Novel integrated circuit copper needle packaging product

Abstract

The invention discloses a novel integrated circuit copper needle packaging product, and belongs to the technical field of integrated circuit copper needle packaging. The novel integrated circuit copper needle packaging product comprises a copper needle unit module, and during preparation of the copper needle unit module, firstly, a copper foil is provided; solder paste is printed on the upper surface of the copper foil, and pre-arranged copper needles are placed on the upper surface of the copper foil after the solder paste is brushed; and welding the copper needle on the copper foil on the surface of the copper foil through a reflow soldering procedure. The solder paste is brushed on the surface of the copper foil to plant the copper column, and the solder paste needs to be ground during mass transfer, so that the problem of poor welding does not need to be worried; the problem of alignment is not considered, and the process difficulty is reduced; the thickness of the copper foil can be 75-100 microns, the price is low, and the grinding process is simple.

Description

Technical Field

[0001] The invention belongs to the technical field of integrated circuit copper pin packaging, and in particular relates to a novel integrated circuit copper pin packaging product. Background Art

[0002] In integrated circuit packaging testing, copper needles can be used as external terminals of IC. Specifically, copper needles can lead out the internal circuit of IC, and can also serve as a conductive bridge connecting micro integrated circuit chips and test circuits. IC chips can be quickly and accurately transferred to test equipment through high-precision equipment to meet the needs of integrated circuit mass production testing. This process is crucial to achieving high-efficiency and high-reliability integrated circuit testing.

[0003] However, in many current packaging tests, each package strip requires a large number of copper pins (approximately between 50,000 and 100,000), and the traditional pick and place mode is too inefficient. Currently, the large number of copper pin transfer solutions requires high cost investment and also leads to a loss of yield. Summary of the invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the structure of the pre-implanted needle module of the present invention can effectively improve the working efficiency through tape packaging, and the yield of the pre-implanted needle module will also be greatly improved, because it will be inspected before mounting, and it is not easy to have problems such as copper column tilting and poor welding.

[0005] In order to achieve the above object, the following technical solution is adopted: The present invention provides a novel integrated circuit copper pin packaging product, including a copper pin unit module. When the copper pin unit module is prepared:

[0006] First, provide copper foil;

[0007] Printing solder paste on the upper surface of the copper foil;

[0008] Pre-arranged copper needles are placed on the upper surface of the copper foil after the solder paste is applied;

[0009] The copper pins on the copper foil are soldered to the surface of the copper foil through a reflow soldering procedure.

[0010] Furthermore, the copper needle unit module comprises:

[0011] Copper foil;

[0012] A copper needle is disposed on the copper foil.

[0013] Furthermore, when preparing the packaged product:

[0014] First, a substrate is provided;

[0015] Adhere a chip on the substrate;

[0016] Adhere the copper needle unit module on the substrate;

[0017] Filling packaging material around the copper needle unit module and the flip chip;

[0018] Grinding is performed on the top of the packaging material to remove the copper foil of the copper needle unit module, exposing the copper needles, and obtaining the packaging product.

[0019] Furthermore, the copper foil is cut into single copper pin unit modules after the reflow process.

[0020] Furthermore, the copper needle unit module is packaged into a reel by a conventional pick-and-place method to obtain a pre-implanted needle module.

[0021] Furthermore, the pre-implantation needle module comprises:

[0022] Copper needle unit module;

[0023] A tape disposed at the bottom of the copper needle unit module;

[0024] An upper cover is arranged on the copper needle unit module and the upper part of the winding tape.

[0025] Furthermore, the copper needle is adhered to the surface of the copper foil by external force and the adhesion of solder paste.

[0026] Furthermore, the copper needles are pre-arranged on an array jig, and the array jig is moved away after placing the pre-arranged copper needles on the upper surface of the copper foil to perform a reflow soldering procedure.

[0027] Furthermore, the copper foil has a thickness of 75 to 100 μm.

