Double-cone-shaped multi-gas-port type dynamic gas lock device
By adopting a double-conical multi-air port dynamic gas lock device, using the double-conical pipe configuration and the design of multiple air inlets and intake ports, the problems of increased pressure and reduced extreme ultraviolet light transmission caused by increased cleaning gas flow in the prior art are solved, and more efficient pollutant suppression and extreme ultraviolet light transmission are achieved.
Patent Information
- Application Number
- CN202411859396.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2044-12-17
AI Technical Summary
When the existing single-cone dynamic gas lock device increases the flow of cleaning gas to improve the pollutant suppression efficiency, it will cause the pressure in the light hole channel to increase, reduce the transmittance of extreme ultraviolet light, and affect the exposure quality.
A double-conical multi-air port dynamic gas lock device is adopted. The cross-sectional shape of the optical hole channel is double-conical, divided into convection sections and suppression sections. By setting multiple intakes and suction ports on the pipe wall, it is ensured that the clean gas flows into the chamber quickly and quickly discharges pollutants, improving the transmittance of extreme ultraviolet light and the suppression effect of pollutants.
It achieves the improvement of pollutant suppression while ensuring extreme ultraviolet light transmission, avoids the increase in pressure in the optical hole channel, and improves the exposure quality.
Smart Images

Figure CN119575766A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of extreme ultraviolet lithography machines, and in particular relates to a double-conical multi-gas-port type dynamic gas lock device. Background Art
[0002] The EUV lithography machine uses an EUV light source with a wavelength of 13.5nm and is mainly used for chip manufacturing at 7nm and below. Since almost all substances, including air, have a strong absorption effect on EUV light and affect the reflectivity, the components or systems of the EUV lithography machine, such as the optical system, projection lens chamber, and silicon wafer stage chamber, must be set to a vacuum environment.
[0003] Each component or system of an EUV lithography machine has different requirements for clean vacuum. Among them, the silicon wafer stage chamber does not contain optical components, so a certain amount of contaminants are allowed to be contained therein. These contaminants are hydrocarbons and water vapor produced by the photochemical reaction of the photoresist on the silicon wafer surface under the action of EUV radiation, so the clean vacuum requirements are relatively low.
[0004] For the projection objective chamber, since it contains a reflective optical system, it is necessary not only to ensure the transmittance of extreme ultraviolet radiation, but also to prevent pollutants that enter through free diffusion from causing carbon deposition and oxidation reactions on the surface of optical components. Carbon deposition and oxidation reactions will lead to reduced reflectivity and shortened service life of optical components, so the projection objective chamber must maintain an ultra-clean vacuum environment.
[0005] In order to ensure nearly lossless transmission of extreme ultraviolet radiation between the projection objective chamber and the wafer stage chamber, and to prevent contaminants from diffusing from the wafer stage chamber into the projection objective chamber, a dynamic gas lock device is usually set between the projection objective chamber and the wafer stage chamber.
[0006] During the operation of the dynamic gas lock device, clean gas with a low absorption rate of extreme ultraviolet light will be introduced into the light hole channel of the dynamic gas lock device through the air inlet, and then flow along the light hole channel to the projection lens chamber and the silicon wafer stage chamber respectively, and finally the clean gas containing pollutants will be extracted from the chamber by the vacuum pump group connected to the chamber. For the clean gas entering the silicon wafer stage chamber, it will collide with the pollutants released from the surface of the silicon wafer. This part of the pollutants originally diffused toward the projection lens chamber, but after the pollutants collided with the clean gas, some of the pollutants would return to the silicon wafer stage chamber and be extracted by the vacuum pump group connected to the silicon wafer stage chamber, thereby isolating and controlling the pollutants. For the clean gas entering the projection lens chamber, it has a cleaning effect on the optical elements in the projection lens chamber, and to a certain extent, it can prevent the pollutants from being deposited on the surface of the optical elements, thereby further exerting the inhibitory effect of the pollutants.
