Relay contact uniformity testing device and method
By designing a relay contact uniformity test device, using grating sensors to monitor the contact status in real time, directly measuring the contact uniformity, solving the problems of low accuracy and high cost in the existing test methods, and achieving efficient and accurate contact uniformity testing.
Patent Information
- Application Number
- CN202411790475.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-02-28
AI Technical Summary
The existing relay contact homogeneity test methods have low accuracy, artificial uncertainties, high cost and large errors.
A relay contact uniformity test device is designed, including a computer, main control board drive unit, program-controlled power supply and automatic position measurement equipment. The contact status is monitored in real time through the grating sensor and directly measure the contact uniformity.
Accurate measurement of the homogeneity of the relay contacts is achieved, which reduces human error, reduces testing costs, and improves the speed and accuracy of testing.
Smart Images

Figure CN119535196A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of relay detection equipment, and in particular relates to a relay contact alignment test device and method. Background Art
[0002] At present, most of the AX series relay contact alignment test devices use manual measurement, mechanical vision, indirect measurement, or calculating the travel to obtain the relay contact alignment. The mechanical vision method not only requires the camera lens to have very high pixels, but also requires photo processing software to analyze the photos. It is costly and has low accuracy. The method used for measurement by calculation is to record the time when the first contact is closed or disconnected, and the time when the last contact is closed or disconnected, and judge whether the contact alignment is within the qualified range by the time difference. The indirect measurement method uses a manipulator device to push the relay armature, collect the state of the upper and lower contacts of the relay, and calculate the alignment of the upper and lower contacts by the movement trajectory of the armature. No matter which method is used, it is an indirect measurement with large errors. Summary of the invention
[0003] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a relay contact alignment test device and method, which solves the problems of low accuracy of manual testing and human uncertainties, and saves a lot of manpower.
[0004] In order to achieve the above object, the main technical solutions adopted by the present invention include: A relay contact alignment test device comprises a host computer, a main control board drive unit, a programmable power supply, and an automatic position measurement device. The host computer communication port is connected to the programmable power supply communication port and the automatic position measurement device communication port. The power output end of the programmable power supply is connected to the coil contact of a relay to be tested. The main control board drive unit comprises a single-chip microcomputer. The main control board single-chip microcomputer drive port is connected to the control end of an IO port expansion circuit. The output end of the IO port expansion circuit is connected to a middle contact of the relay to be tested. The main control board single-chip microcomputer acquisition port is connected to the upper contact and the lower contact of the relay to be tested.
[0005] Furthermore, the automatic position measurement device is a grating sensor.
[0006] The relay contact alignment test method of the test device is adopted, and the automatic position measurement device is placed on the top of the pull rod of the relay to be tested. After the coil is powered, the status of the upper contact and the lower contact is monitored in real time through the main control board drive unit, and the contact position information is read according to the contact status, and the contact alignment is directly measured. The position information of the automatic position measurement device is read by the upper computer when the first lower contact is disconnected from the middle contact, the last lower contact is disconnected from the middle contact, the first upper contact is closed with the middle contact, and the last upper contact is closed with the middle contact. The position difference between the two contacts corresponding to the lower contact is the alignment value of the lower contact, and the position difference between the two contacts corresponding to the upper contact is the alignment value of the upper contact.
[0007] Furthermore, the relay contact alignment test method comprises the following steps: 1) Place the test contact of the automatic position measurement device on the top of the pull rod of the relay to be tested; 2) The microcontroller of the main control board drives the onboard relay to supply 5V power to each intermediate contact; 3) The host computer controls the programmable power supply to supply power to the relay coil, driving the relay to pick up; 4) The single-chip microcomputer of the main control board collects the status of each lower contact of the relay to be tested in real time; 5) When the first lower contact is disconnected from the middle contact and the last lower contact is disconnected from the middle contact, the host computer reads positions 1 and 2 on the automatic test position device; 6) The single-chip microcomputer of the main control board continues to collect the status of each upper contact of the relay to be tested; 7) When the first upper contact and the middle contact are closed, and the last upper contact and the middle contact are closed, the host computer reads positions 3 and 4 on the automatic test position device; 8) The difference between position 1 and position 2 is the alignment of the lower contact, and the difference between position 3 and position 4 is the alignment of the upper contact.
