Floating polishing device and method assisted by gas-liquid array jet flow

Abstract

The invention provides a floating polishing device and method assisted by gas-liquid array jet flow, and relates to the technical field of polishing equipment. Comprising a base frame, a polishing box is arranged on the base frame, a polishing disc is arranged in the polishing box, a plurality of annular grooves are formed in the upper end face of the polishing disc in a concentric circle mode, a set of annular jet flow holes are formed in the ridge of each groove, and a fixed distance is formed between every two adjacent holes; a floatable sample piece clamping device is arranged above the polishing disc, and the device is matched with a vertical through groove through a connecting rod to have an axial degree of freedom; a jet device is arranged below the polishing disc; a base is arranged in the polishing box, a rotary table is fixed to the base and connected with a rotary disc, the polishing disc is arranged on the rotary disc, the rotary disc is provided with a concave part, the upper end of the rotary disc is connected with the polishing disc to form a jet flow cavity, the jet flow cavity is connected with a pressurizing device, and jet flow holes penetrate through the polishing disc to be communicated with the jet flow cavity. Compared with the prior art, rough polishing, fine polishing and atomic-scale polishing can be achieved, the polishing working steps and time are greatly reduced, and the equipment cost is saved.

Description

Technical Field

[0001] The invention relates to the technical field of polishing equipment, and in particular to a floating polishing device and method assisted by a gas-liquid array jet. Background Art

[0002] The development of polishing equipment involves a wide range of evolution from traditional manual polishing to modern automated equipment. At first, polishing technology relied on manual operation to finely polish the surface through abrasives and tools. With the development of industrialization, this process gradually turned to mechanization, forming a variety of polishing methods. Among them, floating polishing and jet polishing are two common non-contact polishing technologies, each of which has its own advantages in different working conditions.

[0003] Floating polishing is a non-contact ultra-precision polishing method that can obtain sub-nanometer roughness and atomic-level flat surfaces. Its working principle mainly relies on a polishing machine with high rotation accuracy. This polishing machine uses a tin polishing disc with high flatness and concentric or spiral grooves. During the polishing process, the polishing liquid covers the entire surface of the polishing disc. When the polishing disc and the workpiece rotate at a relatively high speed under non-contact conditions with a micron gap, the polishing liquid between the two is in a dynamic pressure fluid state. The formed liquid film further supports the polished workpiece and reaches a force balance state. The abrasive particles in the polishing liquid interact with the atoms on the surface of the workpiece material under the action of the fluid force, thereby realizing non-contact polishing of the surface of the workpiece to be polished. The advantage of this method is that there is no plastic deformation on the surface of the workpiece, and no defects such as lattice translocation are generated. It is extremely effective for processing functional crystal materials. In addition, since there is no friction heat and tool wear during the processing process, a polished surface with atomic-level precision can be obtained, which is common in fields with high precision requirements, such as optical lenses and semiconductor manufacturing. However, floating polishing has disadvantages such as low polishing efficiency, long cycle, and high cost, which limits its application scenarios.

[0004] Jet polishing is also a non-contact polishing technology, and water jet polishing and air jet polishing are common. The principle of water jet polishing is to use the polishing liquid mixed with fine abrasive particles sprayed out at high speed from the nozzle hole to act on the surface of the workpiece, and the high-speed collision and shearing effect of the abrasive particles is used to achieve the effect of grinding and removing materials. By controlling the process parameters such as pressure, angle and spraying time of the polishing liquid during spraying, the roughness of the workpiece surface can be quantitatively corrected to achieve the purpose of polishing. The air jet is based on the water jet. Through the "gas-liquid replacement" of the water jet, the nozzle and the workpiece to be polished are immersed in the polishing liquid together. The small nozzle sprays out pressurized gas, and the generated air flow beam is sucked to drive the abrasive in the polishing liquid to act on the surface of the target workpiece to achieve material removal. Compared with water jets, air jets can achieve hundreds of times higher material removal efficiency. Jet polishing technology combines fluid mechanics and surface technology, and has the advantages of low cutting force, no thermal deformation, no pollution, high material utilization, and can polish almost all materials and geometric shapes. Especially in the precision polishing of tiny and complex curved parts, jet polishing technology has unparalleled flexibility compared with other traditional technologies, but compared with floating polishing, jet polishing has slight limitations in the accuracy of the polished surface.

