Semiconductor device front-end module
By designing control measures for automatic conduction fan unit after power supply recovery in the front-end module of the semiconductor equipment, the problem of particle pollution during power outage is solved, and the safe and efficient handling and processing of wafers are achieved.
Patent Information
- Application Number
- CN202411653162.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-03-04
AI Technical Summary
The front-end module of the semiconductor device may cause pressure turbulence when power is off, causing particle contamination in the wafer transfer box, which in turn causes wafer defects or scrapping.
A semiconductor device front-end module is designed, including a wafer handling module and a loading port module. When the power supply unit resumes power supply, the port control unit controls the port opening and closing unit to be closed, and conducts the first control unit and the power supply unit through the second control unit, so that the power supply unit and the fan unit are turned on, thereby preventing particle contamination.
It effectively avoids internal turbulence after power supply recovery of wafer handling modules, prevents wafers from being contaminated by particles, and reduces the risk of wafer defects and scrapping.
Smart Images
Figure CN119560426A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor technology, and in particular to a front-end module of a semiconductor device. Background Art
[0002] In the semiconductor manufacturing process, the handling and processing of wafers is a crucial link. In order to ensure the safe handling of wafers between different processing devices, a container called a front-opening unified pod (FOUP) is usually used. When the wafer needs to be processed, the wafer in the FOUP will be transported from the front-opening unified pod to the process chamber through the semiconductor equipment front end module (EFEM).
[0003] When the semiconductor equipment front-end module (EFEM) encounters an abnormal power outage, its internal recovery mechanism may cause pressure turbulence, which in turn draws particles (PA) deposited between the floor (floor) and the foundation (Foundation) of the semiconductor equipment front-end module into the semiconductor equipment front-end module (EFEM), contaminating the wafers loaded in the front-opening wafer transfer box (FOUP), causing the wafer surface to suffer a large amount of particle contamination (particle high), thereby generating a large number of defects (defects), and even directly causing the wafer to be scrapped.
[0004] Therefore, there is an urgent need for a technical solution to effectively solve the pollution problem caused by power failure of the front-end module of semiconductor equipment during wafer transportation.
[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention
[0006] The present disclosure provides a semiconductor device front-end module, which can solve the problem of wafer contamination during transportation when the semiconductor device front-end module is powered off.
[0007] Other features and advantages of the present disclosure will become apparent from the following detailed description, or may be learned in part by the practice of the present disclosure.
[0008] According to one aspect of the present disclosure, a semiconductor device front-end module is provided.
[0009] include:
[0010] The wafer handling module includes a power supply unit and a fan unit, and the fan unit is electrically connected to the power supply unit through the first switch unit and the first control unit in sequence;
[0011] A loading port module, the loading port module includes a port opening and closing unit and a port control unit, the port opening and closing unit is connected with the wafer handling module and the loading port module, and the port control unit controls the port opening and closing unit; the port control unit is electrically connected to the power supply unit through the second switch unit, and the port control unit acts on the second control unit;
[0012] When the power supply unit resumes power supply, the port control unit controls the port opening and closing unit to close, and then the port control unit acts on the second control unit, and the second control unit conducts the first control unit and the power supply unit, so that the power supply unit and the fan unit are connected.
[0013] In one embodiment, the first switch unit and the second switch unit are mechanical switches and are in a normally closed state.
[0014] In one embodiment, the first control unit includes a third switch unit and a first electric control unit, the third switch unit is electrically connected to the power supply unit and the first switch unit, and the first electric control unit is electrically connected to the second control unit for controlling the third switch unit.
[0015] In one embodiment, the second control unit includes a fourth switch unit, a first electromagnet unit and a second electric control unit, the fourth switch unit is electrically connected to the power supply unit and the first control unit, the first electromagnet unit is connected to the power supply unit, the second electric control unit is electrically connected to the port control unit, and the first electromagnet unit and the second electric control unit jointly control the fourth switch unit.
[0016] In one embodiment, the third switch unit and the fourth switch unit are normally open switch units.
[0017] In one embodiment, the wafer handling module includes a floor opening and closing unit, which is electrically connected to the power supply unit through a third control unit. When the power supply unit is powered off, the floor opening and closing unit is in a closed state. When the power supply unit resumes power supply, the port control unit controls the port opening and closing unit to close, and then the third control unit connects the floor opening and closing unit and the power supply unit so that the floor opening and closing unit is in an open state.
