Head-mounted device
By introducing the heat dissipation components of liquid storage parts, heat receiving parts, capillaries and heat dissipation pipes into the smart glasses, and using the circulating flow of the cooling medium, the problem of poor heat dissipation effect of existing smart glasses is solved, achieving a more efficient heat dissipation effect.
Patent Information
- Application Number
- CN202311128448.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-01
- Publication Date
- 2025-03-04
AI Technical Summary
The existing smart glasses have poor heat dissipation effect and cannot effectively reduce the heat of the optical machine.
A head-mounted device is designed, using a heat dissipation assembly including liquid storage parts, heat receiving parts, capillaries and heat dissipation pipes, so as to achieve more effective heat dissipation through the circulating flow of the cooling medium.
Compared with devices that only conduct heat dissipation through heat conduction, this solution significantly improves the heat dissipation effect and can more effectively reduce the temperature of the heat source.
Smart Images
Figure CN119562483A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of intelligent devices, and in particular, relates to a head-mounted device. Background Art
[0002] Currently in the smart glasses industry, the heat of the optical machine is transferred to the metal frame through graphite sheets or copper foil for heat dissipation, but the heat dissipation effect is poor. Summary of the invention
[0003] On one hand, the present application provides a head-mounted device, the head-mounted device includes a heat source and a heat dissipation component, and the heat dissipation component includes:
[0004] A liquid storage part, used for storing cooling medium;
[0005] A heat receiving member is disposed adjacent to the heat source;
[0006] a capillary tube, connecting the liquid storage element and the heat receiving element, and used for introducing the cooling medium in the liquid storage element into the heat receiving element; and
[0007] A heat dissipation pipe connects the liquid storage component and the heat receiving component.
[0008] On the other hand, the present application provides a head mounted device, comprising:
[0009] Wearing components;
[0010] The external component is mounted on the wearable component, and the external component includes a heat source and a heat dissipation component, and the heat dissipation component includes:
[0011] A liquid storage part, used for storing cooling medium;
[0012] A heat receiving member is disposed adjacent to the heat source;
[0013] a capillary tube, connecting the liquid storage element and the heat receiving element, and used for introducing the cooling medium in the liquid storage element into the heat receiving element; and
[0014] A heat dissipation pipe connects the liquid storage component and the heat receiving component.
[0015] The technical solution described in this application has the following beneficial effects: This solution dissipates heat through a heat dissipation component. In a head-mounted device, the fluidity of the cooling medium is utilized so that the cooling medium carries heat and circulates between the liquid storage component and the heat receiving component to achieve heat dissipation. This application has a better heat dissipation effect than a head-mounted device that dissipates heat only through heat conduction. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the structure of a head mounted device in some embodiments of the present application;
[0017] Figure 2 for Figure 1 An exploded view of the head mounted device in the illustrated embodiment;
[0018] Figure 3 for Figure 2 A schematic diagram of a framework of a heat dissipation assembly in some embodiments of the illustrated embodiment;
[0019] Figure 4 for Figure 3 A schematic diagram of the structure of the heat dissipation assembly in the illustrated embodiment in other embodiments;
[0020] Figure 5 for Figure 2 A schematic diagram of the structure of the heat source, the mirror frame and the heat dissipation assembly in some embodiments shown in the embodiment;
[0021] Figure 6 for Figure 5 A schematic cross-sectional view of the heat source, the mirror frame and the heat dissipation assembly in the embodiment shown in the figure, taken along line VI-VI;
[0022] Figure 7 for Figure 6 A schematic diagram of the structure of the first housing in some embodiments of the illustrated embodiment;
[0023] Figure 8 for Figure 7 A partial exploded view of the first housing in the illustrated embodiment;
[0024] Fig. 9 for Figure 8 A schematic diagram of the structure of the heat receiving tank in the embodiment shown;
[0025] Fig.10 for Fig. 9 A cross-sectional view of the frame body at the heat receiving groove in the illustrated embodiment;
[0026] Fig.11 for Fig. 9 Another cross-sectional view of the frame body at the heated groove in the illustrated embodiment;
[0027] Fig.12 for Figure 8 A cross-sectional view of the frame body at the liquid reservoir in the illustrated embodiment;
[0028] Fig.13 for Figure 8 A cross-sectional view of the frame body at the heat dissipation slot in the illustrated embodiment;
[0029] Fig.14 for Figure 8 A cross-sectional view of the frame body at the capillary groove in the illustrated embodiment. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0031] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0032] The present application describes a head-mounted device. The head-mounted device may be an augmented reality or virtual reality device, such as augmented reality or virtual reality glasses. Of course, the head-mounted device may also be other devices that need to be worn on the head, such as glasses, or devices that have other functions such as lighting and can be worn on the head, which will not be described in detail. The following is a detailed description using augmented reality or virtual reality glasses as an example.
[0033] In the example of augmented reality or virtual reality glasses, the head-mounted device can be configured to pass data to and receive data from an external processing device via a signal connection, and the signal connection can be a wired connection, a wireless connection, or a combination thereof. However, in other cases, the head-mounted device can be used as a standalone device, that is, data processing is performed on the head-mounted device itself. The signal connection can be configured to carry any kind of data, such as image data (e.g., still images and / or full motion video, including 2D and 3D images), audio, multimedia, voice, and / or any other type of data. The external processing device can be, for example, a game console, a personal computer, a tablet computer, a smart phone, or other type of processing device. The signal connection can be, for example, a universal serial bus (USB) connection, a Wi-Fi connection, a Bluetooth or Bluetooth low energy (BLE) connection, an Ethernet connection, a cable connection, a DSL connection, a cellular connection (e.g., 3G, LTE / 4G or 5G), etc., or a combination thereof. Additionally, the external processing device may communicate with one or more other external processing devices via a network, which may be or include, for example, a local area network (LAN), a wide area network (WAN), an intranet, a metropolitan area network (MAN), the global Internet, or a combination thereof.
[0034] The head mounted device may include a display assembly, optical devices, sensors, and processors. In the example of augmented reality or virtual reality glasses, the display assembly is designed to, for example, implement the functions of virtual reality glasses by projecting light into the user's eyes, for example, by projecting light into the user's eyes and overlaying images on the user's view of their real world environment to implement the functions of augmented reality glasses. The head mounted device may also include a circuit system to control at least some of the above components and perform associated data processing functions. The circuit system may include, for example, one or more processors and one or more memories.
[0035] See also Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of a head mounted device in some embodiments of the present application. Figure 2 for Figure 1 An exploded diagram of the head mounted device in the illustrated embodiment. The head mounted device 100 may include a wearing component 200 and an external component 300 mounted on the wearing component 200. The wearing component 200 may be worn on the user's head. The external component 300 may be detachably mounted on the wearing component 200, and of course, may also be directly fixedly mounted on the wearing component 200. The wearing component 200 cooperates with the external component 300 to realize augmented reality or virtual reality functions in front of the user's eyes, and of course, other functions may also be realized, which will not be described in detail. It is understandable that the wearing component 200 may be used alone, or the external component 300 may be mounted and used in conjunction with each other. Similarly, the external component 300 may also be used alone.
