Rapid adjusting mechanism for track width of semiconductor packaging test equipment
By designing the rail width rapid adjustment mechanism of semiconductor packaging test equipment, using components such as cylinders, lifting blocks and sleeve rollers, the problem of complex and time-consuming adjustment of rail width when existing equipment is replaced, and rapid adjustment of rail width and improvement of testing efficiency is achieved.
Patent Information
- Application Number
- CN202411782919.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-02-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When replacing products, existing semiconductor packaging and testing automation equipment need to adjust the track width according to the width of the lead frame. The process is complex and time-consuming, and errors are prone to occur, affecting the testing efficiency and accuracy.
A fast adjustment mechanism for the track width of a semiconductor packaging and testing equipment is designed, including a fixed bracket, an adjustment mechanism, a protective mechanism and an auxiliary mechanism. The track width is quickly adjusted through components such as cylinders, lifting blocks, articulation rods and sleeve rollers.
By simplifying the operation steps, the time for track width adjustment is significantly reduced, the testing efficiency and accuracy are improved, and the occurrence of errors is avoided.
Smart Images

Figure CN119542219A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor packaging and testing, in particular to a track width rapid adjustment mechanism for semiconductor packaging and testing equipment. Background Art
[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The main function of packaging is to protect the chip from physical damage and environmental factors, provide electrical connections, achieve mechanical connections, and assist in heat dissipation. The packaging process includes wafer dicing, chip mounting, bonding, plastic sealing, deburring, electroplating, printing, cutting and molding, appearance inspection, finished product testing, packaging and shipment. At present, due to the wide variety of semiconductor packaging forms, the lead frames used are also different. Although packaging companies have classified the external dimensions of lead frames, they still need to accommodate the production of lead frames of various sizes on the same semiconductor packaging and testing automation equipment. In order to adapt to the products produced, the existing semiconductor packaging and testing automation equipment often needs to adjust the track width according to the width of the lead frame when changing products to adapt to production. Therefore, a semiconductor packaging and testing equipment track width rapid adjustment mechanism is needed; The existing equipment track width adjustment is often complicated and time-consuming. The adjustment mechanism may involve multiple complex manual operation steps, which is prone to errors and affects test efficiency and accuracy. Summary of the invention
[0003] The purpose of the present invention is to provide a mechanism for quickly adjusting the track width of semiconductor packaging and testing equipment, so as to achieve the purpose of solving the problems raised in the above-mentioned background technology.
[0004] To achieve the above object, the present invention provides the following technical solution: a semiconductor packaging test equipment track width rapid adjustment mechanism, comprising a fixed bracket, A support leg fixedly mounted on the bottom of the fixed bracket; A top plate fixedly mounted on the top of the fixing bracket; A stabilizing plate fixedly mounted on the inner wall of the fixing bracket; and a processing assembly disposed at the top of the fixed support; The processing assembly includes an adjustment mechanism installed at the top position of the fixed support; A protective mechanism is installed at the top of the fixed bracket, and the protective mechanism is connected to the adjustment mechanism; An auxiliary mechanism is installed at the top of the fixing bracket, and one end of the auxiliary mechanism is connected to the adjusting mechanism.
[0005] Preferably, the adjusting mechanism comprises a cylinder, which is fixedly mounted on the top of the stabilizing plate, and a lifting block is installed on the cylinder through a telescopic rod transmission at the output end, and an articulated rod is hingedly mounted on the inner wall of the lifting block, and an adjusting block is hingedly mounted on the other end of the articulated rod, and an L-shaped plate is fixedly mounted on the top of the adjusting block, and a sleeve roller is rotatably mounted on the inner wall of the L-shaped plate through a bearing, and an auxiliary rod is slidably mounted on the inner wall of the sleeve roller, and a transport roller is fixedly mounted on one end of the auxiliary rod, and a slider is fixedly mounted on the L-shaped plate, and a connecting base is slidably mounted on the bottom inner wall of the slider, and the bottom of the connecting base is fixedly connected to the top of the top plate.
