PCB thickness measuring assembly and use method

Abstract

The invention discloses a PCB thickness measurement assembly and a use method, relates to the technical field of electronic manufacturing, and solves the problems that a board thickness measurement mode is often low in efficiency, and board thickness data of all positions of a product cannot be comprehensively and accurately obtained at a time, so that processing depth compensation is difficult to accurately carry out in subsequent processing, and the cost is low. Therefore, the stability of the back drilling depth is influenced, and the problem of deep drilling or shallow drilling possibly occurs. The PCB thickness measuring assembly comprises a rack lower shell, a rack upper shell is movably installed on the outer side of the top end of the rack lower shell, and a fixed base is fixedly installed at the position, close to the rear side, of the top end of the rack lower shell. According to the invention, each PCB is divided into one hundred points for board thickness measurement, so that the board thickness measurement precision of different positions of the surface of each PCB is ensured, personal errors are reduced, the problems of over-drilling or under-drilling and the like can be effectively avoided during subsequent back drilling, and the stability of the back drilling depth is improved.

Description

Technical Field

[0001] The invention relates to the field of electronic manufacturing, and in particular to a PCB thickness measuring component and a use method thereof. Background Art

[0002] In the PCB processing process, accurate measurement of board thickness and control of processing depth based on board thickness data are key links to ensure product quality and performance. As electronic equipment develops towards miniaturization and high performance, the requirements for PCB processing accuracy are getting higher and higher. Traditional board thickness measurement methods often have problems such as low measurement efficiency, low accuracy, and cumbersome data processing, which are difficult to meet the needs of modern PCB production. At the same time, in processes such as back drilling, the stability of processing depth directly affects the electrical performance and reliability of PCB.

[0003] The existing board thickness measurement method is often inefficient and cannot fully and accurately obtain the board thickness data of each position of the product at one time, which makes it difficult to accurately compensate the processing depth in subsequent processing, thereby affecting the stability of the back drilling processing depth, and may cause problems such as deep or shallow drilling, reducing the product qualification rate and performance; therefore, it does not meet the existing needs. In this regard, we propose a PCB board thickness measurement component and a method of use. Summary of the invention

[0004] The purpose of the present invention is to provide a PCB board thickness measurement component and a method of use, so as to solve the problem that the board thickness measurement method proposed in the above background technology is often inefficient and cannot fully and accurately obtain the board thickness data of each position of the product at one time, resulting in difficulty in accurately performing processing depth compensation in subsequent processing, thereby affecting the stability of the back drilling processing depth, and may cause problems such as drilling too deep or too shallow.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a PCB board thickness measuring component, comprising a rack lower shell, a rack upper shell is movably mounted on the outer side of the top end of the rack lower shell, a fixed base is fixedly mounted on the rear side of the top end of the rack lower shell, a U-shaped fixing frame is fixedly mounted on the top end of the fixed base, a clamping groove is provided on the front surface of the U-shaped fixing frame, and two detection modules are provided on one end of the front side of the U-shaped fixing frame.

[0006] Preferably, the detection module includes a positioning plate, a lifting platform, a lifting slot, a compression spring and a detection probe. The upper and lower sides of the front end of the U-shaped fixing frame are connected with positioning plates by bolts, the outer ends of the positioning plates are fixedly installed with lifting platforms, the interiors of the two lifting platforms are provided with lifting slots, the interiors of the lifting slots are slidably installed with detection probes, compression springs are movably installed between the detection probes and the interiors of the lifting slots, the detection probes are movably penetrated through the surface of the positioning plate, and the front ends of the lifting platforms are provided with PCB clamping modules.

[0007] Preferably, a transverse movement module is provided at the top of the lower shell of the rack, and the transverse movement module includes a fixed bottom plate, a transverse guide rail, a transverse sliding block, a transverse movement plate, a first motor and a transverse screw rod. A fixed bottom plate is fixedly installed on the top of the lower shell of the rack, three transverse guide rails are fixedly installed on the top of the fixed bottom plate, three transverse sliding blocks are slidably installed on the outer surfaces of the transverse guide rails, and a transverse movement plate is fixedly installed on the top of the transverse sliding block. A first motor is fixedly installed on the middle position on one side of the top of the fixed bottom plate, and an output end of the first motor is connected to a transverse screw rod through a coupling, and the end of the transverse screw rod is rotatably connected to a bearing seat.

