Inductor glue pouring method and glue pouring jig

By designing inductor glue filling methods and glue filling fixtures, the semi-finished inductor products are installed suspended before glue filling, which solves the problems of limited peripheral size and incomplete glue filling in the existing technology, and achieves complete coverage and good compatibility of the finished inductor products.

CN119581206AActive Publication Date: 2025-03-07SHENZHEN BOULDER ELECTRONIC CO LTD
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Patent Information

Application Number
CN202510133546.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-06
Publication Date
2025-03-07
Estimated Expiration
2045-02-06

AI Technical Summary

Technical Problem

The existing inductor glue filling methods require sacrificing the peripheral size of the inductor, affecting its installation and compatibility, and it is difficult to ensure that the semi-finished inductor products are completely covered with glue during glue filling.

Method used

By designing an inductive glue filling method and glue filling fixture, the mold mechanism and the fixing assembly cooperate with each other, the semi-finished inductor is installed suspended before glue filling, so that the glue can completely cover its bottom and outside.

Benefits of technology

It is realized that the semi-finished inductor products are completely covered by glue during the glue filling process, and there is no notch on the outside of the finished inductor products, which improves its installation and compatibility.

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Abstract

The invention relates to the technical field of electronic components, and discloses an inductor glue filling method and a glue filling jig, and the inductor glue filling method comprises the following steps: S1, assembling the jig; s2, installing the inductor semi-finished product; s3, pouring glue; s4, disassembling the finished inductor; the inductor semi-finished product is in a suspended state before glue pouring, the bottom and the outer side of the whole inductor semi-finished product are covered with the poured glue, no notch exists in the outer side of the inductor finished product formed after the glue is completely dried, and follow-up installation of the inductor in electronic equipment and compatibility with other circuit elements are facilitated.
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Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to an inductor glue filling method and a glue filling fixture. Background Art

[0002] An inductor is an electromagnetic induction component, which is made of an insulated wire wound on a winding bracket or an iron core with a certain number of turns. This coil is called an inductor coil or inductor. During the inductor processing, the semi-finished inductor needs to be filled with glue to improve the performance, reliability and service life of the inductor.

[0003] During the glue pouring process of the semi-finished inductor, the product needs to be installed in a jig. In order to ensure that the bottom and the outside of the inductor are completely covered with glue, the semi-finished inductor should be suspended inside the jig during the glue pouring. The existing solution is to support the semi-finished inductor by providing a protrusion on the inside of the jig, but this method requires sacrificing part of the outer size of the inductor. In compact electronic devices, sacrificing the outer size of the inductor will affect the installation of the inductor and its compatibility with other circuit components.

[0004] To this end, the present invention provides an inductor glue potting method and a glue potting jig. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The present invention provides an inductor glue potting method, comprising the following steps: S1. Assemble the jig: Assemble two symmetrical jigs accordingly and merge them into a state ready for glue pouring; S2. Install the semi-finished inductor: Use a fixing mechanism to adhere the top of the semi-finished inductor, and support the semi-finished inductor on the top of the jig through the fixing mechanism. The semi-finished inductor is suspended in the jig forming groove as a whole. S3, glue pouring: pour glue in the center of the semi-finished inductor, and wait for the glue to dry and solidify to form the finished inductor; S4. Disassemble the finished inductor: separate the fixing mechanism and the fixture from the finished inductor one by one.

[0007] By adopting the above technical solution, the semi-finished inductor is in a suspended state before the glue is poured, so that the glue covers the entire bottom and outer side of the semi-finished inductor, and the outer side of the finished inductor formed after the glue is completely dried has no gap.

[0008] On the other hand, the present application also provides an inductor glue potting jig, including a mold mechanism, a pad assembly is placed on the top of the mold mechanism, the fixing mechanism includes a fixing assembly, the fixing assembly is installed on both sides of the top of the mold mechanism, and when the mold mechanism is in a state to be potted, it drives the fixing assembly to fix the inductor semi-finished product. During this process, the pad assembly is used to position the inductor semi-finished product. After fixing is completed, the pad assembly is removed, the height of the top of the fixing assembly is lowered, and the inductor semi-finished product is suspended and installed on the inner side of the mold mechanism.

[0009] Preferably, the mold mechanism comprises two glue pouring mold assemblies, a mounting seat assembly is connected to the bottom between the two glue pouring mold assemblies, and a first electric push rod is installed between the glue pouring mold assembly and the mounting seat assembly.

