Wafer boat structure, semiconductor heat treatment equipment and control method thereof

Abstract

The invention provides a wafer boat structure, semiconductor heat treatment equipment and a control method thereof. The wafer boat structure comprises a fixed support which is provided with a fixed supporting part; the adjusting mechanism is arranged on the fixed support, the adjusting mechanism is provided with a plurality of movable auxiliary supporting parts, the adjusting mechanism has a first state and a second state, and when the adjusting mechanism is in the first state, at least two auxiliary supporting parts move to the position flush with the fixed supporting part; and when the adjusting mechanism is in the second state, only one auxiliary supporting part moves to a position flush with the fixed supporting part, so that one auxiliary supporting part and the fixed supporting part jointly support the same wafer. According to the wafer boat structure, the number of the supporting points for supporting the wafer can be changed by arranging the adjusting mechanism, and during use, the number of the supporting points of the wafer can be adjusted according to the process temperature, so that the slippage defect is avoided, meanwhile, the problems of particle scratching and pollution can be avoided, and the yield of the process is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a wafer boat structure, semiconductor heat treatment equipment and a control method thereof. Background Art

[0002] The vertical heat treatment device is a device used to perform heat treatment on wafers. Figure 1 As shown, it includes: a furnace body 1, a process chamber 2, a lifting system 3 and a wafer boat 4. The process chamber 2 is arranged in the furnace body 1, and a wafer boat 4 is arranged below the furnace body 1 and is arranged on the lifting system 3. The lifting system 3 is used to drive the wafer boat 4 to rise into the process chamber 2 or to descend from the process chamber 2 to the outside of the furnace body 1.

[0003] When heat treating the wafers, the wafer boat 4 is first lowered to the outside of the process chamber, and then the wafers to be heat treated are placed on the wafer boat 4, and then the wafer boat 4 is raised to the process chamber 2 for heat treatment. After the heat treatment is completed, the wafer boat 4 is lowered to the outside of the process chamber 2 to cool and then taken out.

[0004] There are some crystal boats such as Figure 2 and Figure 3 As shown, a three-support column structure is adopted, that is, the wafer boat 4 is provided with three support columns 5, each support column 5 is provided with a plurality of slots 6, and the slots 6 on the three support columns 5 are arranged one by one to form a support structure for supporting the wafer. When the wafer boat 4 with a three-support column structure is adopted, there are also three corresponding support points on the wafer. During the heat treatment process, the process temperature in the process chamber 2 will reach above 1150°C. Since there are only three support points on the wafer, the stress generated by the gravity at each support point is relatively large, making it easier for the wafer to produce slip dislocation defects. Summary of the invention

[0005] The present invention aims to at least solve the problem in the prior art that slip defects are easily generated in the wafer during the heat treatment process, and proposes a wafer boat structure, semiconductor heat treatment equipment and a control method thereof.

[0006] To achieve the purpose of the present invention, according to a first aspect of the present invention, a wafer boat structure is disclosed, including: a fixed bracket, having a fixed support portion; an adjustment mechanism, arranged on the fixed bracket, the adjustment mechanism having a plurality of movable auxiliary support portions, the adjustment mechanism having a first state and a second state, when the adjustment mechanism is in the first state, at least two of the auxiliary support portions move to a position flush with the fixed support portion, so that at least two of the auxiliary support portions and the fixed support portion jointly support the same wafer; when the adjustment mechanism is in the second state, only one of the auxiliary support portions moves to a position flush with the fixed support portion, so that one of the auxiliary support portions and the fixed support portion jointly support the same wafer.

[0007] Furthermore, the adjustment mechanism includes: a plurality of movable columns, the plurality of movable columns are movably arranged on the fixed bracket, the auxiliary support portion is arranged on the movable columns, and the movable columns drive the auxiliary support portion to switch between a position flush with the fixed support portion and a position staggered with the fixed support portion through movement.

[0008] Further, the moving column includes: a first moving column and a second moving column; the auxiliary support portion includes: a first auxiliary support portion and a second auxiliary support portion; the first auxiliary support portion is arranged on the first moving column, and the second auxiliary support portion is arranged on the second moving column.

[0009] Further, the fixed support part includes: a first support part and a second support part; when the adjustment mechanism is in the first state, the first auxiliary support part and the second auxiliary support part are both located at a position flush with the first support part and the second support part, so that the first support part, the second support part, the first auxiliary support part and the second auxiliary support part jointly support the same wafer; when the adjustment mechanism is in the second state, the first auxiliary support part moves to a position staggered with the first support part and the second support part, and the second auxiliary support part is located at a position flush with the first support part and the second support part, so that the first support part, the second support part and the second auxiliary support part jointly support the same wafer.