[0028] Furthermore, adhering a chip on the substrate includes flipping the chip on the substrate.

[0029] The beneficial effects of the present invention are:

[0030] (1) The present invention applies solder paste to the surface of the copper foil to plant the copper pillars. Since the copper pillars need to be ground off when transferring a large amount, there is no need to worry about poor welding.

[0031] (2) The present invention does not need to consider the problem of alignment, thus reducing the process difficulty;

[0032] (3) The copper foil of the present invention can have a thickness of 75 to 100 μm, is cheap, and has a simple grinding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1a-1d It is a schematic diagram of the packaging process of the novel integrated circuit copper pin packaging product of the present invention;

[0034] Figure 2a-2e A schematic diagram of the process for preparing a copper needle unit module;

[0035] Figure 3a-3d Schematic diagram of the packaging process for preparing packaged products through traditional needle implant mass transfer.

[0036] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0037] Legend: 1. Substrate; 2. Copper needle; 3. Chip; 4. Packaging material; 5. Copper needle unit module; 501. Copper foil; 502. Solder paste; 503. Copper needle; 504. Arrangement fixture; 6. Top cover; 7. Tape; 8. Copper pillar. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0039] Unless otherwise defined, all professional and scientific terms used herein have the same meanings as those familiar to those skilled in the art. In addition, any methods and materials similar or equivalent to those described herein may be applied to the present invention. The preferred implementation methods and materials described herein are for demonstration purposes only and are not intended to limit the content of this application.

[0040] Example 1

[0041] New integrated circuit copper pin packaging products

[0042] The packaged product includes a copper pin unit module 5, such as Figure 2a-2e As shown, during the preparation of the copper needle unit module 5:

[0043] First, provide copper foil 501;

[0044] The copper foil 501 may have a thickness of 75 to 100 μm;

[0045] like Figure 2a As shown, solder paste 502 is printed on the upper surface of the copper foil 501;

[0046] like Figure 2b As shown, after the solder paste 502 is applied, pre-arranged copper needles 503 are placed on the upper surface of the copper foil 501;

[0047] The copper needle 503 is adhered to the surface of the copper foil 501 by the external force and the adhesion of the solder paste 502;

[0048] like Figure 2b As shown, the copper needles 503 are pre-arranged on an array jig 504, and the array jig 504 is moved away after placing the pre-arranged copper needles 503 on the upper surface of the copper foil 501 and then performing a reflow soldering procedure;

[0049] Soldering the copper needles 503 on the copper foil 501 to the surface of the copper foil 501 through a reflow soldering process;

[0050] like Figure 2d As shown, the copper needle unit module 5 is obtained by cutting into pieces;

[0051] The copper needle unit module 5 comprises:

[0052] Copper foil 501;

[0053] A copper needle 503 disposed on the copper foil 501;

[0054] Cutting the copper foil 501 into single copper needle unit modules 5 after the reflow process;

[0055] The copper needle unit module 5 is packaged into a reel 7 by a conventional pick-and-place method to obtain a Figure 2e The pre-implanted needle module shown.

[0056] like Figure 2e As shown, the pre-implantation needle module includes:

[0057] Copper needle unit module 5;

[0058] A tape 7 arranged at the bottom of the copper needle unit module 5;

[0059] An upper cover 6 is arranged on the upper part of the copper needle unit module 5 and the winding tape 7 .

[0060] like Figure 1a-1c As shown, during the preparation of the packaged product:

[0061] First, a substrate 1 is provided, and the substrate 1 can be a substrate, a carrier board, or a PCB board, but is not limited thereto;

[0062] like Figure 1a As shown, a chip 3 is adhered on the substrate 1, and the chip 3 can be a flip chip, but is not limited thereto;

[0063] like Figure 1b As shown, a copper needle unit module 5 is adhered on the substrate 1;

[0064] like Figure 1cAs shown, the packaging material 4 is filled around the copper needle unit module 5 and the chip 3;

[0065] like Figure 1d As shown, the top of the packaging material 4 is ground to remove the copper foil 501 of the copper needle unit module 5 to expose the copper needle 503, thereby obtaining the integrated circuit packaging product.

