Method and device for regulating and controlling performance of high-nitrogen steel / nickel-copper brazing filler metal through active elements

Abstract

The invention provides a method and device for regulating and controlling the performance of high-nitrogen steel / nickel-copper brazing filler metal through active elements. The problem that an atomic diffusion mechanism of the active elements on a steel / nickel-copper brazing filler metal interface and the influence of the active elements on interface bonding behaviors cannot be researched through an existing experimental method is effectively solved. The method comprises the following steps: respectively carrying out convergence test on a plurality of high-nitrogen steel crystal surfaces and nickel-copper brazing filler metal crystal surfaces obtained based on a high-nitrogen steel crystal model and a nickel-copper brazing filler metal crystal model so as to screen out a target high-nitrogen steel crystal surface and a target nickel-copper brazing filler metal crystal surface; based on the target high-nitrogen steel crystal surface and the target nickel-copper brazing filler metal crystal surface, a clean interface model of the high-nitrogen steel / nickel-copper brazing filler metal is constructed, and a doped interface model of the high-nitrogen steel / nickel-copper brazing filler metal is obtained; and the clean interface model and the doped interface model are evaluated to obtain corresponding evaluation results, and the performance of the high-nitrogen steel / nickel-copper brazing filler metal regulated and controlled by the active elements is determined on the basis of the evaluation results.

Description

Technical Field

[0001] The present application relates to the field of computing and welding material technology, and in particular to a method and device for regulating the performance of high nitrogen steel / nickel-copper solder by using active elements. Background Art

[0002] High nitrogen steel has excellent mechanical properties, biocompatibility, economy and other advantages. It is widely used in many fields such as oil drilling, biomedicine, chemical engineering, marine engineering, aerospace, military industry, nuclear industry, etc., and has great application potential. However, high nitrogen steel is prone to wear and corrosion under high temperature and high pressure working conditions or long service time, and preparing brazing coating on its surface is an important means to improve the service life of high nitrogen steel. Commonly used brazing fillers are mainly nickel-based brazing fillers, copper-based brazing fillers, and silver-based brazing fillers. Among them, nickel-based brazing fillers have a higher brazing temperature and will cause diamond graphitization; copper-based brazing fillers have poor wear resistance; silver-based brazing fillers are expensive and not conducive to industrialization. Gradually, adding copper elements to nickel-based brazing fillers can increase the number of solid solutions to reduce brittle compounds, which in turn enhances the interface bonding strength between the coating and the substrate. At the same time, copper can reduce the melting point of nickel-based brazing fillers and reduce the degree of graphitization of diamond during brazing. Therefore, nickel-copper brazing fillers have become an excellent choice for preparing coatings on the surface of high nitrogen steel. Active elements are highly reactive and diffusive, so adding active elements to nickel-copper solder can refine the grains, improve the performance of nickel-copper composite coatings, reduce the temperature of nickel-copper solder, and enhance the precipitation strengthening effect of nickel-copper composite coatings, which has great potential in welding solders. However, existing experimental methods cannot study the atomic diffusion mechanism of active elements at the steel / nickel-copper solder interface, and cannot explore the effect of active elements on the bonding behavior of the high-nitrogen steel / nickel-copper solder interface.

[0003] How to quickly and efficiently predict the effect of active elements on the interface performance of high nitrogen steel / nickel copper solder from the atomic scale is one of the difficulties in this field. Based on this, it is urgent to develop relevant methods to predict the effect of active elements on the interface performance of high nitrogen steel / nickel copper solder, improve the research in related fields, and improve production efficiency and product quality. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a method and device for regulating the performance of high nitrogen steel / nickel-copper solder by active elements. The method and device for regulating the performance of high nitrogen steel / nickel-copper solder by active elements effectively solve the problem that the existing experimental methods are unable to study the atomic diffusion mechanism of active elements at the steel / nickel-copper solder interface and the influence on the interface bonding behavior.

[0005] In a first aspect, an embodiment of the present application provides a method for regulating the performance of high nitrogen steel / nickel copper brazing filler metal with active elements, the method comprising: Based on the structures of high nitrogen steel and nickel-copper solder, a corresponding high nitrogen steel crystal model and a nickel-copper solder crystal model are respectively constructed, so as to cut the high nitrogen steel crystal model and the nickel-copper solder crystal model to obtain a plurality of high nitrogen steel crystal surfaces and nickel-copper solder crystal surfaces; the high nitrogen steel crystal model contains atoms corresponding to the high nitrogen steel, and the nickel-copper solder crystal model contains atoms corresponding to the nickel-copper solder; Conducting convergence tests on multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces respectively, obtaining the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces, respectively, so as to screen out target high nitrogen steel crystal surfaces and target nickel copper solder crystal surfaces based on the atomic layer numbers; A clean interface model of high nitrogen steel / nickel copper solder is constructed based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, and a doped interface model of high nitrogen steel / nickel copper solder is obtained by processing the clean interface model based on active elements; The clean interface model and the doped interface model of the high nitrogen steel / nickel copper solder are evaluated based on multiple evaluation dimensions to obtain corresponding evaluation results, so as to determine the performance of the high nitrogen steel / nickel copper solder after active element regulation based on the evaluation results.

[0006] In combination with the first aspect, the embodiment of the present application provides a first possible implementation of the first aspect, wherein the evaluation results obtained by evaluating the clean interface model and the doped interface model of the high nitrogen steel / nickel-copper solder based on multiple evaluation dimensions include: Calling a plurality of evaluation indicators corresponding to the evaluation dimension to calculate evaluation data corresponding to the clean interface model and the doped interface model based on the evaluation indicators; The evaluation result is obtained by fusing the evaluation data corresponding to the clean interface model and the doped interface model.

