Automatic semiconductor feeding device and feeding method for glass substrate processing

Abstract

The invention relates to the technical field of semiconductor feeding, in particular to an automatic semiconductor feeding device and a feeding method for glass substrate processing. Comprising an adsorption transfer module and a carrying frame arranged on one side of the adsorption transfer module. Glass substrates are stacked on the carrying frame; the pneumatic combing module is vertically and fixedly arranged on the side, close to the adsorption transfer module, of the carrying frame, and the output end of the pneumatic combing module faces the carrying frame. The first paper removing module is arranged on the other side of the carrying frame relative to the pneumatic combing module and used for removing the covering paper. The second paper removing module is detachably arranged at the front end of the first paper removing module; the first paper removing module is provided with a first paper removing wheel and a second paper removing wheel which can respectively drive covering paper on different binding surfaces of the glass substrate to be separated from the glass substrate; according to the invention, complete stripping or tearing treatment can be selectively carried out on the covering paper, the stripping is complete and the efficiency is high, so that the integrity and cleanliness of the glass substrate are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor feeding, and in particular to a semiconductor automatic feeding device and a feeding method for glass substrate processing. Background Art

[0002] In the semiconductor manufacturing process, glass substrate is one of the core materials, and its quality and processing accuracy directly affect the performance of semiconductor devices. During the processing, transportation and storage of substrates, protective paper (covering paper) is usually covered on the surface of the substrate to prevent the substrate from being damaged, contaminated or scratched.

[0003] However, before the substrate is put into production, the paper covering the surface of the substrate needs to be peeled off or torn off for further processing or treatment. For example, Chinese patent application CN109003930A discloses an automatic feeding device for semiconductor and pan-semiconductor substrates; the application adopts a vacuum suction nozzle to suck the substrate, and then uses a flexible block to pick up the paper and fasten it through a clamping block, and then drives the horizontal motor to start so that the screw rod drives the horizontal slider to move horizontally, thereby realizing the operation of tearing the cover paper to achieve the purpose of removing the cover paper. However, the patent has the following problems in actual use: 1. In the process of removing the substrate, the cover paper is adsorbed on the upper surface of the substrate by default, but in the actual operation, the cover paper will be synchronously sucked up with the removal of the substrate and the position will also shift to varying degrees; 2. The cover paper will be adsorbed to the lower surface of the moved substrate or the upper surface of the unmoved substrate due to the speed of substrate removal and static electricity, and its position is not fixed; 3. Under the premise of no static electricity, in order to achieve that the cover paper is completely attached to the substrate and will not move autonomously during the movement of the substrate, it is necessary to lift the substrate at a very slow speed during the adsorption of the substrate, that is, to leave enough time for the cover paper to separate from the moved substrate; but this will seriously affect the feeding speed of the substrate;

[0004] Furthermore, some production scenarios require retaining the cover paper for specific processing, and the existing technology cannot achieve selective processing of the cover paper according to actual needs, such as selectively retaining or tearing up the cover paper in some processes. Especially when processing a large area of ​​cover paper, efficient and pollution-free collection of the cover paper and secondary utilization can significantly save expenditure costs. Summary of the invention

[0005] In view of the above problems, a semiconductor automatic feeding device and a feeding method for glass substrate processing are provided. By providing a feeding device capable of automatically and efficiently peeling off or tearing off the cover paper, the cover paper can be selectively peeled off or torn off completely according to production requirements; thereby solving the technical problems in the prior art that peeling off the cover paper is time-consuming, labor-intensive and easy to cause contamination to the glass substrate.

[0006] To solve the problems of the prior art, a semiconductor automatic feeding device is disclosed, comprising an adsorption transfer module and a carrier frame arranged on one side of the adsorption transfer module; glass substrates are stacked and arranged on the carrier frame; a pneumatic combing module is vertically fixedly arranged on one side of the carrier frame close to the adsorption transfer module and the output end is arranged toward the carrier frame; a first paper removal module is arranged on the other side of the carrier frame relative to the pneumatic combing module, and is used to remove the covering paper when the covering paper does not need to be completely collected; a second paper removal module is detachably arranged at the front end of the first paper removal module, and is used to remove the covering paper when the covering paper needs to be completely collected; the first paper removal module is provided with a first paper removal wheel and a second paper removal wheel, which can respectively drive the covering paper on different bonding surfaces of the glass substrate to detach from the glass substrate; and the second paper removal wheel can be arranged longitudinally close to or away from the glass substrate, and is used to autonomously bond and remove the covering paper.

