Packaging structure and packaging method thereof

Abstract

The invention discloses a packaging structure and a packaging method thereof, and the packaging structure comprises a pedestal which is located on a first surface of a side part of a first component, and is provided with a groove for exposing a first substrate; the second substrate is stacked on the first surface of the first substrate, and the second substrate comprises a second surface opposite to the first surface and a third surface opposite to the second surface; the second component is located on one or both of the second surface and the third surface, and the second component is electrically connected with the second substrate; and the conductive columns protrude out of the second surface and are in one-to-one correspondence with the grooves, the first ends of the conductive columns are electrically connected with the second substrate, and the second ends of the conductive columns are located in the corresponding grooves and are electrically connected with the first substrate. According to the embodiment, the base is provided with the grooves for exposing the first substrate, the second ends of the conductive columns are located in the corresponding grooves, the grooves can play a role in limiting and fixing the conductive columns, the probability that the conductive columns deviate and incline is reduced, and therefore the electric connection reliability of the conductive columns and the first substrate can be improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of semiconductor manufacturing, and in particular to a packaging structure and a packaging method thereof. Background Art

[0002] With the rapid development of semiconductor packaging technology, multi-layer stacking bonding technology of chips has become the key to improving storage density and performance. Currently, there are two main processes for multi-layer stacking bonding of chips: thermal compression bonding (TCB) and mass reflow (MR).

[0003] The TCB process has more precise control over the alignment connection between the layers of chips, and realizes the purpose of alignment and welding, but its efficiency is low, which increases the process cost accordingly. Reflow soldering has obvious advantages in efficiency, but the process may cause inter-layer misalignment of chips due to vibration and other reasons during the entire process from stacking multiple layers of chips to completing welding, affecting the reliability of the packaged product. Summary of the invention

[0004] The problem solved by the embodiments of the present invention is to provide a packaging structure and a packaging method thereof, which are beneficial to improving the reliability of the packaged product.

[0005] To solve the above problems, an embodiment of the present invention provides a packaging structure, including: a first substrate, the first substrate including a first surface; a first component, located on the first surface, and the first component is electrically connected to the first substrate; a base, located on the first surface of the side of the first component, and the base has a groove exposing the first substrate; a second substrate, stacked on the first surface of the first substrate and located on the side of the first component and the base facing away from the first substrate, the second substrate including a second surface opposite to the first surface, and a third surface facing away from the second surface; a second component, located on one or both of the second surface and the third surface, and the second component is electrically connected to the first substrate; a conductive column protruding from the second surface and corresponding one-to-one to the groove, the conductive column having a first end and a second end, the first end being electrically connected to the second substrate, and the second end being located in the corresponding groove and electrically connected to the first substrate.

[0006] Correspondingly, an embodiment of the present invention also provides a packaging method, including: providing a first substrate, the first substrate including a first surface, a first component and a base located on the side of the first component are arranged on the first surface, the base has a groove exposing the first substrate, and the first component is electrically connected to the first substrate; providing a second substrate, the second substrate including a second surface arranged opposite to the first surface, and a third surface facing away from the second surface, a second component is arranged on one or both of the second surface and the third surface, and a protruding conductive column is arranged on the second surface, the conductive column has a first end and a second end, the first end is electrically connected to the second substrate, the conductive column corresponds to the groove one by one, and the second component is electrically connected to the second substrate; the second surface of the second substrate is facing the first surface of the first substrate, and the second end of the conductive column is located in the corresponding groove and electrically connected to the first substrate.

[0007] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0008] An embodiment of the present invention provides a packaging structure, comprising: a first substrate, the first substrate including a first surface; a first component, located on the first surface, the first component is electrically connected to the first substrate; a base, located on the first surface of the side of the first component, the base having a groove exposing the first substrate; a second substrate, stacked on the first surface of the first substrate, and located on the side of the first component and the base facing away from the first substrate, the second substrate including a second surface arranged opposite to the first surface, and a third surface facing away from the second surface; a second component, located on one or both of the second surface and the third surface, the second component is electrically connected to the first substrate; a conductive column, protruding from the second surface and corresponding to the groove one by one, the conductive column having a first end and a second end, the first end is electrically connected to the second substrate, the second end is located in the corresponding groove and electrically connected to the first substrate. In this embodiment, the base has a groove exposing the first substrate, the second end of the conductive column is located in the corresponding groove, the groove can limit and fix the conductive column, reduce the probability of the conductive column being offset and tilted, thereby facilitating the improvement of the reliability of the electrical connection between the conductive column and the first substrate, and further improving the reliability of the packaged product.

[0009] Optionally, the packaging structure also includes: a conductive filler, which is located in the groove and wraps the conductive column located in the groove, and the conductive filler fills all or part of the space of the groove where the conductive column is provided; the conductive filler has conductivity, so that the conductive column can be electrically connected to the first substrate, and the conductive filler can also play a fixing role and compensate for the height difference of the conductive column, which is beneficial to improving the electrical connection reliability between the conductive column and the first substrate, thereby reducing the probability of subsequent cold soldering between the conductive column and the first substrate, thereby further improving the reliability of the packaging product.

[0010] The embodiment of the present invention also provides a packaging method, including: providing a first substrate, the first substrate including a first surface, a first component and a base located on the side of the first component, the base having a groove exposing the first substrate, and the first component being electrically connected to the first substrate; providing a second substrate, the second substrate including a second surface opposite to the first surface, and a third surface facing away from the second surface, a second component being arranged on one or both of the second surface and the third surface, and a protruding conductive column being arranged on the second surface, the conductive column having a first end and a second end, the first end being electrically connected to the second substrate, the conductive column corresponding to the groove one by one, and the second component being electrically connected to the second substrate; facing the second surface of the second substrate to the first surface of the first substrate, and making the second end of the conductive column located in the corresponding groove and electrically connected to the first substrate. In this embodiment, the base has a groove exposing the first substrate, the second end of the conductive column is located in the corresponding groove, the groove can limit and fix the conductive column, reduce the probability of the conductive column being offset and tilted, thereby facilitating the improvement of the reliability of the electrical connection between the conductive column and the first substrate, and further improving the reliability of the packaging product.