[0010] Further, the movable column also includes: a third movable column; the auxiliary support part also includes a third auxiliary support part arranged on the third movable column; the fixed support part includes: a first support part and a second support part; when the adjustment mechanism is in the first state, the first auxiliary support part and the third auxiliary support part are both located at a position flush with the first support part and the second support part, and the second auxiliary support part is at a position staggered from the first support part and the second support part, so that the first support part, the second support part, the first auxiliary support part and the third auxiliary support part jointly support the same wafer; when the adjustment mechanism is in the second state, the first auxiliary support part and the third auxiliary support part move to a position staggered from the first support part and the second support part, and the second auxiliary support part is located at a position flush with the first support part and the second support part, so that the first support part, the second support part and the second auxiliary support part jointly support the same wafer.

[0011] Further, the first supporting portion, the second supporting portion, the first auxiliary supporting portion, the second auxiliary supporting portion and the third auxiliary supporting portion are spaced apart in the circumferential direction of the wafer, and the second auxiliary supporting portion is located between the first auxiliary supporting portion and the third auxiliary supporting portion.

[0012] Furthermore, the fixed bracket includes: an end plate, there are two end plates, and the two end plates are arranged opposite to each other; a support column, there are two support columns, both ends of each support column are respectively connected to the two end plates, one of the support columns is provided with the first support portion, and the other support column is provided with the second support portion; both ends of the movable column are respectively connected to the two end plates, the movable column is movable in a direction perpendicular to the end plates, and the two support columns and the movable column are distributed at intervals along the circumference of the end plates.

[0013] Furthermore, there are multiple first support parts, and the multiple first support parts are arranged at intervals along the axial direction of the support column; the second support part, the first auxiliary support part and the second auxiliary support part are respectively arranged in one-to-one correspondence with the first support part, and a corresponding group of the first support part, the second support part, the first auxiliary support part and the second auxiliary support part are used to support the same wafer.

[0014] Furthermore, the adjustment mechanism also includes: a driving device, which is connected to the movable column and is used to drive the movable column to move so that the auxiliary support part switches between a position flush with the fixed support part and a position offset from the fixed support part.

[0015] Furthermore, in the circumferential direction of the movable column, the movable column and the fixed bracket are limitedly matched, and a screw hole is provided at the connection position between the movable column and the driving device; the driving device comprises: a motor and a screw rod arranged on the output shaft of the motor, the screw rod is arranged in the screw hole and cooperates with the screw hole thread, the motor drives the screw rod to rotate, and the rotating screw rod drives the movable column to move along its own axial direction.

[0016] According to the second aspect of the present invention, a semiconductor heat treatment equipment is also disclosed, including: a process chamber; a micro-environment chamber, arranged below the process chamber; a lifting device, arranged in the micro-environment chamber; the above-mentioned wafer boat structure, arranged on the lifting device, and the lifting device is used to drive the wafer boat structure to move between the micro-environment chamber and the process chamber.

[0017] According to the third aspect of the present invention, a control method for the above-mentioned semiconductor heat treatment equipment is also disclosed, comprising the following steps: obtaining the current ambient temperature in the process chamber; comparing the obtained current ambient temperature with the preset temperature, and controlling the state of the adjustment mechanism based on the comparison result.

[0018] During use, when the wafer is in a high temperature state (greater than 800°C), the strength of the wafer is low. Due to the combined effects of gravity stress and thermal stress, slip lattice defects are easily generated. At this time, the control adjustment mechanism is in the first state, and at least two auxiliary support parts are moved to a position flush with the fixed support part to jointly support the wafer. Since the two auxiliary support parts and the fixed support part have a total of four support points (wherein the fixed support part provides two support points), the influence of thermal stress and gravity stress on the wafer can be dispersed, thereby effectively avoiding the occurrence of slip lattice defects.

[0019] When the wafer needs to be heated from room temperature to a preset temperature or cooled from a preset temperature to room temperature, due to the large temperature change, the wafer will generate a large thermal stress, causing the wafer to deform. At this time, the control and adjustment mechanism is in the second state, that is, only one auxiliary support part moves to a position flush with the fixed support part. Since an auxiliary support part and the fixed support part have a total of three support points, it can be ensured that the three support points must be in the same plane. Therefore, it is more stable, the wafer bounces less, is not easy to be scratched, and effectively avoids wafer contamination.