[0036] See also Figure 2 , the wearing component 200 may include a frame 10, a heat source 20 disposed on the frame 10, and a heat dissipation component 400 disposed on the frame 10 and used to dissipate heat from the heat source 20. Among them, in addition to the frame 10, the heat source 20 and the heat dissipation component 400, the wearing component 200 may also include the display component, optical device, sensor or processor in the above-mentioned embodiment, or may include the circuit system in the above-mentioned embodiment. Furthermore, the wearing component 200 may also include a power module for power supply, a communication module for information interaction with other terminals, a camera module for shooting images, or a circuit board that can be used to integrate at least one of the power module, communication module, display component, camera module and circuit system. It can be understood that the device that can generate heat during work in the wearing component 200 can be called a heat source 20, such as a display component, an optical device, a sensor or a processor. For example, a circuit system. For example, a power module, a communication module, a camera module or a circuit board. Of course, the heat source 20 may be adjusted accordingly due to the different types of the wearable component 200 . Specifically, the heat source 20 may be determined as a component that can generate heat according to the different types of the wearable component 200 .
[0037] See also Figure 3 , Figure 3 for Figure 2 The schematic diagram of the framework of the heat dissipation assembly 400 in some embodiments of the embodiment shown. The heat dissipation assembly 400 may include a heat receiving member 401 disposed adjacent to the heat source 20, a liquid storage member 402 for storing a cooling medium, a heat dissipation pipe 403 connecting the heat receiving member 401 and the liquid storage member 402, and a capillary tube 404 connecting the heat receiving member 401 and the liquid storage member 402. The heat receiving member 401, the liquid storage member 402, the heat dissipation pipe 403 and the capillary tube 404 cooperate to form a heat dissipation loop, and thus, the heat dissipation assembly 400 may also be referred to as a heat dissipation loop. The capillary tube 404 uses a capillary phenomenon to introduce the cooling medium into the heat receiving member 401. The heat receiving member 401 may transfer heat with the heat source 20, so that the cooling medium is heated in the heat receiving member 401. The cooling medium in the heat receiving member 401 may change from a liquid state to a gaseous state and / or remain in a liquid state to flow into the heat dissipation pipe 403. The heat dissipation pipe 403 may transfer heat with the outside. The cooling medium can dissipate heat in the heat dissipation pipe 403, and the heat dissipation pipe 403 transfers the heat to the outside. The heat dissipation pipe 403 can introduce the cooling medium in a gaseous and / or liquid state into the liquid storage member 402. It can be understood that the cooling medium can also dissipate heat in the liquid storage member 402, and transfer the heat to the outside through the liquid storage member 402. In addition, the cooling medium can also dissipate heat in the capillary tube 404, and transfer the heat to the outside through the capillary tube 404.
[0038] The heat receiving element 401 can transfer heat with the heat source 20 to dissipate heat from the heat source 20. In some embodiments, the heat receiving element 401 can transfer heat with the heat source 20 in an indirect contact or non-contact manner to dissipate heat from the heat source 20. In some embodiments, the heat receiving element 401 can be in indirect contact with the heat source 20 through a heat conductive sheet, so that the heat conductive sheet conducts the heat generated by the heat source 20 to the heat receiving element 401. The heat conductive sheet can be in direct contact with the heat source 20. In some embodiments, the cooling medium can be heated and vaporized in the heat receiving element 401.
[0039] The liquid storage component 402 may be disposed at a location far away from the heat source 20 . In some embodiments, the liquid storage component 402 may be further away from the heat source 20 than the heated component 401 .
[0040] The liquid storage part 402 can store a cooling medium. The cooling medium in the liquid storage part 402 can be one or more of acetone, mercury, alcohol, kerosene and water. Of course, the cooling medium in the liquid storage part 402 can also be other. It can be understood that the cooling medium in the liquid storage part 402 can be heated from liquid to gas, or can be kept in liquid state, and then other types of cooling media that exist in the prior art and / or have been promoted and used can also be used, which will not be described in detail.
[0041] In some embodiments, the cooling medium may be pure water to ensure the pressure inside the heat dissipation component 400 without causing the heat dissipation component 400 to bulge.
[0042] The heat pipe 403 can transfer heat with the outside world to achieve heat dissipation. The heat pipe 403 can extend in a direction away from the heat source 20. In some embodiments, the height of the heat pipe 403 when in use can be the highest in the heat dissipation assembly 400 to achieve normal circulation of the cooling medium in the heat dissipation assembly 400. In some embodiments, the height of the heat pipe 403 when in use can be higher than the heat receiving part 401 and the liquid storage part 402 to achieve normal circulation of the cooling medium in the heat dissipation assembly 400. In some embodiments, the heat pipe 403 can guide the vaporized cooling medium or the liquid cooling medium in the heat receiving part 401 to the liquid storage part 402. In some embodiments, the heat pipe 403 transfers heat to the outside world for the vaporized cooling medium, so that the vaporized cooling medium is cooled to a liquid state and introduced into the liquid storage part 402. In some embodiments, there may also be a heat pipe 403 that guides the vaporized cooling medium into the liquid storage part 402, and the vaporized cooling medium is cooled to a liquid state in the liquid storage part 402.
[0043] The capillary tube 404 can be used to transfer the cooling medium, and when the cooling medium in the heated part 401 needs to be supplemented, the cooling medium in the liquid storage part 402 is introduced into the heated part 401. In some embodiments, the capillary tube 404 can introduce the liquid cooling medium in the liquid storage part 402 into the heated part 401. In some embodiments, the capillary tube 404 can extend into the heated part 401 so that part of the capillary tube 404 is placed inside the heated part 401, so as to facilitate better introduction of the cooling medium into the heated part 401.
[0044] See also Figure 4 , Figure 4 for Figure 3 The schematic diagram of the structure of the heat dissipation component 400 in other embodiments in the illustrated embodiment. The heat dissipation component 400 may also include a Tesla valve 405 disposed on the heat dissipation pipe 403, so that when the heat dissipation pipe 403 introduces the cooling medium into the liquid storage part 402, the cooling medium passes through the Tesla valve 405. The heat receiving part 401, the liquid storage part 402, the heat dissipation pipe 403, the capillary 404 and the Tesla valve 405 cooperate to form a heat dissipation loop. The Tesla valve 405 can inhibit the cooling medium in the liquid storage part 402 from flowing to the heat receiving part 401 through the heat dissipation pipe 403, and can make the cooling medium in the heat receiving part 401 smoothly pass through the heat dissipation pipe 403 and flow into the liquid storage part 402, so that the Tesla valve 405 acts as a one-way valve. In some embodiments, the Tesla valve 405 can be replaced by other types of one-way valves. Of course, the Tesla valve 405 can have the characteristics of simple structure compared with other types of one-way valves, and can also have the characteristics of increasing the contact area with the cooling medium and improving the heat dissipation effect.
[0045] In some embodiments, the Tesla valve 405 is located at one end of the heat dissipation pipe 403 connected to the liquid storage member 402, so that the heat dissipation pipe 403 is connected to the Tesla valve 405, and the Tesla valve 405 is connected to the liquid storage member 402. In some embodiments, the Tesla valve 405 is located in the middle of the heat dissipation pipe 403, so that a portion of the heat dissipation pipe 403 is connected to the liquid storage member 402 and the Tesla valve 405, and a portion is connected to the heated member 401 and the Tesla valve 405. In some embodiments, the Tesla valve 405 is located at one end of the heat dissipation pipe 403 connected to the heated member 401, so that the heat dissipation pipe 403 is connected to the Tesla valve 405, and the Tesla valve 405 is connected to the heated member 401.