[0010] By adopting the above technical solution, it is easier to take out the finished inductor when the glue-filling mold assembly is separated.

[0011] Preferably, the glue pouring mold assembly includes a mold body, a glue pouring groove is provided at the top of the mold body close to the mounting seat assembly, a movable groove is provided at the bottom of the mold body close to the mounting seat assembly, and the output shaft of the first electric push rod is fixedly connected to the side wall of the movable groove.

[0012] Preferably, the mounting seat assembly includes a mounting seat body, and second mounting grooves are provided in the middle of the front and back sides of the mounting seat body, and the first electric push rod is installed on the inner side of the second mounting groove.

[0013] By adopting the above technical solution, the two mold bodies are always symmetrical about the front center line of the mounting seat body.

[0014] Preferably, the pad assembly includes a pad body, a limiting ring is fixedly connected to the top of the pad body, the center of the limiting ring is located on the midline of the front side of the pad body, a clamping block is fixedly connected to the center of the bottom of the pad body, a first limiting groove that matches the thickness gap of the clamping block is opened at the center of the top of the mounting seat body, a blocking block is fixedly connected to the back of the first limiting groove, and the width of the first limiting groove is the same as the width of the clamping block.

[0015] By adopting the above technical solution, the accuracy of positioning the pad assembly on the semi-finished inductor is ensured.

[0016] Preferably, a first mounting groove is opened on both sides of the top of the mold body, and the fixing assembly includes two second electric push rods, the bottom of the second electric push rods is installed on the inner side of the first mounting groove, the tops of the two second electric push rods are fixedly connected with a fixing block, the adjacent sides of the two fixed blocks are connected with a moving block assembly, the adjacent sides of the two moving block assemblies are connected with a moving rod assembly, and an adhesive assembly is arranged between the two moving rod assemblies.

[0017] Preferably, the adhesive assembly includes an adhesive seat, a storage groove is opened in the center of the top of the adhesive seat, a glue leakage hole is opened in the center of the bottom of the adhesive seat, movable square grooves are opened in the middle of both sides of the adhesive seat, and second limiting grooves are opened at the top and bottom of the movable square grooves.

[0018] Preferably, the moving rod assembly includes a rod body, a third limiting groove is provided at the top and bottom of the middle part of the rod body, the top and bottom of the rod body close to the adhesive seat are fixedly connected to limiting blocks, one end of the rod body close to the adhesive seat is fixedly connected to a poking needle, an annular square groove is provided at the bottom inside the adhesive seat, and a heating ring is fixedly installed on the inner side of the annular square groove of the adhesive seat.

[0019] By adopting the above technical solution, after the glue filling is completed, the heating ring is started to melt the fixed glue, which makes it easier to separate the finished inductor from the glue seat, and at this time, the glue remaining at the bottom of the glue seat is easier to remove.

[0020] Preferably, the moving block assembly includes a moving block body, a moving groove is opened on the side of the moving block body close to the moving rod assembly, the top wall and the bottom wall of the moving groove close to the side of the moving rod assembly are fixedly connected to a limiting block, and the width of the limiting block is gap-matched with the width of the third limiting groove.

[0021] By adopting the above technical solution, when the two mold bodies are combined and connected, the piercing needle is sufficient to pierce the two sides of the glue mass, but the two piercing needles will not collide with each other, thereby extending the service life of the piercing needles.

[0022] The present application includes at least one of the following beneficial technical effects: the inductor glue filling method and glue filling jig described in the present invention are provided with a mold mechanism and a fixing component that cooperate with each other. When the mold mechanism moves to the state to be filled with glue, the fixing component moves accordingly and pierces the liquid glue ball with a plastic package on the outside. The liquid glue inside the glue ball flows from the glue leakage hole to the contact point between the bottom of the glue seat and the top of the semi-finished inductor, and the semi-finished inductor is quickly fixed. In this process, there is no need to manually apply liquid glue to avoid the liquid glue sticking to the operator's hands; and the second electric push rod drives the glue seat to move downward and hangs the semi-finished inductor on the top of the jig forming groove, so that the semi-finished inductor is in a suspended state before glue filling, so that the glue filling covers the entire bottom and outside of the semi-finished inductor. After the glue is completely dry, there is no gap on the outside of the finished inductor, which is convenient for the subsequent installation of the inductor in electronic equipment and compatibility with other circuit components.