[0020] It can be seen that the wafer boat structure of the present invention can change the number of supporting points for supporting the wafer by setting an adjustment mechanism. When in use, the number of wafer supporting points can be adjusted according to the process temperature, thereby avoiding slip defects. At the same time, it can also avoid particle scratches and contamination problems, thereby improving the process yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of a vertical heat treatment device in the prior art;

[0022] Figure 2 A schematic diagram of the structure of a crystal boat with three supporting columns in the prior art;

[0023] Figure 3 A top view of a wafer boat with three supporting pillars in the prior art;

[0024] Figure 4 It is a structural schematic diagram of the adjustment mechanism of the wafer boat structure in the first embodiment of the present invention in the first state;

[0025] Figure 5 It is a structural schematic diagram of the adjustment mechanism of the wafer boat structure in the first embodiment of the present invention in the second state;

[0026] Figure 6 is a cross-sectional view of a top view of a wafer boat structure according to a first embodiment of the present invention;

[0027] Figure 7 It is a structural schematic diagram of the adjustment mechanism of the wafer boat structure in the second embodiment of the present invention in the first state;

[0028] Figure 8 It is a structural schematic diagram of the adjustment mechanism of the wafer boat structure in the second embodiment of the present invention in the second state;

[0029] Fig. 9 is a cross-sectional view of a top view of a wafer boat structure according to a second embodiment of the present invention;

[0030] Fig.10 It is an orthographic projection diagram of the support part and the auxiliary support part of the wafer boat structure of the first embodiment of the present invention on the corresponding support plane;

[0031] Fig.11 for Figure 4 A partial enlarged view of part A;

[0032] Fig.12 A schematic structural diagram of a semiconductor heat treatment device according to a first embodiment of the present invention;

[0033] Fig.13 A flow chart of a control method for semiconductor heat treatment equipment according to a first embodiment of the present invention;

[0034] Fig.14 A specific flow chart of step S20 in the control method of semiconductor heat treatment equipment according to the first embodiment of the present invention;

[0035] List of reference numerals:

[0036] 10. Fixed bracket; 11. End plate; 111. Through hole; 112. Limiting groove; 12. Support column; 121. First supporting part; 122. Second supporting part; 20. Support plane; 30. Adjustment mechanism; 31. Auxiliary supporting part; 31a. First auxiliary supporting part; 31b. Second auxiliary supporting part; 31c. Third auxiliary supporting part; 32. Moving column; 321. Screw hole; 322. Limiting protrusion; 32a. First moving column; 32b. Second moving column; 32c. Third moving column; 33. Driving device; 331. Motor; 332. Screw; 40. Furnace body; 41. Process chamber; 50. Microenvironment chamber; 60. Lifting device. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solution of the present invention, the wafer boat structure, semiconductor heat treatment equipment and control method thereof provided by the present invention are described in detail below with reference to the accompanying drawings.

[0038] To achieve the purpose of the present invention, Figures 4 to 6 The first embodiment shown discloses a wafer boat structure, including: a fixing bracket 10 and an adjusting mechanism 30 .

[0039] The fixed support 10 has a fixed support part for supporting the wafer. The adjustment mechanism 30 is arranged on the fixed support 10, and the adjustment mechanism 30 has a plurality of independently movable auxiliary support parts 31, and the adjustment mechanism 30 has a first state and a second state.

[0040] In the first state of the adjustment mechanism 30, at least two auxiliary support parts 31 move to a position flush with the fixed support part, so that at least two auxiliary support parts 31 and the fixed support part jointly support the same wafer; in the second state of the adjustment mechanism 30, only one auxiliary support part 31 moves to a position flush with the fixed support part, so that one auxiliary support part 31 and the fixed support part jointly support the same wafer.

[0041] like Figure 4 As shown, in this embodiment, the fixed support portion includes: a first support portion 121 and a second support portion 122, and the first support portion 121 and the second support portion 122 are spaced apart and distributed on a support plane 20, wherein the support plane 20 refers to the plane where the lower surface of the wafer is located when the first support portion 121 and the second support portion 122 jointly support the same wafer. Figure 8 As shown, the orthographic projections of all auxiliary support portions 31 on the support plane 20 are distributed at intervals in the circumferential direction.

[0042] That is, when the adjustment mechanism 30 is in the first state, at least two auxiliary support portions 31 move to a position flush with the first support portion 121 and the second support portion 122, that is, Figure 4 The position of the supporting plane 20 in the embodiment is such that the first supporting portion 121, the second supporting portion 122 and at least two auxiliary supporting portions 31 are located on the same supporting plane 20 to jointly support the same wafer.

[0043] like Figure 5 As shown, when the adjustment mechanism 30 is in the second state, only one auxiliary support portion 31 moves to a position flush with the first support portion 121 and the second support portion 122, and the other auxiliary support portions 31 move to a position staggered from the first support portion 121 and the second support portion 122, that is, only one auxiliary support portion 31 is located Figure 5 On the support plane 20, the other auxiliary support parts 31 are separated from Figure 5 The support plane 20 in the embodiment of the present invention is configured such that the first support portion 121, the second support portion 122 and an auxiliary support portion 31 are located on the same support plane 20 to jointly support the same wafer.