[0007] Preferably, the first paper removal module also includes an adjustment frame that can horizontally approach or move away from the glass substrate, and the adjustment frame is arranged in a U-shape; the first paper removal wheel is rotatably arranged on the adjustment frame and is arranged close to the front end of the adjustment frame to peel off the covering paper between the glass substrates; the second paper removal wheel is horizontally arranged at the rear side of the first paper removal wheel, and the second paper removal wheel can longitudinally approach or move away from the adjustment frame through a first linear drive arranged on one side of the adjustment frame; the second paper removal module is detachably arranged at the front end of the adjustment frame through a connecting frame; the adjustment frame is driven and adjusted by an adjustment module arranged on one side of the supporting frame.

[0008] Preferably, the first paper removal wheel consists of a rotating shaft and a rubber wheel coaxially sleeved and installed outside the rotating shaft; the second paper removal wheel has the same structure as the first paper removal wheel; the first paper removal wheel is horizontally spanned on the adjustment frame through bearing seats arranged at both ends of the rotating shaft.

[0009] Preferably, the first linear drive is provided with two groups, the two groups of first linear drives are vertically arranged on both sides of the adjustment frame relative to each other, and are rotatably connected to the second paper removal wheel through bearing seats arranged at the driving ends of the two groups of first linear drives; a second servo motor capable of driving the second paper removal wheel to rotate is fixedly provided on one side of the first linear drive.

[0010] Preferably, the adjustment module consists of a guide frame capable of horizontally guiding the adjustment frame to slide and a second linear drive capable of driving the guide frame to slide back and forth longitudinally; a third linear drive is also horizontally fixed on the outer side of the guide frame to drive the adjustment frame to slide back and forth along the guiding direction of the guide frame.

[0011] Preferably, a receiving plate is detachably provided in the guide frame for receiving the withdrawn covering paper.

[0012] Preferably, the front end of the adjustment frame is further provided with a partition capable of guiding the unidirectional movement of the covering paper; the partition is arranged in an inclined state between the first paper removing wheel and the second paper removing wheel.

[0013] Preferably, the pneumatic combing module includes an air outlet pipe capable of continuously outputting an air curtain toward the glass substrate; the air outlet pipe is slidably matched with a longitudinal guide element arranged at the end; the air outlet pipe is horizontally arranged on one side of the longitudinal guide element; a fixing frame fixedly connected to the guide frame is also arranged on one side of the air outlet pipe; it is used to move longitudinally synchronously with the guide frame, thereby synchronously changing the output position of the air curtain.

[0014] Preferably, the second paper removal module is composed of a roller and a suction cup radially arranged outside the roller; the suction cup is arranged in multiple groups at equal distances along the axis of the roller.

[0015] A feeding method for processing a glass substrate of a semiconductor automatic feeding device is applied to a semiconductor automatic feeding device, and comprises the following steps:

[0016] S1: First, an external power source is connected to drive the adsorption and transfer module to operate, and the glass substrate is adsorbed by the adsorption and transfer module. During the adsorption process, the glass substrate is lifted up at a fixed angle so that the cover paper falls off quickly;

[0017] S2: When the glass substrate is tilted and lifted, the first paper removal wheel of the first paper removal module extends into the angle of the glass substrate in a rotating state, and uses the rotating first paper removal wheel to peel the cover paper from between the glass substrates. At this time, the cover paper is on the upper surface of the glass substrate below the sucked glass substrate;

[0018] S3: If the cover paper is attached to the lower surface of the lifted glass substrate due to static electricity, the second paper removal wheel only needs to be driven to rotate and extend into the lower surface of the glass substrate in a rotating state. At this time, the second paper removal wheel will be lifted up and contacted with the cover paper under the longitudinal drive of the first linear drive, so that the cover paper attached to the lower surface of the lifted glass substrate is peeled off by the second paper removal wheel;

[0019] S4: When the cover paper needs to be completely peeled off, the pneumatic combing module is first driven to operate, and the cover paper is continuously arranged by using the air curtain output by the pneumatic combing module, so that the completely retained cover paper is pressed on the lower glass substrate, and then the second paper removal module is driven to operate, and it is adsorbed on the cover paper while contacting with it, and cooperates with the adjustment module to peel off the complete cover paper and place it in the receiving plate.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention significantly reduces the problem of synchronous lifting of the cover paper due to the electrostatic effect by tilting and lifting the glass substrate. During the loading process, the cover paper is easily adsorbed on the glass substrate due to static electricity, making subsequent processes difficult to carry out. By tilting and lifting the glass substrate and using a pneumatic combing module to flatly press the cover paper onto the upper surface of the glass substrate below, the electrostatic interference problem is effectively overcome, thereby improving the efficiency of peeling the cover paper.