[0008] The beneficial effects of the present invention are: 1. The present invention provides a relay contact alignment test device and method, which solves the problems of low accuracy of manual testing and human uncertainties, and saves a lot of manpower; 2. The method of the present invention can save equipment procurement costs and save a lot of financial resources; 3. The method of the present invention can ensure that the contact alignment test of all types of railway signal relays can be carried out accurately, quickly and conveniently during the relay contact alignment test, thereby improving the speed of the test process and the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 It is a connection diagram of the relay contact alignment test device of the present invention; Figure 2This is the schematic diagram of the JWXC-1700 relay base; Figure 3 It is a schematic diagram of the relay contact alignment test method of the present invention. DETAILED DESCRIPTION
[0010] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation modes in conjunction with the accompanying drawings.
[0011] In order to test the contact alignment of a relay to be tested, the present invention provides a relay contact alignment testing device and method, wherein the relay contact alignment testing device, such as Figure 1 As shown, it includes a host computer, a main control board drive unit, a programmable power supply, and an automatic position measurement device. The automatic position measurement device is an existing device and can be a grating sensor. The host computer communication port is connected to the programmable power supply communication port and the automatic position measurement device communication port, the power output end of the programmable power supply is connected to the coil contact of the relay to be tested, the main control board drive unit includes a single-chip microcomputer, the main control board single-chip microcomputer drive port is connected to the control end of the IO port expansion circuit, the output end of the IO port expansion circuit is connected to the middle contact of the relay to be tested, and the main control board single-chip microcomputer acquisition port is connected to the upper contact and the lower contact of the relay to be tested, so as to complete the measurement of the contact alignment of the relay to be tested.
[0012] Taking the JWXC-1700 relay as an example, the judgment steps of the present invention are described: the JWXC-1700 relay is a relay with 8 groups of contacts, and the distribution positions are as shown in the attached figure. Figure 2 As shown, the distribution positions of the 8 groups of middle contacts on the relay are 11, 21, 31, 41, 51, 61, 71, and 81, the distribution positions of the 8 groups of upper contacts on the relay are 12, 22, 32, 42, 52, 62, 72, and 82, and the positions of the 8 groups of lower contacts are 13, 23, 33, 43, 53, 63, 73, and 83. Assume that the lower contact 13 is the first contact to be disconnected, the lower contact 73 is the last contact to be disconnected, the upper contact 12 is the first contact to be closed, and the upper contact 72 is the last contact to be closed.
[0013] First, push the contact of the automatic test position device to the top of the pull rod of the relay to be tested, which is in a stressed state; the control port of the main control board single motor controls the onboard relays K1 to K8 to output a high potential, the onboard relays K1 to K8 are sucked up, and each middle contact is introduced with a 5V potential. The main control board single-chip microcomputer acquisition port acquires the 5V potential of the lower contact corresponding to each middle contact, and the upper computer controls the programmable power supply to supply power to the relay coil to be tested. The single-chip microcomputer acquires the status of each lower contact in real time. As the voltage increases, the relay pull rod is continuously lifted, and the first lower contact 13 is disconnected from the middle contact 11. The single-chip microcomputer RD3 port cannot acquire 5V electricity. At this time, the upper computer acquires the position 1 of the automatic measurement position device, and the voltage continues to rise. The lower contact 73 is disconnected from the middle contact 71 one by one, and the last lower contact 73 is disconnected from the middle contact 71. The MCU RA2 port cannot collect 5V electricity. At this time, the host computer collects position 2 of the automatic measurement position device, and the voltage continues to rise. The first upper contact 12 and the middle contact 11 are closed, and the MCU RD1 port collects 5V electricity. At this time, the host computer collects position 3 of the automatic measurement position device, and the voltage continues to rise. Each upper contact is closed with the middle contact one after another, and the last upper contact 72 is closed with the middle contact 71. The MCU RA0 port collects 5V electricity. At this time, the host computer collects position 4 of the automatic measurement position device. The difference between position 1 and position 2 is the alignment of the lower contact, and the difference between position 3 and position 4 is the alignment of the upper contact.
