Vacuum manipulator and semiconductor process equipment
By designing a vacuum manipulator that uses vacuum adsorption force and adjusting parts, the problem that quartz manipulators are difficult to process into complex structures in semiconductor manufacturing process is solved, and the reliable adsorption and chip transfer efficiency of semiconductor workpieces are improved.
Patent Information
- Application Number
- CN202510047177.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2025-02-28
AI Technical Summary
In the semiconductor process, robots made of quartz are difficult to process into complex structures in high-temperature processes, resulting in semiconductor workpieces being easily slipped or dropped during pick-up and placement, affecting chip transfer efficiency.
A vacuum robot is designed to absorb semiconductor workpieces on quartz fingers using vacuum adsorption force, and the adjustment parts are coordinated with quartz fingers and mounting arms to achieve leveling and fixing the surface of quartz fingers to ensure the stability of the workpiece.
Through the cooperation of vacuum adsorption force and adjusting parts, the reliable adsorption and chip transfer efficiency of semiconductor workpieces are achieved, while ensuring the working reliability of the robot and preventing quartz fingers from swinging up and down.
Smart Images
Figure CN119526459A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor manufacturing technology, and in particular to a vacuum robot and semiconductor process equipment. Background Art
[0002] In the related art, in the semiconductor manufacturing process, when performing high temperature processes, a manipulator made of a material that can withstand high temperatures, such as quartz, is usually used to pick up and place wafers. Therefore, how to reasonably design the manipulator made of quartz is one of the problems that need to be solved urgently. Summary of the invention
[0003] The present disclosure provides a vacuum manipulator and semiconductor process equipment, which can utilize vacuum adsorption force to reliably adsorb semiconductor workpieces on the vacuum manipulator, thereby preventing the semiconductor workpieces from slipping or falling, and is beneficial to improving the wafer transfer efficiency.
[0004] In a first aspect, the present disclosure provides a vacuum manipulator, comprising: a quartz finger, the quartz finger having a relative adsorption end and a mounting end, the adsorption end being provided with a vacuum adsorption port; the quartz finger is also provided with a first air channel, the first air channel is connected to the vacuum adsorption port; a mounting arm, the mounting arm is provided with a first mounting hole, the mounting end of the quartz finger is inserted into the first mounting hole; the mounting arm is also provided with at least two adjustment holes, the axial direction of the adjustment hole is perpendicular to the axial direction of the first mounting hole, the adjustment hole is connected to the first mounting hole; the mounting arm is also provided with a second air channel, the second air channel is connected to the first air channel; an adjustment member, the adjustment member is respectively matched with the adjustment hole; the adjustment member is used to abut against the surface of the quartz finger to adjust the position of the surface of the quartz finger in contact with the semiconductor workpiece; a clamping assembly, the clamping assembly is connected to the mounting arm, and the clamping assembly is used to abut against the surface of the quartz finger away from the adjustment member to clamp the quartz finger.
[0005] In some embodiments, the clamping assembly includes: a clamping block, one of the surfaces of the clamping block contacts the quartz finger, the surface of the clamping block facing away from the quartz finger includes a first inclined surface section, and the first inclined surface section gradually moves away from the quartz finger in a direction away from the adsorption end of the quartz finger; a mounting groove is provided on the wall of the first mounting hole, the clamping block is accommodated in the mounting groove, and the end of the clamping block facing away from the adsorption end of the quartz finger is used to abut against the groove wall of the mounting groove; a pull rod, the pull rod has a first connecting end and a second connecting end relative to each other, the first connecting end has a second inclined surface section matching the first inclined surface section; a driving member, the driving member is connected to the second connecting end of the pull rod, the driving member is used to drive the pull rod to move in a direction away from the adsorption end of the quartz finger, and the pull rod is used to push the clamping block toward the quartz finger.
[0006] In some embodiments, the driving member includes a cylinder, an output end of the cylinder is fixedly connected to a transfer block, and the transfer block is fixedly connected to the second connecting section of the pull rod.
[0007] In some embodiments, the adapter block and the pull rod are respectively provided with a first fastening hole, and the adapter block and the pull rod are stacked along the axial direction of the first fastening hole; the vacuum manipulator also includes a first fastener, which respectively cooperates with the first fastening hole of the adapter block and the first fastening hole of the pull rod.
[0008] In some embodiments, the mounting arm is provided with a receiving groove, and the receiving groove is located on a side of the first mounting hole away from the adsorption end of the quartz finger; the driving member is installed in the receiving groove.
[0009] In some embodiments, the pull rods include at least two, and the pull rods are arranged side by side along a direction perpendicular to the axial direction of the adjustment hole and the axial direction of the first mounting hole.
[0010] In some embodiments, the vacuum manipulator also includes: a pressure plate, which is fixedly connected to the mounting arm; wherein the first connecting end of the clamping block and the pull rod is clamped between the quartz finger and the pressure plate; and the part of the pull rod close to the first connecting end is clamped between the pressure plate and the mounting arm.
[0011] In some embodiments, a plurality of sealing rings are disposed between the mounting end of the quartz finger and the wall of the first mounting hole, so that a preset gap is provided between the quartz finger and the wall of the first mounting hole.
[0012] In some embodiments, a plurality of the sealing rings are spaced apart and distributed along the axial direction of the first mounting hole.
[0013] In some embodiments, a positioning groove is provided at the mounting end of the quartz finger, and a portion of the sealing ring is located in the positioning groove.
[0014] In some embodiments, the quartz finger includes a first quartz plate and a second quartz plate stacked together, wherein the first quartz plate and the second quartz plate are connected by a plurality of quartz pins; the first air channel is provided on a surface of the first quartz plate facing the second quartz plate or on a surface of the second quartz plate facing the first quartz plate, and at least two of the quartz pins are respectively located on opposite sides of the first air channel.
[0015] In some embodiments, the first quartz plate is provided with the vacuum adsorption port, and the diameter of the vacuum adsorption port gradually increases in a direction toward the semiconductor workpiece.
[0016] In some embodiments, two ends of the quartz pin are respectively welded and fixed to the first quartz plate and the second quartz plate.
[0017] In some embodiments, a portion of the first quartz plate close to an edge and a portion of the second quartz plate close to an edge are fixed by welding.