[0023] The inductor glue pouring method and glue pouring jig described in the present invention are provided with a mold mechanism. When two glue pouring mold assemblies are combined and connected, the mold mechanism is in a glue pouring state. The first electric push rod drives the two glue pouring mold assemblies to move closer to or away from each other. When the glue pouring mold assemblies are separated, it is easier to take out the finished inductor.

[0024] The inductor glue pouring method and glue pouring jig described in the present invention are provided with a pad assembly. Before using a fixing assembly to install the semi-finished inductor, the pad assembly needs to be placed on the top of the mold mechanism, and then the semi-finished inductor is placed on the inner side of a limiting ring. The pad assembly enables the semi-finished inductor to be suspended in the center of the jig forming groove when the fixing assembly fixes the semi-finished inductor and drives the semi-finished inductor to descend. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a top view of the overall structure of the present invention; Figure 2 It is a bottom view of the overall structure of the present invention; Figure 3 It is a structural schematic diagram of the mold mechanism in the present invention; Figure 4 It is a structural schematic diagram of the pad assembly in the present invention; Figure 5 yes Figure 1 A partial enlarged view of the middle part; Figure 6 It is a schematic diagram of the structure of the fixing assembly in the present invention; Figure 7 yes Figure 6 A partial enlarged view of point B in the middle.

[0026] Description of reference numerals: 1. Mold mechanism; 101. Glue-filling mold assembly; 1011. Mold body; 1012. First mounting groove; 1013. Glue-filling groove; 1014. Movable groove; 102. Mounting seat assembly; 1021. Mounting seat body; 1022. Second mounting groove; 1023. First limiting groove; 1024. Stopper; 103. First electric push rod; 2. Pad assembly; 201. Pad body; 202. Limiting ring; 203. Block; 3. Fixing assembly; 301. Glue Assembly; 3011, adhesive seat; 3012, storage slot; 3013, glue leakage hole; 3014, movable square slot; 3015, second limiting slot; 302, moving rod assembly; 3021, rod body; 3022, third limiting slot; 3023, poking needle; 3024, limiting square block; 303, moving block assembly; 3031, moving block body; 3032, moving slot; 3033, limiting block; 304, fixed block; 305, second electric push rod; 306, heating ring. DETAILED DESCRIPTION

[0027] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that the discussion of these embodiments is only to enable those skilled in the art to better understand and implement the subject matter described herein, and the functions and arrangements of the elements discussed may be changed without departing from the scope of protection of the contents of this specification. Each example may omit, replace or add various processes or components as needed. In addition, the features described relative to some examples may also be combined in other examples. Example

[0028] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments of the specification. The present application provides an inductor glue potting method, which includes the following steps: S1. Assemble the jig: Assemble two symmetrical jigs accordingly and merge them into a state ready for glue pouring; S2. Install the semi-finished inductor: Use a fixing mechanism to install and connect the top of the semi-finished inductor, and support the semi-finished inductor on the top of the jig through the fixing mechanism. The semi-finished inductor as a whole is in a suspended state in the jig forming groove; S3, glue pouring: pour glue in the center of the semi-finished inductor, and wait for the glue to dry and solidify to form the finished inductor; S4. Disassemble the finished inductor: separate the fixing mechanism and the fixture from the finished inductor one by one.

[0029] Specifically, a fixing mechanism is provided to hang the semi-finished inductor on the top of the jig forming groove, so that the semi-finished inductor is in a suspended state before glue pouring, so that the glue pouring covers the entire bottom and outer side of the semi-finished inductor, and the outer side of the finished inductor formed after the glue is dried has no gap, which is convenient for the subsequent installation of the inductor in electronic equipment and compatibility with other circuit components.

[0030] On the other hand, see Figures 1 to 7 The present application also provides an inductor glue potting fixture, please refer to Figure 1 and Figure 2 , including a mold mechanism 1, a pad assembly 2 is placed on the top of the mold mechanism 1, and a fixing mechanism includes a fixing assembly 3, and the fixing assembly 3 is installed on both sides of the top of the mold mechanism 1. When the mold mechanism 1 is in a state of waiting for glue filling, it drives the fixing assembly 3 to fix the semi-finished inductor. During this process, the pad assembly 2 is used to position the semi-finished inductor. After the fixing is completed, the pad assembly 2 is removed, the top height of the fixing assembly 3 drops, and the semi-finished inductor is suspended and installed on the inner side of the mold mechanism 1.