[0018] In one embodiment, the third control unit includes a fifth switch unit, a second electromagnet unit and a third electric control unit, the fifth switch unit is electrically connected to the power supply unit and the floor opening and closing unit, the second electromagnet unit is connected to the power supply unit, the third electric control unit is electrically connected to the port control unit, and the second electromagnet unit and the third electric control unit jointly control the fifth switch unit.
[0019] In one embodiment, the floor opening and closing unit includes a multi-layer hollow floor, and pneumatic valve units and normally closed air valve units are sequentially arranged on both sides of the hollow floor, and the normally closed air valve unit is electrically connected to the third control unit.
[0020] In one embodiment, the hollow floor has holes of the same shape. When the power supply unit is powered off, the holes of the hollow floor are staggered. When the power supply unit is powered on, the holes of the hollow floor are overlapped.
[0021] In one embodiment, the semiconductor equipment front-end module includes a gas control unit, which controls the gas to pass through a normally closed gas valve unit, a pneumatic valve unit, and a hollow floor in sequence.
[0022] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.
[0024] Figure 1 A schematic diagram of the structure of a front-end module for a semiconductor device provided by an embodiment of the present disclosure is shown; Figure 2 A circuit diagram of a semiconductor device front-end module provided by an embodiment of the present disclosure; Figure 3 A circuit diagram of a semiconductor device front-end module provided by another embodiment of the present disclosure; Figure 4 A circuit diagram of a semiconductor device front-end module provided by another embodiment of the present disclosure; Figure 5 A circuit diagram of a semiconductor device front-end module provided by another embodiment of the present disclosure; Figure 6-7 A schematic diagram of the structure of a floor opening and closing unit of a front-end module of a semiconductor device provided by an embodiment of the present disclosure; Figure 8 A circuit diagram of a semiconductor device front-end module provided by another embodiment of the present disclosure; DETAILED DESCRIPTION
[0025] In order to facilitate understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thorough and comprehensive.
[0026] In the semiconductor manufacturing process, the handling and processing of wafers is a crucial link. In order to ensure the safe handling of wafers between different processing devices, a container called a front-opening unified pod (FOUP) is usually used. When the wafer needs to be processed, the wafer in the front-opening unified pod (FOUP) will be transported from the front-opening unified pod to the process chamber through the semiconductor equipment front-end module (EFEM).
[0027] In the existing semiconductor equipment front end module (EFEM), the fan unit, port control unit, gas control unit, etc. are all powered independently. Therefore, once the semiconductor equipment front end module (EFEM) encounters a power outage (power off), all these units will immediately lose power and stop operating. Similarly, when the power is restored, these units also regain power at the same time. In the process of restoring power at the same time, pressure turbulence may occur inside the semiconductor equipment front end module (EFEM), and then the particles (PA) deposited between the floor (floor) and the foundation (Foundation) of the semiconductor equipment front end module (EFEM) may be drawn into the semiconductor equipment front end module (EFEM), contaminating the wafers loaded in the front opening wafer transfer box (FOUP), causing the wafer surface to suffer a large amount of particle contamination (particle high), thereby generating a large number of defects (defects), and even directly causing the wafer to be scrapped.
[0028] In view of this, an embodiment of the present disclosure provides a front-end module for a semiconductor device. When the power supply unit resumes power supply, the port control unit controls the port opening and closing unit to close, and the port control unit acts on the second control unit. The second control unit connects the first control unit and the power supply unit, so that the power supply unit and the fan unit are connected. In this way, the wafers in the front-opening wafer transfer box (FOUP) can be prevented from being contaminated by particles.
[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0030] Figure 1 A schematic diagram of the structure of a front-end module for a semiconductor device provided by an embodiment of the present disclosure is shown; Figure 2A circuit diagram of a semiconductor device front-end module provided by an embodiment of the present disclosure;
[0031] Reference Figure 1 and Figure 2 As shown, in one embodiment, a semiconductor device front-end module,
[0032] include:
[0033] The wafer handling module 110 includes a power supply unit 111 and a fan unit 112, and the fan unit 112 is electrically connected to the power supply unit 111 through a first switch unit 113 and a first control unit 114 in sequence;
[0034] The loading port module 210 includes a port opening and closing unit 211 and a port control unit 212. The port opening and closing unit 211 connects the wafer handling module 110 and the loading port module 210. The port control unit 212 controls the port opening and closing unit 211. The port control unit 212 is electrically connected to the power supply unit 111 through the second switch unit 215. The port control unit 212 acts on the second control unit 216.
