Vacuum reflow soldering device for semiconductor substrate processing

Abstract

The invention discloses a vacuum reflow soldering device for semiconductor base material processing. The vacuum reflow soldering device comprises a negative pressure exhaust fan, a welding box, a processing table, an adsorption supporting mechanism, a feeding mechanism, an auxiliary conveying mechanism, a heating mechanism, a sealing mechanism and a floating auxiliary mechanism, and the floating auxiliary mechanism is installed in the processing table; by arranging a floating auxiliary mechanism, a rotating rod can drive a cam to rotate, when the protruding position of the cam rotates to the top, a fixing plate can be pushed to move upwards, so that a connecting rod can drive a floating table to move upwards, and when the protruding position of the cam rotates to the bottom, the fixing plate can be pushed by a first spring to move downwards; and meanwhile, a contact piece in a floating plate at the top of the floating table is in contact with the bottom of a machining plate, so that the machining plate at the top of the machining table is slightly shaken, the welding contact between the machining plate and a chip pin at the top is tighter, and the welding effect is better.

Description

Technical Field

[0001] The present invention relates to the field of vacuum reflow soldering technology, and in particular to a vacuum reflow soldering device for semiconductor substrate processing. Background Art

[0002] Semiconductor sintering vacuum reflow technology has a wide range of applications and market demand in the semiconductor industry. With the rapid development of the semiconductor industry, the market size of semiconductor sintering vacuum reflow technology continues to expand. The growth in demand for semiconductor devices and the promotion of emerging technologies such as the Internet of Things, artificial intelligence, 5G, etc. have driven the growth of the semiconductor sintering vacuum reflow market. Semiconductor devices play an important role in various application fields, and their reliability and stability are highly required.

[0003] Semiconductor sintering vacuum reflow technology can provide high-quality welding connections, ensure the reliability of devices, and reduce the risk of faults and failures. Vacuum reflow, also known as vacuum / controlled atmosphere eutectic furnace, has large heat capacity and extremely small temperature difference on the PCB surface. It has been widely used in European and American aviation, aerospace, military electronics and other fields. It adopts the principle of infrared radiation heating, and has the characteristics of uniform temperature, ultra-low temperature safe welding, no temperature difference, no overheating, reliable and stable process parameters, no need for complex process tests, and low environmental protection cost operation, etc., which meets the needs of military products with multiple varieties, small batches and high reliability welding.

[0004] In the Chinese patent application number CN117086429A, a reflow soldering device based on semiconductor substrate and its operation process are disclosed, which includes an external vacuum furnace and a heating component, a cooling component and a transfer component arranged in the inner cavity of the vacuum furnace. The upper part of the lifting frame of the transfer component forms a bearing surface, and the lifting and lowering movement of the lifting frame as a whole is realized by the lifting and lowering drive component. The horizontal driving component realizes the horizontal transfer of the lifting frame between the heating component and the cooling component. The heating component heats the stacked body carrying the joined components and the solder material above, and the cooling component is used to cool the heated stacked body; the gas supply module is used to pass gas into the inner cavity of the vacuum furnace through a pipeline. The vacuum furnace used in the device is respectively provided with a heating component and a cooling component, both of which are located in the same cavity, so that heating and cooling operations can be quickly realized on one device.

[0005] However, in actual use, it is impossible to ensure that the chip pins and the circuit board are tightly welded, which may easily lead to cold solder joints and thus affect the welding effect. Summary of the invention

[0006] The object of the present invention is to provide a vacuum reflow soldering device for semiconductor substrate processing to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions: A vacuum reflow soldering device for semiconductor substrate processing, comprising: A negative pressure exhaust fan, the negative pressure exhaust fan is installed on the ground, and the output end of the negative pressure exhaust fan is respectively installed with a first connecting pipe and a second connecting pipe; A welding box, wherein the welding box is installed on the top of the negative pressure exhaust fan, the top of the first connecting pipe extends to the inside of the welding box, the welding box forms a hollow cavity, the first connecting pipe is connected to the inside of the welding box, and conveying holes for conveying processed material plates are opened on both sides of the welding box; A processing table, the processing table is installed in the inner cavity of the welding box, the second connecting pipe extends into the interior of the processing table, and the processing table is used to place the processing material plate; An adsorption support mechanism, which is installed on the top of the processing table and is used to adsorb and support the processing material plate on the top of the processing table; A feeding mechanism, the feeding mechanism is installed inside the welding box, and two groups of the feeding mechanism are provided. The two groups of the feeding mechanism are respectively located on one side of the processing table, one group of the feeding mechanism is used to transport the processed material plate from the outside of the welding box to the top of the processing table, and the other group of the feeding mechanism is used to transport the processed material plate from the top of the processing table to the outside of the welding box after processing; An auxiliary conveying mechanism, which is installed on the top of the processing table, and plays an auxiliary role when unloading materials and plays a conveying role when withdrawing materials; A heating mechanism, which is installed inside the welding box and heats the processing plate on the top of the processing table through an electric heating wire; A sealing mechanism, which is installed on the top of the welding box and seals the conveying hole through a sealing plate and a sealing gasket on one side of the sealing plate; A floating auxiliary mechanism is installed inside the processing table. The floating auxiliary mechanism floats through a floating plate to cause the processing material plate on the top of the processing table to vibrate slightly.