[0007] However, existing dynamic gas lock devices usually adopt a single-cone pipe configuration. In order to increase the suppression efficiency of pollutants, the goal is achieved by simply increasing the number of air inlets and increasing the flow rate of clean gas. However, as the flow rate of clean gas continues to increase, the pressure inside the light hole channel of the dynamic gas lock device will increase, which will reduce the transmittance of extreme ultraviolet light in the light hole channel, thereby affecting the exposure quality. Summary of the invention
[0008] In view of the problems existing in the prior art, the present invention provides a double-conical multi-gas-port dynamic gas lock device, and proposes a double-conical pipeline configuration for the first time, that is, the cross-sectional shape of the light hole channel is double-conical, which is divided into a convection section and a suppression section. The large mouth end of the convection section faces the projection lens chamber, and the small mouth end of the convection section is connected with the small mouth end of the suppression section to form a narrow throat. The large mouth end of the suppression section faces the silicon wafer stage chamber, which can not only ensure that the continuously contracted extreme ultraviolet light is transmitted in the light hole channel, but also ensure that the clean gas introduced by the air inlet can quickly flow into the projection lens chamber and the silicon wafer stage chamber, effectively improving the transmittance of the extreme ultraviolet light and the suppression efficiency of pollutants. At the same time, by arranging multiple air inlets on the pipeline wall of the light hole channel, the clean gas entrained with pollutants in the light hole channel can be quickly discharged, so that the transmittance of the extreme ultraviolet light and the suppression efficiency of pollutants are further improved.
[0009] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a double-conical multi-gas-port type dynamic gas lock device, adopting a double-conical pipeline configuration, the cross-sectional shape of the light hole channel in the center of the pipeline is double-conical, and is divided into a convection section and a suppression section; the large mouth end of the convection section faces the projection lens chamber and is connected thereto, the small mouth end of the convection section is connected to the small mouth end of the suppression section to form a narrow throat, and the large mouth end of the suppression section faces the silicon wafer stage chamber and is connected thereto; multiple rows of air inlets and at least one row of air suction ports are arranged on the pipeline wall of the convection section along the axial direction; multiple rows of air suction ports and at least one row of air inlets are arranged on the pipeline wall of the suppression section along the axial direction.
[0010] The central axis of the air inlet and the air suction port on the convection section pipe wall is at an acute angle or perpendicular to the central axis of the light hole channel, and when the central axis of the air inlet and the air suction port on the convection section pipe wall is at an acute angle to the central axis of the light hole channel, the tip of the acute angle faces the narrow throat; the central axis of the air inlet and the air suction port on the suppression section pipe wall is at an acute angle or perpendicular to the central axis of the light hole channel, and when the central axis of the air inlet and the air suction port on the suppression section pipe wall is at an acute angle to the central axis of the light hole channel, the tip of the acute angle faces the wafer stage chamber.
[0011] The air inlet and air intake on the wall of the convection section pipe need to meet the following conditions: in the axial direction of the light hole channel, the angle between the central axis of the air inlet or air intake on the side close to the projection objective lens chamber and the central axis of the light hole channel needs to be no greater than the angle between the central axis of the air inlet or air intake on the side close to the narrow throat and the central axis of the light hole channel; the air inlet and air intake on the wall of the suppression section pipe need to meet the following conditions: in the axial direction of the light hole channel, the angle between the central axis of the air inlet or air intake on the side close to the narrow throat and the central axis of the light hole channel needs to be no less than the angle between the central axis of the air inlet or air intake on the side close to the wafer stage chamber and the central axis of the light hole channel.
[0012] There are multiple air inlets in the same row on the convection section and the suppression section pipe wall, and the multiple air inlets are evenly distributed along the circumference of the pipe wall; there are multiple air intake ports in the same row on the convection section and the suppression section pipe wall, and the multiple air intake ports are evenly distributed along the circumference of the pipe wall.
[0013] The number and spacing of the air inlets and air suction ports on the convection section and suppression section pipeline walls in the circumferential direction are determined according to the suppression efficiency of pollutants.