[0044] During use, when the wafer is in a high temperature state (greater than 800°C), the strength of the wafer is low. Due to the combined effect of gravity stress and thermal stress, slip lattice defects are easily generated. At this time, the control and adjustment mechanism 30 is in the first state, that is, the fixed support part and at least two auxiliary support parts 31 are located on the same support plane 20 to jointly support the wafer. Since there are at least four support points (wherein the first support part 121 and the second support part 122 in the fixed support part each provide a support point), the influence of thermal stress and gravity stress on the wafer can be dispersed, thereby effectively avoiding the occurrence of slip lattice defects.

[0045] When the wafer needs to be heated from room temperature to a preset temperature or cooled from a preset temperature to room temperature, due to the large temperature change, the wafer will generate a large thermal stress, causing the wafer to deform. At this time, the control and adjustment mechanism 30 is in the second state, that is, the fixed support part and an auxiliary support part 31 are located on the same support plane 20 to jointly support the wafer. Since it is a three-point support (wherein the first support part 121 and the second support part 122 in the fixed support part each provide a support point), the three support points must be located in the same plane and can be supported on the wafer surface at the same time, making the wafer more stable, with less vibration, not easy to be scratched, and effectively avoiding wafer contamination.

[0046] It can be seen that the wafer boat structure of the present invention can change the number of supporting points for supporting the wafer by setting an adjustment mechanism 30. When in use, the number of wafer supporting points can be adjusted according to the process temperature, thereby avoiding slip defects and particle scratches and contamination problems, thereby improving the process yield.

[0047] Furthermore, the adjustment mechanism 30 includes: a movable column 32, a plurality of movable columns 32, and the plurality of movable columns 32 are movably arranged on the fixed bracket 10, the axes of all movable columns 32 are perpendicular to the supporting plane 20, the moving direction of the movable column 32 is the axis direction of the movable column 32, and each movable column 32 can move independently; an auxiliary support portion 31 is arranged on the movable column 32, and the movable column 32 drives the auxiliary support portion 31 to switch between a position flush with the fixed support portion and a position staggered with the fixed support portion through movement.

[0048] Specifically, in Figure 4 In the illustrated embodiment 1, the moving column 32 includes a first moving column 32a, a second moving column 32b and a third moving column 32c. The auxiliary support portion 31 includes a first auxiliary support portion 31a, a second auxiliary support portion 31b and a third auxiliary support portion 31c. The first auxiliary support portion 31a is arranged on the first moving column 32a, the second auxiliary support portion 31b is arranged on the second moving column 32b; and the third auxiliary support portion 31c is arranged on the third moving column 32c. It can be understood that each moving column 32 can be moved independently.

[0049] like Figure 4 As shown, in the first state of the adjustment mechanism 30, the first movable column 32a drives the first auxiliary support portion 31a to move to a position flush with the fixed support portion. Figure 4 The third movable column 32c moves the third auxiliary support portion 31c to a position flush with the fixed support portion. Figure 4 At the same time, the second movable column 32b drives the second auxiliary support portion 31b to move to a position staggered with the fixed support portion, that is, Figure 4 The first supporting part 121, the second supporting part 122, the first auxiliary supporting part 31a and the third auxiliary supporting part 31c are located at a distance below the middle supporting plane 20, so as to achieve the purpose of supporting the wafer through four supporting points.

[0050] like Figure 5 As shown, in the second state of the adjustment mechanism 30, the first movable column 32a drives the first auxiliary support portion 31a to move to a position staggered from the fixed support portion, that is, Figure 5 The third movable column 32c moves the third auxiliary supporting portion 31c to a position staggered from the fixed supporting portion, that is, Figure 5 At the same time, the second movable column 32b drives the second auxiliary supporting part 31b to move to a position flush with the fixed supporting part, that is, Figure 5 The position of the middle supporting plane 20 makes the first supporting portion 121, the second supporting portion 122 and the second auxiliary supporting portion 31b located on the same supporting plane 20, thereby achieving the purpose of supporting the wafer through three supporting points.

[0051] It should be noted that, in the present embodiment, in the first state of the adjustment mechanism 30, the second auxiliary support portion 31b is located at a position staggered from the fixed support portion, that is, it is separated from the support plane 20, but this is not restrictive. In some other embodiments not shown in the figure, in the first state of the adjustment mechanism 30, the second auxiliary support portion 31b may also be located at a position flush with the fixed support portion, that is, in the first state of the adjustment mechanism 30, the second auxiliary support portion 31b may also be located on the same support plane 20 as the first support portion 121, the second support portion 122, the first auxiliary support portion 31a and the third auxiliary support portion 31c, thereby achieving the purpose of supporting the wafer through five support points, further dispersing the influence of thermal stress and gravity stress on the wafer, and further reducing the occurrence of slip lattice defects.

