Method for solving automatic probe alignment of semiconductor probe station equipment through RCM

Abstract

The invention discloses a method for achieving automatic probe alignment of semiconductor probe station equipment through RCM, and relates to the technical field of probe stations. The method comprises the steps of S1, equipment preparation, S2, probe head correction and S3, automatic probe alignment. According to the invention, the advantages of the RCM technology are utilized, high-precision probe correction and chip coordinate acquisition are realized, the accuracy of automatic probe alignment is ensured, the chip coordinate information is acquired in real time, rapid and automatic probe alignment is realized, the working efficiency of equipment is improved, and the RCM technology has the advantage of reconfigurability and can adapt to chips to be detected with different sizes and shapes; the method has high adaptability, a complex mechanical structure or high-cost image recognition equipment is not needed, and the equipment cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of probe stations, and in particular to a method for solving automatic needle alignment of semiconductor probe station equipment through RCM. Background Art

[0002] Semiconductor probe station equipment is an important device for wafer testing in the semiconductor manufacturing process. During the testing process, accurate needle alignment is a key step to ensure reliable test results.

[0003] However, with the continuous advancement of semiconductor technology and the continuous increase in wafer size, the alignment accuracy and efficiency of probe station equipment are facing increasing challenges. Traditional probe station alignment methods mainly rely on manual operation or simple mechanical positioning, with limited accuracy and efficiency, and cannot meet the needs of modern semiconductor technology. Therefore, seeking an efficient and high-precision automatic alignment method has become an important direction for the development of semiconductor probe station equipment technology. In response to the above problems, the inventors proposed a method for automatically aligning semiconductor probe station equipment through RCM to solve the above problems. Summary of the invention

[0004] In order to solve the problem that the positioning method of the probe station equipment has limited accuracy and the image recognition method is easily affected by factors such as ambient light and lens distortion; the purpose of the present invention is to provide a method for solving the automatic needle alignment of semiconductor probe station equipment through RCM.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solution: a method for solving the automatic needle alignment of semiconductor probe station equipment through RCM, comprising the following steps:

[0006] S1. Equipment preparation

[0007] Use RCM technology to measure and calibrate the probe station body and establish the corresponding relationship between the equipment coordinate system and the probe head coordinate system;

[0008] S2. Probe head calibration

[0009] The probe head is installed on the probe station body, and the probe head is accurately measured and calibrated using RCM technology to establish a probe head shape model;

[0010] S3, Automatic Needle Alignment

[0011] During the test process, RCM technology is used to obtain the coordinate information of the chip to be tested in real time, and the needle alignment operation is performed according to the probe head shape model. Specifically, by comparing the coordinate information of the chip to be tested with the preset chip coordinate information, the moving distance and direction of the probe head are calculated to realize the automatic needle alignment function.

[0012] Preferably, the specific steps of the automatic needle alignment are as follows:

[0013] S1. Initialization

[0014] Initialize the RCM system, set the initial position of the probe station, and load the information of the chip to be tested, including chip coordinates, model, etc.

[0015] S2. Needle point positioning

[0016] According to the information of the chip to be tested, the coordinate position of the needle point is calculated. This step can be accurately calculated by the RCM system;

[0017] S3. Probe head alignment

[0018] Under the control of the RCM system, the probe head is accurately aligned with the needle point, and can be accurately positioned and adjusted through the feedback system of the RCM system;

[0019] S4, needle alignment

[0020] After the probe head is aligned, the needle alignment operation is performed, and the lifting and movement of the probe head are controlled by the RCM system to make the probe head contact the chip accurately;

[0021] S5. Detection

[0022] After the needle alignment is completed, the RCM system is used to detect the contact quality between the probe head and the chip to ensure that the needle alignment is accurate.

[0023] Preferably, two bases are provided on the upper surface of the probe station body, connecting bases are fixedly installed on opposite sides of the two bases, probe mounting bases are provided on opposite sides of the two connecting bases, through holes are opened inside the two probe mounting bases, the probe heads pass through the through holes, mounting mechanisms are provided inside the through holes, a horizontal adjustment mechanism is provided between the probe station body and the base, and an angle adjustment mechanism is provided between the base and the probe mounting base.