[0005] Floating polishing provides excellent surface uniformity, adaptability and high surface quality, but requires a high initial surface quality. Poor initial surface quality will lead to long polishing time and difficulty in obtaining the final atomic-level surface accuracy. Existing air jet and water jet polishing technologies have much higher removal rates than floating polishing, but are usually used for fixed-point polishing of workpiece surfaces. To achieve large-area polishing, it is necessary to use a path trajectory to scan the entire workpiece surface, which makes it difficult to directly achieve large-area polishing of the workpiece. In order to overcome the shortcomings of the above-mentioned technologies and to achieve the integration of large-area rough polishing, fine polishing and atomic-level polishing of planar samples, this paper proposes a floating polishing device assisted by a gas-liquid array jet. The device combines the high efficiency of gas-liquid jet polishing with the uniformity and high precision of floating polishing, and realizes integrated polishing of different polishing stages of the same workpiece.

[0006] The development of this device can not only greatly improve polishing efficiency and polishing accuracy, but also reduce polishing costs. It is expected to become a technological innovation with important application prospects in the modern industrial field. Summary of the invention

[0007] The purpose of the present invention is to provide a floating polishing device and method assisted by a gas-liquid array jet, which has a simple structure and is easy to use. The same device can complete multi-stage one-time polishing, greatly reducing the polishing work steps and time, and saving equipment costs.

[0008] The embodiment of the present invention is achieved as follows:

[0009] An embodiment of the present application provides a floating polishing device assisted by a gas-liquid array jet, which includes a polishing box arranged on a base frame, a polishing disc arranged in the polishing box, a plurality of annular grooves arranged in concentric circles on the upper end surface of the polishing disc, a group of annular jet holes arranged on the ridge of each groove, and a fixed distance between each hole; a floating sample clamping device is arranged above the polishing disc, and the device has axial freedom through the cooperation of a connecting rod and a vertical through groove; a jet device is arranged below the polishing disc, and the jet device includes a jet chamber and a pressurizing device; a base is arranged in the polishing box, a turntable is fixed on the base, a rotating disc is connected to the turntable, the polishing disc is arranged on the rotating disc, the rotating disc has a recessed portion, and the upper end is connected to the polishing disc to form a jet chamber, the jet chamber is connected to the pressurizing device through a rotating joint, and the jet hole passes through the polishing disc and is connected to the jet chamber.

[0010] In some embodiments of the present invention, a plurality of annular grooves are arranged on the polishing disc in the form of concentric circles, the spacing between two annular grooves is set to be the same, and the jet hole group is arranged on the groove ridge of the annular groove.

[0011] In some embodiments of the present invention, the annular groove and the jet hole group on the polishing plate have a range of at least 200 mm in diameter; and the distance between two holes on each ring group of all jet holes is the same.

[0012] In some embodiments of the present invention, the intervals between each group of the jet hole ring groups are arranged to be the same, and the interval between two holes in any ring group is a fixed value array.

[0013] In some embodiments of the present invention, a horizontal movable frame is fixed on the above-mentioned base frame; a horizontal slide rail is provided on the above-mentioned horizontal movable frame, and the above-mentioned horizontal slide rail is slidably connected to the vertical movable frame; a vertical slide rail is provided on the above-mentioned vertical movable frame, and the above-mentioned vertical slide rail is slidably connected to the main shaft rotating device; the above-mentioned main shaft rotating device is connected to a floating sample clamping device, which includes a coupling rod, a connecting rod, and a clamping seat; the above-mentioned coupling rod is connected to the clamping seat through a connecting rod, and the above-mentioned clamping seat can clamp the sample.

[0014] In some embodiments of the present invention, a rotating motor is arranged on the spindle rotating device, and the output end of the rotating motor is connected to the coupling rod; the coupling rod is sleeved with the clamping seat through a connecting rod, and vertical through grooves are arranged on both sides of the top of the clamping seat, and the connecting rod passes through the vertical through grooves and comes out from the outside thereof.