[0008] The floating auxiliary mechanism includes a plurality of floating tables, a connecting rod, a first spring, a fixed plate, a rotating rod, a cam, a second electric push rod, a contact piece, a limit plate and a second spring. The top of the processing table is provided with a plurality of first movable grooves, the bottom of the first movable groove is provided with a second movable groove, the rotating rod is rotatably connected inside the second movable groove, and the cam is fixedly mounted on the side wall of the rotating rod; The connecting rod is fixedly mounted on the bottom of the floating platform, the connecting rod is slidably connected inside the first movable groove, the fixing plate is fixedly mounted on the bottom of the connecting rod, the fixing plate corresponds to the cam, and the first spring is sleeved and mounted on the outer wall of the connecting rod, so that one end of the first spring contacts the inner wall of the second movable groove and contacts the top of the fixing plate; The second electric push rod is fixedly mounted on the top of the floating platform, the floating plate is fixedly mounted on the output end of the second electric push rod, a plurality of movable cavities with openings facing upward are opened on the top of the floating plate, one end of the second spring is fixedly mounted on the bottom of the movable cavity, the other end of the second spring is limited to the upper part of the movable cavity by a limiting plate, and the limiting plate is movably connected to the inside of the movable cavity through the second spring.

[0009] Optionally, the contact piece is a hemispherical structure, and the top of the contact piece protrudes from the upper surface of the floating plate.

[0010] Optionally, a synchronous wheel is fixedly mounted on the side wall at one end of several of the rotating rods, and teeth are fixedly mounted on the outer circumference of the synchronous wheel. The synchronous belt is synchronously mounted with multiple sets of synchronous wheels at the same time, and the synchronous belt is matched with the teeth. Several of the rotating rods are connected through the synchronous wheel and the synchronous belt transmission. A mounting cover is fixedly mounted on one side of the processing table, and the synchronous wheel and the synchronous belt are both located inside the mounting cover. A fourth servo motor is fixedly mounted on one side of the welding box, and a transmission rod is fixedly mounted on one end of the synchronous wheel located at the end, and the transmission rod is fixedly mounted on the output end of the fourth servo motor.

[0011] Optionally, the adsorption support mechanism includes four support frames and several buffer pads, the support frames are fixedly installed at the four corners of the top of the processing table, several exhaust ports are opened inside the support frames, the exhaust ports are connected to the second connecting pipe, the buffer pads are fixedly installed on the top of the support frames, the buffer pads are located on one side of the exhaust ports, and the buffer pads are in a circular shape.

[0012] Optionally, the feeding mechanism includes a fixed cover, two conveying rollers, two rotating shafts, two transmission wheels, a transmission belt and a first servo motor, the rotating shaft is rotatably connected to the inside of the welding box, the conveying rollers are fixedly installed on both sides of the rotating shaft, and the conveying rollers and the upper surface of the rotating shaft are kept in the same plane, and the conveying rollers are located on one side of the conveying hole; A transmission wheel is fixedly mounted on the side wall of one end of the rotating shaft, the transmission belt is mounted on the side wall of the transmission wheel, the two rotating shafts are connected through the transmission belt and the transmission wheel, the fixed cover is fixedly mounted on one end of the welding box, the transmission wheel and the transmission belt are both located and covered by the fixed cover, the first servo motor is fixedly mounted on one side of the fixed cover, and one of the transmission wheels is fixedly mounted on the output end of the first servo motor.

[0013] Optionally, the auxiliary conveying mechanism includes a support roller, a bracket and a third spring. A support groove is opened on one side of the top of the processing table. One end of the third spring is fixedly installed on the bottom of the bracket, and the other end of the third spring is fixedly installed on the inner wall of the support groove. The bracket is movably connected to the inside of the support groove through the third spring, and the support roller is rotatably connected to the inside of the bracket.

[0014] Optionally, the auxiliary conveying mechanism also includes a plurality of rollers, a movable frame, a third servo motor and a third electric push rod. A mounting groove is opened at one end of the top of the processing table. The third electric push rod is fixedly installed on the inner wall of the mounting groove. The movable frame is fixedly installed on the output end of the third electric push rod. The third servo motor is fixedly installed on one side of the movable frame. The roller is fixedly installed on the output end of the third servo motor. The roller is rotatably connected to the inside of the movable frame through the third servo motor.

[0015] Optionally, the heating mechanism includes a mounting frame, a first electric push rod and a mounting plate, the mounting frame is fixedly installed inside the welding box, the first electric push rod is fixedly installed inside the mounting frame, the mounting plate is fixedly installed at the output end of the first electric push rod, the mounting plate corresponds to the processing table, and the electric heating wire is fixedly installed at the bottom of the mounting plate.

[0016] Optionally, the sealing mechanism includes a fourth electric push rod, a sliding plate, a connecting column, a connecting frame, a slider and a fourth spring, the sliding plate is fixedly mounted on the output end of the fourth electric push rod, the connecting frame is fixedly mounted on the bottom of the sliding plate through the connecting column, and the connecting frame is located on the side of the welding box; The slider is fixedly installed on the inner side of the connecting frame, a slide groove is opened on one side of the welding box, the slider is slidably connected inside the slide groove, one end of the fourth spring is fixedly installed inside the connecting frame, the sealing plate is fixedly installed on the other end of the fourth spring, the sealing gasket is fixedly installed on one side of the sealing plate, and the sealing gasket fits with the conveying hole.

