Domain controller and vehicle

Abstract

The invention provides a domain controller and a vehicle, the domain controller comprises a bottom shell and a top cover, a first heating element is arranged in an inner cavity of the bottom shell, the top cover is connected to the bottom shell, and a heat dissipation air channel with an air inlet and an air outlet is formed between the top cover and the bottom shell; any one of the air inlet and the air outlet is provided with a fan assembly, the fan assembly is connected to the bottom shell, a heat dissipation module and a first fin set are arranged in the heat dissipation air channel, and the heat dissipation module and the first fin set are distributed in the axial direction of the fan assembly at intervals; the heat dissipation module is connected to the bottom shell and is used for conducting heat generated by the first heating element and dissipating the heat; the first fin set is connected to the bottom shell and comprises a plurality of first fins distributed at intervals, and the extending direction of each first fin is consistent with the axial direction of the fan assembly. According to the domain controller, the heat dissipation cost is relatively low, and the installation steps of the domain controller on the whole vehicle are relatively simplified.

Description

Technical Field

[0001] The present application relates to the technical field of unmanned vehicles, and in particular to a domain controller and a vehicle. Background Art

[0002] The emergence of domain controller (Domain Control Unit, DCU) is due to the problem of bus lengthening caused by the increase in the number of electronic control units (Electronic Control Unit, ECU) in the development process of vehicles. In order to control the bus length and reduce the number of ECUs, or keep the number of ECUs unchanged, reduce the weight of electronic components, and reduce the manufacturing cost of the whole vehicle, various scattered small sensors are integrated into a more powerful single sensor, and the scattered controllers are divided according to functional domains and integrated into domain controllers with stronger computing power.

[0003] Generally, a domain controller includes a shell, an inner cavity of the shell has a circuit board, and the circuit board has a chip. In order for the domain controller to operate normally, the heat generated by the domain controller needs to be dissipated. For the heat dissipation of some high-power chips, such as chips with a thermal power of 30 watts to 70 watts, the relevant technology will use water cooling for heat dissipation, and it is necessary to set up external water cooling equipment, such as water pumps, water pipes, valves and overflow tanks.

[0004] However, the above-mentioned heat dissipation method is relatively expensive and requires high external water cooling equipment, which will increase the manufacturing cost of the entire vehicle; in addition, the installation of water cooling equipment will complicate the installation of the domain controller. Summary of the invention

[0005] The present application provides a domain controller and a vehicle, which can reduce the heat dissipation cost of the domain controller to reduce the manufacturing cost of the vehicle; in addition, it can simplify the installation steps of the domain controller on the whole vehicle. The specific technical solution is as follows:

[0006] On the one hand, the present application provides a domain controller, including a bottom shell and a top cover, the bottom shell has a first heating element in its inner cavity, the top cover is connected to the bottom shell, and a heat dissipation duct with an air inlet and an air outlet is formed between the top cover and the bottom shell; either the air inlet or the air outlet is provided with a fan assembly, the fan assembly is connected to the bottom shell, a heat dissipation module and a first fin group are provided in the heat dissipation duct, the heat dissipation module and the first fin group are spaced apart along the axial direction of the fan assembly; the heat dissipation module is connected to the bottom shell, the heat dissipation module is used to conduct the heat generated by the first heating element and dissipate the heat; the first fin group is connected to the bottom shell, and the first fin group includes a plurality of first fins spaced apart, and the extension direction of each first fin is consistent with the axial direction of the fan assembly.

[0007] As an optional implementation, the bottom shell has a through hole facing the first heating element; the heat dissipation module includes a vacuum chamber heat spreader and a plurality of second fins distributed at intervals, the vacuum chamber heat spreader is connected to the bottom shell, and one end of the vacuum chamber heat spreader is located in the inner cavity and abuts against the first heating element; a plurality of second fins are arranged on the other end of the vacuum chamber heat spreader and extend out of the inner cavity through the through hole, and the extension direction of each second fin is consistent with the axial direction of the fan assembly. In this way, the heat emitted by the first heating element can be quickly transferred out, so that the heat dissipation performance of the domain controller provided in this embodiment is better.

[0008] As an optional implementation, a first heat conducting member is provided on a side of the vacuum chamber vapor chamber facing the first heating element, so that the heat generated by the first heating element can be quickly transferred to the vacuum chamber vapor chamber.

[0009] As an optional implementation, the first heating element is a chip, and the thermal power of the first heating element is 30 watts to 70 watts.

[0010] As an optional implementation, a partition fin is provided between the top cover and the bottom shell, and the partition fin divides the heat dissipation air duct into a plurality of sub-air ducts, and each sub-air duct is provided with a heat dissipation module and a plurality of first fins, and a heat dissipation module corresponds to a first heating element. In this way, not only the heat generated by each first heating element can be quickly dissipated, but also the method of dividing the heat dissipation air duct into a plurality of sub-air ducts by the partition fin is not only conducive to heat dissipation, but also convenient for arranging and shaping the plurality of first fins.

[0011] As an optional embodiment, the thickness of the second fin is 2 mm to 4 mm, and a first sealing ring is provided on the outer side of the plurality of second fins; the through hole includes a first hole section and a second hole section which are connected in sequence, and the aperture of the first hole section is larger than the aperture of the second hole section, so as to form a step surface at the connection between the first hole section and the second hole section; the first sealing ring is located in the first hole section, and one end of the first sealing ring abuts against the heat spreader of the vacuum chamber, and the other end of the first sealing ring abuts against the step surface. In this way, by setting the first sealing ring, the vibration resistance of the second fin and the heat spreader of the vacuum chamber can be improved to avoid the second fin from breaking and affecting the normal use of the domain controller provided in this embodiment; in addition, by setting the first sealing ring, dust and the like can be prevented from entering the inner cavity 11 through the through hole, thereby improving the performance of the domain controller provided in this embodiment.

