Hidden heating system

Abstract

The invention discloses a hidden heating system, which relates to the field of heating and comprises a heating module and a control module, the nanometer heating layer in the heating module is connected with the control module through a wire, the control module executes control operation, and the control operation comprises monitoring and adjusting the working process of the nanometer heating layer, specifically, monitoring and adjusting the nanometer heating layer to generate heat energy according to the electrothermal effect and releasing the heat energy to the surrounding environment. The heating main body of the hidden heating system is only a layer of thin film which is hundreds of nanometers or even thinner, a gas pipeline, a water pipeline, an electric heating wire and a device main body which occupies a large volume in the prior art are omitted, the thin film can be attached to any place with heating requirements, the occupied space is small, the thin film is very hidden, and a user cannot perceive the thin film.

Description

Technical Field

[0001] The present application relates to the field of heating, and in particular to a hidden heating system. Background Art

[0002] With the development of economy and technology, people's quality of life has gradually improved. In the cold winter, there are various ways to heat: there are mainly three heating methods: water heating, electric heating and gas heating. Water heating can maintain a constant temperature for a long time; electric heating equipment can heat up quickly and is plug-and-play; and gas heating is efficient and energy-saving, ensuring warmth while taking into account economy.

[0003] However, these heating methods in the known technologies all require the laying of complex pipes or circuits, which may interfere with the original layout of the room and require more physical space for laying, installation or placement. Summary of the invention

[0004] In view of the above problems, the present application provides a hidden heating system to solve the problems of complex installation, high maintenance cost and large space occupied by heating devices in the known technology.

[0005] The specific plan is as follows:

[0006] A first aspect of the present application provides a hidden heating system, including a heating module and a control module;

[0007] The heating module includes a nano heating layer; the nano heating layer is a nano-scale transparent film;

[0008] The nano heating layer is connected to the control module via a wire;

[0009] The control module performs control operations, which include monitoring and adjusting the working process of the nano heating layer. The working process includes the nano heating layer generating heat energy according to the electrothermal effect and releasing the heat energy to the surrounding environment.

[0010] In a possible implementation, the heating module includes a nano heating layer, an isolation layer, a heat conduction layer and a surface coating layer stacked in sequence;

[0011] The nano heating layer is located at the bottom layer, the isolation layer is attached to the surface of the nano heating layer, the heat conduction layer is attached to the surface of the isolation layer, the surface coating is attached to the surface of the heat conduction layer, and the surface coating is located at the top layer.

[0012] In one possible implementation, the nano-heat-generating layer converts electrical energy into thermal energy based on the electrocaloric effect, and the thermal energy is transferred to the surrounding environment through the heat conduction layer.

[0013] In a possible implementation, the nano heat-generating layer includes indium tin oxide material, indium zinc oxide material and carbon nanotube nano material.

[0014] In a possible implementation, the isolation layer is a flexible and stretchable transparent insulating material.

[0015] In a possible implementation, the control module includes a temperature sensor group, a display unit, a microcontroller, a power regulator, and a communication unit; the microcontroller is used to control the temperature sensor group, the display unit, the power regulator, and the communication unit.

[0016] In one possible implementation, the temperature sensor group includes a first temperature sensor and a second temperature sensor;

[0017] The first temperature sensor is installed on the surface of the laying position of the heating module, and is used to monitor the surface temperature of the laying position and send the surface temperature information of the laying position to the microcontroller.

[0018] The second temperature sensor is used to monitor the temperature of the surrounding environment and send the temperature information of the surrounding environment to the microcontroller.

[0019] In a possible implementation, the power regulator adjusts the heat output of the nano heat-generating layer by adjusting the current delivered to the nano heat-generating layer.

[0020] In a possible implementation, the communication unit includes a wireless communication unit or a Bluetooth communication unit, so as to facilitate a user to remotely control the hidden heating system.

[0021] In a possible implementation, when the first temperature sensor detects that the temperature of the nano heat-generating layer is abnormal, the microcontroller controls the power regulator to reduce the power or the microcontroller shuts down the implicit heating system.

