Metal substrate made of composite heat conduction material and manufacturing process of metal substrate

Abstract

The invention belongs to the technical field of semiconductors, and discloses a metal substrate of a composite heat conduction material and a manufacturing process thereof, and the manufacturing process comprises the following steps: sequentially laminating a copper foil layer, an insulating layer and a metal heat dissipation substrate into a metal copper-clad plate in a thermocompression bonding manner, and forming a mounting hole in a high-heating area, corresponding to an electronic element, on the metal copper-clad plate, an adjustable heat dissipation assembly is manufactured; the adjustable heat dissipation assembly comprises a heat dissipation block and an adjustable heat dissipation connection structure. The adjustable heat dissipation assembly is mounted in the mounting hole of the metal copper-clad plate for tight connection; a space between the heat dissipation block and the electronic component base is filled with a heat dissipation medium with high heat conduction performance, and a layer of high heat conduction film is added between the heat dissipation block and the electronic component base; by means of the adjustable heat dissipation assembly, flexible adjustment is achieved according to the specific size and position of the electronic element, meanwhile, the heat conduction path is further optimized through the arrangement of the heat dissipation medium and the high-heat-conduction film, the heat dissipation performance of the metal substrate is improved, and stable operation of the high-power electronic element is ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a metal substrate of a composite heat-conducting material and a manufacturing process thereof. Background Art

[0002] With the rapid development of semiconductor technology, the integration and power density of electronic components are constantly increasing, resulting in a large amount of heat generated by the devices during operation. If the heat cannot be dissipated in a timely and effective manner, the excessively high temperature will affect the performance stability of the electronic components and even shorten their service life. Therefore, in the semiconductor field, how to dissipate heat efficiently has become a key issue in the design and manufacturing process. Metal substrates are widely used in the packaging and heat dissipation of power electronic devices due to their excellent thermal conductivity and mechanical strength.

[0003] At present, the heat dissipation method of semiconductor metal substrate in the prior art usually adopts fixing the electronic components directly on the metal substrate, or setting the heat dissipation device in the dense area of ​​the electronic components, and coating a layer of heat-conducting medium between the metal substrate and the electronic components for heat conduction. However, this method has some defects. First, the contact between the electronic components and the metal substrate is not tight enough, which easily produces interface gaps, resulting in increased interface thermal resistance and affecting the heat transfer efficiency; secondly, the main thing is that due to the different sizes and shapes of different electronic components, the heat dissipation device is usually a standard component with fixed size and installation angle. The fixed heat dissipation structure lacks flexibility, resulting in the inability to fully adapt and fit between the heat dissipation device and the electronic components, and the gap is easy to exist, which leads to an increase in thermal resistance and cannot meet the personalized heat dissipation needs of high-heat areas. These problems cause the heat of the electronic components to not be quickly and effectively conducted away, which may cause the device to overheat and affect its performance and reliability.

[0004] In view of this, it is necessary to improve the substrate heat dissipation structure in the prior art to solve the technical problem of large thermal resistance of fixed heat dissipation devices. Summary of the invention

[0005] The purpose of the present invention is to provide a metal substrate of a composite thermal conductive material and a manufacturing process thereof to solve the above technical problems.

[0006] To achieve this object, the present invention adopts the following technical solutions: A manufacturing process of a metal substrate of a composite thermal conductive material, comprising: The copper foil layer, the insulating layer and the metal heat dissipation substrate are sequentially pressed into a metal copper clad laminate by means of heat pressing, and the metal copper clad laminate is cut by using a cutting device; Opening mounting holes on the cut copper-clad metal board at high-heat-generating areas corresponding to the electronic components, wherein the mounting holes are processed according to the shape and size of the component base; According to the size of the mounting hole and the size of the corresponding electronic component base, an adjustable heat dissipation component is manufactured; the adjustable heat dissipation component comprises a heat dissipation block and an adjustable heat dissipation connection structure, the heat dissipation block is made of a high thermal conductivity material, and the heat dissipation connection structure is used to adjust the position and angle of the heat dissipation block; Install the adjustable heat dissipation assembly into the mounting hole of the metal copper-clad plate, and tightly connect the heat dissipation block to the metal heat dissipation substrate through the heat dissipation connection structure; Filling a heat dissipation medium with high thermal conductivity in the space between the heat dissipation block and the electronic component base; During the installation of the adjustable heat dissipation assembly and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base.