[0008] Preferably, a vertical moving module is provided at the top of the transverse moving plate, and the vertical moving module includes a transverse moving plate, a vertical guide rail, a vertical sliding block, a vertical moving plate, a second motor and a vertical screw rod. Three vertical guide rails are fixedly installed on the top of the transverse moving plate, and three vertical sliding blocks are movably installed on the surface of the vertical guide rails. The top of the vertical sliding blocks is fixedly installed with a vertical moving plate, and a second motor is fixedly installed at the middle position on the front side of the top of the transverse moving plate. The output end of the second motor is connected to the vertical screw rod through a coupling, and the end of the vertical screw rod is rotatably connected to a bearing seat.

[0009] Preferably, a PCB board adjustment module is provided at the top of the vertical movable plate, and the PCB board adjustment module includes a vertical movable plate, a support frame, an adjustment guide rail and a size adjustment plate, three support frames are installed on both sides of the top of the vertical movable plate by bolts, and the tops of the three support frames located on the same side are fixedly installed with adjustment guide rails, and the tops of the adjustment guide rails are slidably installed with adjustment sliders, and the tops of the adjustment sliders are fixedly installed with two size adjustment plates.

[0010] Preferably, the PCB clamping module includes a cylinder, a clamping plate, a probe card slot, a displacement sensor and a baffle. A baffle is movably installed on the front side of the lifting platform, a cylinder is fixedly installed on the front side of the baffle, the output end of the cylinder is connected to the clamping plate by bolts, a probe card slot is provided on the rear side of the clamping plate, and a displacement sensor is provided on the inner surface of the probe card slot.

[0011] Preferably, the bottom end of the transverse movable plate is movably connected to the surface of the transverse screw rod, the bottom end of the vertical movable plate is movably connected to the surface of the vertical screw rod, a PCB board is movably installed between the two size adjustment plates, the surfaces of the size adjustment plates are provided with assembly grooves, and both sides of the PCB board are movably inserted into the interior of the assembly grooves.

[0012] Preferably, two connecting rods are fixedly installed on the rear side of the baffle, and the connecting rods are movably inserted into the front end surface of the card slot. An alarm light is provided on one side of the top of the upper shell of the rack, and a control panel is provided on one side of the front side of the upper shell of the rack.

[0013] Preferably, the surfaces of the detection probes are in contact with the surface of the PCB board, the surfaces of the clamping plates are in contact with the surface of the PCB board, one end of the detection probes is movable through the interior of the probe card slot, and a dot matrix generation module is provided on the top surface of the vertical movable plate.