[0035] Among them, when the power supply unit 111 resumes power supply, the port control unit 212 controls the port opening and closing unit 211 to close, and the port control unit 212 acts on the second control unit 9216, and the second control unit 216 connects the first control unit 114 and the power supply unit 111, so that the power supply unit 111 and the fan unit 112 are connected.
[0036] Reference Figure 1-Figure 2 , the above-mentioned semiconductor device front-end module is described in detail.
[0037] The wafer handling module 110 plays a key role in semiconductor manufacturing equipment. It is responsible for safely and efficiently transporting the wafers stored in the front-opening wafer transfer box 510 (FOUP) to the reaction chamber 410 (process chamber) for processing. Among them, the front-opening wafer transfer box 510 (FOUP) is a container widely used in the semiconductor manufacturing process, which is used to protect, transport and store wafers and can accommodate up to 25 wafers. The reaction chamber module 410 (process chamber) is a closed space or container for performing specific processing. The reaction chamber is the core part of the semiconductor equipment, in which various key manufacturing processes are carried out, such as deposition, etching, ion implantation, chemical vapor deposition (CVD, Chemical Vapor Deposition), physical vapor deposition (PVD, Physical Vapor Deposition), lithography, etc. In addition, the wafer handling module 110 is connected to the reaction chamber module 410 via the load interlock module 420, that is, the load interlock module 420 is located between the reaction chamber module 410 and the wafer handling module 110 and is respectively connected to the reaction chamber module 410 and the wafer handling module 110 to perform heating, heat release and buffering functions on the wafers transferred between the wafer handling module 110 and the reaction chamber module 410.
[0038] In the wafer handling module 110, the power supply unit 111 provides the necessary power for the entire handling process, ensuring that key components such as the handling robot unit 120 and the fan unit 112 can operate normally. The handling robot unit 120 is responsible for accurately handling the wafers from the front-opening wafer pod 510 to the load lock module 420 and the reaction chamber module 410 for processing, and safely returning the wafers to the front-opening wafer pod 510 after the handling is completed. The fan unit 112 helps maintain the cleanliness of the handling area and reduces the contamination of the wafers by particles by generating directional airflow.
[0039] The fan unit 112 is electrically connected to the power supply unit 111 via the first switch unit 113 and the first control unit 114 in sequence. That is to say, the first switch unit 113 and the first control unit 114 serve as intermediate links and can cut off or restore the power connection between the fan unit 112 and the power supply unit 111 when necessary. The architectural design in which the fan unit 112 is electrically connected to the power supply unit 111 via the first switch unit 113 and the first control unit 114 ensures that the operation of the fan unit is both safe and controllable.
[0040] The loading port module 210 is a key interface connecting the wafer handling module 110 with the external environment, and is responsible for the transition of the wafer from the front-opening wafer transfer box 510 to the wafer handling module 110. The loading port module 210 includes a port opening and closing unit 211, a port control unit 212, a loading unit 213, and a fixing unit 214. The port opening and closing unit 211 is responsible for the physical connection and disconnection between the wafer handling module 110 and the loading port module 210, ensuring that during the wafer handling process, the port opening and closing unit 211 can be opened or closed in time as needed, while maintaining the environmental stability of the handling area to avoid external pollution; the port control unit 212 controls the opening and closing action of the port opening and closing unit 211; the loading unit 213 is responsible for carrying the front-opening wafer transfer box 510, ensuring the stable placement of the front-opening wafer transfer box 510 on the loading port module 210. The loading unit 213 is disposed on the fixing unit 214 , and the fixing unit 214 is used to stabilize the loading unit 213 , thereby ensuring the safety and stability of the front-opening wafer pod 510 during transportation.
[0041] The electrical connection design between the port control unit 212 and the power supply unit 111 through the second switch unit 215 ensures that the operation of the port control unit 212 can be directly powered by the power supply unit 111 , while providing additional safety and flexibility through the second switch unit 215 .
[0042] In addition, the port control unit 212 also acts on the second control unit 216 , which means that the port control unit 212 can not only control the opening and closing actions of the port opening and closing unit 211 , but also work in coordination with the second control unit 216 .