[0018] In some embodiments, at least two of the adjustment members are spaced apart along a direction perpendicular to the axial direction of the adjustment hole and the axial direction of the first mounting hole so as to be able to adjust the position of the surface of the quartz finger in contact with the semiconductor workpiece, so that the surface of the quartz finger in contact with the semiconductor workpiece is parallel to a horizontal plane, and the horizontal plane is perpendicular to the axial direction of the adjustment hole.
[0019] In some embodiments, the mounting arm is provided with a first positioning hole, and the quartz finger is provided with a second positioning hole, the second positioning hole passes through the quartz finger, the axial directions of the second positioning hole and the first positioning hole are perpendicular to the axial direction of the first mounting hole, and the second positioning hole is arranged corresponding to the first positioning hole; the vacuum manipulator also includes a positioning pin, and the positioning pin is passed through the first positioning hole and the second positioning hole.
[0020] In a second aspect, this embodiment provides a semiconductor process equipment, including: a vacuum robot as described in any of the above items.
[0021] The vacuum manipulator provided in the embodiment of the present disclosure can utilize the vacuum adsorption force to reliably adsorb the semiconductor workpiece on the vacuum manipulator, thereby preventing the semiconductor workpiece from slipping or falling, and is beneficial to improving the wafer transfer efficiency; it can adjust the surface of the quartz finger, such as leveling; it can reliably fix the quartz finger and the mounting arm to prevent the quartz finger from swinging up and down, thereby ensuring the working reliability of the vacuum manipulator.
[0022] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure.
[0024] Figure 1 Schematic diagram of a vacuum manipulator according to an embodiment of the present disclosure Figure 1 ;
[0025] Figure 2 Schematic diagram of a vacuum manipulator according to an embodiment of the present disclosure Figure 2 ;
[0026] Figure 3 The vacuum robot according to the embodiment of the present disclosure is Figure 2 Section view at AA Figure 1 ;
[0027] Figure 4 yes Figure 3 A partial enlarged schematic diagram of part D in the middle;
[0028] Figure 5 The vacuum robot according to the embodiment of the present disclosure is Figure 2 Sectional view at the middle BB;
[0029] Figure 6 Schematic diagram of a vacuum manipulator according to an embodiment of the present disclosure Figure 3 ;
[0030] Figure 7 The vacuum robot according to the embodiment of the present disclosure is Figure 6 Sectional view at CC;
[0031] Figure 8 Schematic diagram of a vacuum manipulator according to an embodiment of the present disclosure Figure 4 .
[0032] Explanation of the reference numerals: 100-quartz finger; 100a-adsorption end; 100b-mounting end; 110-first quartz plate; 111-vacuum adsorption port; 120-second quartz plate; 121-first air channel; 130-quartz pin; 140-sealing ring; 200-mounting arm; 201-first mounting hole; 202-adjustment hole; 203-mounting groove; 204-receiving groove; 205-second air channel; 206-vacuum air inlet; 300-adjustment member; 400-clamping assembly; 410-clamping block; 411-first inclined surface section; 420-pull rod; 421-second inclined surface section; 430-driving member; 431-cylinder; 440-adapter block; 500-pressing plate; 600-locating pin. DETAILED DESCRIPTION
[0033] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description.
[0034] In the related technology, due to the limitations of the characteristics of the quartz material itself, the robot made of quartz cannot be processed and manufactured into a complex mechanical structure. Therefore, in the process of picking up and placing semiconductor workpieces such as wafers, how to ensure the safety of semiconductor workpieces is one of the urgent problems to be solved.
[0035] In order to overcome the above-mentioned problems, the present embodiment provides a vacuum manipulator, which utilizes the cooperation of the adjustment parts with the quartz fingers and the mounting arm to achieve the adjustment of the surface of the quartz fingers, such as leveling, and utilizes the vacuum adsorption force to reliably adsorb the semiconductor workpiece on the vacuum manipulator to avoid the semiconductor workpiece from slipping or falling, which is beneficial to improving the wafer transfer efficiency of the manipulator; the adjustment parts and the clamping assembly can be used to reliably fix the quartz fingers and the mounting arm to ensure the working reliability of the vacuum manipulator.
[0036] Figure 1 is a three-dimensional schematic diagram of a vacuum manipulator according to an embodiment of the present disclosure; Figure 2 is a top view of a vacuum manipulator according to an embodiment of the present disclosure; Figure 3 The vacuum robot according to the embodiment of the present disclosure is Figure 2 Section view at AA Figure 1 ; Figure 4 yes Figure 3 A partial enlarged schematic diagram of part D in the middle; Figure 5 The vacuum robot according to the embodiment of the present disclosure is Figure 2 Sectional view at the middle BB; Figure 6is a side view of a vacuum manipulator according to an embodiment of the present disclosure; Figure 7 The vacuum robot according to the embodiment of the present disclosure is Figure 6 Cross-sectional view at CC.
[0037] Please refer to Figures 1 to 7 The vacuum manipulator provided in this embodiment includes: a quartz finger 100, the quartz finger 100 has a suction end 100a and a mounting end 100b opposite to each other, the suction end 100a is provided with a vacuum suction port 111; the quartz finger 100 is also provided with a first air channel 121, the first air channel 121 is connected to the vacuum suction port 111; the mounting arm 200 is provided with a first mounting hole 201, the mounting end 100b of the quartz finger 100 is inserted into the first mounting hole 201; the mounting arm 200 is also provided with at least two adjustment holes 202, and the adjustment holes 202 are provided with a plurality of adjustment holes 203. The whole hole 202 is connected to the first mounting hole 201; the mounting arm 200 is also provided with a second air channel 205, and the second air channel 205 is connected to the first air channel 121; the adjusting member 300 is respectively penetrated in the adjusting hole 202; the adjusting member 300 is used to abut against the surface of the quartz finger 100 to adjust the position of the surface of the quartz finger 100 in contact with the semiconductor workpiece; the clamping assembly 400 is connected to the mounting arm 200, and the clamping assembly 400 is used to abut against the surface of the quartz finger 100 away from the adjusting member 300.
[0038] For ease of description, this embodiment takes the vacuum manipulator as an example in which the length direction is the longitudinal direction, the width direction is the transverse direction, and the thickness direction is the vertical direction. The transverse direction is the left-right direction, the longitudinal direction is the front-back direction, the direction perpendicular to the transverse and longitudinal directions is the vertical direction, and the vertical direction is the up-down direction.