[0046] See also Figure 1 and Figure 2 The frame 10 can be worn on the user's head and can be used to mount the external component 300. The frame 10 may include a frame 30 and a connecting component 40 connected to the frame 30. The frame 30 cooperates with the connecting component 40 to realize that the frame 10 is worn on the user's head. The heat source 20 and the heat dissipation component 40 in the above embodiment can be set on the frame 30 and / or the connecting component 40.
[0047] The frame 30 may be located in front of the user's eyes, and specifically may be worn on the user's nose bridge. The connecting assembly 40 may be set up between the user's ears and head, and then the frame 30 and the connecting assembly 40 may be worn on the user's head in cooperation. Of course, the frame 30 may not be worn on the bridge of the nose, but on the user's head, and the connecting assembly 40 may not be set up between the user's ears and head, but on the user's head. In some embodiments, the framework 10 may also be worn in other forms, for example, the frame 30 may also be connected with the connecting assembly 40 to form an annular structure or a semi-annular structure to be worn on the user's head, and then the framework 10 may be annular or semi-annular. It is understandable that the framework 10 may not be limited to the frame 30 and the connecting assembly 40, and it may also include other structures, which will not be repeated.
[0048] See also Figure 2 , a heat source 20 and a heat dissipation component 400 may be arranged on the frame 30. The frame 30 may include a first mounting frame 31 and a second mounting frame 32 which are arranged side by side and connected to each other. A nose pad portion 33 may be formed at the connection between the first mounting frame 31 and the second mounting frame 32. The nose pad portion 33 may be located on one side of the frame 30. The first mounting frame 31 may be arranged corresponding to the right eye of the user. The second mounting frame 32 may be arranged corresponding to the left eye of the user. The nose pad portion 33 may be arranged corresponding to the bridge of the user's nose, and then the frame 30 may be mounted on the bridge of the user's nose to achieve wearing.
[0049] It should be noted that the terms "first", "second", etc., herein and hereinafter, are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the said features.
[0050] The first installation frame 31 may be made of a hard material such as metal, rubber, plastic, etc. In some embodiments, the first installation frame 31 may be made of a heat-conducting solid metal.
[0051] The first installation frame 31 may be provided with an installation hole 3001 penetrating the first installation frame 31, so that the first installation frame 31 may be an annular structure, such as a rectangular annular structure, an irregular annular structure, a circular annular structure, an elliptical annular structure, etc. Of course, the installation hole 3001 may be provided in a different manner, so that the first installation frame 31 may be a semi-annular structure or other structures, which will not be described in detail.
[0052] In some embodiments, mounting hole 3001 may be arranged to correspond to the user's right eye.
[0053] The first installation frame 31 may be provided with a first connection portion 311 to be connected to the connection assembly 40. In some embodiments, the first connection portion 311 may be fixedly connected or rotatably connected to the connection assembly 40, and of course, may be connected in other ways.
[0054] In some embodiments, the first connection portion 311 may be disposed at a position of the first mounting frame 31 away from the second mounting frame 32. In some embodiments, the first connection portion 311 may be located at a side of the mounting hole 3001 away from the nose pad portion 33. That is, the mounting hole 3001 may be located between the first connection portion 311 and the nose pad portion 33.
[0055] The second mounting frame 32 may be made of a hard material such as metal, rubber, plastic, etc. In some embodiments, the second mounting frame 32 may be made of a heat-conducting solid metal.
[0056] The second installation frame 32 may be provided with a mounting hole 3002 that penetrates the second installation frame 32, so that the second installation frame 32 may be an annular structure, such as a rectangular annular structure, an irregular annular structure, a circular annular structure, an elliptical annular structure, etc. Of course, the mounting hole 3002 may be provided in a different manner, so that the second installation frame 32 may be a semi-annular structure or other structures, which will not be described in detail.
[0057] In some embodiments, mounting hole 3002 may be positioned corresponding to the user's left eye.
[0058] The second installation frame 32 may be provided with a second connection portion 321 to be connected to the connection assembly 40. In some embodiments, the second connection portion 321 may be fixedly connected or rotatably connected to the connection assembly 40, and of course, may also be connected in other ways.
[0059] In some embodiments, the second connection portion 321 may be disposed at a portion of the second mounting frame 32 away from the first mounting frame 31. In some embodiments, the second connection portion 321 may be located at a side of the mounting hole 3002 away from the nose pad portion 33. That is, the mounting hole 3002 may be located between the second connection portion 321 and the nose pad portion 33.
[0060] The nose pad 33 may directly contact the user's nose bridge, or may indirectly contact the user's nose bridge through the nose bracket, so as to achieve wearing on the user's head. Of course, in the case of structural changes in the frame 30, the nose pad 33 may not contact the user's nose bridge, but may simply be arranged corresponding to the user's nose bridge to make way for the user's nose bridge.
[0061] See also Figure 5 , Figure 5 for Figure 2 The heat source 20, the mirror frame 30 and the heat dissipation assembly 400 in the illustrated embodiment cooperate with each other in some embodiments. The heat dissipation assembly 400 can be arranged on the first mounting frame 31. The heat dissipation assembly 400, for example, a heat dissipation loop, can be arranged around the mounting hole 3001. The heat receiving member 401 can be arranged adjacent to the first connecting portion 311. The heat dissipation pipe 403 is arranged around the mounting hole 3001 and extends to a side close to the second mounting frame 32 to extend in a direction away from the heat receiving member 401. The liquid storage member 402 is arranged around the mounting hole 3001 and is arranged at a position away from the first connecting portion 311. The capillary 404 is arranged around the mounting hole 3001 and connected to the liquid storage member 402, and extends to a side close to the first connecting portion 311 to connect with the heat receiving member 401. The Tesla valve 405 is arranged on the heat dissipation pipe 403. Furthermore, the heat receiving member 401, the liquid storage member 402, the heat dissipation pipe 403, the capillary tube 404 and the Tesla valve 405 cooperate to form a heat dissipation loop, so as to be arranged around the mounting hole 3001. Of course, the Tesla valve 405 can be omitted.
[0062] In some embodiments, the liquid storage member 402 may be disposed on a portion of the first mounting frame 31 on the same side of the frame 30 as the nose pad portion 33. That is, the liquid storage member 402 and the nose pad portion 33 are located on the same side of the frame 30. In some embodiments, the heat dissipation pipe 403 is disposed on a portion of the first mounting frame 31 on opposite sides of the frame 30 as the nose pad portion 33. That is, the heat dissipation pipe 403 and the nose pad portion 33 are disposed on opposite sides of the frame 30. In some embodiments, the capillary tube 404 may be disposed on a portion of the first mounting frame 31 on the same side of the frame 30 as the nose pad portion 33. That is, the capillary tube 404 and the nose pad portion 33 are located on the same side of the frame 30. In some embodiments, the Tesla valve 405 is disposed adjacent to the nose pad portion 33.
[0063] In some embodiments, the heat dissipation pipe 403 and the capillary tube 404 are disposed around the mounting hole 3001 , so that the mounting hole 3001 is located between the heat dissipation pipe 403 and the capillary tube 404 .