[0043] When the power supply unit 111 is powered off, the fan unit 112 and the port control unit 212 both rely on the power provided by the power supply unit 111 to operate, so they will stop working. Specifically: the fan unit 112 is electrically connected to the power supply unit 111 through the first switch unit 113 and the first control unit 114. Once the power supply unit 111 is powered off, the fan unit 112 stops running. The port control unit 212 is electrically connected to the power supply unit 111 through the second switch unit 215. When the power supply unit 111 is powered off, the port control unit 212 stops working.
[0044] When the power supply unit 111 resumes power supply, the port control unit 212 controls the port opening and closing unit 211 to close, ensuring the isolation of the wafer handling module 110 from the external environment, and preventing the wafer placed on the loading unit 213 from being contaminated by particles inside the wafer handling module 110. Once the port opening and closing unit 211 confirms to be closed, the port control unit 212 acts on the second control unit 216, so that the second control unit 216 conducts the circuit connection between the first control unit 114 and the power supply unit 111, and then the first control unit 114 conducts the circuit connection between the power supply unit 111 and the fan unit 112, and the fan unit 112 resumes operation.
[0045] Through the above method, it can be effectively ensured that after the power supply of the wafer handling module 110 is restored, the operation of the fan unit 112 is after the port opening and closing unit 211 is closed, which can effectively avoid internal turbulence in the wafer handling module 110 and prevent the wafers placed on the loading unit 213 from being contaminated by particles inside the wafer handling module 110.
[0046] In one embodiment, the first switch unit 113 and the second switch unit 315 are mechanical switches and are in a normally closed state. When the first switch unit 113 and the second switch unit 315 are in a normally closed state, it means that in the absence of an external control signal or power input, the switch is closed by default and the circuit is in a conducting state. This ensures that when the power supply unit 111 is powered off, key components such as the fan unit 112 and the port control unit 212 can maintain their default state, thereby improving the safety and reliability of the system.
[0047] Figure 3 A circuit diagram of a semiconductor device front-end module provided by another embodiment of the present disclosure;
[0048] In one embodiment, see Figure 3 As shown, the first control unit 114 includes a third switch unit 1141 and a first electric control unit 1142. The third switch unit 1141 is electrically connected to the power supply unit 111 and the first switch unit 113. The first electric control unit 1142 is electrically connected to the second control unit 216 and is used to control the third switch unit 1141. That is, the first electric control unit 1142 will have a forward movement when the power is on, thereby closing the third switch unit 1141. The first electric control unit 1142 will have a retracting movement when the power is off, thereby disconnecting the third switch unit 1141. The third switch unit 1141 serves as a bridge between the power supply unit 111 and the first switch unit 113, and the first electric control unit 1142 is used to control the opening and closing of the third switch unit 1141, thereby connecting or disconnecting the circuit between the power supply unit 111 and the fan unit 112, and controlling the flow of power.
[0049] In one embodiment, see Figure 3 As shown, the second control unit 216 includes a fourth switch unit 2161, a first electromagnet unit 2163 and a second electric control unit 2162, the fourth switch unit 2161 is electrically connected to the power supply unit 111 and the first control unit 114, the first electromagnet unit 2163 is connected to the power supply unit 111, the second electric control unit 2162 is electrically connected to the port control unit 212, and the first electromagnet unit 2163 and the second electric control unit 2162 jointly control the fourth switch unit 2161. Among them, the first electromagnet unit 2163 will be magnetic when powered on, and under the joint action of the second electric control unit 2162, the fourth switch unit 2161 is closed, the first electromagnet unit 2163 will be demagnetized when powered off, and the fourth switch unit 2161 will automatically disconnect after the first electromagnet unit 2163 is no longer magnetically attracted. The second electric control unit 2162 is controlled by the port control unit 212, that is, after the port control unit 212 controls the port opening and closing unit 211 to close, the port control unit 212 controls the second electric control unit 2162 to be powered on, thereby causing the second electric control unit 2162 to move forward; after the port control unit 212 controls the port opening and closing unit 211 to open, the port control unit 212 controls the second electric control unit 2162 to be powered off, thereby causing the second electric control unit 2162 to retract. During the wafer handling process, the port opening and closing unit 211 is often opened and closed.