[0052] It should also be noted that in the above-mentioned embodiment 1, the moving column 32 includes a first moving column 32a, a second moving column 32b and a third moving column 32c, and the auxiliary support portion 31 includes a first auxiliary support portion 31a, a second auxiliary support portion 31b and a third auxiliary support portion 31c, but this is not restrictive. Figures 7 to 9 The second embodiment shown discloses a crystal boat structure, which is basically the same as the first embodiment, except that, in this embodiment, the moving column 32 includes a first moving column 32a and a second moving column 32b, and the auxiliary support part 31 includes a first auxiliary support part 31a and a second auxiliary support part 31b; the first auxiliary support part 31a is arranged on the first moving column 32a, and the second auxiliary support part 31b is arranged on the second moving column 32b.

[0053] like Figure 7 As shown, in the first state of the adjustment mechanism 30, the first auxiliary support portion 31a and the second auxiliary support portion 31b are both located flush with the fixed support portion, that is, Figure 7 At the position of the middle support plane 20 , the first support portion 121 , the second support portion 122 , the first auxiliary support portion 31 a and the second auxiliary support portion 31 b are located on the same support plane 20 .

[0054] like Figure 8 As shown, in the second state of the adjustment mechanism 30, the first auxiliary support portion 31a moves to a position offset from the fixed support portion, that is, Figure 8 At a distance below the middle support plane 20, the second auxiliary support portion 31b is located flush with the fixed support portion, that is, Figure 8 At the position of the middle supporting plane 20 , the first supporting portion 121 , the second supporting portion 122 and the second auxiliary supporting portion 31 b are located on the same supporting plane 20 .

[0055] In the second embodiment, the switching between three supporting points and four supporting points can also be achieved through two movable columns 32, thereby avoiding slip defects, while also avoiding problems such as particle scratches and contamination, improving the process yield, and the structure is relatively simple, the modification cost is lower, and it is easier to implement.

[0056] In order to better support the wafer, Fig.10 In the first embodiment shown, the orthographic projections of the first support portion 121, the second support portion 122, the first auxiliary support portion 31a, the second auxiliary support portion 31b and the third auxiliary support portion 31c on the support plane 20 are distributed at intervals in the circumferential direction, and the second auxiliary support portion 31b is located between the first auxiliary support portion 31a and the third auxiliary support portion 31c. With this support method, the force on the wafer is more uniform and the balance is better, which can effectively prevent the wafer from bouncing and sliding, thereby improving the process yield rate.

[0057] In such Figure 4 and Figure 5 In the illustrated embodiment 1, the fixed bracket 10 includes: an end plate 11 and two support columns 12. There are two end plates 11, and the two end plates 11 are arranged opposite to each other. The two ends of each support column 12 are respectively connected to the two end plates 11, one of the support columns 12 is provided with a first support portion 121, and the other support column 12 is provided with a second support portion 122; the two ends of the movable column 32 are respectively connected to the two end plates 11, and the movable column 32 is movable in a direction perpendicular to the end plates 11, and the two support columns 12 and the movable column 32 are spaced apart along the circumference of the end plates 11.

[0058] like Figure 4 As shown, the adjustment mechanism 30 also includes a driving device 33, which is drivingly connected to the movable column 32 and is used to drive the movable column 32 to move in a direction perpendicular to the support plane 20, so that the auxiliary support portion 31 switches between a position flush with the fixed support portion and a position offset from the fixed support portion.

[0059] It should be noted that, in the present embodiment, there are three driving devices 33 , and the first moving column 32 a , the second moving column 32 b and the third moving column 32 c are respectively connected to a driving device 33 , so as to realize independent movement of the moving columns 32 .

[0060] like Figure 4 As shown, in the circumferential direction of the movable column 32, the movable column 32 and the fixed bracket 10 are limitedly matched, that is, each movable column 32 cannot rotate along its own axis relative to the fixed bracket 10, and can only move along its own axis. Fig.11 As shown, the first end of the movable column 32 is located in the through hole 111 opened on the end plate 11, and a limiting groove 112 is arranged on the inner wall of the through hole 111. The limiting groove 112 extends to both ends of the through hole 111 along the axial direction of the through hole 111 (that is, the axial direction of the movable column 32), and a limiting protrusion 322 cooperating with the limiting groove 112 is arranged on the outer wall of the movable column 32 near the first end. When the first end of the movable column 32 is located in the through hole 111, the limiting protrusion 322 is located in the limiting groove 112, and the limiting protrusion 322 can move along the limiting groove 112, and at the same time, the limiting groove 112 and the limiting protrusion 322 restrict the movable column 32 from rotating along its own axis.

