PCB magnetic assembly

Abstract

The invention provides a PCB magnetic assembly. The PCB magnetic assembly comprises a multi-layer circuit board support structure and a magnetic assembly. The multi-layer circuit board support structure comprises a multi-layer circuit board, the multi-layer circuit board is provided with an upper surface and a lower surface which are opposite, and the upper surface and the lower surface respectively comprise an upper connecting position and a lower connecting position. The multi-layer circuit board comprises an upper groove, a lower groove and a supporting layer. The upper groove is concavely arranged from the upper surface to the lower surface, the lower groove is concavely arranged from the lower surface to the upper surface, and the supporting layer is located between the upper groove and the lower groove. The supporting layer is an N-layer circuit board, N is greater than or equal to 1, the supporting layer comprises a copper layer and M through holes, M is greater than or equal to 2, and the copper layer is annularly arranged around the holes to form a winding. The copper layer comprises a first end which is electrically connected with an upper connecting position on the upper surface of the multi-layer circuit board and a second end which is electrically connected with a lower connecting position on the lower surface of the multi-layer circuit board. The upper surface and the lower surface of the multi-layer circuit board form the upper surface and the lower surface of the PCB magnetic assembly. The magnetic assembly is arranged in the multi-layer circuit board support structure. The magnetic component partially passes through the hole of the support layer.

Description

Technical Field

[0001] The invention relates to an assembly structure of an electronic component, in particular to a PCB magnetic component. An inductor winding is made of a PCB, and two outgoing wire ends of the winding are led out in the form of PCB pads to improve the flatness of the overall module and the welding quality. Background Art

[0002] With the rapid development and widespread application of microprocessors and communication equipment, the current flowing through computing chips has increased rapidly, exceeding 1000 amperes. This change has brought great challenges to the voltage regulator that powers the chip.

[0003] Voltage regulators are generally required to have characteristics such as low output voltage, high current, high load transient performance and high efficiency. As an indispensable part of the voltage regulator, the performance, size and cost of the inductor are crucial to the entire system.

[0004] The traditional inductor manufacturing method is to process the winding and the core separately, and then pass the winding through the core to form an independent inductor, and form the output terminal on the surface of the inductor. On the one hand, this method is affected by the processing accuracy, which can easily cause a large deviation between the winding impedance and the inductor coupling coefficient and the design value, which is not conducive to engineering application and promotion; on the other hand, the assembly accuracy will affect the subsequent welding process of the inductor, and the position of the winding and the core needs to be manually trimmed, which is not conducive to mass production of modules. On the other hand, the uneven output terminal of the inductor module will also affect the subsequent welding quality of the inductor module, and thus affect the use of the module.

[0005] In view of this, it is necessary to provide a PCB magnetic component, which uses PCB to make an inductor winding, and the two output ends of the winding are led out in the form of PCB pads to improve the flatness of the overall module, while improving the welding quality and solving the defects of the known technology. Summary of the invention

[0006] The object of the present invention is to provide a PCB magnetic component. The inductor winding is made of PCB, and two outgoing wire ends of the winding are led out in the form of PCB pads to improve the flatness of the overall module and the welding quality.

[0007] Another object of the present invention is to provide a PCB magnetic component. By producing a multi-layer circuit board support structure, an inductor winding is arranged therein, and the two outlet ends of the winding are allowed to be led out in the form of pads. Its overall flatness is much higher than the traditional assembly scheme, and the welding quality can be greatly improved. Furthermore, in the PCB production process, at least one pair of grooves are milled out in the designated area of ​​the PCB by a controlled depth milling process, and the two grooves are distributed on the upper and lower sides of the multi-layer circuit board, and their positions are opposite to each other. There is a support layer between each pair of grooves, which is composed of at least one layer of circuit board. According to the size and shape of the magnetic core, at least two holes are drilled between the two grooves to facilitate the subsequent assembly of the magnetic core through the magnetic column. The support layer can be copper-clad in a specific area to form a winding, and then electrically connected to the connection of the upper and lower surfaces of the multi-layer circuit board by electroplating punching or electroplating punching combined with PCB inner layer routing. The support layer of the multi-layer structure can be set as the primary and secondary sides of the transformer to provide the application of the transformer function. The PCB magnetic component produced by the application of the multi-layer circuit board support structure combined with the magnetic core has the characteristics of high flatness accuracy. The winding technology built into the PCB further improves the consistency of impedance and inductive coupling coefficient. In addition, the PCB magnetic component can also realize the transmission of control signals and sampling signals through the inner layer routing and punching of the multi-layer circuit board, which is used to connect the components or electrical networks above or below the PCB magnetic component. The PCB magnetic component can subsequently add a circuit layer or circuit board to connect the power circuit to form a module with power transmission and conversion function. Since the internal wiring of the PCB magnetic component passes through the internal wiring of the circuit board, the overall module can greatly improve the function of the entire module and the degree of freedom in electrical design after adding copper plating on the board edge, for example, it can input signals from the external test module to facilitate the debugging of the module. On the other hand, the assembly of the magnetic core can be bonded through the hole between the two grooves, and the magnetic core only needs to be placed in the groove for bonding of the magnetic column. Since the multi-layer circuit board bracket structure produced by the PCB process has high dimensional accuracy, there is no need to manually trim the position of the magnetic core, which is conducive to improving the production yield of the module and reducing production costs. In addition, the assembly of the magnetic core is not limited to the bonding of the upper and lower magnetic cores, and can also be composed of magnetic powder. The magnetic core formed by pressing the magnetic powder with a jig can reduce the space waste caused by assembly tolerance, minimize the gap between the magnetic core and the multi-layer circuit board bracket structure, increase the effective volume of the magnetic core structure, and solve the problem of magnetic core assembly tolerance. By adopting a process that combines magnetic core molding with a multi-layer circuit board bracket structure, the voltage resistance problem of the inductor group is better solved.

