LED device

Abstract

The invention relates to a double-color-temperature LED device which comprises a support bowl cup with an open containing cavity, a light-emitting chip assembly, a bonding pad assembly and a crossed bonding wire structure. The light-emitting chip assembly and the bonding pad assembly are arranged in the containing cavity. The crossed bonding wire structure is formed by arranging a first bonding wire and a second bonding wire in a crossed mode. The light-emitting chip assembly is electrically connected with the bonding pad assembly through the first bonding wire, the number of the light-emitting chips is at least two, and the light-emitting chips are electrically connected through the second bonding wire; in the crossed bonding wire structure, the second bonding wire is located above the first bonding wire and does not make contact with the first bonding wire, the highest point of the second bonding wire is provided with a horizontal section which is horizontally arranged, and the orthographic projection of the horizontal section on the horizontal plane and the orthographic projection of the first bonding wire on the horizontal plane intersect at one point. According to the LED device disclosed by the invention, under the condition that the thickness of the device is not increased, short circuit caused by easy contact between the two bonding wires at the staggered position is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to an LED device. Background Art

[0002] In order to increase the brightness of LED lamps and improve the light effect, existing LED devices will simultaneously set up multiple light-emitting chips in a bracket bowl. The light-emitting chips and the pads of the bracket bowl are usually electrically connected by welding wires. The more chips there are, the more welding wires there are. As the number of welding wires increases, it is inevitable that two welding wires will be staggered in space to form a cross welding wire structure (such as Figure 1 However, the two cross-wires are easily touched and cause a short circuit, resulting in poor reliability of the LED device. Figure 1 As shown, in the cross-wire structure, the low wire 1 and the high wire 2 are both arc-shaped wires, wherein the high wire 2 has a protruding portion 2a protruding upward near its starting end, and the protruding portion 2a is in the shape of a circular arc to support the structure of the high wire 1. However, in order to ensure that the encapsulation glue can completely cover the protruding portion 2 of the high wire 2 during encapsulation and to prevent the protruding portion 2a of the high wire 2 from leaking out of the encapsulation glue after the device is encapsulated, the height of the bracket bowl needs to be increased, but this will increase the thickness of the LED device, which is not conducive to the miniaturization of the device. In addition, since the raised portion 2a of the high welding wire 2 is close to its starting end, the position where the high welding wire 2 intersects with the low welding wire 1 tends to tilt downward. Therefore, in order to avoid the high welding wire 2 and ensure that the high welding wire 2 and the low welding wire 1 do not touch each other, a downwardly recessed recessed portion 1a is required to be provided at the position where the low welding wire 1 intersects with the high welding wire 2, so as to increase the distance between the low welding wire 1 and the high welding wire 2 in the height direction, thereby reducing the risk of contact between the two. However, the provision of the recessed portion 1a makes it easy for the middle position of the low welding wire 1 to contact with other light-emitting chips or pads to cause a short circuit, thereby affecting the reliability of the device. Summary of the invention

[0003] Based on this, the purpose of the present invention is to overcome the defects or shortcomings of the prior art and provide an LED device that can avoid the two welding wires at the staggered positions from touching each other and causing a short circuit without increasing the thickness of the device by improving the welding wire structure at the staggered positions.

[0004] An LED device comprises a support bowl with an open accommodating cavity, a light-emitting chip assembly and a solder pad assembly arranged in the accommodating cavity, and a cross-welding wire structure formed by a first soldering wire and a second soldering wire being cross-arranged; the light-emitting chip assembly and the solder pad assembly are electrically connected via the first soldering wire, the light-emitting chip comprises at least two light-emitting chips, and the light-emitting chips are electrically connected via the second soldering wire; in the cross-welding wire structure, the second soldering wire is located above the first soldering wire and does not contact the first soldering wire, and the second soldering wire has a horizontal section at its highest point, and the orthographic projection of the horizontal section on the horizontal plane intersects with the orthographic projection of the first soldering wire on the horizontal plane at a point.