[0011] Optionally, the step of positioning the second end of the conductive column in the groove and electrically connecting the second end of the conductive column to the first substrate includes: positioning the second end of the conductive column in the groove; after positioning the second end of the conductive column in the groove, forming a conductive filler in the groove to wrap the conductive column, the conductive filler filling all or part of the space of the groove in which the conductive column is arranged; the conductive filler has conductivity so that the conductive column can be electrically connected to the first substrate, and the conductive filler can also play a fixing role and compensate for the height difference of the conductive column, which is beneficial to improving the electrical connection reliability between the conductive column and the first substrate, thereby reducing the probability of subsequent cold soldering between the conductive column and the first substrate, thereby further improving the reliability of the packaging product. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figures 1 to 3 It is a schematic diagram of the structure of a packaging structure;

[0013] Figures 4 to 5 It is a structural schematic diagram of an embodiment of a packaging structure of the present invention;

[0014] Figures 6 to 14 It is a schematic structural diagram corresponding to each step in an embodiment of a packaging method of the present invention. DETAILED DESCRIPTION

[0015] At present, the reliability of packaging products still needs to be improved. Now, combined with a structural schematic diagram of a packaging structure, the reasons why the reliability of packaging products needs to be improved are analyzed.

[0016] Figures 1 to 3 It is a structural diagram of a packaging structure.

[0017] refer to Figures 1 to 3 The packaging structure includes: a first substrate 10, the first substrate 10 includes a first surface 11; a first component 12, located on the first surface 11, the first component 12 is electrically connected to the first substrate 10; a second substrate 20, stacked on the first surface 11 of the first substrate 10, and located on the side of the first component 12 facing away from the first substrate 10, the second substrate 20 includes a second surface 21 arranged opposite to the first surface 11, and a third surface 22 facing away from the second surface 21; a second component 23, located on the second surface 21 and the third surface 22, the second component 23 is electrically connected to the second substrate 20; a conductive column 24, protruding from the second surface 21, the conductive column 24 has a first end 25 and a second end 26, the first end 25 is electrically connected to the second substrate 20, and the second end 26 is electrically connected to the first substrate 10.

[0018] The research found that Figure 2 As shown, in the prior art, the second end 26 of the conductive pillar 24 is usually electrically connected to the first substrate 10 by using a surface mounting process. The process is mainly completed by soldering. However, during the surface mounting process, bubbles are easily generated inside the solder. These bubbles will generate thrust on the conductive pillar 24, which will easily cause the conductive pillar 24 to tilt and deviate, thereby affecting the reliability of the packaged product. In addition, Figure 3As shown, in the process of electrically connecting the second end 26 of the conductive column 24 to the first substrate 10, when the thickness of the first component 12 or the second component 23 on the second surface 21 is relatively large, a higher requirement will be placed on the height difference between the conductive columns 24. If the height difference between the conductive columns 24 does not meet the actual process requirements, the risk of collision between the first component 12 and the second component 23 is easily increased. At the same time, the risk of cold solder joint between the second end 26 of the conductive column 24 and the first substrate 10 is also easily increased, thereby further affecting the reliability of the packaged product, and correspondingly resulting in restrictions on the design of the first component 12 or the second component 23.

[0019] In order to solve the technical problem, the packaging structure provided by the embodiment of the present invention includes: a first substrate, the first substrate includes a first surface; a first component, located on the first surface, the first component is electrically connected to the first substrate; a base, located on the first surface of the side of the first component, the base has a groove exposing the first substrate; a second substrate, stacked on the first surface of the first substrate, and located on the side of the first component and the base facing away from the first substrate, the second substrate includes a second surface arranged opposite to the first surface, and a third surface facing away from the second surface; a second component, located on one or both of the second surface and the third surface, the second component is electrically connected to the first substrate; a conductive column, protruding from the second surface and corresponding one-to-one to the groove, the conductive column having a first end and a second end, the first end is electrically connected to the second substrate, and the second end is located in the corresponding groove and electrically connected to the first substrate.

[0020] In the scheme disclosed in the embodiment of the present invention, the base has a groove exposing the first substrate, and the second end of the conductive column is located in the corresponding groove. The groove can limit and fix the conductive column, reducing the probability of the conductive column being offset and tilted, which is beneficial to improving the electrical connection reliability between the conductive column and the first substrate, and further improving the reliability of the packaged product.

[0021] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and understandable, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] Figures 4 to 5 1 is a schematic diagram of a packaging structure according to an embodiment of the present invention. Specifically, Figure 5 yes Figure 4 A partial enlarged view of area A. It should be noted that for the convenience of illustration, Figure 5 The conductive filler is not shown.

[0023] refer to Figures 4 to 5The packaging structure includes: a first substrate 100, the first substrate 100 includes a first surface 101; a first component 102, located on the first surface 101, the first component 102 is electrically connected to the first substrate 100; a base 103, located on the first surface 101 at the side of the first component 102, the base 103 has a groove 104 exposing the first substrate 100; a second substrate 105, stacked on the first surface 101 of the first substrate 100, and located on the side of the first component 102 and the base 103 facing away from the first substrate 100, the second substrate 105 includes A second surface 106 arranged opposite to the first surface 101, and a third surface 107 facing away from the second surface 106; a second component 108, located on one or both of the second surface 106 and the third surface 107, and the second component 108 is electrically connected to the second substrate 105; a conductive column 109, protruding from the second surface 106 and corresponding to the groove 104 one by one, the conductive column 109 has a first end 110 and a second end 111, the first end 110 is electrically connected to the second substrate 105, and the second end 111 is located in the corresponding groove 104 and electrically connected to the first substrate 100.