[0022] By means of the above technical solution, the hidden heating system provided by the present application includes a heating module and a control module; the nano heating layer in the heating module is connected to the control module through a wire, and the control module performs a control operation, which includes monitoring and adjusting the working process of the nano heating layer, specifically monitoring and adjusting the nano heating layer to generate heat energy according to the electrothermal effect and release the heat energy into the surrounding environment. The heating body of the hidden heating system provided by the present application is only a thin film of a few hundred nanometers or even thinner. There are no gas pipelines, water pipelines, electric heating wires, and large-volume device bodies in the known technology. The film can be attached to any place where heating is needed, occupies a small space and is very hidden, and the user cannot detect it. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the originals and elements are not necessarily drawn to scale.

[0024] Figure 1A schematic diagram of the structure of a hidden heating system provided in this application;

[0025] Figure 2 This is an example diagram of the composition structure of the heating module in the hidden heating system provided in this application;

[0026] Figure 3 Example diagram of the hidden heating system provided for this application;

[0027] Figure 4 Example of a concealed heating system hidden in the front of the floor tiles provided for this application;

[0028] Figure 5 Example of a concealed heating system provided for this application hidden behind the floor tiles. DETAILED DESCRIPTION

[0029] The following describes the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. The terms used in the implementation method section of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0030] The embodiments of the present application are described below in conjunction with the accompanying drawings. Those skilled in the art will appreciate that, with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0031] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and need not be used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, which is only to describe the distinction mode adopted by the objects of the same attributes when describing in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0032] At present, with the improvement of people's living standards, people usually use heating devices to keep warm in cold seasons. Daily heating methods include water heating, electric heating and gas heating.

[0033] The installation process of the above-mentioned heating devices in the known technology is complicated, and they all need to lay complicated pipes or circuits. They are bulky in appearance and occupy indoor space. Radiators need to be installed in each room, which takes up a lot of space resources and is not beautiful.

[0034] In addition, water pipes in water heating, natural gas pipes in gas heating, and circuit pipes in electric heating pose great safety hazards. In daily installation, circuits and water pipes are usually laid underground or inside walls. If problems such as circuit aging and pipe leakage occur, it is difficult to discover and solve them in the first place.

[0035] In order to solve the above problems, the present application provides a hidden heating system, which uses a nano-scale heating film for heating. It is easy to lay and takes up almost no space. It is particularly important to emphasize that the nano-scale film used for heating in the present application is a transparent and stable film that cannot be detected by users.

[0036] See also Figure 1 , a schematic diagram of the composition structure of the implicit heating system provided in this application.

[0037] like Figure 1 As shown, the hidden heating system mainly includes three parts: a heating module 1 , a control module 2 and a wire 3 connecting the heating module 1 and the control module 2 .

[0038] It should be noted that the heating module 1 is a multi-layer structure, mainly including a nano heating layer, an isolation layer, a heat conduction layer and a surface coating layer stacked in sequence, and the heating module as a whole is a transparent four-layer film structure.

[0039] The nano heating layer is located at the bottom layer of the heating module 1, that is, the bottom layer of the nano heating layer contacts the surface of the laying position. For example, when the heating module 1 of the implicit heating system is laid on the floor tile, the bottom layer of the nano heating layer is attached to the surface of the floor tile; when the heating module 1 of the implicit heating system is laid on the wall, the bottom layer of the nano heating layer is attached to the wall surface.

[0040] Specifically, the nano heating layer is a transparent nano-scale thin film nano heating layer composed of transparent carbon nano materials with high thermal conductivity. The thickness is generally 200nm, or even thinner to tens of nanometers. It mainly includes indium tin oxide (ITO) material, indium zinc oxide (IZO) material and carbon nanotube (CNT) nano materials.

[0041] For indium tin oxide (ITO) material, it has a high transmittance of 85% to 90%, and the resistivity of indium tin oxide (ITO) material is low and has strong conductivity. Similarly, indium zinc oxide (IZO) material also has high transmittance and strong conductivity. Carbon nanotube (CNT) nanomaterials have strong conductivity. It can be understood that the heat conduction layer including indium tin oxide (ITO) material, indium zinc oxide (IZO) material and carbon nanotube (CNT) nanomaterial is a transparent and highly conductive film. It should also be noted that the materials included in the nano heating layer provided in the present application are not limited to the above materials, and may also include other transparent conductive materials, conductive polymers, metal nanowires, FTO (Fluorine-doped Tin Oxide, fluorine antimony tin oxide), graphene, other metals, etc. In addition, according to the conductivity requirements for the nano heating layer in practical applications, the above-mentioned various materials can be freely combined to achieve different conductivity requirements.