[0064] Of course, the positions of the heat receiving element 401, the liquid storage element 402, the heat dissipation pipe 403, the capillary tube 404 and the Tesla valve 405 can be adjusted. Figure 5 In the embodiment, the heat receiving element 401, the heat dissipation pipe 403, the liquid storage element 402 and the capillary tube 404 can be arranged as follows: Figure 5 The heat receiving element 401, the heat dissipation pipe 403, the liquid storage element 402 and the capillary tube 404 can also be connected in a clockwise manner and surround the mounting hole 3001. Figure 5 The heat receiving element 401, the heat dissipating pipe 403, the liquid storage element 402 and the capillary tube 404 can be arranged on the same side of the mounting hole 3001.
[0065] When the user wears the eyeglass frame 30, the height of the heat dissipation pipe 403 in space can be higher than the height of the capillary tube 404, so that the heat dissipation assembly 400 can be used normally. Of course, in some embodiments, the highest part of the heat dissipation pipe 403 in space must be higher than the liquid storage part 402, so that the liquid cooling medium can flow into the liquid storage part 402 under the action of gravity.
[0066] It can be understood that the heat dissipation component 400 can also be extended to the second mounting frame 32. In some embodiments, the heat dissipation component 400, such as a heat dissipation loop, can be arranged around the mounting hole 3001 and the mounting hole 3002. In some embodiments, the heat dissipation component 400 can be arranged in coordination with the second connection part 321 and the nose pad part 33 in a manner of being arranged in coordination with the first connection part 311 and the nose pad part 33. For example, the heat dissipation component 400 can be arranged on the second mounting frame 32. The heat dissipation component 400, such as a heat dissipation loop, is arranged around the mounting hole 3002. The heat receiving part 401 can be arranged adjacent to the second connection part 321. The heat dissipation pipe 403 is arranged around the mounting hole 3002 and extends to a side close to the first mounting frame 31, so as to extend in a direction away from the heat receiving part 401. The liquid storage part 402 is arranged around the mounting hole 3002 and is arranged at a position away from the second connection part 321. The capillary tube 404 is disposed around the mounting hole 3002 and connected to the liquid storage member 402, extending to the side close to the second connection portion 321 to connect to the heat receiving member 401. The Tesla valve 405 is disposed on the heat dissipation pipe 403. Furthermore, the heat receiving member 401, the liquid storage member 402, the heat dissipation pipe 403, the capillary tube 404 and the Tesla valve 405 cooperate to form a heat dissipation loop to be disposed around the mounting hole 3002. Of course, the Tesla valve 405 can be omitted.
[0067] The connection component 40 is used to be worn on the user's head and can be connected with the frame 30 to form the frame 10. The connection component 40 can be provided with a heat source 20 and a heat dissipation component 400.
[0068] See also Figure 2 The connection component 40 may include a first leg 41 connected to the first installation frame 31, such as the first connection portion 311, and a second leg 42 connected to the second installation frame 32, such as the second connection portion 321, and arranged opposite to the first leg 41. The first leg 41 may be mounted on the right ear, and the second leg 42 may be mounted on the left ear, so as to realize the wearing of the connection component 40. Of course, the connection component 40 may also be arranged in other forms such as a ring structure, a semi-ring structure, etc.
[0069] The first leg 41 is made of a hard material such as metal, rubber, plastic, etc., and can also be made of the same material as the frame 30. In some embodiments, the first leg 41 can be made of a heat-conducting solid metal.
[0070] The first leg 41 can be fixedly connected to the first mounting frame 31, such as the first connecting portion 311, by screwing, welding, clamping or bonding, and in some embodiments, the first connecting portion 311 can also be a part of the first leg 41. In some embodiments, the first leg 41 can also be rotatably connected to the first mounting frame 31, such as the first connecting portion 311. When the first leg 41 and the first mounting frame 31, such as the first connecting portion 311, rotate relative to each other, the end of the first leg 41 away from the first connecting portion 311 moves toward the side of the second leg 42, so that the wearing component 200 can be folded and stored, thereby reducing the occupied space of the wearing component 200. When the first leg 41 and the first mounting frame 31, such as the first connecting portion 311, rotate relative to each other, the end of the first leg 41 away from the first connecting portion 311 moves toward the side away from the second leg 42, thereby unfolding the wearing component 200.
[0071] The second leg 42 is made of a hard material such as metal, rubber, plastic, etc., and can also be made of the same material as the frame 30. In some embodiments, the first leg 41 can be made of a heat-conducting solid metal.
[0072] The second leg 42 can be fixedly connected to the second mounting frame 32, such as the second connecting portion 321, by screwing, welding, clamping or bonding, and in some embodiments, the second connecting portion 321 can also be a part of the second leg 42. In some embodiments, the second leg 42 can also be rotatably connected to the second mounting frame 32, such as the second connecting portion 321. When the second leg 42 and the second mounting frame 32, such as the second connecting portion 321, rotate relative to each other, the end of the second leg 42 away from the second connecting portion 321 moves toward the side of the first leg 41, so that the wearing assembly 200 can be folded and stored, thereby reducing the occupied space of the wearing assembly 200. When the second leg 42 and the second mounting frame 32, such as the second connecting portion 321, rotate relative to each other, the end of the second leg 42 away from the second connecting portion 321 moves toward the side away from the first leg 41, thereby unfolding the wearing assembly 200.
[0073] In some embodiments, a heat source 20 and a heat dissipation assembly 400 may be disposed on the first leg 41 and / or the second leg 42 .
[0074] See also Figure 6 , Figure 6 for Figure 5A schematic cross-sectional view of the heat source 20, the frame 30 and the heat dissipation assembly 400 at line VI-VI in the embodiment shown. The heat source 20 may include a lens module 21 and an optical-mechanical assembly 22 mounted on the frame 30. The lens module 21 may be used to receive light emitted by the optical-mechanical assembly 22 and transmit the light to the user's eyes to achieve augmented reality or virtual reality. It is understandable that when the lens module 21 is only used to transmit light and does not generate heat during operation, it may not be a part of the heat source 20.
[0075] The lens module 21 can be arranged corresponding to the user's eyes to achieve certain optical functions such as light transmission, vision correction, virtual reality or augmented reality, etc.
[0076] The lens module 21 can be made of transparent or translucent materials such as glass and / or plastic. The lens module 21 can also be made of one or more materials such as transparent materials, translucent materials, opaque materials, etc. for a certain light transmission effect.
[0077] In one embodiment, the lens module 21 may include an optical waveguide, specifically a planar grating waveguide such as a diffraction grating waveguide. The head mounted device 100 may present a virtual reality / augmented reality environment through the lens module 21 such as an optical waveguide.
[0078] Of course, the lens module 21 may be other when not matched with the optical-mechanical assembly 22 .
[0079] For example, the lens module 21 may include a vision correction lens made of one or more lenses such as convex lenses or concave lenses. Of course, other types of lenses or functional lenses (such as flat lenses, anti-glare lenses, colored lenses, etc.) or functional films (such as anti-reflection films, polarizing films, filter films, etc.) may also be provided in the vision correction lens. In one embodiment, the lens module 21 may include a myopia lens.
[0080] For example, the lens module 21 may also include other functional lenses such as flat lenses, anti-glare lenses, colored lenses, etc.
[0081] For example, the lens module 21 may also include a photochromic device. For example, the photochromic device may be made of a photochromic material so that the photochromic device can change color after being excited by light of a certain wavelength. The photochromic material may be made using existing technical solutions in the prior art within the scope of understanding of those skilled in the art, and will not be described in detail.
