Ceramic chopper IC angle machining profiling cutter grinding equipment

Abstract

The invention relates to the technical field of ceramic chopper manufacturing, in particular to ceramic chopper I / C angle machining profiling cutter grinding equipment. The rotary pneumatic chuck is used for receiving and clamping the to-be-formed profiling tool, and the rotary pneumatic chuck drives the to-be-formed profiling tool to execute follow-up circumferential rotating motion under the action of the rotating torque. The multi-degree-of-freedom bearing table has the sliding motion degree of freedom and the circumferential rotation degree of freedom at the same time, and the chamfering and grinding machining unit can occupy the correct machining position. The automatic feeding unit is used for intermittently supplying the profiling tool to be formed to the rotary pneumatic chuck. Thus, on one hand, a traditional manual feeding mode is abandoned, the time consumed for feeding is greatly shortened, and the phenomenon that the to-be-formed profiling cutter is subjected to flexible deformation due to the over-limited hand force effect is avoided; and on the other hand, a power source for clamping and releasing actions of the rotary pneumatic chuck is compressed gas, the execution speed is extremely high, the clamping force depends on the pressure intensity value of the compressed gas, and the rotary pneumatic chuck has an overload protection function.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic splitting cutter manufacturing, in particular to a ceramic splitting cutter IC angle processing profiling tool grinding device. Background Art

[0002] Ceramic choppers are used in the Cob packaging process, and according to the specific process requirements, the IC angle of the ceramic chopper is also different (such as Figure 1 In actual forming, a profiling tool (usually a 3 mm tungsten steel round bar) is required to form the IC angle on the ceramic chopper.

[0003] As far as the current status of the industry is concerned, given that the diameter of the profiling tool is extremely small and the material hardness is extremely high, there is no complete set of equipment on the market. A few years ago, our company cooperated with universities to develop a special grinding equipment for profiling tools for IC angle processing of ceramic splitters. After nearly two years of field verification in the workshop, it has the following problems: the loading operation of tungsten steel round bars is implemented manually, and mechanical chucks are used for clamping. Due to the extremely small diameter of the tungsten steel round bars, it is not easy for workers to pick them up, and the work efficiency is low. In the process of picking up, the tungsten steel round bars are very easy to bend and deform due to the excessive force. Furthermore, in the process of clamping the tungsten steel round bars with mechanical chucks, workers rely solely on experience to tighten them, and it is difficult to accurately control the tightening force. The outer wall of the tungsten steel round bar is very easy to be damaged or plastically deformed due to improper extrusion force, which will inevitably lead to a high scrap rate of profiling tools. Therefore, it is urgent for technical personnel to solve the above problems. Summary of the invention

[0004] Therefore, in view of the above-mentioned existing problems and defects, the designers of the present invention collected relevant information, conducted multiple evaluations and considerations, and continued to experiment and modify after many years of R&D experience in this industry, which ultimately led to the emergence of the ceramic chopper IC angle processing profiling tool grinding equipment.

[0005] In order to solve the above technical problems, the present invention relates to a ceramic chopper IC angle processing profiling tool grinding equipment, including a bearing seat, a rotary pneumatic chuck, a first power unit, a multi-degree-of-freedom bearing platform, a chamfering grinding unit and an automatic feeding unit. The rotary pneumatic chuck is used to receive and clamp the profiling tool to be formed, and it is installed on the bearing seat. The first power unit is arranged at the rear of the bearing seat to continuously input the rotational torque to the rotary pneumatic chuck, so that the profiling tool to be formed can perform a follow-up circumferential rotation motion. The multi-degree-of-freedom bearing platform is used to bear the chamfering grinding unit, and it is arranged on the left side of the bearing seat. The multi-degree-of-freedom bearing platform has both the sliding motion freedom and the circumferential rotation freedom, so that the chamfering grinding unit can occupy the correct processing position relative to the profiling tool to be formed. The automatic feeding unit is used to intermittently supply the profiling tool to be formed to the rotary pneumatic chuck, and it is arranged on the right side of the bearing seat.