[0042] It should be noted that the nano heating layer can achieve uniform heating after being energized. The heating principle is:

[0043] Thermal energy is generated based on the electrocaloric effect. The thermal conductivity layer of the nano heating layer has extremely high carrier mobility in a highly dispersed state, and can form a conductive network with extremely high electrical conductivity in the thermal conductivity layer, thereby being able to quickly generate a large amount of Joule heat when power is turned on.

[0044] In the known technology, electric heating devices generally use resistance wires to generate heat. The principle of resistance wire heating is the resistance heating effect, which can also be called the Joule heating effect. Specifically, the resistance wire is generally made of high resistivity materials such as iron-chromium-aluminum alloy or nickel-chromium alloy. These materials can maintain physical and chemical stability at high temperatures. When current passes through the resistance wire, it will encounter resistance from the material itself, resulting in the conversion of electrical energy into heat energy.

[0045] Therefore, the heating principle of the hidden heating system provided in the present application is different from that in the known technology.

[0046] The isolation layer can also be called an insulating layer. The insulating layer is attached to the surface of the nano heating layer. On the one hand, it is used to isolate the conductive part to prevent the current of the nano heating layer from leaking out; on the other hand, the existence of the isolation layer can prevent the user from getting an electric shock after touching the heating module 1 of the hidden heating system, greatly improving the safety of the hidden heating system. Specifically, the isolation layer is a flexible and stretchable transparent insulating material, such as polyethylene terephthalate film (PET film) and fluorinated polyethylene film (FEP film).

[0047] The heat conduction layer is attached to the surface of the isolation layer, and is mainly used to conduct the heat energy generated by the nano heating layer to the surrounding environment. The heat conduction layer is composed of thermally conductive transparent polymers. For example, polyimide (PI) or polycarbonate (PC) film doped with thermal conductive fillers can also be doped with BN (Boron Nitride) with excellent thermal conductivity.

[0048] The surface coating is attached to the surface of the heat conducting layer.

[0049] On the one hand, the surface coating can radiate heat and transfer heat, on the other hand, the surface coating can also play a concealing role.

[0050] Specifically, the surface coating can significantly increase the infrared emissivity of the heat conduction layer, thereby strengthening the radiation heat transfer process. In addition, the surface coating can also increase the heat conduction efficiency of the heat conduction layer per unit time, improve the infrared radiation heat transfer capacity, and facilitate the rapid transfer of heat. The surface coating can not only improve the heat exchange efficiency, but also effectively protect the heat conduction layer, the isolation layer and the nano heating layer, thereby extending the life of the entire heating module 1. It should be noted that the infrared radiation performance of the surface coating in a high temperature environment is not affected, that is, it can effectively protect the heat conduction layer at any temperature.

[0051] On the other hand, the surface coating is equivalent to a concealing layer. Exemplarily, when the heating module needs to be covered on the wall for heating, the surface coating may be latex paint. The top layer of the heating module is a layer of latex paint, which can better hide the heating module of the hidden heating system on the wall; when the heating module needs to be covered on the toilet tiles for heating, the surface coating may be a pigment of the tile color; when the heating module needs to be covered on the table for heating, the surface coating is a pigment and pattern consistent with the table. The surface coating enables the heating module to blend in with the surface of the location it covers, so that the user is completely unaware of the existence of the heating module 1.

[0052] For example, see Figure 2 , an example diagram of the composition structure of the heating module in the implicit heating system provided in this application.

[0053] The heating module consists of a nano heating layer, an insulating layer, a heat conducting layer and a surface coating from the bottom layer to the surface layer.

[0054] To sum up, the nano heating layer in the heating module 1 provided in the present application has high thermal conductivity, can quickly affect the change of heat source, and quickly realize indoor temperature regulation; the heat conduction layer in the heating module 1 can realize uniform heat transfer in the indoor space by optimizing the arrangement and distribution of various materials; the heating module 1 has good environmental adaptability, is very stable, and can work under different temperature and humidity conditions; and its preparation method is simple and low-cost.