[0008] Another object of the present invention is to provide a PCB magnetic component. The PCB magnetic component formed after the multi-layer circuit board support structure and the magnetic core are assembled can be electrically connected to other circuit networks or external devices or components to form a power module. The upper surface of the PCB magnetic component is connected to the power board, and the upper surface of the power board can be provided with components such as a driver IC, and the lower surface of the PCB magnetic component can be connected to the capacitor board. The capacitor board can be provided with components such as capacitors on the side opposite to the lower surface of the PCB magnetic component, and the other side of the capacitor board has multiple electrical connection parts. When the depth-controlled milling process is used to control the depth of the grooves in the magnetic core installation area on the upper and lower surfaces of the multi-layer circuit board support structure, a corresponding margin can be reserved. The groove margin can be used to leave space for the capacitor and other components when welding the capacitor board, thereby reducing the height and volume of the entire power module and improving the power density of the power module. In addition, the PCB magnetic component can also be formed by using PCB process means to make circuit layers on the upper and lower surfaces of the PCB magnetic component to form a PCB magnetic component with a built-in magnetic component. The pads on the upper and lower surfaces of the PCB magnetic component can be connected to components or electrical networks to serve as a complete power module. In addition to the production of single modules, PCB magnetic components can also be produced in a continuous mode, with multiple PCB magnetic components forming a PCB component set. Through PCB process means, circuit layers can be made on the upper and lower surfaces of the PCB component set to form a composite PCB module with electrical functions. Components can be placed on both sides or a circuit network can be formed through internal wiring of the circuit board to conduct electrical transmission with the outside to form a power module set. The power module set can be divided into blocks to produce multiple power modules at one time. Since the PCB module adds two complete PCB surfaces, the area on the board where components can be placed is greatly increased. After reassembly through process flows such as surface mounting (SMT), the PCB module can be better used in various products to achieve miniaturization and integrated application of inductor devices.

[0009] To achieve the above-mentioned purpose, one aspect of the present invention provides a PCB magnetic component including a multi-layer circuit board support structure and a magnetic component. The multi-layer circuit board support structure includes a multi-layer circuit board, having an upper surface and a lower surface relative to each other, and the upper surface and the lower surface respectively include an upper connection position and a lower connection position. The multi-layer circuit board includes an upper groove, a lower groove and a support layer, wherein the upper groove is recessed from the upper surface to the lower surface, and the lower groove is recessed from the lower surface to the upper surface, and the support layer is located between the upper groove and the lower groove, wherein the support layer is an N-layer circuit board, N≥1, and the support layer includes a copper layer and M through holes, M≥2, and the copper layer is arranged around the hole to form a winding, wherein the copper layer includes a first end electrically connected to the upper connection position on the upper surface of the multi-layer circuit board, and a second end electrically connected to the lower connection position on the lower surface of the multi-layer circuit board, wherein the upper surface and the lower surface of the multi-layer circuit board constitute the upper surface and the lower surface of the PCB magnetic component. The magnetic component is arranged in the multi-layer circuit board support structure, wherein the magnetic component partially passes through the hole of the support layer.

[0010] In one embodiment, the multi-layer circuit board support structure includes a first side surface and a second side surface relative to each other, and a third side surface and a fourth side surface relative to each other, and the first side surface, the second side surface, the third side surface and the fourth side surface all maintain a spacing with the upper groove and the lower groove, and the multi-layer circuit board allows signal transmission through an internal routing.

[0011] In one embodiment, the first side surface, the second side surface, the third side surface and the fourth side surface allow signal transmission through copper plating on the board edge.

[0012] In one embodiment, the magnetic component is a snap-on magnetic core including an upper magnetic core and a lower magnetic core.

[0013] In one embodiment, the magnetic component has a height difference with the upper surface and the lower surface of the multi-layer circuit board respectively.

[0014] In one embodiment, the magnetic component is a magnetic powder core formed by pressing magnetic powder materials.

[0015] In one embodiment, the magnetic core upper surface and the magnetic core lower surface of the magnetic powder core are respectively recessed inward from the upper surface and the lower surface of the multi-layer circuit board.

[0016] In one embodiment, the support layer is a multi-layer structure and allows to be set as the primary side and the secondary side of the transformer.

[0017] In one embodiment, a height of an upper surface of the magnetic component does not exceed a depth of the upper groove, and a height of a lower surface of the magnetic component does not exceed a depth of the lower groove.

[0018] In one embodiment, the connection points on the upper surface and the lower surface of the PCB magnetic assembly are electrically connected to external circuits or components to form an electronic module.

[0019] In one embodiment, the upper surface of the PCB magnetic component is connected to the first circuit board, and a power device is disposed on the upper surface of the first circuit board of the first circuit board.

[0020] In one embodiment, a second circuit board is connected to the lower surface of the PCB magnetic component, and a plurality of electrical connection parts are provided on the lower surface of the second circuit board of the second circuit board to realize electrical transmission with an external device.

[0021] In one embodiment, an accommodation space is formed between the bottom surface of the magnetic core of the magnetic component and the upper surface of the second circuit board of the second circuit board to accommodate components.

[0022] In one embodiment, the components are passive components.

[0023] In one embodiment, the plurality of electrical connection portions on the lower surface of the second circuit board of the second circuit board are BGA ball arrays.

[0024] In one embodiment, an upper circuit layer is disposed on the upper surface of the PCB magnetic component, and a first outer surface of the upper circuit layer has at least one connection position, and the at least one connection position is electrically connected to an output terminal of a winding in the PCB magnetic component.

[0025] In one embodiment, a lower circuit layer is disposed on the lower surface of the PCB magnetic component, and a second outer surface of the lower circuit layer has a plurality of electrical connection portions.

[0026] In one embodiment, a plurality of PCB magnetic components are connected by a connecting piece to form a PCB component set.

[0027] In one embodiment, the upper surface of the component set and the lower surface of the component set of the PCB component set are respectively connected to the circuit board or multiple circuit layers to form electrical transmission with an external network or device to form an electronic module set.

[0028] In one embodiment, the upper surface of the component assembly and the lower surface of the component assembly of the electronic module assembly include a plurality of electrical connection sites for placing power devices or connecting to an external network.

[0029] In one embodiment, the electronic module set is divided into blocks to form a plurality of electronic modules that can work independently.

[0030] In one embodiment, one end of the winding is led out from the upper connection point, and the other end of the winding is led out from the lower connection point.

