the laser light L so that the laser light L emitted from the laser light source 111 is irradiated to the desired LED element of the mounting substrate 200.

[0061] In addition, the functions of the alignment adjustment unit 160 and the control device 170 can also be realized by the cooperation of software and hardware such as a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM). The CPU functions as an operation processing device, and is an operation processing device that controls the actions of the alignment adjustment unit 160 and the control device 170 according to various programs recorded in ROM or RAM. ROM is a storage device that stores programs and operation parameters used by the CPU. RAM is a storage device that temporarily stores programs used in the execution of the CPU and parameters used during the execution.

[0062] <2. Structure>

[0063] Next, refer to Figure 2 and Figure 3 , the detailed structure of the laser light irradiation device of this embodiment is described. Figure 2 It is a schematic perspective view for explaining the detailed structure of the laser light source 111 , the mask 120 , the microlens array 130 , and the substrate stage 140 . Figure 3 It is a schematic perspective view for explaining the detailed structure of the mounting substrate 200 .

[0064] like Figure 2 As shown, in the laser light irradiation device 1, the laser light source 111 included in the light source unit 110 irradiates the substrate stage 140 with laser light L. The laser light L emitted from the laser light source 111 is separated and shaped by passing through a plurality of openings 121 provided in the mask 120, and then is focused by each of the microlenses 131 provided in the microlens array 130 to reach the substrate stage 140.

[0065] The mask 120 and the microlens array 130 are provided so as to be independently movable in the X direction, the Y direction, and the rotation direction around the Z axis, for example. The laser light irradiation device 1 can adjust the alignment of the light source unit 110, the mask 120, the microlens array 130, and the substrate stage 140 by moving the mask 120 and the microlens array 130 in the X direction, the Y direction, and the rotation direction around the Z axis relative to the substrate stage 140.

[0066] The substrate stage 140 is mounted Figure 3 The mounting substrate 200 is shown. Figure 3 As shown, the mounting substrate 200 is formed by attaching a supporting substrate 230 having a plurality of LED elements 220 arranged in a matrix on one surface thereof to the circuit substrate 210 in such a manner that the LED elements 220 face the circuit substrate 210. The laser light irradiation device 1 can irradiate each of the plurality of LED elements 220 arranged on the mounting substrate 200 with laser light L, thereby peeling the plurality of LED elements 220 from the supporting substrate 230 by laser peeling.

[0067] Specifically, a laser light L having a rectangular shape extending in the Y direction is emitted from the laser light source 111. The width of the laser light L in the X direction may be equal to or greater than the arrangement pitch of the LED elements 220 arranged in the X direction (i.e., the row direction) on the mounting substrate 200. For example, the width of the laser light L in the X direction may be greater than one amount and less than two amounts of the arrangement pitch of the LED elements 220 in the X direction. In addition, the length of the laser light L in the Y direction may be a length corresponding to at least a portion of a column of the LED elements 220 arranged in the mounting substrate 200 extending in the Y direction (i.e., the column direction), for example, a length corresponding to a plurality of amounts of the LED elements 220 arranged in the Y direction. In addition, the laser light L emitted from the laser light source 111 may be transformed by a homogenizer, etc., so that the light intensity distribution of the irradiated area becomes uniform.

[0068] In addition, the light source unit 110 includes an illumination light source 112 in addition to the laser light source 111 . The illumination light sources 112 are provided on both sides of the laser light source 111 in the Y direction, and emit illumination light S toward the first mark opening M1 provided in the mask 120 .

[0069] The mask 120 is provided with a plurality of openings 121 corresponding to the arrangement pitch in the Y direction of the LED elements 220 arranged on the mounting substrate 200. Specifically, the mask 120 is provided with a plurality of openings 121 arranged in the Y direction at a pitch equal to the arrangement pitch in the Y direction of the LED elements 220 of the mounting substrate 200. In addition, the mask 120 may further include a plurality of rows of the plurality of openings 121 arranged in the Y direction at a predetermined interval. The plurality of openings 121 may be, for example, rectangular shapes corresponding to the shapes of the LED elements 220. The laser light L emitted from the laser light source 111 and incident on the mask 120 is separated into a plurality of laser lights L1 according to the plurality of openings 121 by passing through the plurality of openings 121.