[0022] 2. The present invention not only supports the peeling process of the covering paper, but also can completely retain the covering paper according to the needs, which is of great significance in the production process that needs to reuse the covering paper or has special requirements; through the pneumatic combing module and the second paper removal wheel, the covering paper can be effectively sorted and removed while being completely retained, ensuring the smooth progress of the production process.

[0023] 3. The present invention realizes that the first paper removal wheel and the second paper removal wheel can effectively remove the covering paper when it is adsorbed to different positions, and through the cooperation of the partition, it is further realized that in the process of efficient removal of the covering paper, the covering paper will only be conducted in the required guiding direction, and the technical problem of paper entanglement will not occur. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional diagram of a semiconductor automatic feeding device.

[0025] Figure 2 It is a side view of a partial structure of a semiconductor automatic feeding device.

[0026] Figure 3 yes Figure 2 A partial enlarged view of point A.

[0027] Figure 4 It is a three-dimensional diagram of a partial structure of a semiconductor automatic feeding device.

[0028] Figure 5 yes Figure 4 A partial enlarged view of point B.

[0029] Figure 6 The present invention is a partial structural side view of an adsorption transfer module and an adjustment module in a semiconductor automatic feeding device.

[0030] Figure 7 yes Figure 6 Cross-sectional view at CC.

[0031] Figure 8 yes Figure 7 A partial enlarged view of point D.

[0032] Fig. 9The present invention is a partially exploded stereoscopic diagram of the first paper removal module, the second paper removal module and the adjustment module in a semiconductor automatic feeding device.

[0033] Fig.10 yes Fig. 9 A partial enlarged view of point E.

[0034] The numbers in the figure are:

[0035] 1-adsorption and transport module; 11-manipulator; 12-adsorption element;

[0036] 2-Carrying frame;

[0037] 3-pneumatic combing module; 31-air outlet pipe; 32-longitudinal guide element; 33-fixed frame;

[0038] 4-first paper removal module; 41-first paper removal wheel; 411-rotating shaft; 412-rubber wheel; 42-second paper removal wheel; 43-adjusting frame; 44-first linear drive; 45-first servo motor; 46-second servo motor; 47-partition;

[0039] 5-second paper removal module; 51-connecting frame; 52-roller; 53-suction cup;

[0040] 6-adjustment module; 61-guide frame; 62-second linear drive; 63-third linear drive; 64-material receiving plate. DETAILED DESCRIPTION

[0041] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0042] See also Figures 1 to 10 As shown: a semiconductor automatic feeding device, including an adsorption transfer module 1, a carrier 2 arranged on one side of the adsorption transfer module 1; glass substrates are stacked and arranged on the carrier 2; a pneumatic combing module 3 is vertically fixedly arranged on one side of the carrier 2 close to the adsorption transfer module 1 and the output end is arranged toward the carrier 2; a first paper removal module 4 is arranged on the other side of the carrier 2 relative to the pneumatic combing module 3, and is used to remove the covering paper when the covering paper does not need to be completely collected; a second paper removal module 5 is detachably arranged at the front end of the first paper removal module 4, and is used to remove the covering paper when the covering paper needs to be completely collected; the first paper removal module 4 is provided with a first paper removal wheel 41 and a second paper removal wheel 42, which can respectively drive the covering paper on different bonding surfaces of the glass substrate to detach from the glass substrate; and the second paper removal wheel 42 can be arranged longitudinally close to or away from the glass substrate, so as to autonomously bond and remove the covering paper.