[0017] Optionally, a through hole is opened inside the sliding plate, and the through hole matches the mounting frame. The sliding plate is slidably connected to the side wall of the mounting frame through the through hole and the fourth electric push rod.

[0018] The present invention has at least the following beneficial effects: (1) This scheme sets a floating auxiliary mechanism. The rotating rod can drive the cam to rotate. When the cam protrusion rotates to the top, it can push the fixed plate to move upward, so that the connecting rod can drive the floating platform to move upward. When the cam protrusion rotates to the bottom, the fixed plate can move downward under the push of the first spring, so that the floating platform repeatedly floats up and down. At the same time, the contact piece inside the floating plate at the top of the floating platform contacts the bottom of the processing sheet, so that the processing sheet on the top of the processing table is slightly shaken, so that the processing sheet and the top chip pin welding contact is closer, so that the welding effect is better; (2) This solution provides an adsorption support mechanism, and a support frame can be provided to support the processing material plate on the top of the processing table. By providing an exhaust port connected to the second connecting pipe, when the negative pressure exhaust fan is running, the processing material plate can be more stably adsorbed on the top of the support frame, and a buffer pad can be provided to avoid scratching the bottom of the processing material plate; (3) This solution sets a sealing mechanism, and the fourth electric push rod is extended to control the sliding plate to slide downward, so that the connecting frame can slide downward together with the connecting column. When the connecting frame moves to the bottom, the sealing plate will be located on one side of the conveying hole. At this time, the sealing gasket on one side of the sealing plate will be inserted into the conveying hole under the push of the fourth spring, so that the conveying hole can be blocked and sealed. By completely inserting the sealing gasket into the conveying hole, the sealing effect can be better, so that the inside of the welding box is in a more stable negative pressure environment; (4) This scheme can play an auxiliary conveying role when unloading materials and a conveying role when returning materials by setting up an auxiliary conveying mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the installation structure of the sealing mechanism of the present invention; Figure 3 This is a schematic diagram of the welding box structure of the present invention; Figure 4 This is a schematic diagram of the structure of the negative pressure exhaust fan of the present invention; Figure 5 This is a schematic diagram of the structure of the mounting plate of the present invention; Figure 6 This is a schematic diagram of the installation position structure of the feeding mechanism of the present invention; Figure 7 It is a schematic diagram of the structure of the conveying roller of the present invention; Figure 8 This is a schematic diagram of the support structure of the present invention; Fig. 9 It is a schematic diagram of the structure of the processing table of the present invention; Fig.10 It is a schematic diagram of the cross-sectional structure of the processing table of the present invention; Fig.11 This is a schematic diagram of the connection structure between the synchronous wheel and the synchronous belt of the present invention; Fig.12 This is a schematic diagram of the floating platform structure of the present invention; Fig.13 It is a schematic diagram of the cross-sectional structure of the floating plate of the present invention; Fig.14 This is a schematic diagram of the top structure of the processing table of the present invention; Fig.15 This is a schematic diagram of the support structure of the present invention; Fig.16 It is a schematic diagram of the structure of the movable frame of the present invention; Fig.17 It is a schematic diagram of the sealing mechanism structure of the present invention; Fig.18 It is a schematic diagram of the sealing plate structure of the present invention.

[0020] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Negative pressure exhaust fan; 101. First connecting pipe; 102. Second connecting pipe; 2. Welding box; 2001. Processing table; 2002. First movable slot; 2003. Second movable slot; 201. Mounting frame; 2011. First electric push rod; 2012. Mounting plate; 2013. Electric heating wire; 202. Fixed cover; 2021. Conveying roller; 2022. Rotating shaft; 2023. Transmission wheel; 2024. Transmission belt; 2025. First servo motor; 203. Conveying hole; 204. Floating table; 2041. Connecting rod; 20411. First spring; 2042. Fixed plate; 2043. Rotating rod; 2044. Cam; 2045. Second electric push rod; 2046. Floating plate; 2047. Active cavity; 2048. Contact piece; 2049. Limit Position plate; 20491, second spring; 205, support frame; 2051, buffer pad; 2052, exhaust port; 206, mounting groove; 2061, roller; 2062, movable frame; 2063, third servo motor; 2064, third electric push rod; 207, mounting cover; 2071, transmission rod; 2072, fourth servo motor; 2073, synchronous wheel; 2074, teeth; 2075, synchronous belt; 208, support roller; 2081, support groove; 2082, bracket; 2083, third spring; 3, sealing mechanism; 301, fourth electric push rod; 302, sliding plate; 303, connecting column; 304, connecting frame; 305, slide groove; 306, slider; 307, sealing pad; 308, sealing plate; 309, fourth spring; 310, through hole. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1-Figure 18 The present invention provides a vacuum reflow soldering device for semiconductor substrate processing, comprising: A negative pressure exhaust fan 1 is installed on the ground, and a first connecting pipe 101 and a second connecting pipe 102 are respectively installed at the output end of the negative pressure exhaust fan 1; The welding box 2 is installed on the top of the negative pressure exhaust fan 1. The top of the first connecting pipe 101 extends to the inside of the welding box 2. The first connecting pipe 101 is connected to the inside of the welding box 2. The two sides of the welding box 2 are provided with conveying holes 203 for conveying the processed material plates. A processing table 2001, which is installed inside the welding box 2, and the second connecting pipe 102 extends into the processing table 2001, and the processing table 2001 is used to place the processing material plate; An adsorption support mechanism is installed on the top of the processing table 2001 and is used to provide adsorption support for the processing material plate on the top of the processing table 2001; In some embodiments, see Figure 8 , Fig. 9 The adsorption support mechanism includes four support frames 205 and a plurality of buffer pads 2051. The support frames 205 are fixedly installed at the four corners of the top of the processing table 2001. A plurality of exhaust ports 2052 are opened inside the support frames 205. The exhaust ports 2052 are connected to the second connecting pipe 102. The buffer pads 2051 are fixedly installed on the top of the support frames 205. The buffer pads 2051 are located on one side of the exhaust ports 2052. The buffer pads 2051 are ring-shaped. By setting the support frames 205, the processing material plate on the top of the processing table 2001 can be supported. By setting the exhaust ports 2052 connected to the second connecting pipe 102, when the negative pressure exhaust fan 1 is running, the processing material plate can be more stably adsorbed on the top of the support frames 205. By setting the buffer pads 2051, scratching the bottom of the processing material plate can be avoided.