[0014] A method for using a PCB thickness measuring component, the method comprising the following steps: Step A: first measure the length and width of the PCB board, first select a size adjustment plate that matches the length of the PCB board, and adjust the surface of the vertical movable plate to move away from the position of the support frame on one side of the U-shaped fixing frame, so that the spacing between the two adjustment rails matches the length of the size adjustment plate, then install the size adjustment plate on the adjustment slider on the surface of the adjustment rail through bolts, and move the size adjustment plate on the surface of the adjustment rail to make the spacing between the two size adjustment plates consistent with the width of the PCB board, then place the PCB board on the surface of the size adjustment plate, so that the two ends of the PCB board are stuck in the inside of the assembly groove, so as to assemble the PCB board, so that the device can install PCB boards of different sizes and measure the board thickness; Step B: by recording the length and width of the PCB board to the dot matrix generation module, the dot matrix generation module divides the surface of the PCB board into one hundred dot matrixes according to the length and width dimensions, and takes each dot matrix point as a measurement point. When the lateral movement module and the vertical movement module move, the PCB board is driven to move stepwise along each dot matrix point through the size adjustment plate, so that each dot matrix point passes through the position of the detection probe in turn, and the detection probe measures the thickness of the PCB board; Step C: When the PCB touches the detection probe, the PCB will hit the surface of the detection probe, so that the detection probe will retract into the lifting slot. At this time, the detection probe will be ejected by the elastic potential energy of the compression spring and contact the upper and lower surfaces of the PCB. At this time, the detection probe will be monitored by the displacement sensor to measure the displacement of the detection probe when it applies pressure to the PCB, so as to calculate the thickness of the PCB. Step D: Record the board thickness data measured at each dot matrix point in real time, display the data through the control panel, and integrate the board thickness data of each PCB board through the control panel to generate a specific QR code; Step E: When the thickness detection process requires manual recording or marking of any dot matrix point on the surface of the PCB board, the cylinder drive output end can be pushed out to drive the clamping plate to press the surface of the PCB board, thereby temporarily stopping the movement of the PCB board. At this time, personnel can manually mark or record the dot matrix point position that needs to be marked, which is convenient for special identification of the PCB board during subsequent processing.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention adjusts the coordination between the guide rail and the size adjustment plate so that when the device is in use, the spacing between the size adjustment plates and the size adjustment plate adapted to the length of the PCB board can be adjusted, so that the device can clamp and detect PCB boards of different sizes, thereby facilitating the use of the device.

[0016] 2. The present invention divides each PCB board into one hundred points for board thickness measurement, thereby ensuring the board thickness measurement accuracy at different positions on the surface of each PCB board, reducing human errors, and effectively avoiding problems such as over-drilling or under-drilling during subsequent back-drilling processing, thereby improving the stability of back-drilling processing depth, thereby improving the quality and performance of PCB products. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the overall internal structure of the present invention; Figure 3 is a cross-sectional side view of the detection probe position of the present invention; Figure 4 A diagram for adjusting the position of the guide rail according to the present invention; Figure 5 A cross-sectional top view of the present invention as a whole; Figure 6 For the present invention Figure 3 Schematic diagram of the local structure of part A.

[0018] In the figure: 1. upper housing of the rack; 2. lower housing of the rack; 3. alarm light; 4. fixed bottom plate; 5. horizontal guide rail; 6. horizontal sliding block; 7. horizontal moving plate; 8. vertical guide rail; 9. vertical sliding block; 10. vertical moving plate; 11. support frame; 12. adjustment rail; 13. size adjustment plate; 14. PCB board; 15. U-shaped fixing frame; 16. fixed base; 17. card slot; 18. first motor; 19. horizontal screw rod; 20. second motor; 21. vertical screw rod; 22. positioning plate; 23. lifting platform; 24. lifting slot; 25. compression spring; 26. detection probe; 27. assembly slot; 28. cylinder; 29. ​​clamping plate; 30. probe card slot; 31. displacement sensor; 32. baffle. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] See also Figures 1 to 6 An embodiment of the present invention is a PCB thickness measuring component, comprising a rack lower shell 2, a rack upper shell 1 is movably mounted on the outer side of the top of the rack lower shell 2, a fixed base 16 is fixedly mounted on the rear side of the top of the rack lower shell 2, a U-shaped fixing frame 15 is fixedly mounted on the top of the fixed base 16, a clamping groove 17 is provided on the front surface of the U-shaped fixing frame 15, and two detection modules are provided on one end of the front side of the U-shaped fixing frame 15.

[0021] The detection module includes a positioning plate 22, a lifting platform 23, a lifting slot 24, a compression spring 25 and a detection probe 26. The upper and lower sides of the front end of the U-shaped fixed frame 15 are connected to the positioning plate 22 by bolts. The outer ends of the positioning plates 22 are fixedly installed with lifting platforms 23. Lifting slots 24 are provided inside the two lifting platforms 23. Detection probes 26 are slidably installed inside the lifting slots 24. Compression springs 25 are movably installed between the detection probes 26 and the inside of the lifting slots 24. The detection probes 26 are movably inserted through the surface of the positioning plate 22. A PCB clamping module is provided at the front end of the lifting platform 23.