[0007] In combination with the first aspect, the embodiment of the present application provides a second possible implementation of the first aspect, wherein the calling of multiple evaluation indicators corresponding to the evaluation dimension to calculate the evaluation data corresponding to the clean interface model and the doped interface model based on the evaluation indicators includes: Inputting the clean interface model and the doped interface model into the calculation network corresponding to the evaluation index respectively; The calculation network corresponding to the evaluation index calculates the clean interface model and the doped interface model respectively to obtain corresponding evaluation data.

[0008] In combination with the first aspect, the embodiment of the present application provides a third possible implementation of the first aspect, wherein the clean interface model of high nitrogen steel / nickel copper solder is constructed based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, comprising: Determine whether the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface meet the model building condition; the model building condition is that the interface fitness between the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface meets the preset fitness range; If so, the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface are spliced ​​to obtain the clean interface model of the high nitrogen steel / nickel-copper solder.

[0009] In combination with the first aspect, the embodiment of the present application provides a fourth possible implementation of the first aspect, wherein the obtaining of the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and the nickel copper solder crystal surfaces, respectively, to screen out the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface based on the atomic layer numbers, comprises: Based on the number of atomic layers, it is determined whether the corresponding high nitrogen steel crystal surface and nickel copper solder crystal surface are stable; If so, the corresponding high nitrogen steel crystal surface and nickel copper solder crystal surface are identified as the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, respectively.

[0010] In combination with the first aspect, the embodiment of the present application provides a fifth possible implementation of the first aspect, wherein the active element-based processing of the clean interface model to obtain a doped interface model of high nitrogen steel / nickel-copper brazing filler metal comprises: Selecting atoms corresponding to at least one active element to replace atoms in the clean interface model to obtain an initial doping interface model of high nitrogen steel / nickel copper solder; The initial doping interface model is optimized according to a preset optimization method to obtain a corresponding doping interface model.

[0011] In combination with the first aspect, the embodiment of the present application provides a sixth possible implementation of the first aspect, wherein the active element includes at least one of the following: titanium Ti, zirconium Zr, and vanadium V. In a second aspect, the present application provides a device for regulating the performance of high nitrogen steel / nickel copper brazing filler metal by active elements, the device comprising: A construction module is used to construct a corresponding high nitrogen steel crystal model and a nickel copper solder crystal model based on the structures of the high nitrogen steel and the nickel copper solder, respectively, so as to cut the high nitrogen steel crystal model and the nickel copper solder crystal model to obtain a plurality of high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces; the high nitrogen steel crystal model contains atoms corresponding to the high nitrogen steel, and the nickel copper solder crystal model contains atoms corresponding to the nickel copper solder; A test module is used to perform convergence tests on multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces respectively to obtain the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces, so as to screen out target high nitrogen steel crystal surfaces and target nickel copper solder crystal surfaces based on the atomic layer numbers; A processing module, for constructing a clean interface model of high nitrogen steel / nickel copper solder based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, and processing the clean interface model based on active elements to obtain a doped interface model of high nitrogen steel / nickel copper solder; An evaluation module is used to evaluate the clean interface model and the doped interface model of the high nitrogen steel / nickel copper solder based on multiple evaluation dimensions to obtain corresponding evaluation results, so as to determine the performance of the high nitrogen steel / nickel copper solder after active element regulation based on the evaluation results. In a third aspect, an embodiment of the present application provides an electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of any one of the methods for regulating the performance of high nitrogen steel / nickel-copper brazing alloys with active elements are performed.

[0012] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, executes any one of the steps of a method for regulating the performance of high nitrogen steel / nickel-copper brazing material with active elements.

[0013] The embodiment of the present application provides a method for regulating the performance of high nitrogen steel / nickel-copper solder by active elements. The method first constructs corresponding high nitrogen steel crystal models and nickel-copper solder crystal models based on the structures of high nitrogen steel and nickel-copper solder, respectively, and cuts the high nitrogen steel crystal model and the nickel-copper solder crystal model to obtain multiple high nitrogen steel crystal surfaces and nickel-copper solder crystal surfaces; the high nitrogen steel crystal model contains atoms corresponding to high nitrogen steel, and the nickel-copper solder crystal model contains atoms corresponding to nickel-copper solder; secondly, convergence tests are performed on multiple high nitrogen steel crystal surfaces and nickel-copper solder crystal surfaces, respectively, to obtain the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and the nickel-copper solder crystal surfaces, respectively, to screen out target high nitrogen steel crystal surfaces and target nickel-copper solder crystal surfaces based on the atomic layer numbers; then, a clean interface model of high nitrogen steel / nickel-copper solder is constructed based on the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface, and the clean interface model is processed based on active elements to obtain a doped interface model of high nitrogen steel / nickel-copper solder; Finally, the clean interface model and the doped interface model of the high nitrogen steel / nickel-copper solder are evaluated based on multiple evaluation dimensions to obtain corresponding evaluation results, so as to determine the performance of the high nitrogen steel / nickel-copper solder after active element regulation based on the evaluation results. The influence of active elements on the interface performance of high nitrogen steel / nickel-copper solder is predicted by using first-principles calculation simulation. Only by constructing and optimizing the clean and doped HNS / CuNi3 interface structures, the atomic diffusion mechanism of active elements at the steel / nickel-copper solder interface can be studied, and the influence of active elements on the bonding behavior of the heterogeneous connection interface of high nitrogen steel / nickel-copper solder can be revealed. Through first-principles calculation simulation, the influence of the reaction phase generated by active elements and iron on the heterogeneous connection interface performance of high nitrogen steel / nickel-copper solder can be effectively predicted, and the experiment can be guided to reduce the generation of harmful phases such as VFe phase, obtain a reliable and stable connection interface, and improve the service life of copper-steel heterogeneous joints, which effectively solves the problem that the existing experimental methods cannot study the atomic diffusion mechanism of active elements at the steel / nickel-copper solder interface and the influence on the interface bonding behavior. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 A schematic flow chart of a method for regulating the performance of high nitrogen steel / nickel-copper solder using a first active element provided in this embodiment is shown; Figure 2 A schematic diagram of the crystal model of high nitrogen steel HNS and nickel-copper brazing filler metal CuNi3 provided in this embodiment is shown; Figure 3 The interface schematic diagram of the clean interface model and the doped interface model provided in this embodiment is shown; Figure 4 A schematic diagram showing the adhesion work of the clean interface model and the doped interface model constructed according to the present embodiment is shown; Figure 5 (a)-(g) in the figure show the charge density schematic diagrams of the doping interface model of different element doping provided in this embodiment after complete relaxation; Figure 6 (a)-(g) in the figure show the differential charge density schematic diagrams after the doping interface model of different element doping provided in this embodiment is completely relaxed; Figure 7 The schematic diagram of the structure of the device for regulating the performance of high nitrogen steel / nickel copper solder by the first active element provided in this embodiment is shown; Figure 8 A schematic structural diagram of an electronic device provided in this embodiment is shown. DETAILED DESCRIPTION

