HTCC ceramic tube shell cavity structure

Abstract

An HTCC ceramic tube shell cavity structure comprises a ceramic cavity which comprises a ceramic side wall and a ceramic bottom surface and forms a hollow structure used for packaging an electronic element; the metal pattern is arranged on the ceramic bottom surface and is used for forming a circuit connection path so as to realize electric connection between the electronic element and an external circuit; and the insulating layer is arranged at the connecting part of the ceramic bottom surface and the ceramic side wall and is used for separating the metal pattern from the edge and the corner of the ceramic cavity so as to prevent overplating at the edge and the corner of the cavity in the chemical plating process. According to the invention, overplating generated at the edge and corners of the cavity when the ceramic substrate is subjected to chemical nickel gold plating is solved, and the risks of insulation resistance reduction and short circuit are avoided. According to the HTCC ceramic tube shell cavity structure, the insulating layer is arranged at the joint of the ceramic bottom surface and the side wall, so that the overplating phenomenon generated at the edge and the corner of the cavity in the chemical plating process is effectively avoided, and the reliability and the stability of electronic component packaging are remarkably improved.

Description

Technical Field

[0001] The invention relates to an HTCC high temperature ceramic device, in particular to an HTCC ceramic tube shell cavity structure. Background Art

[0002] HTCC high temperature ceramic substrate is different from general PCB substrate. It can be used as a packaging shell with different shapes and features such as deep cavity, blind cavity and step. These features make it easy for gold seepage and climbing to occur on the inner wall of the ceramic cavity and the corners of the step during chemical plating.

[0003] The surface of HTCC ceramic tube shell generally needs to be plated with nickel and gold. When chemical nickel and gold plating or nickel-palladium and gold plating is used, for some more complex structures, due to the cavity structure of the product, areas with insufficient preliminary treatment are easily formed at the corners in the cavity, causing abnormal growth of electrodes at the edge of the wall, resulting in overflow plating or even cross-plating, which reduces the insulation resistance and even short circuits, causing product failure.

[0004] It should be noted that the information disclosed in the above background technology section is only used for understanding the background of the present application, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the invention

[0005] The main purpose of the present invention is to overcome the defects existing in the above-mentioned background technology and provide a HTCC ceramic tube shell cavity structure.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] A HTCC ceramic tube shell cavity structure, comprising:

[0008] A ceramic cavity, including a ceramic side wall and a ceramic bottom surface, forming a hollow structure for packaging electronic components;

[0009] A metal pattern, disposed on the ceramic bottom surface, for forming a circuit connection path to achieve electrical connection between the electronic component and an external circuit;

[0010] The insulating layer is arranged at the connection between the ceramic bottom surface and the ceramic side wall, and separates the metal pattern from the edge and corner of the ceramic cavity to prevent creep plating at the edge and corner of the cavity during the chemical plating process.

[0011] Furthermore, the insulating layer covers the metal pattern at the connection.

[0012] Furthermore, the metal pattern includes bonding fingers arranged inside the ceramic cavity, and a circle of insulating layer along the cavity wall covers the surface of the bonding fingers close to the ceramic cavity wall.

[0013] Furthermore, a circle of insulating layer along the cavity wall is arranged on the surface of the ceramic side wall.

[0014] Furthermore, the main component of the ceramic cavity is one or more of aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, and beryllium oxide.

[0015] Furthermore, the main component of the metal pattern is one or more of tungsten, molybdenum, manganese, gold, platinum and palladium.

[0016] Furthermore, the insulating layer material is the same as the ceramic cavity material, and the main component is one of aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, and beryllium oxide.

[0017] Furthermore, the insulating layer has an extension width of 10-300 microns and a thickness of 5-30 microns.

[0018] Furthermore, the surface of the metal pattern is plated with nickel-gold or nickel-palladium-gold.

[0019] Furthermore, the metal pattern extends to the inside of the ceramic body through the boundary line between the ceramic side wall and the ceramic bottom surface, and is connected to the external pad of the tube shell through the through hole and the internal circuit.

[0020] The present invention has the following beneficial effects:

[0021] The HTCC ceramic tube shell cavity structure of the present invention effectively avoids the creep plating phenomenon generated at the cavity edge and corner during the chemical plating process by arranging an insulating layer at the connection between the ceramic bottom surface and the side wall, thereby significantly improving the reliability and stability of the electronic component packaging. This design not only prevents the reduction of insulation resistance and potential short circuit risks caused by creep plating, but also enhances the bonding strength of the cavity wall edge and reduces the possibility of cracks at the edge of the metal pattern. In addition, the introduction of the insulating layer makes the chemical plating process more controllable, improves the consistency and durability of the product, especially in the face of complex structural design, the advantages of this structure are more obvious, and provides an effective technical solution for the application of HTCC ceramic tube shells in the field of high-performance electronic packaging.