[0007] Optionally, the step of sequentially pressing the copper foil layer, the insulating layer and the metal heat dissipation substrate into a metal copper clad laminate by means of heat pressing, and cutting the metal copper clad laminate by using a cutting device specifically includes: Pre-treating the surfaces of the copper foil layer, the insulating layer and the metal heat dissipation substrate, wherein the pre-treatment includes cleaning, removing oxides and surface roughening; A layer of high thermal conductivity adhesive is applied on the surfaces to be bonded of the copper foil layer and the metal heat dissipation substrate respectively; The pre-treated copper foil layer, insulating layer and metal heat dissipation substrate are stacked in the order of copper foil layer, insulating layer and metal heat dissipation substrate to form a multi-layer structure to be pressed, so that the layers are accurately aligned without bubbles and impurities.

[0008] Optionally, the forming of the multilayer structure to be pressed so that each layer is precisely aligned and free of bubbles and impurities may further include: Placing the multilayer structure in a vacuum hot pressing device, setting predetermined temperature, pressure and time parameters, and performing hot pressing treatment to form a metal copper clad laminate; After the hot pressing is completed, the metal copper clad laminate is taken out and naturally cooled to room temperature, and then the metal copper clad laminate is cut according to the design requirements using a cutting device to obtain a metal copper clad laminate that meets the specification size.

[0009] Optionally, the step of opening a mounting hole on the cut metal copper-clad laminate at a high-heat-generating area corresponding to the electronic component specifically includes: Performing thermal distribution simulation on the metal copper-clad laminate by using a thermal analysis tool to generate a thermal distribution map to determine the location of high-heat-generating areas of electronic components on the cut metal copper-clad laminate; According to the heat distribution diagram, combined with the specific size and shape of the electronic component, the shape and size of the mounting hole are designed so that the mounting hole matches the size of the component base; Use laser cutting equipment to punch holes in high heat areas of the metal copper clad laminate according to design requirements.

[0010] Optionally, the method uses a laser cutting device to punch holes in high-heat-generating areas of the metal copper-clad laminate according to design requirements, and then further includes: During the drilling process, air cooling is used to cool the area around the mounting hole; After the mounting holes are processed, the metal copper clad laminate is cleaned.

[0011] Optionally, the heat dissipation connection structure includes: A positioning portion, the positioning portion being used to be installed in a corresponding mounting hole to position the adjustable heat dissipation assembly; A positioning adjustment member, which is provided with a guide groove and an adjustment bolt and is used to adjust the position of the heat sink; The angle adjustment member includes an adjustment hinge and is used to adjust the angle of the heat sink.

[0012] Optionally, a heat dissipation medium with high thermal conductivity is filled in the space between the heat dissipation block and the electronic component base, specifically including: Select a suitable type of heat dissipation medium according to the operating temperature and heat dissipation requirements of the electronic components; the heat dissipation medium may be any one of thermal conductive glue, thermal conductive silicone grease or phase change material; Clean the contact surfaces of the heat sink and the electronic component base; Using glue dispensing equipment, a predetermined amount of heat dissipation medium is evenly filled in the space between the heat dissipation block and the electronic component base; After the heat dissipation medium is filled, the heat dissipation medium is cured.

[0013] Optionally, during the installation of the adjustable heat dissipation assembly and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base, specifically including: Before filling the heat dissipation medium, prepare a layer of high thermal conductivity film; the high thermal conductivity film is a thin film material with uniform thickness and high thermal conductivity, and its size and shape match the contact surface of the heat dissipation block and the electronic component base; The high thermal conductivity film is arranged on the upper surface of the electronic component base, so that the high thermal conductivity film and the electronic component base are completely fitted together without bubbles and wrinkles.

[0014] Optionally, the high thermal conductivity film is disposed on the upper surface of the electronic component base so that the high thermal conductivity film is completely attached to the electronic component base without bubbles and wrinkles, and then further includes: Installing the heat dissipation block onto the electronic component base on which the high thermal conductivity film has been affixed, so that the lower surface of the heat dissipation block is in close contact with the upper surface of the high thermal conductivity film; After the heat dissipation medium is filled, the combination of the heat dissipation block, the high thermal conductivity film and the heat dissipation medium is subjected to a preset pressurization and heating process to ensure a tight connection between the layers.