[0006] Preferably, the inner wall diameter of the sleeve roller is the same as the side wall diameter of the auxiliary rod, the side wall of the auxiliary rod is slidingly connected to the inner wall of the sleeve roller, there are multiple sleeve rollers, and the multiple sleeve rollers are equidistantly distributed on the inner wall of the L-shaped plate.
[0007] Preferably, the protective mechanism includes a long rod, one end of the long rod is fixedly connected to the side wall of the L-shaped plate, one end of the long rod is fixedly installed with a side plate, the side wall of the long rod is slidably installed with a sleeve block, the side wall of the sleeve block is fixedly installed with an extrusion spring, the other end of the extrusion spring is fixedly connected to the side wall of the L-shaped plate, one end of the sleeve block is fixedly installed with a connecting block, and the side wall of the connecting block is fixedly installed with a protective plate.
[0008] Preferably, there are two protective plates, the bottoms of the two protective plates are slidably connected to the top of the L-shaped plate, and the two protective plates are symmetrically arranged relative to the middle surface in the front-rear direction of the fixed bracket.
[0009] Preferably, the auxiliary mechanism includes a rectangular block, which is fixedly mounted on the top of the stabilizing plate, an inclined plate is fixedly mounted on the top of the rectangular block, an arc-shaped rod is fixedly mounted on the top of the inclined plate, a lifting block is fixedly mounted on the top of the arc-shaped rod, and the top inner wall of the lifting block is arranged in contact with the side wall of the transport roller.
[0010] Preferably, there are two lifting blocks, the two lifting blocks are equal in shape and size, and the two lifting blocks are symmetrically arranged relative to the middle surface in the front-to-back direction of the stabilizing plate.
[0011] Preferably, there are four supporting legs, the four supporting legs are equal in shape and size, and the four supporting legs are respectively fixedly installed at the four corners of the bottom of the fixed bracket, so that the position of the entire device can be supported by the supporting legs.
[0012] The present invention provides a semiconductor packaging test equipment track width rapid adjustment mechanism, which has the following beneficial effects: (1) In the present invention, the operator directly opens the cylinder, and the cylinder drives the lifting block to lift the position through the telescopic rod at the output end. The lifting block squeezes one end of the hinged rod. Under the action of the adjusting block, the hinged rod drives the position of the L-shaped plate to move to both sides. At this time, the sleeve roller slides on the surface of the auxiliary rod, causing the spacing of the transport track to increase. The position of the semiconductor packaging material can be quickly moved and transported by the sleeve roller and the transport roller. The operator can quickly adjust the width of the track through the adjustment mechanism, which solves the problem that the track width adjustment of existing equipment is often complicated and time-consuming. The adjustment mechanism may involve multiple complex manual operation steps, which are prone to errors and affect the test efficiency and accuracy.
[0013] (2) The present invention can drive the position of the slider to move when the position of the L-shaped plate is moved. During the movement of the slider, the slider will slide on the top of the connecting base, which effectively improves the stability of the slider during the movement and facilitates the operator to better use the device.
[0014] (3) When the transport roller of the present invention transports objects, the bottom position of the transport roller can be supported by the lifting block. Under the joint action of the rectangular block and the lifting block, the position of the arc rod can be supported. The arc rod further supports the position of the lifting block, thereby improving the stability of the transport roller during the transportation of objects.
[0015] (4) In the process of transporting materials, the present invention can limit the position of the materials through the protective plate to stabilize the materials from being offset and falling. When the materials are squeezed onto the protective plate, the protective plate will drive the position of the socket block to move under the action of the connecting block, and the socket block will slide on the surface of the long rod, squeezing one end of the squeezing spring. Under the squeezing action of the squeezing spring, the object can be pushed to the middle position to prevent it from being offset, which is convenient for the operator to use the device better. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the appearance structure of the present invention; Figure 2 It is a schematic diagram of the structure of the present invention facing upward; Figure 3 It is a structural schematic diagram of the regulating mechanism and the auxiliary mechanism of the present invention; Figure 4 It is a structural schematic diagram of the auxiliary mechanism of the present invention; Figure 5 For the present invention Figure 2 A partial enlarged view of Figure 6 A partial structural diagram of the adjustment mechanism of the present invention Figure 7 For the present invention Figure 3 A partial enlarged view of B.