[0039] The quartz finger 100 is used to pick up and place semiconductor workpieces. The quartz finger 100 is roughly Y-shaped. The quartz finger 100 is in the shape of a long strip, and the quartz finger 100 has a suction end 100a and a mounting end 100b spaced apart in the longitudinal direction. Exemplarily, the suction end 100a of the quartz finger 100 is provided with two gripping parts, and there is a preset angle between the two gripping parts; the preset angle can be set according to actual needs, for example, the preset angle can be 60°, 120°, or 150°, or an angle between any two of the above.
[0040] The quartz finger 100 also has a connecting arm, which is roughly in the shape of a long strip, and the specific length of the connecting arm can be set according to actual needs. The connecting arm is connected to the gripping portion, and the angles between the connecting arm and the two gripping portions are equal. The angles between the connecting arm and the gripping portion can be set according to actual needs. For example, the angles between the connecting arm and the two gripping portions are 120° respectively; optionally, the two gripping portions can be symmetrically distributed about the center point of the connecting arm along its length direction. The end of the connecting arm away from the gripping portion forms the mounting end 100b.
[0041] The two gripping parts are respectively provided with a vacuum suction port 111, and the vacuum suction port 111 is located at the end of the gripping part away from the connecting arm. The shape and size of the vacuum suction port 111 can be set according to actual needs. For example, the vacuum suction port 111 can be a circular hole. Optionally, the vacuum suction port 111 is in an inverted cone shape, that is, the aperture of the vacuum suction port 111 gradually increases in the direction toward the semiconductor workpiece, thereby facilitating the increase of the suction area of the semiconductor workpiece and improving the suction reliability. In other examples, the vacuum suction port 111 can also be a cylindrical hole.
[0042] The quartz finger 100 is provided with a first air channel 121, which is connected to the vacuum suction port 111 and is used to guide the vacuum pressure. Figure 7 As shown, illustratively, the first air channel 121 may also be Y-shaped, and the first air channel 121 includes channels in the two gripping parts and a channel in the connecting arm, the channel in the connecting arm is arranged to penetrate in the longitudinal direction, and one end of the channel in the connecting arm facing the gripping part is connected with the channels in the two gripping parts respectively. The channel in the connecting arm is arranged close to the longitudinal center plane of the quartz finger 100 parallel to the longitudinal direction. One end of the channel in the connecting arm away from the gripping part is connected with the second air channel 205 in the mounting arm 200.
[0043] Optionally, the quartz finger 100 is set as a stacked structure to facilitate processing the first air channel 121 in the quartz finger 100. In other examples, the two gripping parts in the quartz finger 100 are set as one body, and the vacuum suction port 111 and the channel for guiding the vacuum pressure are processed in the two gripping parts respectively; the channel for guiding the vacuum pressure is processed in the connecting arm; and then the gripping part and the connecting arm are fixedly connected, for example, the gripping part and the connecting arm can be fixedly connected by welding or bonding. Or,
[0044] The mounting arm 200 has a first mounting hole 201 at the end thereof facing the quartz finger 100, and the axial direction of the first mounting hole 201 is parallel to the longitudinal direction. The mounting end 100b of the quartz finger 100 is inserted into the first mounting hole 201. The mounting end 100b of the quartz finger 100 is flat, and the shape of the first mounting hole 201 matches the shape of the quartz finger 100. For example, if the end face of the mounting end 100b of the quartz finger 100 is rectangular, the cross section of the first mounting hole 201 is also rectangular. The mounting arm 200 can be made of quartz or other materials, and can be specifically set according to actual needs.
[0045] The mounting arm 200 may be machined with a channel for guiding vacuum pressure, and the shape of the channel may be set according to actual needs, for example, the channel may be straight or curved, and the channel forms a second air channel 205. The port of the second air channel 205 away from the first air channel 121 forms a vacuum air inlet 206, and the vacuum air inlet 206 is used to connect to a vacuum device.
[0046] like Figure 1 , Figure 6 and Figure 7 As shown, optionally, in order to avoid the installation arm 200 from being connected to other components in the semiconductor process equipment, the vacuum inlet 206 can be arranged near one side (e.g., the left side or the right side) of the installation arm 200. For example, the second air channel 205 can include a first channel and a second channel, the first channel can extend in the longitudinal direction, the first channel away from the port of the second channel forms the vacuum inlet 206, the first channel and the first air channel 121 are staggered at the portion of the installation end 100b; the second channel can be connected between the first channel and the first air channel 121, and the second channel can extend in the transverse direction.
[0047] In order to reduce the friction or collision between the quartz finger 100 and the mounting arm 200 , the quartz finger 100 and the first mounting hole 201 may be clearance-fitted, and the quartz finger 100 may be fixed by the adjusting member 300 and the clamping assembly 400 .
[0048] The mounting arm 200 is provided with an adjustment hole 202, the axial direction of the adjustment hole 202 is parallel to the vertical direction. The adjustment hole 202 is connected to the first mounting hole 201, so that the adjustment member 300 matched with the adjustment hole 202 can abut against the surface of the quartz finger 100.
[0049] Exemplarily, the adjusting member 300 may be a screw or a pin; when the adjusting member 300 is a screw, at least a portion of the adjusting hole 202 is provided with a thread; when the adjusting member 300 is a pin, an elastic member is provided between the pin and the hole wall of the adjusting hole 202, so that when the pin moves to the target position, the pin is kept at the target position by friction. Optionally, the surface of the adjusting member 300 contacting the quartz finger 100 may have good smoothness.
[0050] Optionally, there are multiple adjustment members 300, and at least two of the multiple adjustment members 300 are spaced apart in the lateral direction. In this way, the position of the quartz finger 100 can be adjusted by adjusting the size of the portion of at least one adjustment member 300 extending out of the adjustment hole 202, for example, adjusting the horizontal state of the quartz finger 100 so that the surface of the quartz finger 100 facing the semiconductor workpiece is parallel to the horizontal plane, or adjusting the vertical position of the quartz finger 100.
[0051] Exemplarily, there may be two adjusting members 300, and the two adjusting members 300 are respectively located on opposite sides of the longitudinal center plane of the mounting arm 200, for example, the two adjusting members 300 are symmetrically distributed about the longitudinal center plane. Alternatively, there may be three adjusting members 300, wherein two adjusting members 300 are respectively located on opposite sides of the longitudinal center plane of the mounting arm 200, and another adjusting member 300 may be disposed close to the longitudinal center plane of the mounting arm 200. Alternatively, there may be four adjusting members 300, and the four adjusting members 300 are distributed at intervals in the transverse direction, and the four adjusting members 300 are respectively located on opposite sides of the longitudinal center plane of the mounting arm 200.