[0070] In addition, the mask 120 is provided with first mark openings M1 at the outermost portions on both sides in the Y direction across the region where the plurality of openings 121 are provided. For example, the first mark openings M1 may be provided on both sides in the Y direction of the row where the plurality of openings 121 are arranged, as openings in a shape such as a cross whose center is easily determined. In order to adjust the position of the mask 120 in the rotation direction around the Z axis, the first mark openings M1 are preferably provided at at least two or more mutually different positions. The first mark openings M1 may be formed into a planar shape corresponding to the shape of the first mark openings M1 by allowing the illumination light S irradiated from the illumination light source 112 to pass therethrough.

[0071] In the microlens array 130, a plurality of microlenses 131 are provided corresponding to the arrangement pitch in the Y direction of the LED elements 220 arranged on the mounting substrate 200. Specifically, in the microlens array 130, a plurality of microlenses 131 are arranged in the Y direction at a pitch equal to the arrangement pitch in the Y direction of the LED elements 220 of the mounting substrate 200. In addition, in the microlens array 130, a plurality of columns of the plurality of microlenses 131 arranged in the Y direction may be further arranged in a plurality of columns at a predetermined interval in the X direction. The plurality of microlenses 131 may be, for example, lenses of a shape capable of forming an image of the position of the mask 120 (i.e., the image of the opening 121) on the substrate stage 140 at a desired magnification. The plurality of laser lights L1 that pass through the plurality of openings 121 and enter the microlens array 130 are respectively focused by the microlenses 131 and formed on the substrate stage 140.

[0072] In addition, in the microlens array 130, a microlens 131A is further provided at a position corresponding to the first mark opening M1 of the mask 120. Specifically, in the microlens array 130, microlenses 131A for focusing the illumination light S that has passed through the first mark opening M1 are further provided at the outermost portions on both sides in the Y direction across the region where the plurality of microlenses 131 are provided. The microlens 131A can form an image of the illumination light S formed into the shape of the first mark opening M1 on the substrate stage 140. The illumination light S formed on the substrate stage 140 is photographed by the first camera 151 provided on the substrate stage 140 and used for position adjustment of the mask 120.

[0073] Furthermore, in the microlens array 130, second marks M2 are provided on both sides in the X direction across the region where the microlenses 131 are provided. For example, the second marks M2 may be provided at the outermost portions of both sides in the X direction of the microlens array 130 as marks of a shape such as a cross that is easy to determine the center. In order to adjust the position of the microlens array 130 in the rotation direction around the Z axis, the second marks M2 are preferably provided at at least two or more different positions. The second marks M2 are used for position adjustment of the mask 120 and the microlens array 130 by photographing with the second camera 152 provided on the substrate stage 140.

[0074] In addition, the positions of the first mark opening M1 and the second mark M2 are not limited to the above, and the first mark opening M1 and the second mark M2 only need to be provided at different positions to avoid overlap.

[0075] The substrate stage 140 is provided with a first camera 151 and a second camera 152 of the imaging unit 150 so as to be able to image from the mounting surface of the mounting substrate 200. For example, the first camera 151 and the second camera 152 may be embedded in the mounting surface of the substrate stage 140 on which the mounting substrate 200 is mounted.

[0076] The first camera 151 is disposed at a position facing the first mark opening M1 and captures illumination light S emitted from the illumination light source 112 and transmitted through the first mark opening M1 and focused by the microlens 131A. The image of illumination light S captured by the first camera 151 is used for alignment of the mask 120 and the microlens array 130 .