[0082] For example, the lens module 21 may also include an electrochromic device. For example, the electrochromic device may be made of an electrochromic material. The electrochromic material may be one of an inorganic electrochromic material and an organic electrochromic material. The inorganic electrochromic material may be tungsten trioxide. The organic electrochromic material may be one of polythiophenes and their derivatives, viologens, tetrathiafulvalene, metal phthalocyanine compounds, and the like. Of course, the electrochromic material may be made using existing technical solutions in the prior art within the scope of understanding of those skilled in the art, and will not be elaborated on. In some embodiments, the electrochromic device may be electrically connected to a host inside the head-mounted device 100 to achieve control of the electrochromic device.
[0083] It can be understood that the lens module 21 can also be a structure formed by combining any of the above embodiments, which will not be described in detail.
[0084] The lens module 21 can be mounted on the lens frame 30, such as the first mounting frame 31. The lens module 21 can be arranged corresponding to the mounting hole 3001, so that the lens module 21 is arranged corresponding to the user's right eye to match the user's eye.
[0085] In some embodiments, the lens module 21 can be installed at the mounting hole 3001 .
[0086] In order to install the lens module 21 on the lens frame 30, the lens frame 30 may be structurally set and adjusted. The lens frame 30 may include a first shell 34 and a second shell 35 connected to the first shell 34. The first shell 34 and the second shell 35 are connected to clamp and fix the lens module 21.
[0087] The first housing 34 may include a first assembly frame 341 and a second assembly frame 342 that are arranged side by side and connected to each other. The connection between the first assembly frame 341 and the second assembly frame 342 may form a nose pad 33. In some embodiments, the first assembly frame 341 may be provided with an assembly hole 3411 that passes through the first assembly frame 341. In some embodiments, the second assembly frame 342 may be provided with an assembly hole 3421 that passes through the second assembly frame 342.
[0088] The second housing 35 may be located on one side of the first housing 34 and may be connected to the first housing 34. In some embodiments, the second housing 35 may be fixed to the first housing 34 by snapping, screwing, welding or bonding. In some embodiments, the second housing 35 is located on a side of the first housing 34 facing the connection assembly 40.
[0089] The second housing 35 may include a first configuration frame 351 and a second configuration frame 352 that are arranged side by side and connected to each other. The connection between the first configuration frame 351 and the second configuration frame 352 may form a nose pad portion 33 .
[0090] In some embodiments, the first configuration frame 351 may be provided with a configuration hole 3511 that passes through the first configuration frame 351. In some embodiments, the first configuration frame 351 may be connected with the first assembly frame 341 to form the first installation frame 31, and the assembly hole 3411 and the configuration hole 3511 may be arranged opposite to each other and connected to form the installation hole 3001.
[0091] In some embodiments, the first configuration frame 351 can be connected to the first assembly frame 341 to clamp and fix the lens module 21 .
[0092] The second housing 35 can be connected to the connecting assembly 40. In some embodiments, the first connection portion 311 can be provided on a side of the first configuration frame 351 away from the first housing 34, such as the first assembly frame 341. In some embodiments, an installation space 3110 can be provided in the first connection portion 311 to accommodate the optical-mechanical assembly 22.
[0093] In some embodiments, the second configuration frame 352 may be provided with a configuration hole 3521 that penetrates the second configuration frame 352. In some embodiments, the second configuration frame 352 may be connected to the second assembly frame 342 to form the second installation frame 32, and the assembly hole 3421 may be arranged opposite to and connected to the configuration hole 3521 to form the installation hole 3002. In some embodiments, the second configuration frame 352 may be connected to the second assembly frame 342, and may also be provided to clamp and fix the lens module 21, so that the second installation frame 32 may also be installed with the lens module 21.
[0094] The second housing 35 may be connected to the connection assembly 40. In some embodiments, a second connection portion 321 may be provided on a side of the second configuration frame 352 away from the first housing 34, such as the second assembly frame 342. In some embodiments, an installation space 3210 may be provided in the second connection portion 321.
[0095] It can be understood that the first connection portion 311 and the second connection portion 321 may also be disposed on the first shell 34 instead of being disposed on the second shell 35 .
[0096] See also Figure 6 , the lens module 21 can be clamped and fixed between the first assembly frame 341 and the first configuration frame 351 to realize the installation of the lens module 21 on the first installation frame 31. Of course, the lens module 21 can also be matched with the first installation frame 31 in other ways to realize the installation on the first installation frame 31. It can be understood that when the lens module 21 needs to be installed on the second installation frame 32, the lens module 21 can also be matched with the second installation frame 32 in the way of matching with the first installation frame 31 to realize the installation on the second installation frame 32.
[0097] See also Figure 6, the optical-mechanical assembly 22 can be installed in the first connecting portion 311, such as the installation space 3110, and cooperate with the lens module 21. Of course, the optical-mechanical assembly 22 can also be installed at other positions of the frame 10 as needed. It can be understood that when the optical-mechanical assembly 22 needs to be installed on the second installation frame 32, the optical-mechanical assembly 22 can also cooperate with the second installation frame 32 in the same manner as the first installation frame 31 to achieve installation on the second installation frame 32. Of course, the optical-mechanical assembly 22 can also be installed on the frame 10 in other ways to cooperate with the lens module 21 installed on the second installation frame 32.
[0098] In some embodiments, a heat dissipation assembly 400 may be disposed on the first housing 34. A heat conductive sheet 3412 is disposed on the first housing 34. The heat conductive sheet 3412 may be respectively connected to the heat dissipation assembly 400, such as the heat receiving element 401, and the heat source 20, such as the optical-mechanical assembly 22, to introduce the heat generated by the heat source 20, such as the optical-mechanical assembly 22, into the heat dissipation assembly 400, such as the heat receiving element 401, and dissipate the heat of the heat source 20, such as the optical-mechanical assembly 22, through the heat dissipation assembly 400, such as the heat receiving element 401. Of course, the heat conductive sheet 3412 may also be omitted.
[0099] In some embodiments, the heat dissipation component 400 , such as a heat dissipation loop, is disposed around the lens module 21 , such as an optical waveguide.
[0100] See also Figure 7 and Figure 8 , Figure 7 for Figure 6 The schematic diagram of the structure of the first housing 34 in some embodiments shown in the embodiment is as follows, Figure 8 for Figure 7 Partial exploded view of the first housing 34 in the illustrated embodiment. The first housing 34 may include a lens frame body 361 having a mounting surface 3611 and a heat conducting sheet 362 disposed on the lens frame body 361, such as the mounting surface 3611. The lens frame body 361 may cooperate with the heat conducting sheet 362 to form a heat dissipation assembly 400.
[0101] The frame body 361 can be made of heat-conducting solid metal to achieve the heat dissipation function of the heat dissipation component 400. In some embodiments, the frame body 361 can be made of magnesium alloy, stainless steel or titanium alloy, and of course, can also be other materials.
[0102] In some embodiments, a surface of the lens frame body 361 facing the second shell 35 may be a mounting surface 3611 .
[0103] See also Figure 8 , a heat receiving groove 363 may be provided on the assembly surface 3611. In some embodiments, the heat receiving groove 363 may be formed by die casting on the first shell 34, and of course, may also be formed by other methods.