[0043] When the cover paper used to space the glass substrates needs to be removed during the loading of the glass substrates, the external power supply is first connected to drive the adsorption and transfer module 1 to operate. At this time, the adsorption end of the adsorption and transfer module 1 operates and automatically adsorbs the glass substrates stacked on the carrier 2. In the process of adsorbing the glass substrates by the adsorption and transfer module 1, the glass substrates are first lifted in an inclined state, that is, they are rotated circumferentially with the long side direction of the glass substrate as the axis; thereby, the cover paper used to space the glass substrates can be separated from the glass substrates at the fastest speed, and the probability of the cover paper being sucked up together with the glass substrates during the lifting process is reduced to the greatest extent; after the glass substrate is lifted up in an inclined manner by the adsorption and transfer module 1, the first paper removal module 4 is immediately driven to operate, so that the paper removal end of the first paper removal module 4 extends toward the angle where the lifted glass substrate is lifted, and then the effect of peeling the cover paper from between the glass substrates is achieved by the first paper removal wheel 41;

[0044] When the glass substrate is lifted, the cover paper is adsorbed on the lower surface of the lifted glass substrate under the influence of static electricity, and the second paper removal wheel 42 extending into the angle of the lifted glass substrate will move, actively contact the cover paper on the lower surface of the adsorbed glass substrate, and remove the cover paper through the second paper removal wheel 42; the above is to remove the cover paper in a discarding manner, especially when dealing with some small-sized cover papers; and when facing a large cover paper and need to keep it intact;

[0045] When the glass substrate is lifted, the pneumatic combing module 3 is in operation, and an air curtain is continuously output from the middle of the glass substrate toward the first paper removal module 4, so that in the process of lifting the glass substrate, under the action of the air curtain, the cover paper is always pressed to the upper surface of the glass substrate directly below the lifted glass substrate, and continuously maintains a flat and fitting posture, so that it cannot be sucked up together with the glass substrate when it is sucked away; then the second paper removal module 5 is driven to be arranged close to the edge of the cover paper, and actively adsorbs it to cooperate with the first paper removal module 4 to remove the cover paper; the effect of complete peeling of the cover paper can be achieved; by sucking the glass substrate away in an inclined posture, the adsorption area and the electrostatic adsorption effect can be minimized to the greatest extent, so that the cover paper is always in contact with the upper surface of the glass substrate below, thereby ensuring the paper removal efficiency of the cover paper by the first paper removal module 4 and the second paper removal module 5; the adsorption and transfer module 1 is composed of a manipulator 11 and an adsorption element 12 detachably arranged at the output end of the manipulator 11; the adsorption and transfer module 1 is a prior art and is not described here;

[0046] By tilting and lifting the glass substrate, this design significantly reduces the electrostatic effect and the possibility of the overlying paper being lifted, ensuring the efficiency and reliability of the paper removal process. At the same time, in combination with the first paper removal module 4, the second paper removal module 5, and the pneumatic flattening module 3, it can flexibly select to peel off or retain the overlying paper according to the size of the overlying paper, effectively improving production efficiency and quality.

[0047] See Fig. 9 and Fig.10 As shown: The first paper removal module 4 further includes an adjusting frame 43 that can horizontally approach or move away from the glass substrate. The adjusting frame 43 is arranged in a U shape. The first paper removal wheel 41 is rotatably arranged on the adjusting frame 43 and is arranged near the front end of the adjusting frame 43 for peeling off the overlying paper between the glass substrates. The second paper removal wheel 42 is horizontally arranged behind the first paper removal wheel 41, and the second paper removal wheel 42 can be longitudinally close to or away from the adjusting frame 43 through a first linear driver 44 arranged on one side of the adjusting frame 43. The second paper removal module 5 is detachably arranged at the front end of the adjusting frame 43 through a connecting frame 51. The adjusting frame 43 is driven by an adjusting module 6 arranged on one side of the carrier frame 2.

[0048] When directly removing the overlying paper, first drive the adjusting module 6 to act, so as to drive the adjusting frame 43 to horizontally approach the glass substrate through the adjusting module 6. When the glass substrate is tilted and lifted by the adsorption and transfer module 1, the adjusting frame 43 cooperates with the first paper removal wheel 41 to extend into the included angle of the tilted glass substrate. Then drive the first paper removal wheel 41 to rotate, so as to drive the overlying paper to fall off between the glass substrates through the first paper removal wheel 41. Since when the overlying paper has static electricity, the overlying paper will be lifted along with the lifting of the glass substrate. When the adjusting frame 43 extends to the included angle of the lifted glass substrate, the second paper removal wheel 42 will be synchronously longitudinally lifted and rotated under the drive of the first linear driver 44, and actively contact the overlying paper adhered to the lower surface of the tilted and lifted glass substrate, realizing the effect of peeling off the overlying paper from the glass substrate. The first paper removal wheel 41 rotates clockwise, and the second paper removal wheel 42 rotates counterclockwise, respectively for realizing the effect of peeling off and conducting the overlying paper adsorbed on the surfaces of different glass substrates towards the first paper removal module 4.