[0052] Take the case where the adjustment member 300 is located above the quartz finger 100 as an example. When there is an angle between the upper surface of the quartz finger 100 and the horizontal direction, for example, when the left side of the upper surface of the quartz finger 100 is higher than the right side, the adjustment member 300 located on the left side can be adjusted to extend downward from the adjustment hole 202 under the action of external force, so that the left side of the upper surface of the quartz finger 100 is lowered until the upper surface of the quartz finger 100 is parallel to the horizontal plane; or, the adjustment member 300 located on the right side can be adjusted to extend downward from the adjustment hole 202 under the action of external force, so that the right side of the upper surface of the quartz finger 100 is raised until the upper surface of the quartz finger 100 is parallel to the horizontal plane. It can be understood that the adjustment process of the upper surface of the quartz finger 100 is not limited to this, and the adjustment of the upper surface of the quartz finger 100 can be specifically set according to actual needs.
[0053] In other embodiments, at least two adjusting members 600 may also be distributed at intervals in the longitudinal direction. The specific distribution of the adjusting members 600 is not limited thereto and may be arranged according to actual needs.
[0054] The clamping assembly 400 is located on the side of the quartz finger 100 away from the adjusting member 300. The clamping assembly 400 is connected to the mounting arm 200, and is used to abut against the surface of the quartz finger 100 away from the adjusting member 300. Exemplarily, the surface of the clamping assembly 400 in contact with the quartz finger 100 can move toward the quartz finger 100 or away from the quartz finger 100 under the action of the driving force. After the horizontal state of the upper surface of the quartz finger 100 is adjusted, the surface of the clamping assembly 400 in contact with the quartz finger 100 can move toward the quartz finger 100, and together with the adjusting member 300, the quartz finger 100 is tightly clamped to prevent the quartz finger 100 from colliding due to the up and down swinging, and to prevent the quartz finger 100 from slipping or colliding with the semiconductor workpiece due to the up and down swinging. When the horizontal state or vertical position of the upper surface of the quartz finger 100 needs to be adjusted, the surface of the clamping assembly 400 in contact with the quartz finger 100 can move away from the quartz finger 100 to provide adjustment space.
[0055] The vacuum manipulator provided in this embodiment, through the above-mentioned settings, can use the vacuum adsorption force to reliably adsorb the semiconductor workpiece on the vacuum manipulator, avoid the semiconductor workpiece from slipping or falling, etc., and help improve the wafer transfer efficiency; by using the cooperation of the adjustment member 300, the quartz finger 100, and the mounting arm 200, the surface of the quartz finger 100 can be adjusted, such as leveling; by using the adjustment member 300 and the clamping assembly 400, the quartz finger 100 can be reliably fixed and connected with the mounting arm 200, preventing the quartz finger 100 from swinging up and down, thereby ensuring the working reliability of the vacuum manipulator.
[0056] like Figures 1 to 4 As shown, in some embodiments, the clamping assembly 400 includes: a clamping block 410 , a pull rod 420 and a driving member 430 . One of the surfaces of the clamping block 410 is in contact with the quartz finger 100, and the surface of the clamping block 410 facing away from the quartz finger 100 includes a first inclined surface section 411, and along the direction away from the adsorption end 100a of the quartz finger 100, the first inclined surface section 411 gradually moves away from the quartz finger 100; the hole wall of the first mounting hole 201 is provided with a mounting groove 203, and the end of the clamping block 410 facing away from the adsorption end 100a of the quartz finger 100 is used to abut against the groove wall of the mounting groove 203; the pull rod 420 has a first connecting end and a second connecting end relative to each other, and the first connecting end has a second inclined surface section 421 that cooperates with the first inclined surface section 411; the driving member 430 is connected to the second connecting end of the pull rod 420, and the driving member 430 is used to drive the pull rod 420 to move in the direction away from the adsorption end 100a of the quartz finger 100, and the pull rod 420 is used to push the clamping block 410 toward the quartz finger 100.
[0057] The following description will be made by taking the example that the adjusting member 300 is located on the upper side of the quartz finger 100 and the clamping assembly 400 is located on the lower side of the quartz finger 100 .
[0058] The clamping block 410 may be a wedge-shaped block. The upper surface of the clamping block 410 is used to contact the quartz finger 100. When the lower surface of the quartz finger 100 is a plane, the upper surface of the clamping block 410 is also a plane. The lower surface of the clamping block 410 has a first inclined surface section 411. The lower surface of the clamping block 410 may be the first inclined surface section 411, that is, in the direction away from the adsorption end 100a of the quartz finger 100 (that is, in the direction toward Figure 4 The first slope section 411 gradually moves away from the lower surface of the quartz finger 10, and the thickness of the clamping block 410 gradually increases. Taking the plane parallel to the longitudinal direction and the vertical direction as the projection plane, the orthographic projection of the clamping block 410 on the projection plane is a triangle or a trapezoid. In other examples, a portion of the lower surface of the clamping block 410 is the first slope section 411, as long as the clamping block 410 can achieve its function.
[0059] In the horizontal direction, the clamping block 410 can be extended by a preset distance to increase the contact area between the clamping block 410 and the quartz finger 100, which is conducive to improving the installation stability of the quartz finger 100. For example, the two edges of the clamping block 410 that are spaced apart in the horizontal direction are respectively arranged flush with the corresponding edges of the quartz finger 100. For another example, the size of the clamping block 410 in the horizontal direction can also be smaller than the size of the corresponding part of the quartz finger 100 in the horizontal direction, and the clamping block 410 is arranged close to the middle of the quartz finger 100. Optionally, the longitudinal center plane of the clamping block 410 coincides with the longitudinal center plane of the quartz finger 100.
[0060] The hole wall of the first mounting hole 201 is provided with a mounting groove 203, and the mounting groove 203 is connected to the internal space of the first mounting hole 201. Exemplarily, the hole wall of the first mounting hole 201 is provided with a notch, and the notch is located at the part of the hole wall facing the adsorption end 100a of the quartz finger 100, and the notch is located at the side of the hole wall away from the adjustment member 300, so that the clamping block 410 can be accommodated in the mounting groove 203. The end of the clamping block 410 away from the adsorption end 100a of the quartz finger 100 is used to abut against the groove wall of the mounting groove 203, so that the groove wall of the mounting groove 203 can limit the clamping block 410. In addition, at least a portion of the mounting groove 203 can correspond to the adjustment hole 202.