[0061] like Fig.11As shown, a screw hole 321 is provided at the connection position between the moving column 32 and the driving device 33; the driving device 33 includes: a motor 331 and a screw rod 332 provided on the output shaft of the motor 331, the screw rod 332 is provided in the screw hole 321 and is threadedly matched with the screw hole 321, the motor 331 drives the screw rod 332 to rotate, and the rotating screw rod 332 drives the moving column 32 to move along its own axis direction. That is to say, when in use, the motor 331 can drive the screw rod 332 to rotate, and the rotating screw rod 332 can push the moving column 32 to move along its own axis direction by matching with the thread in the screw hole 321, so that the moving column 32 drives the auxiliary support part 31 to move between a position flush with the fixed support part and a position staggered with the fixed support part.

[0062] like Figure 4 and Figure 5 As shown, there are multiple groups of fixed support parts, which are arranged on the fixed bracket 10 at intervals along the direction perpendicular to the support plane 20, and there are multiple groups of auxiliary support parts 31, which are arranged at intervals along the axis of the moving column 32, and the fixed support parts correspond to the auxiliary support parts 31 one by one. That is to say, among the two support columns 12, one support column 12 is provided with multiple first support parts 121 at intervals along its own axis direction, and the other support column 12 is provided with multiple second support parts 122 at intervals along its own axis. The corresponding first moving column 32a is provided with multiple first auxiliary support parts 31a at intervals along its own axis, the second moving column 32b is provided with multiple second auxiliary support parts 31b at intervals along its own axis, and the third moving column 32c is provided with multiple third auxiliary support parts 31c at intervals along its own axis. Moreover, the first support part 121, the second support part 122, the first auxiliary support part 31a, the second auxiliary support part 31b, and the third auxiliary support part 31c are provided in a one-to-one correspondence. The corresponding first supporting parts 121, second supporting parts 122, first auxiliary supporting parts 31a, second auxiliary supporting parts 31b, and third auxiliary supporting parts 31c are used to support the same wafer. All the first supporting parts 121, second supporting parts 122, first auxiliary supporting parts 31a, second auxiliary supporting parts 31b, and third auxiliary supporting parts 31c are used to support multiple wafers arranged at intervals.

[0063] It is understandable that if Figure 4As shown, in the first state of the adjustment mechanism 30, the first movable column 32a drives all the first auxiliary supporting parts 31a to move to a position flush with their respective corresponding fixed supporting parts by moving, and the third movable column 32c drives all the third auxiliary supporting parts 31c to move to a position flush with their respective corresponding fixed supporting parts by moving. At the same time, the second movable column 32b drives all the second auxiliary supporting parts 31b to a position staggered with the corresponding fixed supporting parts by moving, so that all the corresponding first supporting parts 121, second supporting parts 122, first auxiliary supporting parts 31a and third auxiliary supporting parts 31c are located on the same supporting plane 20, thereby adjusting the supporting mode of all wafers to four supporting points.

[0064] Similarly, if Figure 5 As shown, in the second state of the adjustment mechanism 30, the first movable column 32a drives all the first auxiliary support parts 31a to move to the staggered positions of the corresponding fixed support parts by moving, and the third movable column 32c drives the third auxiliary support parts 31c to move to the staggered positions of their respective corresponding fixed support parts by moving. At the same time, the second movable column 32b drives the second auxiliary support parts 31b to move to the positions flush with their respective corresponding fixed support parts by moving, so that the corresponding first support parts 121, second support parts 122 and second auxiliary support parts 31b are located in the same support plane 20, thereby adjusting the support mode of all wafers to three support point support.

[0065] It can be understood that, in the above embodiment, the supporting portion and the auxiliary supporting portion 31 are slots for placing wafers.

[0066] In such Fig.12 In the illustrated embodiment 1, a semiconductor heat treatment device is also disclosed, including: a process chamber 41, a micro-environment chamber 50, a lifting device 60 and the above-mentioned wafer boat structure.

[0067] Among them, a furnace body 40 is arranged outside the process chamber 41; the micro-environment chamber 50 is located below the process chamber 41 and is connected with the process chamber 41; the lifting device 60 is arranged in the micro-environment chamber 50; the crystal boat structure is arranged on the lifting device 60, and the lifting device 60 moves the crystal boat structure between the process chamber 41 and the micro-environment chamber 50 by lifting.