[0014] The air inlets on the convection section and suppression section pipeline walls are independently equipped with mass flow controllers, and the clean gas inlet flow rate at the air inlet is adjusted by the mass flow controller. The clean gas uses a single gas or a mixed gas.
[0015] The air intake ports on the convection section and suppression section pipeline walls, the exhaust ports of the projection lens chamber, and the exhaust ports of the wafer stage chamber are all independently connected to a vacuum pump group, and the pumping speed of the clean gas is adjusted by the vacuum pump group.
[0016] The cross-sectional shape of the light hole channel is circular or rectangular, and the transitional connection between the inner wall surface of the light hole channel and the air inlet and the air suction port is set as a round chamfer or a straight chamfer.
[0017] The pipe wall at the narrow throat adopts a closed structure or is provided with an air inlet or an air intake. When the pipe wall at the narrow throat is provided with an air inlet or an air intake, the air inlet or the air intake is a single-row structure. There are multiple air inlets or air intakes in the single row, and the multiple air inlets or air intakes are evenly distributed along the circumference of the pipe wall. The number and spacing of the air inlets or air intakes in the circumferential direction are determined according to the pollutant suppression efficiency.
[0018] When an air inlet is provided on the pipe wall at the narrow throat, the air inlet is independently configured with a mass flow controller, and the flow rate of the clean gas inlet at the air inlet is adjusted by the mass flow controller, and the clean gas uses a single gas or a mixed gas; when an air suction port is provided on the pipe wall at the narrow throat, the air suction port is independently configured and connected to a vacuum pump group, and the suction speed of the clean gas is adjusted by the vacuum pump group.
[0019] Beneficial effects of the present invention:
[0020] The double-conical multi-gas-port dynamic gas lock device of the present invention proposes a double-conical pipeline configuration for the first time, that is, the cross-sectional shape of the light hole channel is double-conical, which is divided into a convection section and a suppression section. The large mouth end of the convection section faces the projection lens chamber, and the small mouth end of the convection section is connected with the small mouth end of the suppression section to form a narrow throat. The large mouth end of the suppression section faces the silicon wafer stage chamber, which can not only ensure that the continuously contracted extreme ultraviolet light is transmitted in the light hole channel, but also ensure that the clean gas introduced by the air inlet can quickly flow into the projection lens chamber and the silicon wafer stage chamber, effectively improving the transmittance of the extreme ultraviolet light and the suppression efficiency of pollutants. At the same time, by arranging multiple air inlets on the tube wall of the light hole channel, the clean gas entrained with pollutants in the light hole channel can be quickly discharged, thereby further improving the transmittance of the extreme ultraviolet light and the suppression efficiency of pollutants. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a structural schematic diagram of a double-conical multi-gas-port dynamic gas lock device of the present invention (Example 1);
[0022] Figure 2 It is a structural schematic diagram of a double-conical multi-gas-port dynamic gas lock device of the present invention (Example 2);
[0023] Figure 3 It is a structural schematic diagram of a double-conical multi-gas-port dynamic gas lock device of the present invention (Example 3);
[0024] Figure 4 Schematic diagram of the cross section of the light hole channel at the air inlet (the cross section shape is circular and the number of air inlets is 6);
[0025] Figure 5 Schematic diagram of the cross section of the light hole channel at the air inlet (the cross section shape is rectangular and the number of air inlets is 6);
[0026] Figure 6 Schematic diagram of the cross section of the air inlet of the light hole channel (the cross section shape is circular and the number of air inlets is 6);
[0027] Figure 7 Schematic diagram of the cross section of the light hole channel at the air inlet (the cross section shape is rectangular and the number of air inlets is 6);
[0028] In the figure, 1 is the convection section, 2 is the suppression section, 3 is the projection lens chamber, 4 is the silicon wafer stage chamber, 5 is the air inlet, 6 is the air intake port, and 7 is the narrow throat port. DETAILED DESCRIPTION
[0029] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
[0030] Embodiment 1
[0031] like Figure 1 As shown, a double-conical multi-air-port type dynamic gas lock device adopts a double-conical pipeline configuration, the cross-sectional shape of the light hole channel in the center of the pipeline is double-conical, and is divided into a convection section 1 and a suppression section 2; the large-mouth end of the convection section 1 faces the projection lens chamber 3 and is connected thereto, the small-mouth end of the convection section 1 is connected to the small-mouth end of the suppression section 2 to form a narrow throat 7, the pipeline wall at the narrow throat 7 adopts a closed structure, and the large-mouth end of the suppression section 2 faces the silicon wafer stage chamber 4 and is connected thereto; two rows of air inlets 5 and one row of air suction ports 6 are arranged on the pipeline wall of the convection section 1 along the axial direction, the two rows of air inlets 5 are close to the projection lens chamber 3, and the one row of air suction ports 6 are close to the narrow throat 7; two rows of air suction ports 6 and one row of air inlets 5 are arranged on the pipeline wall of the suppression section 2 along the axial direction, and the one row of air inlets 5 is located between the two rows of air suction ports 6.