[0061] The pull rod 420 has a first connecting end and a second connecting end opposite to each other. The first connecting end has a second inclined surface section 421 that matches the first inclined surface section 411. The upper surface of the first connecting end has a second inclined surface section 421; Figure 4The second slope section 421 gradually moves away from the quartz finger 100 .
[0062] In this way, when the pull rod 420 moves in the longitudinal direction, the clamping block 410 will move in the vertical direction accordingly. Specifically, when the pull rod 420 moves in the direction away from the adsorption end 100a of the quartz finger 100, under the cooperation of the second inclined surface section 421 and the first inclined surface section 411, the pull rod 420 applies an upward force to the clamping block 410, so that the clamping block 410 moves upward, and the upward movement of the clamping block 410 can press the quartz finger 100; in some scenarios, the upward movement of the clamping block 410 can drive the quartz finger 100 to move slightly upward to adjust the vertical position of the quartz finger 100. When the pull rod 420 moves in the direction toward the adsorption end 100a of the quartz finger 100, the force applied by the pull rod 420 to the clamping block 410 is cancelled, and the clamping block 410 moves downward under the action of its own gravity until the first inclined surface section 411 of the clamping block 410 cooperates with the second inclined surface section 421 of the pull rod 420.
[0063] Exemplarily, the pull rod 420 is in the shape of a long strip, and the pull rod 420 is extended in the longitudinal direction. Optionally, in order to improve the movement reliability of the clamping block 410, the pull rod 420 includes at least two, and each pull rod 420 is arranged side by side; that is, in the transverse direction, multiple pull rods 420 are distributed at intervals. The following will be described by taking the example of two pull rods 420. In other examples, the pull rod 420 can also extend a preset distance in the transverse direction.
[0064] In some examples, the pull rod 420 may include a rod-shaped body portion, the rod-shaped body portion is columnar, for example, the rod-shaped body portion is in the shape of a quadrangular prism; the end of the rod-shaped body portion facing the adsorption end 100a of the quartz finger 100 is connected with a protrusion, the protrusion is arranged to protrude toward the clamping block 410, the protrusion is generally columnar, for example, the protrusion is in the shape of a cylinder or a prism; the upper surface of the protrusion has a second inclined surface section 421. Through the above arrangement, there is a preset distance between the lower surface of the clamping block 410 and the upper surface of the rod-shaped body portion of the pull rod 420, which can avoid interference between the rod-shaped body portion of the pull rod 420 and the clamping block 410.
[0065] In other examples, in order to avoid interference between the pull rod 420 and the clamping block 410, the pull rod 420 is columnar, and an avoidance portion may be provided in the pull rod 420. The avoidance portion may be located on the surface of the pull rod facing the clamping block 410, and there is a preset distance between the avoidance portion and the end surface of the pull rod 420 facing the adsorption end 100a of the quartz finger 100, and the preset distance may be set according to actual needs; the part of the pull rod 420 located on the side of the avoidance portion facing the adsorption end 100a of the quartz finger 100 is provided with a second inclined surface section 421.
[0066] The driving member 430 is connected to the second connection end of the pull rod 420, and the driving member 430 is used to drive the pull rod 420 to move in a direction away from the adsorption end 100a of the quartz finger 100 (i.e. Figure 4 The pull rod 420 is used to push the clamping block 410 to move toward the quartz finger 100 so that the quartz finger 100 can be clamped together with the adjustment member 300.
[0067] Exemplarily, the driving member 430 may include a cylinder 431, and the output end (i.e., piston rod) of the cylinder 431 is fixedly connected to the second connection end of the pull rod 420. In order to facilitate the connection between the output end of the cylinder 431 and the pull rod 420 and take into account the connection reliability, the output end of the cylinder 431 is fixedly connected to the adapter block 440, and the adapter block 440 is fixedly connected to the second connection section of the pull rod 420. In other examples, the pull rod 420 may also be fixedly connected to the output end of the cylinder 431 by welding, bonding, or screwing.
[0068] The adapter block 440 may be fixedly connected to the output end of the cylinder 431. The adapter block 440 may be fixedly connected to the output end of the cylinder 431 by welding, bonding, interference fit, or fastening.
[0069] In order to ensure the synchronization of the movement of the multiple rods 420, the adapter block 440 can extend a preset distance in the lateral direction to facilitate the connection between the adapter block 440 and the multiple rods 420. The adapter block 440 can be detachably connected to the multiple rods 420 to facilitate the subsequent replacement of the rods 420 or the cylinder 431.
[0070] Optionally, the adapter block 440 and the pull rod 420 are respectively provided with a first fastening hole, and the adapter block 440 and the pull rod 420 are stacked along the axial direction of the first fastening hole, that is, vertically. The vacuum manipulator also includes a first fastener, which cooperates with the first fastening hole of the adapter block 440 and the first fastening hole of the pull rod 420. The adapter block 440 can be fastened to each pull rod 420 by at least one first fastener. The first fastener can include at least one of the following: a bolt, a screw.
[0071] Optionally, in order to improve the compactness of the structure, the mounting arm 200 is provided with a receiving groove 204, and the receiving groove 204 is located on the side of the first mounting hole 201 away from the adsorption end 100a of the quartz finger 100; the cylinder 431 is installed in the receiving groove 204. The cylinder 431 can be fastened to the mounting arm 200 through a plurality of second fasteners. The adapter block 440 connected to the output end of the cylinder 431 can also be located in the receiving groove 204, and the pull rod 420 can be located below the adapter block 440.
[0072] In other examples, the cylinder 431 may also be directly connected to the lower surface of the mounting arm 200 , and the pull rod 420 may also be located above the adapter block 440 .
[0073] In other embodiments, the driving member 430 may include a linear driving motor, and an output end of the linear driving motor is fixedly connected to the second connecting end of the pull rod 420 .
[0074] Figure 8 is a bottom view of the vacuum manipulator according to an embodiment of the present disclosure.
[0075] like Figure 1 , Figure 4 and Figure 8 As shown, in some embodiments, the vacuum manipulator further includes: a pressing plate 500, which is fixedly connected to the mounting arm 200. The first connection ends of the clamping block 410 and the pull rod 420 are clamped between the quartz finger 100 and the pressing plate 500. The portion of the pull rod 420 adjacent to the first connection end is clamped between the pressing plate 500 and the mounting arm 200.