[0068] In this embodiment, the semiconductor heat treatment equipment may be a vertical heat treatment device, but this is not restrictive. In some other embodiments not shown in the figures, other heat treatment equipment may also be used.

[0069] The semiconductor heat treatment equipment of the present invention can change the number of supporting points for supporting the wafer by setting an adjustment mechanism 30. When in use, the number of wafer supporting points can be adjusted according to the process temperature, thereby avoiding the generation of slip defects, while also avoiding particle scratches and contamination problems, thereby improving the process yield.

[0070] like Fig.13 As shown, the present invention also discloses a control method for the above-mentioned semiconductor heat treatment equipment, comprising the following steps:

[0071] S10: Acquire the current ambient temperature T1 in the process chamber 41;

[0072] S20: Compare the acquired current ambient temperature T1 with the preset temperature T2, and control the state of the regulating mechanism 30 according to the comparison result.

[0073] Furthermore, if Fig.14 As shown, step S20 specifically includes the following steps:

[0074] S21: If T1>T2, the regulating mechanism 30 is controlled to be in the first state;

[0075] S22: If T1≤T2, the regulating mechanism 30 is controlled to be in the second state, wherein the value range of T1 is 600-800°C.

[0076] During use, when T1>T2, and the wafer boat 4 carrying the wafer is located in the process chamber 41, that is, the temperature of the wafer is higher than the preset temperature (greater than 600-800°C), the high temperature will cause the strength of the wafer to decrease. Due to the combined effect of gravity stress and thermal stress, slip lattice defects are easily generated. At this time, the control and adjustment mechanism 30 is in the first state, that is, the first support part 121, the second support part 122 and at least two auxiliary support parts 31 are located on the same support plane 20 to jointly support the wafer. Since there are at least four support points, the influence of thermal stress and gravity stress on the wafer can be dispersed, thereby effectively avoiding the occurrence of slip lattice defects.

[0077] When T1≤T2, that is, the wafer needs to be loaded from the micro-environment chamber 50 at room temperature into the process chamber 41 and heated to a preset temperature or cooled from a preset temperature to room temperature, due to the large temperature change, the wafer will produce a large thermal stress, resulting in deformation of the wafer. At this time, the control and adjustment mechanism 30 is in the second state, that is, the first support part 121, the second support part 122 and an auxiliary support part 31 are located on the same support plane 20 to jointly support the wafer. Since it is a three-point support, it is more stable, the wafer bounces less, is not easy to be scratched, and effectively avoids wafer contamination.

[0078] It can be seen that the vertical heat treatment device of the present invention can change the number of supporting points for supporting the wafer by setting the adjustment mechanism 30. When in use, the number of wafer supporting points can be adjusted according to the process temperature, thereby avoiding the generation of slip defects, while also avoiding problems such as particle scratches and contamination, thereby improving the process yield.

[0079] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer boat structure, characterized in that: include: A fixed bracket (10) having a fixed support portion; An adjustment mechanism (30) is arranged on the fixed bracket (10), the adjustment mechanism (30) has a plurality of movable auxiliary support parts (31), and the adjustment mechanism (30) has a first state and a second state. When the adjustment mechanism (30) is in a first state, at least two of the auxiliary support parts (31) move to a position flush with the fixed support part, so that at least two of the auxiliary support parts (31) and the fixed support part jointly support the same wafer; When the adjustment mechanism (30) is in the second state, only one of the auxiliary support parts (31) moves to a position flush with the fixed support part, so that the one auxiliary support part (31) and the fixed support part jointly support the same wafer.

2. The wafer boat structure according to claim 1, characterized in that: The regulating mechanism (30) comprises: A plurality of movable columns (32) are movably arranged on the fixed bracket (10); the auxiliary support portion (31) is arranged on the movable columns (32); the movable columns (32) drive the auxiliary support portion (31) to switch between a position flush with the fixed support portion and a position offset from the fixed support portion through movement.

3. The wafer boat structure according to claim 2, characterized in that: The moving column (32) comprises: a first moving column (32a) and a second moving column (32b); The auxiliary support part (31) comprises: a first auxiliary support part (31a) and a second auxiliary support part (31b); The first auxiliary support portion (31a) is arranged on the first moving column (32a), and the second auxiliary support portion (31b) is arranged on the second moving column (32b).