[0104] See also Fig. 9 , Fig.10 and Fig.11 , Fig. 9 for Figure 8 The schematic diagram of the structure of the heat receiving tank 363 in the embodiment shown, Fig.10 for Fig. 9 A cross-sectional view of the frame body 361 at the heat receiving groove 363 in the embodiment shown, Fig.11 for Fig. 9 Another cross-sectional view of the frame body 361 at the heated groove 363 in the illustrated embodiment. The heated groove 363 may have a groove bottom 3631, a notch 3632 and a groove wall 3633. In some embodiments, in the heated groove 363, the distance from the groove bottom 3631 to the notch 3632 is greater than 0.15 mm and less than 1 mm. In some embodiments, a support column 3634 is provided on the groove bottom 3631 of the heated groove 363 to support the heat conducting sheet 362. In some embodiments, there may be a plurality of support columns 3634. In some embodiments, a plurality of support columns 3634 may be distributed in the heated groove 363. In some embodiments, a heat conducting layer 3635 may be provided on the groove bottom 3631 and / or the groove wall 3633 of the heated groove 363 to enhance heat dissipation performance. In some embodiments, a heat conducting layer 3635 is also provided on the support column 3634 to enhance heat dissipation performance.
[0105] In some embodiments, the thickness of the thermal conductive layer 3635 is 100 nm-500 nm.
[0106] See also Figure 8 , a liquid reservoir 364 may be provided on the assembly surface 3611. In some embodiments, the liquid reservoir 364 may be formed by die casting on the first housing 34, and may also be formed by other methods.
[0107] See also Fig.12 , Fig.12 for Figure 8 A cross-sectional view of the lens frame body 361 at the liquid reservoir 364 in the illustrated embodiment. The liquid reservoir 364 has a bottom 3641, a notch 3642, and a wall 3643. In some embodiments, in the liquid reservoir 364, the distance from the bottom 3631 to the notch 3632 is greater than 50 μm and less than 500 μm. In some embodiments, in a cross section perpendicular to the extension direction of the liquid reservoir 364, the distance L11 from the bottom 3631 to the notch 3632 is greater than 50 μm and less than 500 μm.
[0108] In some embodiments, in a cross section perpendicular to the extension direction of the liquid storage tank 364 , a distance L12 between two tank walls 3643 is greater than 0.5 mm and less than 4 mm.
[0109] In some embodiments, a heat-conducting layer 3635 is disposed on the bottom 3641 and / or the wall 3643 of the liquid storage tank 364 to enhance heat dissipation performance.
[0110] See also Figure 8 , a heat dissipation groove 365 may be provided on the assembly surface 3611. In some embodiments, the heat dissipation groove 365 may be connected to the heat receiving groove 363 and the liquid storage groove 364 respectively, so that the heat receiving groove 363 is connected to the liquid storage groove 364 through the heat dissipation groove 365. In some embodiments, the heat dissipation groove 365 may be formed by die casting on the first housing 34, and of course, it may also be formed by other methods.
[0111] See also Fig.13 , Fig.13 for Figure 8 A cross-sectional view of the frame body 361 at the heat dissipation slot 365 in the illustrated embodiment. The heat dissipation slot 365 has a slot bottom 3651, a slot opening 3652, and a slot wall 3653. In some embodiments, in the heat dissipation slot 365, the distance from the slot bottom 3651 to the slot opening 3652 is greater than 0.15 mm and less than 1 mm. In some embodiments, in a cross section perpendicular to the extension direction of the heat dissipation slot 365, the distance L21 from the slot bottom 3651 to the slot opening 3652 is greater than 0.15 mm and less than 1 mm.
[0112] In some embodiments, in a cross section perpendicular to the extension direction of the heat dissipation slot 365 , a distance L22 between two slot walls 3653 is greater than 0.5 mm and less than 2 mm.
[0113] In some embodiments, a heat conducting layer 3635 is disposed on the groove bottom 3651 and / or the groove wall 3653 of the heat dissipation groove 365 to enhance the heat dissipation performance.
[0114] See also Figure 8 , a capillary groove 366 may be provided on the assembly surface 3611. In some embodiments, the capillary groove 366 may be communicated with the heat receiving groove 363 and the liquid storage groove 364 respectively, so that the heat receiving groove 363 is communicated with the liquid storage groove 364 through the capillary groove 366. In some embodiments, the capillary groove 366 may be formed by die casting on the first housing 34, and of course, it may also be formed by other methods.
[0115] See also Fig.14 , Fig.14 for Figure 8A cross-sectional view of the lens frame body 361 at the capillary groove 366 in the illustrated embodiment. The capillary groove 366 has a groove bottom 3661, a notch 36562, and a groove wall 3663. In some embodiments, in the capillary groove 366, the distance from the groove bottom 3661 to the notch 3662 is greater than 50 μm and less than 500 μm. In some embodiments, in a cross section perpendicular to the extension direction of the capillary groove 366, the distance L31 from the groove bottom 3661 to the notch 3662 is greater than 50 μm and less than 500 μm.
[0116] In some embodiments, in a cross section perpendicular to the extending direction of the capillary groove 366 , a distance L32 between two groove walls 3663 is greater than 50 μm and less than 500 μm.
[0117] In some embodiments, a heat conductive layer 3635 is disposed on the groove bottom 3661 and / or the groove wall 3663 of the capillary groove 366 to enhance the heat dissipation performance.
[0118] See also Fig. 9 , Fig.10 and Fig.11 , the capillary groove 366 may extend in the heated groove 363 so that the cooling medium can be introduced into the heated groove 363. In some embodiments, the capillary groove 366 in the heated groove 363 may be arranged on the groove bottom 3631. In some embodiments, the capillary groove 366 in the heated groove 363 may be arranged around the support column 3634. In some embodiments, the capillary grooves 366 in the heated groove 363 may be interconnected. To ensure that the amount of cooling medium stored on the entire surface of the groove bottom 3631. Of course, the capillary groove 366 in the heated groove 363 may also be arranged on the groove wall 3633.
[0119] See also Figure 8 , a control groove 367 may be provided on the assembly surface 3611. In some embodiments, the control groove 367 may be formed by die casting on the first housing 34, or may be formed by other methods. In some embodiments, a heat conductive layer 3635 may also be provided on the groove bottom and / or groove wall of the capillary groove 366 to enhance heat dissipation performance.
[0120] In some embodiments, the control slot 367 may be disposed on the heat dissipation slot 365. In some embodiments, the control slot 367 is located at one end of the heat dissipation slot 365 connected to the liquid storage tank 364, so that the heat dissipation slot 365 is connected to the control slot 367, and the control slot 367 is connected to the liquid storage tank 364. In some embodiments, the control slot 367 is located in the middle of the heat dissipation slot 365, so that a portion of the heat dissipation slot 365 is connected to the liquid storage tank 364 and the control slot 367, and a portion is connected to the heat receiving slot 363 and the control slot 367. In some embodiments, the control slot 367 is located at one end of the heat dissipation slot 365 connected to the heat receiving slot 363, so that the heat dissipation slot 365 is connected to the control slot 367, and the control slot 367 is connected to the heat receiving slot 363.
[0121] In some embodiments, the heat conductive layer 3635 can be formed on the mirror frame body 361 by electroplating. In some embodiments, the heat conductive layer 3635 can be a solid metal that can conduct heat. In some embodiments, the heat conductive layer 3635 has a better heat conductive property than the mirror frame body 361. In some embodiments, the heat conductive layer 3635 can be copper, and of course it can also be other materials.