[0015] The present invention further provides a metal substrate of a composite thermally conductive material, which is manufactured using the manufacturing process of the metal substrate of the composite thermally conductive material as described above, and the metal substrate comprises: A metal copper-clad laminate, comprising a copper foil layer, an insulating layer and a metal heat dissipation substrate stacked in sequence; wherein a mounting hole is provided at a preset position of the metal copper-clad laminate; An adjustable heat dissipation component, comprising a heat dissipation block and an adjustable heat dissipation connection structure, wherein the adjustable heat dissipation component is mounted in a mounting hole of a metal copper-clad plate; High thermal conductivity film, a thin film located between the heat sink and the electronic component base, has high thermal conductivity and is used to reduce the interface thermal resistance between the heat sink and the electronic component base; The heat dissipation medium is filled in the space between the heat dissipation block and the electronic component base, and surrounds the high thermal conductivity film.

[0016] Compared with the prior art, the present invention has the following beneficial effects: the copper foil layer, the insulating layer and the metal heat dissipation substrate are pressed into a metal copper clad laminate in sequence by a hot pressing method, and the metal copper clad laminate is cut into required sizes and shapes by a cutting device; a mounting hole matching the shape and size of the electronic component base is opened on the cut metal copper clad laminate according to the position of the high heating area of ​​the electronic component; an adjustable heat dissipation component is made according to the size of the mounting hole and the electronic component base; the adjustable heat dissipation component is installed in the mounting hole of the metal copper clad laminate; a heat dissipation block is tightly connected to the metal heat dissipation substrate through a heat dissipation connection structure; a heat dissipation medium with high thermal conductivity is filled in the space between the heat dissipation block and the electronic component base; in the process of filling the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base to further reduce the interface thermal resistance and enhance the thermal conductivity effect; the scheme realizes flexible adjustment according to the specific size and position of the electronic component through the adjustable heat dissipation component; at the same time, the setting of the heat dissipation medium and the high thermal conductivity film further optimizes the heat conduction path, improves the heat dissipation performance of the metal substrate, and ensures the stable operation of the high-power electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0019] Figure 1 This is one of the schematic flow charts of the manufacturing process of the metal substrate of the composite thermal conductive material of the first embodiment; Figure 2 The second schematic diagram of the manufacturing process of the metal substrate of the composite thermal conductive material of the first embodiment; Figure 3 This is the third schematic diagram of the process of manufacturing the metal substrate of the composite thermal conductive material of the first embodiment. DETAILED DESCRIPTION

[0020] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] Embodiment 1: Combination Figures 1 to 3 As shown, an embodiment of the present invention provides a manufacturing process of a metal substrate of a composite thermal conductive material, comprising: S1, sequentially press the copper foil layer, the insulating layer and the metal heat dissipation substrate into a metal copper clad laminate by hot pressing, and use cutting equipment to cut the metal copper clad laminate; the copper foil layer and the metal heat dissipation substrate have good thermal conductivity, and the insulating layer has good heat resistance, so as to realize the thermal conductivity and insulation function of the substrate. Use cutting equipment to cut the pressed metal copper clad laminate into sizes and shapes that meet the design specifications; to meet the subsequent installation and heat dissipation requirements.

[0024] S2, opening mounting holes on the cut metal copper-clad laminate corresponding to the high-heat-generating areas of the electronic components, wherein the mounting holes are processed according to the shape and size of the component base to ensure that the heat dissipation components can be effectively installed and contacted.

[0025] It should be noted that the corresponding electronic components or electronic component bases have been installed on the cut metal copper-clad laminate at this stage, and the installation holes are set later. Since the focus of this solution is not on the development of electronic components, it will not be described in detail here. However, it is easy to understand that the installation of electronic components has been completed in this process, so the high-heat area is set.

[0026] S3, making an adjustable heat dissipation assembly according to the size of the mounting hole and the corresponding size of the electronic component base; the adjustable heat dissipation assembly includes a heat dissipation block and an adjustable heat dissipation connection structure, the heat dissipation block is made of high thermal conductivity material, and the heat dissipation connection structure is used to adjust the position and angle of the heat dissipation block; by adjusting the position and angle of the heat dissipation block, the contact area between the electronic component and the heat dissipation assembly is optimized, thereby improving the heat dissipation efficiency.