[0031] Please refer to Figure 2 , Figure 3 The mold mechanism 1 includes two glue-filling mold assemblies 101 , a mounting seat assembly 102 is connected to the bottom between the two glue-filling mold assemblies 101 , and a first electric push rod 103 is installed between the glue-filling mold assembly 101 and the mounting seat assembly 102 .

[0032] Specifically, when two glue-filling mold assemblies 101 are combined and connected, the mold mechanism 1 is in a glue-filling state, and the first electric push rod 103 drives the two glue-filling mold assemblies 101 to move closer to or away from each other. When the glue-filling mold assemblies 101 are separated, it is easier to take out the finished inductor.

[0033] Please refer to Figure 3 The glue pouring mold assembly 101 includes a mold body 1011. A glue pouring groove 1013 is opened at the top of the mold body 1011 close to the mounting seat assembly 102. A movable groove 1014 is opened at the bottom of the mold body 1011 close to the mounting seat assembly 102. The output shaft of the first electric push rod 103 is fixedly connected to the side wall of the movable groove 1014.

[0034] Please refer to Figure 3 The mounting seat assembly 102 includes a mounting seat body 1021 , and second mounting grooves 1022 are provided in the middle of the front and back sides of both sides of the mounting seat body 1021 , and the first electric push rod 103 is installed on the inner side of the second mounting groove 1022 .

[0035] Specifically, the initial state is Figure 1 , Figure 2As shown, at this time, the output shaft of the first electric push rod 103 is extended to the longest state. When glue pouring is required, the output shaft of the first electric push rod 103 is started to pull the two mold bodies 1011 closer to each other and equidistantly until the mold bodies 1011 are merged and connected. At this time, the two glue pouring grooves 1013 are connected to form a jig forming groove, and the two ends of the mounting seat body 1021 are respectively immersed in the inner side of the movable groove 1014 and covered by the movable groove 1014. The two mold bodies 1011 are always symmetrical about the front center line of the mounting seat body 1021.

[0036] Please refer to Figure 2 , Figure 4 The pad assembly 2 includes a pad body 201, a limiting ring 202 is fixedly connected to the top of the pad body 201, the center of the limiting ring 202 is located on the midline of the front of the pad body 201, a clamping block 203 is fixedly connected to the center of the bottom of the pad body 201, a first limiting groove 1023 that matches the thickness gap of the clamping block 203 is opened at the center of the top of the mounting seat body 1021, a stopper 1024 is fixedly connected to the back of the first limiting groove 1023, and the width of the first limiting groove 1023 is the same as the width of the clamping block 203.

[0037] Specifically, before using the fixing component 3 to install the semi-finished inductor, it is necessary to place the pad component 2 on the top of the mold mechanism 1, and then place the semi-finished inductor on the inner side of the limiting ring 202; in order to ensure the accuracy of the pad component 2 in positioning the semi-finished inductor, a clamping block 203 is provided to cooperate with the first limiting groove 1023, so that the front midpoint of the pad body 201 is aligned with the front midpoint of the mounting seat body 1021, and the center of the limiting ring 202 is located at the same position as the center of the two glue injection grooves 1013 when they are connected. On the vertical line, the inner shape of the limit ring 202 is loosely matched with the outer shape of the inductor, and the number of the limit rings 202 is the same as the number of the glue pouring grooves 1013 opened on the top of the single mold body 1011; the operator pushes the pad body 201 along the inner side of the first limit groove 1023 toward the block 1024 through the block 203, and the block 1024 blocks the block 203. When the bottom of the block 203 is completely located inside the first limit groove 1023, the back of the block 203 contacts the front of the block 1024.

[0038] Please refer to Figure 1 , Figure 3 , Figure 6A first mounting groove 1012 is provided on both sides of the top of the mold body 1011, and the fixing component 3 includes two second electric push rods 305, the bottom of the second electric push rods 305 is installed on the inner side of the first mounting groove 1012, and the tops of the two second electric push rods 305 are fixedly connected with a fixing block 304, and the adjacent sides of the two fixed blocks 304 are connected with a moving block component 303, and the adjacent sides of the two moving block components 303 are connected with a moving rod component 302, and an adhesive component 301 is arranged between the two moving rod components 302.