[0022] A transverse moving module is provided at the top of the lower housing 2 of the frame, and the transverse moving module includes a fixed base plate 4, a transverse guide rail 5, a transverse sliding block 6, a transverse moving plate 7, a first motor 18 and a transverse screw rod 19. The top of the lower housing 2 of the frame is fixedly installed with a fixed base plate 4, and three transverse guide rails 5 are fixedly installed on the top of the fixed base plate 4. Three transverse sliding blocks 6 are slidably installed on the outer surface of the transverse guide rail 5, and a transverse moving plate 7 is fixedly installed on the top of the transverse sliding block 6. A first motor 18 is fixedly installed at a middle position on one side of the top of the fixed base plate 4, and the output end of the first motor 18 is connected to the transverse screw rod 19 through a coupling, and the end of the transverse screw rod 19 is rotatably connected to a bearing seat.

[0023] A vertical moving module is provided at the top of the transverse moving plate 7, and the vertical moving module includes a transverse moving plate 7, a vertical guide rail 8, a vertical sliding block 9, a vertical moving plate 10, a second motor 20 and a vertical screw rod 21. Three vertical guide rails 8 are fixedly installed on the top of the transverse moving plate 7, and three vertical sliding blocks 9 are movably installed on the surface of the vertical guide rails 8. The top of the vertical sliding blocks 9 are fixedly installed with the vertical moving plate 10. The second motor 20 is fixedly installed at the middle position on the front side of the top of the transverse moving plate 7. The output end of the second motor 20 is connected to the vertical screw rod 21 through a coupling, and the end of the vertical screw rod 21 is rotatably connected to a bearing seat.

[0024] A PCB board adjustment module is provided at the top of the vertical movable plate 10, and the PCB board adjustment module includes the vertical movable plate 10, a support frame 11, an adjustment guide rail 12 and a size adjustment plate 13. Three support frames 11 are installed on both sides of the top of the vertical movable plate 10 by bolts, and the tops of the three support frames 11 on the same side are fixedly installed with adjustment guide rails 12, and the tops of the adjustment guide rails 12 are slidably installed with adjustment sliders, and the tops of the adjustment sliders are fixedly installed with two size adjustment plates 13.

[0025] By adjusting the cooperation between the guide rail 12 and the size adjustment plate 13, when the device is in use, the spacing of the size adjustment plates 13 and the size adjustment plates 13 adapted to the length of the PCB board 14 can be adjusted, so that the device can clamp and detect PCB boards 14 of different sizes, which is convenient for the use of the device.

[0026] The PCB clamping module includes a cylinder 28, a clamping plate 29, a probe card slot 30, a displacement sensor 31 and a baffle 32. The baffle 32 is movably installed on the front side of the lifting platform 23, and the cylinder 28 is fixedly installed on the front side of the baffle 32. The output end of the cylinder 28 is connected to the clamping plate 29 by bolts, and the probe card slot 30 is provided on the rear side of the clamping plate 29, and the displacement sensor 31 is provided on the inner surface of the probe card slot 30.

[0027] Through the cooperation of the cylinder 28 and the pressing plate 29, when the board thickness detection process needs to manually record or mark any dot matrix point on the surface of the PCB board 14, the output end can be pushed out by the cylinder 28 to drive the pressing plate 29 to press the surface of the PCB board 14, thereby temporarily stopping the movement of the PCB board 14. At this time, the personnel can manually mark or record the position of the dot matrix point that needs to be marked, which is convenient for special identification of the PCB board 14 during subsequent processing.

[0028] The bottom end of the transverse movable plate 7 is movably connected to the surface of the transverse screw rod 19, and the bottom end of the vertical movable plate 10 is movably connected to the surface of the vertical screw rod 21. A PCB board 14 is movably installed between the two size adjustment plates 13. The surfaces of the size adjustment plates 13 are provided with assembly grooves 27, and both sides of the PCB board 14 are movably inserted into the interior of the assembly grooves 27.