[0005] Compared with the prior art, the LED device described in the present invention can improve the reliability of the device by setting a horizontal section parallel to the horizontal plane for the welding wire located at a higher position in the cross welding wire structure, and making the horizontal section cross the welding wire located at a lower position.

[0006] In one embodiment, the first welding wire includes a first vertical section, a first bending section and a second bending section connected in sequence, the first vertical section is connected to the light-emitting chip through a first welding point, and the second bending section is connected to the pad assembly through a second welding point.

[0007] In one embodiment, the second bent section is inclined in a direction away from the opening of the accommodating cavity, and the orthographic projection of the horizontal section on the horizontal plane intersects with the orthographic projection of the second bent section on the horizontal plane.

[0008] In one embodiment, an angle between an orthographic projection of the first bending section on a horizontal plane and an orthographic projection of a line connecting the first welding point and the second welding point on the horizontal plane is a first angle α1, and 20°≤α1<90°.

[0009] In one embodiment, the second welding wire further includes a second vertical section and an inclined section, and the second vertical section, the horizontal section and the inclined section are sequentially composed, wherein the inclined section is inclined in a direction away from the opening of the accommodating cavity; the second vertical section is connected to a light-emitting chip through a third welding point, and the inclined section is connected to another light-emitting chip through a fourth welding point.

[0010] In one embodiment, the length of the orthographic projection of the horizontal segment on the horizontal plane does not exceed two thirds of the length of the orthographic projection of a line connecting the third welding point and the fourth welding point on the horizontal plane.

[0011] In one embodiment, the height of the horizontal section is no more than 50 μm from the cup surface of the support bowl.

[0012] In one embodiment, a height difference between the first welding wire and the second welding wire at the intersection along the height direction is greater than or equal to 40 μm.

[0013] In one embodiment, the LED device includes two groups of light-emitting chip components, namely a first light-emitting chip component arranged in the middle position of the accommodating cavity, and a second light-emitting chip component arranged around the outer periphery of the first light-emitting chip component; and also includes two groups of solder pad components, namely a first solder pad component and a second solder pad component; the first light-emitting chip component is electrically connected to the first solder pad component through a solder wire to form a first electrical control channel; the second light-emitting chip component is electrically connected to the second solder pad component through a solder wire to form a second electrical control channel.

[0014] In one embodiment, the first electrically controlled channel includes two electrically controlled circuits connected in parallel, namely a first electrically controlled circuit and a second electrically controlled circuit, the first light-emitting chip assembly includes at least three first light-emitting chips, the first electrically controlled circuit is formed by electrically connecting at least two first light-emitting chips to the first pad assembly, and the second electrically controlled circuit is formed by electrically connecting the remaining first light-emitting chips to the first pad assembly;

[0015] And / or, the second electrically controlled channel includes two electrically controlled circuits connected in parallel, namely a third electrically controlled circuit and a fourth electrically controlled circuit, the second light-emitting chip assembly includes at least three second light-emitting chips, the third electrically controlled circuit is formed by electrically connecting at least two second light-emitting chips to the second solder pad assembly, and the fourth electrically controlled circuit is formed by electrically connecting the remaining second light-emitting chips to the second solder pad assembly.

[0016] In one embodiment, one electrode of a first light-emitting chip in the first electric control circuit is connected to a first welding wire and a third welding wire, the other end of the first welding wire is connected to the first pad assembly, and the other end of the third welding wire is connected to an electrode with the same polarity of a first light-emitting chip in the second electric control circuit.

[0017] In one embodiment, one electrode of a second light-emitting chip in the third electric control circuit is connected to a second welding wire and a fourth welding wire, the other end of the fourth welding wire is connected to the second pad assembly, and the other end of the second welding wire is connected to an electrode with the same polarity of a second light-emitting chip in the fourth electric control circuit.