[0016] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart under the guidance of the content of the present application, or remove one or more operations from the flowchart.

[0017] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0018] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.

[0019] At present, adding active elements to nickel-copper solder can refine the grains, improve the performance of nickel-copper composite coating, reduce the temperature of nickel-copper solder, and enhance the precipitation strengthening effect of nickel-copper composite coating. It has great potential in welding solder. However, the existing experimental methods cannot study the atomic diffusion mechanism of active elements at the steel / nickel-copper solder interface, and cannot explore the influence of active elements on the bonding behavior of high nitrogen steel / nickel-copper solder interface.

[0020] Based on this, the embodiments of the present application provide a method and device for regulating the performance of high nitrogen steel / nickel copper brazing filler metal by using active elements, which will be described below through embodiments.

[0021] Example 1 To facilitate understanding of this embodiment, a method for regulating the performance of high nitrogen steel / nickel copper brazing alloy with an active element disclosed in the embodiment of this application is first introduced in detail. Figure 1 A flow chart of a method for regulating the performance of high nitrogen steel / nickel copper brazing alloy with active elements is shown. The present application provides a method for regulating the performance of high nitrogen steel / nickel copper brazing alloy with active elements, and the method comprises: S101. Based on the structures of high nitrogen steel and nickel-copper solder, a corresponding high nitrogen steel crystal model and a nickel-copper solder crystal model are respectively constructed, so as to cut the high nitrogen steel crystal model and the nickel-copper solder crystal model to obtain a plurality of high nitrogen steel crystal surfaces and nickel-copper solder crystal surfaces; the high nitrogen steel crystal model contains atoms corresponding to the high nitrogen steel, and the nickel-copper solder crystal model contains atoms corresponding to the nickel-copper solder; S102, respectively performing convergence tests on a plurality of high nitrogen steel crystal surfaces and nickel-copper solder crystal surfaces to obtain the atomic layer numbers corresponding to the plurality of high nitrogen steel crystal surfaces and nickel-copper solder crystal surfaces, so as to screen out target high nitrogen steel crystal surfaces and target nickel-copper solder crystal surfaces based on the atomic layer numbers; S103, constructing a clean interface model of high nitrogen steel / nickel copper solder based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, and processing the clean interface model based on active elements to obtain a doped interface model of high nitrogen steel / nickel copper solder; S104. Evaluate the clean interface model and the doped interface model of the high nitrogen steel / nickel copper solder based on multiple evaluation dimensions to obtain corresponding evaluation results, so as to determine the performance of the high nitrogen steel / nickel copper solder after active element regulation based on the evaluation results.

[0022] In step S101, the corresponding high nitrogen steel crystal model and nickel copper solder crystal model are respectively constructed based on the structures of high nitrogen steel and nickel copper solder. The specific construction method is preset, including crystal structure visualization software and computational simulation software. The crystal structure visualization software includes Materials Studio and VESTA, and the computational simulation software includes CASTEP. The high nitrogen steel crystal model can be represented as an HNS crystal model. Since the nickel copper solder is a nickel-based material, the nickel copper solder has the basic condition that the atomic percentage of nickel and copper is greater than 1:1. Therefore, the original model of the nickel copper solder can be CuNi and CuNi3. In order to be more compatible with the high nitrogen steel, the applicable model of the nickel copper solder is CuNi3. The crystal model of the nickel copper solder CuNi3 can be imported from the crystal database. The high nitrogen steel HNS model adopts Materials Studio and VESTA. Studio visual computational simulation software is used to construct the high nitrogen steel crystal model, there are atoms corresponding to the high nitrogen steel in the high nitrogen steel crystal model, there are atoms corresponding to the nickel copper solder in the nickel copper solder crystal model, that is, the nickel copper solder crystal model and the diamond crystal model are constructed. After the nickel copper solder crystal model and the diamond crystal model are constructed, in order to ensure the stability of the nickel copper solder crystal model and the diamond crystal model, the nickel copper solder crystal model and the diamond crystal model are structurally optimized according to structural optimization parameters. The structural optimization parameters include functional, pseudopotential, K point grid, cutoff energy, maximum stress and maximum displacement, wherein the functional is an exchange-correlation functional, and the PBE form in the generalized gradient approximation (GGA) is adopted; the pseudopotential adopts an ultrasoft pseudopotential; the K point grid adopts 4×4×4; the cutoff energy is set to 500 eV; the maximum stress is set to 0.05 GPa, and the maximum displacement is set to 0.001 Å. After the structural optimization, a stable nickel copper solder crystal model and a diamond crystal model are obtained.