[0024] Preferably, the mounting mechanism comprises a plurality of arc-surface clamping plates, a connecting frame is fixedly mounted between two adjacent arc-surface clamping plates, double-headed screws are rotatably mounted on the inner walls of the two through holes, two threaded sleeves are threadably mounted on the outer walls of the two double-headed screws, a moving rod is fixedly mounted on the outer walls of the threaded sleeves, one end of the moving rod away from the threaded sleeve is fixedly connected to one side of the connecting frame, and a mounting handle is fixedly mounted on one end of the two double-headed screws.

[0025] Preferably, a curved anti-skid pad is fixedly mounted on the inner wall of the curved clamping plate, and the inner wall of the curved anti-skid pad is in active contact with the outer wall of the probe head.

[0026] Preferably, two frame plates are fixedly installed on the inner walls of the two through holes, a guide groove is opened on one side of the frame plate, two guide blocks are slidably connected to the inner wall of the guide groove, a connecting rod is fixedly installed on one side of the guide block, and the end of the connecting rod away from the guide block is fixedly connected to the outer wall of the arc clamping plate.

[0027] Preferably, the horizontal adjustment mechanism includes two first base plates and two second base plates, the lower surfaces of the two first base plates are fixedly connected to the upper surface of the probe station body, the upper surfaces of the two first base plates are each provided with a first slide groove, the inner walls of the two first slide grooves are each slidably connected with a first slider, the upper surface of one of the first sliders is fixedly connected to the lower surface of a second base plate, a first screw is rotatably installed on one side of the two first base plates, and one of the first screws passes through a first slide groove and is threadedly rotatably connected to a first slider.

[0028] Preferably, a second slide groove is provided on the upper surface of the two second base plates, and a second slider is slidably connected to the inner walls of the two second slide grooves, and a fixing frame is fixedly installed on the upper surface of the two second sliders, one end of the fixing frame is fixedly connected to the lower surface of a base, and a second screw is rotatably installed on one side of the two second base plates, and one of the second screws passes through a second slide groove and is threadedly rotatably connected to a second slider.

[0029] Preferably, the angle adjustment mechanism includes two U-shaped sleeves, one side of the U-shaped sleeve is fixedly connected to one end of a connecting seat, the inner walls of the two U-shaped sleeves are rotatably mounted with rotating shafts, the outer walls of the two rotating shafts are fixedly mounted with connecting sleeves, the outer walls of the two connecting sleeves are fixedly mounted with connecting blocks, and the end of the connecting block away from the connecting sleeve is fixedly connected to one side of the probe mounting seat.

[0030] Preferably, a worm wheel is fixedly installed at one end of the two rotating shafts, a support frame is fixedly installed on the other side of the two U-shaped sleeves, a worm is rotatably installed on the inner wall of the two support frames, the worm and the worm wheel are meshingly connected, and an adjustment handle is fixedly installed at one end of the two worms.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] 1. In the present invention, the advantages of RCM technology are utilized to achieve high-precision probe calibration and chip coordinate acquisition, thereby ensuring the accuracy of automatic needle alignment;

[0033] 2. In the present invention, by acquiring chip coordinate information in real time, rapid and automatic needle alignment is achieved, thereby improving the working efficiency of the equipment;

[0034] 3. In the present invention, the RCM technology has the advantage of being reconfigurable and can adapt to chips of different sizes and shapes to be tested, and has strong adaptability;

[0035] 4. In the present invention, no complicated mechanical structure or high-cost image recognition equipment is required, thus reducing equipment costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 It is a schematic diagram of the automatic needle alignment method of the present invention.

[0038] Figure 2 It is a schematic diagram of the overall structure of the probe station body of the present invention.

[0039] Figure 3 FIG. 4 is another schematic diagram of the overall structure of the probe station body of the present invention.

[0040] Figure 4 It is a schematic diagram of the connection structure between the horizontal adjustment mechanism and the probe head of the present invention.