[0024] The first substrate 100 is used as a packaging carrier to provide support for the first component 102 and provide an electrical connection path between the first component 102 and an external circuit, thereby realizing packaging integration and electrical integration of the first component 102. The first substrate 100 may include a packaging substrate, an interposer, or a printed circuit board (PCB). As an example, the first substrate 100 is a packaging substrate.

[0025] The first surface 101 is used as a bearing surface for placing the first component 102 and the base 103 .

[0026] The first component 102 includes one or both of a first passive component 112 and a first chip 113. In this embodiment, the first component 102 includes the first passive component 112 and the first chip 113.

[0027] In this embodiment, the first passive element 112 includes one or more of a capacitor, a resistor, an inductor, a filter, and a coupler.

[0028] In this embodiment, the first chip 113 is a chip with a specific function. Specifically, the type of the first chip 113 is determined according to actual functional requirements or application scenarios. For example, the first chip 113 includes one or more of a radio frequency chip, a memory chip, an ASIC (Application-Specific Integrated Circuit) chip, a CPU (Central Processing Unit) chip, a GPU (Graphics Processing Unit) chip, and an FPGA (Field-Programmable Gate Array) chip.

[0029] In other embodiments, according to actual process requirements, the first chip may also be other chips.

[0030] The base 103 is used to provide a groove 104 .

[0031] It should be noted that the base 103 has a groove 104 that exposes the first substrate 100, and the second end 111 of the conductive column 109 is located in the corresponding groove 104. The groove 104 can limit and fix the conductive column 109, thereby reducing the probability of the conductive column 109 being offset and tilted, which is beneficial to improving the electrical connection reliability between the conductive column 109 and the first substrate 100, and further improving the reliability of the packaged product.

[0032] It should also be noted that, compared with the solution of directly forming a groove in the first substrate, this embodiment forms a groove 104 in the base 103. On the one hand, it is beneficial to reduce the probability of damage to the first substrate 100; on the other hand, the depth of the groove 104 is not limited by the thickness of the first substrate 100, and accordingly the groove 104 can meet the requirements of embedding conductive pillars 109 of different heights, thereby improving the flexibility and adaptability of the process.

[0033] In this embodiment, the material of the base 103 includes a conductive material, which facilitates electrical connection between the conductive pillar 109 and the first substrate 100 , thereby achieving electrical connection between the first substrate 100 and the second substrate 105 .

[0034] Specifically, the conductive material includes copper, aluminum, copper alloy or nickel-iron alloy. It should be noted that copper, aluminum, copper alloy or nickel-iron alloy has good electrical conductivity and thermal conductivity. As an example, the material of the base 103 is copper.

[0035] The groove 104 is used to limit and fix the conductive pillar 109 .

[0036] Specifically, the bottom of the groove 104 exposes a connection terminal (eg, a pad) of the first substrate 100 , thereby achieving electrical connection between the conductive pillar 109 and the first substrate 100 .

[0037] In this embodiment, reference Figure 5 The groove 104 includes: a first groove 114 and a second groove 115 intersecting the bottom of the first groove 114 , and an opening size w1 of the first groove 114 is greater than an opening size w2 of the second groove 115 .

[0038] It should be noted that making the opening size w2 of the second groove 115 smaller is conducive to reducing unnecessary waste of the conductive filler filled in the groove 104, thereby reducing production costs. In addition, making the opening size w1 of the first groove 114 larger can ensure that the opening of the groove 104 has enough space to accommodate the embedding of conductive pillars 109 of different lateral sizes.

[0039] Specifically, the transverse direction is perpendicular to the direction in which the conductive pillar 109 extends.

[0040] In other embodiments, the opening size of the first groove may also be equal to the opening size of the second groove.

[0041] In this embodiment, the cross-sectional shape of the groove 104 includes: one or both of a circle and a square, which is conducive to the groove 104 being able to adapt to the conductive pillars 109 of different shapes; at the same time, it is also conducive to reducing the difficulty of forming the groove 104 in the base 103. As an example, the cross-sectional shape of the groove 104 is a circle.

[0042] In other embodiments, according to actual process requirements, the cross-sectional shape of the groove may also be other shapes, such as an ellipse, a triangle, or other polygons.

[0043] The second substrate 105 is used as a packaging carrier to provide support for the second component 108 and provide an electrical connection path between the second component 108 and an external circuit, thereby achieving packaging integration and electrical integration of the second component 108. The second substrate 105 may include a packaging substrate, an interposer, or a printed circuit board. As an example, the second substrate 105 is a packaging substrate.

[0044] The second surface 106 is used as a bearing surface for placing the second component 108 and the conductive pillar 109 .

[0045] The third surface 107 is used as a bearing surface for placing the second component 108 .

[0046] The second component 108 includes one or both of a second passive component 116 and a second chip 117. In this embodiment, the second component 108 includes the second passive component 116 and the second chip 117.

[0047] It should be noted that the second passive element 116 includes one or more of a capacitor, a resistor, an inductor, a filter and a coupler.

[0048] In this embodiment, the second chip 117 is a chip with a specific function. Specifically, the type of the second chip 117 depends on the actual functional requirements or application scenarios. For example, the second chip 117 includes one or more of a radio frequency chip, a memory chip, an ASIC chip, a CPU chip, a GPU chip, and an FPGA chip.

[0049] In this embodiment, when the second component 108 is at least located on the second surface 106 , along the stacking direction of the first substrate 100 and the second substrate 105 , there is a longitudinal gap between the second component 108 on the second surface 106 and the first component 102 on the first surface 101 .

[0050] It should be noted that there is a longitudinal gap between the second component 108 on the second surface 106 and the first component 102 on the first surface 101. On the one hand, in the process of stacking the second substrate 105 on the first substrate 100, it is beneficial to reduce the probability of collision between the second component 108 and the first component 102; on the other hand, it is also beneficial to arrange the tallest one of the first component 106 or the second component 108, so that the first component 106 and the second component 108 are staggered.