[0012] As an optional implementation, there is a gap between the hole wall of the first hole section and the outer periphery of the first sealing ring. In this way, when relative movement occurs between the upper heat dissipation module and the bottom shell, kinetic energy can be converted into elastic potential energy of the first sealing ring, causing the first sealing ring to undergo elastic deformation in the radial direction of the first sealing ring, reducing vibration and avoiding the second fin from breaking to a certain extent.

[0013] As an optional embodiment, the bottom shell includes an upper shell, a lower shell and a second sealing ring, the upper shell is located on the side of the lower shell close to the top cover, the upper shell and the lower shell are buckled to form an inner cavity, and the second sealing ring is arranged between the upper shell and the lower shell; the fan assembly and the first fin group are both connected to the upper shell, and the first fin group and the upper shell are in an integrated structure. In this way, by setting the second sealing ring, dust and the like can be prevented from entering the inner cavity through the gap between the upper shell and the lower shell, and the performance of the domain controller provided by this embodiment can be further improved; in addition, by molding multiple first fins on the shell in an integrated molding manner, not only the molding convenience of the first fins can be improved, but also the molding process of the first fins can be simplified, so that the manufacturing cost of the upper shell and the multiple first fins is low.

[0014] As an optional implementation, the domain controller provided by the present application further includes a second heating element located in the inner cavity, the thermal power of the second heating element is less than the thermal power of the first heating element; the upper shell has a protrusion protruding toward the second heating element, and the second heating element abuts against the protrusion. In this way, rapid heat dissipation of the second heating element can be achieved.

[0015] As an optional embodiment, a second heat conducting member is provided on the side of the protrusion facing the second heating element. Thus, by providing the second heat conducting member, the heat generated by the second heating element can be quickly dissipated.

[0016] As an optional implementation, a second fin group is further provided on the upper shell, the second fin group is located between the upper shell and the top cover, and the second fin group is located beside the first fin group. In this way, through the provision of the second fin group, the heat generated by each heating element in the domain controller provided by this embodiment can be quickly dissipated, so that the heat dissipation performance of the domain controller provided by this embodiment is better.

[0017] On the other hand, the present application provides a vehicle, including a vehicle body and the above-mentioned domain controller, and the domain controller is arranged on the vehicle body.

[0018] In the domain controller and vehicle provided by the present application, the domain controller includes a bottom shell and a top cover, the inner cavity of the bottom shell is provided with a first heating element, the top cover is connected to the bottom shell, and a heat dissipation duct with an air inlet and an air outlet is formed between the top cover and the bottom shell; either the air inlet or the air outlet is provided with a fan assembly, the fan assembly is connected to the bottom shell, a heat dissipation module and a first fin group are provided in the heat dissipation duct, and the heat dissipation module and the first fin group are spaced apart along the axial direction of the fan assembly; the heat dissipation module is connected to the bottom shell, and the heat dissipation module is used to conduct the heat generated by the first heating element and dissipate the heat; the first fin group is connected to the bottom shell, and the first fin group includes a plurality of first fins spaced apart, and the extension direction of each first fin is consistent with the axial direction of the fan assembly. In the domain controller provided by the present application, during the heat dissipation process, the heat generated by the first heating element is transferred out through the heat dissipation module, and the heat generated by other heating elements located in the inner cavity is transferred out through the first fin group, and then under the action of the fan assembly, the heat is extracted from the heat dissipation module and the first fin assembly, that is, the heat dissipation method in the domain controller provided by the present application is a combination of a heat dissipation module, a plurality of first fins and a fan assembly. Compared with the water-cooled heat dissipation method in the related art, no external water cooling equipment is required, so that the heat dissipation cost of the domain controller provided by the present application is lower, and then the manufacturing cost of the domain controller provided by the present application is lower, so that the manufacturing cost of the vehicle provided by the present application is lower; in addition, by combining the heat dissipation module, the plurality of first fins and the fan assembly for heat dissipation, the heat dissipation effect is also better, which can improve the performance of the domain controller provided by the present application; moreover, the domain controller provided by the present application will not be dependent on the water cooling equipment, which can simplify the installation steps of the domain controller on the vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a domain controller provided in this embodiment;

[0020] Figure 2 for Figure 1 Schematic diagram of the three-dimensional structure from another perspective;

[0021] Figure 3 An exploded diagram of a domain controller provided in this embodiment;

[0022] Figure 4 A schematic diagram of the local structure of the domain controller provided in this embodiment;

[0023] Figure 5 for Figure 4 Cross-sectional view along AA direction;

[0024] Figure 6 for Figure 5 A magnified schematic diagram of the local structure at B in the middle;

[0025] Figure 7 A schematic diagram of the three-dimensional structure of a heat dissipation module in a domain controller provided in this embodiment;

[0026] Figure 8 A schematic diagram of the three-dimensional structure of the upper shell of the domain controller provided in this embodiment;

[0027] Fig. 9 A heat dissipation principle diagram of a vacuum chamber vapor chamber in a domain controller provided in this embodiment;

[0028] Fig.10 A schematic diagram of the three-dimensional structure of the upper shell of the domain controller provided in this embodiment from another perspective.