[0015] The present application provides a gas-liquid array jet-assisted floating polishing method, which includes the following steps:

[0016] Step 1: Determine the workpiece to be polished and the expected polishing degree;

[0017] Step 2: Adjust the clamping device to clamp the workpiece to be polished;

[0018] Step 3, determining the polishing time of gas array jet assisted floating polishing, liquid array jet assisted floating polishing and floating polishing, using a pressurizing device to pressurize the fluid, and starting segmented polishing through gas array jet assisted floating polishing, liquid array jet assisted floating polishing and floating polishing;

[0019] Step 4: Monitor the polishing degree of the workpiece to be polished and complete the polishing.

[0020] In some embodiments of the present invention, in the above step three, the polishing time for rough polishing using gas array jet assisted floating polishing, fine polishing using liquid array jet assisted floating polishing, and atomic level polishing using floating polishing is selected according to the roughness of the workpiece to be polished.

[0021] In some embodiments of the present invention, in the above step 4, the polishing degree of the polished part is judged and monitored according to the smoothness and roughness of the polished part by the clamping device.

[0022] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0023] The polishing equipment on the market has relatively single functions. The same polishing equipment cannot take into account the rough polishing, fine polishing and atomic-level polishing of the polished parts, and cannot meet the one-time polishing requirements. The present invention provides a gas-liquid array jet-assisted floating polishing device, which includes a polishing box arranged on a base frame, a polishing disc arranged in the polishing box, and a plurality of annular grooves arranged concentrically on the upper end surface of the polishing disc, and a group of annular jet holes are arranged on the groove ridge of each groove, and each hole has a fixed distance; a floating sample clamping device is arranged above the polishing disc, and the device has axial freedom through the cooperation of a connecting rod and a vertical through groove; a jet device is arranged below the polishing disc, and the jet device includes a jet cavity and a pressurizing device; a base is arranged in the polishing box, a turntable is fixed on the base, a rotating disc is connected to the turntable, the polishing disc is arranged on the rotating disc, a recessed portion is stored in the rotating disc, and the upper end is connected to the polishing disc to form a jet cavity, the jet cavity is connected to the pressurizing device through a rotary joint, and the jet hole passes through the polishing disc and communicates with the jet cavity.

[0024] The present invention provides a jet hole group, and gas and liquid fluids are pressurized in the jet cavity by a pressurizing device and then ejected through the jet holes. The polishing liquid is injected above the polishing disk and slightly covers the surface of the workpiece. The motor below drives the polishing disk to rotate. The microstructure on the polishing disk generates fluid dynamic pressure when it rotates, and with the assistance of the array jet, drives the floating clamping device to float and perform non-contact polishing with the sample surface. The jet work of the two modes of gas and liquid jets, combined with the floating polishing with a microstructure polishing disk, can enable the device to switch between rough polishing, fine polishing and atomic-level polishing during work, so that the same device can complete one-time polishing, greatly reducing the polishing steps and time, and saving equipment costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 is a three-dimensional structural diagram of an embodiment of the present invention;

[0027] Figure 2 A top view of a polishing disc according to an embodiment of the present invention;

[0028] Figure 3 is a cross-sectional view of a polishing disc according to an embodiment of the present invention;

[0029] Figure 4 It is a front view of the floating sample clamping device according to an embodiment of the present invention;

[0030] Figure 5 A cross-sectional view of a floating sample clamping device according to an embodiment of the present invention;

[0031] Figure 6 A partial cross-sectional view of a polishing disc according to an embodiment of the present invention;

[0032] Figure 7 It is a cross-sectional view of the annular ball rolling groove according to an embodiment of the present invention.

[0033] Icons: 1. Base frame; 2. Polishing box; 3. Polishing disc; 4. Jet hole; 5. Rotating disc; 6. Recessed portion; 7. Annular groove; 8. Annular fence; 9. Through slot; 10. Horizontal movable frame; 11. Horizontal slide rail; 12. Vertical movable frame; 13. Vertical slide rail; 14. Coupling rod; 15. Clamping seat; 16. Connecting rod; 17. Vertical through slot; 18. Rotating motor; 19. Sliding ball; 20. Annular ball slot; 21. Auxiliary fixing frame; 22. Telescopic connecting rod; 23. Slide slot. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Example:

[0037] Please refer to Figure 1-5 The present embodiment provides a gas-liquid array jet-assisted floating polishing device, which includes a polishing box 2 arranged on a base frame 1, a polishing disc 3 arranged in the polishing box 2, and a plurality of annular grooves 7 are arranged concentrically on the upper end surface of the polishing disc 3. A group of annular jet holes 4 are arranged on the ridge of each annular groove 7, and each hole has a fixed distance; a floating clamping device is arranged above the polishing disc 3, and the device has axial freedom through the cooperation of a connecting rod 16 and a vertical through groove 17, and a jet device is arranged below the polishing disc 3, and the jet device includes a jet cavity and a fluid pressurizing device; a base is arranged in the polishing box 2, a turntable is fixed on the base, a rotating disc 5 is connected to the turntable, the polishing disc 3 is arranged on the rotating disc 5, and a recessed portion 6 is present in the rotating disc 5, and the upper end is connected to the polishing disc to form a jet cavity, and the jet cavity is connected to the pressurizing device through a rotary joint, and the jet hole 4 passes through the polishing disc 3 and is connected to the jet cavity.

[0038] The polishing equipment on the market has relatively single functions. The same polishing equipment cannot take into account both the rough polishing and fine polishing of the polished parts, and cannot meet the polishing requirements. The present invention sets a jet hole group, and the gas and liquid jets enter the recessed part 6 after the gas and liquid tanks are pressurized by the pressure device, and are ejected through the jet hole 4. The polishing liquid is injected above the polishing disk 3 and slightly covers the surface of the workpiece. The motor below drives the polishing disk 3 to rotate. The microstructure on the polishing disk 3 generates fluid dynamic pressure during its rotation, and with the assistance of the array jet, drives the floating clamping tool to float and perform non-contact polishing with the disk surface. The two jets of gas and liquid work, in conjunction with the polishing disk 3, so that the device can switch between rough polishing, fine polishing and atomic-level polishing during work, so that the same device can complete one-time polishing, greatly reducing the steps and time of polishing work, and saving equipment costs.

[0039] In some embodiments of the present invention, at least 30 circles of jet hole groups are arranged on the polishing disc 3; on each jet hole group, the spacing between adjacent jet holes 4 is 2π. At least 30 circles of jet hole groups, with the same spacing between adjacent jet holes 4, make the jet holes 4 more uniform, so that the device can adapt to various different workpieces to be polished and effectively polish them.

[0040] In some embodiments of the present invention, the jet holes 4 are inclined along the tangent direction of the concentric circles, and the inclination directions of the three adjacent jet holes 4 in the same jet hole group are different, which can effectively avoid the confluence of the gas and liquid flows ejected from the jet holes 4 and cause unnecessary displacement of the polishing workpiece.

[0041] In some embodiments of the present invention, a plurality of annular grooves 7 are concentrically arranged on the top of the polishing disc 3, and the jet holes 4 are arranged on the groove ridges of the annular grooves 7. The jet holes 4 are arranged on the groove ridges of the annular grooves 7, so that the groove wall of the annular groove 7 can effectively form an upward focusing effect on the gas and liquid flow, and better exert the polishing and auxiliary effects of the gas and liquid jets on the workpiece surface.

[0042] like Figure 6 As shown, further, the top ends of the inner and outer sides of the annular groove 7 are inclined from the outside to the inside, which can effectively prevent the water from forming a water film due to tension to hinder the running-in, and the water retained in the groove can effectively cooperate with the jet to polish the material.

[0043] In some embodiments of the present invention, a circular fence 8 is provided on the top of the polishing disc 3, and the jet hole 4 is provided inside the circular fence 8; a plurality of through grooves 9 are provided around the bottom of the circular fence 8. The arrangement of the circular fence 8 and the through grooves 9 enable the liquid flow on the polishing disc 3 to be retained to a certain extent without causing accumulation.