[0006] As a further improvement of the technical solution disclosed in the present invention, the automatic feeding unit includes a base, a silo, a material distribution mechanism and a material pushing mechanism. The silo is used to receive and accommodate the profiling tools to be formed in batches, and the silo is installed on the base. The material distribution mechanism is matched with the silo, and at a certain moment in the process of the circumferential rotation, a certain profiling tool to be formed is isolated and keeps a positive position with the material pushing mechanism. With the help of the pushing force of the material pushing mechanism, the profiling tool to be formed can be transferred from the silo to the rotary pneumatic chuck.

[0007] As a further improvement of the technical solution disclosed in the present invention, the material distribution mechanism includes a material distribution column, a power shaft and a second power unit. The power shaft is assembled on the base, crosses the material bin, and performs circumferential rotation due to the torque from the second power unit. The material distribution column is built into the material bin and is coaxially mounted with the power shaft. A material storage groove is formed on the circumferential side wall of the material distribution column. The material storage groove is only allowed to accommodate a single profiling tool to be formed, and the number of the profiling tool is multiple and evenly distributed around the central axis of the material distribution column.

[0008] As a further improvement of the technical solution disclosed in the present invention, the second power unit includes a second motor and a second belt transmission mechanism. The rotational torque generated by the second motor is transmitted to the power shaft via the second belt transmission mechanism.

[0009] As a further improvement of the technical solution disclosed in the present invention, the pusher mechanism includes a thrust cylinder and a pusher rod. The pusher rod crosses the material bin and is coaxial with the rotary pneumatic chuck. At a certain moment in the process of the material distribution column performing the circumferential rotation movement, the pusher rod is aligned with a certain material storage slot, and it can enter or escape from the material storage slot under the push force from the thrust cylinder.

[0010] As a further improvement of the technical solution disclosed in the present invention, the first power unit includes a first motor and a first belt transmission mechanism. The rotational torque generated by the first motor is transmitted to the rotary pneumatic chuck via the first belt transmission mechanism.

[0011] As a further improvement of the technical solution disclosed in the present invention, the multi-degree-of-freedom carrier is composed of a manual translation slide and a rotary carrier. The rotary carrier is used to directly support the chamfer grinding processing unit, which is assembled on the manual translation slide and can perform circumferential rotation when subjected to a rotational torque.

[0012] As a further improvement of the technical solution disclosed in the present invention, the ceramic chopper IC angle processing profiling tool grinding equipment also includes a visual sensor. The visual sensor is used to monitor in real time whether the profiling tool to be formed is extended from the rotary pneumatic chuck and whether the extension length of the profiling tool to be formed meets the expected value.

[0013] In practical applications, the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention can achieve at least the following beneficial technical effects, specifically:

[0014] 1) Abandoning the traditional worker feeding mode, the automatic feeding unit is used to intermittently supply the profiling tool to be formed to the rotary pneumatic chuck. In this way, on the one hand, the time required for loading a single product can be greatly shortened, and the design goal of liberating workers from tedious and delicate work is achieved, which is conducive to reducing the processing cost of the profiling tool; on the other hand, during the loading process, the occurrence of flexural deformation of the profiling tool to be formed due to excessive hand force can be effectively avoided;

[0015] 2) The power source for the clamping and releasing action of the rotary pneumatic chuck is compressed gas, which is executed very quickly, and the clamping claw inside it has a certain elasticity. When the compressed gas enters the rotary pneumatic chuck, the clamping claw is driven to perform radial contraction movement until the circumferential holding of the profiling tool to be formed is achieved. Furthermore, the clamping force of the rotary pneumatic chuck depends on the pressure value of the compressed gas, and it has an overload protection function, which can effectively prevent the outer wall of the profiling tool to be formed from being damaged or plastically deformed due to improper extrusion pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 The figure is a schematic diagram of the structure of the ceramic splitting knife involved in the present invention.

[0018] Figure 2 It is a three-dimensional schematic diagram of the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention.

[0019] Figure 3 It is a stereoscopic schematic diagram from one perspective of a rotary pneumatic chuck in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention.

[0020] Figure 4 It is a stereoscopic schematic diagram from another perspective of the rotary pneumatic chuck in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention.

[0021] Figure 5 It is a three-dimensional schematic diagram of the first power unit in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention (the rotary pneumatic chuck is indicated in the form of double-dotted lines).