[0018] For better understanding and implementation, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of an existing cross-wire structure;

[0020] Figure 2A top view of an embodiment of an LED device of the present invention;

[0021] Figure 3 A side view of an embodiment of a first bonding wire in an LED device of the present invention;

[0022] Figure 4 A top view of an embodiment of a first bonding wire in an LED device of the present invention;

[0023] Figure 5 A side view of another embodiment of the first bonding wire in the LED device of the present invention;

[0024] Figure 6 A side view of another embodiment of the first bonding wire in the LED device of the present invention;

[0025] Figure 7 A side view of an embodiment of a second bonding wire in an LED device of the present invention;

[0026] Figure 8 A top view of an embodiment of a cross-wire structure in an LED device of the present invention;

[0027] Fig. 9 A side view of an embodiment of a cross-wire structure in an LED device of the present invention;

[0028] Reference numerals:

[0029] 10. Bracket for bowls and cups;

[0030] 200. a first light-emitting chip;

[0031] 300. a second light-emitting chip;

[0032] 401A, first A-pole pad; 401B, first B-pole pad; 402A, second A-pole pad; 402B, second B-pole pad;

[0033] 50. Cross-weld wire structure;

[0034] 501, first welding line; 501a, first vertical section; 501b, first bending section; 501c, second bending section;

[0035] 502, second welding line; 502a, second vertical section; 502b, horizontal section; 502c, inclined section;

[0036] 503, third welding line;

[0037] 504, fourth welding line;

[0038] D1, first direction. DETAILED DESCRIPTION

[0039] The existing cross-welding structure is usually formed by interlacing a high arc and a low arc, both of which are arc-shaped. The high arc has a protruding portion that protrudes upward, and the protruding portion plays a load-bearing and supporting role for the overall structure of the high arc. However, due to the existence of the protruding portion of the high arc, the thickness of the bracket bowl needs to be increased to ensure that the encapsulation glue can completely cover the protruding portion of the high arc during packaging. However, this will increase the thickness of the LED device, which is not conducive to the miniaturization of the device. In addition, since the protruding portion of the high arc is close to its starting end, the position where the high arc and the low arc intersect tends to tilt downward. Therefore, in order to avoid the high arc and ensure that the high arc and the low arc do not touch each other, a downwardly concave recessed portion needs to be set at the position where the low arc intersects with the high arc, so as to increase the distance between the low arc and the large high arc in the height direction, thereby reducing the risk of contact between the two. However, the setting of the recessed portion will make the middle position of the low arc easy to contact with other light-emitting chips or pads to cause a short circuit, affecting the reliability of the device.

[0040] In order to solve the above problems, the present invention improves the high wire arc of the cross wire structure, and changes the raised part in the high wire arc into a horizontal section arranged horizontally, and makes the horizontal section cross the low wire arc, so as to avoid the two welding wires at the staggered position from easily touching each other and causing a short circuit without increasing the thickness of the device, and overcomes the defect of the existing welding wire located at a low position being easily contacted with other light-emitting chips or pads by setting a recessed part for avoiding the welding wire; further, by improving the low wire arc, setting the low wire arc into a three-dimensional structure, and utilizing the cooperation of the three-dimensional structure with the high wire arc structure, it is ensured that the two welding wires at the staggered position will not touch each other.

[0041] Based on the above improvement ideas, the solution of the present invention is described in detail below in conjunction with the accompanying drawings.

[0042] See also Figure 2 , Figure 2 An exemplary structure of the LED device of the present invention is shown. Figure 2 As shown, in this embodiment, the LED device includes a bracket bowl 10 with an open accommodating cavity, a light-emitting chip component and a solder pad component arranged in the accommodating cavity, and a cross-welding wire structure 50, wherein the cross-welding wire structure 50 includes a first welding wire 501 and a second welding wire 502 that are cross-arranged.