[0076] Exemplarily, the pressure plate 500 is located below the pull rod 420 away from the clamping block 410; the pressure plate 500 can be extended in the transverse direction so that the two edges of the pressure plate 500 along the transverse interval respectively exceed the two corresponding edges of the clamping block 410; for example, the two edges of the clamping block 410 distributed along the transverse interval are respectively located on the inner sides of the two corresponding edges of the mounting arm 200, and the two edges of the pressure plate 500 distributed along the transverse interval can be flush with the two corresponding edges of the mounting arm 200.
[0077] The pressing plate 500 can be fastened to the mounting arm 200 by a plurality of third fasteners; wherein the third fasteners are staggered with the clamping block 410 and the pull rod 420; for example, at least two third fasteners are spaced apart in the transverse direction and are respectively located at the outer sides of two edges of the clamping block 410 spaced apart in the transverse direction, or are respectively located at the outer sides of two pull rods 420 that are spaced apart. In other examples, the pressing plate 500 can also be fixedly connected to the mounting arm 200 by bonding or welding.
[0078] For the portion of the pressing plate 500 corresponding to the clamping block 410, the lower surface of the quartz finger 100 can be matched with the upper surface of the clamping block 410; the first inclined surface section 411 on the lower side of the clamping block 410 can be matched with the second inclined surface section 421 on the upper side of the pull rod 420; the lower surface of the pull rod 420 can contact the lower surface of the pressing plate 500. For another portion of the pressing plate 500, the upper surface of the pressing plate 500 is matched with the lower surface of the mounting arm 200.
[0079] In this embodiment, by providing a pressure plate 500 fixedly connected to the mounting arm 200, the pressure plate 500 can press the portion of the pull rod 420 close to the first connection end against the mounting arm 200, thereby ensuring the installation stability and reliability of the pull rod 420, thereby ensuring the installation stability and reliability of the clamping block 410 located between the pull rod 420 and the quartz finger 100, and further facilitating ensuring the stability of the quartz finger 100 clamped between the clamping block 410 and the adjusting member 300, thereby preventing the quartz finger 100 from shaking up and down.
[0080] like Figure 4 As shown, in some embodiments, a plurality of sealing rings 140 are disposed between the mounting end 100b of the quartz finger 100 and the hole wall of the first mounting hole 201, which can ensure the sealing reliability between the quartz finger 100 and the mounting arm 200 and prevent the vacuum pressure from leaking from the connection between the quartz finger 100 and the mounting arm 200, and can also ensure that there is a preset gap between the quartz finger 100 and the hole wall of the first mounting hole 201 to prevent friction loss between the quartz finger 100 and the mounting arm 200.
[0081] In some examples, multiple sealing rings 140 are spaced apart along the axial direction of the first mounting hole 201. At least one sealing ring 140 among the multiple sealing rings 140 is disposed close to the end surface of the mounting end 100b of the quartz finger 100, and the multiple sealing rings 140 are evenly distributed along the longitudinal direction. For example, there may be two sealing rings 140, with a first spacing between the two sealing rings 140, a second spacing between the sealing ring 140 closer to the end surface of the mounting end 100b and the end surface of the mounting end 100b, and the first spacing and the second spacing are substantially equal. For another example, there may be three sealing rings 140, with a first spacing between every two adjacent sealing rings 140, a second spacing between the sealing ring 140 closer to the end surface of the mounting end 100b and the end surface of the mounting end 100b, and the first spacing and the second spacing are substantially equal. It can be understood that when there are more than three sealing rings 140, their arrangement may be similar to the above example.
[0082] Optionally, in order to prevent the seal ring 140 from deviating and affecting the sealing effect, the mounting end 100b of the quartz finger 100 is provided with a positioning groove, and part of the seal ring 140 is located in the positioning groove. In other examples, the positioning groove can also be provided on the hole wall of the first mounting hole 201.
[0083] In this embodiment, by providing a sealing ring 140 between the quartz finger 100 and the mounting arm 200, the sealing effect of the airway for guiding the vacuum pressure can be ensured, and the quartz finger 100 can be supported by the sealing ring 140, so that a preset gap is provided between the quartz finger 100 and the mounting arm 200, thereby avoiding friction between the quartz finger 100 and the mounting arm 200; moreover, the preset gap between the quartz finger 100 and the hole wall of the first mounting hole 201 can also reserve adjustment space for adjusting the horizontal state of the upper surface of the quartz finger 100.
[0084] like Figures 4 to 6 As shown, in some embodiments, the quartz finger 100 includes a first quartz plate 110 and a second quartz plate 120 stacked one above the other, and the first quartz plate 110 and the second quartz plate 120 are connected by a plurality of quartz pins 130. The first quartz plate 110 is provided with a vacuum suction port 111, and the vacuum suction port 111 vertically penetrates the first quartz plate 110.
[0085] Exemplarily, the first quartz plate 110 and the second quartz plate 120 are respectively roughly Y-shaped. The first quartz plate 110 and the second quartz plate 120 are respectively provided with second mounting holes, the second mounting holes of the first quartz plate 110 and the second mounting holes of the second quartz plate 120 are correspondingly distributed, and the second mounting holes of the first quartz plate 110 and the second mounting holes of the second quartz plate 120 are respectively vertically penetrated; the quartz pins 130 are penetrated in the second mounting holes of the first quartz plate 110 and the second mounting holes of the second quartz plate 120.
[0086] The first quartz plate 110 and the second quartz plate 120 are located in the gripping part and connected by a plurality of quartz pins 130; optionally, the quartz pins 130 located in the gripping part can be symmetrically distributed about the longitudinal center plane of the quartz finger 100, so as to facilitate the uniformity of the force of the first quartz plate 110 and the second quartz plate 120. The first quartz plate 110 and the second quartz plate 120 are located outside the gripping part and connected by a plurality of quartz pins 130; wherein, the quartz pins 130 located outside the gripping part can be symmetrically distributed about the longitudinal center plane of the quartz finger 100, or, in order to avoid other structures, the quartz pins 130 located outside the gripping part can also be asymmetrically distributed.