[0031] The beneficial effect of the present invention is that an embodiment of the present invention provides a PCB magnetic component that uses a PCB to make an inductor winding. The two output terminals of the winding are allowed to be led out in the form of pads, so that the overall flatness of the PCB magnetic component is much higher than the traditional assembly solution, and the welding quality can be greatly improved. The winding technology built into the PCB further improves the consistency of impedance and inductive coupling coefficient. Furthermore, the magnetic core assembly built into the multi-layer circuit board bracket structure is not limited to the bonding of the upper and lower magnetic cores, but can also be composed of magnetic powder, which is conducive to solving the problem of magnetic core assembly tolerance, improving power density, while improving the production yield of the module and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to more fully understand the above contents, and are not intended to limit the present invention.

[0033] Figure 1 A structural stereogram of a PCB magnetic assembly according to a first embodiment of the present invention is disclosed;

[0034] Figure 2 A structural exploded view of a PCB magnetic assembly in a top view according to a first embodiment of the present invention is disclosed;

[0035] Figure 3Disclosed is a structural exploded view of a PCB magnetic assembly in a first embodiment of the present invention when viewed from a bottom perspective;

[0036] Figure 4 A schematic cross-sectional structure diagram of a PCB magnetic assembly according to a first embodiment of the present invention is disclosed;

[0037] Figure 5 A structural stereogram of an electronic module using a PCB magnetic component according to a second embodiment of the present invention is disclosed;

[0038] Figure 6 A structural exploded view of an electronic module using a PCB magnetic component in a second embodiment of the present invention is disclosed in a top view;

[0039] Figure 7 A structural exploded view of an electronic module using a PCB magnetic component in a second embodiment of the present invention is disclosed in a bottom-up perspective;

[0040] Figure 8 A schematic cross-sectional structure diagram of an electronic module using a PCB magnetic component according to a second embodiment of the present invention is disclosed;

[0041] Figures 9 to 14 A schematic diagram of the manufacturing process of a PCB magnetic component according to a third embodiment of the present invention is disclosed;

[0042] Fig.15 A structural stereogram of a PCB magnetic assembly according to a third embodiment of the present invention is disclosed;

[0043] Fig.16 Disclose a structural exploded view of a PCB magnetic assembly according to a fourth embodiment of the present invention;

[0044] Fig.17 A schematic cross-sectional structure diagram of a PCB magnetic assembly according to a fourth embodiment of the present invention is disclosed;

[0045] Fig.18 A structural stereogram of a PCB magnetic assembly according to a fifth embodiment of the present invention is disclosed;

[0046] Fig.19 A structural exploded view of a PCB magnetic assembly according to a fifth embodiment of the present invention is disclosed; and

[0047] Fig. 20 A schematic cross-sectional structure diagram of a PCB magnetic assembly according to a fifth embodiment of the present invention is disclosed. DETAILED DESCRIPTION

[0048] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different ways, all of which do not depart from the scope of the present invention, and the description and drawings therein are essentially used for illustrative purposes rather than for limiting the present invention. For example, if the following content of the present disclosure describes that a first feature is set on or above a second feature, it means that it includes an embodiment in which the first feature set is in direct contact with the second feature, and also includes an embodiment in which the additional feature can be set between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, different embodiments of the present disclosure may use repeated reference symbols and / or marks. These repetitions are for the purpose of simplification and clarity, and are not used to limit the relationship between the various embodiments and / or the appearance structure. Furthermore, in order to facilitate the description of the relationship between a component or feature component and another (plural) component or (plural) feature component in the drawings, spatially related terms such as "upper", "lower", "top", "bottom" and similar terms may be used. In addition to the orientation shown in the drawings, spatially related terms are used to cover different orientations of the device in use or operation. The device may also be positioned in another manner (e.g., rotated 90 degrees or located in other orientations), and the description of the spatially related terms used is interpreted accordingly. In addition, when a component is referred to as "connected to" or "coupled to" another component, it may be directly connected to or coupled to another component, or there may be an intervening component. Although the numerical ranges and parameters of the broad scope of the present disclosure are approximate values, the numerical values ​​are stated in the specific examples as accurately as possible. In addition, it is understood that although the words "first", "second", "third" and the like may be used in the claims to describe different components, these components should not be limited by these terms, and the components described accordingly in the embodiments are represented by different component symbols. These terms are for different components respectively. For example: the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component without departing from the scope of the embodiment. The term "and / or" used in this way includes any or all combinations of one or more related listed items.

[0049] Figure 1 A structural stereogram of a PCB magnetic assembly according to a first embodiment of the present invention is disclosed. Figure 2 A structural exploded view of a PCB magnetic assembly according to a first embodiment of the present invention is disclosed from a top view. Figure 3 A structural exploded view of a PCB magnetic assembly according to a first embodiment of the present invention is disclosed when viewed from a bottom perspective. Figure 4The cross-sectional structure diagram of the PCB magnetic component of the first embodiment of the present invention is disclosed. In this embodiment, the present invention provides a PCB magnetic component 1 including a multi-layer circuit board support structure 10 and a magnetic component 20. The multi-layer circuit board support structure 10 includes a multi-layer circuit board 11, which has an upper surface 12 and a lower surface 13 relative to each other. The upper surface 12 and the lower surface 13 respectively include an upper connection position 121 and a lower connection position 131. In this embodiment, the multi-layer circuit board 11 also includes an upper groove 14, a lower groove 15 and a support layer 16. The upper groove 14 is recessed from the upper surface 12 to the lower surface 13 in the direction (i.e., the reverse Z-axis direction), and the lower groove 15 is recessed from the lower surface 13 to the upper surface 12 in the direction (i.e., the Z-axis direction). In this embodiment, the support layer 16 is located between the upper groove 14 and the lower groove 15. The support layer 16 is more, for example, an N-layer circuit board of a multi-layer board structure, N≥1. In this embodiment, the support layer 16 includes a copper layer 161 and M through holes 162, M≥2. The copper layer 161 is arranged around the hole 162 to form a winding. In addition, the copper layer 161 includes a first end electrically connected to the upper connection position 121 of the upper surface 12 of the multi-layer circuit board 11, and a second end electrically connected to the lower connection position 131 of the lower surface 13 of the multi-layer circuit board 11. It should be noted that in this embodiment, the upper surface 12 and the lower surface 13 of the multi-layer circuit board 11 constitute the upper surface 12 and the lower surface 13 of the PCB magnetic component 1. The magnetic component 20 is arranged in the multi-layer circuit board support structure 10. In one embodiment, the magnetic component 20 is more, for example, a snap-fit ​​magnetic core, including an upper magnetic core 21 and a lower magnetic core 22, wherein the upper magnetic core 21 and the lower magnetic core 22 are further partially connected through the hole 162 of the support layer 16, so that the magnetic component 20 is snap-fitted in the multi-layer circuit board support structure 10.