[0122] See also Figure 8 , the heat conductive sheet 362 can block the heat receiving groove 363, so that the heat conductive sheet 362 cooperates with the part of the frame body 361 where the heat receiving groove 363 is set to form the heat receiving part 401. In some embodiments, the heat conductive sheet 362 is set at the notch 3632 of the heat receiving groove 363. In some embodiments, the outer surface of the heat conductive sheet 362 is flush with the assembly surface 3611 of the part of the frame body 361 where the heat receiving groove 363 is set. In some embodiments, the heat conductive sheet 362 abuts against the support column 3634 at the heat receiving groove 363. In some embodiments, the heat conductive sheet 362 can be connected and / or abutted with the heat conductive layer 3635 in the heat receiving groove 363 to enhance the heat dissipation effect. In some embodiments, the heat conductive sheet 362 can be connected and cooperated with the heat conductive layer 3635 in the heat receiving groove 363 to form the heat receiving part 401, so that the heat receiving part 401 is accommodated in the heat receiving groove 363.
[0123] See also Figure 8 , the heat conductive sheet 362 can block the liquid reservoir 364 so that the heat conductive sheet 362 cooperates with the portion of the frame body 361 where the liquid reservoir 364 is provided to form a liquid storage member 402. In some embodiments, the heat conductive sheet 362 is provided at the notch 3642 of the liquid reservoir 364. In some embodiments, the outer surface of the heat conductive sheet 362 is flush with the assembly surface 3611 of the portion of the frame body 361 where the liquid reservoir 364 is provided. In some embodiments, the heat conductive sheet 362 can be connected and / or abutted with the heat conductive layer 3635 in the liquid reservoir 364 to enhance the heat dissipation effect. In some embodiments, the heat conductive sheet 362 can be connected and cooperated with the heat conductive layer 3635 in the liquid reservoir 364 to form a liquid storage member 402 so that the liquid storage member 402 is accommodated in the liquid reservoir 364.
[0124] See also Figure 8, the heat conductive sheet 362 can block the heat dissipation slot 365, so that the heat conductive sheet 362 cooperates with the part of the frame body 361 where the heat dissipation slot 365 is set to form a heat dissipation pipe 403. In some embodiments, the heat conductive sheet 362 is set at the notch 3652 of the heat dissipation slot 365. In some embodiments, the outer surface of the heat conductive sheet 362 is flush with the assembly surface 3611 of the part of the frame body 361 where the heat dissipation slot 365 is set. In some embodiments, the heat conductive sheet 362 can be connected and / or abutted with the heat conductive layer 3635 in the heat dissipation slot 365 to enhance the heat dissipation effect. In some embodiments, the heat conductive sheet 362 can be connected and cooperated with the heat conductive layer 3635 in the heat dissipation slot 365 to form a heat dissipation pipe 403, so that the heat dissipation pipe 403 is accommodated in the heat dissipation slot 365.
[0125] See also Figure 8 , the heat conductive sheet 362 can block the capillary groove 366 so that the heat conductive sheet 362 cooperates with the part of the frame body 361 where the capillary groove 366 is set to form a capillary 404. In some embodiments, the heat conductive sheet 362 is set at the notch 3662 of the capillary groove 366. In some embodiments, the outer surface of the heat conductive sheet 362 is flush with the assembly surface 3611 of the part of the frame body 361 where the capillary groove 366 is set. In some embodiments, the heat conductive sheet 362 can be connected and / or abutted with the heat conductive layer 3635 in the capillary groove 366 to enhance the heat dissipation effect. In some embodiments, the heat conductive sheet 362 can be connected and cooperated with the heat conductive layer 3635 in the capillary groove 366 to form a capillary 404, so that the capillary 404 is accommodated in the capillary groove 366.
[0126] See also Figure 8 , the heat conductive sheet 362 can block the control groove 367 so that the heat conductive sheet 362 cooperates with the portion of the frame body 361 where the control groove 367 is set to form a Tesla valve 405. In some embodiments, the heat conductive sheet 362 is set at the notch of the control groove 367. In some embodiments, the outer surface of the heat conductive sheet 362 is flush with the assembly surface 3611 of the portion of the frame body 361 where the control groove 367 is set. In some embodiments, the heat conductive sheet 362 can be connected and / or abutted with the heat conductive layer 3635 in the control groove 367 to enhance the heat dissipation effect. In some embodiments, the heat conductive sheet 362 can be connected and cooperated with the heat conductive layer 3635 in the control groove 367 to form a Tesla valve 405, so that the Tesla valve 405 is accommodated in the control groove 367.
[0127] The heat conductive sheet 362 can be made of a heat-conducting solid metal. In some embodiments, the heat conductive sheet 362 has a better heat conductive property than the heat conductive layer 3635. In some embodiments, the heat conductive sheet 362 can be copper or other materials. In some embodiments, the heat conductive sheet 362 has a better heat conductive property than the frame body 361. In some embodiments, the heat conductive sheet 362 can be connected to the heat conductive sheet 3412 to achieve heat transfer through the contact between the heat conductive sheet 3412 and the heat source 20, such as the optical machine component 22. In some embodiments, the heat conductive sheet 3412 can be a part of the heat conductive sheet 362. In some embodiments, the heat conductive sheet 3412 can be omitted.
[0128] It can be understood that the assembly surface 3611 can also be arranged on the side of the lens frame body 361 away from the second shell 35. In some embodiments, the assembly surface 3611 can also be a surface on the lens frame body 361 located at the assembly hole 3411. Of course, in some embodiments, the lens frame body 361 can be an integral structure with the second shell 35, and then the second shell 35 can also be a part of the lens frame body 361. Then in some embodiments, the lens frame 30 can be referred to as the lens frame body 361. And the assembly surface 3611 is arranged on the lens frame 30. In some embodiments, the heat dissipation assembly 400 formed by the heat conductive sheet 362 and the heat conductive layer 3635 can be arranged inside the lens frame 30. In some embodiments, the assembly surface 3611 can also be arranged on the connecting assembly 40, and the corresponding heat dissipation assembly 400 is also arranged on the connecting assembly 40 in the same manner as on the lens frame body 361. In some embodiments, the assembly surface 3611 can also be arranged on the second shell 35, and the corresponding heat dissipation assembly 400 is also arranged on the second shell 35 in the same manner as on the lens frame body 361. In some embodiments, the heat dissipation component 400 formed by the heat conductive sheet 362 and the heat conductive layer 3635 may also be disposed inside the connection component 40 .
[0129] See also Figure 1 and Figure 2 The external hang-on component 400 may include an external hang-on body 50 mounted on the frame 10, such as the connecting component 40, and an optical system 60 installed on the external hang-on body 50 corresponding to the user's glasses setting.
[0130] The external hanging body 50 may include a mirror frame 70 and an external hanging shell 80 connected to the mirror frame 70. The mirror frame 70 and the external hanging shell 80 cooperate to install the heat source 60.
[0131] The lens frame 70 can be arranged in the same manner as the first mounting frame 31. The lens frame 70 can be arranged in a stacked manner with the first mounting frame 31, so that the lens frame 70 can also be arranged corresponding to the right eye of the user. Of course, when the lens frame 70 is arranged corresponding to the left eye of the user, the lens frame 70 can be arranged in the same manner as the second mounting frame 32. The lens frame 70 can be arranged in a stacked manner with the second mounting frame 32.
[0132] The external shell 80 can be mounted on the connection component 40, such as the first leg 41. Furthermore, the configuration of the external shell 80 can be the same as the configuration of the first leg 41. Of course, the configuration of the external shell 80 can be the same as the configuration of the connection component 40, such as the second leg 42. Furthermore, the external shell 80 can be mounted on the connection component 40, such as the second leg 42, which will not be described in detail.