[0087] In order to ensure the connection reliability between the first quartz plate 110 and the second quartz plate 120, the quartz pin 130 may be welded or bonded to the first quartz plate 110 and the second quartz plate 120. For example, the upper end of the quartz pin 130 is welded to the first quartz plate 110, and the lower end of the quartz pin 130 is welded to the second quartz plate 120. For another example, an adhesive layer is formed between the quartz pin 130 and the hole wall of the second mounting hole.
[0088] Optionally, the first quartz plate 110 and the second quartz plate 120 near the edge can also be connected by welding or bonding, which can ensure the connection reliability of the first quartz plate 110 and the second quartz plate 120 and the sealing effect. For example, the side surface of the first quartz plate 110 and the side surface of the second quartz plate 120 are welded. For another example, an adhesive layer is formed between the lower surface of the first quartz plate 110 and the upper surface of the second quartz plate 120.
[0089] In some examples, the second quartz plate 120 is provided with a groove on the upper surface facing the first quartz plate 110, and the groove is used to form the first air channel 121. At least two quartz pins 130 are respectively located on opposite sides of the first air channel 121. In other examples, the first quartz plate 110 is provided with a groove on the lower surface facing the second quartz plate 120, and the groove is used to form the first air channel 121; or, the lower surface of the first quartz plate 110 and the upper surface of the second quartz plate 120 are respectively provided with grooves, and the grooves of the first quartz plate 110 and the grooves of the second quartz plate 120 together form the first air channel 121.
[0090] In this embodiment, the above arrangement is helpful to ensure that the first quartz plate 110 and the second quartz plate 120 are urgently attached to each other, and prevent the existence of large gaps between the first quartz plate 110 and the second quartz plate 120.
[0091] like Figure 1 , Figure 2 and Figure 7 As shown, in some embodiments, in order to further prevent the quartz finger 100 from falling off from the mounting arm 200, the mounting arm 200 is provided with a first positioning hole, and the quartz finger 100 is provided with a second positioning hole, the second positioning hole passes through the quartz finger 100, and the axial directions of the second positioning hole and the first positioning hole can be parallel to the vertical direction, and the second positioning hole is arranged corresponding to the first positioning hole; the vacuum manipulator also includes a positioning pin 600, and the positioning pin 600 is passed through the first positioning hole and the second positioning hole.
[0092] Among them, the first positioning hole can also be set through the mounting arm 200. There can be multiple first positioning holes, and at least two first positioning holes are respectively located on the outer sides of the two pull rods 420 that are separated from each other. For example, there can be two first positioning holes, and the two first positioning holes are respectively located on the outer sides of the two pull rods 420 that are separated from each other. For another example, there can be four first positioning holes, and two first positioning holes are respectively provided on the outer sides of the two pull rods 420 that are separated from each other. The number and distribution of the second positioning holes correspond to those of the first positioning holes. The number and distribution of the positioning pins 600 correspond to those of the first positioning holes. In addition, the positioning pins 600 can be located on the side of the adjustment member 300 that is away from the adsorption end 100a of the quartz finger 100. The positioning pins 600 can be located on the side of the pressure plate 500 that is away from the adsorption end 100a of the quartz finger 100.
[0093] Optionally, in order to improve the installation reliability of the positioning pin 600, the positioning pin 600 can be welded or bonded to the mounting arm 200. Alternatively, the positioning pin 600 is interference-fitted with the first positioning hole. There can be a preset gap between the positioning pin 600 and the second positioning hole to provide adjustment space for adjusting the horizontal state of the quartz finger 100.
[0094] Alternatively, the portion of the first positioning hole located above the second positioning hole is stepped. Specifically, the portion of the first positioning hole located above the second positioning hole includes: a first section and a second section, the first section is located above the second section, and the aperture of the first section is larger than the aperture of the second section; the head of the positioning pin 600 is located in the first section, and the rod of the positioning pin 600 is located in the second section, the second positioning hole, and the portion of the first positioning hole located below the second positioning hole.
[0095] The vacuum manipulator provided in this embodiment is used. During the assembly process, the first quartz plate 110 and the second quartz plate 120 are stacked, and the quartz pin 130 is inserted into the second mounting holes of the first quartz plate 110 and the second quartz plate 120; the first quartz plate 110 and the second quartz plate 120 are bonded or welded; the quartz pin 130 is bonded or welded to the first quartz plate 110 and the second quartz plate 120 to obtain the quartz finger 100; a sealing ring 140 is sleeved on the mounting end 100b of the quartz finger 100; the mounting end 100b of the quartz finger 100 is inserted into the mounting arm 100; 200, so that the sealing ring 140 is supported between the quartz finger 100 and the hole wall of the first mounting hole 201; the positioning pin 600 is inserted into the first positioning hole and the second positioning hole; the adjustment member 300 is installed in the adjustment hole 202; the clamping block 410 is placed in the mounting groove 203; the pull rod 420 is connected to the cylinder 431, and the cylinder 431 is fixed in the receiving groove 204, and the second inclined surface section 421 of the pull rod 420 corresponds to the first inclined surface section 411 of the clamping block 410; the pressure plate 500 is connected to the mounting arm 200.
[0096] When it is necessary to adjust the horizontal state of the quartz finger 100, adjust the vertical position of at least one adjusting member 300 so that the upper surface of the quartz finger 100 is parallel to the horizontal plane; control the cylinder 431 to retract, and the output end of the cylinder 431 drives the adapter block 440 and the pull rod 420 to move in a direction away from the adsorption end 100a of the quartz finger 100, thereby causing the clamping block 410 to move upward until the clamping block 410 is reliably abutted against the lower surface of the quartz finger 100, so that the quartz finger 100 is only clamped by the adjusting member 300 and the clamping block 410 to prevent the quartz finger 100 from swinging up and down.
[0097] When transferring the semiconductor workpiece, the upper surface of the quartz finger 100 is used to receive the semiconductor workpiece; the vacuum pressure provided by the vacuum device is transmitted to the vacuum suction port 111 through the vacuum air inlet 206, the second air channel 205, and the first air channel 121, thereby sucking the semiconductor workpiece; in this way, during the movement of the vacuum manipulator, the vacuum suction force can also be used to reliably suck the semiconductor workpiece to prevent the semiconductor workpiece from falling.
[0098] This embodiment also provides a semiconductor process equipment, including the vacuum manipulator in any of the above embodiments. The semiconductor process equipment also includes a vacuum device, which can be connected to the end of the mounting arm in the vacuum manipulator away from the quartz finger, so that the vacuum device can provide vacuum pressure through the vacuum inlet. Among them, the rest of the semiconductor process equipment can be conventionally set or set according to actual needs.