[0049] See Figure 8 As shown: The first paper removal wheel 41 is composed of a rotating shaft 411 and a rubber wheel 412 coaxially sleeved outside the rotating shaft 411. The second paper removal wheel 42 has the same structure as the first paper removal wheel 41. The first paper removal wheel 41 is horizontally spanned on the adjusting frame 43 through bearing seats arranged at both ends of the rotating shaft 411.

[0050] The first paper removal wheel 41 is composed of a rotating shaft 411 and a rubber wheel 412 sleeved outside the rotating shaft 411. The rubber wheel 412 can effectively contact the cover paper to ensure that the glass substrate is not scratched during the peeling process, and at the same time provide sufficient friction for paper removal operation; it is ensured that when the paper removal wheel is driven to rotate, the cover paper can quickly move toward the required conduction direction, thereby achieving efficient paper removal of the cover paper; the first paper removal wheel 41 is driven to rotate by a first servo motor 45 fixedly arranged on one side of the adjustment frame 43; by installing the rubber wheel 412 outside the first paper removal wheel 41, the stability and safety of the paper removal operation are effectively improved, and the damage that may be caused when the cover paper and the substrate are peeled off is avoided.

[0051] See also Figure 3 As shown: the first linear drive 44 is provided with two groups, the two groups of first linear drives 44 are vertically arranged on both sides of the adjustment frame 43, and the two groups of first linear drives 44 are rotatably connected with the second paper removal wheel 42 through the bearing seat arranged at the driving end; one side of the first linear drive 44 is fixedly provided with a second servo motor 46 that can drive the second paper removal wheel 42 to rotate.

[0052] The first linear drive 44 is specifically an electric push rod;

[0053] When it is necessary to peel off the cover paper adsorbed on the lower surface of the lifted glass substrate, firstly, an external power source is connected to drive the first linear driver 44 to operate; the output shaft of the first linear driver 44 extends to drive the second paper removal wheel 42 to be lifted longitudinally and contact the lower surface of the glass substrate adsorbed by the adsorption transfer module 1, and then the second servo motor 46 drives the second paper removal wheel 42 to rotate counterclockwise, thereby achieving the effect of quickly peeling off the cover paper from the lower surface of the glass substrate;

[0054] The first linear drive 44 is provided with two groups, and the two groups of first linear drives 44 are respectively arranged vertically on both sides of the adjustment frame 43, and are connected with the rotating part of the second paper removing wheel 42 through the bearing seat provided at the driving end thereof, thereby ensuring the precise driving of the second paper removing wheel 42 in the vertical direction; a second servo motor 46 is also fixedly installed on one side of the first linear drive 44 to drive the rotation of the second paper removing wheel 42. During the lifting process of the glass substrate, the paper covering electrostatically adsorbed to the substrate can be effectively peeled off through the precisely controlled paper removing operation.

[0055] See also Figure 4 and Fig. 9 As shown: the adjustment module 6 is composed of a guide frame 61 capable of horizontally guiding the adjustment frame 43 to slide, and a second linear drive 62 capable of driving the guide frame 61 to slide back and forth longitudinally; a third linear drive 63 is also horizontally fixed on the outer side of the guide frame 61 to drive the adjustment frame 43 to slide back and forth along the guiding direction of the guide frame 61.

[0056] When the cover paper is being removed, it is necessary to drive the first paper removal wheel 41 to approach the glass substrate through the adjustment frame 43, firstly, an external power supply is connected to drive the third linear driver 63 to operate, and the output shaft of the third linear driver 63 extends to push the adjustment frame 43 to slide along the guide direction of the guide frame 61, so as to achieve precise adjustment of the target position; and in the process of continuous adsorption and transportation of the glass substrate by the adsorption and transportation module 1, the height of the cover paper to be adsorbed will gradually decrease, at this time, it is only necessary to connect the external power supply to drive the second linear driver 62 to operate, so as to achieve the effect of freely adjusting the longitudinal height of the adjustment frame 43 and the first paper removal module 4 and the second paper removal module 5; thereby, the paper removal ends of the first paper removal module 4 and the second paper removal module 5 always maintain a corresponding height with the cover paper to be removed; the second linear driver 62 is specifically an electric push rod, and the third linear driver 63 is specifically a screw slide.

[0057] See also Fig. 9 As shown, a receiving plate 64 is detachably provided in the guide frame 61 for receiving the withdrawn covering paper.