[0027] S4, install the adjustable heat dissipation component into the mounting hole of the metal copper clad plate, and tightly connect the heat dissipation block to the metal heat dissipation substrate through the heat dissipation connection structure; ensure good thermal contact between the heat dissipation block and the metal heat dissipation substrate, while maintaining adjustability to meet the heat dissipation requirements of different electronic components S5, fill the space between the heat sink and the electronic component base with a heat dissipation medium with high thermal conductivity; the heat dissipation medium is such as thermal grease or thermal adhesive, and ensure that the heat dissipation medium is in close contact with the heat sink and the electronic component base. The heat dissipation medium can fill tiny gaps, reduce interface thermal resistance, and improve heat transfer efficiency.

[0028] S6, during the installation of the adjustable heat dissipation component and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base. Through the high-efficiency thermal conductivity of the film, the heat conduction efficiency is further improved, the interface thermal resistance is reduced, and the overall heat dissipation effect is improved.

[0029] The working principle of the present invention is as follows: first, a copper foil layer, an insulating layer and a metal heat dissipation substrate are pressed into a metal copper clad laminate in sequence by a hot pressing method, and the copper clad laminate is cut into required sizes and shapes by a cutting device. On the cut metal copper clad laminate, a mounting hole matching the shape and size of the electronic component base is opened according to the position of the high-heating area of ​​the electronic component. An adjustable heat dissipation component is made according to the size of the mounting hole and the electronic component base, and the adjustable heat dissipation component is installed in the mounting hole of the metal copper clad laminate. The heat dissipation block is tightly connected to the metal heat dissipation substrate through a heat dissipation connection structure, and a heat dissipation medium with high thermal conductivity is filled in the space between the heat dissipation block and the electronic component base. In the process of filling the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base to further reduce the interface thermal resistance and enhance the thermal conductivity effect. The scheme realizes flexible adjustment according to the specific size and position of the electronic component through the adjustable heat dissipation component. At the same time, the setting of the heat dissipation medium and the high thermal conductivity film further optimizes the heat conduction path, improves the heat dissipation performance of the metal substrate, and ensures the stable operation of the high-power electronic component.

[0030] In this embodiment, it is specifically explained that step S1 specifically includes: S11, pre-treating the surfaces of the copper foil layer, the insulating layer and the metal heat dissipation substrate, including cleaning, removing oxides and surface roughening, so as to improve the interlayer bonding strength and ensure the lamination quality.

[0031] S12, coating a layer of high thermal conductivity adhesive on the surfaces to be bonded of the copper foil layer and the metal heat dissipation substrate respectively; the adhesive has high temperature resistance and high thermal conductivity, and can improve the thermal conduction efficiency between layers.

[0032] S13, stacking the pretreated copper foil layer, insulating layer and metal heat dissipation substrate in the order of copper foil layer, insulating layer and metal heat dissipation substrate to form a multi-layer structure to be pressed, so that each layer is accurately aligned without bubbles and impurities.

[0033] S14, placing the multilayer structure in a vacuum hot pressing device, setting predetermined temperature, pressure and time parameters, and performing hot pressing treatment to form a metal copper clad laminate; hot pressing in a vacuum environment can prevent oxidation, improve the interlayer bonding strength, and form a metal copper clad laminate with a stable structure and excellent thermal conductivity.

[0034] S15, after the hot pressing is completed, the metal copper clad laminate is taken out and naturally cooled to room temperature, and then the metal copper clad laminate is cut according to the design requirements using a cutting device to obtain a metal copper clad laminate that meets the specification size. To prepare for subsequent processing steps, a cutting device such as a CNC cutting machine or a laser cutting machine is used.

[0035] In this embodiment, it is specifically described that step S2 specifically includes: S21, thermal analysis tools are used to simulate the thermal distribution of the metal copper clad laminate and generate a thermal distribution map to determine the location of the high heat generation area of ​​the electronic component on the cut metal copper clad laminate; thermal imaging or computer-aided design (CAD) software is used to generate a thermal distribution map to accurately locate the area where the mounting holes need to be opened.

[0036] S22, according to the heat distribution diagram, combined with the specific size and shape of the electronic component, design the shape and size of the mounting hole so that the mounting hole matches the size of the component base; the design takes into account the heat dissipation requirements of the edge of the mounting hole to ensure that there is enough heat conduction area around it.

[0037] S23, use laser cutting equipment to punch holes in the high heat generation area of ​​the metal copper clad laminate according to the design requirements. The equipment should ensure that the heat generated during the hole punching process does not affect the bonding effect between the copper foil layer and the insulation layer, while keeping the edges of the mounting holes smooth to reduce mechanical stress concentration points.

