Simulation chip heating device and control method

Abstract

The invention provides an analog chip heating device. A power supply module is used for providing power supply voltage; the control module is used for setting the test power of the heating simulation test and controlling the on-off of a circuit between the voltage regulating module and the power supply module; the voltage regulating module is used for converting power supply voltage into test voltage according to the test power; the heating module is used for generating heat under the driving of the test voltage so as to simulate the heating process of the chip; the temperature feedback module is used for acquiring temperature data of the heating module and feeding back the temperature data to the control module; the control module is further used for determining heating parameters of the chip in the heating process simulated by the heating module according to the temperature data.

Description

Technical Field

[0001] The present invention relates to the field of server liquid cooling systems, and in particular to a chip heating simulation device and a control method for performing performance testing on server liquid cooling systems. Background Art

[0002] With the development of artificial intelligence and high-performance computing (HPC) chips, the power consumption of a single chip has jumped from hundreds of watts to kilowatts. This high power consumption brings severe heat dissipation challenges, especially with the development trend of increased integration and miniaturization, the average power density of the chip may reach 500W / cm², which puts higher requirements on heat dissipation and reliability. The miniaturization and high integration of chips have led to a significant increase in local heat flux density. The increase in computing power and speed has brought huge power consumption and heat generation, which has restricted the development of high-computing chips.

[0003] In the prior art, air cooling and liquid cooling are commonly used, among which liquid cooling has better cooling effect. However, the entire server is a relatively large system, and the heat dissipation capacity of the liquid cooling system cannot be mastered, and the control method is unstable. In actual applications, the working environment of the liquid cooling system may be complex and changeable, including different load levels, ambient temperatures, and coolant conditions. Testing in the actual environment may require a lot of time and resources, and is easily interfered by external factors. If the heat dissipation capacity of the liquid cooling system is insufficient, it may cause the equipment to overheat and even cause safety accidents.

[0004] Therefore, how to better understand the heat dissipation capacity of the liquid cooling system and the working condition of the chip during chip heating is an urgent problem to be solved. Summary of the invention

[0005] The purpose of the present invention is to address the corresponding deficiencies of the prior art and provide a simulated chip heating device and a control method, by which the chip is heated up and the cooling system dissipates the heat of the simulated chip to test the performance of the cooling system.

[0006] The objective of the present invention is achieved by adopting the following scheme: A first aspect of the present invention provides a device for simulating chip heating, comprising a power supply module, a control module, a voltage regulating module, a heating module, and a temperature feedback module; The power supply module is used to provide a power supply voltage; The control module is connected to the power module and the voltage regulating module, and is used to set the test power of the heating simulation test and control the on-off of the circuit between the voltage regulating module and the power module; The voltage regulating module is disconnectably connected to the power module, and is used to obtain a power supply voltage from the power module under the control of the control module, and convert the power supply voltage into a test voltage according to the test power; The heating module is connected to the voltage regulating module and is used to generate heat under the driving of the test voltage to simulate the heating process of the chip; The temperature feedback module is connected to the heating module and the control module, and is used to obtain temperature data of the heating module and feed the temperature data back to the control module; The control module is further used to determine the heating parameters of the chip whose heating process is simulated by the heating module according to the temperature data.

[0007] The simulated chip heating device also includes a power display module, which is connected to the heating module and is used to display the heating power of the heating module.

[0008] The control module includes a fault test interface and a fault collection interface connected to the voltage regulating module, the fault test interface is used to send a fault test signal to the voltage regulating module, and the fault collection interface is used to receive a test feedback signal generated by the voltage regulating module in response to the fault test signal. The control module is also used to detect whether the analog chip heating device has a fault based on the test feedback signal.

[0009] The fault test signal and the test feedback signal are both pulse width modulation (PWM) signals, and the control module is used to determine whether the analog chip heating device fails by comparing the PWM waveforms of the fault test signal and the test feedback signal.

[0010] The control module also includes a relay control interface connected to the voltage regulating module, and the control module is also used to control the on-off of the circuit between the voltage regulating module and the power supply module through the relay control interface.