[0039] Specifically, the second electric push rod 305 is installed on the inner side of the first installation groove 1012. When the first electric push rod 103 drives the two mold bodies 1011 to approach each other, the second electric push rod 305 moves with the mold body 1011, thereby driving the fixed block 304 to push the two moving block assemblies 303 to approach each other, and the moving block assembly 303 drives the moving rod assembly 302 to approach each other, so that the length of the overall top of the fixed assembly 3 is synchronously shortened during the process of the two mold bodies 1011 approaching each other.

[0040] Please refer to Figure 7 The adhesive component 301 includes an adhesive seat 3011, a storage groove 3012 is opened in the center of the top of the adhesive seat 3011, a glue leakage hole 3013 is opened in the center of the bottom of the adhesive seat 3011, movable square grooves 3014 are opened in the middle of both sides of the adhesive seat 3011, and second limiting grooves 3015 are opened in the top and bottom of the movable square groove 3014.

[0041] Specifically, the liquid glue ball with plastic packaging on the outside is placed in the storage groove 3012, and the top surface size of the glue leakage hole 3013 is smaller than the top surface size of the storage groove 3012, so that the liquid glue ball with plastic packaging on the outside can be stuck on the inside of the storage groove 3012, and the moving rod assembly 302 moves along the movable square groove 3014 and the second limit groove 3015 when moving.

[0042] Please refer to Figure 7 The moving rod assembly 302 includes a rod body 3021, and a third limiting groove 3022 is provided at the top and bottom of the middle part of the rod body 3021. The top and bottom of the rod body 3021 close to the adhesive seat 3011 are fixedly connected to a limiting block 3024, and one end of the rod body 3021 close to the adhesive seat 3011 is fixedly connected to a poking needle 3023. An annular square groove is provided at the bottom inside the adhesive seat 3011, and a heating ring 306 is fixedly installed on the inner side of the annular square groove of the adhesive seat 3011.

[0043] Specifically, when the moving block assembly 303 drives the moving rod assembly 302 to approach each other, the rod body 3021 moves along the movable square groove 3014, and the limiting square block 3024 moves along the second limiting groove 3015 until the liquid glue ball with a plastic package on the outside placed in the storage groove 3012 is pierced by the puncture needle 3023, and the liquid glue inside the glue ball flows from the glue leakage hole 3013 to the bottom of the glue seat 3011 and the contact point with the top of the inductor semi-finished product. After the liquid glue is dried, the height of the glue seat 3011 is raised by driving the second electric push rod 305 to drive the semi-finished inductor to be synchronously lifted to the top of the limiting ring 202 The backing plate assembly 2 is then pulled out along the first limiting groove 1023 to remove the entire backing plate assembly 2, and then the second electric push rod 305 is driven so that the output shaft of the second electric push rod 305 drives the adhesive seat 3011 to drop to the height until the top of the semi-finished inductor is flush with the top of the mold body 1011. At this time, the semi-finished inductor is in a suspended state in the glue pouring groove 1013, and the surface of the finished inductor after the glue pouring is finally completed has no gap; after the glue pouring is completed, the heating ring 306 is started to melt the fixed glue, which makes it easier to separate the finished inductor from the adhesive seat 3011, and the glue remaining at the bottom of the adhesive seat 3011 is easier to remove.

[0044] Please refer to Figure 6 The moving block assembly 303 includes a moving block body 3031, and a moving groove 3032 is opened on the side of the moving block body 3031 close to the moving rod assembly 302. The top wall and the bottom wall of the moving groove 3032 close to the side of the moving rod assembly 302 are fixedly connected to the limiting block 3033, and the width of the limiting block 3033 is gap-matched with the width of the third limiting groove 3022.

[0045] Specifically, Figure 6 , Figure 7As shown, this is the initial state of the fixed component 3, the limiting block 3033 is located at the side of the third limiting groove 3022 farthest from the adhesive component 301, and the limiting block 3024 is located at the side of the second limiting groove 3015 closest to the moving block component 303. During the process of the moving block components 303 approaching each other: first, the moving block body 3031 moves toward the side close to the moving rod component 302, that is, the limiting block 3033 moves along the third limiting groove 3022. When it moves to the side of the third limiting groove 3022 closest to the adhesive component 301, the moving block component 303 will push the moving rod component 302. The two mold bodies 1011 move forward together, and the limiting block 3024 moves along the second limiting groove 3015. The poking pin 3023 gradually approaches the gelatin mass until it is pierced. The moving block assembly 303 and the moving rod assembly 302 make the overall length of the top of the fixed assembly 3 decrease layer by layer, which can adapt to the distance change in the process of the mold bodies 1011 approaching each other, and will not directly drive the third limiting groove 3022 to be too close, so that when the two mold bodies 1011 are merged and connected, the poking pin 3023 is sufficient to pierce both sides of the gelatin mass, but the two poking pins 3023 will not collide with each other, thereby extending the service life of the poking pins 3023.