[0029] Description of reference numerals:

[0030] 1. bottom shell; 2. top cover; 3. first heating element; 4. sub-air duct; 5. fan assembly; 6. heat dissipation module; 7. first fin; 8. circuit board; 9. first heat conducting member;

[0031] 10. domain controller; 11. inner cavity; 12. upper shell; 13. lower shell; 14. first connecting column; 15. fan seat; 16. second connecting column; 17. positioning column; 18. third connecting column; 19. protrusion; 21. buckle cover; 22. extension; 51. fan; 52. bracket; 61. vacuum chamber heat plate; 62. second fin; 20. third fin; 30. first sealing ring; 40. second sealing ring; 50. separation fin;

[0032] 121, through hole; 141, second connection hole; 161, fourth connection hole; 211, top plate; 212, side plate; 221, first connection hole; 222, positioning notch; 521, main body; 522, connection part; 611, fifth connection hole; 612, copper plate; 613, vacuum chamber; 614, capillary structure; 615, copper column;

[0033] 1211, first hole section; 1212, second hole section; 1213, step surface; 5211, support plate; 5212, enclosure plate; 5221, third connecting hole. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings to clearly and thoroughly describe the technical solutions in this application. In the description of this application, unless otherwise specified, " / " means or, for example, A / B can mean A or B: "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of this application, "multiple" means two or more than two.

[0035] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0036] The emergence of domain controller (Domain Control Unit, DCU) is due to the problem of bus lengthening caused by the increase in the number of electronic control units (Electronic Control Unit, ECU) in the development process of vehicles. In order to control the bus length and reduce the number of ECUs, or keep the number of ECUs unchanged, reduce the weight of electronic components, and reduce the manufacturing cost of the whole vehicle, various scattered small sensors are integrated into a more powerful single sensor, and the scattered controllers are divided according to functional domains and integrated into domain controllers with stronger computing power.

[0037] "Domain" refers to the decomposition of the vehicle's electronic system into several functional blocks according to its functions. The domain controller takes the lead in building the system architecture within different functional blocks, and uses a multi-core central processing unit (CPU) or graphics processing unit (GPU) chip with stronger processing power to relatively centrally control each domain, replacing the distributed electronic and electrical architecture in the current vehicle. The system interconnection within each domain can use the controller area network (CAN) and FlexRay communication bus. For communication between different domains, Ethernet with higher transmission performance is required as the backbone network to undertake the task of information exchange.

[0038] The domain controller is the center of the domain-centralized vehicle architecture design, requiring strong computing power, high real-time performance, and a large number of communication peripherals. Since the domain controller has powerful hardware computing power and rich software interface support, many core functional modules are concentrated in the domain controller, which greatly improves the system function integration and reduces the hardware requirements for function perception and execution. With the standardization of data interaction interfaces, components become standard parts, thereby reducing the development or manufacturing costs of these components.

[0039] Different vehicle brands will have their own design concepts for the specific division of functional domains. For example, the domains can be divided into: power domain, chassis domain, cockpit domain, autonomous driving domain, and body domain; they can also be divided into: autonomous driving domain, smart cockpit domain, and body control domain.

[0040] Generally, a domain controller includes a shell, a circuit board is located in the inner cavity of the shell, and a chip is located on the circuit board. In order for the domain controller to operate normally, the heat generated by the domain controller needs to be dissipated. For the heat dissipation of some high-power chips, such as chips with a thermal power of 30 watts to 70 watts, the relevant technology will use water cooling for heat dissipation, and external water cooling equipment needs to be set up, such as a water pump, a water pipe, a valve, and an overflow tank. However, the cost of the above heat dissipation method is relatively high, and the requirements for external water cooling equipment are relatively high, which will increase the manufacturing cost of the entire vehicle.

[0041] Therefore, the present embodiment provides a domain controller and a vehicle. The domain controller provided in the present embodiment includes a bottom shell and a top cover. The inner cavity of the bottom shell has a first heating element. The top cover is connected to the bottom shell, and a heat dissipation duct with an air inlet and an air outlet is formed between the top cover and the bottom shell; either the air inlet or the air outlet is provided with a fan assembly, the fan assembly is connected to the bottom shell, a heat dissipation module and a first fin group are provided in the heat dissipation duct, and the heat dissipation module and the first fin group are spaced apart along the axial direction of the fan assembly; the heat dissipation module is connected to the bottom shell, and the heat dissipation module is used to conduct the heat generated by the first heating element and dissipate the heat; the first fin group is connected to the bottom shell, and the first fin group includes a plurality of first fins spaced apart, and the extension direction of each first fin is consistent with the axial direction of the fan assembly. In the domain controller provided by the present embodiment, during the heat dissipation process, the heat generated by the first heating element is transferred out through the heat dissipation module, and the heat generated by other heating elements located in the inner cavity is transferred out through the first fin group, and then under the action of the fan assembly, the heat is extracted from the heat dissipation module and the first fin assembly, that is, the heat dissipation method in the domain controller provided by the present embodiment is a combination of the heat dissipation module, multiple first fins and a fan assembly. Compared with the water-cooled heat dissipation method in the related art, no external water cooling equipment is required, so that the heat dissipation cost of the domain controller provided by the present embodiment is lower, and then the manufacturing cost of the domain controller provided by the present embodiment is lower, so that the manufacturing cost of the vehicle provided by the present embodiment is lower; in addition, by combining the heat dissipation module, multiple first fins and the fan assembly for heat dissipation, the heat dissipation effect is also better, which can improve the performance of the domain controller provided by the present embodiment.

[0042] It should be noted that the vehicle provided in this embodiment includes but is not limited to an unmanned vehicle. Here, there is no restriction on the type of vehicle provided in this embodiment.