[0038] In this embodiment, it is further explained that after step S23, the following steps are further performed: S24, during the drilling process, air cooling is used to cool the area around the mounting hole; to avoid material deformation or performance degradation due to the high temperature generated by the processing, air cooling or liquid cooling can be used to ensure processing accuracy and material stability.

[0039] S25, after the installation hole processing is completed, the metal copper clad plate is cleaned. Use cleaning equipment to remove debris and impurities in and around the hole to ensure that the inner wall of the installation hole is smooth, and use testing equipment to check the accuracy of the installation hole to confirm that it meets the design specifications, providing a good foundation for the subsequent installation of heat dissipation components.

[0040] In this embodiment, it is specifically described that the heat dissipation connection structure includes: The positioning part is used to be installed in the corresponding mounting hole to position the adjustable heat dissipation component. Specifically, it can be inserted with pins or other connecting components.

[0041] The positioning adjustment member is provided with a guide groove and an adjustment bolt to adjust the position of the heat sink; a structure such as a slide rail, a guide groove or a positioning hole can be used to allow the heat sink to move within a certain range to accurately align with the heating area of ​​the electronic component. This structure can ensure that the heat sink can flexibly adjust its position during installation.

[0042] The angle adjustment member includes an adjustment hinge for adjusting the angle of the heat sink. Through these mechanisms, the inclination angle of the heat sink can be adjusted according to actual needs, so that it is in close contact with the electronic component base and the heat conduction path is optimized.

[0043] It should be noted that the adjustable function of the heat sink is limited to the installation process. After installation, it is fixed by a locking structure (adjustment bolt), and then the long-term stability of the system is ensured through the filling and curing process of the heat dissipation medium. Since the heat dissipation medium forms a stable heat conduction path after curing, there is no need to adjust the heat sink later. Therefore, although the heat sink is adjustable during installation, once the installation and curing are completed, the adjustment function is locked, thereby ensuring the reliability and thermal efficiency of the entire system.

[0044] The adjustable structure of the adjustable heat sink assembly is of great significance during the installation process. It can fine-tune the position and angle of the heat sink according to specific needs, and fix the heat sink through the locking structure. After filling with high thermal conductivity medium and curing, the adjustment function of the system will be locked to ensure that the heat sink maintains a stable and efficient heat conduction path throughout the use process. This design solves the balance problem between the installation flexibility of the heat sink and the subsequent stability.

[0045] In this embodiment, it is specifically described that step S5 specifically includes: S51, select a suitable type of heat dissipation medium according to the operating temperature and heat dissipation requirements of the electronic components; the heat dissipation medium can be any one of thermal conductive adhesive, thermal conductive silicone grease or phase change material; select according to the operating temperature and heat dissipation requirements of the electronic components to ensure that the heat dissipation medium has excellent thermal conductivity and stable physical and chemical properties.

[0046] S52, cleaning the contact surface between the heat sink and the electronic component base; removing the oil, dust and oxide layer on the surface to ensure the surface finish, so as to improve the filling effect of the heat dissipation medium and the heat conduction efficiency.

[0047] S53, using dispensing coating equipment, evenly fills a predetermined amount of heat dissipation medium in the space between the heat dissipation block and the electronic component base; during the filling process, the thickness and distribution of the heat dissipation medium are controlled to avoid the generation of bubbles and gaps to reduce the interface thermal resistance.

[0048] S54, after the heat dissipation medium is filled, the heat dissipation medium is cured, such as by heating, ultraviolet irradiation or natural curing, so that the heat dissipation medium achieves the best physical properties and thermal conductivity.

[0049] In this embodiment, it is specifically described that step S6 specifically includes: S61, before filling the heat dissipation medium, prepare a layer of high thermal conductivity film; the high thermal conductivity film is a thin film material with uniform thickness and high thermal conductivity, and its size and shape match the contact surface of the heat dissipation block and the electronic component base; S62, placing a high thermal conductivity film on the upper surface of the electronic component base, so that the high thermal conductivity film and the electronic component base are completely attached without bubbles and wrinkles. Vacuum bonding technology or electrostatic adsorption technology can be used to make the film and the base form a close contact.