4. The wafer boat structure according to claim 3, characterized in that: The fixed support portion comprises: a first support portion (121) and a second support portion (122); When the adjustment mechanism (30) is in a first state, the first auxiliary support portion (31a) and the second auxiliary support portion (31b) are both located flush with the first support portion (121) and the second support portion (122), so that the first support portion (121), the second support portion (122), the first auxiliary support portion (31a) and the second auxiliary support portion (31b) jointly support the same wafer; When the adjustment mechanism (30) is in the second state, the first auxiliary support portion (31a) moves to a position offset from the first support portion (121) and the second support portion (122), and the second auxiliary support portion (31b) is located at a position flush with the first support portion (121) and the second support portion (122), so that the first support portion (121), the second support portion (122) and the second auxiliary support portion (31b) jointly support the same wafer.

5. The wafer boat structure according to claim 3, characterized in that: The moving column (32) further includes: a third moving column (32c); The auxiliary support portion (31) further comprises a third auxiliary support portion (31c) arranged on the third movable column (32c); The fixed support portion comprises: a first support portion (121) and a second support portion (122); When the adjustment mechanism (30) is in a first state, the first auxiliary support portion (31a) and the third auxiliary support portion (31c) are both located at positions flush with the first support portion (121) and the second support portion (122), and the second auxiliary support portion (31b) is located at a position staggered from the first support portion (121) and the second support portion (122), so that the first support portion (121), the second support portion (122), the first auxiliary support portion (31a) and the third auxiliary support portion (31c) jointly support the same wafer; When the adjustment mechanism (30) is in the second state, the first auxiliary support portion (31a) and the third auxiliary support portion (31c) move to positions offset from the first support portion (121) and the second support portion (122), and the second auxiliary support portion (31b) is located at a position flush with the first support portion (121) and the second support portion (122), so that the first support portion (121), the second support portion (122) and the second auxiliary support portion (31b) jointly support the same wafer.

6. The wafer boat structure according to claim 5, characterized in that: The first supporting portion (121), the second supporting portion (122), the first auxiliary supporting portion (31a), the second auxiliary supporting portion (31b) and the third auxiliary supporting portion (31c) are spaced apart in the circumferential direction of the wafer, and the second auxiliary supporting portion (31b) is located between the first auxiliary supporting portion (31a) and the third auxiliary supporting portion (31c).

7. The wafer boat structure according to claim 4, characterized in that: The fixing bracket (10) comprises: End plates (11), wherein there are two end plates (11), and the two end plates (11) are arranged opposite to each other; A support column (12), wherein there are two support columns (12), and both ends of each support column (12) are respectively connected to the two end plates (11), wherein one of the support columns (12) is provided with the first support portion (121), and the other support column (12) is provided with the second support portion (122); The two ends of the movable column (32) are respectively connected to the two end plates (11); the movable column (32) is movable in a direction perpendicular to the end plates (11); and the two support columns (12) and the movable column (32) are distributed at intervals along the circumference of the end plates (11).

8. The wafer boat structure according to claim 7, characterized in that: There are a plurality of the first support portions (121), and the plurality of the first support portions (121) are arranged at intervals along the axial direction of the support column (12); The second supporting portion (122), the first auxiliary supporting portion (31a) and the second auxiliary supporting portion (31b) are respectively arranged in one-to-one correspondence with the first supporting portion (121). A corresponding group of the first supporting part (121), the second supporting part (122), the first auxiliary supporting part (31a) and the second auxiliary supporting part (31b) are used to support the same wafer.

9. The wafer boat structure according to claim 2, characterized in that: The adjustment mechanism (30) further comprises: A driving device (33) is connected to the movable column (32) and is used to drive the movable column (32) to move so that the auxiliary support portion (31) switches between a position flush with the fixed support portion and a position offset from the fixed support portion.

10. The wafer boat structure according to claim 9, characterized in that: In the circumferential direction of the movable column (32), the movable column (32) and the fixed bracket (10) are limitedly matched, and a screw hole (321) is provided at the connection position between the movable column (32) and the driving device (33); The driving device (33) comprises: a motor (331) and a screw rod (332) arranged on an output shaft of the motor (331); the screw rod (332) is arranged in the screw hole (321) and threadedly matched with the screw hole (321); the motor (331) drives the screw rod (332) to rotate, and the rotating screw rod (332) drives the moving column (32) to move along its own axial direction.

11. A semiconductor heat treatment device, characterized in that: include: a process chamber (41); A microenvironment chamber (50) is arranged below the process chamber (41); A lifting device (60) is arranged in the microenvironment chamber (50); The wafer boat structure according to any one of claims 1 to 10 is arranged on the lifting device (60), and the lifting device (60) is used to drive the wafer boat structure to move between the microenvironment chamber (50) and the process chamber (41).

12. A control method for the semiconductor heat treatment equipment according to claim 11, characterized in that: The following steps are involved: Acquiring the current ambient temperature in the process chamber (41); The acquired current ambient temperature is compared with the preset temperature, and the state of the regulating mechanism (30) is controlled according to the comparison result.

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