[0051] In this embodiment, reference Figure 5 When the second component 108 is at least located on the second surface 106, the depth h of the groove 104 is greater than or equal to twice the minimum value of the longitudinal spacing between the first component 102 and the second component 108, thereby ensuring that the groove 104 has sufficient space to accommodate the embedding of conductive pillars 109 of different heights.

[0052] The conductive pillars 109 are used to achieve electrical connection between the first substrate 100 and the second substrate 105 .

[0053] Specifically, the first end 110 of the conductive pillar 109 is electrically connected to a connection terminal (eg, pad) of the second substrate 105 , and the second end 111 of the conductive pillar 109 is located in the groove 104 and electrically connected to a connection terminal (eg, pad) of the first substrate 100 .

[0054] The material of the conductive pillar 109 includes copper, aluminum, copper alloy or nickel-iron alloy. Specifically, copper, aluminum, copper alloy or nickel-iron alloy has good electrical conductivity and thermal conductivity.

[0055] As an example, the material of the conductive pillar 109 is copper.

[0056] In this embodiment, the opening size of the groove 104 is greater than or equal to twice the lateral size of the conductive pillar 109 , and the lateral size is perpendicular to the extension direction of the conductive pillar.

[0057] It should be noted that the opening size of the groove 104 is greater than or equal to twice the lateral size of the conductive column 109. When the conductive column 109 is slightly tilted, the probability of the base 103 being affected by the tilt is reduced, so that the groove 104 can still effectively limit and fix the conductive column 109, thereby ensuring the stability of the electrical connection between the conductive column 109 and the first substrate 100.

[0058] In this embodiment, the packaging structure further includes: a conductive filler 118 located in the groove 104 and wrapping the conductive pillar 109 located in the groove 104 , and the conductive filler 118 fills all or part of the space of the groove 104 where the conductive pillar 109 is located.

[0059] The conductive filler 118 has electrical conductivity, so that the conductive pillar 109 can be electrically connected to the first substrate 100 .

[0060] The conductive filler 118 can also play a fixing role, and the conductive filler 118 can also compensate for the height difference of the conductive column 109, which is beneficial to improve the reliability of the electrical connection between the conductive column 109 and the first substrate 100, thereby reducing the probability of subsequent cold solder joints between the conductive column 109 and the first substrate 100, thereby further improving the reliability of the packaging product.

[0061] In addition, the conductive filler 118 wraps the conductive pillar 109 in the groove 104 , thereby increasing the bonding area between the conductive pillar 109 and the conductive filler 118 .

[0062] It should be noted that, when the longitudinal interval between the second component 108 on the second surface 106 and the first component 102 on the first surface 101 is small, it is easy to make the distance between the conductive column 109 and the first substrate 100 closer. At this time, a small amount of conductive filler 118 can be used to make the conductive filler 118 fill part of the space of the groove 104 where the conductive column 109 is set; when the longitudinal interval between the second component 108 on the second surface 106 and the first component 102 on the first surface 101 is large, it is easy to make the distance between the conductive column 109 and the first substrate 100 farther. At this time, the filling amount of the conductive filler 118 can be increased, for example, the conductive filler 118 can fill all the space of the groove 104 where the conductive column 109 is set.

[0063] In this embodiment, the conductive filler 118 includes conductive glue or metal material. Specifically, the conductive glue or metal material has good conductivity, and the conductive filler 118 can be used to achieve electrical connection between the conductive pillar 109 and the first substrate 100 .

[0064] It should be noted that the conductive glue has good electrical conductivity and is also sticky, so that it can limit and fix the conductive column 109. The materials of the conductive glue include: conductive particles or conductive fillers, and base glue or adhesive. Among them, the conductive particles or conductive fillers include silver conductive glue, copper conductive glue, copper oxide conductive glue or carbon nanotube conductive glue, and the base glue or adhesive is such as epoxy resin, acrylate, and silicon-based material.

[0065] It should also be noted that the metal material includes one or more of tin, silver, nickel, lead, zinc, aluminum and gallium. Specifically, tin, silver, nickel, lead, zinc, aluminum and gallium all have good electrical conductivity, and the solidification temperature of tin, silver, nickel, lead, zinc, aluminum and gallium is relatively low, thereby reducing the difficulty of tin, silver, nickel, lead, zinc, aluminum and gallium filling the groove 104, and correspondingly reducing the difficulty of tin, silver, nickel, lead, zinc, aluminum and gallium to limit and fix the conductive column 109.

[0066] In this embodiment, the height of the conductive filler 118 wrapping the conductive column 109 is greater than or equal to 200 microns, which is beneficial to ensure that there is sufficient contact area between the conductive filler 118 and the conductive column 109, thereby facilitating sufficient adhesion between the conductive filler 118 and the conductive column 109, and further improving the limiting and fixing effects on the conductive column 109.

[0067] Correspondingly, an embodiment of the present invention also provides a packaging method. Figures 6 to 14 : is a schematic diagram of the structure corresponding to each step in an embodiment of a packaging method of the present invention, wherein: Figure 7 yes Figure 6 A partial enlarged view of area B. Figure 8 is a top view of the groove.

[0068] refer to Figures 6 to 8 A first substrate 500 is provided, the first substrate 500 includes a first surface 501, a first component 502 is arranged on the first surface 501, and a base 503 located on the side of the first component 502, the base 503 has a groove 504 exposing the first substrate 500, and the first component 502 is electrically connected to the first substrate 500.

[0069] The first substrate 500 is used as a packaging carrier to provide support for the first component 502 and provide an electrical connection path between the first component 502 and an external circuit, thereby achieving packaging integration and electrical integration of the first component 502. The first substrate 500 may include a packaging substrate, an interposer, or a printed circuit board. As an example, the first substrate 500 is a packaging substrate.