[0050] In one embodiment, see Figure 3 As shown, the third switch unit 1141 and the fourth switch unit 2161 are normally open switch units. That is, in the absence of an external control signal or power supply, the two switch units are in a disconnected (i.e., "normally open") state by default. In this way, it can be ensured that the system can automatically enter a safe state when power is off or the control signal is lost, preventing accidental power flow or device startup, thereby protecting the safety of the system and operators.
[0051] Through the above introduction, the control method of the front-end module of the semiconductor equipment is as follows:
[0052] When the power supply unit 111 is powered off, the first electric control unit 1142 is powered off and retracts, and the third switch unit 1141 is automatically disconnected. At this time, the first electromagnet unit 2163 is demagnetized when the power is off, and the fourth switch unit 2161 is automatically disconnected after it is no longer magnetically attracted by the first electromagnet unit 2163. In this way, the interlocking function is realized to ensure that the fan unit 112 will not be accidentally started when the power is off, thereby protecting the safety of the equipment and operators.
[0053] When the power supply unit 111 resumes power supply, the first electromagnet unit 2163 resumes magnetism when powered on. However, since the first electromagnet unit 2163 is too far away from the fourth switch unit 2161, the first electromagnet unit 2163 cannot immediately attract the fourth switch unit 2161, resulting in the system being unable to immediately resume normal operation. In this case, after the port control unit 212 controls the port opening and closing unit 211 to close, the port control unit 212 controls the second electric control unit 2162 to be powered on, thereby causing the second electric control unit 2162 to have a forward push action. This action prompts the first electromagnet unit 2163 to attract the fourth switch unit 2161. At the same time, the first electric control unit 1142 is powered on, and when powered on, there is a forward push action, thereby causing the third switch unit 1141 to close. In this way, the power supply unit 111 and the fan unit 112 are turned on. That is to say, after the power supply of the wafer handling module 110 is restored, the fan unit 112 can only operate after the port opening and closing unit 211 is closed. In this way, internal turbulence in the wafer handling module 110 can be effectively avoided, and the wafers placed on the loading unit 213 can be prevented from being contaminated by particles inside the wafer handling module 110.
[0054] Figure 4 A circuit diagram of a semiconductor device front-end module provided by another embodiment of the present disclosure;
[0055] In one embodiment, the wafer handling module 110 includes a floor opening and closing unit 130, which is electrically connected to the power supply unit 111 through the third control unit 140. When the power supply unit 111 is powered off, the floor opening and closing unit 130 is in a closed state. When the power supply unit 111 is powered on again, the port control unit 212 controls the port opening and closing unit 211 to be closed, and then the third control unit 140 conducts the floor opening and closing unit 130 and the power supply unit 111 so that the floor opening and closing unit 130 is in an open state. That is, when the power supply unit 111 is powered off, the floor opening and closing unit 130 is automatically in a closed state, so that particles (PA) deposited between the floor (floor) and the foundation (Foundation) of the semiconductor equipment front-end module can be prevented from being drawn into the interior of the semiconductor equipment front-end module (EFEM), thereby preventing the particles from contaminating the wafers still being transported in the wafer handling module 110. When the power supply unit 111 resumes power supply, only after the port control unit 212 controls the port opening and closing unit 211 to close, the third control unit 140 connects the floor opening and closing unit 130 and the power supply unit 111 to make the floor opening and closing unit 130 in an open state. In this way, the wafers in the front-opening wafer transfer box 510 can be prevented from being contaminated by particles.
[0056] Figure 5 A circuit diagram of a semiconductor device front-end module provided by another embodiment of the present disclosure;
[0057] In one embodiment, the third control unit 140 includes a fifth switch unit 141, a second electromagnet unit 143 and a third electric control unit 142, wherein the fifth switch unit 141 is electrically connected to the power supply unit 111 and the floor opening and closing unit 130, the second electromagnet unit 143 is connected to the power supply unit 111, the third electric control unit 142 is electrically connected to the port control unit 212, and the second electromagnet unit 143 and the third electric control unit 142 jointly control the fifth switch unit 141. The second electromagnet unit 143 will be magnetic when powered on, and in cooperation with the third electric control unit 142, the fifth switch unit 141 will be closed, the second electromagnet unit 143 will be demagnetized when powered off, and the fifth switch unit 141 will automatically disconnect after the second electromagnet unit 143 is no longer magnetically attracted. The third electric control unit 142 is controlled by the port control unit 212, that is, after the port control unit 212 controls the port opening and closing unit 211 to close, the port control unit 212 controls the third electric control unit 142 to be powered on, thereby causing the third electric control unit 142 to have a forward movement; after the port control unit 212 controls the port opening and closing unit 211 to open, the port control unit 212 controls the third electric control unit 142 to be powered off, thereby causing the third electric control unit 142 to have a retracting movement.