[0032] The central axis of the air inlet 5 on the pipe wall of the convection section 1 forms an acute angle with the central axis of the light hole channel, and the tip of the acute angle faces the narrow throat 7. The central axes of the two rows of air inlet 5 are parallel, and the central axis of the air suction port 6 on the pipe wall of the convection section 1 is perpendicular to the central axis of the light hole channel.
[0033] The central axis of the air inlet 5 on the pipe wall of the suppression section 2 forms an acute angle with the central axis of the light hole channel, and the tip of the acute angle faces the silicon wafer stage chamber 4, and the central axis of the two rows of air intake ports 6 is perpendicular to the central axis of the light hole channel.
[0034] like Figure 4 , Figure 6 As shown, the cross-sectional shape of the light hole channel is circular, and the transition connection between the inner wall surface of the light hole channel and the air inlet 5 and the air suction port 6 is set as a round chamfer. The number of air inlets 5 in the same row on the pipe wall of the convection section 1 and the suppression section 2 is 6, and the 6 air inlets 5 are evenly distributed along the circumference of the pipe wall; the number of air suction ports 6 in the same row on the pipe wall of the convection section 1 and the suppression section 2 is 6, and the multiple air suction ports 6 are evenly distributed along the circumference of the pipe wall.
[0035] The air inlets 5 on the pipeline walls of the convection section 1 and the suppression section 2 are independently equipped with mass flow controllers. The clean gas inlet flow rate of the air inlet 5 is adjusted by the mass flow controller, and the clean gas adopts a single gas.
[0036] The air inlet 6 on the pipeline wall of the convection section 1 and the suppression section 2, the exhaust port of the projection lens chamber 3, and the exhaust port of the wafer stage chamber 4 are all independently configured to be connected to a vacuum pump group, and the vacuum pump group is used to adjust the pumping speed of the cleaning gas.
[0037] Embodiment 2
[0038] like Figure 2As shown, a double-conical multi-air-port type dynamic gas lock device adopts a double-conical pipeline configuration, and the cross-sectional shape of the light hole channel in the center of the pipeline is double-conical, which is divided into a convection section 1 and a suppression section 2; the large-mouth end of the convection section 1 faces the projection lens chamber 3 and is connected thereto, and the small-mouth end of the convection section 1 is connected to the small-mouth end of the suppression section 2 to form a narrow throat 7, and the pipeline wall at the narrow throat 7 is provided with an air inlet 5, and the central axis of the air inlet 5 is perpendicular to the central axis of the light hole channel; the large-mouth end of the suppression section 2 faces the wafer stage chamber 4 and is connected thereto; two rows of air inlets 5 and one row of air suction ports 6 are arranged on the pipeline wall of the convection section 1 along the axial direction, the two rows of air inlets 5 are close to the projection lens chamber 3, and the one row of air suction ports 6 are close to the narrow throat 7; two rows of air suction ports 6 and one row of air inlets 5 are arranged on the pipeline wall of the suppression section 2 along the axial direction, and the one row of air inlets 5 is located between the two rows of air suction ports 6.