[0050] It is worth noting that the PCB magnetic component 1 sets the winding of the magnetic component 20 in the multi-layer circuit board bracket structure 10, and the two output ends of the winding are allowed to be led out to the upper connection position 121 of the upper surface 12 and the lower connection position 131 of the lower surface 13 in the form of solder pads. The upper surface 12 and the lower surface 13 of the PCB magnetic component 1 are composed of the upper surface 12 and the lower surface 13 of the multi-layer circuit board 11, and its overall flatness is much higher than that of the traditional assembly scheme, and can greatly improve the welding quality of the upper connection position 121 and the lower connection position 131.

[0051] In this embodiment, the multilayer circuit board support structure 10 includes a first side surface S1 and a second side surface S2 opposite to each other, and a third side surface S3 and a fourth side surface S4 opposite to each other. The first side surface S1, the second side surface S2, the third side surface S3 and the fourth side surface S4 are all spaced apart from the upper groove 14 and the lower groove 15. In other words, the upper groove 14 and the lower groove 15 are limited to a designated area of ​​the inner edge of the multilayer circuit board 11. In this way, the multilayer circuit board 11 can be milled out with at least one pair of upper grooves 14 and lower grooves 15 in a designated area by a controlled depth milling process. The upper grooves 14 and the lower grooves 15 are distributed on the upper surface 12 and the lower surface 13 of the multilayer circuit board 11, and their positions are opposite to each other. There is a support layer 16 between each pair of upper grooves 14 and lower grooves 15, and the support layer 16 is composed of at least one layer of circuit board. According to the size and shape of the upper magnetic core 21 and the lower magnetic core 22, at least two holes 162 are drilled between the upper groove 14 and the lower groove 15 to facilitate the subsequent assembly of the upper magnetic core 21 and the lower magnetic core 22 through the upper magnetic column 211 and the lower magnetic column 221. In this embodiment, the assembly of the upper magnetic core 21 and the lower magnetic core 22 can be, for example, bonded through the holes 162 between the upper groove 14 and the lower groove 15, and the upper magnetic core 21 and the lower magnetic core 22 only need to be placed in the upper groove 14 and the lower groove 15 respectively to bond the upper magnetic column 211 and the lower magnetic column 221. Since the multi-layer circuit board bracket structure 10 produced by the PCB process has high dimensional accuracy, there is no need to manually trim the position of the upper magnetic core 21 and the lower magnetic core 22, which is conducive to improving the production yield of the module and reducing the production cost. Of course, the present invention is not limited to this.

[0052] In this embodiment, the support layer 16 can form a winding according to the copper layer 161 in a specific area, and then be electrically connected to the upper connection position 121 on the upper surface 12 of the multi-layer circuit board 11 and the lower connection position 131 on the lower surface 13 by electroplating punching or electroplating punching combined with inner layer routing. Figure 4As shown, in this embodiment, the multilayer circuit board 11 can determine the controlled depth milling area of ​​the upper groove 14 and the lower groove 15 according to the shape and size of the upper magnetic core 21 and the lower magnetic core 22, and then control the depth milling downward from the GTL layer to expose the G3 layer, and control the depth milling upward from the GBL layer to expose the G4 layer. The G3 layer and the G4 layer are the support layer 16 of this embodiment. Then, holes 162 are punched in the upper groove 14 and the lower groove 15 area according to the shape and size of the upper magnetic column 211 and the lower magnetic column 221, and penetrate the G3 layer and the G4 layer for the installation of the upper magnetic column 211 and the lower magnetic column 221. In this embodiment, the copper cladding of the G3 layer and the G4 layer can form a partial winding according to the copper layer 161 of a specific area, and form an upper connection position 121 and a lower connection position 131 of the lower surface 13 on the upper surface 12 (i.e., the GTL layer) and the lower surface 13 (i.e., the GBL layer) of the multilayer circuit board 11, respectively. The windings of the G3 layer and the G4 layer can be electrically connected to the upper connection position 121 and the lower connection position 131 by electroplating punching or electroplating punching combined with inner layer routing. That is, the multilayer circuit board 11 allows signal transmission through an internal routing. In addition, the support layer 16 of the multilayer structure can also be set as the primary and secondary sides of the transformer to provide the application of the transformer function. In this embodiment, the first side S1, the second side S2, the third side S3 and the fourth side S4 also allow signal transmission through the copper plating 17 of the board edge. Of course, the present invention is not limited to this. The PCB magnetic component 1 produced by the application of the multilayer circuit board support structure 10 combined with the magnetic component 20 has the characteristics of high flatness accuracy. Therefore, the winding technology built into the PCB magnetic component 1 further improves the consistency of impedance and inductive coupling coefficient.