[0058] The guide frame 61 is detachably provided with a receiving plate 64, which is used to receive and collect the covering paper after it is extracted; the receiving plate 64 is designed to be a detachable structure, which is convenient for installation and cleaning; and can be adjusted to different paper receiving states according to different paper removal states; when there is no need to collect the covering paper, the receiving plate 64 is inclined toward the first paper removal module 4; at this time, the receiving plate 64 is only used to guide the covering paper away from the supporting frame 2; and when the covering paper to be exposed is processed, the receiving plate 64 is arranged in a horizontal state, so as to ensure that the covering paper removed by the second paper removal module 5 falls into the receiving plate 64 in a non-bent and flat state; it cooperates with the guide frame 61, and can collect and store the peeled covering paper in time during the covering paper extraction process, so as to prevent the covering paper from falling to the bottom of the equipment or the surrounding working environment, affecting the production process or causing secondary pollution.

[0059] See also Fig.10 As shown, the front end of the adjusting frame 43 is also provided with a partition plate 47 capable of guiding the unidirectional movement of the covering paper; the partition plate 47 is arranged in an inclined state between the first paper removing wheel 41 and the second paper removing wheel 42.

[0060] The partition plate 47 is used to prevent the cover paper from being affected by the opposite paper removal wheel when guiding the cover paper.

[0061] The front end of the adjustment frame 43 is provided with a partition plate 47 for guiding the unidirectional movement of the covering paper, and the partition plate 47 is obliquely installed between the first paper removal wheel 41 and the second paper removal wheel 42; the design of the partition plate 47 can effectively guide the covering paper to pass smoothly during the extraction process, and avoid being reversely squeezed or blocked by the paper removal wheel, so as to ensure that the covering paper maintains unidirectional and stable movement when being guided; the position and angle of the partition plate 47 are precisely designed to ensure that the covering paper will not be disturbed by the oppositely arranged paper removal wheels, so that the covering paper can complete the peeling and conduction work more smoothly;

[0062] The inclined partition 47 can ensure that the cover paper is guided in one direction when being pulled out, thereby preventing the cover paper from being blocked by interference with the paper removal wheel, thereby improving the efficiency of peeling off the cover paper; at the same time, the design of the inclined partition 47 can also ensure the stability of the cover paper moving process, preventing the cover paper from being wrinkled or damaged due to uneven force, thereby improving the working reliability of the equipment and the cover paper processing quality.

[0063] See also Figure 5 and Fig.10 As shown: the pneumatic combing module 3 includes an air outlet pipe 31 that can continuously output an air curtain toward the glass substrate; the air outlet pipe 31 is slidably matched with a longitudinal guide element 32 arranged at the end; the air outlet pipe 31 is horizontally arranged on one side of the longitudinal guide element 32; a fixing frame 33 fixedly connected to the guide frame 61 is also arranged on one side of the air outlet pipe 31; it is used to move synchronously with the guide frame 61 longitudinally, thereby synchronously changing the output position of the air curtain.

[0064] The pneumatic combing modules 3 are provided with two groups, and the two groups of pneumatic combing modules 3 are relatively arranged on both sides of the short side direction of the glass substrate, and the output wind sources of the air outlet pipes 31 are outputted in an inclined manner toward the middle of the first paper removal module 4; the longitudinal guiding element 32 is composed of a base and a guide rod vertically arranged on the base, and the air outlet pipes 31 are slidably matched with the guide rod to guide the air outlet pipes 31 to slide longitudinally;

[0065] The fixing frame 33 is used to ensure that the air outlet pipe 31 can move longitudinally synchronously with the movement of the guide frame 61; through this arrangement, the pneumatic combing module 3 can continuously output the air curtain above the glass substrate, and adjust the air curtain output position according to the position of the guide frame 61, so as to ensure that the airflow can always evenly comb and flatten the cover paper on the glass substrate;

[0066] The air outlet pipe 31 can effectively ensure that when the glass substrate is lifted, the cover paper always remains flat and adheres to the glass substrate below, avoiding the cover paper from sticking to the glass substrate due to static electricity or external force when the glass substrate is lifted; at the same time, the pneumatic combing module 3 further reduces the wrinkles or misalignment of the cover paper during the separation process through the continuous action of the air curtain, thereby improving the stability and efficiency of the cover paper peeling process.

[0067] See also Figure 8 As shown: the second paper removal module 5 is composed of a roller 52 and a suction cup 53 radially arranged outside the roller 52; the suction cup 53 is arranged in multiple groups at equal distances along the axis of the roller 52.