[0023] After obtaining a stable nickel-copper solder crystal model and a diamond crystal model, the nickel-copper solder crystal model is imported into a visualization computing simulation software, and then the high nitrogen steel crystal model and the nickel-copper solder crystal model are cut based on the visualization computing simulation software to obtain multiple high nitrogen steel crystal surfaces and nickel-copper solder crystal surfaces, that is, the nickel-copper solder crystal model is cut multiple times to obtain multiple nickel-copper solder crystal surfaces, and the high nitrogen steel crystal model is cut multiple times to obtain multiple high nitrogen steel crystal surfaces, wherein the cut surfaces include but are not limited to (111), (100), (001), and (010) surfaces. In the present application, the surfaces cut from the high nitrogen steel crystal model and the nickel-copper solder crystal model are (010) surfaces. In step S102, after obtaining multiple high-nitrogen steel crystal surfaces and multiple nickel-copper solder crystal surfaces, convergence tests are performed on the multiple high-nitrogen steel crystal surfaces and multiple nickel-copper solder crystal surfaces respectively, and the convergence test is an atomic layer spacing convergence test to obtain a convergence test result, that is, each high-nitrogen steel crystal surface or nickel-copper solder crystal surface has a corresponding convergence test result, and the convergence test result represents the rate of change between the atomic layers of each high-nitrogen steel crystal surface or each nickel-copper solder crystal surface, so as to obtain the number of atomic layers corresponding to the multiple high-nitrogen steel crystal surfaces and the nickel-copper solder crystal surfaces based on the convergence test result, and then screen the multiple high-nitrogen steel crystal surfaces and the multiple nickel-copper solder crystal surfaces based on the number of atomic layers, so as to screen out the target high-nitrogen steel crystal surface and the target nickel-copper solder crystal surface, wherein the target high-nitrogen steel crystal surface is a high-nitrogen steel crystal surface with an optimal number of atomic layers, and the target nickel-copper solder crystal surface is a nickel-copper solder crystal surface with an optimal number of atomic layers.

[0024] The atomic layer spacing convergence test is expressed using formula (1): (1); in, and represent the distance between the i-th layer and the j-th layer before and after the relaxation of the surface model, is the rate of change of the distance between the i-th layer and the j-th layer before and after the surface model is relaxed. In the specific implementation process of step S102, there is an embodiment in which the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and the nickel copper solder crystal surfaces are obtained, and the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface are screened out based on the atomic layer numbers, including: S1021, judging whether the corresponding high nitrogen steel crystal surface and nickel copper solder crystal surface are stable based on the number of atomic layers; S1022. If yes, then the corresponding high nitrogen steel crystal surface and nickel copper solder crystal surface are identified as the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface respectively.

[0025] In steps S1021-S1022, the number of atomic layers on the high nitrogen steel crystal surface and the nickel-copper solder crystal surface is judged based on the convergence test results. If the convergence test results are consistent or the same at a certain atomic layer on the high nitrogen steel crystal surface, then this atomic layer is the optimal atomic layer on the high nitrogen steel crystal surface, that is, the high nitrogen steel crystal surface at this time remains stable and can represent the true material properties, and it is determined that the target high nitrogen steel crystal surface is obtained. Otherwise, the high nitrogen steel crystal surface is still in an unstable state, and the target high nitrogen steel crystal surface cannot be obtained. The method of obtaining the target nickel-copper solder crystal surface is consistent with the target high nitrogen steel crystal surface, that is, if the convergence test results are consistent or the same at a certain atomic layer on the nickel-copper solder crystal surface, then this atomic layer is the optimal atomic layer on the nickel-copper solder crystal surface, that is, the nickel-copper solder crystal surface is stable at this time and can represent the true material properties, and it is determined that the target nickel-copper solder crystal surface is obtained, otherwise, the nickel-copper solder crystal surface is still in an unstable state, and the target nickel-copper solder crystal surface cannot be obtained.

[0026] The optimized CuNi3 and HNS crystal models were cut on the (010) surface, and the convergence of the atomic layer thickness of the cut surface was tested by calculating the surface energy and the atomic layer spacing. It was found that the 5-layer HNS crystal surface and the 7-layer CuNi3 crystal surface are convergent and can represent the real material properties.

[0027] The optimized CuNi3 and HNS crystal models were cut on the (100) plane, and the convergence of the atomic layer thickness of the cut surface was tested by calculating the surface energy and the atomic layer spacing. The results showed that the 5-layer HNS crystal surface and the 7-layer CuNi3 crystal surface are convergent and can represent the real material properties.

[0028] In step S103, after obtaining the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, a clean interface model of high nitrogen steel / nickel copper solder is constructed based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface. The specific construction method is to splice the obtained target high nitrogen steel crystal surface and the target nickel copper solder crystal surface together through visual computing simulation software. To ensure the stability of the clean interface model, the clean interface model is optimized based on multiple structural optimization parameters. The structural optimization parameters include functional, pseudopotential, K point grid, cutoff energy, maximum stress and maximum displacement, wherein the functional is an exchange-correlation functional, and the PBE form in the generalized gradient approximation (GGA) is adopted; the pseudopotential adopts an ultrasoft pseudopotential; the K point grid adopts 4×4×4; the cutoff energy is set to 500 eV; the maximum stress is set to 0.05 GPa, and the maximum displacement is set to 0.001 Å, then after structural optimization, a stable clean interface model is obtained, and the clean interface model is processed based on the active elements to obtain the doped interface model of high nitrogen steel / nickel-copper solder, that is, the active elements and the clean interface model are mixed in a predetermined manner to obtain the doped interface model of high nitrogen steel / nickel-copper solder, that is, the doped interface model of high nitrogen steel / nickel-copper solder includes active elements, high nitrogen steel, and nickel-copper solder at the same time.