[0050] S63, install the heat sink block onto the electronic component base with the high thermal conductivity film attached thereto, so that the lower surface of the heat sink block is in close contact with the upper surface of the high thermal conductivity film; adjust the position and angle of the heat sink block through the adjustable heat dissipation connection structure to ensure full contact of the contact surface.

[0051] S64, after the heat dissipation medium is filled, the combination of the heat dissipation block, the high thermal conductivity film and the heat dissipation medium is subjected to a preset pressurization and heating process to make the layers tightly connected, ensuring that the film, the heat dissipation block and the electronic component base form an efficient heat conduction path.

[0052] Embodiment 2: The present invention further provides a metal substrate of a composite thermally conductive material, which is manufactured using the manufacturing process of the metal substrate of the composite thermally conductive material in the first embodiment, and the metal substrate comprises: A metal copper-clad laminate, comprising a copper foil layer, an insulating layer and a metal heat dissipation substrate stacked in sequence; wherein a mounting hole is provided at a preset position of the metal copper-clad laminate; Among them, the copper foil layer is located on the top layer and is used to lay out electronic components and circuits, serving as the conductive layer of the circuit.

[0053] The insulating layer is located below the copper foil layer and acts as an electrical insulator to prevent current from being directly conducted to the lower layer.

[0054] The metal heat dissipation substrate is located under the insulating layer and is usually made of high thermal conductivity materials such as aluminum or copper. It is used to conduct and dissipate heat.

[0055] An adjustable heat dissipation component, comprising a heat dissipation block and an adjustable heat dissipation connection structure, wherein the adjustable heat dissipation component is mounted in a mounting hole of a metal copper-clad plate; It should be noted that the heat sink is made of a high thermal conductivity material, installed in the mounting hole, connected to the electronic component base, and is used to directly absorb the heat generated by the electronic component.

[0056] The adjustable heat dissipation connection structure connects the heat dissipation block and the metal heat dissipation substrate, and is used to adjust the position and angle of the heat dissipation block during installation to ensure that the heat dissipation block is in close contact with the electronic component base.

[0057] The high thermal conductivity film is a thin film located between the heat sink and the electronic component base, which has high thermal conductivity and is used to reduce the interface thermal resistance between the heat sink and the electronic component base and improve the heat conduction efficiency.

[0058] The heat dissipation medium fills the space between the heat sink and the electronic component base, surrounding the high thermal conductivity film. Filling the tiny gaps further reduces the interface thermal resistance and ensures efficient heat transfer.

[0059] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A manufacturing process of a metal substrate of a composite thermal conductive material, characterized in that: include: The copper foil layer, the insulating layer and the metal heat dissipation substrate are sequentially pressed into a metal copper clad laminate by means of heat pressing, and the metal copper clad laminate is cut by using a cutting device; Opening mounting holes on the cut copper-clad metal board at high-heat-generating areas corresponding to the electronic components, wherein the mounting holes are processed according to the shape and size of the component base; According to the size of the mounting hole and the size of the corresponding electronic component base, an adjustable heat dissipation component is manufactured; the adjustable heat dissipation component comprises a heat dissipation block and an adjustable heat dissipation connection structure, the heat dissipation block is made of a high thermal conductivity material, and the heat dissipation connection structure is used to adjust the position and angle of the heat dissipation block; Install the adjustable heat dissipation assembly into the mounting hole of the metal copper-clad plate, and tightly connect the heat dissipation block to the metal heat dissipation substrate through the heat dissipation connection structure; Filling a heat dissipation medium with high thermal conductivity in the space between the heat dissipation block and the electronic component base; During the installation of the adjustable heat dissipation assembly and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base.

2. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: The method comprises: sequentially pressing the copper foil layer, the insulating layer and the metal heat dissipation substrate into a metal copper clad laminate by heat pressing, and cutting the metal copper clad laminate by using a cutting device, specifically comprising: Pre-treating the surfaces of the copper foil layer, the insulating layer and the metal heat dissipation substrate, wherein the pre-treatment includes cleaning, removing oxides and surface roughening; A layer of high thermal conductivity adhesive is applied on the surfaces to be bonded of the copper foil layer and the metal heat dissipation substrate respectively; The pre-treated copper foil layer, insulating layer and metal heat dissipation substrate are stacked in the order of copper foil layer, insulating layer and metal heat dissipation substrate to form a multi-layer structure to be pressed, so that the layers are accurately aligned without bubbles and impurities.

3. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 2, characterized in that: The forming of the multi-layer structure to be pressed together so that each layer is precisely aligned without bubbles and impurities, and then further comprising: Placing the multilayer structure in a vacuum hot pressing device, setting predetermined temperature, pressure and time parameters, and performing hot pressing treatment to form a metal copper clad laminate; After the hot pressing is completed, the metal copper clad laminate is taken out and naturally cooled to room temperature, and then the metal copper clad laminate is cut into pieces according to the design requirements using a cutting device to obtain a metal copper clad laminate that meets the specification size.

4. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: The step of opening a mounting hole on the cut copper-clad metal laminate corresponding to a high-heat-generating area of ​​the electronic component specifically includes: Performing thermal distribution simulation on the metal copper-clad laminate by using a thermal analysis tool to generate a thermal distribution map to determine the location of high-heat-generating areas of electronic components on the cut metal copper-clad laminate; According to the heat distribution diagram, combined with the specific size and shape of the electronic component, the shape and size of the mounting hole are designed so that the mounting hole matches the size of the component base; Use laser cutting equipment to punch holes in high heat areas of the metal copper clad laminate according to design requirements.

5. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 4, characterized in that: The laser cutting equipment is used to punch holes in the high-heat-generating area of ​​the metal copper-clad laminate according to the design requirements, and then the following is included: During the drilling process, air cooling is used to cool the area around the mounting hole; After the mounting holes are processed, the metal copper clad laminate is cleaned.

6. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: The heat dissipation connection structure comprises: A positioning portion, the positioning portion being used to be installed in a corresponding mounting hole to position the adjustable heat dissipation assembly; A positioning adjustment member, which is provided with a guide groove and an adjustment bolt and is used to adjust the position of the heat sink; The angle adjustment member includes an adjustment hinge and is used to adjust the angle of the heat sink.

7. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: The space between the heat dissipation block and the electronic component base is filled with a heat dissipation medium with high thermal conductivity, which specifically includes: Select a suitable type of heat dissipation medium according to the operating temperature and heat dissipation requirements of the electronic components; the heat dissipation medium may be any one of thermal conductive glue, thermal conductive silicone grease or phase change material; Clean the contact surfaces of the heat sink and the electronic component base; Using glue dispensing equipment, a predetermined amount of heat dissipation medium is evenly filled in the space between the heat dissipation block and the electronic component base; After the heat dissipation medium is filled, the heat dissipation medium is cured.

8. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: During the installation of the adjustable heat dissipation assembly and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base, specifically including: Before filling the heat dissipation medium, prepare a layer of high thermal conductivity film; the high thermal conductivity film is a thin film material with uniform thickness and high thermal conductivity, and its size and shape match the contact surface of the heat dissipation block and the electronic component base; The high thermal conductivity film is arranged on the upper surface of the electronic component base, so that the high thermal conductivity film and the electronic component base are completely fitted together without bubbles and wrinkles.

9. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 8, characterized in that: The high thermal conductivity film is arranged on the upper surface of the electronic component base so that the high thermal conductivity film is completely attached to the electronic component base without bubbles and wrinkles, and then further includes: Installing the heat dissipation block onto the electronic component base on which the high thermal conductivity film has been affixed, so that the lower surface of the heat dissipation block is in close contact with the upper surface of the high thermal conductivity film; After the heat dissipation medium is filled, the combination of the heat dissipation block, the high thermal conductivity film and the heat dissipation medium is subjected to a preset pressurization and heating process to ensure a tight connection between the layers.

10. A metal substrate of a composite thermal conductive material, characterized in that: The metal substrate is manufactured by the manufacturing process of the metal substrate of the composite thermal conductive material according to any one of claims 1 to 9, wherein the metal substrate comprises: A metal copper-clad laminate, comprising a copper foil layer, an insulating layer and a metal heat dissipation substrate stacked in sequence; wherein a mounting hole is provided at a preset position of the metal copper-clad laminate; An adjustable heat dissipation component, comprising a heat dissipation block and an adjustable heat dissipation connection structure, wherein the adjustable heat dissipation component is mounted in a mounting hole of a metal copper-clad plate; A high thermal conductivity film is a thin film located between the heat sink and the electronic component base, which has high thermal conductivity and is used to reduce the interface thermal resistance between the heat sink and the electronic component base; The heat dissipation medium is filled in the space between the heat dissipation block and the electronic component base, and surrounds the high thermal conductivity film.

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