[0017] In the figure: 1. fixed bracket; 2. supporting leg; 3. top plate; 4. processing component; 41. adjusting mechanism; 411. cylinder; 412. lifting block; 413. hinged rod; 414. adjusting block; 415. L-shaped plate; 416. sleeve roller; 417. transport roller; 418. auxiliary rod; 419. slider; 4110. connecting base; 42. protective mechanism; 421. side plate; 422. long rod; 423. sleeve block; 424. extrusion spring; 425. protective plate; 426. connecting block; 43. auxiliary mechanism; 431. tilting plate; 432. arc rod; 433. lifting block; 434. rectangular block; 5. stabilizing plate. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0019] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0020] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0022] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described with reference to the accompanying drawings.
[0023] Embodiment 1: A preferred embodiment of a semiconductor packaging test equipment track width rapid adjustment mechanism provided by the present invention is as follows: Figures 1 to 7 As shown: A semiconductor packaging test equipment track width quick adjustment mechanism, comprising a fixed bracket 1, A support leg 2 is fixedly mounted on the bottom of the fixed bracket 1. There are four support legs 2. The four support legs 2 are of equal shape and size. The four support legs 2 are respectively fixedly mounted at the four corners of the bottom of the fixed bracket 1. The support legs 2 can support the position of the entire device. A top plate 3 fixedly mounted on the top of the fixed bracket 1; A stabilizing plate 5 fixedly mounted on the inner wall of the fixing bracket 1; and a processing assembly 4 disposed at the top of the fixed support 1; The processing assembly 4 includes an adjustment mechanism 41 installed at the top position of the fixed support 1; A protection mechanism 42 is installed at the top of the fixed bracket 1, and the protection mechanism 42 is connected to the adjustment mechanism 41; An auxiliary mechanism 43 is installed at the top of the fixing bracket 1 , and one end of the auxiliary mechanism 43 is connected to the adjusting mechanism 41 .
[0024] The adjusting mechanism 41 comprises a cylinder 411, which is fixedly mounted on the top of the stabilizing plate 5. The cylinder 411 is provided with a lifting block 412 through a telescopic rod transmission at the output end. A hinged rod 413 is hingedly mounted on the inner wall of the lifting block 412. An adjusting block 414 is hingedly mounted on the other end of the hinged rod 413. An L-shaped plate 415 is fixedly mounted on the top of the adjusting block 414. A sleeve roller 416 is rotatably mounted on the inner wall of the L-shaped plate 415 through a bearing. An auxiliary rod 418 is slidably mounted on the inner wall of the sleeve roller 416. A transport roller 417 is fixedly mounted on one end of the auxiliary rod 418. A slider 419 is fixedly mounted on the L-shaped plate 415. A connecting base 4110 is slidably mounted on the bottom inner wall of the slider 419. The bottom of the connecting base 4110 is fixedly connected to the top of the top plate 3.
[0025] In this embodiment, the inner wall diameter of the sleeve roller 416 is the same as the side wall diameter of the auxiliary rod 418, the side wall of the auxiliary rod 418 is slidingly connected to the inner wall of the sleeve roller 416, there are multiple sleeve rollers 416, and the multiple sleeve rollers 416 are equidistantly distributed on the inner wall of the L-shaped plate 415.
[0026] During the specific implementation process, when the operator uses the device and needs to adjust the spacing of the transport tracks, the operator directly turns on the cylinder 411, and the cylinder 411 drives the lifting block 412 to lift the position through the telescopic rod at the output end. The lifting block 412 will squeeze one end of the hinged rod 413, and the hinged rod 413, under the action of the adjustment block 414, drives the position of the L-shaped plate 415 to move to both sides. At this time, the sleeve roller 416 will slide on the surface of the auxiliary rod 418, causing the spacing of the transport tracks to increase. The position of the semiconductor packaging material can be quickly moved and transported through the sleeve roller 416 and the transport roller 417, and the operator can quickly adjust the width of the track through the adjustment mechanism 41.