[0039] The central axis of the air inlet 5 on the pipe wall of the convection section 1 forms an acute angle with the central axis of the light hole channel, and the tip of the acute angle faces the narrow throat 7. The central axes of the two rows of air inlet 5 are parallel, and the central axis of the air suction port 6 on the pipe wall of the convection section 1 is perpendicular to the central axis of the light hole channel.
[0040] The central axis of the air inlet 5 on the pipe wall of the suppression section 2 forms an acute angle with the central axis of the light hole channel, and the tip of the acute angle faces the silicon wafer stage chamber 4, and the central axis of the two rows of air intake ports 6 is perpendicular to the central axis of the light hole channel.
[0041] like Figure 4 , Figure 6 As shown, the cross-sectional shape of the light hole channel is circular, and the transition connection between the inner wall surface of the light hole channel and the air inlet 5 and the air suction port 6 is set as a round chamfer. The number of air inlets 5 in the same row on the pipe wall of the convection section 1 and the suppression section 2 is 6, and the 6 air inlets 5 are evenly distributed along the circumference of the pipe wall; the number of air suction ports 6 in the same row on the pipe wall of the convection section 1 and the suppression section 2 is 6, and the plurality of air suction ports 6 are evenly distributed along the circumference of the pipe wall; the air inlets 5 in a single row on the pipe wall of the narrow throat 7 are evenly distributed along the circumference of the pipe wall;
[0042] The convection section 1, the suppression section 2 and the air inlet 5 on the pipe wall at the narrow throat 7 are independently configured with mass flow controllers. The clean gas inlet flow rate of the air inlet 5 is adjusted by the mass flow controller, and the clean gas uses a single gas.
[0043] The air inlet 6 on the pipe wall at the convection section 1 and the suppression section 2, the exhaust port of the projection lens chamber 3, and the exhaust port of the wafer stage chamber 4 are all independently configured to be connected to a vacuum pump group, and the vacuum pump group is used to adjust the pumping speed of the cleaning gas.
[0044] Embodiment 3
[0045] like Figure 3As shown, a double-conical multi-gas-port type dynamic gas lock device adopts a double-conical pipeline configuration. The cross-sectional shape of the light hole channel in the center of the pipeline is double-conical, and is divided into a convection section 1 and a suppression section 2; the large mouth end of the convection section 1 faces the projection lens chamber 3 and is connected thereto, the small mouth end of the convection section 1 is connected to the small mouth end of the suppression section 2 to form a narrow throat 7, and the pipeline wall at the narrow throat 7 is provided with an air intake port 6, and the central axis of the air intake port 6 is perpendicular to the central axis of the light hole channel; the large mouth end of the suppression section 2 faces the silicon The film stage chamber 4 is connected thereto; three rows of air inlets 5 and one row of air suction ports 6 are arranged on the pipeline wall of the convection section 1 along the axial direction, two rows of air inlets 5 are close to the projection lens chamber 3, one row of air inlets 5 is close to the narrow throat 7, and one row of air suction ports 6 is between the two rows of air inlets 5 close to the projection lens chamber 3 and the one row of air inlets 5 close to the narrow throat 7; two rows of air inlets 5 and one row of air suction ports 6 are arranged on the pipeline wall of the suppression section 2 along the axial direction, and one row of air suction ports 6 is located between the two rows of air inlets 5.
[0046] The central axis of the air inlet 5 on the pipe wall of the convection section 1 forms an acute angle with the central axis of the light hole channel, and the tip of the acute angle faces the narrow throat 7. The central axes of the two rows of air inlet ports 5 close to the projection lens chamber 3 intersect on the central axis of the light hole channel, and the central axis of the row of air inlet ports 5 close to the narrow throat 7 is perpendicular to the central axis of the light hole channel; the central axis of the air intake port 6 on the pipe wall of the convection section 1 is perpendicular to the central axis of the light hole channel.