[0041] Figure 5 For the present invention Figure 4 A magnified schematic diagram of part A in FIG.

[0042] Figure 6 It is a schematic diagram of the connection structure between the angle adjustment mechanism and the probe head of the present invention.

[0043] Figure 7 For the present invention Figure 6 An enlarged schematic diagram of part B in FIG.

[0044] Figure 8 It is a schematic diagram of the cross-section structure of the probe mounting seat of the present invention.

[0045] Fig. 9 For the present invention Figure 8 Enlarged schematic diagram of part C in FIG.

[0046] Fig.10 It is a schematic diagram of the connection structure of the mounting mechanism of the present invention.

[0047] In the figure: 1. probe station body; 11. base; 12. connecting seat; 13. probe mounting seat; 131. insertion hole; 14. probe head; 2. mounting mechanism; 21. arc clamping plate; 22. arc anti-skid pad; 23. connecting frame; 24. frame plate; 25. guide groove; 26. guide block; 27. connecting rod; 28. double-headed screw; 29. ​​threaded sleeve; 3. moving rod; 31. mounting handle; 4. horizontal adjustment mechanism; 41. first bottom plate; 42. second bottom plate; 43. first slide groove; 44. first slider; 45. first screw; 46. second slide groove; 47. second slider; 48. fixing frame; 49. second screw; 5. angle adjustment mechanism; 51. U-shaped sleeve; 52. rotating shaft; 53. connecting sleeve; 531. connecting block; 54. worm gear; 55. support frame; 56. worm; 57. adjustment handle. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] Example: Figure 1-10 As shown, the present invention provides a method for solving the automatic needle alignment of semiconductor probe station equipment through RCM, comprising the following steps:

[0050] S1. Equipment preparation

[0051] The probe station body 1 is measured and calibrated using RCM technology to establish a corresponding relationship between the device coordinate system and the probe head 14 coordinate system;

[0052] S2, probe head 14 calibration

[0053] The probe head 14 is mounted on the probe station body 1, and the probe head 14 is accurately measured and calibrated using RCM technology to establish a shape model of the probe head 14;

[0054] S3, Automatic Needle Alignment

[0055] During the test process, RCM technology is used to obtain the coordinate information of the chip to be tested in real time, and the needle alignment operation is performed according to the shape model of the probe head 14. Specifically, by comparing the coordinate information of the chip to be tested with the preset chip coordinate information, the moving distance and direction of the probe head 14 are calculated to realize the automatic needle alignment function.

[0056] The specific steps of automatic needle alignment are as follows:

[0057] S1. Initialization

[0058] Initialize the RCM system, set the initial position of the probe station body 1, and load the information of the chip to be tested, including chip coordinates, model, etc.;

[0059] S2. Needle point positioning

[0060] According to the information of the chip to be tested, the coordinate position of the needle point is calculated. This step can be accurately calculated by the RCM system;

[0061] S3, probe head 14 alignment

[0062] Under the control of the RCM system, the probe head 14 is precisely aligned with the needle point, and can be precisely positioned and adjusted through the feedback system of the RCM system;

[0063] S4, needle alignment

[0064] After the probe head 14 is aligned, the needle alignment operation is performed, and the lifting and movement of the probe head 14 is controlled by the RCM system so that the probe head 14 is in precise contact with the chip;

[0065] S5. Detection

[0066] After the needle alignment is completed, the contact quality between the probe head 14 and the chip is tested by the RCM system to ensure that the needle alignment is accurate.

[0067] By adopting the above technical solution, by setting up an RCM system, that is, a robot coordinate measuring machine, which is an automation equipment integrating robots and coordinate measurement technology, it can achieve accurate measurement and positioning of the coordinate position of an object. The RCM system is usually composed of a robot, a coordinate measuring device, a control system and software, etc., and can be applied to various automated production lines and test equipment;

[0068] The probe station body 1 is a device for testing semiconductor devices, which is usually composed of a probe, a table, a drive system, a control system and a test system. During the test process, the probe station body 1 needs to perform precise needle alignment operations according to the position of the chip and the coordinates of the needle alignment point to ensure the accuracy of the test data;

[0069] Principle of automatic needle alignment: Automatic needle alignment refers to the automatic operation of aligning the probe with the chip needle point through the control system and sensor technology. Usually, automatic needle alignment needs to determine the coordinate position of the chip and the needle point, and then control the probe to align with the chip needle point through the control system and drive system. Automatic needle alignment can improve the accuracy and efficiency of needle alignment and reduce operating costs and errors.