[0046] Working principle: The initial state is as follows Figure 1 , Figure 2 As shown, at this time, the output shaft of the first electric push rod 103 is extended to the longest state. When it is necessary to perform glue pouring, the pad assembly 2 is first placed on the top of the mold mechanism 1, and the operator pushes the pad body 201 along the inner side of the first limiting groove 1023 toward the stopper 1024 through the clamping block 203, and then puts the semi-finished inductor in the limiting ring 202, ensuring that at this time, the bottom of the semi-finished inductor contacts the top of the pad body 201 inside the limiting ring 202, and the top of the semi-finished inductor contacts the bottom of the adhesive seat 3011; Then, the output shaft of the first electric push rod 103 is started to pull the two mold bodies 1011 closer to each other at an equal distance, and the second electric push rod 305 is installed on the inner side of the first installation groove 1012. When the first electric push rod 103 drives the two mold bodies 1011 to move closer to each other, the second electric push rod 305 moves together with the mold body 1011, thereby driving the fixed block 304 to push the two moving block assemblies 303 closer to each other, and the moving block assembly 303 drives the moving rod assembly 302 closer to each other, so that the length of the entire top of the fixed assembly 3 is synchronously shortened during the process of the two mold bodies 1011 approaching each other, until the adjacent sides of the two mold bodies 1011 are respectively attached to the two sides of the card block 203, at this time, the liquid glue ball with plastic packaging on the outer side placed in the storage groove 3012 has been pierced by the puncture needle 3023, and the liquid glue inside the glue ball flows from the glue leakage hole 3013 to the bottom of the glue seat 3011 and the contact with the top of the inductor semi-finished product, waiting for the liquid glue to dry; After the liquid glue is completely dried, the height of the glue seat 3011 is raised by driving the second electric push rod 305 to drive the semi-finished inductor to be synchronously raised to the top of the limiting ring 202, and then the pad assembly 2 is pulled out along the first limiting groove 1023 to remove the pad assembly 2 as a whole, and then the second electric push rod 305 is driven so that the output shaft of the second electric push rod 305 drives the glue seat 3011 to drop to the top of the semi-finished inductor and the top of the mold body 1011. At this time, the semi-finished inductor is in a suspended state in the glue pouring groove 1013, and the glue is poured from the center of the semi-finished inductor, and the glue is waited to dry and solidify to form a finished inductor. After the glue filling is completed, the second electric push rod 305 is driven to raise the height of the glue seat 3011 to lift the semi-finished inductor synchronously, and the first electric push rod 103 is driven to drive the two mold bodies 1011 to move away from each other, and the finished inductor is taken out from the mold body 1011. After taking it out, the heating ring 306 is started to melt the fixed glue, which makes it easier to separate the finished inductor and the glue seat 3011. At this time, the glue remaining at the bottom of the glue seat 3011 is easier to remove.

[0047] An example of the present specific implementation mode is described above, but the present embodiment is not limited to the above-mentioned specific implementation mode, which is merely illustrative and not restrictive. A person skilled in the art may make many forms inspired by the present embodiment, all of which are protected by the present embodiment.

Claims

1. A method for inductor glue potting, characterized in that: The following steps are involved: S1. Assemble the jig: Assemble two symmetrical jigs accordingly and merge them into a state ready for glue pouring; S2. Install the semi-finished inductor: Use a fixing mechanism to install and connect the top of the semi-finished inductor, and support the semi-finished inductor on the top of the jig through the fixing mechanism. The semi-finished inductor as a whole is in a suspended state in the jig forming groove; S3, glue pouring: pour glue in the center of the semi-finished inductor, and wait for the glue to dry and solidify to form the finished inductor; S4. Disassemble the finished inductor: separate the fixing mechanism and the fixture from the finished inductor one by one.