[0055] In practical applications, the heating module 1 of the hidden heating system provided by the present application can be arranged on the surface of any object, such as floors, walls, cabinets, makeup mirrors, ceilings, and even non-planar surfaces such as flexible sofas and mattresses. The heating module 1 can be covered on the surface of the above-mentioned object by spraying. It can be understood that compared with the heating device in the known technology, because the heating module 1 is a transparent film, it has good concealment, avoids visual interference, and the occupied space area can be ignored. There is no need to lay any complicated pipes and circuits, and indoor heating can be achieved without heating by radiators.

[0056] Next, the control module 2 in the hidden heating system is explained.

[0057] The control module 2 is connected to the heating module 1 through the wire 3. The control module 2 performs control operations and can monitor and adjust the working process of the heating module 1 converting electrical energy into heat energy and releasing it into the surrounding environment. The control module 2 can be installed indoors and manually or wirelessly controlled by the user; the control module 2 can also be hidden and installed somewhere indoors or outdoors and only wirelessly controlled by the user.

[0058] The control module 2 includes a temperature sensor group, a display unit, a microcontroller, a power regulator and a communication unit. It should be noted that the microcontroller is a core processing unit that can control the temperature sensor group, the display unit, the power regulator and the communication unit.

[0059] The temperature sensor group includes a high-precision and high-sensitivity temperature sensor, such as an NTC thermistor or a thermocouple. The temperature sensor group includes a first sensor and a second sensor.

[0060] The first sensor is installed on the surface of the location where the heating module 1 is laid, and is used to monitor the surface temperature of the location where the heating module 1 is laid in real time. When the temperature of the heating module 1 is abnormal, the microcontroller will control the power controller to reduce the power or directly shut down the implicit heating system, and at the same time, the temperature abnormality processing process and results will be promptly fed back to the user.

[0061] The second temperature sensor is used to monitor the temperature in the surrounding environment of the heating module 1. For example, when the recessive heating system is installed indoors, the surrounding temperature is the indoor temperature. The second temperature sensor will feed back the monitored surrounding temperature to the microprocessor for processing.

[0062] Exemplarily, the first sensor may be installed on a floor surface, a wall surface, a cabinet surface, a ceiling surface, and the like.

[0063] It should be noted that, after testing, the temperature of the nano heating layer in the present application can reach above 75 degrees Celsius, and the control module 2 is used in the present application to monitor and adjust the temperature of the nano heating layer. Specifically, the power-off temperature of the nano heating layer is set, and the power-off temperature can be specifically set to 50 degrees Celsius. When the temperature of the nano heating layer collected by the first sensor and fed back to the microcontroller reaches 50 degrees Celsius, the microcontroller will control the stop of the power supply to the heating module 1 until the temperature data of the nano heating layer collected by the first sensor and fed back to the microcontroller drops below 35 degrees Celsius and then resumes the power supply to the heating module 1. It can be understood that the temperature control method for the nano heating layer used in the present application can not only improve the safety of the entire implicit heating system, but also save electricity.

[0064] It should be further explained that the reason why the power-off temperature is set to 50 degrees Celsius is:

[0065] After testing, the hidden heating system provided by the present application is laid on a floor of 1 square meter, and the nano heating layer reaching 50 degrees Celsius can make the ambient temperature in 1 cubic meter space reach above 25 degrees Celsius. Therefore, 50 degrees Celsius can be selected as the power-off temperature of the nano heating layer in the present application.

[0066] The power regulator is mainly used to control the current input into the nano heating layer, thereby adjusting the amount of heat generated. The power regulator can use pulse width modulation (PWM) technology to accurately control the amount of heat output by the nano heating layer.

[0067] The communication unit may be a wireless communication unit or a Bluetooth communication unit, allowing the user to remotely control the hidden heating system through a smart home system or a mobile device to achieve functions such as timed switching and temperature adjustment.

[0068] The display unit can be understood as a user-friendly interface, which can have a touch screen or an adjustment knob, for displaying the temperature and intuitively operating and monitoring the hidden heating system.