[0070] Coordinate calculation method: Coordinate calculation refers to the process of determining the coordinate position of an object through measuring devices and sensor technology. Common coordinate calculation methods include laser scanning, machine vision, ultrasonic waves, etc. In the present invention, the coordinate measurement device of the RCM system is used to perform accurate coordinate calculation;

[0071] Position adjustment method: Position adjustment refers to the process of adjusting the position of the probe to the chip through the control system and the drive system. Common position adjustment methods include lifting and moving the probe. In the present invention, the control system and drive system of the RCM system are used to perform precise position adjustment.

[0072] Needle alignment quality detection method: Needle alignment quality detection refers to the process of detecting the contact quality between the probe and the chip through sensor technology. Commonly used needle alignment quality detection methods include contact force detection, current detection, etc. In the present invention, the sensor of the RCM system is used to perform accurate needle alignment quality detection.

[0073] Two bases 11 are provided on the upper surface of the probe station body 1, and connecting seats 12 are fixedly installed on the opposite sides of the two bases 11, and probe mounting seats 13 are provided on the opposite sides of the two connecting seats 12. Insertion holes 131 are opened inside the two probe mounting seats 13, and the probe heads 14 pass through the insertion holes 131. An installation mechanism 2 is provided inside the insertion holes 131, a horizontal adjustment mechanism 4 is provided between the probe station body 1 and the base 11, and an angle adjustment mechanism 5 is provided between the base 11 and the probe mounting seats 13.

[0074] By adopting the above technical solution, after the probe head 14 passes through the insertion hole 131, by setting the installation mechanism 2, the installation mechanism 2 facilitates the fixed installation of the probe head 14, thereby improving the convenience of installing the probe head 14, by setting the horizontal adjustment mechanism 4, the horizontal adjustment mechanism 4 facilitates the lateral and longitudinal horizontal position adjustment of the probe head 14, and by setting the angle adjustment mechanism 5, the angle adjustment mechanism 5 facilitates the angle adjustment of the probe head 14, thereby improving the flexibility of the probe head 14.

[0075] The mounting mechanism 2 comprises a plurality of arc-surface clamping plates 21, a connecting frame 23 is fixedly mounted between two adjacent arc-surface clamping plates 21, double-headed screws 28 are rotatably mounted on the inner walls of the two insertion holes 131, two threaded sleeves 29 are threadedly rotatably mounted on the outer walls of the two double-headed screws 28, a moving rod 3 is fixedly mounted on the outer wall of the threaded sleeve 29, one end of the moving rod 3 away from the threaded sleeve 29 is fixedly connected to one side of the connecting frame 23, and a mounting handle 31 is fixedly mounted on one end of the two double-headed screws 28.

[0076] By adopting the above technical solution, the handle 31 is installed by turning the knob, and the installing handle 31 causes the double-headed screw 28 to rotate. The double-headed screw 28 drives the two threaded sleeves 29 and the two moving rods 3 to move closer to or away from each other. The two moving rods 3 cause the two groups of arc-surface clamping plates 21 to move closer to or away from each other (a group of arc-surface clamping plates 21 is two adjacent arc-surface clamping plates 21) through two connecting frames 23.

[0077] An arc-surface anti-skid pad 22 is fixedly mounted on the inner wall of the arc-surface clamping plate 21 , and the inner wall of the arc-surface anti-skid pad 22 is in active contact with the outer wall of the probe head 14 .

[0078] By adopting the above technical solution and providing the arcuate anti-skid pad 22 , when the arcuate clamping plate 21 clamps the probe head 14 through the arcuate anti-skid pad 22 , the arcuate anti-skid pad 22 improves the stability of the clamped probe head 14 .