[0058] Figure 6-7 A schematic diagram of the structure of a floor opening and closing unit of a front-end module of a semiconductor device provided by an embodiment of the present disclosure;
[0059] In one embodiment, the floor opening and closing unit 130 includes a multi-layer hollow floor 131, and pneumatic valve units 132 and normally closed valve units 133 are sequentially arranged on both sides of the hollow floor 131, and the normally closed valve units 133 are electrically connected to the third control unit 140. The relative position of the hollow floor 131 can determine whether the floor opening and closing unit is opened or closed. The pneumatic valve unit 132 is generally used to control the flow of gas. By adjusting the pressure or flow of the gas, the movement of the hollow floor 131 can be driven to realize the opening and closing of the floor opening and closing unit 130. The normally closed valve unit 133 is in a closed state (i.e., a "normally closed" state) by default when there is no control signal, and it is electrically connected to the third control unit 140, which means that its opening and closing state is determined by the third control unit 140.
[0060] In one embodiment, the hollow floor 131 has holes of the same shape. When the power supply unit 111 is powered off, the holes of the hollow floor 131 are staggered. When the power supply unit 111 is powered on, the holes of the hollow floor 131 are overlapped. The hollow floor 131 realizes a dynamic gas control mechanism through the staggered and overlapping arrangement of its holes. Figure 6As shown, when the power supply unit 111 is powered off, the holes of the hollow floor 131 are designed to be staggered, that is, the holes of the two layers of hollow floor 131 have no overlapping parts, and the gas cannot flow through the holes of the hollow floor 131. Figure 7 As shown, when the power supply unit 111 resumes power supply, the holes of the hollow floor 131 are designed to overlap, that is, the holes of the two layers of the hollow floor 131 have overlapping parts, and gas can flow through the holes of the hollow floor 131.
[0061] Figure 8 A circuit diagram of a semiconductor device front-end module provided by another embodiment of the present disclosure;
[0062] In one embodiment, the semiconductor equipment front-end module includes a gas control unit 310, which controls the gas to pass through the normally closed gas valve unit 133, the pneumatic valve unit 132, and the hollow floor 131 in sequence. The gas control unit 310 is responsible for controlling and adjusting the flow and pressure of the gas to ensure that the gas can be accurately delivered to the chamber of the wafer handling module 110 during the manufacturing process, see Figure 8 As shown, the gas passes through the normally closed valve unit 133 through the exhaust pipe 311, and then passes through the pneumatic valve unit 132 and the hollow floor 131 through the exhaust pipe (not shown). The gas enters the chamber of the wafer handling module 110 through the holes of the hollow floor 131.
[0063] Through the above introduction, the control method of the floor opening and closing unit in the front-end module of the semiconductor equipment is as follows:
[0064] When the power supply unit 111 is powered off, the second electromagnet unit 143 will be demagnetized when the power is off, and the fifth switch unit 141 will automatically disconnect after the second electromagnet unit 143 is no longer magnetically attracted. At this time, the normally closed valve unit 133 will also be powered off and closed, and the pneumatic valve unit 132 will retract, driving the hollow floor 131 to stagger, so that the holes of the two layers of the hollow floor 131 have no overlapping parts, and the gas cannot flow through the holes of the hollow floor 131.