[0070] The first surface 501 is used as a bearing surface for placing the first component 502 and the base 503 .

[0071] The first component 502 includes one or both of a first passive component 512 and a first chip 513. In this embodiment, the first component 502 includes the first passive component 512 and the first chip 513.

[0072] In this embodiment, the first passive element 512 includes one or more of a capacitor, a resistor, an inductor, a filter, and a coupler.

[0073] In this embodiment, the first chip 513 is a chip with a specific function. Specifically, the type of the first chip 513 is determined according to the actual functional requirements or application scenarios. For example, the first chip 513 includes one or more of a radio frequency chip, a storage chip, an ASIC chip, a CPU chip, a GPU chip, and an FPGA chip.

[0074] In other embodiments, according to actual process requirements, the first chip may also be other chips.

[0075] The base 503 is used to provide a groove 504 .

[0076] It should be noted that, compared with the solution of directly forming a groove in the first substrate, this embodiment forms a groove 504 in the base 503. On the one hand, it is beneficial to reduce the probability of damage to the first substrate 500; on the other hand, the depth of the groove 504 is not limited by the thickness of the first substrate 500, and accordingly the groove 504 can meet the requirements of embedding conductive columns of different heights, thereby improving the flexibility and adaptability of the process.

[0077] In this embodiment, the material of the base 503 includes a conductive material, which facilitates electrical connection between the conductive pillar and the first substrate 500, thereby achieving electrical connection between the first substrate 500 and the second substrate.

[0078] Specifically, the conductive material includes copper, aluminum, copper alloy or nickel-iron alloy. It should be noted that copper, aluminum, copper alloy or nickel-iron alloy has good electrical conductivity and thermal conductivity. As an example, the material of the base 503 is copper.

[0079] In this embodiment, the process of setting the base 503 on the first surface 501 includes a surface mounting technology (Surface-Mount Technology, SMT). Specifically, the surface mounting technology can form more components on the first substrate 500 with a limited area, which helps to improve the integration of the packaging structure.

[0080] In other embodiments, the process of disposing the base on the first surface may also be a metal bonding process.

[0081] The groove 504 is used to limit and fix the conductive column.

[0082] Specifically, the bottom of the groove 504 exposes a connection terminal (eg, a pad) of the first substrate 500 , thereby achieving electrical connection between the conductive pillar and the first substrate 500 .

[0083] In this embodiment, reference Figure 7 The groove 504 includes: a first groove 514 and a second groove 515 intersecting the bottom of the first groove 514 , and an opening size W1 of the first groove 514 is greater than an opening size W2 of the second groove 515 .

[0084] It should be noted that making the opening size W2 of the second groove 515 smaller is conducive to reducing unnecessary waste of the conductive filler subsequently filled in the groove 504, thereby reducing production costs. In addition, making the opening size W1 of the first groove 514 larger can ensure that the opening of the groove 504 has enough space to accommodate the embedding of conductive pillars of different lateral sizes.

[0085] Specifically, the transverse direction is perpendicular to the direction in which the conductive pillar extends.

[0086] In other embodiments, the opening size of the first groove may also be equal to the opening size of the second groove.

[0087] In this embodiment, the cross-sectional shape of the groove 504 includes: one or both of a circle and a square, which is conducive to the groove 504 being able to adapt to the conductive pillars 509 of different shapes; at the same time, it is also conducive to reducing the difficulty of forming the groove 504 in the base 503. As an example, refer to Figure 8 , the cross-sectional shape of the groove 504 is circular.

[0088] In other embodiments, according to actual process requirements, the cross-sectional shape of the groove may also be other shapes, such as an ellipse, a triangle, or other polygons.

[0089] refer to Figures 9 and 10 A second substrate 505 is provided, the second substrate 505 includes a second surface 506 arranged opposite to the first surface 501, and a third surface 507 facing away from the second surface 506, a second component 508 is arranged on one or both of the second surface 506 and the third surface 507, and a protruding conductive column 509 is arranged on the second surface 506, the conductive column 509 has a first end 510 and a second end 511, the first end 510 is electrically connected to the second substrate 505, the conductive column 509 corresponds to the groove 504 one by one, and the second component 508 is electrically connected to the second substrate 505.

[0090] The second substrate 505 is used as a packaging carrier to provide support for the second component 508 and provide an electrical connection path between the second component 508 and an external circuit, thereby realizing packaging integration and electrical integration of the second component 508. The second substrate 505 may include a packaging substrate, an interposer, or a printed circuit board. As an example, the second substrate 505 is a packaging substrate.

[0091] The second surface 506 is used as a bearing surface for placing the second component 508 and the conductive pillar 509 .

[0092] The third surface 507 is used as a bearing surface for placing the second component 508 .

[0093] The second component 508 includes one or both of a second passive component 516 and a second chip 517. In this embodiment, the second component 508 includes the second passive component 516 and the second chip 517.

[0094] It should be noted that the second passive element 516 includes one or more of a capacitor, a resistor, an inductor, a filter and a coupler.

[0095] In this embodiment, the second chip 517 is a chip with a specific function. Specifically, the type of the second chip 517 depends on the actual functional requirements or application scenarios. For example, the second chip 517 includes one or more of a radio frequency chip, a storage chip, an ASIC chip, a CPU chip, a GPU chip, and an FPGA chip.

[0096] In this embodiment, when the second component 508 is at least located on the second surface 506 , along the stacking direction of the first substrate 500 and the second substrate 505 , there is a longitudinal gap between the second component 508 on the second surface 506 and the first component 502 on the first surface 501 .

[0097] It should be noted that there is a longitudinal gap between the second component 508 on the second surface 506 and the first component 502 on the first surface 501. On the one hand, in the process of stacking the second substrate 505 on the first substrate 500, it is beneficial to reduce the probability of collision between the second component 508 and the first component 502; on the other hand, it is also beneficial to arrange the tallest one of the first component 502 or the second component 508, so that the first component 502 and the second component 508 are staggered.