[0068] When the cover paper is completely pressed against the upper surface of the glass substrate after passing through the pneumatic combing module 3, it is only necessary to drive the first paper removal module 4 and the second paper removal module 5 to be horizontally close to the cover paper through the adjustment module 6 until the suction cup 53 presses and sucks to the edge of the cover paper and adsorbs it, and then drive the adjustment module 6 again to cooperate with the first paper removal module 4 and the second paper removal module 5 to be horizontally away from the glass substrate to completely remove the cover paper.

[0069] A feeding method for processing a glass substrate of a semiconductor automatic feeding device is applied to a semiconductor automatic feeding device, and comprises the following steps:

[0070] S1: First, an external power source is connected to drive the adsorption and transfer module 1 to operate, and the glass substrate is adsorbed by the adsorption and transfer module 1. During the adsorption process, the glass substrate is lifted up in a fixed angle tilted state to reduce the probability of the cover paper adhering to the glass substrate and to make the cover paper fall off quickly;

[0071] S2: When the glass substrate is tilted and lifted, the first paper removing wheel 41 of the first paper removing module 4 extends into the angle of the glass substrate in a rotating state, and uses the rotating first paper removing wheel 41 to peel the cover paper from between the glass substrates. At this time, the cover paper is on the upper surface of the glass substrate below the sucked glass substrate;

[0072] S3: If the cover paper is attached to the lower surface of the raised glass substrate due to static electricity, it is only necessary to drive the second paper removal wheel 42 to rotate and extend into the lower surface of the glass substrate in a rotating state. At this time, the second paper removal wheel 42 will be lifted up and contacted with the cover paper under the longitudinal drive of the first linear drive 44, so that the cover paper attached to the lower surface of the raised glass substrate is peeled off by the second paper removal wheel 42;

[0073] S4: When the cover paper needs to be completely peeled off, the pneumatic combing module 3 is first driven to operate, and the air curtain output by the pneumatic combing module 3 is used to continuously arrange the cover paper, and the completely retained cover paper is pressed against the glass substrate below. Then the second paper removal module 5 is driven to operate, and it is adsorbed on the cover paper while contacting with it, and cooperates with the adjustment module 6 to peel off the complete cover paper and place it in the receiving plate 64.

[0074] The present invention can selectively perform complete peeling or tearing processing on the cover paper, and the peeling is complete and efficient, so as to ensure the integrity and cleanliness of the substrate.

[0075] The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A semiconductor automatic feeding device, characterized in that: The invention comprises an adsorption transfer module (1), a support frame (2) arranged on one side of the adsorption transfer module (1); glass substrates are stacked and arranged on the support frame (2); a pneumatic combing module (3) is fixedly arranged on one side of the support frame (2) close to the adsorption transfer module (1) in a vertical state, and the output end is arranged in the direction of the support frame (2); a first paper removal module (4) is arranged on the other side of the support frame (2) relative to the pneumatic combing module (3), and is used to remove the covering paper when the covering paper does not need to be completely collected; a second paper removal module (5) is detachably arranged at the front end of the first paper removal module (4), and is used to remove the covering paper when the covering paper needs to be completely collected; the first paper removal module (4) is provided with a first paper removal wheel (41) and a second paper removal wheel (42) that can respectively drive the covering paper on different bonding surfaces of the glass substrate to be detached from the glass substrate; and the second paper removal wheel (42) can be arranged longitudinally close to or away from the glass substrate, and is used to autonomously bond the covering paper and remove it.

2. A semiconductor automatic feeding device according to claim 1, characterized in that: The first paper removal module (4) also includes an adjustment frame (43) capable of horizontally approaching or moving away from the glass substrate, and the adjustment frame (43) is arranged in a U-shaped shape; the first paper removal wheel (41) is rotatably arranged on the adjustment frame (43) and arranged near the front end of the adjustment frame (43) to peel off the covering paper between the glass substrates; the second paper removal wheel (42) is horizontally arranged at the rear side of the first paper removal wheel (41), and the second paper removal wheel (42) can be arranged longitudinally approaching or moving away from the adjustment frame (43) through a first linear drive (44) arranged at one side of the adjustment frame (43); the second paper removal module (5) is detachably arranged at the front end of the adjustment frame (43) through a connecting frame (51); the adjustment frame (43) is driven and adjusted by an adjustment module (6) arranged at one side of the supporting frame (2).