[0065] When the power supply unit 111 resumes power supply, the second electromagnet unit 143 resumes magnetism when powered on. However, since the second electromagnet unit 143 is too far away from the fifth switch unit 141, the second electromagnet unit 143 cannot immediately attract the fifth switch unit 141, resulting in the system being unable to immediately resume normal operation. In this case, after the port control unit 212 controls the port opening and closing unit 211 to close, the port control unit 212 controls the third electric control unit 142 to be energized, so that the third electric control unit 142 has a forward push, and this action prompts the second electromagnet unit 143 to attract the fifth switch unit 141. At the same time, the third electric control unit 142 is energized, and when energized, there is a forward push, thereby closing the fifth switch unit 141. In this way, the normally closed valve unit 133 will also be energized to open, and the pneumatic valve unit 132 is energized to perform a forward push, driving the hollow floor 131 to move to complete overlap, so that the holes of the two layers of hollow floor 131 have overlapping parts. At the same time, the gas control unit 310 controls the gas to pass through the floor opening and closing unit 130. That is, when the power supply unit 111 is powered off, the holes of the two layers of the hollow floor 131 have no overlapping parts, and the gas cannot flow through the holes of the hollow floor 131, that is, turbulence cannot be formed inside the wafer handling module 110, thereby preventing particles from contaminating the wafers transported in the wafer handling module 110. When the power supply unit 111 is restored, only after the port control unit 212 controls the port opening and closing unit 211 to be closed, the holes of the two layers of the hollow floor 131 have overlapping parts, and the gas passes through the floor opening and closing unit 130, thereby preventing the wafers in the front-opening wafer transfer box 510 on the loading unit 213 from being contaminated by particles.
[0066] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.
[0067] In the description of the present disclosure, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.
[0068] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and it can make the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A semiconductor device front-end module, characterized in that: include: A wafer handling module, wherein the wafer handling module comprises a power supply unit and a fan unit, wherein the fan unit is electrically connected to the power supply unit via a first switch unit and a first control unit in sequence; A loading port module, the loading port module comprising a port opening and closing unit and a port control unit, the port opening and closing unit is connected with the wafer handling module and the loading port module, the port control unit controls the port opening and closing unit; the port control unit is electrically connected to the power supply unit through a second switch unit, and the port control unit acts on the second control unit; Among them, when the power supply unit resumes power supply, the port control unit controls the port opening and closing unit to close, and then the port control unit acts on the second control unit, and the second control unit connects the first control unit and the power supply unit, so that the power supply unit and the fan unit are connected.
2. The semiconductor device front-end module according to claim 1, characterized in that: The first switch unit and the second switch unit are mechanical switches and are in a normally closed state.
3. The semiconductor device front-end module according to claim 1, characterized in that: The first control unit includes a third switch unit and a first electric control unit, the third switch unit is electrically connected to the power supply unit and the first switch unit, and the first electric control unit is electrically connected to the second control unit for controlling the third switch unit.
4. The semiconductor device front-end module according to claim 1, characterized in that: The second control unit includes a fourth switch unit, a first electromagnet unit and a second electric control unit. The fourth switch unit is electrically connected to the power supply unit and the first control unit. The first electromagnet unit is connected to the power supply unit. The second electric control unit is electrically connected to the port control unit. The first electromagnet unit and the second electric control unit jointly control the fourth switch unit.
5. The semiconductor device front-end module according to any one of claims 3 to 4, characterized in that: The third switch unit and the fourth switch unit are normally open switch units.
6. The semiconductor device front-end module according to claim 1, characterized in that: The wafer handling module includes a floor opening and closing unit, which is electrically connected to the power supply unit through the third control unit. When the power supply unit is powered off, the floor opening and closing unit is in a closed state. When the power supply unit resumes power supply, the port control unit controls the port opening and closing unit to close, and then the third control unit connects the floor opening and closing unit and the power supply unit so that the floor opening and closing unit is in an open state.
7. The semiconductor device front-end module according to claim 6, characterized in that: The third control unit includes a fifth switch unit, a second electromagnet unit and a third electric control unit. The fifth switch unit is electrically connected to the power supply unit and the floor opening and closing unit. The second electromagnet unit is connected to the power supply unit. The third electric control unit is electrically connected to the port control unit. The second electromagnet unit and the third electric control unit jointly control the fifth switch unit.
8. The semiconductor device front-end module according to claim 7, characterized in that: The floor opening and closing unit includes a multi-layer hollow floor, and a pneumatic valve unit and a normally closed air valve unit are sequentially arranged on both sides of the hollow floor, and the normally closed air valve unit is electrically connected to the third control unit.
9. The semiconductor device front-end module according to claim 8, characterized in that: The hollow floor has holes of the same shape. When the power supply unit is powered off, the holes of the hollow floor are staggered. When the power supply unit is powered on, the holes of the hollow floor are overlapped.
10. The semiconductor device front-end module according to claim 8, characterized in that: The semiconductor equipment front-end module comprises a gas control unit, which controls the gas to pass through the normally closed gas valve unit, the pneumatic valve unit and the hollow floor in sequence.