[0023] The feeding mechanism is installed inside the welding box 2. There are two groups of feeding mechanisms. The two groups of feeding mechanisms are respectively located on one side of the processing table 2001. One group of feeding mechanisms is used to transport the processed material plates from the outside of the welding box 2 to the top of the processing table 2001, and the other group of feeding mechanisms is used to transport the processed material plates from the top of the processing table 2001 to the outside of the welding box 2 after processing.

[0024] In some embodiments, see Figure 6 , Figure 7 The feeding mechanism includes a fixed cover 202, two conveying rollers 2021, two rotating shafts 2022, two transmission wheels 2023, a transmission belt 2024 and a first servo motor 2025. The rotating shaft 2022 is rotatably connected to the inside of the welding box 2, the conveying roller 2021 is fixedly installed on the side wall of the rotating shaft 2022, the conveying roller 2021 is located on one side of the conveying hole 203, a transmission wheel 2023 is fixedly installed on the side wall of one end of the rotating shaft 2022, the transmission belt 2024 is installed on the side wall of the transmission wheel 2023, the two rotating shafts 2022 are connected through the transmission belt 2024 and the transmission wheel 2023, and the fixed cover 202 is fixedly installed at one end of the welding box 2.

[0025] The transmission wheel 2023 and the transmission belt 2024 are both located inside the fixed cover 202. The first servo motor 2025 is fixedly installed on one side of the fixed cover 202. One of the transmission wheels 2023 is fixedly installed at the output end of the first servo motor 2025. By setting the first servo motor 2025, one transmission wheel 2023 can be driven to rotate. When one of the transmission wheels 2023 is rotated through the transmission belt 2024, the other transmission wheel 2023 can be driven to rotate at the same time, so that the two rotating shafts 2022 and the conveying roller 2021 on the side wall can be rotated at the same time. When the processed material plate is placed in the conveying hole 203, the processed material plate can be conveyed by the rotation of the conveying roller 2021, so that the processed material plate is conveyed to the top of the processing table 2001.

[0026] Auxiliary conveying mechanism, the auxiliary conveying mechanism is installed on the top of the processing table 2001, and can play an auxiliary role when unloading materials and can play a conveying role when returning materials; In some embodiments, see Fig.14 , Fig.15 The auxiliary conveying mechanism includes a support roller 208, a bracket 2082 and a third spring 2083. A support groove 2081 is opened on one side of the top of the processing table 2001. One end of the third spring 2083 is fixedly installed at the bottom of the bracket 2082, and the other end of the third spring 2083 is fixedly installed on the inner wall of the support groove 2081. The bracket 2082 is movably connected to the inside of the support groove 2081 through the third spring 2083, and the support roller 208 is rotatably connected to the inside of the bracket 2082. By setting the third spring 2083, it can be used to support the bracket 2082. By installing the support roller 208 inside the bracket 2082, the processing material plate conveyed to the top of the processing table 2001 can be supported by the support roller 208, and the rolling of the support roller 208 can achieve the effect of auxiliary conveying.

[0027] In some embodiments, see Fig.14 , Fig.16 The auxiliary conveying mechanism also includes a plurality of rollers 2061, a plurality of movable frames 2062, a plurality of third servo motors 2063 and a plurality of third electric push rods 2064. A mounting groove 206 is provided at one end of the top of the processing table 2001. The third electric push rod 2064 is fixedly installed on the inner wall of the mounting groove 206. The movable frame 2062 is fixedly installed on the output end of the third electric push rod 2064. The third servo motor 2063 is fixedly installed on one side of the movable frame 2062.

[0028] The roller 2061 is fixedly installed at the output end of the third servo motor 2063. The roller 2061 is rotatably connected to the inside of the movable frame 2062 through the third servo motor 2063. The third electric push rod 2064 is arranged to control the lifting and lowering of the movable frame 2062. The height of the roller 2061 can be adjusted by controlling the lifting and lowering of the movable frame 2062, so that the processing plate on the top of the processing table 2001 can be lifted up. The third servo motor 2063 can be arranged to control the rotation of the roller 2061. The lifted processing plate can be transported by the rotation of the roller 2061 and transported to the outside of the welding box 2, thereby realizing the effect of automatic unloading and completing the processing of the processing plate.

[0029] The heating mechanism is installed inside the welding box 2, and the heating mechanism heats the processing material plate on the top of the processing table 2001 through the electric heating wire 2013.