3. A semiconductor automatic feeding device according to claim 2, characterized in that: The first paper removal wheel (41) is composed of a rotating shaft (411) and a rubber wheel (412) coaxially sleeved and installed outside the rotating shaft (411); the second paper removal wheel (42) has the same structure as the first paper removal wheel (41); the first paper removal wheel (41) is horizontally spanned on the adjustment frame (43) through bearing seats arranged at both ends of the rotating shaft (411).

4. A semiconductor automatic feeding device according to claim 2, characterized in that: The first linear drive (44) is provided with two groups, the two groups of first linear drives (44) are arranged in a vertical state on both sides of the adjustment frame (43) and are rotatably connected to the second paper removal wheel (42) through bearing seats arranged at the driving ends of the two groups of first linear drives (44); a second servo motor (46) capable of driving the second paper removal wheel (42) to rotate is fixedly arranged on one side of the first linear drive (44).

5. The semiconductor automatic feeding device according to claim 2, characterized in that: The adjustment module (6) is composed of a guide frame (61) capable of horizontally guiding the adjustment frame (43) to slide, and a second linear drive (62) capable of driving the guide frame (61) to slide back and forth longitudinally; a third linear drive (63) is also horizontally fixedly arranged on the outer side of the guide frame (61) to drive the adjustment frame (43) to slide back and forth along the guide direction of the guide frame (61).

6. The semiconductor automatic feeding device according to claim 5, characterized in that: A material receiving plate (64) is also detachably provided in the guide frame (61) for receiving the withdrawn covering paper.

7. The semiconductor automatic feeding device according to claim 2, characterized in that: The front end of the adjustment frame (43) is also provided with a partition (47) capable of guiding the unidirectional movement of the covering paper; the partition (47) is arranged in an inclined state between the first paper removal wheel (41) and the second paper removal wheel (42).

8. The semiconductor automatic feeding device according to claim 5, characterized in that: The pneumatic combing module (3) comprises an air outlet pipe (31) capable of continuously outputting an air curtain toward a glass substrate; the air outlet pipe (31) is slidably matched with a longitudinal guide element (32) arranged at the end; the air outlet pipe (31) is horizontally arranged on one side of the longitudinal guide element (32); a fixing frame (33) fixedly connected to a guide frame (61) is also arranged on one side of the air outlet pipe (31); the fixing frame (33) is used to move longitudinally synchronously with the guide frame (61), thereby synchronously changing the output position of the air curtain.

9. The semiconductor automatic feeding device according to claim 1, characterized in that: The second paper removal module (5) is composed of a roller (52) and a suction cup (53) radially arranged outside the roller (52); a plurality of groups of the suction cups (53) are equidistantly arranged along the axis of the roller (52).

10. A feeding method for processing glass substrates of a semiconductor automatic feeding device, applied to a semiconductor automatic feeding device as claimed in any one of claims 1 to 9, comprising the following steps: S1: firstly, an external power source is connected to drive the adsorption and transfer module (1) to operate, and the glass substrate is adsorbed by the adsorption and transfer module (1). During the adsorption process, the glass substrate is lifted up in a tilted state at a fixed angle so that the cover paper falls off quickly; S2: When the glass substrate is tilted and lifted, the first paper removal wheel (41) of the first paper removal module (4) extends into the angle of the glass substrate in a rotating state, and the first paper removal wheel (41) in a rotating state is used to peel the cover paper from between the glass substrates. At this time, the cover paper is located on the upper surface of the glass substrate below the glass substrate that is sucked up; S3: If the cover paper is adsorbed on the lower surface of the raised glass substrate due to static electricity, it is only necessary to drive the second paper removal wheel (42) to rotate and extend into the lower surface of the glass substrate in a rotating state. At this time, the second paper removal wheel (42) will be lifted up and contacted with the cover paper under the longitudinal drive of the first linear drive (44), so that the cover paper adsorbed on the lower surface of the raised glass substrate is peeled off by the second paper removal wheel (42); S4: When the cover paper needs to be completely peeled off, the pneumatic combing module (3) is first driven to operate, and the air curtain output by the pneumatic combing module (3) is used to continuously arrange the cover paper, so that the completely retained cover paper is pressed against the lower glass substrate, and then the second paper removal module (5) is driven to operate, and while contacting with the cover paper, it is adsorbed on it, and cooperates with the adjustment module (6) to peel off the complete cover paper and place it in the receiving plate (64).

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