[0098] In this embodiment, reference Figure 7When the second component 508 is at least located on the second surface 506, the depth H of the groove 504 is greater than or equal to twice the minimum value of the longitudinal spacing between the first component 502 and the second component 508, thereby ensuring that the groove 504 has sufficient space to accommodate the embedding of conductive pillars 509 of different heights.

[0099] The conductive pillars 509 are used to achieve electrical connection between the first substrate 500 and the second substrate 505 .

[0100] Specifically, the first end 510 of the conductive pillar 509 is electrically connected to a connection terminal (eg, pad) of the second substrate 505 , and the second end 511 of the conductive pillar 509 is subsequently electrically connected to a connection terminal (eg, pad) of the first substrate 500 through the groove 504 .

[0101] The material of the conductive pillar 509 includes copper, aluminum, copper alloy or nickel-iron alloy. Specifically, copper, aluminum, copper alloy or nickel-iron alloy has good electrical conductivity and thermal conductivity. As an example, the material of the conductive pillar 509 is copper.

[0102] In this embodiment, the opening size of the groove 504 is greater than or equal to twice the lateral size of the conductive pillar 509 , and the lateral size is perpendicular to the extension direction of the conductive pillar.

[0103] It should be noted that the opening size of the groove 504 is greater than or equal to twice the lateral size of the conductive column 509. When the conductive column 509 is slightly tilted, the probability of the base 503 being affected by the tilt is reduced, so that the groove 504 can still effectively limit and fix the conductive column 509, thereby ensuring the stability of the electrical connection between the conductive column 509 and the first substrate 500.

[0104] In this embodiment, in the step of providing the second substrate 505, when the second components 508 are disposed on both the second surface 506 and the third surface 507, a portion of the second components 508 and the protruding conductive pillars 509 (such as Fig. 9 After that, the remaining second components 508 (as shown in FIG. 5 ) arranged on the third surface 507 are Fig.10 shown).

[0105] In other embodiments, after part of the second components are arranged on the third surface, the remaining second components and the protruding conductive pillars may be arranged on the second surface. In other embodiments, after the second components are arranged on the third surface and the second surface respectively, the protruding conductive pillars may be arranged on the second surface.

[0106] It should be noted that second components 508 are arranged on both the second surface 506 and the third surface 507. Without changing the size of the second substrate 505, the area of ​​the second substrate 505 can be fully utilized and more second components 508 can be arranged on the second substrate 505, thereby improving the integration of components in the packaging structure.

[0107] refer to Fig.11 Before the second end 511 of the conductive pillar 509 is located in the groove 504 and electrically connected to the first substrate 500, the method further includes: forming a buffer fixed layer 519 on the top of the tallest one of the first components 502 .

[0108] In the process of stacking the second substrate 505 on the first substrate 500, on the one hand, the buffer fixing layer 519 plays a buffering role between the first component 502 and the second component 508 to prevent the first component 502 and the second component 508 from colliding. On the other hand, the buffer fixing layer 519 can also play a role of temporarily fixing the second substrate 505, and can improve the balance of the second substrate 505 and reduce the probability of the second substrate 505 tilting.

[0109] In this embodiment, the process of forming the buffer fixed layer 519 on the top of the tallest one of the first components 502 includes a glue dispensing process. The glue dispensing process can accurately control the amount of the buffer fixed layer 519 used and the formation position of the buffer fixed layer 519, which is conducive to reducing material waste and reducing costs.

[0110] In this embodiment, in the step of forming a buffer fixing layer 519 on the top of the tallest one of the first components 502 , the material of the buffer fixing layer 519 includes soft silicone or hot melt adhesive.

[0111] It should be noted that soft silicone or hot melt adhesive has good supporting properties, thereby being able to play a good role in temporarily fixing the second substrate 505; in addition, since soft silicone or hot melt adhesive is easy to remove, the subsequent removal of the soft silicone or hot melt adhesive is helpful in reducing the probability of damage to the first component 502 and the second component 508.

[0112] refer to Figure 12 to Figure 13 , the second surface 506 of the second substrate 505 faces the first surface 501 of the first substrate 500 , and the second end 511 of the conductive pillar 509 is located in the corresponding groove 504 and electrically connected to the first substrate 500 through the groove 504 .

[0113] The second end 511 of the conductive column 509 is located in the corresponding groove 504, and the groove 504 can limit and fix the conductive column 509, reducing the probability of the conductive column 509 being offset and tilted, thereby helping to improve the electrical connection reliability between the conductive column 509 and the first substrate 500, and further improving the reliability of the packaged product.

[0114] In this embodiment, the step of positioning the second end 511 of the conductive pillar 509 in the groove 504 and electrically connecting the second end 511 to the first substrate 500 includes: Fig.12 , so that the second end 511 of the conductive column 509 is located in the groove 504; Fig.13 After the second end 511 of the conductive pillar 509 is located in the groove 504, a conductive filler 518 is formed in the groove 504 to wrap the conductive pillar 509, and the conductive filler 518 fills all or part of the space of the groove 504 where the conductive pillar 509 is arranged.

[0115] The conductive filler 518 has electrical conductivity, so that the conductive pillar 509 can be electrically connected to the first substrate 500 .

[0116] The conductive filler 518 can also play a fixing role, and the conductive filler 518 can compensate for the height difference of the conductive column 509, which is beneficial to improving the reliability of the electrical connection between the conductive column 509 and the first substrate 500, thereby reducing the probability of subsequent cold solder joints between the conductive column 509 and the first substrate 500, thereby further improving the reliability of the packaging product.

[0117] In addition, the conductive filler 518 wraps the conductive pillar 509 in the groove 504 , thereby increasing the bonding area between the conductive pillar 509 and the conductive filler 518 .