[0043] The present embodiment will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0044] See also Figures 1 to 5 , Figure 1 A schematic diagram of the three-dimensional structure of the domain controller provided in this embodiment, Figure 2 for Figure 1Schematic diagram of the three-dimensional structure from another perspective. Figure 3 An exploded diagram of a domain controller provided in this embodiment, Figure 4 A schematic diagram of the local structure of the domain controller provided in this embodiment, Figure 5 for Figure 4 Cross-sectional view along the AA direction. This embodiment provides a domain controller 10, including a bottom shell 1 and a top cover 2, the inner cavity 11 of the bottom shell 1 has a first heating element 3, the top cover 2 is connected to the bottom shell 1, and a heat dissipation duct with an air inlet and an air outlet is formed between the top cover 2 and the bottom shell 1; either the air inlet or the air outlet is provided with a fan assembly 5, the fan assembly 5 is connected to the bottom shell 1, a heat dissipation module 6 and a first fin group are provided in the heat dissipation duct, and the heat dissipation module 6 and the first fin group are distributed along the axial direction of the fan assembly 5; the heat dissipation module 6 is connected to the bottom shell 1, and the heat dissipation module 6 is used to conduct the heat generated by the first heating element 3 and dissipate the heat; the first fin group is connected to the bottom shell 1, and the first fin group includes a plurality of first fins 7 distributed at intervals, and the extension direction of each first fin 7 is consistent with the axial direction of the fan assembly 5. In the domain controller 10 provided in the present embodiment, during the heat dissipation process, the heat generated by the first heating element 3 is transferred out through the heat dissipation module 6, and the heat generated by other heating elements located in the inner cavity 11 is transferred out through the first fin group, and then under the action of the fan assembly 5, the heat is extracted from the heat dissipation module 6 and the first fin group, that is, the heat dissipation method in the domain controller 10 provided in the present embodiment is a combination of the heat dissipation module 6, the plurality of first fins 7 and the fan assembly 5. Compared with the water-cooled heat dissipation method in the related art, no external water cooling equipment is required, so that the heat dissipation cost of the domain controller 10 provided in the present embodiment is lower, and then the manufacturing cost of the domain controller 10 provided in the present embodiment is lower, so that the manufacturing cost of the vehicle provided in the present embodiment is lower; in addition, by combining the heat dissipation module 6, the plurality of first fins 7 and the fan assembly 5 for heat dissipation, the heat dissipation effect is also better, which can improve the use performance of the domain controller 10 provided in the present embodiment; moreover, the domain controller 10 provided in the present embodiment does not rely on the water cooling equipment, so the installation steps of the domain controller 10 on the vehicle can be simplified.

[0045] A printed circuit board (PCB) 8 is also disposed in the inner cavity 11 , and the first heating element 3 is disposed on the PCB.

[0046] It should be noted that the bottom shell 1 is made of aluminum alloy die-casting, and in some other embodiments, the bottom shell 1 can also be made of other materials. Here, there is no limitation on the material of the bottom shell 1.

[0047] Specifically, the bottom shell 1 may include an upper shell 12 and a lower shell 13 that are snapped together, the upper shell 12 is located on a side of the lower shell 13 close to the top cover 2, the upper shell 12 and the lower shell 13 are snapped together to form an inner cavity 11, and the fan assembly 5 and the multiple first fins 7 are all connected to the upper shell 12.

[0048] In some embodiments, the end of the first fin 7 facing the heat dissipation module 6 and away from the upper shell 12 is a rounded structure, so that when air flows through, eddy currents can be avoided to a certain extent, thereby reducing noise. Here, the shape of the first fin 7 is not limited.

[0049] In order to facilitate the placement of the first heating element 3 and the circuit board 8 in the inner cavity 11, the upper shell 12 and the lower shell 13 can be connected in a detachable manner, such as by threaded fasteners; and in some other embodiments, the upper shell 12 and the lower shell 13 can also be connected in other ways. Here, the connection method between the upper shell 12 and the lower shell 13 is not specifically limited.

[0050] Furthermore, in order to form a heat dissipation duct between the top cover 2 and the bottom shell 1, in some specific embodiments, the top cover 2 includes a buckle cover portion 21 for forming a heat dissipation duct and two extension portions 22 for connecting to the upper shell 12, wherein the buckle cover portion 21 includes a top plate 211 and two side plates 212, the top plate 211 is arranged opposite to the upper shell 12, and the two side plates 212 are arranged at opposite ends of the top plate 211 to form relatively distributed air inlets and air outlets between the upper shell 12, wherein the distribution direction of the air inlets and air outlets is perpendicular to the distribution direction of the two side plates 212; the two extension portions 22 are arranged corresponding to the two side plates 212, one side plate 212 corresponds to an extension portion 22, one end of the extension portion 22 is connected to the corresponding side plate 212, and the other end of the extension portion 22 extends along the extension direction of the upper shell 12 toward a direction away from the other extension portion 22, and the extension portion 22 can be detachably connected to the upper shell 12 by threaded fasteners.

[0051] In order to achieve a detachable connection between the extension portion 22 and the upper shell 12, a first connecting column 14 can be provided on the side of the upper shell 12 facing the extension portion 22, a first connecting hole 221 can be opened on the extension portion 22, and a second connecting hole 141 can be opened on the first connecting column 14. The extension portion 22 and the upper shell 12 can be detachably connected together by threaded fasteners such as screws that pass through the first connecting hole 221 and the second connecting hole 141 in sequence to achieve a detachable connection between the top cover 2 and the bottom shell 1.

[0052] In some optional embodiments, in order to facilitate the installation of the top cover 2 on the bottom shell 1, a positioning structure can be set between the top cover 2 and the bottom shell 1, and the relative position between the top cover 2 and the bottom shell 1 is restricted by the positioning structure to improve the connection efficiency between the top cover 2 and the bottom shell 1.

[0053] Specifically, a positioning notch 222 may be provided on the extension portion 22, and correspondingly, a positioning column 17 may be provided on the side of the bottom shell 1 facing the extension portion 22, and the positioning column 17 can extend into the positioning notch 222. In this way, when the top cover 2 is connected to the bottom shell 1, the positioning column 17 and the positioning notch 222 are aligned, and then the top cover 2 is moved along the axial direction of the positioning column 17 so that the positioning column 17 extends into the positioning notch 222. When the positioning column 17 and the positioning notch 222 are matched, the first connecting hole 221 and the second connecting hole 141 can be aligned. At this time, the top cover 2 and the bottom shell 1 can be detachably connected together by threaded fasteners such as screws that pass through the first connecting hole 221 and the second connecting hole 141 in sequence.