[0011] The control module also includes an analog output interface connected to the voltage regulating module. The control module is also used to output a test power signal to the voltage regulating module through the analog output interface, and the test power signal is used to convert the power supply into a corresponding test voltage.

[0012] The control module also includes a heating power collection interface connected to the heating module, and the heating power collection interface is used to transmit the heating power data of the heating module to the control module.

[0013] The control module also includes a temperature data acquisition interface connected to the temperature feedback module, and the temperature data acquisition interface is used to transmit the temperature data acquired by the temperature feedback module to the control module.

[0014] A second aspect of the present invention provides a control method for an analog chip heating device, comprising the following steps: S1, provides power supply voltage through the power module; S2, using the control module to set the test power of the heating simulation test, and controlling the on-off of the circuit between the voltage regulating module and the power module to determine whether to start or end the heating simulation process; S3, obtaining a power supply voltage from a power supply module, and converting the power supply voltage into a corresponding test voltage according to the test power; S4, applying the converted test voltage to the heating module to drive the heating module to generate heat, thereby simulating the heating process of the chip; S5, determining the heating parameters of the chip whose heating process is simulated by the heating module through a PID control algorithm according to the received temperature data.

[0015] Preferably, the method further includes the following steps: installing the heat generating module in a server liquid cooling system, and dissipating heat from the heat generating module through the server liquid cooling system when the heat generating module simulates the heat generating process of the chip, so as to test the performance of the server liquid cooling system.

[0016] The advantage of the present invention is that the heat dissipation capacity of the liquid cooling system and the working condition of the chip during the chip heating process can be better understood. Through the matching controller and control algorithm, the entire control system can run more stably, and the power consumption of the heating module controlled by the simulation device reaches above the kilowatt level, which has important research and reference significance for the actual server liquid cooling and heat dissipation system. Compared with the prior art, the main controller of this device adopts an expandable single-board design with small size, convenient installation, flexible expansion and high functional integration. The simulated chip heating device can provide an accurate and controllable test environment to simulate the heat dissipation requirements under actual working conditions. This test method can not only effectively evaluate the heat dissipation performance of the liquid cooling system, but also quickly and economically complete the test task while ensuring safety. The simulation device allows testers to adjust test parameters such as load, ambient temperature, etc. as needed, so as to comprehensively evaluate the heat dissipation performance of the liquid cooling system under different working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A block diagram of functional modules of a device for simulating chip heating according to an embodiment of the present invention; Figure 2 A fault collection circuit diagram in a control module of a simulated chip heating device according to an embodiment of the present invention; Figure 3 A relay control circuit diagram of a control module of a simulated chip heating device according to an embodiment of the present invention; Figure 4 It is a schematic diagram of the simulated chip heating device according to the embodiment of the present invention installed in an exemplary practical application environment; Figure 5The figure is a flow chart of a control method of an analog chip heating device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0018] The embodiments of the first aspect of the present invention provide an analog chip heating device that can be applied to multiple fields such as electronic cooling technology research and development, server and data center management, automotive electronics and autonomous driving, aerospace and national defense, high-performance computing and data centers, communication equipment and network equipment, new energy and smart grids. It can better understand the heat dissipation performance of the system, and design and optimize accordingly to improve the stability and reliability of the system.

[0019] like Figure 1 A simulated chip heating device provided by an embodiment of the first aspect of the present invention is shown, comprising a power module 100 , a control module 200 , a voltage regulation module 300 , a heating module 400 , and a temperature feedback module 500 .

[0020] The power module 100 is used to provide a power supply voltage.

[0021] The control module 200 is connected to the power module 100 and the voltage regulating module 300 , and is used to set the test power of the heating simulation test and control the on-off of the circuit between the voltage regulating module 300 and the power module 100 .

[0022] The voltage regulating module 300 is detachably connected to the power module 100 , and is used to obtain a power supply voltage from the power module 100 under the control of the control module 200 , and convert the power supply voltage into a test voltage according to the test power.