[0043] Specifically, the support bowl 10 and its accommodating cavity are quadrilateral, and there are two groups of light-emitting chip assemblies, namely the first light-emitting chip assembly and the second light-emitting chip assembly. The first light-emitting chip assembly includes a first light-emitting chip 200 arranged in the middle position of the accommodating cavity, and the four first light-emitting chips 200 are connected end to end to form a regular quadrilateral. The second light-emitting chip assembly includes four second light-emitting chips 300 arranged around the outer peripheral side of the first light-emitting chip assembly, and the four second light-emitting chips 300 are arranged in the same regular quadrilateral as the first light-emitting chip 200. Among them, the first light-emitting chip 200 and the second light-emitting chip 300 both have an A pole and a B pole with opposite polarities. In this embodiment, the A pole is the positive pole and the B pole is the negative pole.

[0044] There are also two groups of pad assemblies, namely the first pad assembly and the second pad assembly. The first pad assembly includes a first A-pole pad 401A and a first B-pole pad 401B, which are respectively arranged at two opposite corners of the accommodating cavity along the first direction D1; the second pad assembly includes a second A-pole pad 402A and a second B-pole pad 402B, which are respectively arranged at the other two opposite corners of the accommodating cavity along the first direction D1.

[0045] The four first light-emitting chips 200 and the four second light-emitting chips 300 located in the middle of the support bowl 10 are arranged opposite to each other up and down and left and right. In the above-mentioned LED device, the first light-emitting chip assembly and the first pad assembly form a first electric control channel, and the first electric control channel includes two electric control circuits, namely a first electric control circuit and a second electric control circuit. The first electric control circuit is formed by connecting two first light-emitting chips 200 in series, specifically: the first A-pole pad 401A is connected to the A-pole of the first light-emitting chip 200 located on the left side through the first welding wire 501, and the B-pole of the first light-emitting chip 200 is connected to the A-pole of the first light-emitting chip 200 located above through the third welding wire 503, and the B-pole of the first light-emitting chip 200 located above is connected to the first B-pole pad 401B through the first welding wire 501. In this way, the first light-emitting chips 200 located on the left and above are connected in series to form a first electric control circuit. The second electric control circuit is formed by connecting the first light-emitting chip 200 located at the bottom and the first light-emitting chip 200 located at the left in series. The A pole of the first light-emitting chip 200 located at the bottom is connected to the A pole of the first light-emitting chip 200 located at the left through a bonding wire, thereby connecting to the first A pole pad 401A, and the B pole of the first light-emitting chip 200 located at the right is connected to the B pole of the first light-emitting chip 200 located at the top through a bonding wire, thereby connecting to the first B pole pad 401B. The second light-emitting chip assembly and the second pad assembly form a second electric control channel, and the second electric control channel includes two electric control circuits, namely the third electric control circuit and the fourth electric control circuit. The third electric control loop is formed by connecting two second light-emitting chips 300 in series, specifically: the second A-pole pad 402A is connected to the A-pole of the second light-emitting chip 300 on the left through the fourth bonding wire 504, the B-pole of the second light-emitting chip 300 is connected to the A-pole of the second light-emitting chip 300 on the top through the second bonding wire 502, the B-pole of the second light-emitting chip 300 on the top is connected to the B-pole of the second light-emitting chip 300 on the right through the second bonding wire 502, and is connected to the second B-pole pad 402B through the fourth bonding wire 504, so that the second light-emitting chips 300 on the left and on the top are connected in series to form the third electric control loop. The fourth electric control loop is formed by connecting the second light-emitting chips 300 on the bottom and on the right in series, the A-pole of the second light-emitting chip 300 on the bottom is connected to the second A-pole pad 402A through the fourth bonding wire 504, and the B-pole of the second light-emitting chip 300 on the right is connected to the second B-pole pad 402B through the fourth bonding wire 504. By forming two first electrically controlled channels and two second electrically controlled channels connected in series and in parallel in a bracket cup 10, when the light-emitting chips of the two electrically controlled channels are packaged with different packaging adhesive layers, it is possible to emit light of two different color temperatures in a bracket cup 10, thereby realizing dual color temperature.