[0030] In some embodiments, see Figure 3 , Figure 5 The heating mechanism includes a mounting frame 201, a first electric push rod 2011 and a mounting plate 2012. The mounting frame 201 is fixedly installed inside the welding box 2, the first electric push rod 2011 is fixedly installed inside the mounting frame 201, the mounting plate 2012 is fixedly installed at the output end of the first electric push rod 2011, the mounting plate 2012 corresponds to the processing table 2001, and the electric heating wire 2013 is fixedly installed at the bottom of the mounting plate 2012. By setting the first electric push rod 2011, it can be used to control the up and down movement of the mounting plate 2012, so as to control the distance between the electric heating wire 2013 at the bottom of the mounting plate 2012 and the top of the processing table 2001, so as to adjust the heating temperature of the processing material plate on the top of the processing table 2001.

[0031] The sealing mechanism 3 is installed on the top of the welding box 2. The sealing mechanism 3 seals the conveying hole 203 through the sealing plate 308 and the sealing gasket 307 on one side of the sealing plate 308; In some embodiments, see Figure 2 , Fig.17 , Fig.18 The sealing mechanism 3 includes a fourth electric push rod 301, a sliding plate 302, a connecting column 303, a connecting frame 304, a slider 306 and a fourth spring 309. The sliding plate 302 is fixedly installed at the output end of the fourth electric push rod 301. The connecting frame 304 is fixedly installed at the bottom of the sliding plate 302 through the connecting column 303. The connecting frame 304 is located on one side of the welding box 2. The slider 306 is fixedly installed on one side of the connecting frame 304. A slide groove 305 is opened on one side of the welding box 2, and the slider 306 is slidably connected inside the slide groove 305.

[0032] One end of the fourth spring 309 is fixedly installed inside the connecting frame 304, the sealing plate 308 is fixedly installed at the other end of the fourth spring 309, the sealing gasket 307 is fixedly installed on one side of the sealing plate 308, the sealing gasket 307 is matched with the conveying hole 203, and a through hole 310 is opened inside the sliding plate 302, and the through hole 310 is matched with the mounting frame 201. The sliding plate 302 is slidably connected to the side wall of the mounting frame 201 through the through hole 310 and the fourth electric push rod 301. By setting the fourth electric push rod 301, it can be used to control the sliding plate 302 to slide on the side wall of the mounting frame 201.

[0033] By extending the fourth electric push rod 301, the sliding plate 302 can be controlled to slide downward, so that the connecting frame 304 can slide downward together under the drive of the connecting column 303. When the connecting frame 304 moves to the bottom, the sealing plate 308 will be located on one side of the conveying hole 203. At this time, the sealing gasket 307 on one side of the sealing plate 308 will be inserted into the conveying hole 203 under the push of the fourth spring 309, so that the conveying hole 203 can be blocked and sealed. By completely inserting the sealing gasket 307 into the conveying hole 203, the sealing effect can be better, so that the inside of the welding box 2 is in a more stable negative pressure environment.

[0034] The floating auxiliary mechanism is installed inside the processing table 2001. The floating auxiliary mechanism floats through the floating plate 2046 to make the processing material plate on the top of the processing table 2001 shake slightly, so that the chip pins and the circuit board are in closer contact during the welding process.

[0035] In some embodiments, see Fig.10 , Fig.11 , Fig.12 , Fig.13 The floating auxiliary mechanism includes a plurality of floating tables 204, a plurality of connecting rods 2041, a plurality of first springs 20411, a plurality of fixed plates 2042, a plurality of rotating rods 2043, a plurality of cams 2044, a plurality of second electric push rods 2045, a plurality of contact members 2048, a plurality of limit plates 2049 and a plurality of second springs 20491. A plurality of first movable grooves 2002 are provided on the top of the processing table 2001, a second movable groove 2003 is provided at the bottom of the first movable groove 2002, and the rotating rod 2043 is rotatably connected inside the second movable groove 2003.

[0036] The cam 2044 is fixedly mounted on the side wall of the rotating rod 2043, the connecting rod 2041 is fixedly mounted on the bottom of the floating platform 204, the connecting rod 2041 is slidably connected to the inside of the first movable groove 2002, the fixed plate 2042 is fixedly mounted on the bottom of the connecting rod 2041, the fixed plate 2042 corresponds to the cam 2044, the first spring 20411 is fixedly mounted on the side wall of the connecting rod 2041, one end of the first spring 20411 contacts the inner wall of the second movable groove 2003, and the other end of the first spring 20411 contacts the inner wall of the second movable groove 2003. The tops of the fixed plates 2042 are in contact with each other, the second electric push rod 2045 is fixedly installed on the top of the floating platform 204, the floating plate 2046 is fixedly installed on the output end of the second electric push rod 2045, a plurality of movable cavities 2047 are opened on the top of the floating plate 2046, one end of the second spring 20491 is fixedly installed on the inner wall of the movable cavity 2047, the limit plate 2049 is fixedly installed on the other end of the second spring 20491, and the limit plate 2049 is movably connected inside the movable cavity 2047 through the second spring 20491.