[0029] After obtaining 5 layers of HNS crystal surface and 7 layers of CuNi3 crystal surface on the (010) surface, the 5 layers of HNS crystal surface and 7 layers of CuNi3 crystal surface were selected to establish the HNS / CuNi3 clean interface model as shown in Figure 3 As shown in (a), the interface fitness of the constructed clean interface model is less than 5%.

[0030] On the (100) surface, 5 layers of HNS crystal surface and 7 layers of CuNi3 crystal surface were obtained. 5 layers of HNS crystal surface and 7 layers of CuNi3 crystal surface were selected to establish the HNS / CuNi3 clean interface model. The interface fitness of the constructed clean interface model was less than 5%.

[0031] In the specific implementation process of step S103, there is an embodiment in which the clean interface model of high nitrogen steel / nickel copper solder is constructed based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, including: S10311, judging whether the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface meet the model building condition; the model building condition is that the interface fitness between the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface meets the preset fitness range; S10312. If yes, then the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface are spliced ​​to obtain a clean interface model of the high nitrogen steel / nickel-copper solder.

[0032] In steps S10311-S10312, before constructing the clean interface model based on the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface, in order to ensure the stability of the clean interface model, it is necessary to determine whether the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface meet the model construction conditions, and the model construction conditions are that the interface fitness between the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface meets the preset fitness range, and the preset fitness range is less than 6%, that is, the clean interface model can be constructed if the interface fitness between the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface is less than 6%, and if the interface fitness between the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface is higher than 6%, the clean interface model cannot be constructed, and it is necessary to cut again to obtain the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface for constructing the clean interface model.

[0033] In the specific implementation process of step S103, there is another embodiment: the active element-based processing of the clean interface model to obtain a doped interface model of high nitrogen steel / nickel-copper solder includes: S10321, selecting atoms corresponding to at least one active element to replace atoms in the clean interface model to obtain an initial doping interface model of high nitrogen steel / nickel-copper solder; S10322. Optimize the initial doping interface model according to a preset optimization method to obtain a corresponding doping interface model.

[0034] In steps S10321-S10322, at least one active element corresponding to atoms is selected to replace the atoms in the clean interface model to obtain an initial doping interface model of high nitrogen steel / nickel-copper solder, that is, at least one active element corresponding to atoms is selected to replace the atoms in the clean interface model. To ensure the effect, when performing the replacement, the present application uses atoms corresponding to one active element to replace part of the atoms in the clean interface model, thereby obtaining an initial doping interface model. When different active elements are used to replace part of the atoms in the clean interface model, different initial doping interface models can be obtained. After obtaining different initial doping interface models, all initial doping interface models are optimized according to a preset optimization method to obtain corresponding doping interface models, wherein the preset optimization method is to optimize all initial doping interface models according to structural optimization parameters, and the structural optimization parameters include functional, pseudopotential, K-point grid, cutoff energy, maximum stress and maximum displacement, wherein the functional is an exchange-correlation functional, and the PBE form in the generalized gradient approximation (GGA) is adopted; the pseudopotential adopts an ultrasoft pseudopotential; the K-point grid adopts 4×4×4; the cutoff energy is set to 500. eV; the maximum stress is set to 0.05GPa, and the maximum displacement is set to 0.001 Å. After structural optimization, different stable doping interface models are obtained.

[0035] In the specific implementation process of step S10321, there is an embodiment in which the active element includes at least one of the following: titanium Ti, zirconium Zr, and vanadium V. In this embodiment, the active elements include but are not limited to titanium Ti, zirconium Zr, and vanadium V. Then, the active elements Ti, Zr, and V replace the Cu atoms in the first layer and the Cu atoms in the third layer respectively to construct a doping model such as Figure 3 (b) Figure 3 As shown in (c), (b) is M atoms doped in the CuNi3 interface layer; (c) is M atoms doped inside the CuNi3, and the M atoms are active elements, that is, in the present application, only atoms corresponding to one element are used for replacement, and the amount of replacement is the same, and an initial doping interface model containing Ti atoms, an initial doping interface model containing Zr atoms, and an initial doping interface model containing V atoms are obtained. The initial doping interface model containing Ti atoms, the initial doping interface model containing Zr atoms, and the initial doping interface model containing V atoms are structurally optimized by a preset optimization method to obtain a doping interface model containing Ti atoms, a doping interface model containing Zr atoms, and a doping interface model containing V atoms.

[0036] In S104, after obtaining the doping interface model containing Ti atoms, the doping interface model containing Zr atoms, the doping interface model containing V atoms and the clean interface model, the evaluation dimensions to be evaluated are determined. There are multiple evaluation dimensions, namely, bonding strength and electronic structure. Based on the multiple evaluation dimensions, the clean interface model and the doping interface model of the high nitrogen steel / nickel-copper solder are evaluated to obtain corresponding evaluation results, that is, the doping interface model containing Ti atoms, the doping interface model containing Zr atoms, the doping interface model containing V atoms and the clean interface model are all evaluated to obtain corresponding evaluation data, and the obtained evaluation data are summarized to obtain evaluation results, so as to determine the performance of the multiple doping interface models based on the evaluation, thereby achieving determination of the performance of the high nitrogen steel / nickel-copper solder after the active element is regulated based on the evaluation results.