[0053] On the other hand, since the upper surface 12 and the lower surface 13 of the PCB magnetic component 1 are formed by the upper surface 12 and the lower surface 13 of the multi-layer circuit board 11, the magnetic component 20 is arranged in the multi-layer circuit board support structure 10 without affecting the overall flatness. Therefore, the upper magnetic core 21 of the magnetic component 20 does not exceed the upper surface 12 of the multi-layer circuit board 11, and the upper surface 210 of the upper magnetic core 21 maintains a height difference D1 with the upper surface 12 of the multi-layer circuit board 11. Similarly, the lower magnetic core 22 of the magnetic component 20 does not exceed the lower surface 13 of the multi-layer circuit board 11, and the lower surface 220 of the lower magnetic core 22 maintains a height difference D2 with the lower surface 13 of the multi-layer circuit board 11. In this embodiment, the multi-layer circuit board support structure 10 forms an upper groove 14 with a depth H1 on the upper surface 12 of the multi-layer circuit board 11, and forms a lower groove 15 with a depth H2 on the lower surface 13 of the multi-layer circuit board 11 through a controlled depth milling process. In addition, the upper magnetic core 21 is composed of an upper magnetic column 211 and an upper magnetic cover 212, and the upper magnetic cover 212 has a height h1. The lower magnetic core 22 is composed of a lower magnetic column 221 and a lower magnetic cover 222, and the lower magnetic cover 222 has a height h2. When the upper magnetic column 211 of the upper magnetic core 21 and the lower magnetic column 221 of the lower magnetic core 22 are bonded through the hole 162 between the upper groove 14 and the lower groove 15, the upper magnetic cover 212 of the upper magnetic core 21 is more closely attached to the bottom surface of the upper groove 14. At this time, the height h1 of the upper magnetic cover 212 is the height of the upper surface 210 of the magnetic component 20 relative to the bottom surface of the upper groove 14, and does not exceed the depth H1 of the upper groove 14, so the upper surface 210 of the upper magnetic core 21 will not exceed the upper groove 14 after assembly. In addition, when the upper magnetic column 211 of the upper magnetic core 21 and the lower magnetic column 221 of the lower magnetic core 22 are bonded through the hole 162 between the upper groove 14 and the lower groove 15, the lower magnetic cover 222 of the lower magnetic core 22 is not limited to fit the bottom surface of the lower groove 15. At this time, the height h2 of the lower magnetic cover 222 is less than the height of the lower surface 220 of the magnetic component 20 relative to the bottom surface of the lower groove 15, and less than the depth H2 of the lower groove 15, so the lower surface 220 of the lower magnetic core 22 will not exceed the lower groove 15 after assembly. Of course, the form of the magnetic component 20 and the way it is arranged in the multi-layer circuit board bracket structure 10 can be adjusted according to application requirements, and the present invention is not limited thereto.

[0054] Figure 5 A structural stereogram of an electronic module using a PCB magnetic component according to a second embodiment of the present invention is disclosed. Figure 6 A structural exploded view of an electronic module using a PCB magnetic component in a second embodiment of the present invention is disclosed in a top view. Figure 7 A structural exploded view of an electronic module using a PCB magnetic component in a second embodiment of the present invention is disclosed in a bottom-up perspective. Figure 8 The cross-sectional structure diagram of the electronic module using the PCB magnetic component in the second embodiment of the present invention is disclosed. In this embodiment, the PCB magnetic component 1 and Figures 1 to 4The PCB magnetic assembly 1 shown is similar, and the same component number represents the same component, structure and function, which will not be repeated here. In this embodiment, the upper surface 12 and the lower surface 13 of the PCB magnetic assembly 1 are further connected to the first circuit board 30 and the second circuit board 40 respectively to form an electronic module 2. The first circuit board 30 is, for example, a power board, and a power device 33 is arranged on the upper surface 31 of the first circuit board. The upper connection position 121 of the upper surface 12 of the PCB magnetic assembly 1 is electrically connected to the power device 33 through the connection position 321 of the lower surface 32 of the first circuit board. In addition, the lower connection position 131 of the lower surface 13 of the PCB magnetic assembly 1 is, for example, electrically connected to the connection position 411 of the upper surface 41 of the second circuit board, and the second circuit board lower surface 42 of the second circuit board 40 has a plurality of electrical connection parts 44 for realizing electrical transmission with an external device. In this embodiment, the second circuit board 40 is, for example, a capacitor plate, and the plurality of electrical connection parts 44 of the lower surface 42 of the second circuit board are, for example, a BGA ball array. In other embodiments, the upper connection position 121 of the upper surface 12 and the lower connection position 131 of the lower surface 13 of the PCB magnetic component 1 can be electrically connected to external circuits or components to form an electronic module 2, preferably passive components, but not limited to this. It is worth noting that in this embodiment, the PCB magnetic component 1 further adds a first circuit board 30 and a second circuit board 40 to connect the power circuit to form an electronic module 2 with power transmission function. In other applications, the PCB magnetic assembly formed after the multi-layer circuit board support structure 10 and the magnetic component 20 are assembled can be electrically connected to other networks or external devices or components to form an electronic module 2 such as a power module. The internal wiring of the PCB magnetic component 1 can achieve circuit connection and maintain overall flatness through the internal wiring of the multi-layer circuit board 11 or the PCB buried copper 18, and if the overall module is increased by copper plating 17 on the edge of the board (see Figure 1 ) can also greatly improve the function of the electronic module 2 and the degree of freedom in electrical design, for example, it can input signals from an external test module to facilitate module debugging, etc. Of course, the present invention is not limited thereto.

[0055] On the other hand, in this embodiment, when the multi-layer circuit board support structure 10 forms the upper groove 14 and the lower groove 15 on the upper surface 12 of the multi-layer circuit board 11 through the controlled depth milling process, a corresponding margin can be reserved. After the magnetic component 20 is buckled into the multi-layer circuit board support structure 10, an accommodation space 152 can be formed between the bottom surface of the magnetic core of the magnetic component 20 (i.e., the lower surface 220 of the lower magnetic core 22) and the second circuit board upper surface 41 of the second circuit board 40 to accommodate the components 43 on the second circuit board upper surface 41. As a result, the height and volume of the electronic module 2 can be reduced, thereby improving the overall power density. Of course, the present invention is not limited to this.

[0056] Figures 9 to 14A schematic diagram of the manufacturing process of a PCB magnetic component according to a third embodiment of the present invention is disclosed. Fig.15 The third embodiment of the present invention discloses a three-dimensional structural diagram of a PCB magnetic component. In this embodiment, the PCB magnetic component 1a and Figures 1 to 4 The PCB magnetic component 1 shown is similar, and the same component number represents the same component, structure and function, which will not be repeated here. In this embodiment, the magnetic component 20a is a magnetic powder core formed by pressing magnetic powder. The multi-layer circuit board support structure 10' and the magnetic component 20a can be assembled by filling the upper groove 14, the lower groove 15 and the hole 162 of the multi-layer circuit board 11 with magnetic powder. The assembly process of the multi-layer circuit board support structure 10' and the magnetic component 20a is described below.