[0046] Based on the arrangement positions of the first light-emitting chip assembly, the second light-emitting chip assembly, the first pad assembly and the second pad assembly in the above-mentioned LED device, and the two series-connected and two parallel-connected first and second electrically controlled channels, the first welding wires 501 respectively connected to the first A-pole welding pads 401A and one first light-emitting chip 200 are interlaced with the second welding wires 502 connected to the two adjacent second light-emitting chips 300 to form a cross welding wire structure 50. In order to avoid a short circuit caused by contact between the two welding wires, the present invention improves the structures of the first welding wires 501 and the second welding wires 502.

[0047] Figure 3-9 The specific structures of the improved first welding wire 501 and the second welding wire 502 are shown respectively. Figure 3-4 As shown, in this embodiment, the first welding wire 501 includes a first vertical section 501a, a first bent section 501b and a second bent section 501c connected in sequence. Specifically, the first vertical section 501a is perpendicular to the top surface of the first light-emitting chip 200, one end of which is connected to the A pole of the first light-emitting chip 200 through the first welding point, and the other end is connected to one end of the first bent section 501b; the first bent section 501b is inclined toward the direction of the opening of the accommodating cavity of the support bowl 10, and the other end is connected to one end of the second bent section 501c; the second bent section 501c is inclined toward the direction away from the opening of the accommodating cavity of the support bowl 10, and the other end is connected to the first A pole pad 401A through the second welding point.

[0048] In some embodiments, the first bending section 501b may also be Figure 5 As shown, the bracket bowl 10 is tilted away from the opening of the accommodating cavity, or as shown Figure 6 Shown is arranged parallel to the horizontal plane.

[0049] like Figure 7As shown, the second welding wire 502 includes a second vertical section 502a, a horizontal section 502b and an inclined section 502c connected in sequence. Specifically, the second vertical section 502a is perpendicular to the top surface of the second light-emitting chip 300, one end of which is connected to the A pole of a second light-emitting chip 300 through the third welding point, and the other end is connected to one end of the horizontal section 502b; the horizontal section 502b is parallel to the horizontal plane, and the other end of the horizontal section 502b is connected to one end of the inclined section 502c; the inclined section 502c is inclined in the direction away from the opening of the accommodating cavity, and the other end of the inclined section 502c is connected to the B pole of another second light-emitting chip 300 through the fourth welding point, so that the second welding wire 502 viewed from the side direction is in the shape of a right-angled trapezoid. Since the second welding wire 502 will be impacted by the colloid during dispensing, in order to avoid the horizontal section 502b from collapsing due to the impact of the colloid during dispensing, the length of the second horizontal section 502b shall not exceed 2 / 3 of the length of the positive projection of the line connecting the welding points at both ends of the second welding wire 502 on the horizontal plane; and the height of the second horizontal section 502b shall not exceed a position 50μm away from the cup surface of the bracket bowl 10, so as to ensure that the second welding wire 502 will not protrude outside the packaging glue after packaging, so as to be completely covered by the packaging glue layer of subsequent packaging.

[0050] like Figure 8-9 As shown, in the cross-wire structure 50, the second wire 502 is located above the first wire 501, and the orthographic projection of the horizontal line segment 502b of the second wire 502 on the horizontal plane intersects with the orthographic projection of the first wire 501 at one point, that is, the horizontal segment 501b of the second wire 502 crosses the first wire 501. The horizontal line segment 502b of the second wire 502 is its highest point, and the horizontal segment 502b crosses the first wire 501 to ensure that the distance between the second wire 502 and the first wire 501 is the maximum, so as to reduce the risk of the two wires touching each other. At the same time, since the highest position of the second wire 502 is horizontally set, it is not necessary to increase the thickness of the device to ensure that the packaging glue completely covers the second wire 502. Among them, the orthographic projection of the horizontal segment 502b of the second wire 502 on the horizontal plane preferably intersects with the second bending segment 501c of the first wire 501. Since the second bending section 501c of the first welding wire 501 extends downward, the horizontal section 501b of the second welding wire 502 crosses the second bending section 501c of the first welding wire 501, thereby further increasing the distance between the two and reducing the risk of the two touching each other. The height difference at the intersection of the horizontal section 501b of the second welding wire 502 and the second bending section 501c of the first welding wire 501 is greater than or equal to 40μm to ensure a sufficient safety distance.