[0079] Two frame plates 24 are fixedly installed on the inner walls of the two through holes 131, a guide groove 25 is opened on one side of the frame plate 24, and two guide blocks 26 are slidably connected to the inner wall of the guide groove 25. A connecting rod 27 is fixedly installed on one side of the guide block 26, and the end of the connecting rod 27 away from the guide block 26 is fixedly connected to the outer wall of the arc clamping plate 21.

[0080] By adopting the above technical solution, by setting the guide groove 25, the guide block 26 and the connecting rod 27, the guide block 26 guides the arc clamping plate 21 and the connecting frame 23 in the vertical direction through the connecting rod 27, so that the arc clamping plate 21 and the connecting frame 23 can maintain the vertical lifting.

[0081] The horizontal adjustment mechanism 4 includes two first base plates 41 and two second base plates 42. The lower surfaces of the two first base plates 41 are fixedly connected to the upper surface of the probe station body 1. The upper surfaces of the two first base plates 41 are each provided with a first slide groove 43. The inner walls of the two first slide grooves 43 are both slidably connected with a first slider 44. The upper surface of a first slider 44 is fixedly connected to the lower surface of a second base plate 42. A first screw 45 is rotatably installed on one side of the two first base plates 41. A first screw 45 passes through a first slide groove 43 and is threadedly rotatably connected to a first slider 44.

[0082] By adopting the above technical solution, by rotating the first screw 45, the first screw 45 drives the first slider 44 to slide horizontally along the inner wall of the first slide groove 43, and the first slider 44 drives the base 11, the connecting seat 12 and the probe mounting seat 13 to make the probe head 14 move longitudinally and horizontally through the second bottom plate 42.

[0083] A second slide groove 46 is provided on the upper surface of the two second base plates 42, and a second slider 47 is slidably connected to the inner walls of the two second slide grooves 46, and a fixing frame 48 is fixedly installed on the upper surface of the two second sliders 47, and one end of a fixing frame 48 is fixedly connected to the lower surface of a base 11, and a second screw 49 is rotatably installed on one side of the two second base plates 42, and a second screw 49 passes through a second slide groove 46 and is threadedly rotatably connected to a second slider 47.

[0084] By adopting the above technical solution, the second screw 49 is rotated to drive the second slider 47 to slide horizontally along the inner wall of the second slide groove 46. The second slider 47 drives the base 11, the connecting seat 12 and the probe mounting seat 13 to move the probe head 14 horizontally through the fixing frame 48.

[0085] The angle adjustment mechanism 5 includes two U-shaped sleeves 51, one side of a U-shaped sleeve 51 is fixedly connected to one end of a connecting seat 12, the inner walls of the two U-shaped sleeves 51 are rotatably mounted with a rotating shaft 52, the outer walls of the two rotating shafts 52 are fixedly mounted with a connecting sleeve 53, the outer walls of the two connecting sleeves 53 are fixedly mounted with a connecting block 531, and the end of the connecting block 531 away from the connecting sleeve 53 is fixedly connected to one side of the probe mounting seat 13.

[0086] By adopting the above technical solution, by rotating the rotating shaft 52, the rotating shaft 52 causes the probe mounting seat 13 and the probe head 14 to rotate around the axis of the rotating shaft 52 through the connecting sleeve 53 and the connecting block 531, thereby achieving angle adjustment of the probe head 14.

[0087] A worm gear 54 is fixedly installed at one end of the two rotating shafts 52, and a support frame 55 is fixedly installed on the other side of the two U-shaped sleeves 51. A worm 56 is rotatably installed on the inner wall of the two support frames 55. The worm 56 is meshingly connected with the worm gear 54, and an adjustment handle 57 is fixedly installed at one end of the two worms 56.

[0088] By adopting the above technical solution, the handle 57 is adjusted by turning the knob, and the adjusting handle 57 causes the worm 56 to rotate, and the worm 56 drives the worm wheel 54 to rotate, and the worm wheel 54 causes the rotating shaft 52 to rotate.