[0057] First, if Fig. 9 As shown, a protective film 80 is attached to the upper surface 12 of the multilayer circuit board 11 to protect the upper connection position 121 of the upper surface 12. Similarly, a protective film 81 is attached to the lower surface 13 of the multilayer circuit board 11 to protect the pads of the lower surface 13. Fig.10 As shown, the protected multi-layer circuit board support structure 10' is placed in the inner space 90 of the lower mold 91, and the lower boss 91 in the inner space 90 is aligned with the lower groove 15. Fig.11 As shown, the magnetic powder 200 can be injected through the upper groove 14 of the multi-layer circuit board 11. The magnetic powder 200, for example, includes a magnetic wet material obtained by mixing magnetic powder and epoxy glue, which can fully fill the space between the lower groove 15 and the lower boss 91 through the upper groove 14 and the hole 162. In one embodiment, the lower mold 90 is heated together with the multi-layer circuit board support structure 10' and the magnetic powder 200. As the temperature gradually rises from room temperature to 180°C, the fluidity of the mixed powder is enhanced, presenting a slurry-like state. At the same time, the lower mold 90 is vibrated, so that the magnetic powder 200 can fill the upper groove 14, the hole 162 and the lower groove 15 on the lower boss 91. Then, the upper mold 92 is installed in pair with the alignment hole 95 of the lower mold 90 through the pin 96, so that the upper boss 94 can press the magnetic powder 200 in the upper groove 14, as shown in FIG. Fig.12 and Fig.13 As shown. The downward pressure is controlled to increase gradually until the mold is completely closed. In this embodiment, the distance is gradually increased from 2t to 4t, and then the pressure is maintained for a period of time. The schematic diagram after the multi-layer circuit board support structure 10' and the magnetic component 20a are assembled is shown in FIG. Fig.14As shown. After the pressure is maintained, the magnetic powder is removed from the mold and embedded in the integrated multi-layer circuit board bracket structure 10', which is placed in an oven for drying and baking. In this embodiment, the drying and baking temperature is controlled at 150-200°C for 3-5 hours to remove the moisture in the magnetic powder and some organic matter in the epoxy glue, which can avoid the subsequent PCB magnetic component 1a from being damp. The effect after molding is as follows Fig.15 shown.

[0058] In the present embodiment, the upper surface 210 of the magnetic component 20a does not exceed the upper surface 12 of the multi-layer circuit board 11, and the upper surface 210 maintains a height difference D1 with the upper surface 12 of the multi-layer circuit board 11. Similarly, the lower surface 210 of the magnetic component 20 does not exceed the lower surface 13 of the multi-layer circuit board 11, and the lower surface 220 maintains a height difference D2 with the lower surface 13 of the multi-layer circuit board 11. In the present embodiment, the multi-layer circuit board support structure 10 forms an upper groove 14 with a depth H1 on the upper surface 12 of the multi-layer circuit board 11, and forms a lower groove 15 with a depth H2 on the lower surface 13 of the multi-layer circuit board 11 through a controlled depth milling process. In addition, the magnetic component 20a has a height h1 relative to the support layer 16 at the bottom of the upper groove 14, which is less than the depth H1 of the upper groove 14. The magnetic component 20a has a height h2 relative to the support layer 16 at the bottom of the lower groove 14, which is less than the depth H2 of the lower groove 15. In this embodiment, in order to avoid the subsequent SMT process, the surface of the magnetic powder core of the magnetic component 20a may be higher than the surface pad of the multi-layer circuit board 11 due to the high temperature warping of the circuit board, the design of the lower boss 91 of the lower mold 90 and the upper boss 94 of the upper mold 92 will make the upper surface 210 and the lower surface 220 of the formed magnetic component 20a lower than the upper surface 12 of the multi-layer circuit board 11 by at least 0.2mm. As a result, the upper surface 210 and the lower surface 220 of the magnetic powder core are respectively recessed inward from the upper surface 12 and the lower surface 13 of the multi-layer circuit board 11, which can effectively reduce the problems of empty solder joints and cold solder joints.

[0059] like Fig.15As shown, the PCB magnetic component 1a is composed of a multi-layer circuit board support structure 10' in which magnetic powder 200 is embedded and formed integrally. Among them, the G1 layer, G2 layer, G3 layer, G4 layer, G5 layer, G6 layer, G7 layer, and G8 layer are the inner layers of the multi-layer circuit board 11, which are used for internal routing and copper cladding. The GTL layer and GBL layer are the surface layers of the multi-layer circuit board 11, which are used to set the welding positions of the upper connection position 121 and the lower connection position 131. The electrical connection between the inner layers of the multi-layer circuit board 11 and between the inner layer and the surface layer can be achieved by electroplating and punching. The process of forming the PCB magnetic component 1a by embedding the magnetic powder 200 into the multi-layer circuit board support structure 10' can reduce the space waste caused by assembly tolerance, minimize the gap between the magnetic component 20a and the multi-layer circuit board 11, increase the effective volume of the magnetic structure, and solve the problem of magnetic core assembly tolerance. At the same time, due to the process of combining magnetic core molding with the multi-layer circuit board support structure 10', the voltage resistance problem of the inductor winding is better solved.

[0060] Fig.16 A structural exploded view of a PCB magnetic assembly according to a fourth embodiment of the present invention is disclosed. Fig.17 The cross-sectional structure diagram of the PCB magnetic component of the fourth embodiment of the present invention is disclosed. In this embodiment, the PCB magnetic component 1 and Figures 1 to 4 The PCB magnetic components 1 shown are similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, the aforementioned multiple PCB magnetic components 1 (see Figure 1 ) can be connected through a connecting piece 100 to form a PCB component set 1'. In this embodiment, the component set upper surface 101 and the component set lower surface 102 of the PCB component set 1' are respectively connected to the circuit boards 71 ​​and 72, and then form electrical transmission with an external network or device to form an electronic module set 3. In other embodiments, the circuit boards 71 ​​and 72 can be replaced by multiple circuit layers, for example, but the present invention is not limited to this. In this embodiment, the component set upper surface 73 and the component set lower surface 74 of the electronic module set 3 include multiple electrical connection positions 731 and 744 for placing power devices or connecting to an external network. In this embodiment, the electronic module set 3 is divided into blocks to form multiple electronic modules 2 that can work independently (see Figure 5 ).