[0054] It should be noted that other detachable connection methods may be used between the top cover 2 and the bottom shell 1, and other positioning structures may be provided between the extension portion 22 and the top cover 2. Here, the connection method between the top cover 2 and the bottom shell 1 and the positioning structure provided between the extension portion 22 and the top cover 2 are not specifically limited.

[0055] Furthermore, in some specific embodiments, the fan assembly 5 may include a fan 51 and a bracket 52 connected to the fan 51. In order to facilitate the setting of the fan assembly 5, the bracket 52 includes a main body 521 and two connecting parts 522. The main body 521 includes two support plates 5211 and a surrounding plate 5212 connected between the two support plates 5211. A accommodating space for accommodating the fan 51 is formed between the surrounding plate 5212 and the two support plates 5211. The fan 51 can be detachably connected to the main body 521 by threaded fasteners such as screws; the two connecting parts 522 are arranged one by one with the two support plates 5211, and the connecting parts 522 are connected to the outer sides of the support plates 5211. The connecting parts 522 are plate-like members and are detachably connected to the upper shell 12 by threaded fasteners such as screws.

[0056] Furthermore, in order to achieve a detachable connection between the connecting portion 522 and the upper shell 12, a fan seat 15 is provided on the side of the upper shell 12 facing the top cover 2, and the fan 51 is located between the main body 521 and the fan seat 15. A second connecting column 16 is provided on the fan seat 15, and each connecting portion 522 is connected to two second connecting columns 16. Specifically, a third connecting hole 5221 is provided on the connecting portion 522, and a fourth connecting hole 161 is provided on the second connecting column 16. Threaded fasteners such as screws can pass through the third connecting hole 5221 and the fourth connecting hole 161 in sequence to detachably connect the connecting portion 522 to the upper shell 12, so as to detachably connect the bracket 52 to the upper shell 12.

[0057] In order to reduce the manufacturing cost of the upper shell 12 and facilitate the arrangement of the first fin group, in some embodiments, the first fin group and the upper shell 12 are in an integrated structure, that is, the plurality of first fins 7 are in an integrated structure with the upper shell 12. In this way, by forming the plurality of first fins 7 on the upper shell 12 in an integrated manner, not only the molding convenience of the first fins 7 can be improved, but also the molding process of the first fins 7 can be simplified, so that the manufacturing cost of the upper shell 12 and the plurality of first fins 7 is low.

[0058] Please continue to see Figures 6 to 8 , Figure 6 for Figure 5 The enlarged schematic diagram of the local structure at B in the middle. Figure 7 A schematic diagram of the three-dimensional structure of the heat dissipation module in the domain controller provided in this embodiment, Figure 8 A schematic diagram of the three-dimensional structure of the upper shell in the domain controller provided for this embodiment. In order to enable the heat dissipation module 6 to transfer the heat generated by the first heating element 3, in some embodiments, the bottom shell 1 has a through hole 121 directly opposite to the first heating element 3; the heat dissipation module 6 includes a vacuum chamber heat spreader 61 (Vapor-Chamber, VC) and a plurality of second fins 62 distributed at intervals, the vacuum chamber heat spreader 61 is connected to the bottom shell 1, and one end of the vacuum chamber heat spreader 61 is located in the inner cavity 11 and abuts against the first heating element 3; a plurality of second fins 62 are arranged on the other end of the vacuum chamber heat spreader 61, and extend out of the inner cavity 11 through the through hole 121, and the extension direction of each second fin 62 is consistent with the axial direction of the fan assembly 5. In this way, the heat generated by the first heating element 3 can be quickly transferred out, so that the heat dissipation performance of the domain controller 10 provided in this embodiment is better.

[0059] In order to reduce the manufacturing cost of the domain controller 10 provided in this embodiment, in this embodiment, the first heating element 3 is a chip, and the thermal power of the first heating element 3 is 30 watts to 70 watts, that is, in this embodiment, the heat dissipation module 6 only dissipates heat for electrical components with high thermal power, and for other electrical components with lower thermal power, heat is directly dissipated through the first fins 7 located on the upper shell 12. In this way, electrical components with high thermal power can be dissipated through a high-cost heat dissipation method, and electrical components with low thermal power can be dissipated through a low-cost heat dissipation method, which makes the heat dissipation cost lower, thereby reducing the manufacturing cost of the domain controller 10 provided in this embodiment.

[0060] The thermal power of the first heating element 3 may be 30W, 35W, 40W, 45W, 50W, 55W, 60W, 65W, 70W, etc. Here, the thermal power of the first heating element 3 is not specifically limited.

[0061] It should be noted that thermal power refers to the power lost due to heat in a circuit, and its magnitude is determined by the product of the square of the current intensity passing through this conductor and the resistance of the conductor.

[0062] In some optional embodiments, the above-mentioned vacuum chamber heat spreader 61 and the upper shell 12 can be detachably connected by fasteners such as screws. Specifically, a fifth connecting hole 611 can be provided on the vacuum chamber heat spreader 61, and a third connecting column 18 protruding toward the top cover 2 can be provided on the upper shell 12. A sixth connecting hole (not shown in the figure) is opened on the third connecting column 18. The fasteners pass through the fifth connecting hole 611 and the sixth connecting hole in sequence to connect the vacuum chamber heat spreader 61 and the upper shell 12 together, so as to connect the heat dissipation module 6 to the upper shell 12.