[0037] In the specific implementation process of step S104, there is another embodiment: evaluating the clean interface model and the doped interface model of the high nitrogen steel / nickel copper solder based on multiple evaluation dimensions to obtain an evaluation result, including: S1041, calling a plurality of evaluation indicators corresponding to the evaluation dimension to calculate evaluation data corresponding to the clean interface model and the doped interface model based on the evaluation indicators; S1042, fusing the evaluation data corresponding to the clean interface model and the doped interface model to obtain the evaluation result.

[0038] In steps S1041-S1042, after determining the two evaluation dimensions of bonding strength and electronic structure, the evaluation indicators are correspondingly determined, that is, the two evaluation dimensions correspond to different evaluation indicators, and the evaluation indicators include: interface adhesion work, charge density, differential charge density, state density and Mulliken layout number, and can also be other evaluation indicators, then multiple evaluation indicators corresponding to the evaluation dimensions are called to calculate the evaluation data corresponding to the clean interface model and multiple doped interface models based on the calculation method corresponding to the evaluation indicators, and the evaluation data corresponding to the clean interface model and the doped interface model are fused, that is, compared or fused in other ways to obtain the evaluation result, as follows: The bonding strength and electronic structure of the HNS / CuNi3 clean interface model and the HNS / CuNi3 doped interface model were evaluated in two evaluation dimensions: the adhesion work of the clean interface was calculated to be 7.87 J / m 2 When Ti is doped in the CuNi3 interface layer, the adhesion work is 8.01 J / m 2 like Figure 4 As shown, it indicates that Ti element has a positive effect on the interface properties of high nitrogen steel / nickel copper brazing filler metal; Figure 5Figure 2 is the charge density diagram of the interface model after complete relaxation of different element doping. (a) is the HNS / CuNi3 clean interface model; (b), (c), and (d) are Ti, Zr, and V atoms doped in the CuNi3 interface layer, respectively; (e), (f), and (g) are Ti, Zr, and V atoms doped in the interior of CuNi3, respectively. Figure 5 As shown in the figure, in the clean interface model and the doped interface model, there is an overlap of electron clouds between Fe atoms and Ni atoms, indicating that there are covalent bonds between Fe atoms and Ni atoms in the seven interfaces; the charge density near the atoms in the doped interface model is significantly different from that in the clean interface model; Figure 5 (ad) It can be seen that when the interface is generated, there are a lot of charges between the Ti, Zr, V, and Cu atoms at the interface and the Fe atoms in the interface layer, which makes them have the properties of covalent bonds with Fe atoms, and the order of charge density from large to small is Ti-Fe>Cu-Fe>V-Fe>Zr-Fe, indicating that the order of covalent bond properties from strong to weak is Ti-Fe>Cu-Fe>V-Fe>Zr-Fe, Figure 6 Figure 3 is the differential charge density diagram after complete relaxation of the interface models doped with different elements. (a) is the HNS / CuNi3 clean interface model; (b), (c) and (d) are Ti, Zr and V atoms doped in the CuNi3 interface layer respectively; (e), (f) and (g) are Ti, Zr and V atoms doped in the interior of CuNi3 respectively. In the differential charge density, the darker background color represents the charge accumulation area, and the lighter background color represents the charge dissipation area. The Cu, Ti, Zr and V atoms are surrounded by lighter areas, which means that the atoms lose electrons; there are both darker and lighter areas around the Fe atoms, which means that the Fe atoms gain electrons and lose electrons at the same time. Figure 5 (ad), there is obvious charge transfer between Cu, Ti, Zr, V atoms and Fe atoms at the interface, indicating that Cu, Ti, Zr, V atoms and Fe atoms form ionic bonds. Compared with the clean interface, Figure 5 The darker color of the charge accumulation area in (b), (c), and (d) indicates a stronger degree of charge transfer. Therefore, it can be concluded that the ionic bonds of Ti, Zr, and V-Fe are stronger than those of Cu-Fe. By comparing the degree of charge transfer between the three doping atoms and Fe atoms, the following conclusions can be drawn: the ionic bond between Zr and Fe is the strongest; the ionic bond between V and Fe is the weakest.

[0039] In summary, the covalent bond and ionic bond strength of Ti-Fe are stronger than those of Cu-Fe. Therefore, the Ti element improves the HNS / CuNi3 interface bonding strength. In addition, since the covalent bond of Cu-Fe is stronger than that of Zr-Fe and V-Fe, the Zr and V elements have a negative impact on the interface bonding strength, and the strength of the Zr-Fe covalent bond is much lower than that of Cu-Fe. This is the reason why the HNS / CuNi3-Zr doping interface bonding strength is significantly reduced. Figure 5 (e-g) and 6(e-g) show that there is no significant difference between the charge distribution around Ti and Zr atoms and the charge distribution around Cu atoms in the clean interface, indicating that Ti and Zr have excellent dissolution effects in the CuNi3 matrix, and the bonding properties of Ti-Ni and Zr-Ni are similar to those of Cu-Ni. The above analysis shows that Ti and Zr play a role in solid solution strengthening, which will improve the performance of the coating; a large amount of charge of V atoms is transferred to Ni atoms and forms covalent bonds, which will obviously increase the strength of the nickel-copper based solder and reduce its plasticity, toughness and ductility, so the doping ratio of V element should not be too high. When Ti, Zr and V are doped in the HNS / CuNi3 doping interface model, the charge accumulation density and distribution in the interface layer do not change significantly, so no further discussion is made here.

[0040] In the specific implementation process of step S1041, there is another embodiment: calling multiple evaluation indicators corresponding to the evaluation dimension to calculate the evaluation data corresponding to the clean interface model and the doped interface model based on the evaluation indicators includes: S10411, respectively inputting the clean interface model and the doped interface model into a calculation network corresponding to the evaluation index; S10412. The computing network corresponding to the evaluation index calculates the clean interface model and the doped interface model respectively to obtain corresponding evaluation data.