[0022] Figure 6 It is a three-dimensional schematic diagram of a multi-degree-of-freedom support platform in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention from one perspective (the chamfering grinding processing unit is indicated in the form of double-dotted lines).

[0023] Figure 7 It is a three-dimensional schematic diagram from another perspective of the multi-degree-of-freedom support platform in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention (the chamfering grinding processing unit is indicated in the form of double-dotted lines).

[0024] Figure 8 It is a stereoscopic schematic diagram from one viewing angle of the automatic feeding unit in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention.

[0025] Fig. 9 It is a stereoscopic schematic diagram from another perspective of the automatic feeding unit in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention.

[0026] Fig.10 It is a cross-sectional view of an automatic feeding unit in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention.

[0027] Fig.11 It is also a three-dimensional schematic diagram of the automatic feeding unit in the ceramic chopper IC angle processing profiling tool grinding equipment disclosed in the present invention (with the material bin hidden).

[0028] Fig.12 It is a three-dimensional schematic diagram of a material dividing column in the ceramic splitter IC angle processing profiling tool grinding equipment disclosed in the present invention.

[0029] 1-bearing seat; 2-rotating pneumatic chuck; 3-first power unit; 31-first motor; 32-first belt transmission mechanism; 4-multi-degree-of-freedom bearing platform; 41-manual translation slide; 42-rotating bearing platform; 5-chamfering and grinding processing unit; 6-automatic feeding unit; 61-base; 62-bin; 63-material dividing mechanism; 631-material dividing column; 6311-material storage groove; 632-power shaft; 633-second power unit; 6331-second motor; 6332-second belt transmission mechanism; 64-pushing mechanism; 641-thrust cylinder; 642-pushing rod; 7-visual sensor. DETAILED DESCRIPTION

[0030] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "left", "right", "front", "back", "up", "down", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0031] The present invention will be further described in detail below in conjunction with specific embodiments. Figure 2 The three-dimensional schematic diagram of the ceramic chipper IC angle processing profiling tool grinding device disclosed in the present invention is shown, and it can be seen that it is mainly composed of a bearing seat 1, a rotary pneumatic chuck 2, a first power unit 3, a multi-degree-of-freedom bearing platform 4, a chamfering grinding unit 5 and an automatic feeding unit 6. Among them, the rotary pneumatic chuck 2 (such as Figure 3 , 4 The first power unit 3 is arranged behind the support base 1 to continuously input the rotation torque to the rotary pneumatic chuck 2, so that the profiling tool to be formed can perform a follow-up circumferential rotation motion. Figure 5 As shown in FIG. 1 , the first power unit 3 is mainly composed of a first motor 31 and a first belt transmission mechanism 32. The rotational torque generated by the first motor 31 is transmitted to the rotary pneumatic chuck 2 via the first belt transmission mechanism 32. The multi-degree-of-freedom support platform 4 is used to support the chamfering grinding unit 5, and is arranged on the left side of the support seat 1. The multi-degree-of-freedom support platform 4 is composed of a manual translation slide 41 and a rotary support platform 42 (as shown in FIG. Figure 6 , 7). The rotary carrier 42 is used to directly support the chamfering and grinding unit 5, which is assembled on the manual translation slide 41 and can perform circumferential rotation when subjected to a rotational torque, so that the chamfering and grinding unit 5 can occupy the correct processing position relative to the profiling tool to be formed. The automatic feeding unit 6 is used to intermittently supply the profiling tool to be formed to the rotary pneumatic chuck 2, and it is arranged on the right side of the carrier 1.

[0032] By adopting the above technical solution, the traditional worker feeding mode is abandoned, and the automatic feeding unit 6 is used to intermittently supply the profiling tool to be formed to the rotary pneumatic chuck 2. In this way, on the one hand, the time required for loading the profiling tool to be formed can be greatly shortened, and the design goal of freeing workers from tedious and delicate work is achieved, which is conducive to reducing the processing cost of the profiling tool; on the other hand, during the loading process, the occurrence of flexural deformation of the profiling tool to be formed due to excessive hand force can be effectively avoided;

[0033] Here, it should also be noted that the power source for the clamping and releasing actions of the rotary pneumatic chuck 2 is compressed gas, which is executed at an extremely fast speed, and the clamping claws inside it have a certain elasticity. When the compressed gas enters the rotary pneumatic chuck 2, the clamping claws are driven to perform radial contraction movement until the circumferential holding of the profiling tool to be formed is achieved. Furthermore, the clamping force of the rotary pneumatic chuck 2 depends on the pressure value of the compressed gas, and it has an overload protection function, which can effectively prevent the outer wall of the profiling tool to be formed from being damaged or plastically deformed due to improper extrusion force.