[0022] Other beneficial effects of the embodiments of the present invention will be further described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figures 1A to 1C They are respectively a top view, a cross-sectional view and a stereoscopic view of the CLCC type ceramic tube shell structure of Example 1 of the present invention.

[0024] Figure 2 CBGA ceramic tube shell structure and stereogram of Example 2 of the present invention.

[0025] Figure 3CBGA ceramic tube shell structure and stereogram of Example 3 of the present invention.

[0026] Figure 4 This is the CLCC type ceramic tube shell structure and stereogram of comparative example 1. DETAILED DESCRIPTION

[0027] The following is a detailed description of the embodiments of the present invention. It should be emphasized that the following description is only exemplary and is not intended to limit the scope and application of the present invention.

[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, connection can be used for fixing as well as for coupling or communication.

[0029] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] See also Figures 1A to 3 The embodiment of the present invention provides a HTCC ceramic tube shell cavity structure, including a ceramic cavity 1, a metal pattern (which may include a bonding finger 2) and an insulating layer 3. The ceramic cavity 1 includes a ceramic side wall 11 and a ceramic bottom surface 12, forming a hollow structure for packaging electronic components such as chips. The metal pattern is arranged on the ceramic bottom surface 12 to form a circuit connection path to achieve electrical connection between the electronic components and the external circuit. The insulating layer is arranged at the connection between the ceramic bottom surface 12 and the ceramic side wall 11, separating the metal pattern from the edge and corner of the ceramic cavity 1 to prevent creep plating at the edge and corner of the cavity during the chemical plating process.

[0032] In some embodiments, the main component of the ceramic cavity 1 can be one or more of aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, and beryllium oxide. The metal pattern of the ceramic cavity 1 is formed by co-firing metal and ceramic, and the metal pattern can extend to the inside of the ceramic body through the boundary line between the ceramic side wall 11 and the ceramic bottom surface 12, and is connected to the external pad of the tube shell through the through hole and the internal circuit. The main component of the metal pattern can be one or more of tungsten, molybdenum, manganese, gold, platinum, and palladium. The surface of the metal pattern can be plated with nickel gold or nickel palladium gold.

[0033] In some embodiments, the insulating layer material is the same as the ceramic cavity 1 material, and the main component may be one of aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, and beryllium oxide.

[0034] like Figure 1C and Figure 2 As shown, in some embodiments, the insulating layer covers the metal pattern at the connection. The metal pattern includes a bonding finger 2 arranged inside the ceramic cavity 1, and a circle of insulating layer is arranged along the ceramic cavity wall, covering the surface of the bonding finger 2 close to the ceramic cavity wall. The extending width of the insulating layer is 10-300 microns, and the thickness is 5-30 microns.

[0035] like Figure 3 As shown, in some other embodiments, a circle of insulating layer along the cavity wall is disposed on the surface of the ceramic side wall 11 .

[0036] The HTCC ceramic tube shell cavity structure of the present invention significantly improves the reliability and stability of electronic component packaging through the design of the insulating layer. The structure sets an insulating layer at the connection between the bottom surface and the side wall of the ceramic cavity, which effectively isolates the metal pattern from the edge and corner of the cavity and prevents creep plating during the chemical plating process. This innovation avoids the reduction of insulation resistance and the risk of short circuit caused by creep plating, while improving the bonding strength of the edge of the cavity wall and reducing the risk of cracks at the edge of the metal pattern. In addition, the structure ensures that the creep plating ratio after chemical plating is extremely low, not exceeding 2‰, and ensures that the airtightness test 100% meets high standards, less than or equal to 1×10 -9 Pa·m 3 / s(He), thus providing a high-reliability technical solution for HTCC ceramic tube shells in the field of high-performance electronic packaging.

[0037] The specific embodiments of the present invention are further described below.

[0038] Example 1

[0039] A CLCC type ceramic tube shell structure; the ceramic material is 92% black alumina, the co-fired metal material used is tungsten, and the metal surface is plated with nickel, palladium and gold; a bonding finger is provided inside the cavity, and a circle of insulating layer is provided on the surface of the bonding finger along the cavity wall; the insulating layer material used is also black alumina, with a width of 50 microns parallel to the plane where the bonding finger is located and a thickness of 30 microns in the vertical direction. Figure 1A , Figure 1B and Figure 1C The top view, cross-sectional view and stereoscopic view of the CLCC ceramic tube shell structure of Example 1 are shown. The creep plating ratio of the product after chemical plating is 0, and the air tightness test is 100% less than 1×10 -9 Pa·m 3 / s(He).

[0040] Example 2

[0041] A CBGA type ceramic tube shell structure; the ceramic material is 92% black alumina, the co-fired metal material used is tungsten, and the metal surface is plated with nickel and gold; a bonding finger is arranged inside the cavity, and a circle of insulating layer is arranged on the surface of the bonding finger along the cavity wall; the insulating layer material used is also black alumina, the width parallel to the plane where the bonding finger is located is 300 microns, and the thickness in the vertical direction is 10 microns. Figure 2 The 3D diagram of the CBGA ceramic tube shell structure of Example 2 is shown. The creep plating ratio of the product after chemical plating is 0, and the air tightness test is 100% less than 1×10 -9 Pa·m 3 / s(He).