2. An inductor glue potting jig, according to the inductor glue potting method of claim 1, characterized in that: The invention comprises a mold mechanism (1), a backing plate assembly (2) is placed on the top of the mold mechanism (1), the fixing mechanism comprises fixing assemblies (3), the fixing assemblies (3) are mounted on both sides of the top of the mold mechanism (1), and when the mold mechanism (1) is in a state to be filled with glue, the fixing assemblies (3) are driven to fix the semi-finished inductor. During this process, the backing plate assembly (2) is used to position the semi-finished inductor. After the fixing is completed, the backing plate assembly (2) is removed, the top of the fixing assembly (3) is lowered, and the semi-finished inductor is suspended and mounted inside the mold mechanism (1).

3. The inductor glue potting jig according to claim 2, characterized in that: The mold mechanism (1) comprises two glue pouring mold assemblies (101), a mounting seat assembly (102) is connected to the bottom between the two glue pouring mold assemblies (101), and a first electric push rod (103) is installed between the glue pouring mold assembly (101) and the mounting seat assembly (102).

4. The inductor glue potting jig according to claim 3, characterized in that: The glue pouring mold assembly (101) comprises a mold body (1011), a glue pouring groove (1013) is provided at the top of the mold body (1011) on a side close to the mounting seat assembly (102), a movable groove (1014) is provided at the bottom of the mold body (1011) on a side close to the mounting seat assembly (102), and the output shaft of the first electric push rod (103) is fixedly connected to the side wall of the movable groove (1014).

5. The inductor glue potting jig according to claim 4, characterized in that: The mounting seat assembly (102) comprises a mounting seat body (1021), and second mounting grooves (1022) are provided in the middle of the front and back sides of the mounting seat body (1021), and the first electric push rod (103) is mounted on the inner side of the second mounting groove (1022).

6. The inductor glue potting jig according to claim 5, characterized in that: The pad assembly (2) comprises a pad body (201), the top of the pad body (201) is fixedly connected to a limiting ring (202), the center of the limiting ring (202) is located on the midline of the front of the pad body (201), the center of the bottom of the pad body (201) is fixedly connected to a clamping block (203), the center of the top of the mounting seat body (1021) is provided with a first limiting groove (1023) that matches the thickness clearance of the clamping block (203), the back of the first limiting groove (1023) is fixedly connected to a stopper (1024), and the width of the first limiting groove (1023) is the same as the width of the clamping block (203).

7. The inductor glue potting jig according to claim 4, characterized in that: First mounting grooves (1012) are provided on both sides of the top of the mold body (1011); the fixing assembly (3) comprises two second electric push rods (305); the bottom of the second electric push rods (305) is installed on the inner side of the first mounting groove (1012); the tops of the two second electric push rods (305) are fixedly connected to fixing blocks (304); the adjacent sides of the two fixing blocks (304) are connected to moving block assemblies (303); the adjacent sides of the two moving block assemblies (303) are connected to moving rod assemblies (302); and an adhesive assembly (301) is provided between the two moving rod assemblies (302).

8. The inductor glue potting jig according to claim 7, characterized in that: The adhesive assembly (301) comprises an adhesive seat (3011), a storage groove (3012) is provided at the centre of the top of the adhesive seat (3011), a glue leakage hole (3013) is provided at the centre of the bottom of the adhesive seat (3011), movable square grooves (3014) are provided in the middle of both sides of the adhesive seat (3011), and second limiting grooves (3015) are provided at the top and bottom of the movable square groove (3014).

9. The inductor glue potting jig according to claim 8, characterized in that: The moving rod assembly (302) comprises a rod body (3021), the top and bottom of the middle part of the rod body (3021) are both provided with a third limiting groove (3022), the top and bottom of the side of the rod body (3021) close to the adhesive seat (3011) are both fixedly connected to a limiting square block (3024), one end of the rod body (3021) close to the adhesive seat (3011) is fixedly connected to a poking needle (3023), the bottom of the inside of the adhesive seat (3011) is provided with an annular square groove, and a heating ring (306) is fixedly installed inside the annular square groove of the adhesive seat (3011).

10. The inductor glue potting jig according to claim 9, characterized in that: The moving block assembly (303) comprises a moving block body (3031), a moving groove (3032) is provided on a side of the moving block body (3031) close to the moving rod assembly (302), the top wall and the bottom wall of the moving groove (3032) close to the moving rod assembly (302) are fixedly connected to a limiting block (3033), and the width of the limiting block (3033) is gap-matched with the width of the third limiting groove (3022).

Citation Information

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