[0047] The central axis of the air inlet 5 on the pipe wall of the suppression section 2 near the narrow throat 7 forms an acute angle with the central axis of the light hole channel, and the tip of the acute angle faces the wafer stage chamber 4, the central axis of the air inlet 5 near the wafer stage chamber 4 is perpendicular to the central axis of the light hole channel, and the central axis of the air intake port 6 is perpendicular to the central axis of the light hole channel.
[0048] like Figure 5 , Figure 7 As shown, the cross-sectional shape of the light hole channel is rectangular, and the transition connection between the inner wall surface of the light hole channel and the air inlet 5 and the air suction port 6 is set as a straight chamfer. The number of air inlets 5 in the same row on the pipe wall of the convection section 1 and the suppression section 2 is 6, and the 6 air inlets 5 are evenly distributed along the circumference of the pipe wall; the number of air suction ports 6 in the same row on the pipe wall of the convection section 1 and the suppression section 2 is 6, and the plurality of air suction ports 6 are evenly distributed along the circumference of the pipe wall; the air suction ports 6 in a single row on the pipe wall of the narrow throat 7 are evenly distributed along the circumference of the pipe wall;
[0049] The air inlets 5 on the pipeline walls of the convection section 1 and the suppression section 2 are independently configured with mass flow controllers. The clean gas inlet flow rate of the air inlet 5 is adjusted by the mass flow controller, and the clean gas adopts a mixed gas.
[0050] The convection section 1, the suppression section 2 and the air inlet 6 on the pipe wall at the narrow throat 7, the exhaust port of the projection lens chamber 3, and the exhaust port of the wafer stage chamber 4 are all independently configured and connected to a vacuum pump group, and the vacuum pump group is used to adjust the pumping speed of the cleaning gas.
[0051] When the dynamic gas lock device adopts the technical solution of the present invention, due to the double cone shape of the light hole channel, it first contracts and then expands from top to bottom, ensuring that the continuously contracted extreme ultraviolet light is transmitted in the light hole channel, and the multiple rows of air inlets 5 are arranged on the pipe wall of the light hole channel, ensuring that each air inlet 5 has the function of preventing pollutants from diffusing into the projection lens chamber 3, achieving multiple barriers and improving the pollutant suppression efficiency. In addition, through the multiple rows of air intakes 6 arranged on the pipe wall of the light hole channel, the clean gas containing pollutants in the light hole channel can be effectively discharged quickly, which not only prevents a large amount of clean gas from gathering in the light hole channel to form a high-pressure area, but also reduces the density of pollutants diffusing into the projection lens chamber 3, thereby further improving the transmittance of extreme ultraviolet light and the pollutant suppression efficiency.
[0052] The solutions in the embodiments are not intended to limit the protection scope of the present invention. All equivalent implementations or changes that do not deviate from the present invention are included in the protection scope of the present invention.
Claims
1. A double-conical multi-gas-port dynamic gas lock device, characterized in that: A double-conical pipeline configuration is adopted, and the cross-sectional shape of the light hole channel in the center of the pipeline is a double cone, which is divided into a convection section and a suppression section; the large mouth end of the convection section faces the projection lens chamber and is connected with the projection lens chamber, the small mouth end of the convection section is connected with the small mouth end of the suppression section to form a narrow throat, and the large mouth end of the suppression section faces the wafer stage chamber and is connected with the projection lens chamber; a plurality of rows of air inlets and at least one row of air suction ports are arranged on the pipeline wall of the convection section along the axial direction; a plurality of rows of air suction ports and at least one row of air inlets are arranged on the pipeline wall of the suppression section along the axial direction.
2. A double-conical multi-gas-port dynamic gas lock device according to claim 1, characterized in that: The central axis of the air inlet and the air suction port on the convection section pipe wall is at an acute angle or perpendicular to the central axis of the light hole channel, and when the central axis of the air inlet and the air suction port on the convection section pipe wall is at an acute angle to the central axis of the light hole channel, the tip of the acute angle faces the narrow throat; the central axis of the air inlet and the air suction port on the suppression section pipe wall is at an acute angle or perpendicular to the central axis of the light hole channel, and when the central axis of the air inlet and the air suction port on the suppression section pipe wall is at an acute angle to the central axis of the light hole channel, the tip of the acute angle faces the wafer stage chamber.
