Sports suit with refrigeration structure
By integrating semiconductor refrigeration wafers, metal heat conduction sheets and ultra-thin low-noise fans into sportswear, the problem of poor heat dissipation effect of existing sportswear is solved, and more efficient heat dissipation and cooling effects are achieved.
Patent Information
- Application Number
- CN202411809141.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-03-07
AI Technical Summary
The sweat-relieving and cooling function of existing sportswear is not ideal, and it mainly depends on the improvement of clothing materials and cannot effectively improve the heat dissipation effect.
It adopts structures such as semiconductor refrigeration wafers, metal heat conduction sheets and ultra-thin low-noise fans to accelerate heat dissipation through heat conduction and air flow, improving the heat dissipation effect of clothes.
It significantly improves the heat dissipation effect of sportswear and can transfer heat from the human body to the outside more efficiently, thereby achieving better cooling effect.
Smart Images
Figure CN119563955A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of sportswear, and in particular to a sportswear with a refrigeration structure. Background Art
[0002] At present, the sweat-wicking and cooling function of sportswear is generally only reflected in the improvement of clothing materials, and this sweat-wicking and cooling effect is not ideal. Summary of the invention
[0003] The purpose of the present invention is to address the defects and shortcomings of the prior art and provide a sportswear with a refrigeration structure, which utilizes semiconductor refrigeration chips, metal heat conductive sheets, and fan structures to conduct heat and increase the heat dissipation effect of the clothing.
[0004] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: it comprises a clothing body, the fabric of the clothing body is provided with holes, a semiconductor refrigeration chip is embedded in the holes, an ultra-thin low-noise fan is installed on the hot end of the semiconductor refrigeration chip, an electric control module is arranged below the ultra-thin low-noise fan, the cold end of the semiconductor refrigeration chip is bonded to an ultra-thin metal heat conductive sheet, and a thermal conductive silicone pad is arranged on the outer side of the ultra-thin metal heat conductive sheet; the semiconductor refrigeration chip and the ultra-thin low-noise fan are both electrically connected to the electric control module.
[0005] Preferably, the electric control module includes a controller and a battery.
[0006] Preferably, the connection line between the electric control module and the ultra-thin low-noise fan is a soft stretchable wire.
[0007] Preferably, the thermally conductive silicone pad is a highly elastic heat-resistant silicone pad.
[0008] The present invention utilizes a thermally conductive silicone pad and an ultra-thin metal thermally conductive sheet to transfer the heat in the clothing body to the cold end of a semiconductor refrigeration chip, which is then transferred to the hot end by the semiconductor refrigeration chip. The heat is then transferred out at an accelerated speed under the action of an ultra-thin low-noise fan, thereby achieving the purpose of efficient heat dissipation and cooling.
[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention provides a sportswear with a refrigeration structure, which utilizes semiconductor refrigeration chips, metal heat conductive sheets and fan structures to conduct heat, thereby increasing the heat dissipation effect of the clothing. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 It is a cross-sectional view of the present invention.
[0011] Figure 2 It is the front view of the present invention.
[0012] Description of reference numerals: Fabric 1, semiconductor refrigeration chip 2, ultra-thin metal heat conductive sheet 3, thermal conductive silicone pad 4, ultra-thin low-noise fan 5, electronic control module 6. DETAILED DESCRIPTION
[0013] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. The preferred embodiments in the description are only used as examples, and all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of the present invention.
[0014] like Figure 1-Figure 2 As shown, this specific embodiment adopts the following technical scheme: it comprises a clothing body, wherein holes are provided in the fabric 1 of the clothing body at the parts of the human body where heat is easily dissipated (such as the back, waist and chest, etc.), and a semiconductor refrigeration chip 2 is embedded in the hole, and an ultra-thin low-noise fan 5 is installed on the hot end of the semiconductor refrigeration chip 2, and an electric control module 6 is provided below the ultra-thin low-noise fan 5, and the electric control module 6 can be installed in a pocket sewn on the fabric 1; the cold end of the semiconductor refrigeration chip 2 is bonded to the ultra-thin metal heat conductive sheet 3, and a thermal conductive silicone pad 4 is provided on the outer side of the ultra-thin metal heat conductive sheet 3, and the thermal conductive silicone pad 4 is a highly elastic heat-resistant silicone pad, and the thermal conductive silicone pad 4 is bonded to the fabric 1; the ultra-thin low-noise fan 5 is electrically connected to the electric control module 6; the electric control module 6 comprises a controller and a battery, and the semiconductor refrigeration chip 2 is electrically connected to the battery; the connecting line between the electric control module 6 and the ultra-thin low-noise fan 5 is a soft stretchable wire.
[0015] When the present invention is in use, the heat generated by the human body is transferred by the thermally conductive silicone pad 4 to the ultra-thin metal thermal conductive sheet 3, and then transferred by the ultra-thin metal thermal conductive sheet 3 to the cold end of the semiconductor refrigeration chip 2, and then transferred by the hot end of the semiconductor refrigeration chip 2 to the outside of the clothing body. Under the action of the ultra-thin low-noise fan 5, the heat is accelerated to be transferred out, thereby achieving the purpose of efficient heat dissipation and cooling.
[0016] Compared with the prior art, the present invention has the following beneficial effects: The semiconductor refrigeration chip is used to transfer the heat inside the sportswear to the outside of the sportswear, achieving a better heat dissipation effect; The use of thermal conductive silicone pads and metal thermal conductive sheets can transfer the heat in the sportswear to the semiconductor refrigeration chip more quickly, achieving faster heat transfer. Using ultra-thin low-noise fans to increase airflow speed can increase the speed of heat transfer and improve the heat dissipation effect.
[0017] For those skilled in the art, they can modify the technical solutions described in the aforementioned embodiments and make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A sportswear with a cooling structure, characterized in that: The invention comprises a clothing body, wherein a hole is provided in a fabric (1) of the clothing body, a semiconductor cooling chip (2) is embedded in the hole, an ultra-thin low-noise fan (5) is installed on the hot end of the semiconductor cooling chip (2), an electric control module (6) is provided below the ultra-thin low-noise fan (5), the cold end of the semiconductor cooling chip (2) is fitted with an ultra-thin metal heat conductive sheet (3), and a heat conductive silicone pad (4) is provided on the outer side of the ultra-thin metal heat conductive sheet (3); the semiconductor cooling chip (2) and the ultra-thin low-noise fan (5) are both electrically connected to the electric control module (6).
2. The sportswear with a refrigeration structure according to claim 1, characterized in that: The electric control module (6) comprises a controller and a battery.
3. The sportswear with a refrigeration structure according to claim 2, characterized in that: The connection line between the electric control module (6) and the ultra-thin low-noise fan (5) is a soft and stretchable wire.
4. The sportswear with a refrigeration structure according to claim 3, characterized in that: The thermally conductive silicone pad (4) is a highly elastic heat-resistant silicone pad.
5. The sportswear with a refrigeration structure according to claim 4, characterized in that: The heat in the clothing body is transferred to the cold end of the semiconductor refrigeration chip (2) by using a heat-conducting silicone pad (4) and an ultra-thin metal heat-conducting sheet (3), and then transferred to the hot end by the semiconductor refrigeration chip (2). The heat is then transferred out at an accelerated speed under the action of an ultra-thin low-noise fan (5), thereby achieving the purpose of efficient heat dissipation and temperature reduction.