[0034] As a further refinement of the above technical solution, Figure 8 As shown in the figure, the automatic feeding unit 6 is mainly composed of a base 61, a silo 62, a material distribution mechanism 63 and a material pushing mechanism 64. The silo 62 is open at the top and is used to receive and accommodate the profiling tools to be formed in batches, and the silo 62 is installed on the base 61. The material distribution mechanism 63 is matched with the silo 62. At a certain moment in the process of the circumferential rotation, a certain profiling tool to be formed is isolated and keeps a positive position with the material pushing mechanism 64. With the help of the pushing force of the material pushing mechanism 64, the profiling tool to be formed can be transferred from the silo 62 to the rotary pneumatic chuck 2.

[0035] like Fig.10 , 11As shown in , the material distribution mechanism 63 is mainly composed of several parts such as a material distribution column 631, a power shaft 632 and a second power unit 633. The power shaft 632 is assembled on the base 61, which crosses the material bin 62 and performs circumferential rotation due to the torque from the second power unit 633. The material distribution column 631 is built into the material bin 62, and is coaxially mounted with the power shaft 632. A material holding groove 6311 is formed on the circumferential side wall of the material distribution column 631. The outer dimensions of the material holding groove 6311 are adapted to the profiling tool to be formed, and only a single profiling tool to be formed is allowed to be accommodated. There are multiple material holding grooves 6311, and they are evenly distributed circumferentially around the central axis of the material distribution column 631 (such as Fig.12 ).

[0036] like Figure 8-11 As shown in the figure, the push mechanism 64 is mainly composed of a thrust cylinder 641 and a push rod 642. The push rod 642 crosses the bin 62 and is coaxial with the rotary pneumatic chuck 2. At a certain moment in the process of the material distribution column 631 performing the circumferential rotation, the push rod 642 is aligned with a certain material storage slot 6311, and it can enter or escape from the material storage slot 6311 under the push force from the thrust cylinder 641.

[0037] like Fig.11 As shown in FIG. 6 , the second power unit 633 is mainly composed of a second motor 6331 and a second belt transmission mechanism 6332. The rotational torque generated by the second motor 6331 is transmitted to the power shaft via the second belt transmission mechanism 6332.

[0038] The working principle of the automatic feeding unit 6 is as follows: first, the profiling tools to be formed are put into the hopper 62 in batches; the second motor 6331 is started, and the power shaft 632 drives the dividing column 631 to perform circumferential rotation due to the rotational torque, and some profiling tools to be formed are guided under the action of the force and enter the material storage groove 6311; at a certain moment, the dividing column 631 stops rotating, at this time, a certain profiling tool to be formed is exactly aligned with the push rod 642; the thrust cylinder 641 is started, and the push rod 642 performs axial displacement due to the driving force, and the profiling tool to be formed is able to escape from the material storage groove 6311 and enter the rotary pneumatic chuck 2.

[0039] From the above description, it can be seen that in the process of the material dividing column 631 continuously performing the circumferential rotation motion, the disordered profiling tools to be formed in the material bin 62 automatically correct themselves and enter the material receiving groove 6311 to realize isolated material dividing. In this way, on the one hand, it not only effectively ensures that the feeding rhythm matches the processing rhythm of the chamfering and grinding processing unit 5, but also relaxes the requirements for workers' work experience and reduces the requirements for labor precision; on the other hand, whether it is the isolated material dividing stage or the loading stage, the external force exerted on the profiling tool to be formed is within the controllable range, thereby effectively avoiding the occurrence of its flexible deformation phenomenon.