3. A double-conical multi-gas-port dynamic gas lock device according to claim 2, characterized in that: The air inlet and air intake on the wall of the convection section pipe need to meet the following conditions: in the axial direction of the light hole channel, the angle between the central axis of the air inlet or air intake on the side close to the projection objective lens chamber and the central axis of the light hole channel needs to be no greater than the angle between the central axis of the air inlet or air intake on the side close to the narrow throat and the central axis of the light hole channel; the air inlet and air intake on the wall of the suppression section pipe need to meet the following conditions: in the axial direction of the light hole channel, the angle between the central axis of the air inlet or air intake on the side close to the narrow throat and the central axis of the light hole channel needs to be no less than the angle between the central axis of the air inlet or air intake on the side close to the wafer stage chamber and the central axis of the light hole channel.
4. A double-conical multi-gas-port dynamic gas lock device according to claim 1, characterized in that: There are multiple air inlets in the same row on the convection section and the suppression section pipe wall, and the multiple air inlets are evenly distributed along the circumference of the pipe wall; there are multiple air intake ports in the same row on the convection section and the suppression section pipe wall, and the multiple air intake ports are evenly distributed along the circumference of the pipe wall.
5. A double-conical multi-gas-port dynamic gas lock device according to claim 4, characterized in that: The number and spacing of the air inlets and air suction ports on the convection section and suppression section pipeline walls in the circumferential direction are determined according to the suppression efficiency of pollutants.
6. A double-conical multi-gas-port dynamic gas lock device according to claim 1, characterized in that: The air inlets on the convection section and suppression section pipeline walls are independently equipped with mass flow controllers, and the clean gas inlet flow rate at the air inlet is adjusted by the mass flow controller. The clean gas uses a single gas or a mixed gas.
7. A double-conical multi-gas-port dynamic gas lock device according to claim 1, characterized in that: The air intake ports on the convection section and suppression section pipeline walls, the exhaust ports of the projection lens chamber, and the exhaust ports of the wafer stage chamber are all independently connected to a vacuum pump group, and the pumping speed of the clean gas is adjusted by the vacuum pump group.
8. A double-conical multi-gas-port dynamic gas lock device according to claim 1, characterized in that: The cross-sectional shape of the light hole channel is circular or rectangular, and the transitional connection between the inner wall surface of the light hole channel and the air inlet and the air suction port is set as a round chamfer or a straight chamfer.
9. A double-conical multi-gas-port dynamic gas lock device according to claim 1, characterized in that: The pipe wall at the narrow throat adopts a closed structure or is provided with an air inlet or an air intake. When the pipe wall at the narrow throat is provided with an air inlet or an air intake, the air inlet or the air intake is a single-row structure. There are multiple air inlets or air intakes in the single row, and the multiple air inlets or air intakes are evenly distributed along the circumference of the pipe wall. The number and spacing of the air inlets or air intakes in the circumferential direction are determined according to the pollutant suppression efficiency.
10. A double-conical multi-gas-port dynamic gas lock device according to claim 9, characterized in that: When an air inlet is provided on the pipe wall at the narrow throat, the air inlet is independently configured with a mass flow controller, and the flow rate of the clean gas inlet at the air inlet is adjusted by the mass flow controller, and the clean gas uses a single gas or a mixed gas; when an air suction port is provided on the pipe wall at the narrow throat, the air suction port is independently configured and connected to a vacuum pump group, and the suction speed of the clean gas is adjusted by the vacuum pump group.
Citation Information
Patent Citations
Extreme ultraviolet source, method for improving asymmetric deposition and radiation source
CN114698216A
Dynamic air lock for extreme ultra-violet lithography machine
CN203414732U
Connection device
US20090224179A1
Control of dynamic gas lock flow inlets of an intermediate focus cap
US20220283506A1