[0027] Embodiment 2: Based on Embodiment 1, a preferred embodiment of a semiconductor packaging test equipment track width rapid adjustment mechanism provided by the present invention is as follows: Figures 1 to 7 As shown: the protective mechanism 42 includes a long rod 422, one end of the long rod 422 is fixedly connected to the side wall of the L-shaped plate 415, one end of the long rod 422 is fixedly installed with a side plate 421, the side wall of the long rod 422 is slidably installed with a sleeve block 423, the side wall of the sleeve block 423 is fixedly installed with an extrusion spring 424, the other end of the extrusion spring 424 is fixedly connected to the side wall of the L-shaped plate 415, one end of the sleeve block 423 is fixedly installed with a connecting block 426, and the side wall of the connecting block 426 is fixedly installed with a protective plate 425.
[0028] In this embodiment, there are two protective plates 425 , the bottoms of the two protective plates 425 are slidably connected to the top of the L-shaped plate 415 , and the two protective plates 425 are symmetrically arranged relative to the middle surface of the fixing bracket 1 in the front-to-back direction.
[0029] In the specific implementation process, the position of the material can be limited by the protective plate 425 during the transportation process to stabilize the material from being offset and falling. When the material is squeezed onto the protective plate 425, the protective plate 425 will drive the position of the socket block 423 to move under the action of the connecting block 426, and the socket block 423 will slide on the surface of the long rod 422, at which time one end of the extrusion spring 424 will be squeezed. Under the extrusion action of the extrusion spring 424, the object can be pushed to the middle position to prevent it from being offset.
[0030] Embodiment 3: Based on Embodiment 1, a preferred embodiment of a semiconductor packaging test equipment track width rapid adjustment mechanism provided by the present invention is as follows: Figures 1 to 7As shown: the auxiliary mechanism 43 includes a rectangular block 434, which is fixedly mounted on the top of the stabilizing plate 5, on the top of the rectangular block 434 is fixedly mounted an inclined plate 431, on the top of the inclined plate 431 is fixedly mounted an arc rod 432, on the top of the arc rod 432 is fixedly mounted a lifting block 433, and the top inner wall of the lifting block 433 is in contact with the side wall of the transport roller 417.
[0031] In this embodiment, there are two lifting blocks 433 , the two lifting blocks 433 are equal in shape and size, and the two lifting blocks 433 are symmetrically arranged relative to the middle surface of the stabilizing plate 5 in the front-to-back direction.
[0032] During the specific implementation process, when the transport roller 417 transports objects, its bottom position can be supported by the lifting block 433. Under the joint action of the rectangular block 434 and the lifting block 433, the position of the arc rod 432 can be supported. The arc rod 432 further supports the position of the lifting block 433, thereby improving the stability of the transport roller 417 during the transportation of objects.
[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
[0034] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A semiconductor packaging test equipment track width rapid adjustment mechanism, comprising a fixed bracket (1), A support leg (2) fixedly mounted on the bottom of the fixed bracket (1); A top plate (3) fixedly mounted on the top of the fixing bracket (1); A stabilizing plate (5) fixedly mounted on the inner wall of the fixing bracket (1); and a processing assembly (4) arranged at the top of the fixed support (1); characterized in that: The processing assembly (4) comprises an adjustment mechanism (41) mounted at the top of the fixed support (1); A protection mechanism (42) is installed at the top of the fixed bracket (1), and the protection mechanism (42) is connected to the adjustment mechanism (41); An auxiliary mechanism (43) is installed at the top of the fixed bracket (1), and one end of the auxiliary mechanism (43) is connected to the adjustment mechanism (41).