[0040] Finally, it should be noted that Figure 2 As shown in , the ceramic chopper IC angle processing profiling tool grinding equipment is also equipped with a visual sensor 7. The visual sensor 7 is used to monitor in real time whether the profiling tool to be formed is extended from the rotary pneumatic chuck 2 and whether the extension length of the profiling tool to be formed meets the expected value, ensuring that the subsequent grinding work can be carried out smoothly.

[0041] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A ceramic chopper IC angle processing profiling tool grinding equipment, characterized in that: The invention comprises a bearing seat, a rotary pneumatic chuck, a first power unit, a multi-degree-of-freedom bearing platform, a chamfering grinding unit and an automatic feeding unit; the rotary pneumatic chuck is used to receive and clamp the profiling tool to be formed, and the bearing seat is used as the installation basis; the first power unit is arranged behind the bearing seat to continuously input the rotational torque to the rotary pneumatic chuck, so that the profiling tool to be formed can perform the follow-up circumferential rotation motion; The multi-degree-of-freedom support platform is used to bear the chamfer grinding processing unit, and is arranged on the left side of the support seat; the multi-degree-of-freedom support platform has both sliding movement freedom and circumferential rotation freedom, so that the chamfer grinding processing unit can occupy the correct processing position relative to the profiling tool to be formed; the automatic feeding unit is used to intermittently supply the profiling tool to be formed to the rotary pneumatic chuck, and is arranged on the right side of the support seat.

2. According to claim 1, the ceramic chopper IC angle processing profiling tool grinding equipment is characterized in that: The automatic feeding unit includes a base, a silo, a material dividing mechanism and a material pushing mechanism; the silo is used to receive and accommodate the profiling tools to be formed in batches, and the silo takes the base as the installation basis; the material dividing mechanism is matched with the silo, and at a certain moment in the process of its circumferential rotation motion, a certain profiling tool to be formed is isolated and keeps a positive position with the material pushing mechanism; with the help of the pushing force of the material pushing mechanism, the profiling tool to be formed can be transferred from the silo to the rotary pneumatic chuck.

3. According to claim 2, the ceramic splitter IC angle processing profiling tool grinding equipment is characterized in that: The material distribution mechanism includes a material distribution column, a power shaft and a second power unit; the power shaft is assembled with the base as the basis, crosses the material bin, and performs circumferential rotation due to the torque from the second power unit; the material distribution column is built into the material bin, and is coaxially mounted with the power shaft as a whole; a material accommodating groove is formed on the circumferential side wall of the material distribution column; the material accommodating groove is only allowed to accommodate a single profiling tool to be formed, and the number of the profiling tool is multiple and evenly distributed around the central axis of the material distribution column.

4. According to claim 3, the ceramic splitter IC angle processing profiling tool grinding equipment is characterized in that: The second power unit includes a second motor and a second belt transmission mechanism; the rotational torque generated by the second motor is transmitted to the power shaft via the second belt transmission mechanism.

5. According to claim 3, the ceramic chopper IC angle processing profiling tool grinding equipment is characterized in that: The pushing mechanism includes a thrust cylinder and a pushing rod; the pushing rod crosses the material bin and is coaxial with the rotary pneumatic chuck; at a certain moment in the process of the circumferential rotation of the material distribution column, the pushing rod is aligned with a certain material storage slot, and can enter or escape from the material storage slot under the pushing force from the thrust cylinder.

6. The ceramic chopper IC angle processing profiling tool grinding equipment according to any one of claims 1 to 5, characterized in that: The first power unit includes a first motor and a first belt transmission mechanism; the rotational torque generated by the first motor is transmitted to the rotary pneumatic chuck via the first belt transmission mechanism.

7. The ceramic chopper IC angle processing profiling tool grinding equipment according to any one of claims 1 to 5, characterized in that: The multi-degree-of-freedom support platform is composed of a manual translation slide and a rotary support platform; the rotary support platform is used to directly support the chamfer grinding processing unit, which is assembled based on the manual translation slide and can perform circumferential rotation when subjected to a rotational torque.

8. The ceramic chopper IC angle processing profiling tool grinding equipment according to any one of claims 1 to 5, characterized in that: It also includes a visual sensor; the visual sensor is used to monitor in real time whether the profiling tool to be formed is extended from the rotary pneumatic chuck and whether the extended length of the profiling tool to be formed meets the expected value.

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