[0118] It should be noted that, when the longitudinal interval between the second component 508 on the second surface 506 and the first component 502 on the first surface 501 is small, it is easy to make the distance between the conductive column 509 and the first substrate 500 closer. At this time, a small amount of conductive filler 518 can be used to make the conductive filler 518 fill part of the space of the groove 504 where the conductive column 509 is set; when the longitudinal interval between the second component 508 on the second surface 506 and the first component 502 on the first surface 501 is large, it is easy to make the distance between the conductive column 509 and the first substrate 500 farther. At this time, the filling amount of the conductive filler 518 can be increased, for example, the conductive filler 518 can fill all the space of the groove 504 where the conductive column 509 is set.

[0119] In this embodiment, the conductive filler 518 includes conductive glue or metal material. Specifically, the conductive glue or metal material has good conductivity, and the conductive filler 518 can be used to achieve electrical connection between the conductive pillar 509 and the first substrate 500 .

[0120] It should be noted that the conductive glue has good electrical conductivity and is also sticky, so that it can limit and fix the conductive column 509. The materials of the conductive glue include: conductive particles or conductive fillers, and base glue or adhesive. Among them, the conductive particles or conductive fillers include silver conductive glue, copper conductive glue, copper oxide conductive glue or carbon nanotube conductive glue, and the base glue or adhesive is such as epoxy resin, acrylate, and silicon-based material.

[0121] It should also be noted that the metal material includes one or more of tin, silver, nickel, lead, zinc, aluminum and gallium. Specifically, tin, silver, nickel, lead, zinc, aluminum and gallium all have good electrical conductivity, and the solidification temperatures of tin, silver, nickel, lead, zinc, aluminum and gallium are relatively low, thereby reducing the difficulty of tin, silver, nickel, lead, zinc, aluminum and gallium filling the groove 504, and correspondingly reducing the difficulty of tin, silver, nickel, lead, zinc, aluminum and gallium to limit and fix the conductive pillar 509.

[0122] In this embodiment, the height of the conductive filler 518 wrapped around the conductive column 509 is greater than or equal to 200 microns, which is beneficial to ensure that there is sufficient contact area between the conductive filler 518 and the conductive column 509, thereby facilitating sufficient adhesion between the conductive filler 518 and the conductive column 509, thereby further improving the limiting and fixing effects on the conductive column 509.

[0123] In other embodiments, the conductive filler may not be used. For example, a surface mounting process is used to place the second end of the conductive column in the corresponding groove and electrically connect it to the first substrate.

[0124] refer to Fig.14 After the second end 511 of the conductive pillar 509 is located in the groove 504 and electrically connected to the first substrate 500, the method further includes: removing the buffer fixed layer 519.

[0125] It should be noted that removing the buffer fixing layer 519 is beneficial to the heat dissipation of the first chip 513 and the first passive component 512 .

[0126] In this embodiment, the process of removing the buffer fixed layer 519 includes a water washing process.

[0127] Since the water flushing process mainly uses water as a solvent to remove the buffer fixed layer 519, additional impurities are not easily introduced during the removal of the buffer fixed layer 519, thereby effectively reducing the probability of secondary contamination of other components (for example, the first component 502, the second component 508, etc.).

[0128] In this embodiment, the parameters of the water flushing process include: the liquid pressure is less than or equal to 1 MPa, and the cleaning chain speed is less than or equal to 30 cm per minute.

[0129] The liquid pressure of the water flushing process should not be too high. If the liquid pressure is too high, during the process of removing the buffer fixing layer 519, it is easy to increase the risk of other components in the packaging structure (for example, the first component 502, the second component 508, etc.) being damaged or falling off. Therefore, in this embodiment, the liquid pressure of the water flushing process is less than or equal to 1 MPa.

[0130] The cleaning chain speed of the water washing process should not be too high. If the cleaning chain speed of the water washing process is too high, the cleaning time is likely to be too short, which may easily lead to the residue of the buffer fixing layer 519. Therefore, in this embodiment, the cleaning chain speed of the water washing process is less than or equal to 30 cm / min.

[0131] By setting the liquid pressure of the water flushing process and the cleaning chain speed within a reasonable range and coordinating them with each other, the removal rate and removal effect of the water flushing process are improved while reducing the process cost and side effects.

[0132] Continue to refer Fig.14 After forming a conductive filler 518 wrapping the conductive column 509 in the groove 504 and before removing the buffer fixing layer 519, it also includes: heating and curing the conductive filler 518; correspondingly, after heating and curing the conductive filler 518, the buffer fixing layer 519 is removed.

[0133] It should be noted that the heating and curing treatment of the conductive filler 518, on the one hand, is conducive to enhancing the contact between the conductive particles in the conductive filler 518 due to the increase in temperature, thereby improving the conductive performance of the conductive filler 518; on the other hand, due to the increase in temperature, the conductive filler 518 is solidified, which can further limit and fix the conductive column 509.

[0134] It should also be noted that since the conductive filler 518 is heated and cured, it is not easy to be removed. Therefore, in the process of removing the buffer fixing layer 519, the probability of the conductive filler 518 being removed is reduced, thereby improving the yield of the formed packaging structure.

[0135] In this embodiment, the curing temperature of the conductive filler 518 is lower than the curing temperature of the buffer fixing layer 519 .

[0136] It should be noted that after the conductive filler 518 is heated and cured, since the curing temperature of the conductive filler 518 is lower than the curing temperature of the buffer fixing layer 519, the probability of the buffer fixing layer 519 curing is correspondingly reduced, thereby reducing the difficulty of removing the buffer fixing layer 519.

[0137] In this embodiment, the conductive filler 518 is heated and cured by a curing method of baking in an oven.

[0138] It should be noted that in other embodiments, the buffer fixed layer may also be retained.