[0029] Two connecting rods are fixedly installed on the rear side of the baffle 32, and the connecting rods are movably inserted into the front end surface of the clamping groove 17. An alarm light 3 is provided on one side of the top of the frame upper shell 1, and a control panel is provided on one side of the front side of the frame upper shell 1.

[0030] The surfaces of the detection probes 26 are in contact with the surface of the PCB board 14, the surfaces of the clamping plates 29 are in contact with the surface of the PCB board 14, one end of the detection probes 26 is movable through the interior of the probe card slot 30, and a dot matrix generation module is provided on the top surface of the vertical movable plate 10.

[0031] By dividing each PCB board 14 into one hundred points for board thickness measurement, the board thickness measurement accuracy at different positions on the surface of each PCB board 14 is ensured, human errors are reduced, and problems such as over-drilling or under-drilling can be effectively avoided during subsequent back-drilling processing, thereby improving the stability of the back-drilling processing depth and improving the quality and performance of PCB products.

[0032] A method for using a PCB thickness measuring component, the method comprising the following steps: Step A: first measure the length and width of the PCB board 14, first select the size adjustment plate 13 with a length that matches the length of the PCB board 14, and adjust the surface of the vertical movable plate 10 to move away from the position of the support frame 11 on one side of the U-shaped fixing frame 15, so that the spacing between the two adjustment guide rails 12 matches the length of the size adjustment plate 13, then install the size adjustment plate 13 on the adjustment slider on the surface of the adjustment guide rail 12 by bolts, and move the size adjustment plate 13 on the surface of the adjustment guide rail 12, so that the spacing between the two size adjustment plates 13 is consistent with the width of the PCB board 14, then place the PCB board 14 on the surface of the size adjustment plate 13, so that the two ends of the PCB board 14 are inserted into the inside of the assembly groove 27, so that the PCB board 14 is assembled, so that the device can install PCB boards 14 of different sizes and measure the board thickness; Step B: by recording the length and width of the PCB board 14 to the dot matrix generation module, the dot matrix generation module divides the surface of the PCB board 14 into one hundred dot matrixes according to the length and width dimensions, and takes each dot matrix point as a measurement point. When the horizontal movement module and the vertical movement module move, the size adjustment plate 13 drives the PCB board 14 to move step by step along each dot matrix point, so that each dot matrix point passes through the position of the detection probe 26 in turn, so that the detection probe 26 measures the thickness of the PCB board 14; Step C: When the PCB board 14 touches the detection probe 26, the PCB board 14 will hit the surface of the detection probe 26, so that the detection probe 26 will retract into the inside of the lifting slot 24. At this time, the detection probe 26 will be ejected by the elastic potential energy of the compression spring 25 and contact the upper and lower surfaces of the PCB board 14. At this time, the detection probe 26 will be monitored by the displacement sensor 31 to measure the displacement of the detection probe 26 when applying pressure to the PCB board 14, so as to calculate the board thickness of the PCB board 14; Step D: Record the board thickness data measured at each dot matrix point in real time, and display the data through the control panel, and integrate the board thickness data of each PCB board 14 through the control panel and generate a specific QR code. When the PCB board 14 is subsequently back-drilled, the board thickness data of each position of the PCB board 14 can be obtained through the QR code by the back-drilling equipment, so as to realize automatic export of the board thickness data, and make the back-drilling equipment compensate the processing depth of each position according to the thickness of each position. For the area with thicker board thickness, the processing depth is appropriately reduced, and for the area with thinner board thickness, the processing depth is increased to ensure that the back-drilling processing depth remains stable on the entire product surface, thereby achieving the effect of stable back-drilling processing depth; Step E: When the plate thickness detection process requires manual recording or marking of any dot matrix point on the surface of the PCB board 14, the output end can be pushed out by the cylinder 28 to drive the clamping plate 29 to clamp the surface of the PCB board 14, thereby temporarily stopping the movement of the PCB board 14. At this time, personnel can manually mark or record the dot matrix point position that needs to be marked, so as to facilitate special identification of the PCB board 14 during subsequent processing.