[0023] The heating module 400 is connected to the voltage regulating module 300 and is used to generate heat under the test voltage to simulate the heating process of the chip. The heating module 400 uses a high-temperature ceramic heating plate as a heat source, and a high-density tungsten heating material is used inside. A temperature sensor is installed on the surface of the heating module 400 to monitor the surface temperature and set an over-temperature protection. The device can adjust the heating power of the device by adjusting the input power supply.

[0024] The temperature feedback module 500 is connected to the heating module 400 and the control module 200 , and is used to obtain temperature data of the heating module 400 and feed the temperature data back to the control module 200 .

[0025] The control module 200 is further configured to determine the heating parameters of the chip whose heating process is simulated by the heating module 400 according to the temperature data.

[0026] The simulated chip heating device further includes a power display module 600 , which is connected to the heating module 400 and is used to display the heating power of the heating module 400 .

[0027] The control module 200 includes a fault test interface and a fault collection interface connected to the voltage regulating module 300. The fault test interface is used to send a fault test signal to the voltage regulating module 300, and the fault collection interface is used to receive a test feedback signal generated by the voltage regulating module 300 in response to the fault test signal. The control module 200 is also used to detect whether the analog chip heating device has a fault based on the test feedback signal.

[0028] Figure 2 This is a fault collection circuit diagram in a control module of a simulated chip heating device according to an embodiment of the present invention.

[0029] The control module 200 includes a fault collection circuit, and the fault collection circuit is used to collect the test feedback signal transmitted from the voltage regulation module 300 to the control module 200 .

[0030] The test feedback signal is collected through the fault collection circuit. The first interface of the resistor R117 is connected to the voltage regulating module 300, which is used to receive the test feedback signal output by the voltage regulating module 300, and the first interface of the resistor R116 is connected to the control module 200, which is used to transmit the received test feedback signal to the control module 200. The fault collection circuit uses the photoelectric coupler U15 to realize the electrical-optical-electrical conversion of the signal, thereby playing the role of input isolation, effectively avoiding the interference caused by electrical characteristics and harsh working environment; the optical coupler U15 combines the light-emitting diode and the light-emitting transistor in an insulated manner, and the light-emitting diode is used as an input circuit to convert electrical energy into light energy, and the light-emitting transistor is used as an output circuit to convert light energy into electrical energy again, so as to realize the electrical isolation of the two parts; the pull-up resistor R116 is selected to be 5.1KΩ, so that the photoelectric transistor enters the saturation zone as soon as possible.

[0031] The fault test signal and the test feedback signal are both pulse width modulation (PWM) signals, and the control module 200 is used to determine whether the analog chip heating device fails by comparing the PWM waveforms of the fault test signal and the test feedback signal.

[0032] The control module 200 further includes a relay control interface connected to the voltage regulating module 300 , and the control module 200 is further used to control the on / off of the circuit between the voltage regulating module 300 and the power module 100 through the relay control interface.

[0033] Figure 3This is a relay control circuit diagram in a control module of a simulated chip heating device according to an embodiment of the present invention.

[0034] The control module 200 includes a relay control circuit, through which the circuit between the voltage regulating module 300 and the power module 100 is controlled to be on and off. The second interface of the resistor R106 is connected to the voltage regulating module 300, and the start and stop of the voltage regulating module 300 can be controlled by the relay K3. The diode D41 plays a protective role, preventing the reverse voltage from damaging other components when the relay is powered off. The control module 200 also includes an analog output interface connected to the voltage regulating module 300. The control module 200 is also used to output a test power signal to the voltage regulating module 300 through the analog output interface. The test power signal is used to convert the power supply into a corresponding test voltage.

[0035] The control module 200 further includes a heating power collection interface connected to the heating module 400 , and the heating power collection interface is used to transmit the heating power data of the heating module 400 to the control module 200 .

[0036] The control module 200 further includes a temperature data acquisition interface connected to the temperature feedback module 500 , and the temperature data acquisition interface is used to transmit the temperature data acquired by the temperature feedback module 500 to the control module 200 .

[0037] like Figure 5 As shown, a control method for a simulated chip heating device provided in an embodiment of the second aspect of the present invention includes the following steps.

[0038] S1, supply voltage is provided by the power module 100.