[0037] The contact piece 2048 is fixedly installed on the top of the limit plate 2049. The contact piece 2048 is hemispherical. By setting the rotating rod 2043, the cam 2044 can be driven to rotate inside the second movable groove 2003. When the cam 2044 rotates inside the second movable groove 2003, when the protrusion of the cam 2044 rotates to the top, the fixed plate 2042 can be pushed to move upward, so that the connecting rod 2041 can drive the floating platform 204 to move upward. By setting the first spring 20411, the fixed plate 2042 can be supported, so that when the protrusion of the cam 2044 rotates to the bottom, the fixed plate 2042 can move downward under the push of the first spring 20411, so that the floating platform 204 repeatedly floats up and down. At the same time, the contact piece 2048 inside the floating plate 2046 at the top of the floating platform 204 contacts the bottom of the processing sheet, so that the processing sheet on the top of the processing table 2001 is slightly shaken, so that the processing sheet and the top chip pin welding contact is closer.

[0038] By setting a second spring 20491, the contact piece 2048 can be supported, so that the contact piece 2048 can push the processed sheet material while avoiding excessive force on the processed sheet material, thereby avoiding excessive vibration of the processed sheet material affecting welding. By setting a second electric push rod 2045, the distance between the floating plate 2046 and the floating table 204 can be adjusted, thereby adjusting the distance between the floating plate 2046 and the bottom of the processed sheet material. The height of the floating plate 2046 is adjusted according to the size of the chip welded on the top of the processed sheet material. When the chip is larger, the distance between the floating plate 2046 and the processed sheet material is smaller, thereby ensuring the auxiliary effect.

[0039] In some embodiments, see Fig.10 , Fig.11A synchronous wheel 2073 is fixedly installed on the side wall of one end of several rotating rods 2043, and teeth 2074 are fixedly installed inside the synchronous wheel 2073. A synchronous belt 2075 is installed on the side wall of the synchronous wheel 2073, and the synchronous belt 2075 is matched with the teeth 2074. Several rotating rods 2043 are connected by transmission through the synchronous wheel 2073 and the synchronous belt 2075. A mounting cover 207 is fixedly installed on one side of the processing table 2001, and the synchronous wheel 2073 and the synchronous belt 2075 are both located inside the mounting cover 207. A fourth servo motor 2072 is fixedly installed on one side of the welding box 2.

[0040] A transmission rod 2071 is fixedly installed at one end of one of the synchronous wheels 2073, and the transmission rod 2071 is fixedly installed on the output end of the fourth servo motor 2072. By setting the fourth servo motor 2072, the transmission rod 2071 can be driven to rotate, thereby driving one of the rotating rods 2043 to rotate. Through the engagement of the synchronous belt 2075 with the teeth 2074 inside the synchronous wheel 2073, several rotating rods 2043 can be driven to rotate at the same time, so that several floating tables 204 can float at the same time under the push of the cam 2044, so that the processed sheet on the top of the processing table 2001 can be more comprehensively and slightly shaken.

[0041] The working process and principle of the present invention are as follows: when in use, the processed sheet material is inserted into the conveying hole 203 on one side of the welding box 2, and a transmission wheel 2023 is driven to rotate by the first servo motor 2025. When one of the transmission wheels 2023 is rotated by the transmission belt 2024, the other transmission wheel 2023 can be driven to rotate at the same time, so that the two rotating shafts 2022 and the conveying roller 2021 on the side wall can rotate at the same time. After the processed sheet material is placed in the conveying hole 203, the processed sheet material can be conveyed by the rotation of the conveying roller 2021, so that the processed sheet material is conveyed to the top of the processing table 2001.

[0042] By setting a third spring 2083, the bracket 2082 can be used to support the bracket 2082. By installing a support roller 208 inside the bracket 2082, the support roller 208 can support the processing material plate transported to the top of the processing table 2001. The rolling of the support roller 208 can assist in transportation. The support frame 205 can support the processing material plate on the top of the processing table 2001. After that, the fourth electric push rod 301 can be extended to control the sliding plate 302 to slide downward, so that the connecting frame 304 can slide downward together with the connecting column 303.

[0043] When the connecting frame 304 moves to the bottom, the sealing plate 308 will be located on one side of the conveying hole 203. At this time, the sealing gasket 307 on one side of the sealing plate 308 will be stuck in the conveying hole 203 under the push of the fourth spring 309, so that the conveying hole 203 can be blocked and sealed. At this time, the negative pressure exhaust fan 1 starts to extract the internal air of the welding box 2 through the first connecting pipe 101, so that the inside of the welding box 2 is in a negative pressure environment, and the exhaust port 2052 connected by the second connecting pipe 102 can more stably adsorb the processing material plate on the top of the support frame 205. By setting the first electric push rod 2011, it can be used to control the up and down movement of the mounting plate 2012, and can be used to control the distance between the electric heating wire 2013 at the bottom of the mounting plate 2012 and the top of the processing table 2001, so that the heating temperature of the processing material plate on the top of the processing table 2001 can be adjusted for welding.

[0044] During the welding process, the fourth servo motor 2072 can be set to drive the transmission rod 2071 to rotate, thereby driving one of the rotating rods 2043 to rotate. The synchronous belt 2075 is engaged with the teeth 2074 inside the synchronous wheel 2073, which can drive several rotating rods 2043 to rotate at the same time, so that several floating tables 204 can float at the same time under the push of the cam 2044, so that the processed sheet on the top of the processing table 2001 can be shaken slightly more comprehensively, so that the processed sheet and the top chip pin welding contact is closer. After the welding is completed, the fourth electric push rod 301 shrinks and the connecting frame 304 moves upward, so that the welding box 2 is connected to the outside through the conveying hole 203.