[0077] The second camera 152 is disposed at a position facing the second mark M2 and photographs the second mark M2 disposed on the microlens array 130. The photographing result of the second mark M2 obtained by the second camera 152 is used for the alignment of the substrate stage 140, the mask 120, and the microlens array 130.

[0078] Specifically, the alignment adjustment unit 160 can adjust the plane position of the mask 120 according to the difference between the position of the imaging center of the first camera 151 and the position of the photographed illumination light S, thereby aligning the mask 120 with the microlens array 130. Thereafter, the alignment adjustment unit 160 can adjust the plane positions of the mask 120 and the microlens array 130 by an equal amount according to the difference between the position of the imaging center of the second camera 152 and the position of the photographed second mark M2, thereby aligning the substrate stage 140 with the mask 120 and the microlens array 130.

[0079] Furthermore, the third camera 153 of the imaging unit 150 is provided so as to face the mounting substrate 200 of the substrate stage 140 .

[0080] The third camera 153 captures a third mark M3 provided on the periphery of the substrate stage 140 and a fourth mark M4 provided on the mounting substrate 200 in a manner corresponding to the third mark M3. Based on the image capture results of the third mark M3 obtained by the third camera 153 and the image capture results of the fourth mark M4 obtained by the third camera 153, the substrate stage 140 and the mounting substrate 200 are aligned.

[0081] The third mark M3 is set at the corner of the outer periphery of the substrate stage 140 in the form of a mark such as a cross, which is easy to determine the center. In order to align the substrate stage 140 and the mounting substrate 200 in the rotation direction around the Z axis, the third mark M3 is preferably set at at least two or more different positions. Figure 3 As shown, the fourth mark M4 is a mark of a shape such as a cross that is easy to determine the center, and is provided at the corners of the outer periphery of the circuit substrate 210 of the mounting substrate 200 in a manner corresponding to the third mark M3 of the substrate stage 140. In order to allow the mounting direction of the mounting substrate 200 on the substrate stage 140 to be arbitrary, the fourth mark M4 can be provided at the corners of the four corners of the circuit substrate 210, respectively.

[0082] Specifically, the alignment adjustment unit 160 can adjust the placement position of the mounting substrate 200 according to the difference between the position of the third mark M3 photographed by the third camera 153 and the position of the fourth mark M4 photographed by the third camera 153, thereby aligning the substrate stage 140 with the mounting substrate 200. The placement position of the mounting substrate 200 can be adjusted, for example, by using a robot arm used when placing the mounting substrate 200 on the substrate stage 140.

[0083] According to the above structure, the laser light irradiation device 1 can automatically adjust the plane position of the mask 120 based on the shooting result of the illumination light S emitted from the illumination light source 112 and formed by the first mark opening M1 provided in the mask 120 and then focused by the microlens 131A. Furthermore, the laser light irradiation device 1 can automatically adjust the plane position of the mask 120 and the microlens array 130 based on the shooting result of the second mark M2 provided in the microlens array 130. Therefore, the laser light irradiation device 1 can adjust the alignment of the light source unit 110, the mask 120, the microlens array 130 and the substrate stage 140 with high precision based on the shooting results of the first camera 151 and the second camera 152.

[0084] Furthermore, the laser light irradiation device 1 can automatically adjust the planar position of the mounting substrate 200 based on the photographing result of the third mark M3 provided on the substrate stage 140 and the photographing result of the fourth mark M4 provided on the mounting substrate 200. Therefore, the laser light irradiation device 1 can adjust the alignment of the substrate stage 140 and the mounting substrate 200 with high precision based on the photographing result of the third camera 153.

[0085] <3. Alignment adjustment process>

[0086] Then, refer to Figure 4 and Figure 5 , the process of the alignment adjustment operation performed using the laser light irradiation device 1 is described. Figure 4 This is a flowchart showing the flow of the alignment adjustment operation performed by the laser light irradiation device 1 . Figure 5 It is a schematic cross-sectional view showing the positional relationship among the first mark opening M1 , the second mark M2 , the third mark M3 , and the fourth mark M4 .