[0063] In order to enable the heat generated by the first heating element 3 to be quickly transferred to the vacuum chamber heat spreader 61, in some embodiments, a first heat conducting member 9 can be provided on the side of the vacuum chamber heat spreader 61 facing the first heating element 3. By providing the first heat conducting member 9, the heat generated by the first heating element 3 can be quickly transferred to the vacuum chamber heat spreader 61, and then transferred to the outside by the vacuum chamber heat spreader 61.

[0064] The first heat-conducting member 9 may be a heat-conducting pad, such as a heat-conducting gel, etc. Here, no specific limitation is imposed on the first heat-conducting member 9 .

[0065] Please continue to see Fig. 9 , Fig. 9 The heat dissipation principle diagram of the vacuum chamber heat sink in the domain controller provided in this embodiment. The dotted arrow direction is the heat absorption direction of the heat source surface, the dashed arrow direction is the reflux direction of the liquid working medium, the solid arrow direction is the flow direction of the steam, and the double-dotted arrow direction is the heat dissipation direction of the heat dissipation surface.

[0066] It should be noted that the material of the vacuum chamber heat plate 61 in this embodiment is C1020 oxygen-free copper, where "C1020" is the grade of oxygen-free copper. In some other embodiments, the vacuum chamber heat plate 61 can also be made of other materials, which are not limited here.

[0067] Specifically, the vacuum chamber heat spreader 61 is formed by welding two layers of copper plates 612, and a vacuum chamber 613 is formed inside. The inner wall of the vacuum chamber 613 has a capillary structure 614, and a plurality of copper pillars 615 are arranged inside the vacuum chamber 613 to provide support. Pure water is usually used as the working fluid inside the vacuum chamber 613, and the capillary structure 614 is made by copper powder sintering or a combined copper mesh microstructure process.

[0068] During the heat dissipation process of the vacuum chamber heat spreader 61, when heat is conducted from the heat source surface to the evaporation zone, the coolant in the vacuum chamber 613 begins to evaporate after being heated in a low vacuum environment. At this time, the coolant absorbs heat energy and its volume expands rapidly, thereby converting from liquid to gas. Subsequently, the gaseous working fluid will quickly fill the entire vacuum chamber 613. When the gaseous working fluid contacts the condensation zone, condensation will occur, and the heat accumulated during evaporation will be released through condensation. The condensed liquid working fluid will return to the evaporation heat source again by the capillary action of the capillary structure 614, and the whole process is continuous and repeated.

[0069] In this embodiment, when the temperature of the first heating element 3 rises to above 80°C, a phase change phenomenon begins to occur on the heat source surface of the vacuum chamber heat spreader 61. At this time, the vacuum chamber heat spreader 61 exhibits efficient heat conduction performance, and its thermal conductivity is initially about 1000 times that of pure copper, and 99% of the heat is quickly conducted from the heat source surface to the heat dissipation surface of the vacuum chamber heat spreader 61.

[0070] In some embodiments, since there is more than one first heating element 3 with high thermal power, in order to quickly dissipate the heat of each first heating element 3, in some embodiments, a partition fin 50 is provided between the top cover 2 and the bottom shell 1, and the partition fin 50 divides the heat dissipation air duct into a plurality of sub-air ducts 4, each of which is provided with a heat dissipation module 6 and a plurality of first fins 7, and a heat dissipation module 6 corresponds to a first heating element 3. In this way, not only the heat generated by each first heating element 3 can be quickly dissipated, but also the method of dividing the heat dissipation air duct into a plurality of sub-air ducts 4 by the partition fin 50 is not only conducive to heat dissipation but also convenient for arranging and shaping the plurality of first fins 7.

[0071] It should be noted that the above-mentioned partition fins 50 are arranged on the upper shell 12 and are integrally formed with the upper shell 12. Here, the connection method between the partition fins 50 and the upper shell 12 is not specifically limited.

[0072] In order to speed up the flow of gas, in some embodiments, in each sub-air duct 4, the width of the air duct at the heat dissipation module 6 is set to be greater than the width of the air duct at the first fin group. In this way, the air duct at the heat dissipation module 6 is trumpet-shaped compared to the air duct at the first fin group, so that the airflow can flow quickly to the heat dissipation module 6 to dissipate the heat of the first heating element 3 with higher thermal power.

[0073] It is understandable that, in the actual design process, it is difficult to make the above-mentioned heat dissipation module 6 and the first fin group cover all the heating elements in the inner cavity 11. Therefore, in order to quickly dissipate the heat generated by the heating elements in the inner cavity 11, in some embodiments, a second fin group is also provided on the upper shell 12, the second fin group is located between the upper shell 12 and the top cover 2, and the second fin group is located beside the first fin group. Specifically, the second fin group includes a plurality of third fins 20 distributed at intervals, and the extension direction of the third fins 20 is consistent with the axial direction of the fan assembly 5. In this way, through the provision of the second fin group, the heat generated by each heating element in the domain controller 10 provided in this embodiment can be quickly dissipated, so that the heat dissipation performance of the domain controller 10 provided in this embodiment is better.

[0074] The third fin 20 is formed integrally with the upper shell 12. Here, the connection method between the third fin 20 and the upper shell 12 is not specifically limited.

[0075] In the present embodiment, since the thickness of the second fin 62 is 2 mm to 4 mm, generally, the thickness of the second fin 62 is 3.5 mm. Since the thickness of the second fin 62 is relatively thin, in order to enable the domain controller 10 provided in the present embodiment to pass the vehicle's vibration test to adapt to vehicle regulations.