[0041] In steps S10411-S10412, after determining the evaluation dimension and the corresponding evaluation index, the clean interface model and the doped interface model are respectively input into the calculation network corresponding to the evaluation index. For example, the calculation network of the interface adhesion work is expressed by formula (2): (2) in , It is the separate A and B layer energies; is the total energy of the interface structure; is the interface area, is the interfacial adhesion work, The calculated value is the evaluation data corresponding to the evaluation index of interface adhesion work, and other charge density, differential charge density, state density and Mulliken layout number can be calculated according to the corresponding calculation method to obtain accurate evaluation data.

[0042] The adhesion work calculated by the HNS / CuNi3 clean interface model and the HNS / CuNi3 doped interface model can express the effect of active element doping on the interface performance in an intuitive and clear manner in the form of evaluation data. The atomic diffusion mechanism of active elements at the steel / nickel-copper solder interface is also studied through the electronic structure, revealing the influence of active elements on the bonding behavior of the high nitrogen steel / nickel-copper solder heterogeneous connection interface, and effectively predicting the effect of the reaction phase generated by active elements and iron on the high nitrogen steel / nickel-copper solder heterogeneous connection interface performance. It can also guide experiments to reduce the generation of harmful phases such as VFe phases, obtain a reliable and stable connection interface, and improve the service life of copper-steel heterogeneous joints. The method provided in this application has high efficiency and good stability, greatly reduces the experimental workload, and is helpful to solve the problem of copper-steel heterogeneous connection in the fields of aerospace, rail transportation, and engineering machinery.

[0043] Example 2 The present application also provides a device for regulating the performance of high nitrogen steel / nickel copper brazing filler metal by active elements, such as Figure 7 The block diagram of a device for regulating the performance of high nitrogen steel / nickel copper solder by active elements is shown. The functions implemented by the device for regulating the performance of high nitrogen steel / nickel copper solder by active elements correspond to the steps of executing the method for regulating the performance of high nitrogen steel / nickel copper solder by active elements on the terminal device. The device can be understood as a component of a server including a processor, and the device includes: A construction module 701 is used to construct a corresponding high nitrogen steel crystal model and a nickel copper solder crystal model based on the structures of the high nitrogen steel and the nickel copper solder, respectively, so as to cut the high nitrogen steel crystal model and the nickel copper solder crystal model to obtain a plurality of high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces; the high nitrogen steel crystal model contains atoms corresponding to the high nitrogen steel, and the nickel copper solder crystal model contains atoms corresponding to the nickel copper solder; The test module 702 is used to perform convergence tests on multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces to obtain the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces, so as to screen out the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface based on the atomic layer numbers; A processing module 703 is used to construct a clean interface model of high nitrogen steel / nickel copper solder based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, and to process the clean interface model based on active elements to obtain a doped interface model of high nitrogen steel / nickel copper solder; The evaluation module 704 is used to evaluate the clean interface model and the doped interface model of the high nitrogen steel / nickel copper solder based on multiple evaluation dimensions to obtain corresponding evaluation results, so as to determine the performance of the high nitrogen steel / nickel copper solder after active element regulation based on the evaluation results. In a feasible implementation, the evaluation module includes: A calling module, used for calling a plurality of evaluation indicators corresponding to the evaluation dimension, so as to calculate evaluation data corresponding to the clean interface model and the doped interface model based on the evaluation indicators; A fusion module is used to fuse the evaluation data corresponding to the clean interface model and the doped interface model to obtain the evaluation result.

[0044] In a feasible implementation manner, the evaluation module further includes: An input module, used to input the clean interface model and the doped interface model into a calculation network corresponding to the evaluation index respectively; A calculation module is used for the calculation network corresponding to the evaluation index to respectively calculate the clean interface model and the doped interface model to obtain corresponding evaluation data.

[0045] In a feasible implementation manner, the processing module includes: The first judgment module is used to judge whether the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface meet the model building condition; the model building condition is that the interface fitness between the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface meets the preset fitness range; A splicing module is used to splice the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface to obtain a clean interface model of the high nitrogen steel / nickel-copper solder.

[0046] In a feasible implementation, the test module includes: A second judgment module is used to judge whether the corresponding high nitrogen steel crystal surface and nickel copper solder crystal surface are stable based on the number of atomic layers; The identification module is used for identifying that if yes, the corresponding high nitrogen steel crystal surface and nickel copper solder crystal surface are the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface respectively.

[0047] In a feasible implementation manner, the processing module includes: A selection module, for selecting atoms corresponding to at least one active element to replace atoms in the clean interface model to obtain an initial doping interface model of high nitrogen steel / nickel copper solder; The optimization module is used to optimize the initial doping interface model according to a preset optimization method to obtain a corresponding doping interface model.

[0048] In a feasible implementation manner, the processing module further includes: The active element includes at least one of the following: titanium Ti, zirconium Zr, and vanadium V. Example 3 The present application also provides an electronic device, such as Figure 8 As shown, it includes: a processor 801, a memory 802 and a bus 803, the memory 802 stores machine-readable instructions executable by the processor 801, when the electronic device is running, the processor 801 communicates with the memory 802 through the bus 803, and when the machine-readable instructions are executed by the processor 801, any one of the steps of the method for regulating the performance of high nitrogen steel / nickel-copper solder with active elements is executed.

[0049] Example 4 The present application also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of any one of the methods for regulating the performance of high nitrogen steel / nickel-copper brazing alloys with active elements are executed.