[0051] In the first welding line 501, the inclined first bending section 501b and the second bending section 501c have an included angle less than 180°, so that the intersection of the first bending section 501b and the second bending section 501c forms a Figure 3The raised structure shown in the figure can bear the load for the first welding wire 501, so as to prevent the welding wire from collapsing due to the impact of the colloid during dispensing. However, the existence of the raised structure makes it easy for the first welding wire 501 to contact the horizontal section 502b of the second welding wire 502 located above it. If the protrusion of the raised structure is reduced or even removed, the structure of the first welding wire 501 itself may be unstable, so that it is easy to collapse under the action of external force. In order to ensure the stability of the structure of the first welding wire 501 itself, while reducing the height of the first welding wire 501 to reduce the risk of contact with the second welding wire 502, the first bending section 501b of the first welding wire 501 is offset relative to the line connecting the welding points at both ends of the first welding wire 501, that is, the orthographic projection of the first bending section 501b on the horizontal plane and the orthographic projection of the line connecting the welding points at both ends of the first welding wire 501 on the horizontal plane have a first angle α1, and 20°≤α1<90°. As Figure 6 As shown, as the first bending section 501b is offset, the second bending section 501c is also offset. The angle between the first bending section 501b and the horizontal plane P0 is the second angle α2, and -15°≤α2≤15°. The length of the positive projection of the first bending section 501b on the line connecting the welding points at both ends of the first welding wire 501 is 1 / 5-1 / 2 of the length of the line. In this way, the first bending section 501b and the second bending section 501c of the first welding wire 501 are not coplanar with the first vertical section 501a, that is, the first welding wire 501 forms a three-dimensional structure as a whole. Compared with the traditional welding wire with a two-dimensional planar structure, the first welding wire 501 with a three-dimensional structure is more stable, and the offset first bending section 501b and the second bending section 501c reduce the height of the first welding wire 501, reducing the risk of it touching the horizontal section 502b of the second welding wire 502.

[0052] Preferably, in the cross welding wire structure, the first bending section 501b and the second bending section 501c are offset toward the direction of the second vertical section 502a of the second welding wire 502 (eg, Fig. 9 As shown in the figure, in this way, the right-angle space formed by the second vertical section 502a and the horizontal section 502b of the second welding wire 502 can accommodate the offset first bending section 501b and the second bending section 501c, so as to avoid contact between the first welding wire 501 and other parts of the second welding wire 502 except the horizontal section 502b. At the same time, in order to form sufficient accommodating space for the first bending section 501b and the second bending section 501c offset in the direction of the second vertical section 502a of the second welding wire 502, the length of the horizontal section 502b of the second welding wire 502 is greater than or equal to 1 / 3 of the length of the orthographic projection of the line connecting the two end points of the second welding wire 502 on the horizontal plane.

[0053] In addition, in addition to improving the structure of the first welding wire 501 and the second welding wire 502 of the cross welding wire structure 50 in the above LED device, the present invention also connects two welding wires by “one welding point” (such as Figure 2 The circular dotted line frame position is shown to realize the connection of two electric control circuits in the same electric control channel.

[0054] like Figure 2 As shown, the first electric control circuit and the second electric control circuit are connected in parallel by "one welding point connecting two welding wires", specifically: the A pole of the first light-emitting chip 200 located on the left is connected to the first welding wire 501 and a third welding wire 503, and the first light-emitting chip 200 located below and the first light-emitting chip 200 located on the right are connected to the first A pole pad 401A through the third welding wire 503. In addition, the B pole of the first light-emitting chip 200 located above is connected to the first welding wire 501 and a third welding wire 503, and the first light-emitting chip 200 located below and the first light-emitting chip 200 located on the right are connected to the first B pole pad 401B through the third welding wire 503. In this way, the first electric control circuit and the second electric control circuit are connected in parallel through the A pole of the first light-emitting chip 200 located on the left and the B pole of the first light-emitting chip 200 located above, forming a first electric control channel with two series and two parallels.