[0061] It can be seen from this that the PCB magnetic component 1 can also be made into a circuit layer on the upper and lower surfaces of the PCB magnetic component 1 by means of PCB process, and a magnetic component 20 is formed with a built-in PCB magnetic component 1 that is not exposed. The pads on the upper and lower surfaces of the PCB magnetic component 1 can be connected to components or electrical networks according to application requirements, and can be used as a complete power module. Furthermore, in addition to the production of a single module, the PCB magnetic component 1 can also be produced in a continuous piece mode, and multiple PCB magnetic components 1 form a PCB component set 1'. By means of PCB process, circuit layers can be made or circuit boards can be added on the upper and lower surfaces of the PCB component set 1' to form a composite PCB module with electrical functions, and components can be placed on both sides or a circuit network can be formed through the internal wiring of the circuit board to conduct electrical transmission with the outside to form a power module set 3. The power module set 3 can be further divided into blocks to produce multiple power modules at one time, which is conducive to improving the production efficiency of the module and reducing the production cost. Of course, the application of the PCB component set 1' divided into PCB magnetic components 1 or architecture power module set 3 can be adjusted according to actual application requirements, and the present invention is not limited to this.

[0062] Fig.18 A structural stereogram of a PCB magnetic assembly according to a fifth embodiment of the present invention is disclosed. Fig.19 A structural exploded view of a PCB magnetic assembly according to a fifth embodiment of the present invention is disclosed. Fig. 20 The cross-sectional structure diagram of the PCB magnetic component of the fifth embodiment of the present invention is disclosed. In this embodiment, the PCB magnetic component 1b and Figures 1 to 4The PCB magnetic component 1 shown is similar, and the same component number represents the same component, structure and function, which will not be repeated here. In this embodiment, the PCB magnetic component 1b further uses PCB process means such as PP pressing, exposure, development, etching, and stripping to set the upper circuit layer 111 on the upper surface 12' after the magnetic component 20 is buckled, and the first outer surface 12" of the upper circuit layer 111 has at least one upper connection position 121" as a pad, allowing the power device 33 to be directly set. In this embodiment, at least one upper connection position 121" can be electrically connected to the output terminal of the winding in the PCB magnetic component 1b through inner layer routing and interlayer punching. In addition, the PCB magnetic component 1b further uses PCB process means such as PP pressing, exposure, development, etching, and stripping to set the lower circuit layer 112 on the lower surface 13' after the magnetic component 20 is buckled, and the second outer surface 13" of the lower circuit layer 112 has multiple electrical connection parts 44. The multiple electrical connection parts 44 are, for example, a BGA array. Thus, the multi-layer circuit board 11 that has been assembled with the magnetic component 20 is allowed to be further formed into a multi-layer circuit board 11a with a complete first outer surface 12” and a second outer surface 13” through PCB process means, and the magnetic component 20 is embedded therein. Among them, the G1 layer, G2 layer, G3 layer, G4 layer, G5 layer, G6 layer, G7 layer, G8 layer, G9 layer, and G10 layer are the inner layers of the multi-layer circuit board 11a, which are used for internal routing and copper cladding. The GTL layer and the GBL layer are the surface layers of the multi-layer circuit board 11a, which are used to set the welding positions of the upper connection position 121” and the lower connection position 131”. Electrical connection can be achieved between the inner layers of the multi-layer circuit board 11a and between the inner layers and the surface layers by electroplating and punching. In addition, the first outer surface 12” and the second outer surface 13” serve as the two sides of the PCB magnetic component 1b, and can be connected with components or electrical networks to finally form an electronic module 2a. Since the PCB magnetic component 1b has two complete first outer surfaces 12” and second outer surfaces 13”, the area on which components can be placed on the PCB magnetic component 1b is greatly increased. After the PCB magnetic component 1b is assembled with the power device 33 and multiple electrical connection parts 44 through SMT and other process flows, the formed electronic module 2a can be better applied to various products to achieve miniaturization and integrated application of inductive devices. Of course, in other embodiments, the multi-layer circuit board 11 is combined with the upper circuit layer 111 and / or the lower circuit layer 112 to construct the multi-layer circuit board bracket structure 10a. The order, number of layers and the method of combining the magnetic components 20 can be adjusted according to the actual application requirements. The present invention is not limited to this and will not be repeated.

[0063] In summary, the present invention provides a PCB magnetic component. The inductor winding is made of PCB, and the two outlet ends of the winding are led out in the form of PCB pads to improve the flatness of the overall module and the welding quality. The inductor winding is arranged in the multi-layer circuit board bracket structure by producing the multi-layer circuit board bracket structure, and the two outlet ends of the winding are allowed to be led out in the form of pads. The overall flatness is much higher than the traditional assembly scheme, and the welding quality can be greatly improved. Furthermore, in the PCB production process, at least one pair of grooves are milled in the designated area of ​​PCB by the controlled depth milling process, and the two grooves are distributed on the upper and lower sides of the multi-layer circuit board, and their positions are opposite to each other. There is a support layer between each pair of grooves, which is composed of at least one layer of circuit board. According to the size and shape of the magnetic core, at least two holes are drilled between the two grooves to facilitate the subsequent assembly of the magnetic core through the magnetic column. The support layer can be copper-clad in a specific area to form a winding, and then electrically connected to the connection of the upper and lower surfaces of the multi-layer circuit board by electroplating punching or electroplating punching combined with PCB inner layer routing. The support layer of the multi-layer structure can be set as the primary side and secondary side of the transformer to provide the application of the transformer function. The PCB magnetic assembly produced by the application of the multi-layer circuit board bracket structure combined with the magnetic core has the characteristics of high flatness accuracy. The winding technology built into the PCB further improves the consistency of impedance and inductive coupling coefficients. In addition, the PCB magnetic assembly can also realize the transmission of control signals and sampling signals through the inner layer routing and punching of the multi-layer circuit board, which is used to connect the components or electrical networks above or below the PCB magnetic assembly. The PCB magnetic assembly can subsequently add circuit layers or circuit boards to connect the power circuit to form a module with power transmission and conversion functions. Since the internal wiring of the PCB magnetic assembly passes through the internal wiring of the circuit board, the overall module can greatly improve the function of the entire module and the freedom of electrical design after adding copper plating on the edge of the board, such as being able to input signals from the external test module to facilitate the debugging of the module. On the other hand, the assembly of the magnetic core can be bonded through the holes between the two grooves, and the magnetic core only needs to be placed in the groove for bonding of the magnetic column. Since the multi-layer circuit board bracket structure produced by the PCB process has high dimensional accuracy, there is no need to manually trim the position of the magnetic core, which is conducive to improving the production yield of the module and reducing production costs. In addition, the assembly of the magnetic core is not limited to the bonding of the upper and lower magnetic cores, and can also be composed of magnetic powder. The magnetic core formed by pressing magnetic powder with a jig can reduce the space waste caused by assembly tolerance, minimize the gap between the magnetic core and the multi-layer circuit board bracket structure, increase the effective volume of the magnetic core structure, and solve the problem of magnetic core assembly tolerance. And by combining the process of magnetic core molding with the multi-layer circuit board bracket structure, the voltage resistance problem of the inductor group is also better solved.