[0089] Working principle: when the probe head 14 needs to be installed, the staff first makes the probe head 14 pass through the insertion hole 131, and then turns the knob installation handle 31, the installation handle 31 makes the double-headed screw 28 rotate, and the double-headed screw 28 rotates while driving the two threaded sleeves 29 and the two moving rods 3 to approach each other, and the two moving rods 3 make the two connecting frames 23, the two sets of arc surface clamping plates 21 and the two sets of arc surface anti-skid pads 22 approach each other, until the inner walls of the two sets of arc surface anti-skid pads 22 are in close contact with the outer wall of the probe head 14, and then stop turning the knob installation handle 31, at this time, the two sets of arc surface clamping plates 21 clamp the probe head 14 through the two sets of arc surface anti-skid pads 22, thereby conveniently realizing the fixed installation of the probe head 14, thereby effectively improving the convenience of installing the probe head 14;

[0090] When the position of the probe head 14 needs to be adjusted, the staff first rotates the first screw 45 and the two second screws 49 respectively, the first screw 45 drives the first slider 44 to slide horizontally along the inner wall of the first slide groove 43, the first slider 44 drives the base 11, the connecting seat 12 and the probe mounting seat 13 to move the probe head 14 longitudinally and horizontally through the second bottom plate 42, the second screw 49 drives the second slider 47 to slide horizontally along the inner wall of the second slide groove 46, the second slider 47 drives the base 11, the connecting seat 12 and the probe mounting seat 13 to move the probe head 14 laterally and horizontally through the fixing frame 48;

[0091] When the staff turns the knob to adjust the handle 57, the adjusting handle 57 causes the worm 56 to rotate, the worm 56 drives the worm wheel 54 to rotate, the worm wheel 54 causes the rotating shaft 52 to rotate, and the rotating shaft 52 causes the probe mounting seat 13 and the probe head 14 to rotate around the axis of the rotating shaft 52 through the connecting sleeve 53 and the connecting block 531, thereby realizing the horizontal position adjustment and angle adjustment of the probe head 14, thereby effectively improving the flexibility of the probe head 14.

[0092] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for solving the automatic needle alignment of semiconductor probe station equipment through RCM, characterized in that: The following steps are involved: S1. Equipment preparation The probe station body (1) is measured and calibrated using RCM technology to establish a corresponding relationship between the device coordinate system and the probe head (14) coordinate system; S2. Probe head (14) calibration The probe head (14) is mounted on the probe station body (1), and the probe head (14) is accurately measured and calibrated using RCM technology to establish a shape model of the probe head (14); S3, Automatic Needle Alignment During the test process, the coordinate information of the chip to be tested is acquired in real time using the RCM technology, and the needle alignment operation is performed according to the shape model of the probe head (14). Specifically, by comparing the coordinate information of the chip to be tested with the preset chip coordinate information, the moving distance and direction of the probe head (14) are calculated, thereby realizing the automatic needle alignment function.

2. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 1, characterized in that: The specific steps of automatic needle alignment are as follows: S1. Initialization Initialize the RCM system, set the initial position of the probe station body (1), and load the information of the chip to be tested, including chip coordinates, model, etc.; S2. Needle point positioning According to the information of the chip to be tested, the coordinate position of the needle point is calculated. This step can be accurately calculated by the RCM system; S3. Alignment of probe head (14) Under the control of the RCM system, the probe head (14) is precisely aligned with the needle point, and can be precisely positioned and adjusted through the feedback system of the RCM system; S4, needle alignment After the probe head (14) is aligned, a needle alignment operation is performed, and the lifting and movement of the probe head (14) is controlled by the RCM system so that the probe head (14) is in precise contact with the chip; S5. Detection After the needle alignment is completed, the contact quality between the probe head (14) and the chip is tested by the RCM system to ensure that the needle alignment is accurate.

3. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 1, characterized in that: The upper surface of the probe station body (1) is provided with two bases (11), the opposite sides of the two bases (11) are fixedly mounted with connecting seats (12), the opposite sides of the two connecting seats (12) are provided with probe mounting seats (13), the insides of the two probe mounting seats (13) are provided with insertion holes (131), the probe heads (14) pass through the insertion holes (131), the insides of the insertion holes (131) are provided with mounting mechanisms (2), a horizontal adjustment mechanism (4) is provided between the probe station body (1) and the base (11), and an angle adjustment mechanism (5) is provided between the base (11) and the probe mounting seats (13).

4. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 3, characterized in that: The mounting mechanism (2) comprises a plurality of arc surface clamping plates (21), a connecting frame (23) is fixedly mounted between two adjacent arc surface clamping plates (21), a double-headed screw (28) is rotatably mounted on the inner walls of the two insertion holes (131), two threaded sleeves (29) are threadedly rotatably mounted on the outer walls of the two double-headed screws (28), a moving rod (3) is fixedly mounted on the outer wall of the threaded sleeve (29), one end of the moving rod (3) away from the threaded sleeve (29) is fixedly connected to one side of the connecting frame (23), and one end of the two double-headed screws (28) is fixedly mounted with a mounting handle (31).

5. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 4, characterized in that: A curved anti-skid pad (22) is fixedly mounted on the inner wall of the curved clamping plate (21), and the inner wall of the curved anti-skid pad (22) is in active contact with the outer wall of the probe head (14).

6. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 4, characterized in that: Two frame plates (24) are fixedly mounted on the inner walls of the two insertion holes (131); a guide groove (25) is provided on one side of the frame plate (24); two guide blocks (26) are slidably connected to the inner wall of the guide groove (25); a connecting rod (27) is fixedly mounted on one side of the guide block (26); and one end of the connecting rod (27) away from the guide block (26) is fixedly connected to the outer wall of the arc clamping plate (21).

7. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 3, characterized in that: The horizontal adjustment mechanism (4) includes two first base plates (41) and two second base plates (42), the lower surfaces of the two first base plates (41) are fixedly connected to the upper surface of the probe station body (1), the upper surfaces of the two first base plates (41) are each provided with a first slide groove (43), the inner walls of the two first slide grooves (43) are each slidably connected to a first slider (44), the upper surface of one first slider (44) is fixedly connected to the lower surface of one second base plate (42), and one side of the two first base plates (41) is rotatably mounted with a first screw rod (45), and one first screw rod (45) passes through a first slide groove (43) and is threadedly rotatably connected to a first slider (44).

8. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 7, characterized in that: The upper surfaces of the two second bottom plates (42) are each provided with a second slide groove (46), the inner walls of the two second slide grooves (46) are slidably connected with a second slider (47), the upper surfaces of the two second sliders (47) are each fixedly mounted with a fixing frame (48), one end of one of the fixing frames (48) is fixedly connected to the lower surface of a base (11), and one side of the two second bottom plates (42) is rotatably mounted with a second screw rod (49), and one of the second screw rods (49) passes through a second slide groove (46) and is threadedly rotatably connected to a second slider (47).

9. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 3, characterized in that: The angle adjustment mechanism (5) comprises two U-shaped sleeves (51), one side of one of the U-shaped sleeves (51) is fixedly connected to one end of a connecting seat (12), the inner walls of the two U-shaped sleeves (51) are rotatably mounted with a rotating shaft (52), the outer walls of the two rotating shafts (52) are fixedly mounted with a connecting sleeve (53), the outer walls of the two connecting sleeves (53) are fixedly mounted with a connecting block (531), and one end of the connecting block (531) away from the connecting sleeve (53) is fixedly connected to one side of the probe mounting seat (13).

10. A method for solving the automatic needle alignment of semiconductor probe station equipment by RCM as claimed in claim 9, characterized in that: A worm wheel (54) is fixedly mounted on one end of the two rotating shafts (52), a support frame (55) is fixedly mounted on the other side of the two U-shaped sleeves (51), a worm (56) is rotatably mounted on the inner wall of the two support frames (55), the worm (56) is meshingly connected to the worm wheel (54), and an adjustment handle (57) is fixedly mounted on one end of the two worms (56).

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