[0044] like Figure 7 As shown, further, an auxiliary fixing frame 21 is arranged above the polishing disc 3, a telescopic connecting rod 22 is arranged at the bottom of the auxiliary fixing frame 21, and a slide groove 23 is arranged at the bottom of the telescopic connecting rod 22; the upper end of the circular fence 8 is slidably connected with the slide groove 23, and a plurality of sliding balls 19 are arranged in a ring at the lower end of the circular fence 8; an annular ball groove 20 is arranged on the outer side of the polishing disc 3, and the sliding balls 19 are adapted to the annular ball groove 20. The setting of the telescopic connecting rod 22 allows the staff to well control the distance between the circular fence 8 and the polishing disc 3 to adjust the liquid accumulation above the polishing disc 3. The circular fence 8 effectively achieves a buffer between the two through the slide groove 23 and the telescopic connecting rod 22, reducing the equipment loss caused by hard contact; at the same time, when the degree of liquid accumulation is different, it can effectively achieve self-adjustment according to the degree of liquid accumulation, and has strong adaptability.

[0045] In some embodiments of the present invention, a horizontal moving frame 10 is fixed on the base frame, and a horizontal slide rail 11 is arranged on the horizontal moving frame 10. The horizontal slide rail 11 is slidably connected to the vertical moving frame 12, and a vertical slide rail 13 is arranged on the vertical moving frame 12. The vertical slide rail 13 is slidably connected to the main shaft rotation device, and the main shaft rotation device is connected to the floating clamping device; it includes a coupling rod 14, a connecting rod 16, and a clamping seat 15. The coupling rod 14 is sleeved on the clamping seat 15 through the connecting rod 16, and vertical through grooves 17 are arranged on both sides of the top of the clamping seat 15. The horizontal rod 16 passes through the vertical through groove 17 and is located on the outside. The sample to be polished can be pasted to the bottom of the abutment sleeve 15 through paraffin; linear motion motors are arranged on both the horizontal slide rail 11 and the vertical slide rail 13. A rotating motor 18 is arranged on the main shaft rotating device, and the output end of the rotating motor 18 is connected to the coupling rod 14; the floating clamping device has an axial floating space to adapt to the height of the polishing liquid level in the polishing box 2, so that the abrasive particles in the polishing liquid can better contact with the surface of the sample; the sample clamping device is driven by the rotating motor 18 to rotate, and the horizontal moving frame 10 and the vertical moving frame 12 cooperate to realize its position adjustment and lateral reciprocating movement.

[0046] The present application provides a gas-liquid jet floating polishing method, which includes the following steps:

[0047] Step 1: Determine the workpiece to be polished and the expected polishing degree;

[0048] Step 2: Adjust the clamping device to clamp the workpiece to be polished;

[0049] Step 3, determining the polishing time of gas array jet assisted floating polishing, liquid array jet assisted floating polishing and floating polishing, using a pressurizing device to pressurize the fluid, and starting segmented polishing through gas array jet assisted floating polishing, liquid array jet assisted floating polishing and floating polishing;

[0050] Step 4: Monitor the polishing degree of the workpiece to be polished and complete the polishing.

[0051] In some embodiments of the present invention, in the above step three, the polishing time for rough polishing using gas array jet assisted floating polishing, fine polishing using liquid array jet assisted floating polishing, and atomic level polishing using floating polishing is selected according to the roughness of the workpiece to be polished.

[0052] In some embodiments of the present invention, in step 4, the polishing degree of the polished workpiece is judged and monitored according to the finish and roughness of the polished workpiece by the clamping device. Further, pressure sensors can be set at the bottom of the clamping seat 15 and the side of the vertical through groove 17, so as to well monitor the force feedback of the workpiece to be polished during the polishing work and realize real-time monitoring of the polishing degree.

[0053] In summary, the embodiment of the present invention is a gas-liquid array jet-assisted floating polishing device, which includes a polishing box 2 arranged on a base frame 1, a polishing disc 3 is arranged in the polishing box 2, and a plurality of annular grooves 7 are arranged on the upper end surface of the polishing disc 3 in a concentric circle, and a group of annular jet holes 4 are arranged on the groove ridge of each groove 7, and each hole has a fixed distance; a floating clamping device is arranged above the polishing disc 3, and the device has an axial degree of freedom through the cooperation of a connecting rod 16 and a vertical through groove 17, and a jet device is arranged below the polishing disc 3, and the jet device includes a jet cavity and A fluid pressurizing device; a base is arranged in the polishing box 2, a turntable is fixed on the base, a rotating disk 5 is connected to the turntable, a polishing disk 3 is arranged on the rotating disk 5, a recess 6 is provided on the rotating disk 5, and the upper end is connected to the polishing disk to form a jet cavity, the jet cavity is connected to the pressurizing device through a rotary joint, and a jet hole 4 passes through the polishing disk 3 and is connected to the jet cavity; compared with the prior art, it has a simple structure and is easy to use, and can achieve the transformation from rough polishing, fine polishing to atomic-level polishing with the same equipment, greatly reducing the polishing work steps and time, and saving equipment costs.