[0042] Example 3

[0043] A CBGA type ceramic tube shell structure; the ceramic material is 92% black alumina, the co-fired metal material used is tungsten, and the metal surface is plated with nickel and gold; a bonding finger is arranged inside the cavity, and there is no insulating layer on the surface of the bonding finger. A circle of insulating layer is arranged on the side wall of the cavity wall. The insulating layer material used is also black alumina, and the width parallel to the plane where the bonding finger is located is 10 microns, and the thickness in the vertical direction is 5 microns. Figure 4 The 3D diagram of the CBGA ceramic shell structure of Example 3 is shown. The creep plating ratio of the product after chemical plating is 2‰, and the air tightness test is 100% less than or equal to 1×10 -9 Pa·m 3 / s(He).

[0044] Comparative Example 1

[0045] A CLCC type ceramic tube shell structure; the ceramic material is 92% black alumina, the co-fired metal material used is tungsten, and the metal surface is plated with nickel and gold; bonding fingers are arranged inside the cavity, and the bonding finger surfaces have no insulating layer along the cavity wall. Figure 3The 3D diagram of the CLCC ceramic tube shell structure of Comparative Example 1 is shown. The creep plating ratio of the product after chemical plating is 3%, and the air tightness test is 3%>1×10 -9 Pa·m 3 / s(He).

[0046] Comparison of experimental results

[0047] Comparative Example 1 has no insulating layer, resulting in a 3% creep plating ratio and substandard air tightness. Compared with Comparative Example 1, Examples 1 and 2 achieve a 0% creep plating ratio after chemical plating by adding an insulating layer along the cavity wall on the bonding finger surface, and ensure that 100% of the air tightness meets high standards. Example 3 achieves a creep plating ratio of only 2‰ after chemical plating, and ensures that 100% of the air tightness meets high standards. The embodiments of the present invention significantly improve product reliability and stability.

[0048] The above content is a further detailed description of the present invention in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, without departing from the concept of the present invention, it can also make several substitutions or modifications to these described embodiments, and these substitutions or modifications should be regarded as belonging to the protection scope of the present invention. In the description of this specification, the description of the reference terms "an embodiment", "some embodiments", "preferred embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In the absence of mutual contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. Although the embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and modifications can be made herein without departing from the scope of protection of the patent application.

Claims

1. A HTCC ceramic tube shell cavity structure, characterized in that: include: A ceramic cavity, including a ceramic side wall and a ceramic bottom surface, forming a hollow structure for packaging electronic components; A metal pattern, disposed on the ceramic bottom surface, for forming a circuit connection path to achieve electrical connection between the electronic component and an external circuit; The insulating layer is arranged at the connection between the ceramic bottom surface and the ceramic side wall, and separates the metal pattern from the edge and corner of the ceramic cavity to prevent creep plating at the edge and corner of the cavity during the chemical plating process.

2. The HTCC ceramic tube shell cavity structure according to claim 1, characterized in that: The insulating layer covers the metal pattern at the connection.

3. The HTCC ceramic tube shell cavity structure according to claim 2, characterized in that: The metal pattern includes bonding fingers arranged inside the ceramic cavity, and a circle of insulating layer along the cavity wall covers the surface of the bonding fingers close to the ceramic cavity wall.

4. The HTCC ceramic tube shell cavity structure according to claim 1, characterized in that: A circle of insulating layer along the cavity wall is arranged on the surface of the ceramic side wall.

5. The HTCC ceramic tube shell cavity structure according to any one of claims 1 to 4, characterized in that: The main component of the ceramic cavity is one or more of aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, and beryllium oxide.

6. The HTCC ceramic tube shell cavity structure according to any one of claims 1 to 4, characterized in that: The main component of the metal pattern is one or more of tungsten, molybdenum, manganese, gold, platinum and palladium.

7. The HTCC ceramic tube shell cavity structure according to any one of claims 1 to 4, characterized in that: The insulating layer material is the same as the ceramic cavity material, and the main component is one of aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, and beryllium oxide.

8. The HTCC ceramic tube shell cavity structure according to any one of claims 1 to 7, characterized in that: The insulating layer has an extension width of 10-300 microns and a thickness of 5-30 microns.

9. The HTCC ceramic tube shell cavity structure according to any one of claims 1 to 7, characterized in that: The surface of the metal pattern is plated with nickel-gold or nickel-palladium-gold.

10. The HTCC ceramic tube shell cavity structure according to any one of claims 1 to 7, characterized in that: The metal pattern extends to the inside of the ceramic body through the boundary line between the ceramic side wall and the ceramic bottom surface, and is connected to the external welding pad of the tube shell through the through hole and the internal circuit.

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