[0069] The hidden heating system provided in this application also includes functions such as overheating protection function, leakage protection function and fault diagnosis function.

[0070] For the overheat protection function, when the microcontroller detects that the data fed back by the temperature sensor is abnormally high or other temperature abnormalities occur, the power controller is controlled to reduce the power or directly shut down the heating function of the implicit heating system.

[0071] For the leakage protection function, a leakage protector can be installed for the hidden heating system. Once the leakage protector detects leakage, the power supply will be directly cut off;

[0072] As for the fault diagnosis function, the microcontroller also has a fault self-diagnosis function, which can promptly detect and report abnormal conditions of the hidden heating system.

[0073] The present application provides a new implicit heating system, including a heating module and a control module connected by wires. The control module performs control operations, including monitoring and adjusting the working process of the nano heating layer, specifically monitoring and adjusting the nano heating layer to generate heat energy according to the electrothermal effect and release the heat energy to the surrounding environment. It can also monitor and adjust the temperature of the nano heating layer. When the nano heating layer reaches a preset power-off temperature, the power supply to the nano heating layer is disconnected until the temperature of the nano heating layer drops below the preset temperature threshold and then the power supply to the nano heating layer is restored. It can be seen that the entire implicit heating system is highly safe and energy-saving.

[0074] The heating body of the invisible heating system provided in the present application is only a transparent film of several hundred nanometers or even thinner. There is no gas pipeline, water pipeline, electric heating wire and device body occupying a large volume in the known technology. The transparent film can be attached to any place where heating is needed, occupies a small space and is very concealed, so that the user can be completely unaware.

[0075] For example, see Figure 3 , an example diagram of the implicit heating system provided in this application.

[0076] like Figure 3 As shown, the invisible heating system provided by the present application may include a transparent nanomaterial layer, a temperature sensor, a wire, a microcontroller, a user interface, a power regulator and a communication interface.

[0077] The transparent nanomaterial layer is the heating module 1, and the microcontroller, user interface, power regulator and communication interface are integrated into the control module 2. The temperature controller is not only installed near the transparent nanomaterial layer, but also needs to be installed in the surrounding environment of the hidden heating system to monitor the temperature of the surrounding environment. When the control module is installed on the wall to provide a manual operation function for the user, it is generally installed at a location such as the wall where the user can operate easily. The temperature sensor for monitoring the temperature of the surrounding environment can be integrated in the control module, and can also be independently installed at any suitable location in the surrounding environment.

[0078] Optionally, when the implicit heating system is used for indoor heating, the control module 2 can manage all the heating modules 1 in the entire house. The heating modules 1 are connected by wires 3, and the heating modules 1 can be distributed on the surfaces of various objects in the room.

[0079] For example, when the hidden heating system is installed on floor tiles, the heating module 1 can be hidden on the front side of the floor tiles or on the back side of the floor tiles.

[0080] For example, see Figure 4 , the present application provides an example diagram of a concealed heating system hidden in the front face of floor tiles. Figure 4 The best position of the heating module 1 is shown as an example: spraying on the front of the floor tile. The spraying area of ​​the heating module 1 can be determined according to the indoor space. Assuming that the indoor floor tile area is 40 square meters, the heating module 1 can be laid on the ground, so that the room can be heated evenly.

[0081] For example, see Figure 5 , the present application provides an example diagram of a concealed heating system hidden behind a floor tile. Figure 5 The example shows where the control module 2 can be installed: hidden behind the floor tile.

[0082] It should be noted that the hidden heating system provided in this application is highly safe.

[0083] First, the hidden heating system provided by the present application does not have the safety hazards in the known technologies. In the known technologies, the safety hazards of electric heating come from circuit aging, and the safety hazards of water heating and gas heating come from pipeline leakage. These problems are difficult to be discovered and solved in time. However, the hidden heating system provided by the present application mainly provides heat through the nano heating layer, and there is no problem of circuit aging. Moreover, there is no need to lay pipelines, so there is naturally no safety hazard of pipeline leakage.