[0054] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A floating polishing device assisted by a gas-liquid array jet, characterized in that: It includes a base frame, on which a polishing box is arranged, in which a polishing disc is arranged, and the upper end surface of the polishing disc is concentrically provided with a plurality of annular grooves, on the ridge of each groove a group of annular jet holes are arranged, and each hole has a fixed distance; a floating sample clamping device is arranged above the polishing disc, and the device has axial freedom through the cooperation of a connecting rod and a vertical through groove; a jet device is arranged below the polishing disc, and the jet device includes a jet chamber and a pressurizing device; a base is arranged in the polishing box, on which a turntable is fixed, and a rotating disc is connected to the turntable, and a recessed portion is present on the rotating disc, and the upper end is connected to the polishing disc to form a jet chamber, and the jet chamber is connected to the pressurizing device through a rotating joint; the jet hole passes through the polishing disc and is connected to the jet chamber.

2. The gas-liquid array jet-assisted floating polishing device according to claim 1, characterized in that: The polishing disc is provided with a plurality of annular grooves in the form of concentric circles, the spacing between two annular grooves is set to be the same, and the jet hole group is arranged on the groove ridge of the annular groove.

3. The floating polishing device assisted by gas-liquid array jet according to claim 2, characterized in that: The annular groove and the jet hole group on the polishing plate have a range of at least 200 mm in diameter; the distance between two holes on each ring group of all jet holes is the same.

4. The gas-liquid array jet-assisted floating polishing device according to claim 3, characterized in that: The intervals between each group of the jet hole ring groups are arranged to be the same, and the interval between two holes in any ring group is a fixed value array.

5. The gas-liquid array jet assisted floating polishing device according to claim 1, characterized in that: A horizontal movable frame is fixed on the base frame; a horizontal slide rail is provided on the horizontal movable frame, and the horizontal slide rail is slidably connected to the vertical movable frame; a vertical slide rail is provided on the vertical movable frame, and the vertical slide rail is slidably connected to the main shaft rotating device; the main shaft rotating device is connected to a floating sample clamping device, which includes a coupling rod, a connecting rod, and a clamping seat; the coupling rod is connected to the clamping seat via a connecting rod, and the clamping seat can clamp the sample.

6. The gas-liquid array jet assisted floating polishing device according to claim 5, characterized in that: A rotating motor is arranged on the main shaft rotating device, and the output end of the rotating motor is connected to the coupling rod; the coupling rod is sleeved with the clamping seat through a connecting rod, and vertical through grooves are arranged on both sides of the top of the clamping seat, and the connecting rod passes through the vertical through grooves and comes out of the outer side thereof.

7. A gas-liquid jet floating polishing method, characterized in that: The following steps are involved: Step 1: Determine the workpiece to be polished and the expected polishing degree; Step 2: Adjust the clamping device to clamp the workpiece to be polished; Step 3, determining the polishing time of gas array jet assisted floating polishing, liquid array jet assisted floating polishing and floating polishing, using a pressurizing device to pressurize the fluid, and starting segmented polishing through gas array jet assisted floating polishing, liquid array jet assisted floating polishing and floating polishing; Step 4: Monitor the polishing degree of the workpiece to be polished and complete the polishing.

8. The gas-liquid array jet-assisted floating polishing device according to claim 7, characterized in that: In the step three, according to the roughness of the workpiece to be polished, the polishing time for rough polishing by gas array jet assisted floating polishing, fine polishing by liquid array jet assisted floating polishing, and atomic level polishing by floating polishing is selected.

9. The gas-liquid array jet assisted floating polishing device according to claim 7, characterized in that: In the step 4, the polishing degree of the polished part is judged and monitored according to the smoothness and roughness of the polished part by the clamping device.

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