[0033] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A PCB thickness measurement assembly, comprising a frame lower housing (2), characterized in that: The upper housing (1) is movably mounted on the outer side of the top of the lower housing (2) of the rack, a fixed base (16) is fixedly mounted on the rear side of the top of the lower housing (2), a U-shaped fixing frame (15) is fixedly mounted on the top of the fixing base (16), a clamping groove (17) is provided on the front surface of the U-shaped fixing frame (15), and two detection modules are provided on one end of the front side of the U-shaped fixing frame (15).

2. A PCB thickness measuring assembly according to claim 1, characterized in that: The detection module comprises a positioning plate (22), a lifting platform (23), a lifting slot (24), a compression spring (25) and a detection probe (26); the upper and lower sides of the front end of the U-shaped fixing frame (15) are connected to the positioning plate (22) by bolts; the outer ends of the positioning plates (22) are fixedly mounted with lifting platforms (23); the interiors of the two lifting platforms (23) are provided with lifting slots (24); the interiors of the lifting slots (24) are slidably mounted with detection probes (26); compression springs (25) are movably mounted between the detection probes (26) and the interiors of the lifting slots (24); the detection probes (26) are movably penetrated through the surface of the positioning plate (22); and the front ends of the lifting platforms (23) are provided with PCB clamping modules.

3. A PCB thickness measuring assembly according to claim 2, characterized in that: A transverse movement module is provided at the top of the lower housing (2) of the frame, and the transverse movement module comprises a fixed base plate (4), a transverse guide rail (5), a transverse sliding block (6), a transverse movement plate (7), a first motor (18) and a transverse screw rod (19). The fixed base plate (4) is fixedly installed at the top of the lower housing (2) of the frame, three transverse guide rails (5) are fixedly installed at the top of the fixed base plate (4), three transverse sliding blocks (6) are slidably installed on the outer surface of each of the transverse guide rails (5), a transverse movement plate (7) is fixedly installed at the top of the transverse sliding block (6), a first motor (18) is fixedly installed at a middle position on one side of the top of the fixed base plate (4), an output end of the first motor (18) is connected to a transverse screw rod (19) via a coupling, and a bearing seat is rotatably connected to the end of the transverse screw rod (19).

4. A PCB thickness measuring assembly according to claim 3, characterized in that: A vertical moving module is provided at the top of the transverse moving plate (7), and the vertical moving module comprises a transverse moving plate (7), a vertical guide rail (8), a vertical sliding block (9), a vertical moving plate (10), a second motor (20) and a vertical screw rod (21). Three vertical guide rails (8) are fixedly mounted on the top of the transverse moving plate (7), three vertical sliding blocks (9) are movably mounted on the surface of the vertical guide rails (8), and the tops of the vertical sliding blocks (9) are fixedly mounted with vertical moving plates (10). A second motor (20) is fixedly mounted at a middle position on the front side of the top of the transverse moving plate (7), and an output end of the second motor (20) is connected to a vertical screw rod (21) via a coupling, and a distal end of the vertical screw rod (21) is rotatably connected to a bearing seat.

5. A PCB thickness measuring assembly according to claim 4, characterized in that: A PCB board adjustment module is provided at the top of the vertical movable plate (10), and the PCB board adjustment module comprises the vertical movable plate (10), a support frame (11), an adjustment guide rail (12) and a size adjustment plate (13). Three support frames (11) are installed on both sides of the top of the vertical movable plate (10) by bolts, and the tops of the three support frames (11) located on the same side are fixedly installed with an adjustment guide rail (12), and the tops of the adjustment guide rails (12) are slidably installed with adjustment sliders, and the tops of the adjustment sliders are fixedly installed with two size adjustment plates (13).

6. A PCB thickness measuring assembly according to claim 5, characterized in that: The PCB clamping module comprises a cylinder (28), a clamping plate (29), a probe card slot (30), a displacement sensor (31) and a baffle (32); a baffle (32) is movably installed on the front side of the lifting platform (23); a cylinder (28) is fixedly installed on the front side of the baffle (32); an output end of the cylinder (28) is connected to the clamping plate (29) by bolts; a probe card slot (30) is provided on the rear side of the clamping plate (29); and a displacement sensor (31) is provided on the inner surface of the probe card slot (30).