[0076] As an optional embodiment, a first sealing ring 30 can be provided on the outside of the plurality of second fins 62; the through hole 121 includes a first hole section 1211 and a second hole section 1212 which are connected in sequence, and the aperture of the first hole section 1211 is larger than the aperture of the second hole section 1212, so as to form a step surface 1213 at the connection between the first hole section 1211 and the second hole section 1212; the first sealing ring 30 is located in the first hole section 1211, and one end of the first sealing ring 30 abuts against the vacuum chamber heat plate 61, and the other end of the first sealing ring 30 abuts against the step surface 1213. In this way, by providing the first sealing ring 30, the vibration resistance of the second fin 62 and the vacuum chamber heat plate 61 can be improved to avoid the second fin 62 from breaking and affecting the normal use of the domain controller 10 provided in this embodiment; in addition, by providing the first sealing ring 30, dust and the like can be prevented from entering the inner cavity 11 through the through hole 121, thereby improving the use performance of the domain controller 10 provided in this embodiment.

[0077] It should be noted that the first sealing ring 30 can be made of elastic materials such as rubber. Here, the material of the first sealing ring 30 is not specifically limited.

[0078] In the anti-vibration test of the vehicle, the heat dissipation module 6 and the bottom shell 1 will move relative to each other. In order to allow the first sealing ring 30 to be sufficiently deformed, in some embodiments, there is a gap between the hole wall of the first hole section 1211 and the outer periphery of the first sealing ring 30. In this way, when the upper heat dissipation module 6 and the bottom shell 1 move relative to each other, the kinetic energy can be converted into the elastic potential energy of the first sealing ring 30, so that the first sealing ring 30 is elastically deformed in the radial direction of the first sealing ring 30, the vibration is reduced, and the second fin 62 is prevented from being broken to a certain extent.

[0079] Since the heat dissipation of the first heating element 3 is achieved through the heat dissipation module 6, and the heat dissipation of other heating elements is achieved through the above-mentioned first fins 7 and third fins 20, specifically, the domain controller 10 provided in this embodiment also includes a second heating element (not shown in the figure) located in the inner cavity 11, wherein the thermal power of the second heating element is less than the thermal power of the first heating element 3.

[0080] Please continue to see Fig.10 , Fig.10 A schematic diagram of the three-dimensional structure of the upper shell in the domain controller provided in this embodiment from another perspective. In order to allow the heat generated by the second heating element to be transferred to the first fin 7 and the third fin 20 on the upper shell 12, in some embodiments, the upper shell 12 has a protrusion 19 protruding toward the second heating element, and the second heating element abuts against the protrusion 19. In this way, the heat generated by the second heating element can be quickly transferred to the first fin 7 or the third fin 20.

[0081] In order to quickly dissipate the heat generated by the second heating element, in some embodiments, a second heat-conducting member, such as a heat-conducting pad, may be provided on the side of the protrusion 19 facing the second heating element, and reference may be made to the above-mentioned first heat-conducting member 9. In this way, by providing the second heat-conducting member, the heat generated by the second heating element can be quickly dissipated.

[0082] In some embodiments, in order to further improve the sealing performance of the bottom shell 1, a second sealing ring 40 may be provided between the upper shell 12 and the lower shell 13. In this way, by providing the second sealing ring 40, dust and the like can be prevented from entering the inner cavity 11 through the gap between the upper shell 12 and the lower shell 13, and the performance of the domain controller 10 provided in this embodiment can be further improved.

[0083] The material of the second sealing ring 40 may be the same as that of the first sealing ring 30. Here, the material of the second sealing ring 40 is not specifically limited.

[0084] The second sealing ring 40 can be pressed between the upper shell 12 and the lower shell 13, or grooves for the second sealing ring 40 to be embedded can be respectively provided on the upper shell 12 and the lower shell 13. Here, the connection method between the second sealing ring 40 and the bottom shell 1 is not specifically limited.

[0085] The domain controller provided in this embodiment includes a bottom shell and a top cover, the inner cavity of the bottom shell is provided with a first heating element, the top cover is connected to the bottom shell, and a heat dissipation duct with an air inlet and an air outlet is formed between the top cover and the bottom shell; either the air inlet or the air outlet is provided with a fan assembly, the fan assembly is connected to the bottom shell, a heat dissipation module and a first fin group are provided in the heat dissipation duct, the heat dissipation module and the first fin group are spaced apart along the axial direction of the fan assembly; the heat dissipation module is connected to the bottom shell, the heat dissipation module is used to conduct the heat generated by the first heating element and dissipate the heat; the first fin group is connected to the bottom shell, and the first fin group includes a plurality of first fins spaced apart, and the extension direction of each first fin is consistent with the axial direction of the fan assembly. In the domain controller provided by the present embodiment, during the heat dissipation process, the heat generated by the first heating element is transferred out through the heat dissipation module, and the heat generated by other heating elements located in the inner cavity is transferred out through the first fin group, and then under the action of the fan assembly, the heat is extracted from the heat dissipation module and the first fin assembly, that is, the heat dissipation method in the domain controller provided by the present embodiment is a combination of the heat dissipation module, multiple first fins and a fan assembly. Compared with the water-cooled heat dissipation method in the related art, no external water cooling equipment is required, so that the heat dissipation cost of the domain controller provided by the present embodiment is lower, and then the manufacturing cost of the domain controller provided by the present embodiment is lower, so that the manufacturing cost of the vehicle provided by the present embodiment is lower; in addition, by combining the heat dissipation module, multiple first fins and the fan assembly for heat dissipation, the heat dissipation effect is also better, which can improve the performance of the domain controller provided by the present embodiment; moreover, the domain controller provided by the present embodiment will not be dependent on the water cooling equipment, which can simplify the installation steps of the domain controller on the vehicle.

[0086] This embodiment further provides a vehicle, including a vehicle body and the domain controller 10 in the above embodiment, wherein the domain controller 10 is arranged on the vehicle body. The structure of the domain controller 10 has been described in detail in the above embodiment, and will not be described here.

[0087] It should be noted that the vehicle provided in this embodiment should also include other modules or components that enable the vehicle to operate normally, and no limitation is imposed on other modules or components.