2. A semiconductor packaging test equipment track width rapid adjustment mechanism according to claim 1, characterized in that: The adjustment mechanism (41) comprises a cylinder (411), wherein the cylinder (411) is fixedly mounted on the top of the stabilizing plate (5), and the cylinder (411) is installed with a lifting block (412) through a telescopic rod at the output end thereof, and an articulated rod (413) is hingedly mounted on the inner wall of the lifting block (412), and an adjustment block (414) is hingedly mounted on the other end of the articulated rod (413), and an L-shaped plate (415) is fixedly mounted on the top of the adjustment block (414), and the L-shaped plate (415) is fixedly mounted on the top of the adjustment block (414). A sleeve roller (416) is rotatably mounted on the inner wall of the plate (415) via a bearing, an auxiliary rod (418) is slidably mounted on the inner wall of the sleeve roller (416), a transport roller (417) is fixedly mounted on one end of the auxiliary rod (418), a slider (419) is fixedly mounted on the L-shaped plate (415), a connecting base (4110) is slidably mounted on the bottom inner wall of the slider (419), and the bottom of the connecting base (4110) is fixedly connected to the top of the top plate (3).
3. The semiconductor packaging and testing equipment track width rapid adjustment mechanism according to claim 2, characterized in that: The inner wall diameter of the sleeve roller (416) is the same as the side wall diameter of the auxiliary rod (418); the side wall of the auxiliary rod (418) is slidably connected to the inner wall of the sleeve roller (416); there are multiple sleeve rollers (416), and the multiple sleeve rollers (416) are equidistantly distributed on the inner wall of the L-shaped plate (415).
4. The semiconductor packaging and testing equipment track width rapid adjustment mechanism according to claim 1, characterized in that: The protective mechanism (42) comprises a long rod (422), one end of the long rod (422) being fixedly connected to the side wall of the L-shaped plate (415), one end of the long rod (422) being fixedly mounted with a side plate (421), a sleeve block (423) being slidably mounted on the side wall of the long rod (422), a compression spring (424) being fixedly mounted on the side wall of the sleeve block (423), the other end of the compression spring (424) being fixedly connected to the side wall of the L-shaped plate (415), one end of the sleeve block (423) being fixedly mounted with a connection block (426), and the side wall of the connection block (426) being fixedly mounted with a protective plate (425).
5. The semiconductor packaging and testing equipment track width rapid adjustment mechanism according to claim 4, characterized in that: There are two protective plates (425), the bottoms of the two protective plates (425) are slidably connected to the top of the L-shaped plate (415), and the two protective plates (425) are symmetrically arranged relative to the middle surface of the fixed bracket (1) in the front-rear direction.
6. The semiconductor packaging and testing equipment track width rapid adjustment mechanism according to claim 1, characterized in that: The auxiliary mechanism (43) comprises a rectangular block (434), wherein the rectangular block (434) is fixedly mounted on the top of the stabilizing plate (5), an inclined plate (431) is fixedly mounted on the top of the rectangular block (434), an arc-shaped rod (432) is fixedly mounted on the top of the inclined plate (431), a lifting block (433) is fixedly mounted on the top of the arc-shaped rod (432), and the top inner wall of the lifting block (433) is arranged in contact with the side wall of the transport roller (417).
7. A semiconductor packaging test equipment track width rapid adjustment mechanism according to claim 6, characterized in that: There are two lifting blocks (433), the two lifting blocks (433) are equal in shape and size, and the two lifting blocks (433) are symmetrically arranged relative to the middle surface of the stabilizing plate (5) in the front-to-back direction.
8. The semiconductor packaging and testing equipment track width rapid adjustment mechanism according to claim 1, characterized in that: There are four supporting legs (2), the four supporting legs (2) are of equal shape and size, and the four supporting legs (2) are respectively fixedly mounted at the four corners of the bottom of the fixed bracket (1).
Citation Information
Cited By
Rail supporting assembly of three-rail conveyor for agricultural machinery
CN120736190A
A track support assembly for a three-rail transport machine for agricultural machinery
CN120736190B