7. A PCB thickness measuring assembly according to claim 6, characterized in that: The bottom end of the transverse movable plate (7) is movably connected to the surface of the transverse screw rod (19), and the bottom end of the vertical movable plate (10) is movably connected to the surface of the vertical screw rod (21). A PCB board (14) is movably mounted between the two size adjustment plates (13). The surfaces of the size adjustment plates (13) are each provided with an assembly groove (27), and both sides of the PCB board (14) are movably snapped into the interior of the assembly groove (27).

8. The PCB thickness measuring assembly according to claim 6, characterized in that: Two connecting rods are fixedly mounted on the rear side of the baffle (32), and the connecting rods are movably inserted into the front end surface of the clamping groove (17). An alarm light (3) is provided on one side of the top of the frame upper shell (1), and a control panel is provided on one side of the front side of the frame upper shell (1).

9. A PCB thickness measuring assembly according to claim 6, characterized in that: The surfaces of the detection probes (26) are in contact with the surface of the PCB board (14), the surfaces of the pressing plates (29) are in contact with the surface of the PCB board (14), one end of the detection probes (26) is movable through the inside of the probe card slot (30), and a dot matrix generation module is provided on the top surface of the vertical movable plate (10).

10. A PCB thickness measuring assembly and a method of use according to any one of claims 1 to 9, characterized in that: The method of use comprises the following steps: Step A: firstly measure the length and width of the PCB board (14), firstly select a size adjustment plate (13) having a length matching the length of the PCB board (14), and adjust the surface of the vertical movable plate (10) to move away from the position of the support frame (11) on one side of the U-shaped fixing frame (15), so that the spacing between the two adjustment rails (12) matches the length of the size adjustment plate (13), then install the size adjustment plate (13) on the adjustment slider on the surface of the adjustment rail (12) by bolts, and move the size adjustment plate (13) on the surface of the adjustment rail (12) so that the spacing between the two size adjustment plates (13) is consistent with the width of the PCB board (14), then place the PCB board (14) on the surface of the size adjustment plate (13), so that the two ends of the PCB board (14) are inserted into the inside of the assembly groove (27), thereby assembling the PCB board (14), so that the device can install PCB boards (14) of different sizes and measure the board thickness; Step B: by recording the length and width dimensions of the PCB board (14) in the dot matrix generation module, the dot matrix generation module evenly divides the surface of the PCB board (14) into one hundred dot matrixes according to the length and width dimensions, and each dot matrix point is used as a measurement point, so that when the horizontal movement module and the vertical movement module move, the PCB board (14) is driven to move stepwise along each dot matrix point through the size adjustment plate (13), so that each dot matrix point passes through the position of the detection probe (26) in turn, so that the detection probe (26) measures the thickness of the PCB board (14); Step C: When the PCB board (14) touches the detection probe (26), the PCB board (14) will hit the surface of the detection probe (26), so that the detection probe (26) will retract into the inside of the lifting slot (24). At this time, the detection probe (26) will be ejected by the elastic potential energy of the compression spring (25) and contact the upper and lower surfaces of the PCB board (14). At this time, the detection probe (26) will be monitored by the displacement sensor (31) to measure the displacement of the detection probe (26) when applying pressure to the PCB board (14), so as to calculate the thickness of the PCB board (14); Step D: recording the board thickness data measured at each dot matrix point in real time, and displaying the data through a control panel, and integrating the board thickness data of each PCB board (14) through the control panel and generating a specific QR code; Step E: When the plate thickness detection process requires manual recording or marking of any dot matrix point on the surface of the PCB board (14), the cylinder (28) can be driven to push out the output end, so that it drives the pressing plate (29) to press the surface of the PCB board (14), thereby temporarily stopping the movement of the PCB board (14). At this time, personnel can manually mark or record the position of the dot matrix point that needs to be marked, so as to facilitate special identification of the PCB board (14) during subsequent processing.

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