[0039] S2, using the control module 200 to set the test power of the heating simulation test, and controlling the on-off of the circuit between the voltage regulating module 300 and the power module 100 to determine whether to start or end the heating simulation process.

[0040] S3, obtaining a power supply voltage from the power supply module 100, and converting the power supply voltage into a corresponding test voltage according to the test power.

[0041] S4, applying the converted test voltage to the heating module 400, driving the heating module 400 to generate heat, thereby simulating the heating process of the chip.

[0042] S5, determining the heating parameters of the chip whose heating process is simulated by the heating module 400 through a PID control algorithm according to the received temperature data.

[0043] Preferably, the method further includes the following steps: installing the heating module 400 in a server liquid cooling system, and dissipating heat from the heating module 400 through the server liquid cooling system when the heating module 400 simulates the heating process of a chip, so as to test the performance of the server liquid cooling system.

[0044] The heating module 400 is connected to the analog output interface of the control module 200 through the voltage regulating module 300. When the internal program of the controller determines that the unit meets the starting conditions, the heating module relay is activated and operates according to the set power parameter value. The controller software adjusts the output power according to the real-time feedback power value. The frequency output of the heating module 400 calculates the power demand within a certain period according to the PID control algorithm to perform output operation.

[0045] Figure 4 It is a schematic diagram of the simulated chip heating device according to an embodiment of the present invention installed in an exemplary actual application environment.

[0046] The power module 100 of the aforementioned chip simulation heating device uses a 220V DC power supply to power the devices in the device in this application scenario, the control module 200 uses a controller, the voltage regulating module 300 uses a thyristor voltage regulating module, and the speed regulating ports of 6 or more thyristor voltage regulating modules are connected to the 0-10V analog output interface of the controller for adjusting the voltage output. The relay control interface on the controller is used to control the start and stop of the thyristor voltage regulating module, thereby controlling the working state of the heating module 400. The heating module 400 uses a CPU, the heating power display module 500 uses an electric energy meter, and the temperature feedback module 600 uses a K-type thermocouple module. The K-type thermocouple module is used to collect the temperature data of the heating module 400, and the power of each heating module 400 can be known in real time through the electric energy meter. The communication interface of the K-type thermocouple module and the electric energy meter is connected to the RS485 communication interface of the controller.

[0047] The K-type thermocouple module and the heating module 400 exchange data with the controller via RS485, thereby realizing the temperature sensor data collection of the entire device. Each heating module 400 can be started and stopped independently and can adjust the output power through real-time power feedback, and can more accurately detect the heat dissipation capacity of the liquid cooling system for the heating equipment.

[0048] The control software of this device can detect the operation status of the whole device in real time, and can realize fault detection and protection control. The temperature sensor data and alarm information can be uploaded to the host computer and handheld operator through the 485 interface. The whole control system can realize local control and remote control, among which local control can realize shutdown mode and manual mode, and remote control can realize remote shutdown mode and remote manual mode. Different power setting parameters of each module can be sent in remote and local manual modes. The controller uses PID control algorithm to adjust the power output of the whole system according to the power parameters sent.

[0049] The power module 100 provides a stable power supply voltage. The power supply voltage obtained from the power module 100 is converted into a corresponding test voltage through the voltage regulating module 300 according to the set test power, and the converted test voltage is applied to the heating module 400. When the test voltage is applied to the heating module 400, heat is generated, thereby simulating the heating process of the chip. While the heating module 400 generates heat, the temperature feedback module 500 receives temperature data in real time. These data are input into the control module 200, and the heating parameters of the chip simulated by the heating module 400 are determined through the PID control algorithm. The heating module 400 is installed in the cooling system, and when the heating module 400 simulates the heating process of the chip, the cooling system dissipates heat. By observing and analyzing the heat dissipation effect, it can be evaluated whether the performance of the cooling system meets the design requirements.