[0139] The packaging structure can be formed by the packaging method of the above embodiment, or by other packaging methods. For the specific description of the packaging structure of this embodiment, reference can be made to the corresponding description in the above embodiment, and this embodiment will not be repeated here.

[0140] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A packaging structure, characterized in that: include: A first substrate, the first substrate comprising a first surface; A first component is located on the first surface, and the first component is electrically connected to the first substrate; A base, located on a first surface of a side portion of the first component, the base having a groove exposing the first substrate; A second substrate, stacked on the first surface of the first substrate and located on a side of the first component and the base facing away from the first substrate, the second substrate comprising a second surface arranged opposite to the first surface, and a third surface facing away from the second surface; A second component is located on one or both of the second surface and the third surface, and the second component is electrically connected to the second substrate; A conductive column protrudes from the second surface and corresponds to the groove one by one. The conductive column has a first end and a second end. The first end is electrically connected to the second substrate, and the second end is located in the corresponding groove and electrically connected to the first substrate.

2. The packaging structure according to claim 1, characterized in that: The packaging structure further includes: a conductive filler located in the groove and wrapping the conductive column located in the groove, wherein the conductive filler fills all or part of the space of the groove where the conductive column is disposed.

3. The packaging structure according to claim 2, characterized in that: The height of the conductive filler wrapping the conductive column is greater than or equal to 200 microns.

4. The packaging structure according to claim 2, characterized in that: The conductive filler includes conductive glue or metal material.

5. The packaging structure according to claim 4, characterized in that: The metal material includes one or more of tin, silver, nickel, lead, zinc, aluminum and gallium.

6. The packaging structure according to claim 1, characterized in that: The groove includes: a first groove and a second groove intersecting with the bottom of the first groove, and the opening size of the first groove is larger than the opening size of the second groove.

7. The packaging structure according to claim 1, characterized in that: The cross-sectional shape of the groove includes: one or both of a circle and a square.

8. The packaging structure according to claim 1, characterized in that: In the case where the second component is at least located on the second surface, along the stacking direction of the first substrate and the second substrate, there is a longitudinal interval between the second component on the second surface and the first component on the first surface.

9. The packaging structure according to claim 8, characterized in that: The depth of the groove is greater than or equal to twice the minimum value of the longitudinal interval between the first component and the second component.

10. The packaging structure according to claim 1, wherein: The material of the conductive pillar includes copper, aluminum, copper alloy or nickel-iron alloy.

11. The packaging structure according to claim 1, characterized in that: The material of the base includes a conductive material.

12. The packaging structure according to claim 11, characterized in that: The conductive material includes copper, aluminum, copper alloy or nickel-iron alloy.

13. The packaging structure according to claim 1, characterized in that: The opening size of the groove is greater than or equal to twice the lateral size of the conductive column, and the lateral size is perpendicular to the extension direction of the conductive column.

14. The packaging structure according to claim 1, wherein: The first components include one or both of a first passive component and a first chip; the second components include one or both of a second passive component and a second chip.

15. A packaging method, characterized in that: include: Providing a first substrate, the first substrate comprising a first surface, a first component disposed on the first surface, and a base located at a side of the first component, the base having a groove exposing the first substrate, the first component being electrically connected to the first substrate; Providing a second substrate, the second substrate comprising a second surface arranged opposite to the first surface, and a third surface facing away from the second surface, second components are arranged on one or both of the second surface and the third surface, and a protruding conductive column is arranged on the second surface, the conductive column has a first end and a second end, the first end is electrically connected to the second substrate, the conductive column corresponds to the groove one by one, and the second component is electrically connected to the second substrate; The second surface of the second substrate is directed toward the first surface of the first substrate, and the second end of the conductive pillar is located in the corresponding groove and electrically connected to the first substrate.

16. The packaging method according to claim 15, characterized in that: The step of positioning the second end of the conductive pillar in the groove and electrically connecting the second end of the conductive pillar to the first substrate comprises: Positioning the second end of the conductive column in the groove; After the second end of the conductive column is located in the groove, a conductive filler that wraps the conductive column is formed in the groove, and the conductive filler fills all or part of the space of the groove where the conductive column is arranged.

17. The packaging method according to claim 15, characterized in that: Before the second end of the conductive column is located in the groove and electrically connected to the first substrate, the method further includes: forming a buffer fixed layer on the top of the tallest one of the first components.

18. The packaging method according to claim 17, characterized in that: The process of forming a buffer fixing layer on the top of the tallest one of the first components includes a glue dispensing process.

19. The packaging method according to claim 17, characterized in that: In the step of forming a buffer fixing layer on the top of the tallest one of the first components, the material of the buffer fixing layer includes soft silica gel or hot melt adhesive.

20. The packaging method according to claim 17, characterized in that: After the second end of the conductive pillar is located in the groove and electrically connected to the first substrate, the method further includes: removing the buffer fixed layer.

21. The packaging method according to claim 20, characterized in that: After forming a conductive filler wrapping the conductive column in the groove and before removing the buffer fixed layer, the method further includes: heating and curing the conductive filler; After the conductive filler is subjected to the heating and curing treatment, the buffer fixing layer is removed.

22. The packaging method according to claim 21, characterized in that: The curing temperature of the conductive filler is lower than the curing temperature of the buffer fixing layer.

23. The packaging method according to claim 20, characterized in that: The process of removing the buffer fixed layer includes a water washing process.

24. The packaging method according to claim 23, characterized in that: The parameters of the water flushing process include: liquid pressure is less than or equal to 1 MPa, and cleaning chain speed is less than or equal to 30 cm per minute.

25. The packaging method according to claim 15, characterized in that: In the step of providing the second substrate, when second components are arranged on both the second surface and the third surface, after some second components and protruding conductive pillars are arranged on the second surface, the remaining second components are arranged on the third surface.

26. The packaging method according to claim 15, characterized in that: The process of providing a base on the first surface includes a surface mounting process.

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