[0045] At this time, the third electric push rod 2064 can be set to control the lifting of the movable frame 2062. By controlling the lifting of the movable frame 2062, the height of the roller 2061 can be adjusted, so that the processing plate on the top of the processing table 2001 can be lifted up. By setting the third servo motor 2063, the rotation of the roller 2061 can be controlled. The lifted processing plate can be transported by the rotation of the roller 2061 and transported to the outside of the welding box 2, thereby realizing the effect of automatic unloading and completing the processing of the processing plate.

[0046] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A vacuum reflow soldering device for semiconductor substrate processing, characterized in that: include: A negative pressure exhaust fan (1), the negative pressure exhaust fan (1) being installed on the ground, and a first connecting pipe (101) and a second connecting pipe (102) being installed at the output end of the negative pressure exhaust fan (1); A welding box (2), the welding box (2) being mounted on top of the negative pressure exhaust fan (1), the top of the first connecting pipe (101) extending into the interior of the welding box (2), the welding box (2) forming a hollow cavity, the first connecting pipe (101) being connected to the interior of the welding box (2), and conveying holes (203) for conveying processed material plates being provided on both sides of the welding box (2); A processing table (2001), the processing table (2001) is installed in the internal cavity of the welding box (2), the second connecting pipe (102) extends into the interior of the processing table (2001), and the processing table (2001) is used to place a processing material plate; An adsorption support mechanism, the adsorption support mechanism is installed on the top of the processing table (2001) and is used to perform adsorption support on the processing material plate on the top of the processing table (2001); A feeding mechanism, the feeding mechanism being installed inside the welding box (2), the feeding mechanism being provided with two groups, the two groups of feeding mechanisms being located on one side of the processing table (2001), respectively, one group of the feeding mechanisms being used to transport the processed material plates from the outside of the welding box (2) to the top of the processing table (2001), and the other group of the feeding mechanisms being used to transport the processed material plates from the top of the processing table (2001) to the outside of the welding box (2) after processing; An auxiliary conveying mechanism, the auxiliary conveying mechanism being installed on the top of the processing table (2001), and playing an auxiliary role when unloading materials and a conveying role when withdrawing materials; A heating mechanism, the heating mechanism being installed inside the welding box (2), the heating mechanism heating the processing material plate on the top of the processing table (2001) through an electric heating wire (2013); A sealing mechanism (3), the sealing mechanism (3) being mounted on the top of the welding box (2), the sealing mechanism (3) sealing the conveying hole (203) through a sealing plate (308) and a sealing gasket (307) on one side of the sealing plate (308); A floating auxiliary mechanism, the floating auxiliary mechanism being installed inside the processing table (2001), the floating auxiliary mechanism floating through a floating plate (2046) causing the processing material plate on the top of the processing table (2001) to vibrate slightly; The floating auxiliary mechanism comprises a plurality of floating platforms (204), a connecting rod (2041), a first spring (20411), a fixed plate (2042), a rotating rod (2043), a cam (2044), a second electric push rod (2045), a contact piece (2048), a limit plate (2049) and a second spring (20491); a plurality of first movable grooves (2002) are provided on the top of the processing platform (2001); a second movable groove (2003) is provided on the bottom of the first movable groove (2002); the rotating rod (2043) is rotatably connected inside the second movable groove (2003); and the cam (2044) is fixedly mounted on the side wall of the rotating rod (2043); The connecting rod (2041) is fixedly mounted on the bottom of the floating platform (204), the connecting rod (2041) is slidably connected inside the first movable groove (2002), the fixing plate (2042) is fixedly mounted on the bottom of the connecting rod (2041), the fixing plate (2042) corresponds to the cam (2044), and the first spring (20411) is sleeved and mounted on the outer wall of the connecting rod (2041), so that one end of the first spring (20411) contacts the inner wall of the second movable groove (2003) and contacts the top of the fixing plate (2042); The second electric push rod (2045) is fixedly mounted on the top of the floating platform (204), the floating plate (2046) is fixedly mounted on the output end of the second electric push rod (2045), a plurality of movable cavities (2047) with openings facing upward are provided on the top of the floating plate (2046), one end of the second spring (20491) is fixedly mounted on the bottom of the movable cavity (2047), the other end of the second spring (20491) is limited at the upper part of the movable cavity (2047) by a limiting plate (2049), and the limiting plate (2049) is movably connected to the inside of the movable cavity (2047) by the second spring (20491).

2. The vacuum reflow soldering device for semiconductor substrate processing according to claim 1, characterized in that: The contact piece (2048) is a hemispherical structure, and the top of the contact piece (2048) protrudes from the upper surface of the floating plate (2046).

3. The vacuum reflow soldering device for semiconductor substrate processing according to claim 2, characterized in that: A synchronous wheel (2073) is fixedly mounted on the side wall of one end of a plurality of the rotating rods (2043), and teeth (2074) are fixedly mounted on the outer circumference of the synchronous wheel (2073). The synchronous belt (2075) is synchronously mounted with the plurality of sets of synchronous wheels (2073) at the same time, and the synchronous belt (2075) is matched with the teeth (2074). The plurality of the rotating rods (2043) are driven by the synchronous wheel (2073) and the synchronous belt (2075). A mounting cover (207) is fixedly mounted on one side of the processing table (2001), the synchronous wheel (2073) and the synchronous belt (2075) are both located inside the mounting cover (207), a fourth servo motor (2072) is fixedly mounted on one side of the welding box (2), a transmission rod (2071) is fixedly mounted on one end of the synchronous wheel (2073) located at the end, and the transmission rod (2071) is fixedly mounted on the output end of the fourth servo motor (2072).