[0099] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0100] In the description of the present disclosure, it is necessary to understand that the terms "up", "down", "left", "right", "top", "bottom", "inside", "outside", "axial", "longitudinal", "lateral", "vertical", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.
[0101] In addition, the terms "first", "second", etc. used in the embodiments of the present disclosure are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features defined by the terms "first", "second", etc. in the embodiments of the present disclosure may explicitly or implicitly indicate that at least one of the features is included in the embodiment. In the description of the present disclosure, the word "multiple" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.
[0102] In the present disclosure, unless otherwise clearly specified or limited in the embodiments, the terms "installed", "connected", "connected" and "fixed" etc. appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or an integrated connection. It can be understood that it can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements, or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific implementation situation.
[0103] In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0104] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.
Claims
1. A vacuum manipulator, comprising: A quartz finger, wherein the quartz finger has an adsorption end and a mounting end opposite to each other, and the adsorption end is provided with a vacuum adsorption port; the quartz finger is also provided with a first air channel, and the first air channel is connected with the vacuum adsorption port; A mounting arm, wherein the mounting arm is provided with a first mounting hole, and the mounting end of the quartz finger is inserted into the first mounting hole; the mounting arm is also provided with at least two adjustment holes, the axial direction of the adjustment hole is perpendicular to the axial direction of the first mounting hole, and the adjustment hole is connected to the first mounting hole; the mounting arm is also provided with a second air channel, and the second air channel is connected to the first air channel; An adjusting member, each of which is matched with the adjusting hole; the adjusting member is used to abut against the surface of the quartz finger to adjust the position of the surface of the quartz finger in contact with the semiconductor workpiece; A clamping assembly is connected to the mounting arm and is used to abut against a surface of the quartz finger away from the adjusting member to clamp the quartz finger.
2. The vacuum robot according to claim 1, wherein: The clamping assembly comprises: A clamping block, one of the surfaces of the clamping block contacts the quartz finger, the surface of the clamping block facing away from the quartz finger comprises a first inclined surface section, and along the direction away from the adsorption end of the quartz finger, the first inclined surface section gradually moves away from the quartz finger; a mounting groove is provided on the hole wall of the first mounting hole, the clamping block is accommodated in the mounting groove, and the end of the clamping block facing away from the adsorption end of the quartz finger is used to abut against the groove wall of the mounting groove; A pull rod, the pull rod having a first connecting end and a second connecting end opposite to each other, the first connecting end having a second inclined surface section matching the first inclined surface section; A driving member is connected to the second connecting end of the pull rod, the driving member is used to drive the pull rod to move in a direction away from the adsorption end of the quartz finger, and the pull rod is used to push the clamping block to move toward the quartz finger.
3. The vacuum robot according to claim 2, wherein: The driving member comprises a cylinder, an output end of the cylinder is fixedly connected to a transfer block, and the transfer block is fixedly connected to the second connecting section of the pull rod.
4. The vacuum robot according to claim 3, wherein: The adapter block and the pull rod are respectively provided with a first fastening hole, and the adapter block and the pull rod are overlapped along the axial direction of the first fastening hole; The vacuum manipulator further includes a first fastener, which is matched with the first fastening hole of the adapter block and the first fastening hole of the pull rod respectively.
5. The vacuum robot according to claim 2, wherein: The mounting arm is provided with a receiving groove, and the receiving groove is located at a side of the first mounting hole away from the adsorption end of the quartz finger; the driving member is installed in the receiving groove; And / or, the pull rods include at least two, and the pull rods are arranged side by side along a direction perpendicular to the axial direction of the adjustment hole and the axial direction of the first mounting hole.
6. The vacuum robot according to claim 2, further comprising: A pressing plate, the pressing plate is fixedly connected to the mounting arm; Wherein, the clamping block and the first connecting end of the pull rod are clamped between the quartz finger and the pressing plate; The portion of the pull rod close to the first connecting end is sandwiched between the pressing plate and the mounting arm.
7. The vacuum robot according to claim 1, wherein: A plurality of sealing rings are disposed between the mounting end of the quartz finger and the hole wall of the first mounting hole, so that a preset gap is provided between the quartz finger and the hole wall of the first mounting hole.
8. The vacuum robot according to claim 7, wherein: Along the axial direction of the first mounting hole, a plurality of sealing rings are distributed at intervals; And / or, a positioning groove is provided at the mounting end of the quartz finger, and a portion of the sealing ring is located in the positioning groove.
9. The vacuum robot according to claim 1, wherein: The quartz finger includes a first quartz plate and a second quartz plate stacked together, wherein the first quartz plate and the second quartz plate are connected by a plurality of quartz pins; The first air channel is provided on the surface of the first quartz plate facing the second quartz plate or on the surface of the second quartz plate facing the first quartz plate, and at least two quartz pins are respectively located on two opposite sides of the first air channel.
10. The vacuum robot according to claim 9, wherein: The first quartz plate is provided with the vacuum adsorption port, and the diameter of the vacuum adsorption port gradually increases in a direction toward the semiconductor workpiece.
11. The vacuum robot according to claim 9, wherein: The two ends of the quartz pin are respectively welded and fixed to the first quartz plate and the second quartz plate; And / or, a portion of the first quartz plate close to an edge and a portion of the second quartz plate close to an edge are welded and fixed.
12. The vacuum robot according to claim 1, wherein: At least two of the adjustment members are spaced apart along a direction perpendicular to the axial direction of the adjustment hole and the axial direction of the first mounting hole, so as to be able to adjust the position of the surface of the quartz finger in contact with the semiconductor workpiece, so that the surface of the quartz finger in contact with the semiconductor workpiece is parallel to a horizontal plane, and the horizontal plane is perpendicular to the axial direction of the adjustment hole.
13. The vacuum robot according to claim 1, wherein: The mounting arm is provided with a first positioning hole, and the quartz finger is provided with a second positioning hole, the second positioning hole passes through the quartz finger, the axial directions of the second positioning hole and the first positioning hole are perpendicular to the axial direction of the first mounting hole, and the second positioning hole is provided corresponding to the first positioning hole; The vacuum manipulator further includes a positioning pin, which is inserted into the first positioning hole and the second positioning hole.
14. A semiconductor process equipment comprising: A vacuum manipulator as claimed in any one of claims 1 to 13.