[0050] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the specific working process of the system and device described above can refer to the corresponding process in the method embodiment, and will not be repeated in this application. In the several embodiments provided in this application, it should be understood that the disclosed system, device and method can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation. For example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0051] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0052] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0053] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a platform server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard drives, ROM, RAM, magnetic disks, or optical disks.

[0054] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for regulating the performance of high nitrogen steel / nickel copper brazing alloy by active elements, characterized in that: The method comprises: Based on the structures of high nitrogen steel and nickel-copper solder, a corresponding high nitrogen steel crystal model and a nickel-copper solder crystal model are respectively constructed, so as to cut the high nitrogen steel crystal model and the nickel-copper solder crystal model to obtain a plurality of high nitrogen steel crystal surfaces and nickel-copper solder crystal surfaces; the high nitrogen steel crystal model contains atoms corresponding to the high nitrogen steel, and the nickel-copper solder crystal model contains atoms corresponding to the nickel-copper solder; Conducting convergence tests on multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces respectively, obtaining the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces, respectively, so as to screen out target high nitrogen steel crystal surfaces and target nickel copper solder crystal surfaces based on the atomic layer numbers; A clean interface model of high nitrogen steel / nickel copper solder is constructed based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, and a doped interface model of high nitrogen steel / nickel copper solder is obtained by processing the clean interface model based on active elements; The clean interface model and the doped interface model of the high nitrogen steel / nickel copper solder are evaluated based on multiple evaluation dimensions to obtain corresponding evaluation results, so as to determine the performance of the high nitrogen steel / nickel copper solder after active element regulation based on the evaluation results.

2. The method according to claim 1, characterized in that The evaluation results obtained by evaluating the clean interface model and the doped interface model of the high nitrogen steel / nickel copper solder based on multiple evaluation dimensions include: Calling a plurality of evaluation indicators corresponding to the evaluation dimension to calculate evaluation data corresponding to the clean interface model and the doped interface model based on the evaluation indicators; The evaluation result is obtained by fusing the evaluation data corresponding to the clean interface model and the doped interface model.

3. The method according to claim 2, characterized in that The calling of the plurality of evaluation indicators corresponding to the evaluation dimension to calculate the evaluation data corresponding to the clean interface model and the doped interface model based on the evaluation indicators includes: Inputting the clean interface model and the doped interface model into the calculation network corresponding to the evaluation index respectively; The calculation network corresponding to the evaluation index calculates the clean interface model and the doped interface model respectively to obtain corresponding evaluation data.

4. The method according to claim 1, characterized in that: The clean interface model of high nitrogen steel / nickel copper solder is constructed based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, comprising: Determine whether the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface meet the model building condition; the model building condition is that the interface fitness between the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface meets the preset fitness range; If so, the target high nitrogen steel crystal surface and the target nickel-copper solder crystal surface are spliced ​​to obtain the clean interface model of the high nitrogen steel / nickel-copper solder.

5. The method according to claim 1, characterized in that The method of obtaining the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and the nickel copper solder crystal surfaces, respectively, and screening out the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface based on the atomic layer numbers, comprises: Based on the number of atomic layers, it is determined whether the corresponding high nitrogen steel crystal surface and nickel copper solder crystal surface are stable; If so, the corresponding high nitrogen steel crystal surface and nickel copper solder crystal surface are identified as the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, respectively.

6. The method according to claim 1, characterized in that The method of processing the clean interface model based on active elements to obtain a doped interface model of high nitrogen steel / nickel-copper solder comprises: Selecting atoms corresponding to at least one active element to replace atoms in the clean interface model to obtain an initial doping interface model of high nitrogen steel / nickel copper solder; The initial doping interface model is optimized according to a preset optimization method to obtain a corresponding doping interface model.

7. The method according to claim 6, characterized in that The active element includes at least one of the following: titanium Ti, zirconium Zr, and vanadium V.

8. A device for regulating the performance of high nitrogen steel / nickel copper brazing alloy by active elements, characterized in that: The device comprises: A construction module is used to construct a corresponding high nitrogen steel crystal model and a nickel copper solder crystal model based on the structures of the high nitrogen steel and the nickel copper solder, respectively, so as to cut the high nitrogen steel crystal model and the nickel copper solder crystal model to obtain a plurality of high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces; the high nitrogen steel crystal model contains atoms corresponding to the high nitrogen steel, and the nickel copper solder crystal model contains atoms corresponding to the nickel copper solder; A test module is used to perform convergence tests on multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces respectively to obtain the atomic layer numbers corresponding to the multiple high nitrogen steel crystal surfaces and nickel copper solder crystal surfaces, so as to screen out target high nitrogen steel crystal surfaces and target nickel copper solder crystal surfaces based on the atomic layer numbers; A processing module, for constructing a clean interface model of high nitrogen steel / nickel copper solder based on the target high nitrogen steel crystal surface and the target nickel copper solder crystal surface, and processing the clean interface model based on active elements to obtain a doped interface model of high nitrogen steel / nickel copper solder; An evaluation module is used to evaluate the clean interface model and the doped interface model of the high nitrogen steel / nickel copper solder based on multiple evaluation dimensions to obtain corresponding evaluation results, so as to determine the performance of the high nitrogen steel / nickel copper solder after active element regulation based on the evaluation results.

9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate via the bus, and when the machine-readable instructions are executed by the processor, the steps of the method for regulating the performance of high nitrogen steel / nickel-copper brazing alloy with active elements as described in any one of claims 1 to 7 are performed.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, which, when executed by a processor, executes the steps of a method for regulating the performance of high nitrogen steel / nickel-copper brazing alloy with active elements as described in any one of claims 1 to 7.

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