4. The vacuum reflow soldering device for semiconductor substrate processing according to claim 1, characterized in that: The adsorption support mechanism comprises four support frames (205) and a plurality of buffer pads (2051); the support frames (205) are fixedly mounted at the four corners of the top of the processing table (2001); a plurality of air exhaust ports (2052) are provided inside the support frames (205); the air exhaust ports (2052) are connected to the second connecting pipe (102); the buffer pads (2051) are fixedly mounted on the top of the support frames (205); the buffer pads (2051) are located on one side of the air exhaust ports (2052); and the buffer pads (2051) are in the shape of a circular ring.

5. The vacuum reflow soldering device for semiconductor substrate processing according to claim 1, characterized in that: The feeding mechanism comprises a fixed cover (202), two conveying rollers (2021), two rotating shafts (2022), two transmission wheels (2023), a transmission belt (2024) and a first servo motor (2025); the rotating shaft (2022) is rotatably connected to the inside of the welding box (2); the conveying rollers (2021) are fixedly mounted on both sides of the rotating shaft (2022) and the upper surface of the conveying rollers (2021) and the rotating shaft (2022) are kept in the same plane; the conveying rollers (2021) are located on one side of the conveying hole (203); A transmission wheel (2023) is fixedly mounted on the side wall of one end of the rotating shaft (2022); the transmission belt (2024) is mounted on the side wall of the transmission wheel (2023); the two rotating shafts (2022) are transmission-connected via the transmission belt (2024) and the transmission wheel (2023); the fixed cover (202) is fixedly mounted on one end of the welding box (2); the transmission wheel (2023) and the transmission belt (2024) are both located and covered by the fixed cover (202); the first servo motor (2025) is fixedly mounted on one side of the fixed cover (202); and one of the transmission wheels (2023) is fixedly mounted on the output end of the first servo motor (2025).

6. The vacuum reflow soldering device for semiconductor substrate processing according to claim 1, characterized in that: The auxiliary conveying mechanism comprises a support roller (208), a bracket (2082) and a third spring (2083); a support groove (2081) is provided on one side of the top of the processing table (2001); one end of the third spring (2083) is fixedly mounted on the bottom of the bracket (2082); the other end of the third spring (2083) is fixedly mounted on the inner wall of the support groove (2081); the bracket (2082) is movably connected to the inside of the support groove (2081) via the third spring (2083); and the support roller (208) is rotatably connected to the inside of the bracket (2082).

7. The vacuum reflow soldering device for semiconductor substrate processing according to claim 1, characterized in that: The auxiliary conveying mechanism further comprises a plurality of rollers (2061), a movable frame (2062), a third servo motor (2063) and a third electric push rod (2064); a mounting groove (206) is provided at one end of the top of the processing table (2001); the third electric push rod (2064) is fixedly mounted on the inner wall of the mounting groove (206); the movable frame (2062) is fixedly mounted on the output end of the third electric push rod (2064); the third servo motor (2063) is fixedly mounted on one side of the movable frame (2062); the roller (2061) is fixedly mounted on the output end of the third servo motor (2063); and the roller (2061) is rotatably connected to the inside of the movable frame (2062) via the third servo motor (2063).

8. The vacuum reflow soldering device for semiconductor substrate processing according to claim 1, characterized in that: The heating mechanism comprises a mounting frame (201), a first electric push rod (2011) and a mounting plate (2012); the mounting frame (201) is fixedly mounted inside the welding box (2); the first electric push rod (2011) is fixedly mounted inside the mounting frame (201); the mounting plate (2012) is fixedly mounted on the output end of the first electric push rod (2011); the mounting plate (2012) corresponds to the processing table (2001); and the electric heating wire (2013) is fixedly mounted on the bottom of the mounting plate (2012).

9. The vacuum reflow soldering device for semiconductor substrate processing according to claim 8, characterized in that: The sealing mechanism (3) comprises a fourth electric push rod (301), a sliding plate (302), a connecting column (303), a connecting frame (304), a slider (306) and a fourth spring (309); the sliding plate (302) is fixedly mounted on the output end of the fourth electric push rod (301); the connecting frame (304) is fixedly mounted on the bottom of the sliding plate (302) via the connecting column (303); and the connecting frame (304) is located on the side of the welding box (2); The slider (306) is fixedly mounted on the inner side of the connecting frame (304); a slide groove (305) is provided on one side of the welding box (2); the slider (306) is slidably connected inside the slide groove (305); one end of the fourth spring (309) is fixedly mounted inside the connecting frame (304); the sealing plate (308) is fixedly mounted on the other end of the fourth spring (309); the sealing gasket (307) is fixedly mounted on one side of the sealing plate (308); and the sealing gasket (307) is fitted with the conveying hole (203).

10. The vacuum reflow soldering device for semiconductor substrate processing according to claim 9, characterized in that: A through hole (310) is provided inside the sliding plate (302), the through hole (310) matches the mounting frame (201), and the sliding plate (302) is slidably connected to the side wall of the mounting frame (201) via the through hole (310) and the fourth electric push rod (301).

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