[0088] The vehicle provided in this embodiment includes a body and a domain controller, the domain controller includes a bottom shell and a top cover, the inner cavity of the bottom shell is provided with a first heating element, the top cover is connected to the bottom shell, and a heat dissipation duct with an air inlet and an air outlet is formed between the top cover and the bottom shell; either the air inlet or the air outlet is provided with a fan assembly, the fan assembly is connected to the bottom shell, a heat dissipation module and a first fin group are provided in the heat dissipation duct, the heat dissipation module and the first fin group are spaced apart along the axial direction of the fan assembly; the heat dissipation module is connected to the bottom shell, the heat dissipation module is used to conduct the heat generated by the first heating element and dissipate the heat; the first fin group is connected to the bottom shell, and the first fin group includes a plurality of first fins spaced apart, and the extension direction of each first fin is consistent with the axial direction of the fan assembly. In this embodiment, during the heat dissipation process, the heat generated by the first heating element is transferred out through the heat dissipation module, and the heat generated by other heating elements located in the inner cavity is transferred out through the first fin group, and then under the action of the fan assembly, the heat is extracted from the heat dissipation module and the first fin assembly, that is, the heat dissipation method in the domain controller provided in this embodiment is a combination of a heat dissipation module, a plurality of first fins and a fan assembly. Compared with the water-cooled heat dissipation method in the related art, no external water cooling equipment is required, so that the heat dissipation cost of the domain controller provided in this embodiment is lower, and thus the manufacturing cost of the domain controller provided in this embodiment is lower, so that the manufacturing cost of the vehicle provided in this embodiment is lower; in addition, by combining the heat dissipation module, the plurality of first fins and the fan assembly for heat dissipation, the heat dissipation effect is also better, which can improve the performance of the domain controller, and thus improve the performance of the vehicle provided in this embodiment; moreover, the domain controller in this embodiment will not be dependent on the water cooling equipment, which can simplify the installation steps of the domain controller on the vehicle, and thus improve the overall assembly efficiency of the vehicle.

[0089] The above contents are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A domain controller, characterized in that: It comprises a bottom shell and a top cover, wherein the inner cavity of the bottom shell has a first heating element, the top cover is connected to the bottom shell, and a heat dissipation air duct with an air inlet and an air outlet is formed between the top cover and the bottom shell; Any one of the air inlet and the air outlet is provided with a fan assembly, the fan assembly is connected to the bottom shell, a heat dissipation module and a first fin group are provided in the heat dissipation duct, and the heat dissipation module and the first fin group are distributed at intervals along the axial direction of the fan assembly; The heat dissipation module is connected to the bottom shell, and is used to conduct the heat generated by the first heating element and dissipate the heat; The first fin group is connected to the bottom shell, and the first fin group includes a plurality of first fins distributed at intervals, and the extension direction of each first fin is consistent with the axial direction of the fan assembly.

2. The domain controller according to claim 1, characterized in that: The bottom shell has a through hole facing the first heating element; The heat dissipation module comprises a vacuum chamber heat spreader and a plurality of second fins distributed at intervals, the vacuum chamber heat spreader is connected to the bottom shell, and one end of the vacuum chamber heat spreader is located in the inner cavity and abuts against the first heating element; A plurality of the second fins are arranged on the other end of the vacuum chamber heat spreader and extend out of the inner cavity through the through hole, and an extending direction of each of the second fins is consistent with the axial direction of the fan assembly.

3. The domain controller according to claim 2, characterized in that: A first heat conducting member is disposed on a side of the vacuum chamber heat spreader facing the first heating element.

4. The domain controller according to any one of claims 1 to 3, characterized in that: The first heating element is a chip, and the thermal power of the first heating element is 30 watts to 70 watts; and / or, A partition fin is provided between the top cover and the bottom shell, and the partition fin divides the heat dissipation air duct into a plurality of sub-air ducts. Each of the sub-air ducts is provided with a heat dissipation module and a plurality of the first fins, and a heat dissipation module corresponds to a first heating element.

5. The domain controller according to claim 2 or 3, characterized in that: The thickness of the second fin is 2 mm to 4 mm, and a plurality of second fins are provided with a first sealing ring on the outer side; The through hole comprises a first hole segment and a second hole segment which are connected in sequence, wherein the hole diameter of the first hole segment is larger than the hole diameter of the second hole segment, so as to form a step surface at the connection between the first hole segment and the second hole segment; The first sealing ring is located in the first hole section, and one end of the first sealing ring abuts against the vacuum chamber heat sink, and the other end of the first sealing ring abuts against the step surface.

6. The domain controller according to claim 5, characterized in that: There is a gap between the hole wall of the first hole section and the outer periphery of the first sealing ring.

7. The domain controller according to any one of claims 1 to 3, characterized in that: The bottom shell comprises an upper shell, a lower shell and a second sealing ring, the upper shell is located on a side of the lower shell close to the top cover, the upper shell and the lower shell are buckled together to form the inner cavity, and the second sealing ring is arranged between the upper shell and the lower shell; The fan assembly and the first fin group are both connected to the upper shell, and the first fin group and the upper shell are in an integrated structure.

8. The domain controller according to claim 7, characterized in that: Also comprising a second heating element located in the inner cavity, the thermal power of the second heating element being less than the thermal power of the first heating element; The upper shell has a protruding portion protruding toward the second heating element, and the second heating element abuts against the protruding portion.

9. The domain controller according to claim 8, characterized in that: A second heat conducting member is disposed on a side of the protruding portion facing the second heating element; and / or, The upper shell is also provided with a second fin group, the second fin group is located between the upper shell and the top cover, and the second fin group is located beside the first fin group.

10. A vehicle, characterized in that: comprising a vehicle body and a domain controller as claimed in any one of claims 1 to 9; The domain controller is arranged on the vehicle body.

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