[0087] like Figure 4 As shown, first, the illumination light S emitted from the illumination light source 112, passing through the first mark opening M1, and focused by the microlens 131A is photographed by the first camera 151 (S101). Specifically, the illumination light S emitted from the illumination light source 112 disposed on both sides of the laser light source 111 is formed by the first mark opening M1 disposed on the periphery of the mask 120, and then focused by the microlens 131A disposed on the periphery of the microlens array 130. The illumination light S focused by the microlens 131A forms an image on the substrate stage 140, and is photographed by the first camera 151 disposed on the substrate stage 140 in a manner facing the illumination light source 112.

[0088] Next, the plane position of the mask 120 is adjusted based on the result of capturing the illumination light S obtained by the first camera 151 (S103). Specifically, the alignment adjustment unit 160 adjusts the plane position of the mask 120 based on the difference between the position of the capturing center based on the first camera 151 and the position of the illumination light S captured by the first camera 151. Thus, the laser light irradiation device 1 can adjust the alignment between the mask 120 and the microlens array 130.

[0089] In addition, the second mark M2 provided on the microlens array 130 is photographed by the second camera 152 (S105). Specifically, the second mark M2 provided on the periphery of the microlens array 130 is photographed by the second camera 152 provided on the substrate stage 140 so as to face the second mark M2.

[0090] Next, the plane positions of the mask 120 and the microlens array 130 are adjusted based on the photographing result of the second mark M2 obtained by the second camera 152 (S107). Specifically, the alignment adjustment unit 160 adjusts the plane positions of the mask 120 and the microlens array 130 by an equal amount based on the difference between the position of the photographing center based on the second camera 152 and the position of the second mark M2 photographed by the second camera 152.

[0091] The alignment between the mask 120 and the microlens array 130 has been adjusted by the operation of step S103. Therefore, the alignment adjustment unit 160 can adjust the alignment between the substrate stage 140, the mask 120, and the microlens array 130 without changing the alignment between the mask 120 and the microlens array 130 by moving the plane positions of the mask 120 and the microlens array 130 by the same amount. Thus, the laser light irradiation device 1 can adjust the alignment between the substrate stage 140, the mask 120, and the microlens array 130.

[0092] Furthermore, the third camera 153 is used to photograph the third mark M3 provided on the substrate stage 140 and the fourth mark M4 provided on the mounting substrate 200 (S109). Specifically, first, the third camera 153 facing the substrate stage 140 is used to photograph the third mark M3 provided on the substrate stage 140 before the mounting substrate 200 is placed. Then, the third camera 153 is used to photograph the fourth mark M4 provided on the mounting substrate 200 after the mounting substrate 200 is placed.

[0093] Then, based on the photographing results of the third mark M3 and the fourth mark M4 obtained by the third camera 153, the plane position of the mounting substrate 200 is adjusted (S111). Specifically, the alignment adjustment unit 160 moves the mounting substrate 200 based on the positional deviation of the third mark M3 and the fourth mark M4 photographed by the third camera 153. Thus, the laser light irradiation device 1 can adjust the alignment between the substrate stage 140 and the mounting substrate 200.

[0094] According to the above operation flow, the laser light irradiation device 1 can adjust the alignment of the laser light source 111, the mask 120, the microlens array 130, the substrate stage 140, and the mounting substrate 200. Therefore, the laser light irradiation device 1 can irradiate the mounting substrate 200 with laser light L1 with higher position accuracy.

[0095] The preferred embodiments of the present invention are described in detail with reference to the accompanying drawings, but the present invention is not limited to the examples. Obviously, anyone with common knowledge in the technical field to which the present invention belongs can think of various variations or modifications within the scope of the technical ideas described in the claims, and it is understood that these also belong to the technical scope of the present invention.