[0064] The present invention may be modified in various ways by those skilled in the art, but all of these modifications are within the scope of the claims of the present invention.

Claims

1. A PCB magnetic component, characterized in that: include: A multi-layer circuit board support structure includes a multi-layer circuit board having an upper surface and a lower surface opposite to each other, wherein the upper surface and the lower surface respectively include an upper connection position and a lower connection position; The multi-layer circuit board comprises an upper groove, a lower groove and a support layer, wherein the upper groove is recessed from the upper surface to the lower surface, and the lower groove is recessed from the lower surface to the upper surface, and the support layer is located between the upper groove and the lower groove, wherein the support layer is an N-layer circuit board, N≥1, and the support layer comprises a copper layer and M through holes, M≥2, and the copper layer is arranged around the holes to form a winding, wherein the copper layer comprises a first end electrically connected to the upper connection position of the upper surface of the multi-layer circuit board, and a second end electrically connected to the lower connection position of the lower surface of the multi-layer circuit board, wherein the upper surface and the lower surface of the multi-layer circuit board constitute an upper surface and a lower surface of the PCB magnetic component; and A magnetic component is arranged in the multi-layer circuit board support structure, wherein a portion of the magnetic component passes through the hole of the support layer.

2. The PCB magnetic assembly according to claim 1, characterized in that: The multi-layer circuit board support structure includes a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The first side, the second side, the third side and the fourth side all maintain a spacing with the upper groove and the lower groove. The multi-layer circuit board allows signal transmission through an internal routing.

3. The PCB magnetic assembly according to claim 2, characterized in that: The first side surface, the second side surface, the third side surface and the fourth side surface allow signal transmission to be achieved through copper plating on a board edge.

4. The PCB magnetic assembly according to claim 1, characterized in that: The magnetic component is a buckled magnetic core, comprising an upper magnetic core and a lower magnetic core.

5. The PCB magnetic assembly according to claim 4, characterized in that: The magnetic component has a height difference with the upper surface and the lower surface of the multi-layer circuit board respectively.

6. The PCB magnetic assembly according to claim 1, characterized in that: The magnetic component is a magnetic powder core formed by pressing magnetic powder materials.

7. The PCB magnetic assembly according to claim 6, characterized in that: A magnetic core upper surface and a magnetic core lower surface of the magnetic powder core are respectively recessed inward from the upper surface and the lower surface of the multi-layer circuit board.

8. The PCB magnetic assembly according to claim 1, characterized in that: The support layer is a multi-layer structure and allows to be set as the primary side and the secondary side of a transformer.

9. The PCB magnetic assembly according to claim 1, characterized in that: The height of an upper surface of the magnetic component does not exceed the depth of the upper groove, and the height of a lower surface of the magnetic component does not exceed the depth of the lower groove.

10. The PCB magnetic assembly according to claim 1, characterized in that: The connection position of the upper surface and the lower surface of the PCB magnetic component is electrically connected to an external circuit or a component to form an electronic module.

11. The PCB magnetic assembly according to claim 10, characterized in that: The upper surface of the PCB magnetic component is connected to a first circuit board, and a power device is arranged on a first circuit board upper surface of the first circuit board.

12. The PCB magnetic assembly according to claim 10, characterized in that: A second circuit board is connected to the lower surface of the PCB magnetic component, and a second circuit board lower surface of the second circuit board has a plurality of electrical connection parts for realizing electrical transmission with an external device.

13. The PCB magnetic assembly according to claim 12, characterized in that: An accommodating space is formed between a magnetic core bottom surface of the magnetic component and an upper surface of a second circuit board of the second circuit board for accommodating a component.

14. The PCB magnetic assembly according to claim 13, characterized in that: This component is a passive device.

15. The PCB magnetic assembly according to claim 12, characterized in that: The plurality of electrical connection parts on the lower surface of the second circuit board are BGA ball arrays.

16. The PCB magnetic assembly according to claim 1, characterized in that: An upper circuit layer is disposed on the upper surface of the PCB magnetic component. A first outer surface of the upper circuit layer has at least one connection position, and the at least one connection position is electrically connected to an output terminal of the winding in the PCB magnetic component.

17. The PCB magnetic assembly according to claim 1, characterized in that: A lower circuit layer is disposed on the lower surface of the PCB magnetic component, and a second outer surface of the lower circuit layer has a plurality of electrical connection parts.

18. The PCB magnetic assembly according to claim 1, characterized in that: A plurality of the PCB magnetic components are connected through a connecting piece to form a PCB component set.

19. The PCB magnetic assembly according to claim 18, characterized in that: An upper surface of a component set and a lower surface of a component set of the PCB component set are respectively connected to a circuit board or multiple circuit layers to form electrical transmission with an external network or device to form an electronic module set.

20. The PCB magnetic assembly according to claim 19, characterized in that: The upper surface of the component set and the lower surface of the component set of the electronic module set include a plurality of electrical connection positions for placing a power device or connecting to the external network.

21. The PCB magnetic assembly according to claim 19, characterized in that: The electronic module set is divided into blocks to form multiple electronic modules that can work independently.

22. The PCB magnetic assembly according to claim 1, characterized in that: One end of the winding is derived from the upper connection position, and the other end of the winding is derived from the lower connection position.

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