[0055] Similarly, the third electric control circuit and the fourth electric control circuit of the second electric control channel are also connected in parallel through "one welding point connecting two welding wires". As mentioned above, the B pole of the second light-emitting chip 300 located on the right is connected to the fourth welding wire 504 in addition to the second welding wire 502. The second light-emitting chip 300 located below and the second light-emitting chip 300 located on the right are connected to the second B-pole pad 402B through the fourth welding wire 504. In this way, the third electric control circuit and the fourth electric control circuit are connected in parallel through the B pole of the second light-emitting chip 300 located on the right, forming a second electric control channel with two series and two parallels.

[0056] In the above-mentioned LED device, the structure of the fourth bonding wire 504 connecting the light-emitting chip and the bonding pad can be the same as that of the first bonding wire 501, or a common J-type bonding wire or a Q-type bonding wire can be used; and the structure of the third bonding wire 503 connecting the two light-emitting chips can be the same as that of the second bonding wire 502, or a common J-type bonding wire or a Q-type bonding wire.

[0057] Compared with the traditional single-chip parallel connection through a common cathode or common anode structure, the above-mentioned "one solder point connecting two solder wires" can realize multiple chips in series and multiple electric control circuits in parallel in a bracket bowl 10 to form multiple electric control channels, thereby meeting the needs of LED products with different performances.

[0058] Compared with the prior art, the LED device of the present invention can avoid the two welding wires at the staggered position from touching each other and causing a short circuit without increasing the thickness of the device by setting a horizontal section parallel to the horizontal plane for the welding wire at the high position in the cross welding wire structure, and making the horizontal section cross the welding wire at the low position, while overcoming the defect of the existing welding wire at the low position being easily contacted with other light-emitting chips or pads by setting a recessed portion for avoiding the welding wire at the low position, thereby improving the reliability of the device. Furthermore, by improving the low wire arc, setting the low wire arc as a three-dimensional structure, and using the cooperation of the low wire arc with a three-dimensional structure and the high wire arc structure, it is ensured that the two welding wires at the staggered position will not touch each other, thereby improving the reliability of the device. In addition, through the setting of "one welding point connecting two welding wires", multiple chips are connected in series and multiple electric control circuits are connected in parallel in a bracket bowl, forming multiple electric control channels to meet the needs of LED products with different performances.

[0059] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the embodiments of the present application. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that, unless otherwise specified, "multiple" refers to two or more; the terms "first", "second", "third", etc. are only used to distinguish, rather than to describe a specific order or sequence, and cannot be understood as indicating or implying relative importance. The term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items. When the above description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of the present application, for those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0060] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. An LED device, comprising a support cup (10) having an open accommodating cavity, a light-emitting chip assembly and a solder pad assembly arranged in the accommodating cavity, and a cross soldering wire structure (50) formed by a first soldering wire (501) and a second soldering wire (502) being cross-arranged; the light-emitting chip assembly and the solder pad assembly are electrically connected via the first soldering wire (501), the light-emitting chip comprises at least two light-emitting chips, and the light-emitting chips are electrically connected via the second soldering wire (502); characterized in that: In the cross welding wire structure (50), the second welding wire (502) is located above the first welding wire (501) and does not contact the first welding wire (501), and the second welding wire (502) has a horizontally arranged horizontal section (502b) at its highest point, and the orthographic projection of the horizontal section (502b) on the horizontal plane intersects with the orthographic projection of the first welding wire (501) on the horizontal plane at a point.

2. The LED device according to claim 1, characterized in that: The first welding wire (501) comprises a first vertical section (501a), a first bent section (501b) and a second bent section (501c) connected in sequence, the first vertical section (501a) being connected to the light-emitting chip via a first welding point, and the second bent section being connected to the pad assembly via a second welding point.