Claims

1. A laser light irradiation device, characterized in that: include: The light source unit includes: a laser light source for emitting laser light, and an illumination light source for emitting illumination light; a substrate stage for mounting the mounting substrate irradiated with the laser light; A mask is disposed between the light source unit and the substrate stage, and separates the laser light according to the plurality of openings through the plurality of openings; A microlens array is provided at a subsequent stage of the mask between the light source unit and the substrate stage, and focuses the laser lights respectively passing through the plurality of openings onto the mounting substrate through a plurality of microlenses; A first camera is disposed at a position facing the illumination light source, and photographs the illumination light emitted from the illumination light source, passing through the first mark opening disposed in the mask, and focused by the microlenses disposed in the microlens array; A second camera is arranged at a position facing the second mark, and photographs the second mark arranged on the microlens array; as well as The alignment adjustment unit adjusts the planar position of the mask based on the imaging result of the illumination light obtained by the first camera, and adjusts the planar positions of the mask and the microlens array by an equal amount based on the imaging result of the second mark obtained by the second camera.

2. The laser light irradiation device according to claim 1, characterized in that: The first mark opening and the second mark opening are arranged at different positions from each other.

3. The laser light irradiation device according to claim 2, characterized in that: At least two of the first mark openings and the second mark openings are respectively provided.

4. The laser light irradiation device according to claim 3, characterized in that: At least two or more of the first marking openings are respectively arranged on opposite sides across the plurality of openings. At least two or more of the second marks are provided on opposite sides with the plurality of microlenses interposed therebetween.

5. The laser light irradiation device according to claim 1, characterized in that: A plurality of light emitting diode elements are arranged in the mounting substrate. The laser light is irradiated onto each of the plurality of light emitting diode elements.

6. The laser light irradiation device according to claim 5, characterized in that: The light emitting diode elements are arranged in a matrix. The laser light is irradiated onto at least a portion of a column of the light emitting diode elements extending along a column direction.

7. The laser light irradiation device according to claim 1, characterized in that: The first camera and the second camera are embedded in the mounting surface of the substrate stage on which the mounting substrate is mounted.

8. The laser light irradiation device according to any one of claims 1 to 7, characterized in that Also includes: The third camera, The third camera photographs a third mark provided on the substrate stage and a fourth mark provided on the mounting substrate at a position corresponding to the third mark. The alignment adjustment unit further adjusts the planar position of the mounting substrate based on the imaging results of the third mark and the fourth mark obtained by the third camera.

9. The laser light irradiation device according to claim 8, characterized in that: At least two of the third mark and the fourth mark are respectively provided.

10. An alignment adjustment method, which is an alignment adjustment method for a substrate stage, a mask and a microlens array, wherein the substrate stage carries a mounting substrate irradiated with the laser light emitted from a laser light source contained in a light source unit, the mask is arranged between the light source unit and the substrate stage in a plane position-adjustable manner, and separates the laser light according to the plurality of openings through a plurality of openings, the microlens array is arranged at a subsequent stage of the mask between the light source unit and the substrate stage in a plane position-adjustable manner, and the laser light respectively transmitted through the plurality of openings is respectively focused onto the mounting substrate through a plurality of microlenses, the alignment adjustment method is characterized in that it comprises: The step of photographing, by using a first camera disposed at a position corresponding to the illumination light source, the illumination light emitted from the illumination light source included in the light source unit, passing through a first mark opening disposed in the mask and focused by a microlens disposed in the microlens array; A step of adjusting a plane position of the mask based on a result of photographing the illumination light obtained by the first camera; The step of photographing the second mark disposed on the microlens array by using a second camera disposed at a position corresponding to the second mark; as well as The step of adjusting the plane positions of the mask and the microlens array by equal amounts based on the photographing result of the second mark obtained by the second camera.

Images