[0084] Secondly, for electric heating devices, the resistance wires are placed in several concentrated places in the house. The temperature of the placement location is very high and cannot be touched by hand. If the user touches it by mistake, he may be burned. However, the nano heating layer in the invisible heating system provided in this application has a very high light transmittance and can be dispersed and attached to the surface of any place. The user cannot detect it. The temperature of the nano heating layer is not high and will not burn the user. In addition, the isolation layer in the heating module can effectively prevent the current leakage of the nano heating layer, so it can effectively prevent the user from electric shock.

[0085] In summary, completely different from the heating equipment in the known technology, the hidden heating system provided by the present application is simple to prepare, low-cost, requires almost no space resources, is convenient and beautiful, has strong universality, strong practicality, and strong safety. Specifically, the hidden heating system provided by the present application can provide uniform heating, introduces a control system for temperature regulation, can realize free temperature regulation, realize adjustable heating, and can also increase the effective use area of ​​the heating environment, avoid visual interference caused by excessive debris, and provide a good user experience.

[0086] It should also be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the drawings of the device embodiments provided by the present application, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines.

[0087] Through the description of the above implementation mode, the technicians in the field can clearly understand that the present application can be implemented by means of software plus necessary general hardware, and of course, it can also be implemented by special hardware including special integrated circuits, special CPUs, special memories, special components, etc. In general, all functions completed by computer programs can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be various, such as analog circuits, digital circuits or special circuits. However, for the present application, software program implementation is a better implementation mode in more cases. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a readable storage medium, such as a computer floppy disk, a U disk, a mobile hard disk, a ROM, a RAM, a disk or an optical disk, etc., including a number of instructions to enable a computer device (which can be a personal computer, a training device, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0088] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product.

Claims

1. A hidden heating system, characterized in that: It includes a heating module and a control module; The heating module comprises a nano heating layer; the nano heating layer is a nano-scale transparent film; The nano heating layer is connected to the control module via a wire; The control module performs a control operation, which includes monitoring and adjusting a working process of the nano heat-generating layer, wherein the working process includes the nano heat-generating layer generating heat energy according to an electrothermal effect and releasing the heat energy to a surrounding environment.

2. The invisible heating system according to claim 1, characterized in that: The heating module comprises a nano heating layer, an isolation layer, a heat conduction layer and a surface coating layer stacked in sequence; The nano heating layer is located at the bottom layer, the isolation layer is attached to the surface of the nano heating layer, the heat conduction layer is attached to the surface of the isolation layer, the surface coating is attached to the surface of the heat conduction layer, and the surface coating is located at the top layer.

3. The invisible heating system according to claim 2, characterized in that: The nano heat-generating layer converts electrical energy into thermal energy according to the electrothermal effect, and the thermal energy is transferred to the surrounding environment through the heat conduction layer.

4. The invisible heating system according to claim 1, characterized in that: The nano heating layer includes indium tin oxide material, indium zinc oxide material and carbon nanotube nano material.

5. The invisible heating system according to claim 2, characterized in that: The isolation layer is a flexible and stretchable transparent insulating material.

6. The invisible heating system according to claim 1, characterized in that: The control module includes a temperature sensor group, a display unit, a microcontroller, a power regulator and a communication unit; the microcontroller is used to control the temperature sensor group, the display unit, the power regulator and the communication unit.

7. The invisible heating system according to claim 6, characterized in that: The temperature sensor group includes a first temperature sensor and a second temperature sensor; The first temperature sensor is installed on the surface of the laying position of the heating module, and is used to monitor the surface temperature of the laying position and send the surface temperature information of the laying position to the microcontroller; The second temperature sensor is used to monitor the temperature of the surrounding environment and send the temperature information of the surrounding environment to the microcontroller.

8. The invisible heating system according to claim 6, characterized in that: The power regulator adjusts the heat output of the nano heat-generating layer by adjusting the current delivered to the nano heat-generating layer.

9. The invisible heating system according to claim 6, characterized in that: The communication unit includes a wireless communication unit or a Bluetooth communication unit, which is convenient for a user to remotely control the hidden heating system.

10. The invisible heating system according to claim 7, characterized in that: When the first temperature sensor detects that the temperature of the nano heat-generating layer is abnormal, the microcontroller controls the power regulator to reduce the power or the microcontroller turns off the implicit heating system.

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