3. The LED device according to claim 2, characterized in that: The second bent section (501c) is inclined in a direction away from the opening of the accommodating cavity, and the orthographic projection of the horizontal section (502b) on the horizontal plane intersects with the orthographic projection of the second bent section (501c) on the horizontal plane.

4. The LED device according to claim 3, characterized in that: The angle between the orthographic projection of the first bending section (501b) on the horizontal plane and the orthographic projection of the line connecting the first welding point and the second welding point on the horizontal plane is a first angle α1, 20°≤α1<90°.

5. The LED device according to claim 1, characterized in that: The second welding line (502) further comprises a second vertical section (502a) and an inclined section (502c), wherein the second vertical section (502a), the horizontal section (502b) and the inclined section (502c) are sequentially composed, wherein the inclined section (502c) is inclined in a direction away from the opening of the accommodating cavity; The second vertical section (502a) is connected to a light-emitting chip via a third welding point, and the inclined section (502c) is connected to another light-emitting chip via a fourth welding point.

6. The LED device according to claim 5, characterized in that: The length of the orthographic projection of the horizontal section (502b) on the horizontal plane does not exceed two thirds of the length of the orthographic projection of the line connecting the third welding point and the fourth welding point on the horizontal plane.

7. The LED device according to claim 6, characterized in that: The setting height of the horizontal section (502b) does not exceed a position 50 μm away from the cup surface of the support bowl (10).

8. The LED device according to claim 5, characterized in that: A height difference between the first welding line (501) and the second welding line (502) at the intersection along the height direction is greater than or equal to 40 μm.

9. The LED device according to claim 1, characterized in that: It includes two groups of light-emitting chip components, namely, a first light-emitting chip component arranged in the middle of the accommodating cavity, and a second light-emitting chip component arranged around the outer periphery of the first light-emitting chip component; and also includes two groups of solder pad components, namely, a first solder pad component and a second solder pad component; The first light-emitting chip component is electrically connected to the first pad component through a bonding wire to form a first electrical control channel; The second light emitting chip assembly is electrically connected to the second pad assembly via a bonding wire to form a second electrical control channel.

10. The LED device according to claim 9, characterized in that: The first electrically controlled channel comprises two electrically controlled circuits connected in parallel, namely a first electrically controlled circuit and a second electrically controlled circuit; the first light-emitting chip assembly comprises at least three first light-emitting chips (200); the first electrically controlled circuit is formed by electrically connecting at least two first light-emitting chips (200) to the first solder pad assembly; and the second electrically controlled circuit is formed by electrically connecting the remaining first light-emitting chips (200) to the first solder pad assembly; And / or, the second electrically controlled channel comprises two electrically controlled circuits connected in parallel, namely a third electrically controlled circuit and a fourth electrically controlled circuit, the second light-emitting chip assembly comprises at least three second light-emitting chips (300), the third electrically controlled circuit is formed by electrically connecting at least two second light-emitting chips (300) to the second solder pad assembly, and the fourth electrically controlled circuit is formed by electrically connecting the remaining second light-emitting chips (300) to the second solder pad assembly.

11. The LED device according to claim 10, characterized in that: One electrode of a first light-emitting chip (200) in the first electric control circuit is connected to a first welding wire (501) and a third welding wire (503), the other end of the first welding wire (501) is connected to the first pad assembly, and the other end of the third welding wire (503) is connected to an electrode with the same polarity of a first light-emitting chip (200) in the second electric control circuit.

12. The LED device according to claim 10, characterized in that: One electrode of a second light-emitting chip (300) in the third electric control circuit is connected to a second welding wire (502) and a fourth welding wire (504), the other end of the fourth welding wire (504) is connected to the second welding pad assembly, and the other end of the second welding wire (502) is connected to an electrode with the same polarity of a second light-emitting chip (300) in the fourth electric control circuit.

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