[0014] like Figure 3 As shown, in order to test the contact alignment of a relay to be tested, the present invention provides a relay contact alignment testing method, using the relay contact alignment testing device proposed by the present invention, comprising the following steps: 1) Place the test contact of the automatic position measurement device on the top of the pull rod of the relay to be tested; 2) The microcontroller of the main control board drives the onboard relay to supply 5V power to each intermediate contact; 3) The host computer controls the programmable power supply to supply power to the relay coil, driving the relay to pick up; 4) The single-chip microcomputer of the main control board collects the status of each lower contact of the relay to be tested in real time; 5) When the first lower contact is disconnected from the middle contact and the last lower contact is disconnected from the middle contact, the host computer reads positions 1 and 2 on the automatic test position device; 6) The single-chip microcomputer of the main control board continues to collect the status of each upper contact of the relay to be tested; 7) When the first upper contact and the middle contact are closed, and the last upper contact and the middle contact are closed, the host computer reads positions 3 and 4 on the automatic test position device; 8) The difference between position 1 and position 2 is the alignment of the lower contact, and the difference between position 3 and position 4 is the alignment of the upper contact.
[0015] The method of the present invention adopts a method of using a contact acquisition circuit to realize the test of the contact alignment of all types of railway signal relays. The combination of the contact acquisition circuit and the automatic position measurement device is introduced into the method of the present invention, which can simply and quickly test the contact alignment.
[0016] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. Alterations, modifications, substitutions and variations of the above embodiments by a person skilled in the art are all within the scope of the present invention.
Claims
1. A relay contact alignment test device, characterized in that: It includes a host computer, a main control board drive unit, a programmable power supply, and an automatic position measurement device. The host computer communication port is connected to the programmable power supply communication port and the automatic position measurement device communication port. The power output end of the programmable power supply is connected to the coil contact of the relay to be tested. The main control board drive unit includes a single-chip microcomputer. The main control board single-chip microcomputer drive port is connected to the control end of the IO port expansion circuit. The output end of the IO port expansion circuit is connected to the middle contact of the relay to be tested. The main control board single-chip microcomputer acquisition port is connected to the upper contact and the lower contact of the relay to be tested.
2. A relay contact alignment test device according to claim 1, characterized in that: The automatic position measurement device is a grating sensor.
3. A relay contact alignment test method using the test device according to any one of claims 1 to 2, characterized in that: The automatic position measurement device is placed at the top of the pull rod of the relay to be tested. After the coil is powered, the status of the upper and lower contacts is monitored in real time through the main control board drive unit, the contact position information is read according to the contact status, and the contact alignment is directly measured. The upper computer reads the position information of the automatic position measurement device when the first lower contact is disconnected from the middle contact, the last lower contact is disconnected from the middle contact, the first upper contact is closed with the middle contact, and the last upper contact is closed with the middle contact. The position difference between the two contacts corresponding to the lower contact is the alignment value of the lower contact, and the position difference between the two contacts corresponding to the upper contact is the alignment value of the upper contact.
4. The relay contact alignment test method according to claim 3, characterized in that: The steps include: 1) Place the test contact of the automatic position measurement device on the top of the pull rod of the relay to be tested; 2) The microcontroller of the main control board drives the onboard relay to supply 5V power to each intermediate contact; 3) The host computer controls the programmable power supply to supply power to the relay coil, driving the relay to pick up; 4) The single-chip microcomputer of the main control board collects the status of each lower contact of the relay to be tested in real time; 5) When the first lower contact is disconnected from the middle contact and the last lower contact is disconnected from the middle contact, the host computer reads positions 1 and 2 on the automatic test position device; 6) The single-chip microcomputer of the main control board continues to collect the status of each upper contact of the relay to be tested; 7) When the first upper contact and the middle contact are closed, and the last upper contact and the middle contact are closed, the host computer reads positions 3 and 4 on the automatic test position device; 8) The difference between position 1 and position 2 is the alignment of the lower contact, and the difference between position 3 and position 4 is the alignment of the upper contact.