[0133] Specifically, the matching setting relationship between the external shell 80 and the mirror frame 70 can adopt the matching setting mode of the first installation frame 31 and the connecting component 40 such as the first leg 41, or can adopt the matching setting mode of the second installation frame 32 and the connecting component 40 such as the second leg 42, which will not be elaborated.
[0134] The heat source 60 can be arranged in the same manner as the heat source 20. Specifically, the arrangement relationship between the heat source 60 and the external body 50 can adopt the arrangement relationship between the heat source 20 and the frame 10, which will not be described in detail.
[0135] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A head mounted device, characterized in that: The head mounted device comprises a heat source and a heat dissipation component, wherein the heat dissipation component comprises: A liquid storage part, used for storing cooling medium; A heat receiving member is disposed adjacent to the heat source; a capillary tube, connecting the liquid storage element and the heat receiving element, and used for introducing the cooling medium in the liquid storage element into the heat receiving element; and A heat dissipation pipe connects the liquid storage component and the heat receiving component.
2. The head mounted device according to claim 1, wherein: Part of the capillary tube is placed inside the heat receiving element.
3. The head mounted device according to any one of claims 1 to 2, characterized in that: The cooling medium is configured to be heated and vaporized in the heat receiving member, and the heat dissipation pipe is used to guide the vaporized cooling medium in the heat receiving member to the liquid storage member.
4. The head mounted device according to claim 1, wherein: The heat dissipation component also includes: A Tesla valve is arranged on the heat dissipation pipe, and is used to inhibit the cooling medium in the liquid storage component from flowing to the heat receiving component through the heat dissipation pipe.
5. The head mounted device according to any one of claims 1 to 2 and 4, characterized in that: The heat source includes an optomechanical component, and the head-mounted device also includes an optical waveguide, which is used to receive light emitted by the optomechanical component.
6. The head mounted device according to claim 5, characterized in that: The liquid storage component, the heat receiving component, the capillary tube and the heat dissipation pipe cooperate to form a heat dissipation loop, and the heat dissipation loop is arranged around the optical waveguide.
7. The head mounted device according to any one of claims 1 to 2, characterized in that: The head mounted device comprises: Frames; and The connecting component is connected with the mirror frame to form a frame, the heat source is arranged on the frame, and the heat dissipation component is arranged on the mirror frame.
8. The head mounted device according to claim 7, wherein: The mirror frame comprises: The frame body has an assembly surface, on which a liquid storage tank, a heat receiving tank, a capillary tank, and a heat dissipation tank are arranged; A heat conductive sheet, wherein the heat conductive sheet is arranged at the notch of the liquid storage tank to cooperate with the portion of the frame body where the liquid storage tank is arranged to form the liquid storage part, the heat conductive sheet is arranged at the notch of the heat receiving groove to cooperate with the portion of the frame body where the heat receiving groove is arranged to form the heat receiving part, the heat conductive sheet is arranged at the notch of the capillary groove to cooperate with the portion of the frame body where the capillary groove is arranged to form the capillary tube, and the heat conductive sheet is arranged at the notch of the heat dissipation groove to cooperate with the portion of the frame body where the heat dissipation groove is arranged to form the heat dissipation tube.
9. The head mounted device according to claim 8, wherein: A heat-conducting layer is provided on the bottom and / or the wall of each of the four grooves of the liquid storage groove, the heat receiving groove, the capillary groove and the heat dissipation groove, and the heat-conducting layer is connected to the heat-conducting sheet.
10. The head mounted device according to claim 8, wherein: The heat dissipation component also includes: A Tesla valve is arranged on the heat dissipation pipe, and is used to inhibit the cooling medium in the liquid storage component from flowing to the heat receiving component through the heat dissipation pipe.
11. The head mounted device according to claim 10, wherein: A control groove is arranged on the assembly surface, and the heat conducting sheet is arranged at the notch of the control groove to cooperate with the part of the frame body where the control groove is arranged to form the Tesla valve.
12. The head mounted device according to claim 11, wherein: A heat-conducting layer is arranged on the groove bottom and / or groove wall of the control groove, and the heat-conducting layer is connected to the heat-conducting sheet.
13. The head mounted device according to claim 8, wherein: Part of the capillary groove is extended and arranged on the groove bottom of the heating groove.
14. The head mounted device according to claim 8, wherein: A support column is arranged on the bottom of the heat receiving tank, and the support column is in contact with or connected to the heat conducting sheet.
15. The head mounted device according to claim 8, wherein: The heat conducting sheet abuts against or is connected to the heat source.
16. The head mounted device according to claim 8, wherein: On a cross section perpendicular to the extension direction of the heat dissipation slot, the distance from the slot bottom to the slot opening is greater than 0.15 mm and less than 1 mm, and the distance between two slot walls is greater than 0.5 mm and less than 2 mm.
17. The head mounted device according to claim 8, wherein: On a cross section perpendicular to the extending direction of the capillary groove, the distance from the bottom of the capillary groove to the groove opening is greater than 50 μm and less than 500 μm, and the distance between two groove walls is greater than 50 μm and less than 500 μm.
18. The head mounted device according to claim 8, wherein: On a cross section perpendicular to the extension direction of the liquid storage tank, the distance from the bottom of the liquid storage tank to the slot opening is greater than 50 μm and less than 500 μm, and the distance between the two slot walls is greater than 0.5 mm and less than 4 mm.
19. The head mounted device according to claim 8, wherein: The distance from the bottom of the heating groove to the groove opening is greater than 0.15 mm and less than 1 mm.
20. The head mounted device according to claim 7, wherein: The mirror frame is provided with a first connecting part and a second connecting part, the heat source is arranged on the first connecting part, and the connecting component is connected to the first connecting part and the second connecting part respectively.
21. The head mounted device according to claim 20, wherein: The mirror frame comprises: The first mounting frame and the second mounting frame are arranged side by side and connected to form a nose pad portion at the connection between the first mounting frame and the second mounting frame, the first connecting portion is arranged on a side of the first mounting frame away from the nose pad portion, and the second connecting portion is arranged on a side of the second mounting frame away from the nose pad portion.
22. The head mounted device according to claim 21, wherein: The first mounting frame is provided with a mounting hole between the first connecting portion and the nose pad portion. The liquid storage component, the heat receiving component, the capillary tube and the heat dissipation tube cooperate to form a heat dissipation loop, and the heat dissipation loop is arranged around the mounting hole.
23. The head mounted device according to claim 22, wherein: The heat receiving part is arranged adjacent to the first connecting part, the liquid storage part is arranged on a part of the first mounting frame which is located on the same side of the frame as the nose pad part, and the heat dissipation pipe is arranged on a part of the first mounting frame which is arranged on opposite sides of the frame as the nose pad part.
24. A head mounted device, characterized in that: include: Wearing components; The external component is mounted on the wearable component, and the external component includes a heat source and a heat dissipation component, and the heat dissipation component includes: A liquid storage part, used for storing cooling medium; A heat receiving member is disposed adjacent to the heat source; a capillary tube, connecting the liquid storage element and the heat receiving element, and used for introducing the cooling medium in the liquid storage element into the heat receiving element; and A heat dissipation pipe connects the liquid storage component and the heat receiving component.