[0066] Comparative Example 1

[0067] Reference Figure 3a-3d The packaging process of the packaged product prepared by traditional needle mass transfer includes:

[0068] First, a substrate 1 is provided;

[0069] like Figure 3a As shown, a copper column 8 is planted on the substrate 1;

[0070] like Figure 3b As shown, a chip 3 is adhered on the substrate 1, and the chip 3 can be a flip chip, but is not limited thereto;

[0071] like Figure 3c As shown, the packaging material 4 is filled around the copper pillar 8 and the chip 3;

[0072] like Figure 3d As shown, the top of the packaging material 4 is ground until the chip 3 is exposed to obtain a packaged product.

[0073] Results Analysis

[0074] By comparing Example 1 with Comparative Example 1, it can be found that:

[0075] The present invention applies solder paste to the surface of the copper foil to plant the copper pillars. Since the copper pillars need to be ground off when transferring a large amount, there is no need to worry about poor welding.

[0076] The present invention does not need to consider the problem of alignment, thus reducing the difficulty of the process;

[0077] The copper foil of the present invention can have a thickness of 75 to 100 μm, is cheap, and has a simple grinding process.

[0078] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0079] The present invention and its implementation methods are described above, which is not restrictive. The drawings are only one of the implementation methods of the present invention, and the actual application is not limited thereto. In short, if ordinary technicians in the field are inspired by it and design methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention, they should all fall within the protection scope of the present invention.

Claims

1. New integrated circuit copper pin packaging product, characterized by: It comprises a copper needle unit module, and when the copper needle unit module is prepared: First, provide copper foil; Printing solder paste on the upper surface of the copper foil; Pre-arranged copper needles are placed on the upper surface of the copper foil after the solder paste is applied; The copper pins on the copper foil are soldered to the surface of the copper foil through a reflow soldering process.

2. The novel integrated circuit copper pin packaging product according to claim 1 is characterized in that: The copper needle unit module comprises: Copper foil; A copper needle is disposed on the copper foil.

3. The novel integrated circuit copper pin packaging product according to claim 2 is characterized in that: When preparing the packaged product: First, a substrate is provided; Adhere a chip on the substrate; Adhere the copper needle unit module on the substrate; Filling packaging material around the copper needle unit module and the chip; Grinding is performed on the top of the packaging material to remove the copper foil of the copper needle unit module, exposing the copper needles, and obtaining the packaging product.

4. The novel integrated circuit copper pin packaging product according to claim 1 is characterized in that: The copper foil is cut into individual copper pin unit modules after the reflow process.

5. The novel integrated circuit copper pin packaging product according to claim 4 is characterized in that: The copper needle unit module is packaged into a reel by pick-and-place placement to obtain a pre-implanted needle module.

6. The novel integrated circuit copper pin packaging product according to claim 5 is characterized in that: The pre-implantation needle module comprises: Copper needle unit module; A tape disposed at the bottom of the copper needle unit module; An upper cover is arranged on the copper needle unit module and the upper part of the winding tape.

7. The novel integrated circuit copper pin packaging product according to claim 1 is characterized in that: The copper needle is adhered to the surface of the copper foil by external force and the adhesion of solder paste.

8. The novel integrated circuit copper pin packaging product according to claim 1 is characterized in that: The copper needles are pre-arranged on an array jig, and the array jig is moved away after placing the pre-arranged copper needles on the upper surface of the copper foil to perform a reflow soldering procedure.

9. The novel integrated circuit copper pin packaging product according to claim 1 is characterized in that: The copper foil has a thickness of 75 to 100 μm.

10. The novel integrated circuit copper pin packaging product according to claim 3 is characterized in that: Adhering a chip to the substrate includes flipping the chip on the substrate.

Images