[0050] The simulated chip heating device and control method provided by the present invention can know the heat dissipation capacity of the liquid cooling system and the working condition of the chip during the chip heating process by controlling the simulated chip heating. Through the matching controller and control algorithm, the operation of the entire control system is more stable, and the power consumption of the heating module controlled by the simulation device reaches above the kilowatt level, which has important research and reference significance for the actual server liquid cooling and heat dissipation system. The simulated chip heating device can provide an accurate and controllable test environment to simulate the heat dissipation requirements under actual working conditions. This test method can not only effectively evaluate the heat dissipation performance of the liquid cooling system, but also complete the test task quickly and economically while ensuring safety. The simulation device allows testers to adjust test parameters such as load, ambient temperature, etc. as needed, so as to comprehensively evaluate the heat dissipation performance of the liquid cooling system under different working conditions.

Claims

1. A device for simulating chip heating, characterized in that: Including power module, control module, voltage regulation module, heating module and temperature feedback module; The power supply module is used to provide a power supply voltage; The control module is connected to the power module and the voltage regulating module, and is used to set the test power of the heating simulation test and control the on-off of the circuit between the voltage regulating module and the power module; The voltage regulating module is disconnectably connected to the power module, and is used to obtain a power supply voltage from the power module under the control of the control module, and convert the power supply voltage into a test voltage according to the test power; The heating module is connected to the voltage regulating module and is used to generate heat under the driving of the test voltage to simulate the heating process of the chip; The temperature feedback module is connected to the heating module and the control module, and is used to obtain temperature data of the heating module and feed the temperature data back to the control module; The control module is further used to determine the heating parameters of the chip whose heating process is simulated by the heating module according to the temperature data.

2. The simulated chip heating device according to claim 1, characterized in that: It also includes a power display module, which is connected to the heating module and is used to display the heating power of the heating module.

3. The simulated chip heating device according to claim 1, characterized in that: The control module includes a fault test interface and a fault collection interface connected to the voltage regulating module, the fault test interface is used to send a fault test signal to the voltage regulating module, and the fault collection interface is used to receive a test feedback signal generated by the voltage regulating module in response to the fault test signal. The control module is also used to detect whether the analog chip heating device has a fault based on the test feedback signal.

4. The simulated chip heating device according to claim 3, characterized in that: The fault test signal and the test feedback signal are both pulse width modulation (PWM) signals, and the control module is used to determine whether the analog chip heating device fails by comparing the PWM waveforms of the fault test signal and the test feedback signal.

5. The simulated chip heating device according to claim 1, characterized in that: The control module also includes a relay control interface connected to the voltage regulating module, and the control module is also used to control the on-off of the circuit between the voltage regulating module and the power supply module through the relay control interface.

6. The simulated chip heating device according to claim 1, characterized in that: The control module also includes an analog output interface connected to the voltage regulating module. The control module is also used to output a test power signal to the voltage regulating module through the analog output interface, and the test power signal is used to convert the power supply into a corresponding test voltage.

7. The simulated chip heating device according to claim 1, characterized in that: The control module also includes a heating power collection interface connected to the heating module, and the heating power collection interface is used to transmit the heating power data of the heating module to the control module.

8. The simulated chip heating device according to claim 1, characterized in that: The control module also includes a temperature data acquisition interface connected to the temperature feedback module, and the temperature data acquisition interface is used to transmit the temperature data acquired by the temperature feedback module to the control module.

9. A control method for a simulated chip heating device, implemented by the simulated chip heating device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, provides power supply voltage through the power module; S2, using the control module to set the test power of the heating simulation test, and controlling the on-off of the circuit between the voltage regulating module and the power module to determine whether to start or end the heating simulation process; S3, obtaining a power supply voltage from a power supply module, and converting the power supply voltage into a corresponding test voltage according to the test power; S4, applying the converted test voltage to the heating module to drive the heating module to generate heat, thereby simulating the heating process of the chip; S5, determining the heating parameters of the chip whose heating process is simulated by the heating module through a PID control algorithm according to the received temperature data.

10. The control method of the analog chip heating device according to claim 9, further comprising the following steps: The heating module is installed in a server liquid cooling system. When the heating module simulates the heating process of a chip, the heating module is cooled by the server liquid cooling system to test the performance of the server liquid cooling system.

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